CN111806014B - Polyethylene low-temperature puncture-resistant packaging film and preparation method thereof - Google Patents

Polyethylene low-temperature puncture-resistant packaging film and preparation method thereof Download PDF

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CN111806014B
CN111806014B CN202010699417.7A CN202010699417A CN111806014B CN 111806014 B CN111806014 B CN 111806014B CN 202010699417 A CN202010699417 A CN 202010699417A CN 111806014 B CN111806014 B CN 111806014B
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polyethylene
temperature
packaging film
low
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CN111806014A (en
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刘�东
张宝轩
王学广
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SHANDONG QILU ETHYLENE CHEMICA
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SHANDONG QILU ETHYLENE CHEMICA
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07—Flat, e.g. panels
    • B29C48/08—Flat, e.g. panels flexible, e.g. films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/16—Articles comprising two or more components, e.g. co-extruded layers
    • B29C48/18—Articles comprising two or more components, e.g. co-extruded layers the components being layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25—Component parts, details or accessories; Auxiliary operations
    • B29C48/92—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/327—Layered products comprising a layer of synthetic resin comprising polyolefins comprising polyolefins obtained by a metallocene or single-site catalyst
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2948/00—Indexing scheme relating to extrusion moulding
    • B29C2948/92—Measuring, controlling or regulating
    • B29C2948/92504—Controlled parameter
    • B29C2948/92704—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
    • B29K2023/04—Polymers of ethylene
    • B29K2023/06—PE, i.e. polyethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
    • B29K2023/04—Polymers of ethylene
    • B29K2023/06—PE, i.e. polyethylene
    • B29K2023/0608—PE, i.e. polyethylene characterised by its density
    • B29K2023/0633—LDPE, i.e. low density polyethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2077/00—Use of PA, i.e. polyamides, e.g. polyesteramides or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/31—Heat sealable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2439/00—Containers; Receptacles
    • B32B2439/70—Food packaging

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wrappers (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention belongs to the technical field of food packaging films, and particularly relates to a polyethylene low-temperature puncture-resistant packaging film and a preparation method thereof. The puncture-resistant packaging film sequentially comprises a layer A, a layer B, a layer C, a layer D, a layer E, a layer F and a layer G from outside to inside from the cross section, wherein the layer A and the layer C are the same in component and are both nylon, the layer B and the layer D are the same in component and are both adhesive resin, the layer E is low-density polyethylene, the layer F is metallocene polyethylene, and the density of the metallocene polyethylene is 0.865-0.915G/cm3The melt index is 1.0-3.0G/10 min, and the G layer is a heat sealing layer. According to the polyethylene low-temperature puncture-resistant packaging film disclosed by the invention, on the basis of ensuring the mechanical property of the packaging film, after low-temperature sealing, the bonding force between the heat-sealing layers is proper, and the layers are mutually matched to ensure that the packaging film is puncture-resistant, so that the packaging safety is improved, and the introduction of external pollutants is effectively avoided.

Description

Polyethylene low-temperature puncture-resistant packaging film and preparation method thereof
Technical Field
The invention belongs to the technical field of food packaging films, and particularly relates to a polyethylene low-temperature puncture-resistant packaging film and a preparation method thereof.
Background
With the development of the packaging industry and the improvement of effective efficiency, many food factories abandon the prefabricated packaging bags through automatic packaging machines to improve the production efficiency, and the automatic packaging machines are different from the prefabricated packaging bags in that the automatic packaging machines do not need to form bags in advance, but realize automatic packaging through a series of processes of automatic forming, filling, heat sealing and the like on the packaging machines. Generally, as the speed of the packaging machine increases, the packaging operation needs to be completed in a shorter time, and therefore, the heat sealability, particularly the low-temperature puncture resistance, of the packaging film is important. As the food packaging speed is faster and faster, higher requirements are provided for the packaging performance of the packaging film, particularly the puncture resistance, and the traditional low-temperature heat-sealing film cannot meet the requirements of the modern food packaging industry, so that the ultra-low-temperature heat-sealing film is required to meet the requirement of ultra-high-speed packaging.
At present, in daily life, people often contact various cooked food, such as instant cooked food of fish bean curd, duck necks, chicken wings and the like. The common packaging structure for packaging the cooked food is to compound a polyethylene heat-sealing bottom film and an OPET/OPP surface film, print, make a bag, then fill the contents in the bag and seal the bag.
When cooked food containing more oily substances, bones or the like with thorns, such as fish tofu, duck necks and chicken wings, is packaged, serious problems can be caused, firstly, the influence of grease at the sealing position is caused, secondly, the anti-puncturing property of a film prepared by blending low-density polyethylene and common linear low-density polyethylene is not enough, the film is easily damaged by the thorns of the contents, so that not only can the fluid in the contents overflow and the whole package be damaged, but also the external microorganisms and pollutants are introduced due to the integral damage of the package, and the effect and the safety of the package are seriously influenced.
Therefore, there is a need to find a polyethylene low-temperature puncture-resistant packaging film.
Disclosure of Invention
The purpose of the invention is: provides a polyethylene low-temperature puncture-resistant packaging film. The low-temperature puncture-resistant packaging film has good puncture resistance and good sealing performance at low temperature; the invention also provides a preparation method thereof.
The polyethylene low-temperature puncture-resistant packaging film comprises a layer A, a layer B, a layer C, a layer D, a layer E, a layer F and a layer G in sequence from outside to inside from the cross section of the packaging film, wherein the layer A and the layer C are the same in component and are both nylon, the layer B and the layer D are the same in component and are both adhesive resin, the layer E is low-density polyethylene, the layer F is metallocene polyethylene, and the density of the metallocene polyethylene is 0.865-0.915G/cm3Melt and meltThe melt index is 1.0-3.0G/10 min, and the G layer is a heat sealing layer.
Wherein:
the layer F creatively adopts metallocene polyethylene, and the puncture resistance of the film is improved.
The thickness of polyethylene low temperature resistant puncture packaging film be 120 ~ 240um, the thickness of A layer, B layer, C layer, D layer, E layer, F layer, G layer account for than being 8 ~ 16%: 8-16%: 8-16%: 8-16%: 8-15%: 8-15%: 8-16%.
The density of the nylon on the layer A and the layer C is 1.13-1.17 g/cm3。
The nylon of the A layer and the C layer is one of PA-6, PA-610 or PA-1010, preferably PA-6.
The adhesive resin of the layer B and the layer D is maleic anhydride grafted polyethylene resin, and the density of the maleic anhydride grafted polyethylene resin is 0.90-0.91g/cm3The melt index is 2.8 to 3.0g/10 min.
The density of the low-density polyethylene of the E layer is 0.91-0.93 g/cm3The melt index is 1.5-2.5 g/10 min.
The G layer is a heat sealing layer and is a blending modified resin of metallocene polyethylene and linear low-density polyethylene, the melt index of the blending modified resin is 1.8-2.2G/10 min, and the density is 0.81-0.93G/cm3(ii) a The purpose of adding metallocene polyethylene into the heat sealing layer is to increase the heat sealing strength, and the purpose of adding linear low-density polyethylene is to improve the aging resistance, acid and alkali resistance, flexibility and processability of the film.
The weight of the metallocene polyethylene in the heat sealing layer accounts for 30-70% of the weight of the blending modified resin, and the weight of the linear low-density polyethylene accounts for 30-70% of the weight of the blending modified resin.
As a preferred technical scheme, the polyethylene low-temperature puncture-resistant packaging film disclosed by the invention is a seven-layer composite film, and comprises a layer A, a layer B, a layer C, a layer D, a layer E, a layer F and a layer G from outside to inside in sequence from the cross section of the packaging film; the component of the F layer is metallocene polyethylene, and the density of the metallocene polyethylene is 0.880-0.915 g/cm3The melt index is 2.0-3.0 g/10 min; the other components of each layer are as follows:
the layer A is made of nylon with the density of 1.15-1.17g/cm3The nylon is PA-6;
the layer B is adhesive resin, the adhesive resin is maleic anhydride grafted polyethylene resin, and the density of the maleic anhydride grafted polyethylene resin is 0.90-0.91g/cm3The melt index is 2.8-3.0g/10 min;
the layer C is PA-6, and the density of the PA-6 is 1.15-1.17g/cm3；
The layer D is adhesive resin, the adhesive resin is maleic anhydride grafted polyethylene resin, and the density of the maleic anhydride grafted polyethylene resin is 0.90-0.91g/cm3The melt index is 2.8-3.0g/10 min;
the component of the E layer is low density polyethylene, and the density of the low density polyethylene is 0.92-0.93 g/cm3The melt index is 2.0-2.5 g/10 min;
the G layer is a heat sealing layer and is a blending modified resin of metallocene polyethylene and linear low-density polyethylene, the melt index of the blending modified resin is 2.0-2.2G/10 min, and the density is 0.85-0.93G/cm3(ii) a The weight of the metallocene polyethylene in the heat-sealing layer accounts for 60-70% of the weight of the blending modified resin, and the weight of the linear low-density polyethylene accounts for 50-60% of the weight of the blending modified resin.
According to the polyethylene low-temperature puncture-resistant packaging film, nylon is selected from the layer A and the layer C to improve the barrier property, the nylon on the surface layer is scratch-resistant and printable, the bonding resin of the layer B and the layer D plays a role in bonding, the layer F adopts metallocene polyethylene to play a role in puncture resistance, and the selection of the raw materials of the layer E and the layer G is based on the comprehensive consideration of the aspects of cost, elongation, stiffness, transparency and thickness uniformity of a formed film.
The preparation method of the polyethylene low-temperature puncture-resistant packaging film comprises the steps of respectively melting and extruding raw materials of the layer A, the layer B, the layer C, the layer D, the layer E, the layer F and the layer G by an extruder, converging the raw materials at a die head through respective flow channels, shaping by a film opening air ring, cooling by a water ring, entering a first traction device for stretching and exhausting, uniformly distributing the thickness points of the film on a reel by rotating the traction device, entering a second traction device for drying at the temperature of less than or equal to 100 ℃, then rectifying in a rectifying device, entering a third traction device for film drawing, finally rolling by a rolling device through a film guiding device, and obtaining the polyethylene low-temperature puncture-resistant packaging film.
As a preferred technical scheme, the preparation method of the polyethylene low-temperature puncture-resistant packaging film comprises the following steps:
(1) proportionally adding the raw materials of the layer A into a stirrer to be uniformly stirred, and carrying out blending extrusion at the melting temperature of 200-260 ℃ to form a layer A molten material; proportionally adding the raw materials of the layer B into a stirrer to be uniformly stirred, and performing blending extrusion at the melting temperature of 170-250 ℃ to form a layer B molten material; proportionally adding the raw materials of the layer C into a stirrer to be uniformly stirred, and carrying out blending extrusion at the melting temperature of 200-260 ℃ to form a layer C molten material; proportionally adding the raw materials of the layer D into a stirrer to be uniformly stirred, and performing blending extrusion at the melting temperature of 170-250 ℃ to form a molten material of the layer D; adding the raw materials of the E layer into a stirrer in proportion, uniformly stirring, and performing blending extrusion at the melting temperature of 180-240 ℃ to form a molten material of the E layer; adding the raw materials of the F layer into a stirrer in proportion, uniformly stirring, and performing blending extrusion at the melting temperature of 180-240 ℃ to form a molten material of the F layer; proportionally adding the raw materials of the G layer into a stirrer to be uniformly stirred, and performing blending extrusion at the melting temperature of 180-240 ℃ to form a molten material of the G layer; the molten materials of each layer enter a co-extrusion die head with the temperature of 220-260 ℃ through respective flow passages to be co-extruded with the materials from other extruders;
(2) the polyethylene low-temperature puncture-resistant packaging film is formed by shaping through a film opening air ring, cooling through a water ring, enabling thick and thin points of the film to be uniformly distributed on a scroll through a rotary traction device, drying at the temperature of less than or equal to 100 ℃ through a second traction device, then rectifying in a rectifying device, pulling the film through a third traction device, and finally rolling through a rolling device through a film guide device, so that the polyethylene low-temperature puncture-resistant packaging film is obtained.
Compared with the prior art, the invention has the following beneficial effects:
(1) according to the polyethylene low-temperature puncture-resistant packaging film disclosed by the invention, on the basis of ensuring the mechanical property of the packaging film, after low-temperature sealing, the bonding force between the heat-sealing layers is proper, and the layers are mutually matched to ensure that the packaging film is puncture-resistant, so that the packaging safety is improved, and the introduction of external pollutants is effectively avoided.
(2) The preparation method of the polyethylene low-temperature puncture-resistant packaging film has the advantages of wide raw material source, simple preparation process and low energy consumption, and is suitable for large-scale production.
Detailed Description
The present invention is further described below with reference to examples.
Example 1
The polyethylene low-temperature puncture-resistant packaging film described in this embodiment 1 sequentially comprises a layer a, a layer B, a layer C, a layer D, a layer E, a layer F and a layer G from outside to inside from the cross section of the packaging film, wherein the layer a and the layer C have the same components and are both nylon, the layer B and the layer D have the same components and are both adhesive resin, the layer E is low-density polyethylene, the layer F is metallocene polyethylene, and the density of the metallocene polyethylene is 0.90G/cm3The melt index is 2.0G/10min, and the G layer is a heat sealing layer.
Wherein:
the thickness of the polyethylene low-temperature puncture-resistant packaging film is 150um, and the thickness of the A layer, the B layer, the C layer, the D layer, the E layer, the F layer and the G layer accounts for 14 percent: 14%: 14%: 14%: 15%: 15%: 14 percent; namely, the A layer is 21um, the B layer is 21um, the C layer is 21um, the D layer is 21um, the E layer is 22.5um, the F layer is 22.5um, and the G layer is 21 um.
The nylon of the layer A and the layer C is PA-6, and the density is 1.15g/cm3。
The adhesive resin of the layer B and the layer D is maleic anhydride grafted polyethylene resin, and the density of the maleic anhydride grafted polyethylene resin is 0.90g/cm3The melt index was 2.8g/10 min.
The density of the low-density polyethylene of the E layer is 0.91g/cm3The melt index was 1.7g/10 min.
The G layer is a heat sealing layer and is a blending modified resin of metallocene polyethylene and linear low density polyethylene, and the melting index of the blending modified resin isThe number was 2.2g/10min and the density was 0.93g/cm3(ii) a The weight of the metallocene polyethylene in the heat sealing layer accounts for 50% of the weight of the blending modified resin, and the weight of the linear low-density polyethylene accounts for 50% of the weight of the blending modified resin.
The preparation method of the polyethylene low-temperature puncture-resistant packaging film described in this example 1 comprises the following steps:
(1) adding the raw materials of the layer A into a stirrer according to a proportion, uniformly stirring, and carrying out blending extrusion at a melting temperature of 220 +/-10 ℃ to form a layer A molten material; adding the raw materials of the layer B into a stirrer in proportion, uniformly stirring, and performing blending extrusion at the melting temperature of 220 +/-10 ℃ to form a layer B molten material; adding the raw materials of the layer C into a stirrer according to a proportion, uniformly stirring, and performing blending extrusion at a melting temperature of 220 +/-10 ℃ to form a layer C molten material; adding the raw materials of the layer D into a stirrer in proportion, uniformly stirring, and performing blending extrusion at the melting temperature of 220 +/-10 ℃ to form a molten material of the layer D; adding the raw materials of the E layer into a stirrer according to a proportion, uniformly stirring, and carrying out blending extrusion at a melting temperature of 210 +/-10 ℃ to form a molten material of the E layer; adding the raw materials of the F layer into a stirrer according to a certain proportion, uniformly stirring, and carrying out blending extrusion at a melting temperature of 220 +/-10 ℃ to form a molten material of the F layer; adding raw materials of the G layer into a stirrer in proportion, uniformly stirring, and performing blending extrusion at a melting temperature of 220 +/-10 ℃ to form a molten material of the G layer; the molten materials of each layer enter a co-extrusion die with the temperature of 240 +/-10 ℃ through respective flow passages to be co-extruded with the materials from other extruders.
(2) The method comprises the steps of shaping through a film opening air ring, cooling through a water ring, enabling the cooled water ring to enter a first traction device to be subjected to stretching and exhausting treatment, enabling thick and thin points of a film to be uniformly distributed on a scroll through a rotary traction device, enabling the film to enter a second traction device to be dried at the temperature of 95 +/-5 ℃, then rectifying in a rectifying device, enabling the film to enter a third traction device to be subjected to film drawing, and finally rolling through a rolling device through a film guide device to obtain the polyethylene low-temperature puncture-resistant packaging film.
Example 2
The polyethylene low temperature puncture resistant packaging film described in example 2 was formed from the outside to the inside of the cross section of the packaging filmThe first layer is an A layer, a B layer, a C layer, a D layer, an E layer, an F layer and a G layer, wherein the A layer and the C layer are the same in component and are both nylon, the B layer and the D layer are the same in component and are both adhesive resin, the E layer is low-density polyethylene, the F layer is metallocene polyethylene, and the density of the metallocene polyethylene is 0.915G/cm3The melt index is 3.0G/10min, and the G layer is a heat sealing layer.
Wherein:
the thickness of the polyethylene low-temperature puncture-resistant packaging film is 180um, and the thickness of the A layer, the B layer, the C layer, the D layer, the E layer, the F layer and the G layer accounts for 15 percent: 14%: 15%: 14%: 14%: 14%: 14%, A layer is 27um promptly, and the B layer is 25.2um, and the C layer is 27um, and the D layer is 25.2um, and the E layer is 25.2um, and the F layer is 25.2um, and the G layer is 25.2 um.
The density of the nylon of the layer A and the layer C is 1.13g/cm3。
The nylon used for the layer A and the layer C is PA-610.
The adhesive resin of the layer B and the layer D is maleic anhydride grafted polyethylene resin, and the density of the maleic anhydride grafted polyethylene resin is 0.91g/cm3The melt index was 3.0g/10 min.
The density of the low-density polyethylene of the E layer is 0.93g/cm3The melt index was 2.5g/10 min.
The G layer is a heat sealing layer and is a blending modified resin of metallocene polyethylene and linear low-density polyethylene, the melt index of the blending modified resin is 2.0G/10min, and the density is 0.90G/cm3。
The weight of the metallocene polyethylene in the heat sealing layer accounts for 70% of the weight of the blending modified resin, and the weight of the linear low-density polyethylene accounts for 30% of the weight of the blending modified resin.
The preparation method of the polyethylene low-temperature puncture-resistant packaging film described in this embodiment 2 comprises the following steps:
(1) adding the raw materials of the layer A into a stirrer according to a proportion, uniformly stirring, and carrying out blending extrusion at a melting temperature of 250 +/-10 ℃ to form a layer A molten material; adding the raw materials of the layer B into a stirrer in proportion, uniformly stirring, and performing blending extrusion at the melting temperature of 240 +/-10 ℃ to form a layer B molten material; adding the raw materials of the layer C into a stirrer according to a proportion, uniformly stirring, and performing blending extrusion at a melting temperature of 250 +/-10 ℃ to form a layer C molten material; adding the raw materials of the layer D into a stirrer in proportion, uniformly stirring, and performing blending extrusion at the melting temperature of 240 +/-10 ℃ to form a molten material of the layer D; adding the raw materials of the E layer into a stirrer according to a proportion, uniformly stirring, and carrying out blending extrusion at a melting temperature of 240 +/-10 ℃ to form a molten material of the E layer; adding the raw materials of the F layer into a stirrer according to a certain proportion, uniformly stirring, and carrying out blending extrusion at a melting temperature of 230 +/-10 ℃ to form a molten material of the F layer; adding raw materials of the G layer into a stirrer in proportion, uniformly stirring, and performing blending extrusion at the melting temperature of 230 +/-10 ℃ to form a molten material of the G layer; the molten materials of each layer enter a co-extrusion die with the temperature of 230 +/-10 ℃ through respective flow channels to be co-extruded with the materials from other extruders;
(2) the method comprises the steps of shaping through a film opening air ring, cooling through a water ring, enabling the cooled water ring to enter a first traction device to be subjected to stretching and exhausting treatment, enabling thick and thin points of a film to be uniformly distributed on a scroll through a rotary traction device, enabling the film to enter a second traction device to be dried at the temperature of 95 +/-5 ℃, then rectifying in a rectifying device, enabling the film to enter a third traction device to be subjected to film drawing, and finally rolling through a rolling device through a film guide device to obtain the polyethylene low-temperature puncture-resistant packaging film.
Example 3
The polyethylene low-temperature puncture-resistant packaging film described in this embodiment 3 sequentially comprises a layer a, a layer B, a layer C, a layer D, a layer E, a layer F and a layer G from outside to inside from the cross section of the packaging film, wherein the layer a and the layer C have the same components and are both nylon, the layer B and the layer D have the same components and are both adhesive resin, the layer E is low-density polyethylene, the layer F is metallocene polyethylene, and the density of the metallocene polyethylene is 0.865G/cm3The melt index is 1.0G/10min, and the G layer is a heat sealing layer.
Wherein:
the thickness of polyethylene low temperature resistant puncture packaging film be 200um, the thickness of A layer, B layer, C layer, D layer, E layer, F layer, G layer account for than being 15%: 15%: 15%: 15%: 13%: 13%: 14%, A layer is 30um, and the B layer is 30um, and the C layer is 30um, and the D layer is 30um, and the E layer is 26um, and the F layer is 26um, and the G layer is 28 um.
The density of the nylon of the layer A and the layer C is 1.17g/cm3。
The nylon of the layer A and the layer C is PA-6.
The adhesive resin of the layer B and the layer D is maleic anhydride grafted polyethylene resin, and the density of the maleic anhydride grafted polyethylene resin is 0.905g/cm3The melt index was 2.9g/10 min.
The density of the low-density polyethylene of the E layer is 0.92g/cm3The melt index was 2.0g/10 min.
The G layer is a heat sealing layer and is a blending modified resin of metallocene polyethylene and linear low-density polyethylene, the melt index of the blending modified resin is 1.8G/10min, and the density is 0.81G/cm3(ii) a The weight of the metallocene polyethylene in the heat sealing layer accounts for 30% of the weight of the blending modified resin, and the weight of the linear low-density polyethylene accounts for 70% of the weight of the blending modified resin.
The preparation method of the polyethylene low-temperature puncture-resistant packaging film described in this embodiment 3 comprises the following steps:
(1) adding the raw materials of the layer A into a stirrer according to a proportion, uniformly stirring, and carrying out blending extrusion at a melting temperature of 250 +/-10 ℃ to form a layer A molten material; adding the raw materials of the layer B into a stirrer in proportion, uniformly stirring, and performing blending extrusion at the melting temperature of 230 +/-10 ℃ to form a layer B molten material; adding the raw materials of the layer C into a stirrer according to a proportion, uniformly stirring, and performing blending extrusion at a melting temperature of 250 +/-10 ℃ to form a layer C molten material; adding the raw materials of the layer D into a stirrer in proportion, uniformly stirring, and performing blending extrusion at the melting temperature of 230 +/-10 ℃ to form a molten material of the layer D; adding the raw materials of the E layer into a stirrer according to a proportion, uniformly stirring, and carrying out blending extrusion at a melting temperature of 220 +/-10 ℃ to form a molten material of the E layer; adding the raw materials of the F layer into a stirrer according to a certain proportion, uniformly stirring, and carrying out blending extrusion at a melting temperature of 230 +/-10 ℃ to form a molten material of the F layer; adding raw materials of the G layer into a stirrer in proportion, uniformly stirring, and performing blending extrusion at the melting temperature of 200 +/-10 ℃ to form a molten material of the G layer; the molten materials of each layer enter a co-extrusion die with the temperature of 250 +/-10 ℃ through respective flow passages to be co-extruded with the materials from other extruders.
(2) The polyethylene low-temperature puncture-resistant packaging film is formed by shaping through a film opening air ring, cooling through a water ring, enabling thick and thin points of the film to be uniformly distributed on a scroll through a rotary traction device, drying at the temperature of 95 +/-5 ℃ through a second traction device, then rectifying in a rectifying device, drawing the film through a third traction device, and finally rolling through a rolling device through a film guide device, so that the polyethylene low-temperature puncture-resistant packaging film is obtained.
Comparative example 1
The packaging film of the comparative example 1 is the same as that of the example 3, and the only difference is that the component of the F layer is different, the F layer is the blend modified resin of LLDPE and LDPE, the LLDPE accounts for 50% of the mass of the blend modified resin, the LDPE accounts for 50% of the mass of the blend modified resin, the melt index of the blend modified resin is 2.0g/10min, and the density of the blend modified resin is 0.923g/cm3。
The packaging films prepared in examples 1 to 3 and comparative example 1 were subjected to a performance test, and the results are shown in table 1:
Figure BDA0002592472310000071

Claims (4)

1. the utility model provides a polyethylene low temperature resistant puncture packaging film which characterized in that: the packaging film comprises a layer A, a layer B, a layer C, a layer D, a layer E, a layer F and a layer G in sequence from outside to inside from the cross section of the packaging film, wherein the layer A and the layer C are the same in component and are both nylon, the layer B and the layer D are the same in component and are both adhesive resin, the layer E is low-density polyethylene, the layer F is metallocene polyethylene, and the density of the metallocene polyethylene is 0.865-0.915G/cm3The melt index is 1.0-3.0G/10 min, and the G layer is a heat sealing layer;
the density of the nylon on the layer A and the layer C is 1.13-1.17 g/cm3(ii) a The nylon of the A layer and the C layer is one of PA-6, PA-610 or PA-1010;
the adhesive resin of the layer B and the layer D is maleic anhydride grafted polyethylene resin, and the maleic anhydride is grafted polyethylene resinThe grafted polyethylene resin has a density of 0.90-0.91g/cm3The melt index is 2.8-3.0g/10 min;
the density of the low-density polyethylene of the E layer is 0.91-0.93 g/cm3The melt index is 1.5-2.5 g/10 min;
the G layer is a heat sealing layer and is a blending modified resin of metallocene polyethylene and linear low-density polyethylene, the melt index of the blending modified resin is 1.8-2.2G/10 min, and the density is 0.81-0.93G/cm3；
The weight of the metallocene polyethylene in the heat sealing layer accounts for 30-70% of the weight of the blending modified resin, and the weight of the linear low-density polyethylene accounts for 30-70% of the weight of the blending modified resin.
2. The polyethylene low temperature puncture resistant packaging film according to claim 1, wherein: the thickness of polyethylene low temperature resistant puncture packaging film be 120 ~ 240um, the thickness of A layer, B layer, C layer, D layer, E layer, F layer, G layer account for than being 8 ~ 16%: 8-16%: 8-16%: 8-16%: 8-15%: 8-15%: 8-16%.
3. The method for preparing the polyethylene low-temperature puncture-resistant packaging film according to claim 1, which is characterized by comprising the following steps: melting and extruding the raw materials of the layer A, the layer B, the layer C, the layer D, the layer E, the layer F and the layer G respectively through an extruder, converging the raw materials at a die head through respective runners, shaping through a film opening air ring, cooling through a water ring, entering a first traction device for stretching and exhausting, enabling the thickness points of the film to be uniformly distributed on a reel through a rotary traction device, entering a second traction device for drying at the temperature of less than or equal to 100 ℃, then rectifying in a rectifying device, entering a third traction device for drawing the film, and finally winding through a winding device through a film guiding device to obtain the polyethylene low-temperature puncture-resistant packaging film.
4. The method for preparing the polyethylene low-temperature puncture-resistant packaging film according to claim 3, wherein the method comprises the following steps: the method comprises the following steps:
(1) proportionally adding the raw materials of the layer A into a stirrer to be uniformly stirred, and carrying out blending extrusion at the melting temperature of 200-260 ℃ to form a layer A molten material; proportionally adding the raw materials of the layer B into a stirrer to be uniformly stirred, and performing blending extrusion at the melting temperature of 170-250 ℃ to form a layer B molten material; proportionally adding the raw materials of the layer C into a stirrer to be uniformly stirred, and carrying out blending extrusion at the melting temperature of 200-260 ℃ to form a layer C molten material; proportionally adding the raw materials of the layer D into a stirrer to be uniformly stirred, and performing blending extrusion at the melting temperature of 170-250 ℃ to form a molten material of the layer D; adding the raw materials of the E layer into a stirrer in proportion, uniformly stirring, and performing blending extrusion at the melting temperature of 180-240 ℃ to form a molten material of the E layer; adding the raw materials of the F layer into a stirrer in proportion, uniformly stirring, and performing blending extrusion at the melting temperature of 180-240 ℃ to form a molten material of the F layer; proportionally adding the raw materials of the G layer into a stirrer to be uniformly stirred, and performing blending extrusion at the melting temperature of 180-240 ℃ to form a molten material of the G layer; the molten materials of each layer enter a co-extrusion die head with the temperature of 220-260 ℃ through respective flow passages to be co-extruded with the materials from other extruders;
(2) the polyethylene low-temperature puncture-resistant packaging film is formed by shaping through a film opening air ring, cooling through a water ring, enabling thick and thin points of the film to be uniformly distributed on a scroll through a rotary traction device, drying at the temperature of less than or equal to 100 ℃ through a second traction device, then rectifying in a rectifying device, pulling the film through a third traction device, and finally rolling through a rolling device through a film guide device, so that the polyethylene low-temperature puncture-resistant packaging film is obtained.
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