CN111800718A

CN111800718A - Vehicle microphone and manufacturing process thereof

Info

Publication number: CN111800718A
Application number: CN202010616028.3A
Authority: CN
Inventors: 鹿焕伟; 张加超
Original assignee: Rongcheng Gol Electronic Technology Co ltd
Current assignee: Rongcheng Gol Electronic Technology Co ltd
Priority date: 2020-06-30
Filing date: 2020-06-30
Publication date: 2020-10-20

Abstract

The invention provides a vehicle microphone and a manufacturing process thereof, and the vehicle microphone comprises the following steps: determining the installation position of an ASIC chip on a circuit board; coating adhesive glue in the mounting position, wherein the coating area is 60-80% of the area of the mounting position; coating sealant at the edge of the installation position; installing an ASIC chip on the adhesive and the sealing glue; mounting the MEMS chip on a circuit board; and welding a conductive wire between the MEMS chip and the ASIC chip to electrically connect the MEMS chip and the ASIC chip. According to the technical scheme, the bonding glue is sealed between the ASIC chip and the circuit board through the sealant, so that the bonding capacity reduction caused by the fact that the bonding glue is in an extreme environment is avoided, and the stability of a product is improved.

Description

Vehicle microphone and manufacturing process thereof

Technical Field

The invention relates to the field of microphone manufacturing, in particular to a manufacturing process of a vehicle microphone and the vehicle microphone.

Background

When a Micro Electro Mechanical System (MEMS) chip is fabricated, an Application Specific Integrated Circuit (ASIC) chip is generally bonded to a Circuit board by glue, so as to prevent the ASIC chip from shaking when WB (Mechanical bonding, such as thermal compression bonding, ultrasonic bonding, thermosonic bonding, or the like) bonding is performed. The glue is more in material selection type, most of the glue can be used as the adhesive of the ASIC chip and the circuit board, however, the automobile microphone is often in an extreme environment in the using process of an automobile, the epoxy glue has the water absorption characteristic, for example, after the glue absorbs moisture and water under the conditions of high temperature and high humidity, the adhesive capacity of the adhesive glue can be influenced, so that the risk coefficient of falling risk of the ASIC chip from the circuit board is greatly increased, and the stability of the product is reduced.

Disclosure of Invention

The invention mainly aims to provide a vehicle microphone and a manufacturing process thereof, and aims to solve the technical problem that the vehicle microphone in the prior art is low in stability in an extreme environment.

In order to achieve the above object, the present invention provides a manufacturing process of a vehicle microphone, comprising the following steps:

determining the installation position of an ASIC chip on a circuit board;

coating adhesive glue in the installation position, wherein the coated area is 60-80% of the area of the installation position;

coating sealant at the edge of the installation position;

mounting the ASIC chip on the adhesive glue and the sealing glue;

mounting a MEMS chip on the circuit board;

soldering conductive wires between the MEMS chip and the ASIC chip to electrically connect the MEMS chip and the ASIC chip.

Optionally, the mounting location includes an inner region and an edge region disposed around the inner region, and the step of applying adhesive glue in the mounting location includes:

and controlling the glue spraying head to move in the inner area, and uniformly coating the bonding glue through the glue spraying head.

Optionally, the step of controlling the glue spraying head to move in the inner area and uniformly spreading the bonding glue comprises:

optionally, after the glue spraying head is controlled to evenly spread the bonding glue along the length direction of the inner area in a reciprocating manner, the ASIC chip is controlled to press the bonding glue, and the thickness of the bonding glue is controlled to be 20-25 micrometers.

Optionally, the step of mounting the ASIC chip on the adhesive glue and the sealant includes:

grabbing the ASIC chip by a mechanical claw and installing the ASIC chip on the adhesive glue and the sealing glue;

the step of mounting the MEMS chip on the circuit board includes:

and grabbing the MEMS chip by a mechanical claw and mounting the MEMS chip on the circuit board.

Optionally, after the step of mounting the ASIC chip on the adhesive glue and the sealant, the method further includes:

curing and bonding the bonding glue and the sealant with the ASIC chip through a high-temperature air box;

and cleaning the circuit board.

Optionally, the step of cleaning the circuit board includes:

and cleaning the circuit board through a plasma cleaning box.

Optionally, the step of soldering conductive wires between the MEMS chip and the ASIC chip to electrically connect the MEMS chip and the ASIC chip comprises:

and providing a conducting wire, welding one end of the conducting wire onto the ASIC chip by ultrasonic welding, and welding the other end of the conducting wire onto the MEMS chip so as to electrically connect the ASIC chip and the MEMS chip.

Optionally, after the step of soldering the conductive wires between the MEMS chip and the ASIC chip to electrically connect the MEMS chip and the ASIC chip, further comprising:

and coating protective glue on the upper surface of the ASIC chip.

Optionally, the step of determining the mounting position of the ASIC chip on the circuit board includes:

acquiring image information of the circuit board through a positioning camera;

establishing a coordinate system by taking the edge of the circuit board as a coordinate axis according to the image information;

acquiring preset coordinate information of the ASIC chip on the circuit board;

and determining the installation position according to the coordinate system and the preset coordinate information.

smearing solder paste on the edge of the circuit board, and mounting the edge of the shell on the solder paste;

and welding the shell to enable the shell to package the ASIC chip and the MEMS chip.

In addition, in order to solve the above problems, the present invention further provides a vehicle microphone, where the vehicle microphone includes a circuit board, an ASIC chip, and an MEMS chip, the ASIC chip and the MEMS chip are disposed on the circuit board, and the MEMS chip is electrically connected to the ASIC chip, where a bonding adhesive is disposed between the ASIC chip and the circuit board, an area of the bonding adhesive is 60% to 80% of an area of the ASIC chip, and a sealant is disposed along an edge of the bonding adhesive to seal the bonding adhesive between the circuit board and the ASIC chip.

According to the technical scheme, the ASIC chip is bonded on the circuit board through the bonding glue, and a circle of sealing glue is arranged on the edge of the ASIC chip to seal the bonding glue between the ASIC chip and the circuit board, so that the bonding glue is prevented from being exposed in the air, the bonding capacity of the bonding glue is prevented from being reduced under extreme environments, such as high temperature and high humidity, due to moisture absorption and water absorption, the risk factor of falling of the ASIC chip from the circuit board is reduced, and the stability of a product is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic flow chart of a first embodiment of a manufacturing process of a microphone for a vehicle according to the present invention;

FIG. 2 is a schematic flow chart illustrating a second embodiment of a process for manufacturing a microphone for a vehicle according to the present invention;

FIG. 3 is a schematic flow chart illustrating a third embodiment of a process for manufacturing a microphone for a vehicle according to the present invention;

FIG. 4 is a schematic flow chart illustrating a fourth embodiment of a process for manufacturing a microphone for a vehicle according to the present invention;

FIG. 5 is a schematic flow chart illustrating a fifth embodiment of a process for manufacturing a microphone for a vehicle according to the present invention;

FIG. 6 is a schematic flow chart illustrating a sixth embodiment of a process for manufacturing a microphone for a vehicle according to the present invention;

FIG. 7 is a schematic flow chart illustrating a seventh exemplary embodiment of a process for manufacturing a microphone for a vehicle according to the present invention;

fig. 8 is a schematic flow chart illustrating a manufacturing process of a microphone for a vehicle according to an eighth embodiment of the present invention;

FIG. 9 is a schematic flow chart illustrating a ninth embodiment of a process for manufacturing a microphone for a vehicle according to the present invention;

fig. 10 is a schematic flow chart illustrating a tenth embodiment of a process for manufacturing a microphone for a vehicle according to the present invention;

FIG. 11 is a schematic cross-sectional view of a microphone for a vehicle according to the present invention;

fig. 12 is a schematic view of the position structure of the bonding glue, the sealant and the ASIC chip on the circuit board in the vehicle microphone of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				10	ASIC chip	20	Circuit board
30	Adhesive glue	40	Sealing glue
				50	MEMS chip	60	Sound inlet hole
70	Shell body

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

The invention provides a manufacturing process of a vehicle microphone, please refer to fig. 1, fig. 11 and fig. 12, fig. 1 is a schematic flow chart of a first embodiment of the manufacturing process of the vehicle microphone, and the manufacturing process of the vehicle microphone comprises the following steps:

step S10: determining a mounting position of the ASIC chip 10 on the circuit board 20;

step S20: coating adhesive glue 30 in the installation position, wherein the coating area is 60-80% of the area of the installation position;

step S30: applying a sealant 40 at the edges of the mounting locations;

step S40: mounting the ASIC chip 10 on the adhesive 30 and the sealant 40;

step S50: mounting a MEMS chip 50 on the circuit board 20;

step S60: electrically conductive wires are soldered between the MEMS chip 50 and the ASIC chip 10 to electrically connect the MEMS chip 50 and the ASIC chip 10.

In the manufacturing process of the microphone for the vehicle, the ASIC chip 10, the MEMS chip 50, and other functional components are generally required to be soldered, but since the packaging space thereof is gradually reduced, the soldering space is small, and therefore, mechanical soldering (thermal compression soldering, ultrasonic soldering, thermosonic soldering, etc.) is required to be adopted, and the ASIC chip 10 and the MEMS chip 50 can be reinforced by being bonded by the adhesive 30 due to severe vibration during mechanical soldering, and the adhesive 30 can be an epoxy adhesive, and by utilizing the advantages of high hardness, large thrust, no volatile matter generation, etc. after being cured, the ASIC chip 10 or the MEMS chip 50, etc. are ensured not to shake during the mechanical soldering process, so that the soldering precision is improved, and the product quality is improved.

In addition, because the vehicle microphone is installed in the vehicle, and the viscosity of the bonding glue 30 is reduced under extreme environments, such as under high temperature and high humidity conditions, during the use process of the vehicle, the sealant 40 is designed to seal the bonding glue 30, and the sealant 40 can be a silica gel product, so that the phenomenon that the bonding ability is reduced after the bonding glue 30 is exposed to moisture absorption and water absorption under high temperature and high humidity conditions is avoided by utilizing the excellent high temperature resistance, low temperature resistance and hydrophobic performance of the silica gel product.

The manufacturing process of the vehicle microphone of the present invention can also be manually manufactured, for example, by printing the adhesive 30 and the sealant 40 on the circuit board 20 with a brush. The intelligent degree of the manufacturing process of the vehicle microphone can be improved and the production efficiency can be improved by automatic equipment, such as a positioning camera, a glue spraying head, an ultrasonic welding machine, a mechanical claw and the like.

After the installation position of the ASIC chip 10 is determined, glue is sprayed at the installation position through a glue spraying head, and it can be understood that a plurality of glue spraying heads can be arranged in the invention, so that the circuit board 20 is coated with the adhesive glue and the sealant 40 at the same time, and the production efficiency is improved. In this embodiment, the glue spraying head moves into the mounting position, the adhesive 30 is smeared in the mounting position, and the area of the adhesive 30 is 60% to 80% of the area of the first mounting position, in this embodiment, the thickness of the adhesive 30 is 20 micrometers to 50 micrometers, so that the adhesive force between the ASIC chip and the circuit board is ensured, and the compatibility is improved. In the process of coating the bonding glue 30, the other glue spraying head can be controlled to move to the edge of the first installation position, and the sealant 40 is coated on the edge of the first installation position to form a circle of the sealant 40 which is wrapped around the periphery of the bonding glue 30. In the above process, the shape of the adhesive 30 may be adjusted according to the size and the dimension of the ASIC chip 10.

Then, the mechanical gripper is controlled to grab the ASIC chip 10 to the mounting position, and press the ASIC chip 10 on the adhesive 30 and the sealant 40, so that the ASIC chip 10 is fastened on the circuit board 20 through the adhesive 30, and the edge of the ASIC chip 10 is connected with the sealant 40, so that the adhesive 30 is sealed between the ASIC chip 10 and the circuit board 20.

After the ASIC chip 10 is bonded to the circuit board 20, another gripper is controlled to grip the MEMS chip 50 onto the circuit board 20 for mounting, or another gripper is controlled to grip the MEMS chip 50 onto the circuit board 20 for mounting during the process of mounting the ASIC chip 10, thereby further improving the production efficiency. After the ASIC chip 10 and the MEMS chip 50 are mounted on the circuit board 20, a conductive wire is soldered between the MEMS chip 50 and the ASIC chip 10, so as to electrically connect the MEMS chip 50 and the ASIC chip 10, or a circuit is fabricated on the circuit board 20, and the ASIC chip 10 and the MEMS chip 50 are soldered on the circuit board, so as to electrically connect the circuit on the circuit board 20.

In this embodiment, similarly, when the MEMS chip 50 is mounted, the adhesive 30 and the sealant 40 may also be disposed between the MEMS chip 50 and the circuit board 20, so as to prevent the MEMS chip 50 from loosening during the welding process, thereby reducing the risk factor of the MEMS chip 50 falling off from the circuit board 20, and improving the stability of the product. Determining another mounting position of the MEMS chip 50 on the circuit board 20 by a positioning device, as with the ASIC chip 10; after the installation position of the MEMS chip 50 is determined, the glue spraying head is controlled to move to the interior of the installation position of the MEMS chip 50 to be coated with the bonding glue 30, the area of the bonding glue 30 is 60% -80% of the area of the installation position of the MEMS chip 50, the edge of the installation position of the MEMS chip 50 is coated with the sealing glue 40 through another glue spraying head, and a circle of sealing glue 40 rings surrounding the periphery of the bonding glue 30 is formed. It can be understood that in this embodiment, the number of the glue-spraying heads is increased, so that the mounting position of the MEMS chip 50 is processed at the same time when the mounting position of the ASIC chip 10 is processed, and the production efficiency of the microphone manufacturing process of the present invention is further improved.

According to the technical scheme, the ASIC chip 10 is bonded on the circuit board 20 through the bonding glue 30, and a circle of sealing glue 40 is arranged on the edge of the ASIC chip 10, so that the bonding glue 30 is sealed between the ASIC chip 10 and the circuit board 20, the bonding glue 30 is prevented from being exposed in the air, the bonding capability of the bonding glue 30 is prevented from being reduced under extreme environments, such as high temperature and high humidity, for example, the bonding glue 30 cannot be reduced due to moisture absorption and water absorption, the risk coefficient of falling risk of the ASIC chip 10 from the circuit board 20 is reduced, and the stability of a product is improved.

Further, the mounting position includes an inner area and an edge area surrounding the inner area, referring to fig. 2, fig. 2 is a schematic flow chart of a second embodiment of the manufacturing process of the vehicle microphone according to the first embodiment of the present invention, and the step S20 includes:

step S21: and controlling the glue spraying head to move in the inner area, and uniformly coating the bonding glue 30.

The mounting position comprises an inner area and an edge area surrounding the inner area, the glue spraying head is controlled to uniformly paint the bonding glue 30 in a straight line shape in the inner area, so that the bonding glue 30 is separated from the edge area, and the edge of the bonding glue 30 and the sealant 40 are arranged at intervals. Because will ASIC chip 10 is installed bond adhesive 30 with sealed glue 40 is last after, under the effect of gravity, ASIC chip 10 can be right bond adhesive 30 with sealed glue 40 causes the extrusion, makes bond adhesive 30 is to diffusing all around, in order to avoid bond adhesive 30 diffuses to outside sealed glue 40, consequently will seal glue 40 with a distance of interval between the bond adhesive 30, thereby for bond adhesive 30 provides more space, in order to guarantee sealed glue 40 can be stably sealed bond adhesive 30 ASIC chip 10 with between the circuit board 20, improve the product yield.

Further, referring to fig. 3, fig. 3 is a schematic flow chart of a third embodiment of the manufacturing process of the vehicle microphone according to the present invention based on the second embodiment, wherein the step S21 includes:

step S211: optionally, after the glue spraying head is controlled to evenly spread the adhesive 30 along the length direction of the inner area in a reciprocating manner, the ASIC chip is controlled to press the adhesive 30, and the thickness of the adhesive 30 is controlled to be 20-25 micrometers. .

And controlling the glue spraying head to paint the bonding glue 30 in a straight shape along the length direction of the inner area, so that the glue spraying head can finish the painting of the bonding glue 30 by moving back and forth once, and the manufacturing efficiency of the manufacturing process of the vehicle microphone is improved. And the coating of the bonding glue 30 is completed at one time, so that the thickness of the bonding glue 30 is convenient to control, the bonding glue 30 can be extruded after the ASIC chip 10 is installed, the bonding glue 30 is scattered to the periphery, and the thickness of the bonding glue is controlled within the range of 20-50 micrometers in the process of extruding the bonding glue by the ASIC chip, so that the bonding force between the ASIC chip and the circuit board is ensured.

Further, referring to fig. 4, fig. 4 is a schematic flow chart of a fourth embodiment of the vehicle microphone manufacturing process according to the present invention based on the second or third embodiment, where the step S40 includes:

step S41: grabbing the ASIC chip 10 by a gripper and mounting the ASIC chip on the adhesive 30 and the sealant 40;

in this embodiment, the ASIC chip 10 is grabbed to the mounting position by controlling the gripper, and is pressed on the adhesive 30 and the sealant 40, so that the ASIC chip 10 is fastened on the circuit board 20 through the adhesive 30, and the edge of the ASIC chip 10 is connected with the sealant 40, so that the adhesive 30 is sealed between the ASIC chip 10 and the circuit board 20.

Step S50 includes step S51, step S51: the MEMS chip 50 is grasped by a gripper and mounted on the circuit board 20.

After the ASIC chip 10 is bonded to the circuit board 20, another gripper is controlled to grip the MEMS chip 50 onto the circuit board 20 for mounting, or another gripper is controlled to grip the MEMS chip 50 onto the circuit board 20 for mounting during the process of mounting the ASIC chip 10, thereby further improving the production efficiency. It should be noted that, the present invention includes but is not limited to the above solutions, and the manufacturing process of the vehicle microphone may also be performed by a manual process, for example, by manually moving the ASIC chip 10 or the MEMS chip 50.

Further, referring to fig. 5, fig. 5 is a schematic flow chart of a fifth embodiment of the manufacturing process of the microphone for a vehicle according to the first embodiment of the present invention, and after the step S40, the method further includes the following steps:

step S70: curing and bonding the bonding glue 30 and the sealant 40 with the ASIC chip 10 through a high-temperature air box;

step S80: the circuit board 20 is cleaned.

After the ASIC chip 10 is mounted, the bonding glue 30 and the sealant 40 are cured to fasten the ASIC chip 10 to the circuit board 20, in this embodiment, the high temperature bellows accelerates the solidification speed of the bonding glue 30 and the sealant 40, thereby improving the production efficiency. In order to improve the broad applicability of the present invention, the temperature of the high temperature bellows may be set to 150 ℃, and the circuit board 20 may be placed in the high temperature bellows to be baked for 30 minutes, so as to meet the curing requirements of most of the adhesive 30 and the sealant 40. Of course, the parameter setting of the high temperature bellows is not unique, and the appropriate adjustment is performed according to the materials of the ASIC chip 10, the circuit board 20, the adhesive 30, and the sealant 40. After the adhesive 30 and the sealant 40 are solidified, the circuit board 20 can be cleaned to remove impurities adhered to the circuit board 20, so that the impurities are prevented from affecting the welding effect of the ASIC chip 10 or affecting the normal use of the circuit board 20, and the product quality and the product stability are improved. After the circuit board is cleaned, the step of mounting the MEMS chip 50 on the circuit board 20 is performed.

Further, referring to fig. 6, fig. 6 is a schematic flow chart of a sixth embodiment of a manufacturing process of a microphone for a vehicle according to the present invention based on the fifth embodiment, where the step S80 includes:

step S81: the circuit board 20 is cleaned by a plasma cleaning tank.

And putting the dried circuit board 20 into the plasma cleaning box, and flushing the surface of the circuit board 20 by plasma gas so as to remove the pollutants attached to the circuit board 20. In this embodiment, after the contaminants attached to the circuit board 20 are removed by the plasma gas, the welding quality between the ASIC chip 10 and the MEMS chip 50 is ensured, and meanwhile, the circuit board 20 is not damaged by the harmful solvent by cleaning with the plasma gas, so as to further improve the quality and reliability of the product.

Further, referring to fig. 7, fig. 7 is a flowchart illustrating a seventh embodiment of a manufacturing process of a microphone for a vehicle according to the present invention based on the first embodiment, wherein the step S60 includes:

step S61: providing a conductive wire, and ultrasonically welding one end of the conductive wire to the ASIC chip 10 and the other end of the conductive wire to the MEMS chip 50 to electrically connect the ASIC chip 10 and the MEMS chip 50.

Since the operation space of the car microphone is small, the ASIC chip 10 and the MEMS chip 50 are bonded by ultrasonic bonding in this embodiment, and this embodiment provides a conductive wire, which may be a gold wire or the like. By using the energy of ultrasonic mechanical vibration, one end of the conductive wire and the bonding pad of the ASIC chip 10 form a eutectic, and the other end of the conductive wire and the bonding pad of the MEMS chip 50 form a eutectic, so that the conductive wire, the ASIC chip 10 and the MEMS chip 50 are connected by the same metal or different metals. In the embodiment, the conductive wires, the ASIC chip 10 and the MEMS chip 50 are bonded by means of ultrasonic vibration in an environment with a small operation space; and can realize multiple spot welding contact through ultrasonic bonding, and then improve welding efficiency.

Further, referring to fig. 8, fig. 8 is a schematic flow chart of an eighth embodiment of a manufacturing process of a microphone for a vehicle according to the present invention based on the first embodiment, and after the step S60, the manufacturing process further includes the following steps:

step S90: a protective paste is applied to the ASIC chip 10.

After the cleaning, a layer of protective glue is sprayed on the ASIC chip 10, the protective glue can be coated on the ASIC chip 10 by controlling a glue spraying head, or can be manually coated, the protective glue is made of non-conductive resin, and the top of the ASIC chip 10 is provided with a circuit, so that the circuit on the ASIC chip 10 is separated from the outside air by coating the protective glue, thereby preventing impurities such as dust from falling on the ASIC chip 10 to cause short circuit, ensuring the normal operation of the ASIC chip 10, and further improving the quality of the product and the stability of the product.

It should be noted that, a photosensitive component is also used on a part of the ASIC chip 10, and therefore, in this embodiment, the protective glue is made of a black material to block the influence of the light beam on the ASIC chip 10, so as to ensure the normal operation of the ASIC chip 10.

Further, referring to fig. 9, fig. 9 is a schematic flow chart of a ninth embodiment of the manufacturing process of the vehicular microphone according to the first embodiment of the present invention, where the step S10 includes:

step S11: acquiring image information of the circuit board 20 by a positioning camera;

step S12: establishing a coordinate system by taking the edge of the circuit board 20 as a coordinate axis according to the image information;

step S13: acquiring preset coordinate information of the ASIC chip 10 on the circuit board 20;

step S14: and determining the installation position according to the coordinate system and the preset coordinate information.

The image information of the circuit board 20 is collected by a positioning camera, the image information is analyzed to identify the edge position of the circuit board 20, and a coordinate system is established according to the circuit board 20, for example, a point is selected on the circuit board 20 as an origin to establish the coordinate system. In order to improve the calculation efficiency, in this embodiment, for example, a coordinate system is established with the edge of the circuit board 20 as a coordinate axis, preset coordinate information of the installation position of the ASIC chip 10 reserved when the circuit board 20 is used for designing a circuit is obtained, and the installation position of the ASIC chip 10 in the coordinate system, that is, the installation position of the ASIC chip 10 on the circuit board 20, is obtained through calculation by sleeving the preset coordinate information into the coordinate system, so that the glue spraying head is controlled to move to the installation position for gluing.

In this embodiment, the installation position is determined by software calculation to improve the coating precision of the adhesive 30 and the sealant 40, thereby ensuring the production quality of the manufacturing process of the vehicle microphone, and meanwhile, the structure of the production equipment does not need to be changed by the software calculation, thereby saving the equipment cost.

It should be noted that, similarly, the positioning camera is used to collect image information of the circuit board 20, a coordinate system is established according to the circuit board 20, another preset coordinate information of the mounting position of the MEMS chip 50 reserved when the circuit board 20 is used for designing a circuit is obtained and sleeved in the coordinate system, and the mounting position of the MEMS chip 50 is obtained through calculation, so that the glue spraying head is controlled to perform gluing.

Further, referring to fig. 10, fig. 10 is a schematic flow chart of a tenth embodiment of the manufacturing process of the microphone for a vehicle according to the first embodiment of the present invention, and after the step S60, the method further includes the following steps:

step S100: coating solder paste on the edge of the circuit board 20, and mounting the edge of the shell 70 on the solder paste;

step S110: the case 70 is soldered so that the case 70 encapsulates the ASIC chip 10 and the MEMS chip 50.

After the ultrasonic welding, solder paste is applied to the edge of the circuit board 20, the edge of the shell 70 is mounted on the solder paste, and the shell 70 and the circuit board 20 are soldered by reflow soldering, so that the shell 70 covers the circuit board 20 to encapsulate the ASIC chip 10 and the MEMS chip 50 on the circuit board 20. In this embodiment, through inciting somebody to action casing 70 welds on circuit board 20, in order to avoid casing 70 with have the gap between the circuit board 20, thereby it is right to improve the collection performance of automobile-used microphone to sound, avoid dust, water stain to enter into simultaneously the inside of circuit board 20 causes circuit board 20 short circuit improves product stability and reliability.

In addition, in order to solve the above problems, the present invention further provides a vehicle microphone, referring to fig. 11 and 12, the vehicle microphone includes a circuit board 20, an ASIC chip 10, and an MEMS chip 50, the ASIC chip 10 and the MEMS chip 50 are disposed on the circuit board 20, the MEMS chip 50 is electrically connected to the ASIC chip 10, an adhesive 30 is disposed between the ASIC chip 10 and the circuit board 20, the size of the area of the adhesive 30 is 60% to 80% of the size of the area of the ASIC chip 10, and a sealant 40 is disposed along the edge of the adhesive 30 to seal the adhesive 30 between the circuit board 20 and the ASIC chip 10.

In the vehicle microphone, the ASIC chip 10 and the MEMS chip 50 are usually fixed on the circuit board 20 by bonding with the bonding adhesive 30, the bonding adhesive 30 can be an epoxy adhesive part, and the ASIC chip 10 or the MEMS chip 50 and the like are not shaken in the process of mechanical welding by using the advantages of high hardness, large thrust, no volatile substance generation and the like after curing, so as to improve the welding precision and improve the product quality. However, since the microphone for vehicle is installed in the vehicle, and the vehicle is often in an extreme environment during use, for example, the viscosity of the adhesive 30 is reduced under high temperature and high humidity conditions, the adhesive 30 needs to be sealed by the sealant 40, the sealant 40 may be a silica gel member, and the excellent high temperature resistance, low temperature resistance and hydrophobic performance of the silica gel member are utilized to avoid the phenomenon that the adhesive 30 is exposed under high temperature and high humidity conditions to absorb moisture and water to reduce the adhesive capacity.

After the installation position of the ASIC chip 10 is determined, the glue is sprayed at the installation position through the glue spraying heads, and it can be understood that a plurality of glue spraying heads can be arranged in the invention to simultaneously coat the bonding glue 30 and the sealant 40 on the circuit board 20 to improve the production efficiency. In this embodiment, the glue spraying head moves into the mounting position, and the adhesive 30 is applied to the mounting position, and because the adhesive 30 is spread around due to extrusion when the ASIC chip 10 is mounted, in this embodiment, the adhesive 30 does not need to be applied to the entire first mounting position, so that the area of the adhesive 30 is 60% -80% of the area of the first mounting position, and the thickness of the adhesive 30 in this embodiment is 20-50 micrometers, thereby ensuring the adhesion between the ASIC chip 10 and the circuit board. In the process of coating the bonding glue 30, the other glue spraying head can be controlled to move to the edge of the first installation position, and the sealant 40 is coated on the edge of the first installation position to form a circle of the sealant 40 which is wrapped around the periphery of the bonding glue 30. In the above process, the shape of the adhesive 30 may be adjusted according to the size and the dimension of the ASIC chip 10.

After the ASIC chip 10 is bonded to the circuit board 20, another gripper is controlled to grip the MEMS chip 50 onto the circuit board 20 for mounting, or another gripper is controlled to grip the MEMS chip 50 onto the circuit board 20 for mounting during the process of mounting the ASIC chip 10, thereby further improving the production efficiency. After the ASIC chip 10 and the MEMS chip 50 are mounted on the circuit board 20, a conductive wire is soldered between the MEMS chip 50 and the ASIC chip 10, so as to electrically connect the MEMS chip 50 and the ASIC chip 10, or to electrically connect the circuit on the circuit board 20, so that the vehicle microphone is manufactured.

According to the microphone for the vehicle, which is manufactured by the technical scheme of the invention, the ASIC chip 10 is bonded on the circuit board 20 through the bonding glue 30, and the edge of the ASIC chip 10 is provided with a circle of sealing glue 40 so as to seal the bonding glue 30 between the ASIC chip 10 and the circuit board 20, so that the bonding glue 30 is not exposed in the air, and therefore, the bonding glue 30 is prevented from being in an extreme environment, such as a high-temperature and high-humidity environment, the bonding capability of the bonding glue 30 is not reduced due to moisture absorption and water absorption, the risk factor of falling risk of the ASIC chip 10 from the circuit board 20 is reduced, and the stability of a product is improved.

The circuit board 20 is further provided with a sound inlet 60, the position of the sound inlet 60 corresponds to the MEMS chip 50, so that the phenomenon that the circuit board 20 weakens a sound signal or blocks the sound signal is avoided, sound can be transmitted to the MEMS chip 50 through the sound inlet 60, the sensitivity of the MEMS chip 50 for receiving the sound signal is improved, and the performance of the MEMS chip 50 is improved.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A manufacturing process of a vehicle microphone is characterized by comprising the following steps:

determining the installation position of an ASIC chip on a circuit board;

coating sealant at the edge of the installation position;

mounting the ASIC chip on the adhesive glue and the sealing glue;

mounting a MEMS chip on the circuit board;

2. The process of claim 1, wherein the mounting location includes an interior area and an edge area disposed around the interior area, and the step of applying adhesive glue in the mounting location includes:

3. The manufacturing process of the microphone for the vehicle as claimed in claim 2, wherein the step of controlling the glue-spraying head to move in the inner area and uniformly spreading the adhesive glue comprises:

and after the glue spraying head is controlled to evenly smear the bonding glue along the length direction of the internal area in a reciprocating manner, the ASIC chip is controlled to press the bonding glue, and the thickness of the bonding glue is controlled to be 20-25 micrometers.

4. The process for manufacturing a microphone for a vehicle as claimed in claim 2 or 3, wherein the step of mounting the ASIC chip on the adhesive and the sealant includes:

the step of mounting the MEMS chip on the circuit board includes:

5. The manufacturing process of the vehicular microphone according to claim 1, wherein after the step of mounting the ASIC chip on the adhesive glue and the sealant, the manufacturing process further comprises:

and cleaning the circuit board.

6. The manufacturing process of the vehicular microphone according to claim 5, wherein the step of cleaning the circuit board comprises:

and cleaning the circuit board through a plasma cleaning box.

7. The vehicular microphone fabrication process according to claim 1, wherein the step of soldering a conductive wire between the MEMS chip and the ASIC chip to electrically connect the MEMS chip and the ASIC chip comprises:

8. The vehicular microphone fabrication process according to claim 1, further comprising, after the step of soldering a conductive wire between the MEMS chip and the ASIC chip to electrically connect the MEMS chip and the ASIC chip:

and coating protective glue on the upper surface of the ASIC chip.

9. The vehicular microphone manufacturing process according to claim 1, wherein the step of determining the mounting position of the ASIC chip on the circuit board includes:

acquiring image information of the circuit board through a positioning camera;

acquiring preset coordinate information of the ASIC chip on the circuit board;

10. The vehicular microphone fabrication process according to claim 1, further comprising, after the step of soldering a conductive wire between the MEMS chip and the ASIC chip to electrically connect the MEMS chip and the ASIC chip:

11. The utility model provides an automobile-used microphone, its characterized in that, automobile-used microphone includes circuit board, ASIC chip and MEMS chip, the ASIC chip with the MEMS chip sets up on the circuit board, the MEMS chip with ASIC chip electric connection, wherein, the ASIC chip with be equipped with the bonding glue between the circuit board, the bonding glue area size does 60% ~ 80% of ASIC chip area size follows the edge of bonding glue is provided with sealed glue, in order to incite somebody to action the bonding glue is sealed the circuit board with between the ASIC chip.