CN111811729A - Pressure sensor and pressure sensor arrangement having such a pressure sensor - Google Patents
Pressure sensor and pressure sensor arrangement having such a pressure sensor Download PDFInfo
- Publication number
- CN111811729A CN111811729A CN202010279406.3A CN202010279406A CN111811729A CN 111811729 A CN111811729 A CN 111811729A CN 202010279406 A CN202010279406 A CN 202010279406A CN 111811729 A CN111811729 A CN 111811729A
- Authority
- CN
- China
- Prior art keywords
- pressure
- pressure sensor
- signal
- connection
- difference
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012530 fluid Substances 0.000 claims abstract description 7
- 239000004065 semiconductor Substances 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 39
- 239000012528 membrane Substances 0.000 claims description 11
- 238000012545 processing Methods 0.000 claims description 10
- 238000002485 combustion reaction Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 description 10
- 239000002245 particle Substances 0.000 description 5
- 239000012945 sealing adhesive Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910021426 porous silicon Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L13/00—Devices or apparatus for measuring differences of two or more fluid pressure values
- G01L13/02—Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements
- G01L13/025—Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements using diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L13/00—Devices or apparatus for measuring differences of two or more fluid pressure values
- G01L13/02—Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention relates to a pressure sensor for pressure sensing of a fluid medium, comprising: a housing having a first pressure connection and a second pressure connection, wherein the first pressure connection has a first pressure channel that is loaded with a first pressure, wherein the second pressure connection has a second pressure channel that is loaded with a second pressure; a first pressure sensing means arranged in the housing, arranged for loading a first pressure and for outputting a first electrical signal representing a pressure difference of the first pressure relative to a reference pressure; a second pressure sensing means arranged for being loaded with a second pressure and for outputting a second electrical signal representing a pressure difference of the second pressure relative to a reference pressure. It is proposed that the pressure sensor has a third pressure-sensing device arranged in the housing, which is provided for being loaded with the first pressure and the second pressure and for outputting a first differential pressure signal representing a differential pressure of the first pressure relative to the second pressure.
Description
Technical Field
The present invention relates to a pressure sensor for pressure sensing of a fluid medium and a pressure sensor arrangement having such a pressure sensor.
Background
Pressure sensors for pressure sensing of fluid media, i.e. liquid or gaseous media, are known from the prior art. In the prior art, absolute pressure sensors are used which sense the pressure acting on the pressure connection, or differential pressure sensors which sense the difference in pressure between the two pressures. In general, a semiconductor chip is used as a sensor element, which has a thin membrane, which is provided on one side with a wheatstone bridge circuit. When pressure is applied to the diaphragm, the diaphragm deflects and the wheatstone bridge circuit generates a signal representative of the pressure. If the diaphragm is loaded with pressure on one side, the signal represents the absolute pressure of the pressure acting on the diaphragm. In this case, the other side of the membrane can be covered in a sealing manner by a cap. If the diaphragm is loaded with a first pressure on one side and a reference pressure on the opposite side, the bridge circuit generates an electrical signal representing the pressure difference of the first pressure relative to the reference pressure.
A pressure sensor is known from DE 4227893 a1, which has a housing with a first pressure connection and a second pressure connection. The first pressure connection has a first pressure channel, which can be acted upon by a first pressure. A second pressure connection, which is separate from the first pressure connection, has a second pressure channel, which can be acted upon by a second pressure. The pressure sensor has a first pressure-sensing device, which is provided for a first pressure to be applied to the first pressure connection and for outputting a first electrical signal representing a pressure difference of the first pressure relative to a reference pressure, and a second pressure-sensing device, which is provided for a second pressure to be applied to the second pressure connection and for outputting a second electrical signal representing a pressure difference of the second pressure relative to the reference pressure.
Disclosure of Invention
The invention relates to a pressure sensor for pressure sensing of a fluid medium, the pressure sensor comprising: a housing having a first pressure connection and a second pressure connection separate from the first pressure connection, wherein the first pressure connection has a first pressure channel which can be acted upon by a first pressure, wherein the second pressure connection has a second pressure channel which can be acted upon by a second pressure; and a first pressure sensing device arranged in the housing, the first pressure sensing device being provided for a first pressure loaded to act on the first pressure connection and for outputting a first electrical signal representing a pressure difference of the first pressure relative to a reference pressure; and a second pressure sensing means arranged for a second pressure to be loaded to act on the second pressure connection and for outputting a second electrical signal representing a pressure difference of the second pressure relative to a reference pressure. According to the invention, a third pressure-sensing device is arranged in the housing, which third pressure-sensing device is provided for the first pressure acting on the first pressure connection and the second pressure acting on the second pressure connection and for outputting a first differential pressure signal representing a pressure difference of the first pressure relative to the second pressure.
In some applications of the automotive industry, sensing of pressure differences before and after components through which a fluid flows is of great importance. This applies without limiting the generality, for example, for sensing the pressure before and after a particulate filter in the exhaust system of an internal combustion engine, such as an otto engine, among others. In such pressure sensors, it is important for the operation of the particle filter to reliably sense the pressure before and after the particle filter. In this case, the pressure upstream of the filter and the pressure downstream of the filter can be sensed separately by two sensor elements and then a pressure difference, which characterizes the pressure drop across the particle filter, can be calculated in the control unit from the two pressures. If one of the sensor elements used here is contaminated or defective, then correct pressure difference sensing can no longer be achieved. Since the formation of faulty measured values does not necessarily lead to a total shutdown of the system, it is also possible to continue to process faulty measured values in the controller, whereby the control program is put at risk with regard to its functionality. For this reason, monitoring of the pressure sensor is desirable. By means of the pressure sensor according to the invention, an effective monitoring of a first electrical signal representing a pressure difference of a first pressure relative to a reference pressure and a second electrical signal representing a pressure difference of a second pressure relative to the reference pressure or a differential pressure signal calculated from the first electrical signal and the second electrical signal can be achieved. According to the invention, this is achieved in that a third pressure-sensing device is additionally arranged in the housing of the pressure sensor, which third pressure-sensing device is provided for the first pressure acting on the first pressure connection and the second pressure acting on the second pressure connection and for outputting a first differential pressure signal representing a pressure difference of the first pressure relative to the second pressure.
Advantageous embodiments and embodiments of the invention can be achieved by the features contained below.
Advantageously, the first pressure sensor module, on which the first and second pressure sensing means are configured, and the second pressure sensor module, on which the third pressure sensing means are configured, are mounted in the housing of the pressure sensor as separate components from each other.
The first pressure sensor module may have, for example, a first carrier substrate on which a first semiconductor component having at least one first pressure-sensitive diaphragm on which a first pressure-sensing device is formed and a second semiconductor component having at least one second pressure-sensitive diaphragm on which a second pressure-sensing device is formed are arranged. The first and second pressure sensing means may for example each be formed by a respective wheatstone bridge circuit on the diaphragm. At least one first integrated electronic circuit component may be applied as a signal processing device on the first carrier substrate, which first integrated electronic circuit component is arranged for providing a first electrical signal representing a pressure difference of the first pressure with respect to a reference pressure and a second electrical signal representing a pressure difference of the second pressure with respect to the reference pressure on a connection face of the first carrier substrate.
In a corresponding manner, the second pressure sensor module can have a second carrier substrate on which a third semiconductor component having at least one third pressure-sensitive diaphragm is arranged, on which a third pressure-sensing device is formed. The third pressure sensing means may for example be formed by a wheatstone bridge circuit on the third diaphragm. At least one second integrated electronic circuit component may be applied as a signal processing device on the second carrier substrate, which second integrated electronic circuit component is arranged for providing a first pressure difference signal representing a pressure difference of the first pressure relative to the second pressure on a connection face of the second carrier substrate.
Such a pressure sensor module can be produced simply and inexpensively and can be installed in a simple manner in a housing of a pressure sensor. In particular, the pressure sensor module may be configured as a land grid array/die preform structure (LGA/MPM) or the like. The carrier substrate is provided on one side with a connection grid designed as a grid array and on the other side with a mold frame and a semiconductor component as a real pressure sensor element. The semiconductor component can be configured, for example, as an advanced porous silicon MEMS sensor element (MEMS) or, for example, as a conventional silicon chip.
The electronic signal processing means may be designed, for example, as an ASIC (application specific integrated circuit). The electronic signal processing means may provide the first and second electrical signals and the first differential pressure signal at the electrical connections of the pressure sensor via the connection faces of the respective carrier substrates.
By using a plurality of pressure sensor modules mounted in the housing of the pressure sensor, a degree of freedom in arranging the pressure sensor modules in the housing is advantageously created.
The first semiconductor component is loaded with a first pressure on a first side of the pressure sensor and the second semiconductor component is loaded with a second pressure on the first side of the pressure sensor, and both the first semiconductor component and the second semiconductor component are loaded with a reference pressure on a second side of the pressure sensor facing away from the first side, whereby a particularly simple construction can be achieved.
The third semiconductor component can be mounted in the housing in such a way that it can be acted upon selectively with the second pressure on a first side of the pressure sensor and with the first pressure on a second side of the pressure sensor facing away from the first side, or with the first pressure on the first side of the pressure sensor and with the second pressure on the second side of the pressure sensor facing away from the first side.
Particularly advantageous is a configuration of the pressure sensor in which the housing has a housing base body on which the first pressure connection and the second pressure connection are formed. The housing base body can have a housing receptacle on the second side of the pressure sensor, which can be closed by a housing cover. The housing receptacle has, for example, a circumferential delimiting wall and is divided by a partition wall into a first pressure chamber which is acted upon by a reference pressure and a second pressure chamber which is acted upon by the first pressure or the second pressure. The electrical connection face of the first pressure sensor module and the electrical connection face of the second pressure sensor module may be arranged in the first pressure chamber. The first pressure sensor module may have a first carrier substrate with a first through-penetration and a second through-penetration, wherein the first through-penetration and the second through-penetration are arranged in a first pressure chamber. The second pressure sensor module may have a second carrier substrate with a third through-penetration, wherein the third through-penetration is arranged in the second pressure chamber. The first pressure chamber, which can be acted upon by the reference pressure, is therefore simultaneously used to establish an electrical connection between the pressure sensor module and the electrical connection of the pressure sensor on the housing base body, which can be realized, for example, by means of a bond wire connection. Thus, the first pressure chamber can be loaded, for example, with ambient pressure, so that no aggressive substances act on the bonding wire. The first pressure and the second pressure can act on the pressure sensor module on a first side of the pressure sensor via a pressure channel formed in the housing base body. The pressure sensor module is protected against aggressive substances by a gel coating on the semiconductor component. The sealing is effected by a seal bond which can be applied simply in this region.
It is furthermore advantageous if the pressure sensor is used in combination with an electronic control unit, wherein the electronic control unit is configured to receive a first electrical signal representing a pressure difference of the first pressure relative to a reference pressure and a second electrical signal representing a pressure difference of the second pressure relative to the reference pressure from the electrical connections of the pressure sensor, wherein the electronic control unit has a subtraction means, wherein the subtraction means is configured to calculate a second pressure difference signal from a difference of the first electrical signal and the second electrical signal.
The electronic controller may be further configured to receive a first differential pressure signal from an electrical junction of the pressure sensor. The controller advantageously has a comparison device, wherein the comparison device is configured to compare a second differential pressure signal, which is calculated from a difference of the first electrical signal and the second electrical signal, with a first differential pressure signal, which represents a differential pressure of the first pressure relative to the second pressure, wherein, depending on at least the comparison, only the first differential pressure signal or only the second differential pressure signal or both the first differential pressure signal and the second differential pressure signal are considered valid. In this context, "at least" means that it should not be excluded that the controller recognizes both an error of the first differential pressure signal and an error of the second differential pressure signal and thus no differential pressure signal is considered valid and instead takes a substitute value or outputs an error signal.
Furthermore, the control device can have a selection device which provides at least the first pressure difference signal which is only recognized as valid or the second pressure difference signal which is only recognized as valid or a value, in particular an average value, which is calculated from the first pressure difference signal and the second pressure difference signal which are recognized as valid for further use of a control program in the control device, for example for controlling an internal combustion engine. The selection means may also not select any of the above values, or may alternatively select a substitute value, when an error in the first and second pressure difference signals has been identified.
Drawings
The figures show:
figure 1 is a perspective view of a first embodiment of a pressure sensor according to the present invention,
figure 2 an embodiment of a first pressure sensor module installed in a pressure sensor,
figure 3 an embodiment of a second pressure sensor module installed in a pressure sensor,
figure 4 is a schematic top view of a housing receiving part of a pressure sensor according to a first embodiment of the pressure sensor,
figure 5 is a schematic top view of a housing receiving part of a pressure sensor according to a second embodiment of the pressure sensor,
figure 6 is a schematic top view of a housing receiving part of a pressure sensor according to a third embodiment of the pressure sensor,
figure 7 is a schematic top view of a housing receiving part of a pressure sensor according to a fourth embodiment of the pressure sensor,
fig. 8 is a schematic illustration of a pressure sensor arrangement with a pressure sensor and an electronic controller.
Detailed Description
Fig. 1 shows a pressure sensor 1 for pressure sensing of a fluid medium. The pressure sensor 1 has a housing 10, which may comprise a housing base 100 and a housing cover 101 placed on the housing base 100. An electrical connection 7, which is designed, for example, as a plug, is provided on the housing base body 100. The housing base body 100 also has a first pressure connection 4 and a second pressure connection 5. The first pressure connection 4 has a pressure channel 14 and the second pressure connection 5 has a pressure channel 15. The housing base 100 has a first side 11 and a second side 12 facing away from the first side. In fig. 1, the viewing direction is directed towards the second side 12. As can be seen, the pressure sensor 1 has a housing receptacle 102 on the second side, which is embodied, for example, as a recess. The housing receptacle 102 is laterally delimited by a circumferential delimiting wall 31. A circumferential sealing adhesive 51, which is schematically illustrated in fig. 4, can be applied to or next to the circumferential limiting wall 31, for example, so that the housing cover 101 is placed in a sealing manner on the circumferential limiting wall 31. The housing receptacle 102 can be divided into a first pressure chamber 35 and a second pressure chamber 34, which are pressurized with a reference pressure P3, by a partition wall 32, which, as shown, can project as a wall segment into the housing receptacle 102 or can also be formed by a sealing adhesive application by means of an adhesive tape (klebereaup). The partition wall 32 can be provided with a seal bond 52 on its side facing away from the housing receptacle 102, as is schematically illustrated in fig. 4. When the housing cover 101 is placed, the first pressure chamber 35 is sealed with respect to the second pressure chamber 34 by the seal bonding portion 52. Further, the second pressure chamber is sealed from the external space by the seal bonding portion 51. The first pressure chamber can be sealed off from the exterior by means of a seal bond 51, wherein a pressure opening, not shown, can connect the first pressure chamber 35 to the exterior, so that an ambient pressure can act in the first pressure chamber as a reference pressure. The second pressure chamber 34 can be charged, for example, with a first pressure P1. For this purpose, a branching channel, not shown, from the first pressure channel 14, from which only the opening 33 is visible in fig. 1, can open out into the second pressure chamber 34 at the opening 33.
As can also be seen in fig. 1, a first pressure sensor module 21 and a second pressure sensor module 22 can be inserted into the housing receptacle 102 on the second side 12 of the pressure sensor.
An exemplary configuration of the first pressure sensor module 21 is shown in fig. 2. The first pressure sensor module 21 has, for example, a first carrier substrate 201 a. The first carrier substrate can be a circuit board, for example, which is provided on the underside with a land grid array having connection areas 211 a. On the side facing away from the connection face 211a, the first carrier substrate 201a is provided with passive electrical components 203 and a first integrated electronic circuit component 204 a. The first integrated electronic circuit component 204a can be provided as a signal processing device and be constructed, for example, as an ASIC. Furthermore, the pressure sensor module 21 has a mold frame 202 made of mold quality, which covers the passive electrical component 203 and the circuit part 204 a. The mold frame 202 has two depressions in which the first semiconductor member 210a or the second semiconductor member 210b is disposed on a stage (post) made of a molding mass by adhesive coating, respectively.
The first semiconductor member 210a is a pressure sensor element with at least one pressure sensitive membrane 221, which is provided with a wheatstone bridge circuit on its side facing away from the first carrier substrate 201a, thereby forming a first pressure sensing device 41. The first semiconductor member 210a or first pressure sensing device is in electrical contact with the first carrier substrate 201a by means of a bond wire connection 207. The bond wire connection 207 leads through an opening of the mold frame 202, which is covered by a passivation layer 208 a. The first semiconductor member 210a is arranged above the through portion 213a in the first carrier substrate 201a in the sunken portion of the mold frame 202. The depression may be covered by means of a gel 209 a. The membrane 221 can be loaded on the second side 12 by the through-opening 213a with a reference pressure P3 and on the first side 11 by the gel 209a with a first pressure P1. The pressure difference between the first pressure P1 and the reference pressure P3 causes a deflection of the membrane 221, whereby the first pressure-sensing device 41 outputs a first electrical signal S1 representing the pressure difference of the first pressure P1 relative to the reference pressure P3, which is transmitted via the bond wire connection 207 and the conductor tracks of the first carrier substrate 201a to the signal-processing circuit component 204a and from there to the connection face 211 a.
The second semiconductor component 210b is a pressure sensor element with at least one pressure-sensitive membrane 222 which is provided with a wheatstone bridge circuit on its side facing away from the first carrier substrate 201a, thereby forming the second pressure-sensing device 42. The second semiconductor member 210b or the second pressure-sensing device 42 is in electrical contact with the first carrier substrate 201a by means of a bond wire connection 207. The bond wire connection 207 leads through an opening of the mold frame 202, which is covered by a passivation layer 208 b. The second semiconductor component 210b is arranged above the through-opening 213b in the first carrier substrate 201a in a further depression of the mold frame 202. The depression may be covered by means of a gel 209 b. The diaphragm 222 may be loaded with a reference pressure P3 on the second side 12 through the through 213b and a second pressure P2 on the first side 11 through the gel 209 b. The pressure difference between the second pressure P2 and the reference pressure P3 causes deflection of the diaphragm 222, whereby the second pressure-sensing means 42 outputs a second electrical signal S2 representing the pressure difference of the second pressure P2 relative to the reference pressure P3, which second electrical signal is transferred via the bond wire connection 207 and the conductor tracks of the first carrier substrate 201a to the signal-processing circuit component 204a and from there to the connection face 211 a.
An exemplary configuration of the third pressure sensor module 23 is shown in fig. 3. The third pressure sensor module 23 has, for example, a second carrier substrate 201 c. The second carrier substrate can be a circuit board, for example, which is provided on the underside with a land grid array having connection areas 211 c. The carrier substrate 201c is provided with passive electrical components and a second integrated electronic circuit component 204c on a side facing away from the connection face 211 c. Furthermore, the second pressure sensor module 22, like the first pressure sensor module, has a molded frame 202 made of molded mass, which covers the passive electrical component 203 and the circuit component 204 c. The mold frame 202 has a depression in which the third semiconductor member 210c is disposed on a stage made of a molding quality by adhesive coating. The third semiconductor component 210c is a pressure sensor element with at least one pressure-sensitive membrane 223 which is provided with a wheatstone bridge circuit on its side facing away from the second carrier substrate 201c, thereby forming a third pressure-sensing device 43. The third semiconductor member 210c or the third pressure sensing means 43 is in electrical contact with the second carrier substrate 201c by means of a bond wire connection 207. The bond wire connection 207 leads through an opening of the mold frame 202, which is covered by a passivation layer 208 c. The third semiconductor member 223 may be covered in the subsidence by means of the gel 209 c. The membrane 223 can be loaded with a pressure, for example a first pressure P1, on the second side 12 via the through-opening 213c and with a further pressure, for example a second pressure P2, on the first side 11 via the gel 209 c. The pressure difference between the first pressure P2 and the second pressure P3 causes a deflection of the diaphragm 223, whereby the third pressure-sensing means 43 outputs a first pressure difference signal S3 representing the pressure difference of the second pressure P2 relative to the first pressure P1, which is transferred via the bond wire connection 207 and the conductor tracks of the second carrier substrate 201c to the signal processing circuit component 204c and from there to the connection face 211 c.
As can also be seen in fig. 1 and 4, the electrical connection surface 211a of the first pressure sensor module 21 is arranged in the first pressure chamber 35 and is there contacted by a bond wire connection 18a with a conductor end 17a of a stamped rail (stanzgiterbahnen) 17 of the housing base body 100, the other end of which is exposed for external contacting in the electrical connection 7 of the pressure sensor 1. In the same way, the electrical connection surface 211c of the second pressure sensor module 22 can be arranged in the first pressure chamber 35 and can be contacted via the bonding wire connection 18c with a conductor end 17c of a stamped rail 17 of the housing base body 100, the other end of which is exposed for external contact in the electrical connection 7 of the pressure sensor 1.
As can be seen most easily in fig. 1, the first pressure sensor module 21 is inserted into the housing receptacle 102 in such a way that the first carrier substrate 201a faces the first pressure chamber 35 with the passages 213a and 213b on the second side 12 of the pressure sensor. The second pressure sensor module 22 is inserted into the housing receptacle 102 in such a way that the second carrier substrate 201c faces the second pressure chamber 34 with a through-opening 213c on the second side 12 of the pressure sensor. Therefore, the first pressure sensor module 21 and the second pressure sensor module 22 are mounted in the housing 10 of the pressure sensor 1 as separate components from each other.
The pressure connection of the embodiment of the pressure sensor 1 shown in fig. 1 is shown in outline in the schematic representation of fig. 4. As can be seen in fig. 4, the first pressure channel 14 and the second pressure channel 15 can each be embodied, for example, as a blind hole in the housing base body 100. The first pressure channel 14 is connected to the second pressure chamber 34 via a branching and an inlet opening 33, so that a first pressure P1 is present in the second pressure chamber 34. Furthermore, the first pressure channel 14 is connected to the molded mass 202 of the first pressure sensor module 21 by a circumferential sealing adhesive 53 arranged in the housing base body in such a way that the pressure in the first pressure channel 14 acts on the first pressure sensing device 41 via the gel layer 209 a.
Furthermore, the second pressure channel 15 is connected to the molding mass 202 of the first pressure sensor module 21 on the side of the first pressure sensor module 21 facing away from the observer in fig. 4 by means of a further circumferential sealing adhesive 54 arranged in the housing base body in such a way that the pressure in the second pressure channel 15 acts via the gel layer 209b on the second pressure-sensing device 42. Finally, the second pressure channel 15 is connected to the molding mass 202 of the second pressure sensor module 22 on the side of the second pressure sensor module 22 facing away from the observer in fig. 4 by a third, circumferential sealing adhesive 55 arranged in the housing base body in such a way that the pressure in the second pressure channel 15 acts via the gel layer 209c on the third pressure-sensing device 43.
To summarize, the first semiconductor component 210a is loaded with a first pressure P1 on the first side 11 of the pressure sensor 1 and the second semiconductor component 210b is loaded with a second pressure P2 on the first side 11 of the pressure sensor 1, and the first semiconductor component 210a and the second semiconductor component 210b are also loaded with a reference pressure P3 on the second side 12 of the pressure sensor 1 facing away from the first side 11. In the exemplary embodiment of fig. 1 and 4, the third semiconductor component 210c is acted upon by the second pressure P2 on the first side 11 of the pressure sensor 1 and by the first pressure P1 on the second side 12 of the pressure sensor 1 facing away from the first side 11. It is of course also possible for the third semiconductor component 210c to be acted upon by the first pressure P1 on a first side 11 of the pressure sensor 1 and by the second pressure P2 on a second side 12 of the pressure sensor 1 facing away from the first side 11.
Fig. 5 shows a schematic top view of a housing receiving part of a pressure sensor according to a second embodiment of the pressure sensor. As can be seen in fig. 5, the overall construction is here established symmetrically with respect to fig. 4. But the function of the pressure connection is essentially that of figure 4.
Fig. 6 shows a schematic top view of a housing receptacle of a pressure sensor according to a third embodiment of the pressure sensor 1. In this embodiment, the first pressure channel 14 opens into a second pressure chamber 34, which is of relatively large design. In contrast to fig. 4 and 5, the first pressure sensor module 21 projects pedal-like into the second pressure chamber 34. The separating wall 3 is formed here by a seal bond 52 which, proceeding from the bridge section 52b, has a U-shaped section 52a which is applied to the first carrier substrate 201a in such a way that both passages 213a and 213b are arranged in the first pressure chamber 35, while the side of the first semiconductor component 210a covered by the gel 209a is arranged in the second pressure chamber 34 on the side facing away from the observer in fig. 6.
Fig. 7 shows a schematic top view of a housing receptacle of a pressure sensor according to a fourth embodiment of the pressure sensor 1. In this embodiment, the second pressure sensor module 22 is arranged on the side of the pressure sensor 1 facing away from the pressure connections 4 and 5, in contrast to the previous embodiments. The first pressure channel 14 is connected to the second pressure chamber 34 by a feed-in opening 33 in the center of the housing base body 100, which is surrounded by the seal bond 52 and/or the partition 32 in a U-shaped manner.
Fig. 8 shows a schematic representation of a pressure sensor arrangement with a pressure sensor and an electronic controller 300. The pressure sensor 1 may be implemented by any of the embodiments shown in fig. 1 to 7. The pressure sensor 1 is used, for example, in an exhaust system 400 of an internal combustion engine to sense a first pressure P1 upstream of a particle filter 401 and a second pressure P2 downstream of the particle filter 401 and upstream of an acoustic damper 402. This occurs as described in fig. 1 to 7. In this regard, the pressure sensor 1 provides the first and second electrical signals S1 and S2 and the first differential pressure signal S3 to the electronic controller 300. In this case, for example, the first electrical signal S1 is transmitted via the interface 301 and the second electrical signal S2 is transmitted via the interface 302 and the first differential pressure signal S3 is transmitted via the interface 309 to the controller 300.
Unlike the diagram in fig. 8, the first electrical signal S1 and the second electrical signal S2 can also be transmitted to the controller 300 on a common send conductor (Single Edge Nibble Transmission) and the first differential pressure signal S3 on a second send conductor, for example. Furthermore, it is also possible, for example, for all the send signals to be output via the electrical connections 7 on a single send conductor by connecting the two pressure sensor modules 21, 2 to one another, via the printed conductor lines of the first and second carrier substrates and/or also via the lines of the conductor ends 17a and 17 c. This advantageously results in savings in cable harness and reduces the number of ASICs used.
In the controller 300, the first electrical signal S1 may be supplied to the first inverter 303, and the second electrical signal S2 may be supplied to the second inverter 304, and the first differential pressure signal S3 may be supplied to the third inverter 308. The electronic controller 300 has a subtraction device 305, wherein the subtraction device 305 is configured for generating a second pressure difference signal S4 from a difference of the first electrical signal S1 received from the first transducer 303 and the second electrical signal S2 received from the second transducer 304.
The received first pressure difference signal S3 represents the pressure difference between the first pressure P1 acting on the first pressure connection 4 and the second pressure P2 acting on the second pressure connection 5, which first pressure difference signal has been sensed by the third pressure sensing device 43.
And the second differential pressure signal S4 is a calculated pressure difference calculated from the first electrical signal S1 and the second electrical signal S2. Thus, the information about the pressure difference between the first pressure P1 acting on the first pressure connection 4 and the second pressure P2 acting on the second pressure connection 5 is present dually in the controller, on the one hand as a measured value which has been measured by the third pressure sensing means acting as a pressure difference sensor, and on the other hand as a value which has been calculated on the basis of the difference of the values for the first pressure and the second pressure sensed by the first and second pressure sensing means.
The controller 300 may further have a comparison device 306, wherein the comparison device 306 is configured to compare the first pressure difference signal S3 with the calculated second pressure difference signal S4 or to be subjected to a plausibility test, wherein, depending on the comparison, for example, at least only the first pressure difference signal S3 or only the second pressure difference signal S4 or both the first pressure difference signal S3 and the second pressure difference signal S4 are considered valid. Values deemed disadvantageous may not be adopted. This also applies in the case where all signals are considered to be unfavorable. The comparison may be made, for example, with reference to a confidence test. In this case, an error can be inferred, for example, from a missing differential pressure signal or a strong deviation of the differential pressure signal from a predetermined value or from a comparison of the differential pressure signal with an expected value or a change of this value over time. If, for example, one of the two differential pressure signals differs from the other differential pressure signal in such a way that it can only be recognized as faulty, a faulty differential pressure signal can also be inferred from a comparison of the first differential pressure signal with the second differential pressure signal.
Furthermore, the control device can have a selection device 307, which provides the first pressure difference signal S3 identified as valid or the second pressure difference signal S4 identified as valid or a value calculated from the first pressure difference signal S3 and the second pressure difference signal S4 identified as valid, in particular an average value, for further use in a control program of the control device 300, for example for controlling an internal combustion engine.
Claims (10)
1. Pressure sensor (1) for pressure sensing of a fluid medium, comprising: a housing (10) having a first pressure connection (4) and a second pressure connection (5) separate from the first pressure connection (4), wherein the first pressure connection (4) has a first pressure channel (14) which can be acted upon by a first pressure (P1), wherein the second pressure connection (5) has a second pressure channel (15) which can be acted upon by a second pressure (P2); and a first pressure sensing means (41) arranged in said housing (10), provided for said first pressure (P1) loaded to act on said first pressure connection (4) and for outputting a first electrical signal (S1) representative of the pressure difference of said first pressure (P1) with respect to a reference pressure (P3); and a second pressure sensing means (42) arranged for being loaded with said second pressure (P2) acting on said second pressure connection (5) and for outputting a second electrical signal (S2) representing a pressure difference of said second pressure (P2) with respect to a reference pressure (P3), characterized in that a third pressure sensing means (43) is arranged in said housing (10) and arranged for being loaded with said first pressure (P1) acting on said first pressure connection (4) and said second pressure (P2) acting on said second pressure connection (6) and for outputting a first pressure difference signal (S3) representing a pressure difference of said first pressure (P1) with respect to said second pressure (P2).
2. Pressure sensor according to claim 1, characterized in that a first pressure sensor module (21), on which the first pressure sensing device (41) and the second pressure sensing device (42) are configured, and a second pressure sensor module (22), on which the third pressure sensing device (43) is configured, are mounted in the housing (10) of the pressure sensor (1) as separate components from each other.
3. Pressure sensor according to claim 2, characterized in that the first pressure sensor module (21) has a first carrier substrate (201a) on which a first semiconductor component (210a) with at least one first pressure-sensitive membrane (221) on which the first pressure-sensing means (41) are constructed and a second semiconductor component (210b) with at least one second pressure-sensitive membrane (222) on which the second pressure-sensing means (42) are constructed are arranged, and in that at least one first integrated electronic circuit component (204a) is applied as signal processing means on the first carrier substrate (201a), which is provided for providing a pressure representative of the first pressure (P1) relative to the reference pressure (P3) on a connection face (211a) of the first carrier substrate (201a) The first electrical signal (S1) of the force difference and the second electrical signal (S2) representing the pressure difference of the second pressure (P2) with respect to the reference pressure (P3).
4. A pressure sensor according to claim 3, characterized in that the first semiconductor component (210a) is loaded with the first pressure (P1) on a first side (11) of the pressure sensor (1) and the second semiconductor component (210b) is loaded with the second pressure (P2) on the first side (11) of the pressure sensor (1), and that both the first semiconductor component (210a) and the second semiconductor component (210b) are loaded with the reference pressure (P3) on a second side (12) of the pressure sensor (1) facing away from the first side (11).
5. A pressure sensor as claimed in claim 2, characterized in that the second pressure sensor module (22) has a second carrier substrate (201c) on which a third semiconductor component (210c) with at least one third pressure-sensitive membrane (223) is arranged, on which the third pressure-sensing means (43) are constructed, and at least one second integrated electronic circuit component (204c) is applied as signal processing means on the second carrier substrate (201c), which is provided for providing the first differential pressure signal (S3) representing the differential pressure of the first pressure (P1) relative to the second pressure (P2) on a connection face (211c) of the second carrier substrate (201 c).
6. The pressure sensor of claim 5,
-the third semiconductor member (210c) is loaded with the second pressure (P2) on a first side (11) of the pressure sensor (1) and with the first pressure (P1) on a second side (12) of the pressure sensor (1) facing away from the first side (11), or,
-the third semiconductor member (210c) is loaded with the first pressure (P1) on a first side (11) of the pressure sensor (1) and with the second pressure (P2) on a second side (12) of the pressure sensor (1) facing away from the first side (11).
7. Pressure sensor according to one of claims 2 to 6, characterized in that the housing (10) has a housing base body (100) on which the first pressure connection (4) and the second pressure connection (5) are formed, the housing base body (100) having a housing receptacle (102) on a second side (12) of the pressure sensor (1), which can be closed by a housing cover (101), and the housing receptacle (102) having a circumferential delimiting wall (31) and being divided by a separating wall (32) into a first pressure chamber (35), which is acted upon by the reference pressure (P3), and a second pressure chamber (34), which is acted upon by the first pressure (P1) or the second pressure (P2), an electrical connection surface (211a) of the first pressure sensor module (21) and an electrical connection surface (211c) of the second pressure sensor module (22) being arranged In the first pressure chamber (35) and electrically connected to an electrical connection (7), the first pressure sensor module (21) has a first carrier substrate (201a) with a first through-opening (213a) and a second through-opening (213b), wherein the first through-opening (213a) and the second through-opening (213b) are arranged in the first pressure chamber (35), and the second pressure sensor module (22) has a second carrier substrate (201c) with a third through-opening (213c), wherein the third through-opening (213c) is arranged in the second pressure chamber (34).
8. Pressure sensor arrangement with a pressure sensor according to any one of claims 1 to 7 and an electronic controller (300), wherein the electronic controller (300) is configured for receiving the first electrical signal (S1) representing the pressure difference of the first pressure with respect to the reference pressure (P3) and the second electrical signal (S2) representing the pressure difference of the second pressure with respect to the reference pressure (P3) from the electrical connection (17) of the pressure sensor (1), wherein the electronic controller (300) has a subtraction means (305), wherein the subtraction means (305) is configured for calculating a second pressure difference signal (S4) from the difference of the first electrical signal (S1) and the second electrical signal (S2).
9. The pressure sensor device of claim 8,
the electronic controller (300) is further configured for receiving the first pressure difference signal (S3) representing a pressure difference of the first pressure (P1) with respect to the second pressure (P2) from the electrical connector (7) of the pressure sensor (1), and the controller (300) has a comparing means (306), wherein the comparison means (306) is configured for comparing the second pressure difference signal (S4) calculated from the difference of the first electrical signal (S1) and the second electrical signal (S2) with the first pressure difference signal (S3) representing the pressure difference of the first pressure (P1) relative to the second pressure (P2), wherein at least either only the first differential pressure signal (S3) or only the second differential pressure signal (S4) or both the first differential pressure signal (S3) and the second differential pressure signal (S4) are considered valid as a function of the comparison.
10. Pressure sensor arrangement according to claim 9, characterized in that a selection means (307) is provided which provides at least the first pressure difference signal (S3) which is only identified as valid or the second pressure difference signal (S4) which is only identified as valid or a value, in particular an average value, calculated from the first pressure difference signal (S3) and the second pressure difference signal (S4) which are identified as valid for further use in a control program of the controller (300), for example for operating an internal combustion engine.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102019205154.5 | 2019-04-10 | ||
| DE102019205154.5A DE102019205154A1 (en) | 2019-04-10 | 2019-04-10 | Pressure sensor for detecting the pressure of fluid media and pressure sensor device with such a pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111811729A true CN111811729A (en) | 2020-10-23 |
Family
ID=72613538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010279406.3A Pending CN111811729A (en) | 2019-04-10 | 2020-04-10 | Pressure sensor and pressure sensor arrangement having such a pressure sensor |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111811729A (en) |
| DE (1) | DE102019205154A1 (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4227893A1 (en) * | 1991-10-18 | 1993-04-22 | Bosch Gmbh Robert | Differential pressure sensor e.g. for vehicle fuel tank - contains two semiconducting membranes with sensor elements on upper sides in common reference chamber, lower sides exposed to different pressures |
| US20080000302A1 (en) * | 2006-06-29 | 2008-01-03 | Denso Corporation | Differential pressure sensor having symmetrically-provided sensor chips and pressure introduction passages |
| CN101451895A (en) * | 2007-10-31 | 2009-06-10 | Kg传送部件有限责任公司 | Pressure transducer and method for monitoring the state of pressure transducer and pressure sensor |
| CN102539060A (en) * | 2010-12-10 | 2012-07-04 | 霍尼韦尔国际公司 | Increased sensor die adhesion |
| CN102980711A (en) * | 2011-09-06 | 2013-03-20 | 霍尼韦尔国际公司 | Packaged sensor with multiple sensors elements |
| CN107076632A (en) * | 2014-10-16 | 2017-08-18 | 罗伯特·博世有限公司 | For the pressure sensor for the pressure for detecting fluid media (medium) |
| CN107063555A (en) * | 2016-02-10 | 2017-08-18 | 森萨塔科技有限公司 | For the system, apparatus and method using two MEMS sensing elements measurement differential pressures and absolute pressure |
| CN107615034A (en) * | 2015-05-28 | 2018-01-19 | 罗伯特·博世有限公司 | Method for the device of the pressure that senses fluid media (medium) and for manufacturing described device |
| CN207515952U (en) * | 2017-12-04 | 2018-06-19 | 潍柴西港新能源动力有限公司 | Double differential pressure pickups |
| CN208223708U (en) * | 2018-05-31 | 2018-12-11 | 联合汽车电子有限公司 | Pressure sensor for vehicle |
| CN109141734A (en) * | 2017-06-16 | 2019-01-04 | 罗斯蒙特公司 | Pressure sensor module for working voltage application |
-
2019
- 2019-04-10 DE DE102019205154.5A patent/DE102019205154A1/en not_active Withdrawn
-
2020
- 2020-04-10 CN CN202010279406.3A patent/CN111811729A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4227893A1 (en) * | 1991-10-18 | 1993-04-22 | Bosch Gmbh Robert | Differential pressure sensor e.g. for vehicle fuel tank - contains two semiconducting membranes with sensor elements on upper sides in common reference chamber, lower sides exposed to different pressures |
| US20080000302A1 (en) * | 2006-06-29 | 2008-01-03 | Denso Corporation | Differential pressure sensor having symmetrically-provided sensor chips and pressure introduction passages |
| CN101451895A (en) * | 2007-10-31 | 2009-06-10 | Kg传送部件有限责任公司 | Pressure transducer and method for monitoring the state of pressure transducer and pressure sensor |
| CN102539060A (en) * | 2010-12-10 | 2012-07-04 | 霍尼韦尔国际公司 | Increased sensor die adhesion |
| CN102980711A (en) * | 2011-09-06 | 2013-03-20 | 霍尼韦尔国际公司 | Packaged sensor with multiple sensors elements |
| CN107076632A (en) * | 2014-10-16 | 2017-08-18 | 罗伯特·博世有限公司 | For the pressure sensor for the pressure for detecting fluid media (medium) |
| CN107615034A (en) * | 2015-05-28 | 2018-01-19 | 罗伯特·博世有限公司 | Method for the device of the pressure that senses fluid media (medium) and for manufacturing described device |
| CN107063555A (en) * | 2016-02-10 | 2017-08-18 | 森萨塔科技有限公司 | For the system, apparatus and method using two MEMS sensing elements measurement differential pressures and absolute pressure |
| CN109141734A (en) * | 2017-06-16 | 2019-01-04 | 罗斯蒙特公司 | Pressure sensor module for working voltage application |
| CN207515952U (en) * | 2017-12-04 | 2018-06-19 | 潍柴西港新能源动力有限公司 | Double differential pressure pickups |
| CN208223708U (en) * | 2018-05-31 | 2018-12-11 | 联合汽车电子有限公司 | Pressure sensor for vehicle |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102019205154A1 (en) | 2020-10-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11143562B2 (en) | Device for detecting a pressure of a fluid medium and method for manufacturing the device | |
| EP2189773B1 (en) | Design of wet/wet differential pressure sensor based on microelectronic packaging process | |
| KR101208442B1 (en) | Differential pressure measurement using backside sensing and a single asic | |
| US5859759A (en) | Semiconductor pressure sensor module | |
| EP1994387B1 (en) | Disposable pressure sensor and a method of forming it | |
| KR102271591B1 (en) | Differential pressure sensor | |
| US7536917B2 (en) | Pressure sensor | |
| US6993976B2 (en) | Pressure measuring device | |
| US4895026A (en) | Semiconductor pressure sensor | |
| KR102276887B1 (en) | Package for a differential pressure sensing die | |
| US6945120B1 (en) | Exhaust gas recirculation system using absolute micromachined pressure sense die | |
| EP1782033B1 (en) | Exhaust gas recirculation system using absolute micromachined pressure sense die | |
| CN1284163A (en) | Madia compatible packages for pressure sensing devices | |
| US7320250B2 (en) | Pressure sensing element and sensor incorporating the same | |
| CN113390555A (en) | Differential pressure sensing base | |
| US8544333B2 (en) | Air pressure sensor for impact recognition | |
| US11199463B2 (en) | Pressure sensor system having a land grid array/mold premold structure and method for its manufacture | |
| CN106052940B (en) | Device for determining pressure and method for producing the same | |
| US10240993B2 (en) | Pressure sensor for recording a pressure of a fluid medium | |
| CN111811729A (en) | Pressure sensor and pressure sensor arrangement having such a pressure sensor | |
| JP2009047670A (en) | Pressure sensor | |
| CN111148979B (en) | Pressure sensor assembly, measuring device and method for the production thereof | |
| JP2017166872A (en) | Pressure sensor module and connection structure of pressure sensor module | |
| KR20200000347A (en) | First level package for pressure sensor module | |
| CN217107252U (en) | Differential pressure sensor and exhaust gas recirculation system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20201023 |