CN111826641A - Process for chemically plating Ni-P alloy on pure titanium plate TA2 - Google Patents
Process for chemically plating Ni-P alloy on pure titanium plate TA2 Download PDFInfo
- Publication number
- CN111826641A CN111826641A CN202010605852.9A CN202010605852A CN111826641A CN 111826641 A CN111826641 A CN 111826641A CN 202010605852 A CN202010605852 A CN 202010605852A CN 111826641 A CN111826641 A CN 111826641A
- Authority
- CN
- China
- Prior art keywords
- pure titanium
- titanium plate
- cleaning
- nickel
- deionized water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1806—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by mechanical pretreatment, e.g. grinding, sanding
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
Abstract
The invention relates to a process for chemically plating Ni-P alloy on a pure titanium plate TA2, which mainly comprises the following steps: (1) mechanically polishing the surface of a pure titanium plate TA2 (2), and degreasing and cleaning the polished surface for 1-5min by using an alkaline degreasing agent. And cleaning with deionized water for 1-5min (3), putting pure titanium plate TA2 into mixed solution containing hydrofluoric acid as main component and inorganic acidic substance as auxiliary component for activation, and cleaning with deionized water for 1-5 min. (4) The activated pure titanium TA2 is put into a chemical nickel solution which takes nickel sulfate as a nickel source and sodium hypophosphite as a reducing agent. The process has the advantages of good plating binding force, low production cost and good product quality.
Description
Technical Field
The invention relates to the field of material chemical nickel technology application, in particular to a process for chemically plating Ni-P alloy on a pure titanium plate TA 2.
Background
Titanium is a thermodynamically unstable metal, and when the surface thereof is exposed to an oxygen-containing medium such as air or an aqueous solution, a new oxide film is rapidly regenerated. However, this oxide film makes it difficult to perform electrochemical surface treatment on titanium, and particularly when it is used for electroless plating and conversion coating, it is difficult to obtain a coating layer of satisfactory quality, because the adhesion is poor when the titanium is pretreated by a conventional method. Thus. In order to obtain a satisfactory and qualified surface film layer on titanium and titanium alloy, plating pretreatment is a very important step, and the key of the pretreatment is activation film forming treatment.
Disclosure of Invention
The invention relates to a process for chemically plating Ni-P alloy on a pure titanium plate TA2, which has good plating layer bonding force, lower production cost and good product quality. Is convenient for large-scale production.
The technical scheme adopted by the invention is as follows:
a process for chemically plating Ni-P alloy on a pure titanium plate TA2 comprises the following steps:
1) mechanically grinding the surface of the pure titanium plate TA 2;
2) degreasing and cleaning the polished surface by using an alkaline degreasing agent;
3) putting a pure titanium plate TA2 into a mixed solution of which the main component is hydrofluoric acid and the auxiliary component is an inorganic acidic substance for activation, and cleaning for 1-5min by using deionized water;
4) the activated pure titanium TA2 is put into a chemical nickel solution which takes nickel sulfate hexahydrate as a nickel source and sodium hypophosphite as a reducing agent.
In the step 1), the mechanical grinding needs to use sand paper of 180# -400# to grind the surface, and after the mechanical grinding is finished, the surface is evenly ground by using green snake melon cloth.
And 2) degreasing and cleaning for 1-5min, and cleaning for 1-5min by using deionized water.
The hydrofluoric acid adopted in the step 3) is analytically pure or more than analytically pure, the activation time is 1-2min, and the water quality of the activated cleaning water exceeds 200K omega cm.
The nickel sulfate hexahydrate used in the step 4) is of analytical grade.
In the step 3), the mixed solution contains 2-5% of hydrofluoric acid, 1-5% of inorganic acidic substance and the balance of water according to volume fraction.
The concentration of the nickel sulfate hexahydrate in the step 4) is 0.1-0.5 mol/L; the concentration of sodium hypophosphite is 0.24mol/L, the working temperature of chemical nickel is 82-88 ℃, and the pH value range is 4.8-5.2.
The invention has the beneficial effects that:
the invention relates to a process for chemically plating Ni-P alloy on a pure titanium plate TA2, which has the advantages of good film quality, lower price of chemicals used for pretreatment and activation, simple and convenient operation and good stability compared with some chemical nickel processes. Most importantly, the chemical nickel produced by the process can reach 50um in thickness, and the appearance and the corrosion resistance of the coating are excellent.
Detailed Description
A process for chemically plating Ni-P alloy on a pure titanium plate TA2 comprises the following steps:
1) mechanically grinding the surface of the pure titanium plate TA 2;
2) degreasing and cleaning the polished surface by using an alkaline degreasing agent;
3) putting a pure titanium plate TA2 into a mixed solution of which the main component is hydrofluoric acid and the auxiliary component is an inorganic acidic substance for activation, and cleaning for 1-5min by using deionized water;
4) the activated pure titanium TA2 is put into a chemical nickel solution which takes nickel sulfate hexahydrate as a nickel source and sodium hypophosphite as a reducing agent.
In the step 1), the mechanical grinding needs to use sand paper of 180# -400# to grind the surface, and after the mechanical grinding is finished, the surface is evenly ground by using green snake melon cloth.
And 2) degreasing and cleaning for 1-5min, and cleaning for 1-5min by using deionized water.
The hydrofluoric acid adopted in the step 3) is analytically pure or more than analytically pure, the activation time is 1-2min, and the water quality of the activated cleaning water exceeds 200K omega cm.
The nickel sulfate hexahydrate used in the step 4) is of analytical grade.
In the step 3), the mixed solution contains 2-5% of hydrofluoric acid, 1-5% of inorganic acidic substance and the balance of water according to volume fraction.
The concentration of the nickel sulfate hexahydrate in the step 4) is 0.1-0.5 mol/L; the concentration of sodium hypophosphite is 0.24mol/L, the working temperature of chemical nickel is 82-88 ℃, and the pH value range is 4.8-5.2.
And 4, fully cleaning by using deionized water in the process interval of the steps 1 to 4.
Claims (8)
1. A process for chemically plating Ni-P alloy on a pure titanium plate TA2 is characterized by comprising the following steps:
1) mechanically grinding the surface of the pure titanium plate TA 2;
2) degreasing and cleaning the polished surface by using an alkaline degreasing agent;
3) putting a pure titanium plate TA2 into a mixed solution of which the main component is hydrofluoric acid and the auxiliary component is an inorganic acidic substance for activation, and cleaning for 1-5min by using deionized water;
4) the activated pure titanium TA2 is put into a chemical nickel solution which takes nickel sulfate hexahydrate as a nickel source and sodium hypophosphite as a reducing agent.
2. The pure titanium plate TA2 chemical plating Ni-P alloy according to claim 1, wherein in step 1), the mechanical grinding is performed by grinding the surface with 180# to 400# sandpaper, and the surface is smoothed with green snake melon cloth after the grinding.
3. The process of claim 1, wherein the step 2) is performed with degreasing and cleaning for 1-5min, and is performed with deionized water for 1-5 min.
4. The process of claim 1, wherein the hydrofluoric acid used in step 3) is analytically pure or more than analytically pure, the activation time is 1-2min, and the water quality of the cleaning water after activation exceeds 200K Ω -cm.
5. The process of claim 1, wherein the nickel sulfate hexahydrate used in step 4) is of analytical grade.
6. The process of claim 1, wherein the mixed solution of step 3) contains hydrofluoric acid 2% -5%, inorganic acidic substance 1% -5%, and water in balance.
7. The process of claim 1, wherein the concentration of nickel sulfate hexahydrate in step 4) is 0.1-0.5 mol/L; the concentration of sodium hypophosphite is 0.24mol/L, the working temperature of chemical nickel is 82-88 ℃, and the pH value range is 4.8-5.2.
8. The process of claim 1, wherein the pure titanium plate TA2 is fully cleaned with deionized water in the process interval of steps 1-4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010605852.9A CN111826641A (en) | 2020-06-29 | 2020-06-29 | Process for chemically plating Ni-P alloy on pure titanium plate TA2 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010605852.9A CN111826641A (en) | 2020-06-29 | 2020-06-29 | Process for chemically plating Ni-P alloy on pure titanium plate TA2 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111826641A true CN111826641A (en) | 2020-10-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010605852.9A Pending CN111826641A (en) | 2020-06-29 | 2020-06-29 | Process for chemically plating Ni-P alloy on pure titanium plate TA2 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04120293A (en) * | 1990-09-11 | 1992-04-21 | Nippon Parkerizing Co Ltd | Method for coating titanium or titanium alloy |
| CN102787335A (en) * | 2012-07-31 | 2012-11-21 | 沈阳理工大学 | Titanium alloy pretreatment method |
| CN106011807A (en) * | 2016-07-18 | 2016-10-12 | 宝鸡石油钢管有限责任公司 | Method of treating thread surface of titanium alloy oil pipe |
| CN111235554A (en) * | 2020-03-10 | 2020-06-05 | 中国科学院金属研究所 | In-situ activated titanium alloy surface chemical coating preparation method |
-
2020
- 2020-06-29 CN CN202010605852.9A patent/CN111826641A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04120293A (en) * | 1990-09-11 | 1992-04-21 | Nippon Parkerizing Co Ltd | Method for coating titanium or titanium alloy |
| CN102787335A (en) * | 2012-07-31 | 2012-11-21 | 沈阳理工大学 | Titanium alloy pretreatment method |
| CN106011807A (en) * | 2016-07-18 | 2016-10-12 | 宝鸡石油钢管有限责任公司 | Method of treating thread surface of titanium alloy oil pipe |
| CN111235554A (en) * | 2020-03-10 | 2020-06-05 | 中国科学院金属研究所 | In-situ activated titanium alloy surface chemical coating preparation method |
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Address after: No.18a-1, Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Applicant after: Shenyang fuchuang precision equipment Co.,Ltd. Address before: No.18a-1, Feiyun Road, Dongling District, Shenyang, Liaoning Province, 110000 Applicant before: Shenyang Fortune Precision Equipment Co.,Ltd. |
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Application publication date: 20201027 |