CN111796705A - Panel, preparation method thereof, touch display screen and electronic equipment - Google Patents
Panel, preparation method thereof, touch display screen and electronic equipment Download PDFInfo
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- CN111796705A CN111796705A CN202010440495.5A CN202010440495A CN111796705A CN 111796705 A CN111796705 A CN 111796705A CN 202010440495 A CN202010440495 A CN 202010440495A CN 111796705 A CN111796705 A CN 111796705A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to a panel and a preparation method thereof, a touch display screen and electronic equipment, wherein the preparation method of the panel comprises the following steps: providing a substrate, wherein the substrate comprises a first surface and a second surface which are oppositely arranged; a photosensitive conductive film is arranged on the first surface; providing a mask plate, wherein the mask plate comprises a complete development area, a first area and a second area, the first area and the second area are arranged at intervals through the complete development area, and the mask plate is used for exposing the photosensitive conductive film; and developing the exposed photosensitive conductive film to ensure that the area of the photosensitive conductive film opposite to the complete development area is completely developed, and ensuring that the thickness of a first mask pattern formed by developing the area of the photosensitive conductive film opposite to the first area is different from the thickness of a second mask pattern formed by developing the area of the photosensitive conductive film opposite to the second area. The invention can lead the resistance values of different areas of the conducting layer to be different according to the different thicknesses of the mask patterns.
Description
Technical Field
The invention relates to an electronic part, in particular to a panel and a preparation method thereof, a touch display screen and electronic equipment.
Background
In the related art, in the process of manufacturing the circuit layer of the circuit board, a substrate is provided first, and then the substrate is sequentially subjected to processes of coating, dry film pressing, exposure, development, etching, film stripping and the like. However, the thicknesses of the circuit patterns in the circuit layer finally prepared by the above process are basically the same, so that the resistances of different areas of the circuit layer are kept consistent, the resistance cannot be adjusted, and the visual effect of the circuit layer is poor.
Disclosure of Invention
Accordingly, it is necessary to provide a panel, a manufacturing method thereof, a touch display screen and an electronic device to solve the problems of equal resistance in different areas of a circuit layer and poor visual effect of the circuit layer.
A method for preparing a panel comprises the following steps:
providing a substrate, wherein the substrate comprises a first surface and a second surface which are oppositely arranged;
a photosensitive conductive film is arranged on the first surface;
providing a mask plate, wherein the mask plate comprises a complete development area and a development reserved area, the development reserved area comprises a first reserved area and a second reserved area, the first reserved area and the second reserved area are arranged at intervals through the complete development area, the first reserved area comprises a first area, the second reserved area comprises a second area, and the light transmittance of the first area is different from that of the second area; setting the mask plate to be opposite to the photosensitive conductive film, and exposing the photosensitive conductive film by using the mask plate; and
and developing the exposed photosensitive conductive film to completely develop the area of the photosensitive conductive film opposite to the completely developed area, wherein the thickness of a first mask pattern formed by developing the area of the photosensitive conductive film opposite to the first area is different from the thickness of a second mask pattern formed by developing the area of the photosensitive conductive film opposite to the second area.
According to the preparation method of the panel, the photosensitive conductive film (such as a transferable transparent conductive film) has flexibility, conductivity and high transparency, so that the photosensitive conductive film can replace ITO (indium tin oxide) to prepare the conductive layer through exposure and development, processes such as film coating, etching, film stripping and the like are omitted, and the formation process of the conductive layer formed after the photosensitive conductive film is exposed and hidden is simplified. Moreover, since the formed conductive layer includes the first mask pattern and the second mask pattern, and the first mask pattern and the second mask pattern have different thicknesses, the resistance values of different regions of the conductive layer may be different according to the different thicknesses of the mask patterns, wherein the thicker the mask pattern is, the smaller the resistance is. In addition, the mask patterns with different thicknesses can improve the appearance visual effect of the conducting layer.
In one embodiment, the first reserved area comprises at least one third area adjacent to the first area, the third area comprises at least one sub-area, and the light transmittance of two adjacent areas in the first area and the at least one sub-area is different;
when the exposed photosensitive conductive film is developed, third mask patterns are formed in the regions, opposite to the sub-regions, of the photosensitive conductive film, the thicknesses of the two adjacent third mask patterns are different, and the thicknesses of the third mask patterns are different from the thicknesses of the first mask patterns.
Thus, the visual effect of the circuit pattern can be further improved.
In one embodiment, the photosensitive conductive film is a positive film, the fully developed area is completely transparent to light, and both the first area and the second area are partially transparent to light, or one of the first area and the second area is partially transparent to light and the other is opaque to light. So, rationally arrange the position in complete printing opacity district, partial printing opacity district and the printing opacity district in the mask plate, can be through the thickness of this regional mask pattern of mask plate of regional adjustment of mask plate in needs adjustment resistance.
In one embodiment, the photosensitive conductive film is a negative film, the completely developed area is opaque, and the first area and the second area are both partially transparent; alternatively, one of the first and second regions is partially light transmissive and the other is fully light transmissive. So, rationally arrange the position in complete printing opacity district, partial printing opacity district and the printing opacity district in the mask plate, can be through the thickness of this regional mask pattern of mask plate of regional adjustment of mask plate in needs adjustment resistance.
In one embodiment, the first regions are located on two opposite sides of the second region, the photosensitive conductive film is a positive film, and the light transmittance of the first regions is smaller than that of the second regions; when the exposed photosensitive conductive film is developed, the thickness of the first mask pattern is larger than that of the second mask pattern; or the first area is positioned at two opposite sides of the second area, the photosensitive conductive film is a negative film, and the light transmittance of the first area is greater than that of the second area; and when the exposed photosensitive conductive film is developed, the thickness of the first mask pattern is larger than that of the second mask pattern. Therefore, the first mask pattern formed by the area, opposite to the first area, of the photosensitive conductive film after being developed is equivalent to the peripheral pattern in the conductive layer, the mask pattern formed by the area, opposite to the second area, of the photosensitive conductive film after being developed is equivalent to the inner side pattern, the thickness value of the peripheral pattern is larger than that of the inner side pattern, wiring is conveniently arranged on the peripheral pattern, the inner side pattern can be protected, and the circuit visual effect of the inner side pattern can be improved.
In one embodiment, the first reserved area comprises two fourth areas, the area of the first reserved area different from the fourth areas is a central area of the first reserved area, and the fourth areas are arranged on two opposite sides of the central area; the light transmittance of the fourth area is gradually increased or decreased from one side far away from the central area to one side close to the central area to be equal to that of the central area connected with the fourth area;
when the exposed photosensitive conductive film is developed, making the region of the photosensitive conductive film opposite to the central region exposed and hidden to form a central mask pattern, and making the region of the photosensitive conductive film opposite to the fourth region developed to form a fourth mask pattern; the pattern surface of the central mask pattern, which is far away from the first surface and is connected with the fourth mask pattern, is a first pattern surface, the fourth mask pattern is provided with a first side surface connecting the first surface and the first pattern surface, and the distance between a pattern cut by a reference plane parallel to the first surface and the central mask pattern is gradually reduced in the direction from the first surface to the first pattern surface. Therefore, the first side surface inclines towards the inner side, so that the central mask pattern can be prevented from being hollowed through over development, and the adhesive force between the central mask pattern and the substrate can be improved.
In one embodiment, the photosensitive conductive film is a positive film, and the light transmittance of the fourth region gradually decreases from 100% from the side away from the central region to the side close to the central region; or, the photosensitive conductive film is a negative film, and the light transmittance of the fourth region gradually increases from 0% from the side far away from the central region to the side close to the central region. Thus, a fourth mask pattern can be obtained.
In one embodiment, the first region and the second region extend in a first direction, the extending direction of the first mask pattern and the extending direction of the second mask pattern extend in the first direction when the exposed photosensitive conductive film is developed, the first mask pattern and the second mask pattern form a first conductive layer, and after the step of developing the exposed photosensitive conductive film, the manufacturing method further includes the steps of:
arranging a second conductive layer on the second surface, so that the first conductive layer and the second conductive layer form a coupling capacitor, and obtaining a touch panel with a touch function; the second conductive layer includes a plurality of electrode patterns arranged in parallel at intervals, the electrode patterns extending in a second direction crossing the first direction.
A panel, comprising:
the substrate comprises a first surface and a second surface which are arranged oppositely; and
the first conducting layer is arranged on the first surface and comprises a photosensitive conducting film, and the first conducting layer comprises a first pattern area and a second pattern area which are arranged at intervals; the first pattern area comprises a first mask pattern, the second pattern area comprises a second mask pattern, and the first mask pattern and the second mask pattern are different in thickness.
In the panel, the formed first conductive layer comprises the first mask pattern and the second mask pattern, and the thicknesses of the first mask pattern and the second mask pattern are different, so that the resistance values of different areas of the first conductive layer can be different according to the different thicknesses of the mask patterns, wherein the thicker the mask patterns are, the smaller the resistance is. In addition, the mask patterns with different thicknesses can also improve the appearance visual effect of the first conducting layer.
In one embodiment, the first pattern region includes at least one adjacent pattern adjacent to the first mask pattern, the adjacent pattern includes at least one third mask pattern, the thickness of two adjacent third mask patterns is different, and the thickness of the third mask pattern is different from the thickness of the first mask pattern. Therefore, the circuit visual effect of the first conductive layer can be further improved.
In one embodiment, the first mask patterns are located on two opposite sides of the second mask pattern, and the thickness of the first mask patterns is greater than that of the second mask patterns. Therefore, the first mask pattern is equivalent to the peripheral pattern of the first conducting layer, the second mask pattern is equivalent to the inner side pattern of the first conducting layer, the thickness value of the peripheral pattern is larger than that of the inner side pattern, wiring is conveniently arranged on the peripheral pattern, the inner side pattern can be protected, and the line visual effect of the inner side pattern can be improved.
In one embodiment, the first pattern region includes two fourth mask patterns, the pattern of the first pattern region different from the fourth mask patterns is a central mask pattern of the first pattern region, and the fourth mask patterns are disposed on two opposite sides of the central mask pattern; the end face, far away from the first surface, of the central mask pattern and connected with the fourth mask pattern is a first pattern face, the fourth mask pattern is provided with a first side face connecting the first surface and the first pattern face, and in the direction from the first surface to the first pattern face, the distance between a pattern cut by a reference plane parallel to the first surface and the central mask pattern is gradually reduced. Therefore, the first side surface inclines towards the inner side, so that the central mask pattern can be prevented from being hollowed out due to over-development, and the adhesive force between the central mask pattern and the substrate can be improved.
In one embodiment, the substrate is a flexible substrate and the panel is a flexible circuit board. Therefore, the flexible circuit board not only has better bending performance, but also has better line visual effect.
In one embodiment, the panel is a touch panel, the extending direction of the first mask pattern and the extending direction of the second mask pattern extend along a first direction, the panel includes a second conductive layer disposed on the second surface, the second conductive layer includes a plurality of electrode patterns disposed in parallel at intervals, the electrode patterns extend along a second direction crossing the first direction, and the first conductive layer and the second conductive layer form a coupling capacitor. The touch panel has a good line visual effect.
A touch display screen, comprising:
a display panel; and
the touch panel is stacked on the display panel.
The touch display screen has better bending performance and can meet the resistance requirements of different areas.
An electronic device, comprising:
a terminal body; and
the touch display screen is connected with the terminal body.
The touch display screen has better bending performance and can meet the resistance requirements of different areas.
Drawings
Fig. 1 is a schematic structural diagram of a panel according to an embodiment of the present invention;
FIG. 2 is a schematic sectional view taken along line II-II in FIG. 1;
fig. 3 is a schematic structural diagram of a touch panel according to an embodiment of the invention;
fig. 4 is a schematic structural diagram of a touch display screen according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;
FIG. 6 is a schematic view of a process for manufacturing a panel according to an embodiment of the present invention;
fig. 7 is a schematic view of exposure of a transferable transparent conductive film using a halftone mask.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as broadly as the present invention is capable of modification in various respects, all without departing from the spirit and scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 and 2, a panel 10 according to an embodiment of the present application includes a substrate 100 and a first conductive layer 200. The substrate 100 is made of a flexible insulating material, for example, a polymer material such as Polyimide (PI), Polycarbonate (PC), Polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), Polyarylate (PAR), or glass Fiber Reinforced Plastic (FRP), but is not limited thereto. When the material of the substrate 100 is Polyimide (PI), especially Colorless Polyimide (CPI), it has better bending resistance and insulation performance. The substrate 100 includes a first surface 110 and a second surface 120 that are oppositely disposed.
The first Conductive layer 200 is disposed on the first surface 110 and includes a photosensitive Conductive film, the photosensitive Conductive film can be directly exposed to light for exposure, and the first Conductive layer 200 can be formed by development after exposure without performing an etching process after attaching a dry film and development, and the photosensitive Conductive film can be, for example, a transferable Transparent Conductive film (TCTF), that is, the first Conductive layer 200 is formed by exposing and developing the transferable Transparent Conductive film. The formed first conductive layer 200 can be used as a circuit layer, and the panel 10 can be a Flexible Printed Circuit (FPC), and the manufactured flexible printed circuit also has good flexibility because the transferable transparent conductive film has flexibility and conductivity.
Referring to fig. 2, in an embodiment, the first conductive layer 200 includes a first pattern region 200a and a second pattern region 200b disposed at an interval, the first pattern region 200a includes a first mask pattern 210, the second pattern region 200b includes a second mask pattern 220, and thicknesses of the first mask pattern 210 and the second mask pattern 220 are different. For example, in an exemplary embodiment, the first pattern region 200a is located at two opposite sides of the second pattern region 200b, i.e. the first mask pattern 210 is located at two opposite sides of the second mask pattern 220, and the thickness of the first mask pattern 210 is greater than that of the second mask pattern 220. For example, fig. 2 illustrates that the second mask pattern 220 is disposed between two first mask patterns 210. Of course, the first mask pattern 210 may also be located at the outer periphery of the second mask pattern 220 to surround the second mask pattern 220. In addition, the relative positions of the first mask pattern 210 and the second mask pattern 220 are not limited, the number of the first mask pattern 210 and the second mask pattern 220 is not limited, and the number of the first mask pattern 210 may be plural, and "plural" herein means two or more.
It should be noted that, when the first mask pattern 210 is located on two opposite sides of the second mask pattern 220, the first mask pattern 210 is equivalent to a peripheral pattern in the first conductive layer 200, the second mask pattern 220 is equivalent to an inner pattern in the first conductive layer 200, and a thickness value of the peripheral pattern is greater than a thickness value of the inner pattern, so that a routing or binding region is conveniently disposed on the peripheral pattern, and the inner pattern can be protected and a line visual effect of the inner pattern can be improved. For convenience of understanding, the thickness in the embodiments of the present invention refers to a dimension value in the X-axis direction shown in fig. 2.
The panel 10 of the present invention can be prepared by exposing and developing the transferable transparent conductive film instead of ITO to obtain the conductive layer of the present invention, which eliminates the processes of plating, etching, stripping, etc., and simplifies the formation process of the first conductive layer 200, because the transferable transparent conductive film has flexibility, conductivity, and high transparency. Furthermore, since the first conductive layer 200 is formed to include a plurality of mask patterns, at least two of the plurality of mask patterns have different thicknesses, the resistance values of different regions of the conductive layer may be different according to the thickness of the mask patterns, wherein the thicker the mask patterns, the smaller the resistance values. In addition, the mask patterns with different thicknesses can improve the appearance visual effect of the conducting layer. In one embodiment, the width of the mask pattern is within 10mm, and the resistance can reach 0-9M omega.
In one embodiment, the first pattern region 200a includes at least one adjacent pattern adjacent to the first mask pattern 210, and fig. 2 illustrates that the adjacent pattern is one and connected to one side of the first mask pattern 210. Of course, the adjacent patterns may be two and connected to both sides opposite to the first mask pattern 210. Wherein the adjacent pattern includes at least one third mask pattern 230 (only one is illustrated in fig. 2). The thickness of the third mask patterns 230 is not equal to that of the first mask patterns 210, and when the number of the third mask patterns 230 is plural, the thicknesses of adjacent two of the third mask patterns 230 in the adjoining patterns are also not equal. In one embodiment, the thickness of the third mask pattern 230 is less than the thickness of the first mask pattern 210. Thus, the third mask pattern 230 forms a step with the first mask pattern 210.
In an embodiment, the first pattern region 200a further includes two fourth mask patterns 240, a pattern of the first pattern region 200a different from the fourth mask patterns 240 is a center mask pattern of the first pattern region 200a, and the fourth mask patterns 240 are disposed on two opposite sides of the center mask pattern. Taking fig. 2 as an example, when only the first mask pattern 210 is disposed between the two fourth mask patterns 240, the first mask pattern 210 is a center mask pattern of the first pattern region 200 a. When the first mask pattern 210 and the adjacent pattern including the third mask pattern 230 are disposed between the two fourth mask patterns 240, the combination of the first mask pattern 210 and the adjacent pattern is the center mask pattern of the first pattern region 200 a.
It should be noted that the end surface of the central mask pattern away from the first surface 110 and connected to the fourth mask pattern 240 is a first pattern surface, the first mask pattern 210 has a first surface 211 away from the first surface 110, and the adjacent pattern has a second surface 231 away from the first surface. When the center mask pattern is the first mask pattern 210, the first pattern surface is the first surface 211. When the center mask pattern includes the first mask pattern 210 and the adjacent pattern, the first pattern surface is a bending surface formed by combining the first surface 211 and the second surface 231.
The fourth mask pattern 240 has a first side surface 241 connecting the first surface 110 and the first pattern surface, and the distance between the center mask pattern and a pattern cut by a reference plane parallel to the first surface 110 of the first side surface 241 is gradually reduced in a direction from the first surface 110 to the first pattern surface. In one embodiment, FIG. 2 illustrates the first side 241 as a sloped surface that is sloped with respect to the first surface 110 at an angle of 30 to 75, such as 45, with respect to the first surface 110. The fourth mask pattern 240 is disposed on the first side 241 to prevent the center mask pattern from being hollowed due to over-development during the developing process, so that the adhesion between the center mask pattern and the substrate 100 can be improved. Compared with the difference between the mask pattern and the substrate 100 in the related art (i.e., the first side 241 is perpendicular to the first surface 110), the inclined first side 241 can be used for over-development, and even if the first side 241 is over-developed, the phenomenon that the lower end of the central mask pattern is hollowed out and suspended does not occur. Of course, the first side 241 may be a curved surface.
The second mask pattern 220 has a second pattern surface 221 remote from the first surface 110. In one embodiment, the second pattern region 200b includes fifth mask patterns 250 connected to opposite sides of the second mask patterns 220, the fifth mask patterns 250 have second side surfaces 251 connecting the first surface 110 and the second pattern surfaces 221, and the distance between the second side surfaces 251 and the second mask patterns 220 is gradually decreased by a pattern cut by a reference plane parallel to the first surface 110 in a direction from the first surface 110 to the second pattern surfaces 221. In one embodiment, FIG. 2 illustrates the second side 251 as a sloped surface that is sloped with respect to the first surface 110 at an angle of 30 to 75, such as 45, with respect to the first surface 110. The fifth mask pattern 250 may prevent the second mask pattern 220 from being hollowed due to over-development during development based on the second side surface 251, so that the adhesion between the second mask pattern 220 and the substrate 100 may be improved. Compared with the difference between the mask pattern and the substrate 100 in the related art (i.e., the second side 251 is perpendicular to the first surface 110), the inclined second side 251 can be used for over-development, thereby preventing the lower end of the second mask pattern 220 from being hollowed out and suspended. Of course, the second side 251 may also be curved.
In an embodiment, referring to fig. 3, the panel 10 may be a touch panel, that is, the panel 10 has a touch feedback function. In one embodiment, the first conductive layer 200 includes a plurality of parallel first electrode stripes and a plurality of parallel second electrode stripes, the first electrode stripes are arranged to cross the second electrode stripes, and the first electrode stripes are disconnected at the crossing of the second electrode stripes to form a first pattern and a second pattern. The first and second mask patterns 210 and 220 belong to at least one of the first and second electrode bars. At this time, the panel 10 further includes an insulating layer 300 and a second conductive layer 400 sequentially disposed on the first conductive layer 200, wherein the second conductive layer 400 can be understood as a bridging layer, and the second conductive layer 400 serves as a bridge passing through the insulating layer 300 to electrically connect the first pattern and the second pattern. Of course, the second conductive layer 400 may be stacked on the second surface 120 of the substrate 100. At this time, the extending direction of the first mask pattern 210 and the extending direction of the second mask pattern 220 extend along a first direction, the second conductive layer 400 includes a plurality of electrode patterns arranged in parallel at intervals, the electrode patterns extend along a second direction crossing the first direction, and the first conductive layer 200 and the second conductive layer 400 form a coupling capacitor to implement a touch function of the panel 10.
In an embodiment, the second conductive layer 400 includes a transferable transparent conductive film, the second conductive layer 400 includes a plurality of electrode patterns disposed at intervals, at least two of the plurality of electrode patterns have different thicknesses, and the structure of the second conductive layer 400 herein can refer to the description of the first conductive layer 200, and is not repeated herein. In order to protect the second conductive layer 400, the second conductive layer 400 may be connected to the protective cover by an adhesive layer.
Note that one of the first conductive layer 200 and the second conductive layer 400 is, for example, a transmission electrode layer (generally, referred to as TX electrode), and the other is, for example, a reception electrode layer (generally, referred to as RX electrode). In order to realize the touch function of the panel 10, a plurality of signal lines (not shown) are disposed on the substrate 100, and the plurality of signal lines are electrically connected to the first conductive layer 200 and the second conductive layer 400 respectively, so as to transmit the electrical signals of the first conductive layer 200 and the second conductive layer 400 to the FPC. The signal line may be, for example, a silver (Ag) line or a gold (Au) line obtained by printing, exposing, or irradiating, and the material of the signal line is not limited herein.
Referring to fig. 4, when the panel 10 can be used as a touch panel, the panel 10 with touch function can be stacked and attached to the display panel 20 to form a touch display screen 30. The display panel 10 may adopt an LCD (Liquid crystal display) screen for displaying information, and the LCD screen may be a TFT (Thin Film Transistor) screen, an IPS (In-Plane Switching) screen, or an SLCD (split Liquid crystal display) screen. In another embodiment, the display panel 10 may adopt an OLED (Organic Light-Emitting display) screen for displaying information, and the OLED screen may be an AMOLED (Active Matrix Organic Light-Emitting Diode) screen or a Super AMOLED (Super Active Matrix Organic Light-Emitting Diode) screen or a Super AMOLED Plus (Super Active Matrix Organic Light-Emitting Diode) screen, which will not be described herein again.
The invention further provides an electronic device 1000, and referring to fig. 5, the invention will describe the electronic device 1000 by taking a smart phone as an example. Those skilled in the art will readily understand that the electronic device 1000 of the present application may also be any device having communication and storage functions, such as a tablet computer, a notebook computer, a portable phone, a video phone, a digital still camera, an electronic book reader, a Portable Multimedia Player (PMP), a mobile medical device, and other intelligent terminals, and the representation form of the electronic device 1000 is not limited herein. For wearable devices such as smart watches, the same applies to the electronic device 1000 according to the embodiments of the present application.
This electronic equipment 1000 includes touch-sensitive display screen 30, back lid 40 and center 50, and touch-sensitive display screen 30 and back lid 40 connect in the both sides that center 50 carried on the back mutually and enclose and close and form accommodating space, and accommodating space can be used for installing devices such as mainboard, power of electronic equipment 1000. The rear cover 40 and the middle frame 50 form a terminal body of the electronic device 1000, and the rear cover 40 and the middle frame 50 may be integrally formed or detachably connected. The side of the touch display screen 30 facing away from the rear cover 40 includes a displayable region 301, the displayable region 301 may form all or part of the side of the touch display screen 30 facing away from the rear cover 40, and the displayable region 301 is used for displaying image information.
Referring to fig. 6, the present invention also provides a method for manufacturing a panel 10, including the steps of:
in step S810, referring to fig. 7, the substrate 100 is provided. The substrate 100 includes a first surface 110 and a second surface 120 that are oppositely disposed. The substrate 100 is made of a flexible insulating material, for example, a polymer material such as Polyimide (PI), Polycarbonate (PC), Polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), Polyarylate (PAR), or glass Fiber Reinforced Plastic (FRP), but is not limited thereto. When the material of the substrate 100 is Polyimide (PI), especially Colorless Polyimide (CPI), it has better bending resistance and insulation performance.
In step S820, the photosensitive conductive film 200a is disposed on the first surface 110. The photosensitive Conductive film 200a may be, for example, a transferable Transparent Conductive film (TCTF), the transferable Transparent Conductive film may be transferred to the first surface 110, and the transferable Transparent Conductive film 200a may be formed on the substrate 100 by a lamination process.
Step S830, providing the mask 400, where the mask 400 includes a complete development area 410 and a development retention area 420, the development retention area 420 includes a first retention area 420a and a second retention area 420b, and the first retention area 420a and the second retention area 420b are disposed at an interval through the complete development area 410. The first reserved area 420a includes a first area 421 and the second reserved area 420b includes a second area 422, and the light transmittance of the first area 421 and the light transmittance of the second area 422 are different. The difference between the light transmittance of the first region 421 and the light transmittance of the second region 422 may be 10% to 90%, for example, 50%. The mask plate 400 is disposed to be opposed to the photosensitive conductive film 200a, and the photosensitive conductive film 200a is exposed by the mask plate 400.
In step S840, the exposed photosensitive conductive film 200a is developed, such that the area of the photosensitive conductive film 200a opposite to the completely developed area 410 is completely developed, and the thickness of the first mask pattern 210 formed by the developing process on the area of the photosensitive conductive film 200a opposite to the first area 421 is different from the thickness of the second mask pattern 220 formed by the developing process on the area of the photosensitive conductive film 200a opposite to the second area 422.
In an embodiment, the photosensitive conductive film 200a disposed in step S820 is a positive film, the full development region 410 of the mask 400 provided in step S830 is completely transparent, the first region 421 and the second region 422 are both partially transparent, UV light (the direction indicated by the arrow in fig. 7 is the direction irradiated by the UV light) can completely penetrate through the full development region 410 to completely expose the region of the photosensitive conductive film 200a opposite to the full development region 410, and the UV light can partially penetrate through the first region 421 and the second region 422 to partially expose the photosensitive conductive film 200 a. In step S840, the region of the photosensitive conductive film 200a opposite to the full development region 410 can be fully developed by a positive developing solution, and the region of the photosensitive conductive film 200a opposite to the first and second regions 421 and 422 can be partially developed by the positive developing solution to form the first and second mask patterns 210 and 220. Since the light transmittance of the first region 421 and the second region 422 is different, the exposure rates of the two regions of the photosensitive conductive film 200a, which are respectively opposite to the first region 421 and the second region 422, are different, so that the two regions of the photosensitive conductive film 200a are developed to different degrees during development, and finally the first mask pattern 210 and the second mask pattern 220 with different thicknesses can be obtained. Of course, the first region 421 and the second region 422 may be configured such that one is partially transparent and the other is opaque. The region of the photosensitive conductive film 200a opposite to the opaque region is not developed by the positive developing solution and is completely retained.
In an embodiment, the photosensitive conductive film 200a disposed in step S820 is a negative film, the completely developed area 410 of the mask 400 provided in step S830 is opaque, and the first area 421 and the second area 422 are both partially transparent. In step S840, the region of the photosensitive conductive film 200a opposite to the fully developed region 410 can be fully developed by a negative developing solution, and the region of the photosensitive conductive film 200a opposite to the first and second regions 421 and 422 can be partially developed by the negative developing solution to form the first and second mask patterns 210 and 220. Since the light transmittance of the first region 421 and the second region 422 is different, the exposure rates of the two regions of the photosensitive conductive film 200a, which are respectively opposite to the first region 421 and the second region 422, are different, so that the two regions of the photosensitive conductive film 200a are developed to different degrees during development, and finally the first mask pattern 210 and the second mask pattern 220 with different thicknesses can be obtained. Of course, the first region 421 and the second region 422 may be provided such that one is partially transparent and the other is completely transparent. The region of the photosensitive conductive film 200a opposite to the complete light transmission is not developed but completely retained by the negative developer.
In an embodiment, the first region 421 of the mask 400 provided in step S830 is located on two opposite sides of the second region 422, and the light transmittance of the first region 421 is smaller than that of the second region 422 based on the photosensitive conductive film 200a being a positive film. In an embodiment, the light transmittance of the first region 421 may be 0, that is, the first region 421 is opaque, the first region 421 may also be partially transparent, and the light transmittance of the second region 422 may be between 10% and 90%. When the exposed photosensitive conductive film 200a is developed based on the photosensitive conductive film 200a being a positive film, the region of the photosensitive conductive film 200a opposite to the first region 421 is not irradiated with light and remains, and the region of the photosensitive conductive film 200a opposite to the second region 422 is partially irradiated with light and partially developed, so that the thickness of the obtained first mask pattern 210 is greater than that of the second mask pattern 220.
In an embodiment, the first region 421 of the mask 400 provided in step S830 is located on two opposite sides of the second region 422, and the light transmittance of the first region 421 is greater than that of the second region 422 based on the photosensitive conductive film 200a being a negative film. In one embodiment, the light transmittance of the first region 421 may be between 10% and 100%, when the light transmittance of the first region 421 is 100%, the first region 421 completely transmits light, and the light transmittance of the second region 422 may be between 10% and 90%. When the exposed photosensitive conductive film 200a is developed, if the first region 421 is completely transparent, the region of the photosensitive conductive film 200a opposite to the first region 421 is completely exposed to light and remains, and the region of the photosensitive conductive film 200a opposite to the second region 422 is partially exposed to light and is partially developed, so that the thickness of the obtained first mask pattern 210 is greater than that of the second mask pattern 220.
The developed photosensitive conductive film 200a is the first conductive layer 200, the first mask pattern 210 is equivalent to the peripheral pattern of the first conductive layer 200, the second mask pattern 220 is equivalent to the inner side pattern of the first conductive layer 200, the thickness of the peripheral pattern is greater than that of the inner side pattern, a routing or binding area is conveniently arranged on the peripheral pattern, a protection effect can be achieved on the inner side pattern, and the line visual effect of the inner side pattern can be improved. In other embodiments, the thickness of the first mask pattern 210 may also be less than the thickness of the second mask pattern 220.
In one embodiment, the first reserved area 420a includes at least one third area 423 contiguous with the first area 421. For example, fig. 7 illustrates that the third region 423 is one in number and connected to the first region 421. Of course, the number of the third regions 423 may be two and connected to both sides opposite to the first region 421. The third region 423 includes at least one sub-region 423a (only one sub-region 423a is illustrated in fig. 7), and light transmittances of two adjacent regions in the first region 421 and the at least one sub-region 423a are different.
When the exposed photosensitive conductive film 200a is developed, the third mask patterns 230 are formed in the regions of the photosensitive conductive film 200a opposite to each of the sub-regions 423a, the thicknesses of two adjacent third mask patterns 230 are not equal, and the thickness of the third mask pattern 230 is not equal to the thickness of the first mask pattern 210.
In one embodiment, the thickness of the third mask pattern 230 is less than that of the first mask pattern 210, so that the third mask pattern 230 and the first mask pattern 210 can form a step. Based on this, for the positive tone development, it is necessary to ensure that the light transmittance of each sub-region 423a is larger than that of the first region 421. For the negative type development, it is necessary to ensure that the light transmittance of each sub region 423a is smaller than that of the first region 421.
In one embodiment, the first reserved area 420a further includes two fourth regions 424, a region of the first reserved area 420a different from the fourth region 424 is a central region of the first reserved area 420a, and the fourth regions 424 are disposed on two opposite sides of the central region. Taking fig. 7 as an example, when only the first region 421 is disposed between the two fourth regions 424, the first region 421 is a central region of the first reserved region 420 a. When the first region 421 and the third region 423 including the sub-region 423a are disposed between the two fourth regions 424, the combination of the first region 421 and the third region 423 becomes a central region of the first reserved region 420 a.
For positive development, the light transmittance of the fourth region 424 gradually decreases from the side away from the central region to the side close to the central region to be equal to the light transmittance of the region of the central region connected to the fourth region 424. For example, the light transmittance of the fourth region 424 gradually decreases from 100% from the side away from the central region to the side close to the central region. For negative development, the light transmittance of the fourth region 424 gradually increases from the side away from the central region to the side close to the central region to be equal to the light transmittance of the region of the central region connected to the fourth region 424. For example, the transmittance of the fourth region 424 gradually increases from 0% from the side away from the central region to the side close to the central region.
When the exposed photosensitive conductive film 200a is developed, a central mask pattern is formed by making the region of the photosensitive conductive film 200a facing the central region invisible, and a fourth mask pattern 240 is formed by making the region of the photosensitive conductive film 200a facing the fourth region 424. Wherein, the pattern surface of the central mask pattern far from the first surface and connected to the fourth mask pattern 240 is the first pattern surface, the fourth mask pattern 240 has a first side surface 241 connecting the first surface 110 and the first pattern surface, and in the direction from the first surface 110 to the first pattern surface, the distance between the pattern cut by the reference plane parallel to the first surface 110 and the central mask pattern of the first side surface 241 is gradually reduced. The structure of the first side 241 has been described above, and will not be described herein.
In an embodiment, based on the photosensitive conductive film 200a being a positive film, the developing retention area 420 of the mask 400 provided in step S830 further includes a fifth area 425, and the fifth area 425 is connected to two opposite sides of the second area 242. In a direction from the side away from the second region 422 to the side close to the second region 422 of the fifth region 425, the light transmittance of the fifth region 425 gradually decreases from 100% to be equal to that of the second region 422. When the exposed photosensitive conductive film 200a is developed, a region of the photosensitive conductive film 200a facing the fifth region 425 is developed to form a fifth mask pattern 250 connected to an edge of the second mask pattern 220. Wherein the second mask pattern 220 has a second pattern surface 221 far away from the first surface 110, the fifth mask pattern 250 has a second side surface 251 connecting the first surface 110 and the second pattern surface 221, and a distance between the second side surface 251 and the second mask pattern 220 is gradually reduced by a pattern cut by a reference plane parallel to the first surface 110 in a direction from the first surface 110 to the second pattern surface 221. Specifically, when the transmittance of the fifth region 425 changes linearly, the second side 251 is an inclined surface inclined to the first surface 110, and when the transmittance of the fifth region 425 changes parabolically, the second side 251 is a curved surface.
In an embodiment, based on the photosensitive conductive film 200a being a negative film, the developing reservation region 420 of the mask 400 provided in step S830 further includes a fifth region 425, and the fifth region 425 is connected to two opposite sides of the second region 242. In a direction from the side away from the second region 422 to the side close to the second region 422 of the fifth region 425, the light transmittance of the fifth region 425 gradually increases from 0% to be equal to that of the second region 422. When the exposed photosensitive conductive film 200a is developed, a region of the photosensitive conductive film 200a facing the fifth region 425 is developed to form a fifth mask pattern 250 connected to an edge of the second mask pattern 220. Wherein the second mask pattern 220 has a second pattern surface 221 far away from the first surface 110, the fifth mask pattern 250 has a second side surface 251 connecting the first surface 110 and the second pattern surface 221, and a distance between the second side surface 251 and the second mask pattern 220 is gradually reduced by a pattern cut by a reference plane parallel to the first surface 110 in a direction from the first surface 110 to the second pattern surface 221. Specifically, when the transmittance of the fifth region 425 changes linearly, the second side 251 is an inclined surface inclined to the first surface 110, and when the transmittance of the fifth region 425 changes parabolically, the second side 251 is a curved surface.
In an embodiment, the first region 421 and the second region 422 of the mask 400 provided in step S830 both extend along the first direction, and the extending direction of the first mask pattern 210 and the extending direction of the second mask pattern 210 obtained in step S840 also extend along the first direction, so that the first conductive layer 200 is formed by the first mask pattern 210 and the second mask pattern 220. At this time, after step S840, a second conductive layer may be further disposed on the second surface 120, so that the first conductive layer 200 and the second conductive layer form a coupling capacitor, and the panel 10 with a touch function is obtained. The second conductive layer includes a plurality of electrode patterns arranged in parallel at intervals, the electrode patterns extending in a second direction crossing the first direction.
In an embodiment, the light-transmitting area of the mask 400 may be appropriately set, so that when the exposed photosensitive conductive film 200a is developed, the photosensitive conductive film 200a may form a plurality of parallel first electrode stripes and a plurality of parallel second electrode stripes, the first electrode stripes are arranged to intersect with the second electrode stripes, the first electrode stripes are disconnected from the intersections of the second electrode stripes to form first patterns and second patterns, and the first mask patterns 210 and the second mask patterns 220 belong to at least one of the first electrode stripes and the second electrode stripes. At this time, after step S840, an insulating layer and a second conductive layer (corresponding to a bridging layer) covering the first electrode strips and the second electrode strips may be sequentially disposed on the substrate 100, so that the bridging layer penetrates through the insulating layer to electrically connect the first pattern and the second pattern, thereby obtaining the touch panel with a touch function.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (15)
1. A method for preparing a panel is characterized by comprising the following steps:
providing a substrate, wherein the substrate comprises a first surface and a second surface which are oppositely arranged;
a photosensitive conductive film is arranged on the first surface;
providing a mask plate, wherein the mask plate comprises a complete development area and a development reserved area, the development reserved area comprises a first reserved area and a second reserved area, the first reserved area and the second reserved area are arranged at intervals through the complete development area, the first reserved area comprises a first area, the second reserved area comprises a second area, and the light transmittance of the first area is different from that of the second area; setting the mask plate to be opposite to the photosensitive conductive film, and exposing the photosensitive conductive film by using the mask plate; and
and developing the exposed photosensitive conductive film to completely develop the area of the photosensitive conductive film opposite to the completely developed area, wherein the thickness of a first mask pattern formed by developing the area of the photosensitive conductive film opposite to the first area is different from the thickness of a second mask pattern formed by developing the area of the photosensitive conductive film opposite to the second area.
2. The manufacturing method according to claim 1, wherein the first reserved area comprises at least one third area adjacent to the first area, the third area comprises at least one sub-area, and the light transmittance of the first area and the adjacent two areas in the at least one sub-area is different;
when the exposed photosensitive conductive film is developed, third mask patterns are formed in the regions, opposite to the sub-regions, of the photosensitive conductive film, the thicknesses of the two adjacent third mask patterns are different, and the thicknesses of the third mask patterns are different from the thicknesses of the first mask patterns.
3. The method according to claim 1 or 2, wherein the photosensitive conductive film is a positive film, the fully developed region is completely transparent to light, and both the first region and the second region are partially transparent to light, or one of the first region and the second region is partially transparent to light and the other is opaque to light.
4. The manufacturing method according to claim 1 or 2, wherein the photosensitive conductive film is a negative film, the fully developed region is opaque, and the first region and the second region are both partially transparent; alternatively, one of the first and second regions is partially light transmissive and the other is fully light transmissive.
5. The production method according to claim 1 or 2, wherein the first region is located on opposite sides of the second region, the photosensitive conductive film is a positive film, and the light transmittance of the first region is smaller than that of the second region; when the exposed photosensitive conductive film is developed, the thickness of the first mask pattern is larger than that of the second mask pattern; or
The first area is positioned on two opposite sides of the second area, the photosensitive conductive film is a negative film, and the light transmittance of the first area is greater than that of the second area; and when the exposed photosensitive conductive film is developed, the thickness of the first mask pattern is larger than that of the second mask pattern.
6. The production method according to claim 1 or 2, wherein the first reserved region includes two fourth regions, a region of the first reserved region different from the fourth regions is a central region of the first reserved region, and the fourth regions are disposed on opposite sides of the central region; the light transmittance of the fourth area is gradually increased or decreased from one side far away from the central area to one side close to the central area to be equal to that of the central area connected with the fourth area;
when the exposed photosensitive conductive film is developed, making the region of the photosensitive conductive film opposite to the central region exposed and hidden to form a central mask pattern, and making the region of the photosensitive conductive film opposite to the fourth region developed to form a fourth mask pattern; the pattern surface of the central mask pattern, which is far away from the first surface and is connected with the fourth mask pattern, is a first pattern surface, the fourth mask pattern is provided with a first side surface connecting the first surface and the first pattern surface, and the distance between a pattern cut by a reference plane parallel to the first surface and the central mask pattern is gradually reduced in the direction from the first surface to the first pattern surface.
7. The production method according to claim 6, wherein the photosensitive conductive film is a positive film, and the light transmittance of the fourth region gradually decreases from 100% from a side away from the central region to a side close to the central region; or, the photosensitive conductive film is a negative film, and the light transmittance of the fourth region gradually increases from 0% from the side far away from the central region to the side close to the central region.
8. The production method according to claim 1 or 2, wherein the first region and the second region extend in a first direction, an extending direction of the first mask pattern and an extending direction of the second mask pattern are extended in the first direction when the photosensitive conductive film after exposure is developed, the first mask pattern and the second mask pattern form a first conductive layer, and after the step of developing the photosensitive conductive film after exposure, the production method further comprises the steps of:
arranging a second conductive layer on the second surface, so that the first conductive layer and the second conductive layer form a coupling capacitor, and obtaining a touch panel with a touch function; the second conductive layer includes a plurality of electrode patterns arranged in parallel at intervals, the electrode patterns extending in a second direction crossing the first direction.
9. A panel, comprising:
the substrate comprises a first surface and a second surface which are arranged oppositely; and
the first conducting layer is arranged on the first surface and comprises a photosensitive conducting film, and the first conducting layer comprises a first pattern area and a second pattern area which are arranged at intervals; the first pattern area comprises a first mask pattern, the second pattern area comprises a second mask pattern, and the first mask pattern and the second mask pattern are different in thickness.
10. The panel according to claim 9, wherein the first pattern region includes at least one adjoining pattern adjoining the first mask pattern, the adjoining pattern includes at least one third mask pattern, adjacent two of the third mask patterns have different thicknesses, and the third mask pattern has a different thickness from the first mask pattern.
11. The panel according to claim 9 or 10, wherein the first mask patterns are located on opposite sides of the second mask patterns, and a thickness of the first mask patterns is greater than a thickness of the second mask patterns.
12. The panel according to claim 9 or 10, wherein the first pattern region comprises two fourth mask patterns, the pattern of the first pattern region different from the fourth mask patterns is a center mask pattern of the first pattern region, and the fourth mask patterns are disposed on opposite sides of the center mask pattern; the end face, far away from the first surface, of the central mask pattern and connected with the fourth mask pattern is a first pattern face, the fourth mask pattern is provided with a first side face connecting the first surface and the first pattern face, and in the direction from the first surface to the first pattern face, the distance between a pattern cut by a reference plane parallel to the first surface and the central mask pattern is gradually reduced.
13. The panel according to claim 9 or 10, wherein the substrate is a flexible substrate, the panel being a flexible circuit board; or, the panel is a touch panel, the extending direction of the first mask pattern and the extending direction of the second mask pattern extend along a first direction, the panel includes a second conductive layer, the second conductive layer is disposed on the second surface, the second conductive layer includes a plurality of electrode patterns arranged in parallel at intervals, the electrode patterns extend along a second direction crossing the first direction, and the first conductive layer and the second conductive layer form a coupling capacitor.
14. A touch display screen, comprising:
a display panel; and
the touch panel of claim 13, stacked on the display panel.
15. An electronic device, comprising:
a terminal body; and
the touch display screen of claim 14, connected to the terminal body.
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| CN109545800A (en) * | 2018-11-23 | 2019-03-29 | 京东方科技集团股份有限公司 | A kind of display base plate and preparation method thereof, display device |
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| US20140232959A1 (en) * | 2011-10-27 | 2014-08-21 | Fujifilm Corporation | Conductive film and touch panel |
| CN105247626A (en) * | 2013-05-24 | 2016-01-13 | 富士胶片株式会社 | Transparent conductive film and method for producing transparent conductive film |
| US20160244580A1 (en) * | 2013-11-22 | 2016-08-25 | Fujifilm Corporation | Film, method for producing same, transparent conductive film, and touch panel |
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