CN111805036A - Device heat dissipation device - Google Patents
Device heat dissipation device Download PDFInfo
- Publication number
- CN111805036A CN111805036A CN202010713184.1A CN202010713184A CN111805036A CN 111805036 A CN111805036 A CN 111805036A CN 202010713184 A CN202010713184 A CN 202010713184A CN 111805036 A CN111805036 A CN 111805036A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- water injection
- groove
- heat sink
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/002—Soldering by means of induction heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
Abstract
The invention relates to the technical field of device heat dissipation, in particular to a device heat dissipation device. The heat dissipation device comprises a heat dissipation main body, wherein a positioning structure and a water injection groove are arranged on the heat dissipation main body, and the positioning structure is used for placing devices; the water injection groove and the end face of the device form a water injection channel, and heat dissipation liquid is injected to take away the heat of the device. According to the invention, the heat dissipation main body is arranged, the positioning structure for placing the device and the water injection groove are arranged on the heat dissipation main body, the water injection groove and the end surface of the device form a water injection channel, heat dissipation liquid is injected through the water injection groove, the heat dissipation liquid diffuses and flows to the water injection channel through the capillary effect, so that a liquid film is formed between the positioning structure and the device, the liquid film is converted from a liquid phase to a gas phase after the device is welded by high-frequency induction heating, a large amount of heat is rapidly absorbed, meanwhile, the heat dissipation main body dissipates the rest heat, the heat dissipation effect is good, and therefore, the problem of overhigh temperature or overheating damage in a non-welding area of the.
Description
Technical Field
The invention relates to the technical field of device heat dissipation, in particular to a device heat dissipation device.
Background
In the welding process, the device can be heated by various heating modes for welding. High-frequency induction heating is an ideal heating mode in the process of welding low-temperature glass solder or tin solder at present, is particularly suitable for small devices requiring non-contact, but a large amount of heat rapidly generated by the high-frequency induction heating is easy to damage other non-welding areas of the devices.
The existing heat dissipation mode when welding devices is as follows: the method is characterized in that a large heat dissipation copper plate or a condensation plate is additionally arranged around the device to dissipate redundant heat, but the methods cannot dissipate a large amount of heat generated in a short time in a very short time, and particularly for small devices or devices with heat sensitive parts near a welding area, the heat dissipation effect is poor, and the devices are easily damaged.
Disclosure of Invention
The invention provides a device heat dissipation device, aiming at the defects in the prior art, and solving the problems that the device is poor in heat dissipation effect and easy to damage when high-frequency induction heating is adopted.
The technical scheme adopted by the invention for solving the technical problems is as follows: provides a device heat dissipation device, which comprises a heat dissipation main body, wherein the heat dissipation main body is provided with a positioning structure and a water injection groove,
the positioning structure is used for placing a device;
and the water injection groove and the end surface of the device form a water injection channel, and heat dissipation liquid is injected to take away the heat of the device.
Further preferred embodiments of the present invention are: the heat dissipation main part is provided with a plurality of inclined planes arranged along the path of the water injection groove, and the inclined planes surround to form a liquid storage part.
Further preferred embodiments of the present invention are: the heat dissipation main body is further provided with a groove communicated with the water injection groove, and the groove is formed in one of the inclined planes.
Further preferred embodiments of the present invention are: the positioning structure comprises a positioning groove arranged on the heat dissipation main body and used for placing a device.
Further preferred embodiments of the present invention are: the water injection groove includes the first groove section that sets up along the horizontal direction of constant head tank and second groove section and the third groove section that sets up along the depth direction of constant head tank, second groove section, first groove section and third groove section communicate in proper order.
Further preferred embodiments of the present invention are: the cross section of the second groove section and/or the third groove section is in a circular arc structure.
Further preferred embodiments of the present invention are: the heat dissipation main body is further provided with end faces extending from the inclined faces to the water injection groove.
Further preferred embodiments of the present invention are: and a limiting part used for limiting the device is arranged in the positioning groove.
Further preferred embodiments of the present invention are: the heat dissipation main part is made of brass.
The invention has the advantages that compared with the prior art, the heat dissipation device has the advantages that the heat dissipation main body is arranged, the positioning structure for placing the device and the water injection groove are arranged on the heat dissipation main body, the water injection groove and the end surface of the device form a water injection channel, the heat dissipation liquid is injected through the water injection groove, the heat dissipation liquid flows to the water injection channel through the capillary effect in a diffusion mode, a liquid film is formed between the positioning structure and the device, the liquid film is converted from a liquid phase to a gas phase after the device is welded by high-frequency induction heating, a large amount of heat is absorbed quickly, meanwhile, the heat dissipation main body dissipates the rest heat, the heat dissipation effect is good, the problem that the temperature is too high or the device is damaged due.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a schematic perspective view of a heat sink of the present invention;
FIG. 2 is a schematic plan view of the heat sink of the present invention;
FIG. 3 is a schematic perspective view of the device heat sink (in the device-mounted state) of the present invention;
fig. 4 is a schematic sectional structure view of the device heat sink of the present invention (in a state where the device is placed).
Detailed Description
The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
As shown in fig. 1 and 2, the present invention provides a preferred embodiment of a device heat sink.
With reference to fig. 1 to 4, the device heat dissipation apparatus includes a heat dissipation main body 10, and a positioning structure and a water injection groove 11 are disposed on the heat dissipation main body 10, where the positioning structure is used for placing a device a; the water injection groove 11 and the end face of the device form a water injection channel, and heat dissipation liquid is injected to take away the heat of the device. By arranging the heat dissipation main body 10, arranging the positioning structure for placing the device A and the water injection groove 11 on the heat dissipation main body 10, injecting heat dissipation liquid through the water injection groove 11, wherein the heat dissipation liquid flows to the water injection channel through capillary effect diffusion, so that a liquid film B is formed between the positioning structure and the device A, when high-frequency induction starts to heat the device welding area A1, the rapidly generated heat is conducted from the welding area A1 to a non-welding area through a device A shell, the liquid film B of the non-welding area is heated and directly converted from a liquid phase to a gas phase, and a large amount of heat is rapidly absorbed from the device A; meanwhile, the rest heat is dissipated through the heat dissipation main body 10, the heat dissipation effect is good, the problem that the non-welding area is too high in temperature or damaged due to overheating is solved, and the effect of protecting the device A is achieved.
In this embodiment, the heat dissipation body 10 may be made of brass, which has a low cost and a good heat dissipation effect. In other embodiments, materials such as bronze, red copper, aluminum, and alloys thereof, which can dissipate heat from the device a, may also be used. In addition, the heat dissipation liquid can be liquid water, a thin water film is formed between the device A and the positioning structure by the liquid water, when the device A is heated and welded, a large amount of heat is absorbed by the liquid water film when the liquid water film is converted from a liquid phase to a gas phase, and redundant heat generated during welding is rapidly taken away from the device A, so that the function failure caused by overheating of the inside or key parts of the device A is prevented.
Further, referring to fig. 1 and 2, a reservoir 12 for storing a heat dissipating liquid is further disposed on the heat dissipating body 10, and the reservoir 12 is communicated with the water injection tank 11. The liquid storage part 12 can inject and store heat dissipation liquid, the heat dissipation liquid is continuously injected into the water injection tank 11 through the capillary effect, and then is diffused between the positioning structure and the device A through the capillary effect to dissipate heat of the device A. Specifically, the heat dissipation body 10 is provided with a plurality of inclined surfaces 121 arranged along the path of the water injection tank 11, and the plurality of inclined surfaces 121 surround to form the liquid storage part 12. The heat dissipation liquid is stored by injecting the heat dissipation liquid into the space formed by enclosing the inclined surfaces 121, and the structure is simple.
Wherein, the heat dissipation body 10 may be provided with a slot 13 communicating with the water injection tank 11, and the slot 13 may be provided on one of the inclined planes 121. The heat dissipating liquid can be injected into the water injection tank 11 through the open slot 13, and the heat dissipating liquid can be stored in a storage part surrounded by the plurality of inclined surfaces 121. The open slots 13 accelerate the injection of the heat dissipating liquid into the water injection slots 11 and facilitate the injection of the heat dissipating liquid.
Further, referring to fig. 1, the heat dissipation body 10 is further provided with an end surface 14 extending from each inclined surface 121 to the water injection groove 11, and the end surface 14 increases a contact area between the heat dissipation body 10 and the device a. The heat-dissipating liquid forms a liquid film B between the end face 14 and the device a, and dissipates heat from the device a when the device a is subjected to high-frequency induction heating.
Referring to fig. 1, in the present embodiment, the positioning structure includes a positioning groove 15 disposed on the heat dissipating body 10 for placing a device. The device is placed in the positioning groove 15, the device is attached to the heat dissipation main body 10, and the end face of the device and the water injection groove 11 form a water injection channel. Of course, in other embodiments, the positioning structure may also be a fastener disposed on the heat dissipating main body 10, the device is positioned on the heat dissipating main body 10 to be attached to the heat dissipating main body 10, and the end surface of the device and the water injection groove 11 form a water injection channel. Further, a limiting portion 151 for limiting the component a is disposed in the positioning groove 15. Specifically, two protrusions for limiting the component a are disposed in the positioning groove 15, and the two protrusions form a limiting portion 151.
Further, the water injection groove 11 in this embodiment includes a first groove section 111 disposed along the horizontal direction of the positioning groove 15, and a second groove section 112 and a third groove section 113 disposed along the depth direction of the positioning groove 15, where the second groove section 112, the first groove section 111, and the third groove section 113 are sequentially communicated. Radiating liquid is injected into the second groove section 112, the first groove section 111 and the third groove section 113 which are sequentially communicated, the horizontal direction and the depth direction of the device A are enclosed, a liquid film B can be fully formed between each end face 14 and the positioning groove 15 of the device A, the device A is fully radiated, and the damage of the device A due to high-frequency induction heating is avoided.
Further, one or both of the second groove section 112 and the third groove section 113 have a circular arc-shaped cross section. The circular arc structure can better diffuse the heat dissipation liquid through the capillary effect.
In this embodiment, an avoidance groove 16 for avoiding the pin of the device a may be further provided in the heat dissipation main body 10. The operator places the device a in the positioning slot 15 with the pins of the device a in the avoiding slot 16.
In the present invention, liquid water can be used as a heat-dissipating liquid to carry away the heat of the device. When the device heat dissipation device is used, the device A can be placed and positioned in the positioning groove 15 of the heat dissipation main body 10, the heat dissipation main body 10 and the device A are integrally abutted to a plane, liquid water is injected through the groove 13 in the heat dissipation main body 10 and flows into the water injection groove 11, the liquid water is diffused between the positioning groove 15 and the device A through the capillary effect to form a water film, the liquid water can be accumulated in the liquid storage part 12 formed by the inclined planes 121, after the water film is changed from a liquid phase to a gas phase, the liquid water flows to the water injection groove 11 from the liquid storage part 12 through the end surface 14 and the groove 13, and is diffused between the positioning groove 15 and the device A again through the capillary effect by the water injection groove 11, and heat dissipation of the device is continuously performed.
It should be understood that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same, and those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some technical features; and all such modifications and alterations are intended to fall within the scope of the appended claims.
Claims (10)
1. A device heat dissipation device is characterized by comprising a heat dissipation main body, wherein a positioning structure and a water injection groove are arranged on the heat dissipation main body,
the positioning structure is used for placing a device;
and the water injection groove and the end surface of the device form a water injection channel, and heat dissipation liquid is injected to take away the heat of the device.
2. The device heat sink as claimed in claim 1, wherein the heat sink body further comprises a reservoir for storing a heat dissipating liquid, and the reservoir is communicated with the water injection tank.
3. The device heat sink as claimed in claim 2, wherein the heat sink body is provided with a plurality of slopes along a path of the water injection groove, and the plurality of slopes surround to form a liquid storage portion.
4. The device heat sink as claimed in claim 3, wherein the heat sink body further has a slot communicating with the water injection slot, and the slot is disposed on one of the inclined planes.
5. The device heat sink as claimed in claim 1, wherein the positioning structure comprises a positioning groove disposed on the heat sink body for placing the device.
6. The device heat sink as claimed in claim 5, wherein the water injection groove comprises a first groove section provided along a horizontal direction of the positioning groove and a second groove section and a third groove section provided along a depth direction of the positioning groove, the second groove section, the first groove section and the third groove section being sequentially communicated.
7. The device heat sink as claimed in claim 6, wherein the cross section of the second and/or third slot segments is in a circular arc shape.
8. The device heat sink as claimed in claim 3, wherein the heat sink body further has an end surface extending from each of the inclined surfaces to the water injection groove.
9. The device heat sink according to claim 5, wherein a position-limiting portion is disposed in the positioning groove for limiting the device.
10. The device heat sink as claimed in any one of claims 1 to 9, wherein the heat sink body is made of brass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010713184.1A CN111805036A (en) | 2020-07-22 | 2020-07-22 | Device heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010713184.1A CN111805036A (en) | 2020-07-22 | 2020-07-22 | Device heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111805036A true CN111805036A (en) | 2020-10-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010713184.1A Pending CN111805036A (en) | 2020-07-22 | 2020-07-22 | Device heat dissipation device |
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| CN (1) | CN111805036A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114496483A (en) * | 2022-02-18 | 2022-05-13 | 上海华湘计算机通讯工程有限公司 | High-power impedance converter |
-
2020
- 2020-07-22 CN CN202010713184.1A patent/CN111805036A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114496483A (en) * | 2022-02-18 | 2022-05-13 | 上海华湘计算机通讯工程有限公司 | High-power impedance converter |
| CN114496483B (en) * | 2022-02-18 | 2023-07-14 | 上海华湘计算机通讯工程有限公司 | High-power impedance converter |
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Address after: No.35 Cuijing Road, Pingshan District, Shenzhen City, Guangdong Province Applicant after: Ona Technology (Shenzhen) Group Co.,Ltd. Address before: No.35 Cuijing Road, Pingshan District, Shenzhen City, Guangdong Province Applicant before: O-NET COMMUNICATIONS (SHENZHEN) Ltd. |
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