CN111785768A - Organic light-emitting display panel, preparation method and display device - Google Patents
Organic light-emitting display panel, preparation method and display device Download PDFInfo
- Publication number
- CN111785768A CN111785768A CN202010866345.0A CN202010866345A CN111785768A CN 111785768 A CN111785768 A CN 111785768A CN 202010866345 A CN202010866345 A CN 202010866345A CN 111785768 A CN111785768 A CN 111785768A
- Authority
- CN
- China
- Prior art keywords
- layer
- organic light
- packaging
- protective layer
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides an organic light-emitting display panel, a preparation method and a display device. The organic light emitting display panel includes: the base plate to and be located a plurality of organic light emitting diode on the base plate, packaging structure encapsulates organic light emitting diode on the base plate, packaging structure includes: the first packaging layer is positioned on one side of the organic light-emitting diode, which is far away from the substrate; the second packaging layer is positioned on one side of the first packaging layer, which is far away from the organic light-emitting diode, and is formed by a polymer material; the protective layer is positioned on one side, far away from the first packaging layer, of the second packaging layer; and the third packaging layer is positioned on one side of the protective layer, which is far away from the second packaging layer, and the porosity of the protective layer is greater than that of the third packaging layer. In conclusion, the organic light-emitting display panel remarkably improves the problem that partial pixel points are dark or bad after the reliability test.
Description
Technical Field
The invention relates to the field of electronic equipment, in particular to an organic light-emitting display panel, a preparation method and a display device.
Background
With the increasing and diversified requirements of people on the display effect of electronic devices, the organic light-emitting display panel has become a main research and development direction in the display field due to the characteristics of self-luminescence, wide viewing angle, wide color gamut, high contrast, lightness, thinness, foldability, bendability, lightness, thinness, portability and the like. At present, organic light emitting display panels are mostly realized by adopting technologies based on Organic Light Emitting Diodes (OLEDs). The light-emitting materials in OLED devices are very sensitive to water and oxygen in the surrounding environment, so that the packaging technology is very important for protecting the OLED. The current packaging technologies for OLED devices mainly include ultraviolet packaging (UV packaging) and thin film packaging (TFE packaging). At present, the reliability of the OLED device packaged by the TFE packaging process still needs to be improved.
Therefore, the organic light emitting display panel, the manufacturing method and the display device still need to be improved.
Disclosure of Invention
The present application is made based on the findings of the inventors on the following problems:
the organic light emitting display panel packaged by the TFE process has a phenomenon of poor pixel display after a dependency test, for example, poor blue-green pixel display in a reliability test. The inventor finds that the reason for causing the pixel point problem of the display panel is that the first packaging layer has defects, the second packaging layer is mostly made of organic materials, the materials forming the second packaging layer generate escaping gas (such as free oxygen-containing micromolecules) in the process of forming the third packaging layer, and the escaping gas enters the organic light-emitting diode along the defects on the first packaging layer, so that the material of a light-emitting layer in the organic light-emitting diode is oxidized, and the problem of poor pixel point display after the reliability test occurs.
The present application is directed to solving, at least to some extent, one of the technical problems in the related art.
In one aspect of the present application, the present invention provides an organic light emitting display panel including: the substrate, and be located a plurality of organic light emitting diode on the substrate, packaging structure will organic light emitting diode encapsulates on the substrate, packaging structure includes: the first packaging layer is positioned on one side, far away from the substrate, of the organic light emitting diode; the second packaging layer is positioned on one side of the first packaging layer far away from the organic light-emitting diode and is formed by a polymer material; the protective layer is positioned on one side, far away from the first packaging layer, of the second packaging layer; and the third packaging layer is positioned on one side of the protective layer, which is far away from the second packaging layer, and the porosity of the protective layer is greater than that of the third packaging layer. Because the porosity of the protective layer is lower, the process for forming the protective layer is milder than the process for forming the third packaging layer, so that the second packaging layer can be prevented from generating free oxygen-containing micromolecules under severe working conditions such as high power and the like. Therefore, the influence of the third packaging layer forming process on the polymer material of the second packaging layer can be reduced through the arrangement of the protective layer, so that the influence of the free oxygen-containing small molecules escaping from the second packaging layer on the light-emitting characteristic of the light-emitting layer in the organic light-emitting diode is reduced. In conclusion, the display panel can improve and even solve the problem that partial pixel points are dark or bad after the reliability test of the thin film packaged display panel.
According to an embodiment of the invention, the chemical composition of the protective layer is the same as the chemical composition of the third encapsulation layer. Therefore, the light emitting condition of the organic light emitting diode is not influenced by the increase of the protective layer.
According to the embodiment of the invention, the material forming the second packaging layer contains carbon-oxygen double bonds. The second packaging layer formed by the high polymer material can improve the surface flatness, so that the overall packaging effect is improved.
According to the embodiment of the invention, the sum of the thickness of the protective layer and the thickness of the third packaging layer ranges from 0.65 to 0.7 micrometers, and the thickness of the protective layer ranges from 0.05 to 0.1 micrometers. When the thicknesses of the third encapsulation layer and the protection layer are within the above ranges, the requirements of mass production on process time management and control can be met while the damage to organic molecules in the second encapsulation layer is reduced as much as possible.
According to an embodiment of the present invention, a constituent material of the first encapsulation layer includes silicon oxynitride. Therefore, the light emitting effect of the organic light emitting diode can be improved through the lower refractive index of the silicon oxynitride.
According to the embodiment of the invention, the side of the first encapsulating layer away from the organic light emitting diode further comprises a first protective layer. Therefore, the first protective layer can further reduce the influence of the free oxygen-containing small molecules escaping from the second packaging layer on the light-emitting layer material in the organic light-emitting diode.
According to an embodiment of the present invention, a constituent material of the first protective layer includes silicon nitride. Therefore, the barrier effect on the free oxygen-containing micromolecules escaping from the second packaging layer can be realized through the better water-oxygen barrier property of the silicon nitride.
According to the embodiment of the invention, the sum of the thickness of the first protective layer and the thickness of the first encapsulating layer ranges from 1.0 to 1.1 micrometers, and the thickness of the first protective layer ranges from 0.05 to 0.15 micrometers. When the thicknesses of the first packaging layer and the first protection layer are in the range, the water and oxygen blocking effect of the packaging layer can be further improved while the light emitting requirement of the organic light emitting diode is met.
In another aspect of the present invention, the present invention provides a method of preparing an organic light emitting display panel, the method comprising: forming a first packaging layer on one side of the organic light-emitting diode, which is far away from the substrate; forming a second encapsulation layer on a side of the first encapsulation layer away from the organic light emitting diode, the second encapsulation layer being formed of a polymer material; forming a protective layer on one side of the second packaging layer far away from the first packaging layer; and forming a third packaging layer on one side of the protective layer, which is far away from the second packaging layer, wherein the protective layer and the third packaging layer are formed by deposition processes respectively and independently, and the deposition power for forming the protective layer is less than that for forming the third packaging layer. Because the deposition power for forming the protective layer is less than that of the third packaging layer, the negative effect on the material of the second packaging layer can be effectively reduced by the protective layer formed by lower deposition power, so that the generation of free oxygen-containing micromolecules escaping from the second packaging layer is reduced or even prevented, the influence of the escaping free oxygen-containing micromolecules on the material of the light-emitting layer in the organic light-emitting diode can be further prevented, and the problem that part of pixel points are dark or bad after the reliability test of the display panel is improved.
According to the embodiment of the invention, the deposition process is a plasma enhanced chemical deposition process, the deposition power is plasma power, and the ratio of the deposition power when the protective layer is formed to the deposition power when the third packaging layer is formed is in the range of 0.8-0.85. The protective layer formed by reducing the plasma power can effectively reduce the influence of the plasma on the polymer material of the second packaging layer, thereby effectively reducing the escape of free oxygen-containing small molecules of the second packaging layer.
According to the embodiment of the invention, the chemical composition of the material forming the protective layer and the material forming the third packaging layer are the same, and the porosity of the protective layer is greater than the porosity of the third packaging layer. Because the porosity of the protective layer is lower, the process for forming the protective layer is milder than the process for forming the third packaging layer, so that the situation that the second packaging layer generates free oxygen-containing micromolecules under severe working conditions such as high power and the like can be prevented, and the chemical composition of the protective layer is consistent with that of the third packaging layer, so that the light emitting condition of the organic light emitting diode is not influenced by the increase of the protective layer.
According to the embodiment of the invention, the sum of the thickness of the third packaging layer and the thickness of the protective layer ranges from 0.65 to 0.7 micrometer, and the thickness of the protective layer ranges from 0.05 to 0.1 micrometer. When the thicknesses of the third encapsulation layer and the protection layer are within the above ranges, the requirements of mass production on process time management and control can be met while the damage to organic molecules in the second encapsulation layer is reduced as much as possible. According to the embodiment of the invention, further, a first protection layer is formed on a side of the first encapsulation layer away from the organic light emitting diode. By adding the first protection layer on the first encapsulation layer far from the organic light-emitting diode, the negative influence of the free oxygen-containing small molecules escaping from the second encapsulation layer on the light-emitting layer material in the organic light-emitting diode can be further reduced.
According to the embodiment of the invention, the material for forming the first protective layer comprises silicon nitride. Therefore, the barrier effect on the free oxygen-containing micromolecules escaping from the second packaging layer can be realized through the better water-oxygen barrier property of the silicon nitride.
According to the embodiment of the invention, the sum of the thickness of the first encapsulating layer and the thickness of the first protecting layer ranges from 1.0 to 1.1 micrometers, and the thickness of the first protecting layer ranges from 0.05 to 0.15 micrometers. When the thicknesses of the first packaging layer and the first protection layer are in the range, the water and oxygen blocking effect of the packaging layer can be further improved while the light emitting requirement of the organic light emitting diode is met.
In a further aspect of the invention, the invention proposes a display device comprising a display panel as described above. Therefore, the display device has all the features and advantages of the display panel described above, and will not be described herein again. In general, the display device has at least one of advantages of good reliability and difficulty in causing blue-green dot defects.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 shows a schematic structural view of an organic light emitting display panel according to an embodiment of the present invention;
fig. 2 is a schematic view showing a partial structure of an organic light emitting display panel in the related art;
FIG. 3 shows a scanning electron microscope image of a defect in a first encapsulation layer, in accordance with one embodiment of the present invention;
fig. 4 shows a schematic structural view of an organic light emitting display panel according to still another embodiment of the present invention;
fig. 5 shows a schematic structural view of an organic light emitting display panel according to still another embodiment of the present invention;
fig. 6 is a schematic flow chart showing a method of fabricating an organic light emitting display panel according to the present invention;
fig. 7 shows a schematic flow chart of yet another method of manufacturing an organic light emitting display panel according to the present invention.
Description of reference numerals:
1000: an organic light emitting display panel; 10: an organic light emitting diode; 20: a support foreign matter; 100: a first encapsulation layer; 110: a first protective layer; 200: a second encapsulation layer; 300: a protective layer; 400: a third encapsulation layer; 500: a substrate.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
The present application is directed to solving, to some extent, one of the technical problems in the related art.
In one aspect of the present application, referring to fig. 1, the present application proposes an organic light emitting display panel 1000 including: the substrate 500, and a plurality of organic light emitting diodes 10 located on the substrate 500, the package structure packages the organic light emitting diodes 10 on the substrate 500, the package structure includes: a first encapsulation layer 100, wherein the first encapsulation layer 100 is located on a side of the organic light emitting diode 10 away from the substrate 500. And a second encapsulation layer 200, wherein the second encapsulation layer 200 is located on the side of the first encapsulation layer 100 away from the organic light emitting diode 10 and is formed by a polymer material. And a protection layer 300 located on a side of the second packaging layer 200 away from the first packaging layer 100. And a third encapsulation layer 400, wherein the third encapsulation layer 400 is located on the side of the protection layer 300 far away from the second encapsulation layer 200, and the porosity of the protection layer 300 is greater than that of the third encapsulation layer 400. Because the porosity of the protective layer is lower, the process for forming the protective layer is milder than the process for forming the third packaging layer, so that the second packaging layer can be prevented from generating free oxygen-containing micromolecules due to severe working conditions such as high power and the like. Therefore, the influence of the third packaging layer forming process on the polymer material of the second packaging layer can be reduced through the arrangement of the protective layer, so that the influence of the free oxygen-containing small molecules escaping from the second packaging layer on the light-emitting characteristic of the light-emitting layer in the organic light-emitting diode is reduced. In conclusion, the display panel can improve and even solve the problem that partial pixel points are dark or bad after the reliability test of the thin film packaged display panel.
For convenience of understanding, the principle that the organic light emitting display panel can achieve the above advantageous effects is first briefly described with reference to fig. 2, 3 and 4:
as described above, after the organic light emitting display panel packaged by the conventional TFE process is subjected to a dependency test, a phenomenon that some pixels are dark or defective may occur, for example, the above-mentioned defects occur at blue and green pixels, which is also called as cyan dot defects. The inventors have found that the defect is mainly caused by defects in the first encapsulation layer, and the second encapsulation layer generates free oxygen-containing small molecules during the formation of the encapsulation structure. Specifically, when the metal mask is used for carrying out the evaporation coating operation for forming the organic light-emitting diode, the metal mask can be scratched with a supporting piece on the periphery of the organic light-emitting diode when being aligned before evaporation coating, so that residual materials such as light-emitting layer materials on the mask are scattered and gathered around a pixel area to form a supporting piece foreign body, and the supporting piece foreign body can cause abnormal packaging, so that the first packaging layer is damaged, and the packaging effect of the first packaging layer is influenced. As shown in FIG. 3, where CVD1 is the first encapsulation layer and IJP is the second encapsulation layerPS is a support, AND is an anode of the organic light emitting diode. It can be seen that, as shown in fig. 3, after the support PS and the metal mask are scratched, the luminescent layer material is scattered and gathered in the area indicated by the dashed line box close to the arrow in the figure, and an abnormal protrusion (as indicated by the arrow in the figure) is formed. The abnormal protrusion penetrates through the light emitting layer of the organic light emitting diode to the region between the second packaging layers, i.e. the first packaging layer cannot form a flat surface with uniform chemical composition in the packaging process, i.e. the first packaging layer has a packaging defect with non-uniform packaging layer thickness. It is evident from fig. 3 that the thickness of the first encapsulation layer is not uniform throughout, wherein defects occur where the thickness of the first encapsulation layer is thinner, because the thickness of the first encapsulation layer at the defect is not sufficient, so that water and oxygen are not blocked well. If the second packaging layer generates free oxygen-containing small molecules escaping from the second packaging layer due to the influence of the subsequent process, the escaping free oxygen-containing small molecules can enter the organic light-emitting diode along the defect of the first packaging layer, and the organic light-emitting diode is adversely affected by the escaping free oxygen-containing small molecules. Since the composition material of the second encapsulation layer is usually polymethyl methacrylate (PMMA), the molecular formula is: - [ CH2C(CH3)(COOCH3)]n-The structural formula of the monomer forming the macromolecule is as follows:
it can be seen that the monomer structure contains carbon-oxygen double bonds, which can be broken under the influence of the plasma enhanced chemical deposition process conditions used for forming the third encapsulation layer to generate free oxygen-containing small molecules. The free oxygen-containing small molecules enter the light-emitting layer of the organic light-emitting diode along the path of the support foreign matters, so that the material of the light-emitting layer of the organic light-emitting diode is oxidized, and finally, the problem that partial pixel points are dark or poor after the reliability test occurs.
In the display panel according to the embodiment of the invention, the protective layer is additionally arranged between the second packaging layer and the third packaging layer, and the porosity of the protective layer is smaller than that of the third packaging layer. Therefore, the deposition power for forming the protective layer is also smaller than that of the third packaging layer, so that the negative effect on the material of the second packaging layer can be effectively reduced by the protective layer formed by lower deposition power, the generation of free oxygen-containing micromolecules escaping from the second packaging layer is reduced or even prevented, the influence of the escaping free oxygen-containing micromolecules on the material of the light-emitting layer in the organic light-emitting diode can be further prevented, and the problem that part of pixel points are dark or bad after the reliability test of the display panel is improved. And, the improvement does not involve the improvement of the deposition process of the support and the light emitting layer, so that the advantages of higher compatibility, no obvious increase of production cost and the like are achieved.
It should be noted that, for simplicity, the support part is not shown in fig. 1, 2, 4, and 5, but only the substrate, the organic light emitting diode, and the encapsulation structure are shown. It will be appreciated by those skilled in the art that fig. 1, 2, 4, 5 are for ease of understanding only and are not to be construed as limiting the distribution and shape of the supports.
According to an embodiment of the present invention, the polymer material forming the second encapsulation layer is not particularly limited as long as it can perform the functions of planarizing and improving the overall encapsulation effect of the encapsulation layer. For example, the polymer material forming the second encapsulation layer may contain carbon-oxygen double bonds, and specifically, may be PMMA.
According to some embodiments of the present invention, the specific chemical composition of the protective layer and the third encapsulation layer is not particularly limited as long as it can perform an encapsulation function. For example, both chemical compositions may be the same. The composition of the protective layer and the third encapsulation layer can be selected by those skilled in the art according to actual needs. It should be specifically noted that "the same chemical composition" in the present application should be understood in a broad sense, that is, the two have the same chemical composition as the main component, or the two have the substantially same chemical composition, and may have errors within the allowable range or contain impurities within the allowable range, which can be understood by those skilled in the art. Specifically, both the protective layer and the third encapsulation layer may be formed of silicon nitride. The silicon nitride material has a good packaging effect, and can prevent external water and oxygen from entering the inside of the packaging layer to damage the organic light-emitting diode. Moreover, when the chemical compositions of the protective layer and the third packaging layer are the same, the light emitting effect of the packaging layer is not affected by the addition of the protective layer, namely: the light-emitting effect of the packaging structure with the protective layer added is basically the same as that of the packaging structure without the protective layer, and the third packaging layer is directly arranged on the second packaging layer. The organic light emitting display panel provided by the present application does not need to adjust the microcavity structure of the organic light emitting diode, that is, the organic light emitting display panel provided by the present application can improve the reliability and keep the light emitting effect unaffected.
According to the embodiment of the present invention, the thicknesses of the protective layer and the third encapsulation layer are not particularly limited, for example, the sum of the thickness of the protective layer and the thickness of the third encapsulation layer may be in a range of 0.65 to 0.7 micrometers, and the thickness of the protective layer may be in a range of 0.05 to 0.1 micrometers. Specifically, the protective layer may also be formed by a plasma vapor deposition process. When the thickness of the protective layer is less than 0.05 μm, the protective layer is difficult to form a flat and complete surface, and cannot achieve the effect of the second packaging layer. As mentioned above, the porosity of the protective layer is lower than that of the third encapsulation layer, and thus, it can be understood by those skilled in the art that the protective layer has a weaker ability to prevent the intrusion of external water and oxygen than the third encapsulation layer. Therefore, in order to ensure the capability of the package structure to prevent the external water and oxygen from corroding the organic light emitting diode, the third package layer needs to have a certain thickness. At this time, if the thickness of the protection layer is greater than 0.1 μm, the overall thickness of the protection layer and the third encapsulation layer will be too thick, the process time is long, and the mass production capacity is affected. The inventor finds that on the premise that the thickness range of the protective layer is 0.05-0.1 micrometer, when the sum of the thickness of the protective layer and the thickness of the third packaging layer is less than 0.65 micrometer, the third packaging layer cannot achieve the effect of blocking external water and oxygen, and the packaging performance is poor. When the sum of the thickness of the protective layer and the thickness of the third packaging layer is greater than 0.7 micrometer, the third packaging layer blocks the light emitted by the organic light emitting diode, and the final display effect is influenced.
According to an embodiment of the present invention, the composition material of the first encapsulation layer is not particularly limited, and for example, silicon oxynitride may be included in the composition material of the first encapsulation layer. Specifically, when the material forming the first package layer is silicon oxynitride, the nitrogen content in the silicon oxynitride is low, and the refractive index is low, so that the light emitting effect is favorably improved when the organic light emitting diode is attached.
According to some embodiments of the present invention, referring to fig. 5, a first protection layer 110 may be further included on a side of the first encapsulation layer 100 away from the organic light emitting diode 10. As described above, the flatness of the first encapsulation layer 100 is affected and has defects due to the support foreign matter 20, so that the addition of the first protection layer 110 can further prevent the escaping free oxygen-containing small molecules in the second encapsulation layer 200 or the water and oxygen in the environment from entering the interior of the encapsulation structure through the defects of the first encapsulation layer, thereby reducing the influence on the light emitting layer material in the organic light emitting diode 10.
According to an embodiment of the present invention, a constituent material forming the first protective layer is not particularly limited, and for example, a material forming the first protective layer may include silicon nitride. Specifically, when the material forming the first protection layer is silicon nitride, the better water and oxygen barrier property of the silicon nitride can be utilized to achieve the packaging effect.
According to some embodiments of the present invention, the thickness of the first protective layer and the thickness of the first encapsulation layer are not particularly limited, for example, the sum of the thickness of the first protective layer and the thickness of the first encapsulation layer may range from 1.0 to 1.1 micrometers, and the thickness of the first protective layer may range from 0.05 to 0.15 micrometers. Specifically, when the thickness of the first protective layer is less than 0.05 μm, the first protective layer cannot block free oxygen-containing small molecules escaping from the second encapsulation layer, and cannot play a role in isolating water and oxygen. When the thickness of the first protective layer is greater than 0.15 micrometer, the refractive index of the silicon nitride is higher, and the light emitting effect of the organic light emitting diode is influenced. The inventor finds that on the premise that the thickness range of the first protective layer is 0.05-0.15 micrometers, when the sum of the thickness of the first protective layer and the thickness of the first packaging layer is less than 1.0 micrometer, the thickness of the layer is too thin, and the packaging effect cannot be achieved. When the sum of the thickness of the first protective layer and the thickness of the first packaging layer is larger than 1.1 micrometers, the thickness of the layer is too thick, and the light emitting effect of the organic light emitting diode is affected.
In another aspect of the present invention, the present invention provides a method for manufacturing an organic light emitting display panel, which can have the same features and advantages as those of the organic light emitting display panel described above, and therefore, the description thereof is omitted. The protective layer and the third packaging layer are formed by deposition process independently, and the deposition power for forming the protective layer is less than that for forming the third packaging layer. In summary, the porosity of the protective layer is low, so that the process for forming the protective layer is milder than the process for forming the third packaging layer, and the second packaging layer can be prevented from generating free oxygen-containing micromolecules under severe working conditions such as high power. Therefore, the influence of the third packaging layer forming process on the polymer material of the second packaging layer can be reduced through the arrangement of the protective layer, so that the influence of the free oxygen-containing small molecules escaping from the second packaging layer on the light-emitting characteristic of the light-emitting layer in the organic light-emitting diode is reduced. In conclusion, the display panel can improve and even solve the problem that partial pixel points are dark or bad after the reliability test of the thin film packaged display panel.
Specifically, the method comprises the following steps: referring to fig. 6, the method may include the steps of:
s100: forming a first packaging layer on the side of the organic light emitting diode far away from the substrate
According to an embodiment of the invention, a first encapsulation layer is formed at this step. The first packaging layer is close to the organic light-emitting diode and needs to be matched with the organic light-emitting diode microcavity to emit light. The material forming the first encapsulation layer should have a low refractive index, for example the material forming the first encapsulation layer may be silicon oxynitride. The process of forming the first encapsulation layer is not particularly limited, and may be, for example, a plasma enhanced chemical deposition process. Specifically, a plasma enhanced chemical deposition process may be used to form the first encapsulation layer on the side of the oled away from the substrate, using silicon oxynitride as a raw material.
S200: forming a second packaging layer on the side of the first packaging layer far away from the organic light-emitting diode
According to an embodiment of the invention, a second encapsulation layer is formed at this step. The second encapsulating layer mainly functions as a flat surface, and the second encapsulating layer should be formed from a material having good uniformity and film-forming property, and may be, for example, a polymer material containing carbon-oxygen double bonds, and specifically, the polymer may be polymethyl methacrylate. The process of forming the second encapsulation layer is not particularly limited, and may be, for example, inkjet printing. Specifically, an inkjet printing process may be used to form the second encapsulation layer on the side of the first encapsulation layer away from the organic light emitting diode, using polymethyl methacrylate as a raw material.
S300: forming a protective layer on the side of the second packaging layer far away from the first packaging layer
According to the embodiment of the invention, the protective layer is formed in the step, and the deposition power for forming the protective layer is less than that of the third encapsulation layer, so that the negative effect on the material of the second encapsulation layer can be effectively reduced by the protective layer formed with lower deposition power, the generation of the free oxygen-containing small molecules escaping from the second encapsulation layer can be reduced and even prevented, and the influence of the escaping free oxygen-containing small molecules on the material of the light-emitting layer in the organic light-emitting diode can be further prevented. The chemical composition of the protective layer may be the same as that of the third encapsulation layer, so that the increase of the protective layer does not affect the light emitting condition of the organic light emitting diode. The process of preparing the protective layer is a deposition process, and particularly, the process of preparing the protective layer may be a plasma enhanced chemical deposition process. As will be understood by those skilled in the art, deposition power refers to plasma power.
According to the embodiment of the invention, the deposition power when the protective layer is formed is less than the deposition power when the third encapsulation layer is formed, for example, the ratio of the deposition power when the protective layer is formed to the deposition power when the third encapsulation layer is formed may be in the range of 0.8 to 0.85. The porosity of the protective layer can be adjusted by limiting the deposition power, the water-oxygen barrier effect and the light extraction effect of the protective layer are further adjusted, and the energy consumption in the process can be reduced.
According to the embodiment of the present invention, the material forming the protective layer is not particularly limited as long as it has a good water oxygen barrier property and a good light transmission effect. For example, the material forming the protective layer may include silicon nitride, and specifically, the material forming the protective layer may be silicon nitride.
S400: forming a third packaging layer on the side of the protective layer far away from the second packaging layer
According to an embodiment of the invention, a third encapsulation layer is formed at this step. The third package has the effect of blocking external water and oxygen and is made of a material with better water and oxygen blocking performance. The third packaging layer can also be formed by plasma enhanced chemical vapor deposition, and the plasma power for forming the third packaging layer can be larger than the plasma power for forming the protective layer. Therefore, the chemical composition of the material forming the protective layer and the material forming the third packaging layer are the same, and the porosity of the protective layer is larger than that of the third packaging layer. For example, the material forming the third encapsulation layer may include silicon nitride, and specifically, the material forming the third encapsulation layer may be silicon nitride. Therefore, the third packaging layer with better compactness can be formed by higher power, and the generation of the escaping free oxygen-containing micromolecules caused by the direct action of the high-power process on the second packaging layer formed by organic matters can be avoided.
According to an embodiment of the present invention, the thickness of the third encapsulation layer and the thickness of the protection layer are not particularly limited, for example, the sum of the thickness of the third encapsulation layer and the thickness of the protection layer ranges from 0.65 to 0.7 micrometers, and the thickness of the protection layer ranges from 0.05 to 0.1 micrometers.
S10: forming organic light emitting diodes on a substrate
According to an embodiment of the present invention, before forming the first encapsulation layer, the method further includes forming an organic light emitting diode on the substrate, and a process of forming the organic light emitting diode is not particularly limited, for example, the process of forming the organic light emitting diode includes an evaporation process.
According to an embodiment of the present invention, before forming the first encapsulation layer, the method further includes forming a support on the substrate, and the process of forming the organic light emitting diode in which the support functions as a support is not particularly limited, for example, the process of forming the organic light emitting diode includes an evaporation process.
It will be appreciated by those skilled in the art that the method may also include the necessary steps of forming the support members, such as forming the support members, cushioning layers, etc. The specific operation of forming the support and the like is not particularly limited, and the skilled person can select a familiar process to realize the preparation of the support and the like according to the actual needs.
In order to further reduce the influence of the free oxygen-containing small molecules escaping from the second encapsulating layer on the material of the light-emitting layer in the organic light-emitting diode, referring to fig. 7, a first protecting layer may be formed on the side of the first encapsulating layer away from the organic light-emitting diode.
S110: forming a first protective layer on the side of the first packaging layer far away from the organic light-emitting diode
According to an embodiment of the present invention, the first protective layer is formed at this step. The material forming the first protective layer is not particularly limited, and for example, the material forming the first protective layer includes silicon nitride, and specifically, the material forming the first protective layer may be silicon nitride.
According to an embodiment of the present invention, the thickness of the first encapsulation layer and the thickness of the first protection layer are not particularly limited, for example, the sum of the thickness of the first encapsulation layer and the thickness of the first protection layer may range from 1.0 to 1.1 micrometers, and the thickness of the first protection layer may range from 0.05 to 0.15 micrometers.
It will be understood by those skilled in the art that when the method includes the operation of forming the first protective layer, the subsequently formed second encapsulating layer is located on top of the first protective layer, i.e., the second encapsulating layer is now located on the side of the first encapsulating layer away from the organic light emitting diode, and is also located on the side of the first protective layer away from the first encapsulating layer.
In yet another aspect of the present invention, a display device is provided that includes a front display panel. Therefore, the display device has all the features and advantages of the display panel, and the description thereof is omitted.
The following embodiments are provided to illustrate the present application, and should not be construed as limiting the scope of the present application. The examples, where specific techniques or conditions are not indicated, are to be construed according to the techniques or conditions described in the literature in the art or according to the product specifications. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products commercially available.
Example 1
1. An organic light emitting diode is formed on a substrate.
2. And forming a first packaging layer, wherein the material of the first packaging layer is silicon oxynitride, and the thickness of the first packaging layer is 0.9 microns.
3. And forming a second packaging layer, wherein the material of the second packaging layer is polymethyl methacrylate.
4. And forming a protective layer, wherein the protective layer is made of silicon nitride and has the thickness of 0.06 micrometer.
5. And forming a third packaging layer, wherein the material of the third packaging layer is silicon nitride, and the thickness of the third packaging layer is 0.6 microns.
The results show that: the reliability test is carried out at 85 ℃ and 85% humidity, and after 240 hours of test, the display performance of the display panel is good, and the phenomenon of poor reliability pixel points does not occur.
Example 2
1. An organic light emitting diode is formed on a substrate.
2. And forming a first packaging layer, wherein the material of the first packaging layer is silicon oxynitride, and the thickness of the first packaging layer is 0.9 microns.
3. And forming a first protective layer, wherein the material of the first protective layer is silicon nitride, and the thickness of the first protective layer is 0.12 microns.
4. And forming a second packaging layer, wherein the material of the second packaging layer is polymethyl methacrylate.
5. And forming a protective layer, wherein the protective layer is made of silicon nitride and has the thickness of 0.06 micrometer.
6. And forming a third packaging layer, wherein the material of the third packaging layer is silicon nitride, and the thickness of the third packaging layer is 0.6 microns.
The results show that: the reliability test is carried out at 85 ℃ and 85% humidity, and the display panel has good display performance after 360-hour test, and the phenomenon of poor reliability pixel points does not occur.
Comparative example 1
1. An organic light emitting diode is formed on a substrate.
2. And forming a first packaging layer, wherein the material of the first packaging layer is silicon oxynitride, and the thickness of the first packaging layer is 0.9 microns.
3. And forming a second packaging layer, wherein the material of the second packaging layer is polymethyl methacrylate.
4. And forming a third packaging layer, wherein the material of the third packaging layer is silicon nitride, and the thickness of the third packaging layer is 0.6 microns.
The results show that: the reliability test is carried out at 85 ℃ and 85% humidity, and after the test for 200 hours, the display performance of the display panel is poor, and the phenomenon of poor reliability pixel points occurs.
In the description of the present invention, the terms "upper", "lower", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention but do not require that the present invention must be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description herein, references to the description of "one embodiment," "another embodiment," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
Claims (11)
1. An organic light emitting display panel, comprising:
a substrate, and a plurality of organic light emitting diodes on the substrate,
an encapsulation structure encapsulating the organic light emitting diode on the substrate, the encapsulation structure comprising:
the first packaging layer is positioned on one side, far away from the substrate, of the organic light emitting diode;
the second packaging layer is positioned on one side of the first packaging layer far away from the organic light-emitting diode and is formed by a polymer material;
the protective layer is positioned on one side, far away from the first packaging layer, of the second packaging layer;
a third packaging layer, the third packaging layer is positioned on one side of the protection layer far away from the second packaging layer,
the porosity of the protective layer is greater than the porosity of the third encapsulation layer.
2. The panel of claim 1, wherein the chemical composition of the protective layer is the same as the chemical composition of the third encapsulation layer.
3. The panel of claim 1, wherein the sum of the thickness of the protective layer and the thickness of the third encapsulation layer ranges from 0.65 to 0.7 micrometers, and the thickness of the protective layer ranges from 0.05 to 0.1 micrometers.
4. The panel of claim 1, wherein the first encapsulation layer comprises a constituent material comprising silicon oxynitride.
5. The panel of claim 1, wherein the side of the first encapsulant layer remote from the organic light emitting diode further comprises a first protective layer.
6. The panel of claim 5, wherein the first protective layer comprises a material comprising silicon nitride.
7. The panel of claim 5, wherein the sum of the thickness of the first protective layer and the thickness of the first encapsulant layer is in the range of 1.0 to 1.1 microns, and the thickness of the first protective layer is in the range of 0.05 to 0.15 microns.
8. A method of making an organic light emitting display panel, comprising:
forming a first packaging layer on one side of the organic light-emitting diode, which is far away from the substrate;
forming a second encapsulation layer on a side of the first encapsulation layer away from the organic light emitting diode, the second encapsulation layer being formed of a polymer material;
forming a protective layer on one side of the second packaging layer far away from the first packaging layer;
forming a third packaging layer on the side of the protection layer far away from the second packaging layer,
wherein the protective layer and the third encapsulation layer are respectively and independently formed by a deposition process, and the deposition power for forming the protective layer is less than the deposition power for forming the third encapsulation layer.
9. The method according to claim 8, wherein the deposition process is a plasma enhanced chemical deposition process, the deposition power is a plasma power, and a ratio of the deposition power when forming the protective layer to the deposition power when forming the third encapsulation layer is in a range of 0.8 to 0.85.
10. The method of claim 8, wherein the material forming the protective layer and the material forming the third encapsulation layer are chemically the same, and wherein the porosity of the protective layer is greater than the porosity of the third encapsulation layer.
11. A display device characterized by comprising the display panel according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010866345.0A CN111785768A (en) | 2020-08-25 | 2020-08-25 | Organic light-emitting display panel, preparation method and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010866345.0A CN111785768A (en) | 2020-08-25 | 2020-08-25 | Organic light-emitting display panel, preparation method and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111785768A true CN111785768A (en) | 2020-10-16 |
Family
ID=72761698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010866345.0A Pending CN111785768A (en) | 2020-08-25 | 2020-08-25 | Organic light-emitting display panel, preparation method and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111785768A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022261870A1 (en) * | 2021-06-16 | 2022-12-22 | 京东方科技集团股份有限公司 | Display panel and display apparatus |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1347265A (en) * | 2001-06-14 | 2002-05-01 | 中国科学院上海冶金研究所 | Protecting film of organic luminescent device and its packaging method |
| CN109285958A (en) * | 2017-07-19 | 2019-01-29 | 上海和辉光电有限公司 | Organic light-emitting display device and preparation method |
| CN109427992A (en) * | 2017-08-28 | 2019-03-05 | 昆山国显光电有限公司 | Thin-film packing structure and display device with it |
| CN110518146A (en) * | 2019-08-30 | 2019-11-29 | 京东方科技集团股份有限公司 | Thin-film packing structure and display panel |
-
2020
- 2020-08-25 CN CN202010866345.0A patent/CN111785768A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1347265A (en) * | 2001-06-14 | 2002-05-01 | 中国科学院上海冶金研究所 | Protecting film of organic luminescent device and its packaging method |
| CN109285958A (en) * | 2017-07-19 | 2019-01-29 | 上海和辉光电有限公司 | Organic light-emitting display device and preparation method |
| CN109427992A (en) * | 2017-08-28 | 2019-03-05 | 昆山国显光电有限公司 | Thin-film packing structure and display device with it |
| CN110518146A (en) * | 2019-08-30 | 2019-11-29 | 京东方科技集团股份有限公司 | Thin-film packing structure and display panel |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022261870A1 (en) * | 2021-06-16 | 2022-12-22 | 京东方科技集团股份有限公司 | Display panel and display apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107731873B (en) | Color film substrate and manufacturing method thereof and OLED display device | |
| US8557325B2 (en) | Full color OLED and method of fabricating the same | |
| US9013099B2 (en) | Organic electroluminescent apparatus | |
| TWI388078B (en) | Method for manufacturing electronic components and electronic components | |
| US8680766B2 (en) | Organic electroluminescence display device and manufacturing method thereof | |
| KR100656496B1 (en) | full color OLED and fabricating method of the same | |
| US20070003743A1 (en) | Color filter substrate for organic EL element | |
| KR20070061381A (en) | Emissive device, process for producing emissive device, and electronic apparatus | |
| US20220285455A1 (en) | Display panel, manufacturing method thereof and display device | |
| US20120126688A1 (en) | Electroluminescent device | |
| CN109830515B (en) | Display panel and display device | |
| US11937481B2 (en) | Display substrate, manufacturing method thereof, and display device | |
| CN111785768A (en) | Organic light-emitting display panel, preparation method and display device | |
| EP3598502B1 (en) | Package structure, display panel and display device | |
| KR101347471B1 (en) | Organic el device and method of manufacturing organic el device | |
| US11805670B2 (en) | Packaging structure for display substrate, packaging method and display device | |
| US9570709B2 (en) | Method for manufacturing ultrathin organic light-emitting device | |
| US7030557B2 (en) | Display device with passivation structure | |
| CN111029480A (en) | Bottom emission display substrate, manufacturing method and display device | |
| US20240049512A1 (en) | Display panel, manufacturing method thereof, and display terminal | |
| US11991899B2 (en) | Display panel, including a scattering layer with micropores preparation method, and display device | |
| JP2013214427A (en) | Display device | |
| CN102097454A (en) | OLED (Organic Light Emitting Diode) display and manufacturing method thereof | |
| JP2007311277A (en) | Organic el element | |
| US20210351379A1 (en) | Display panel and method for fabricating same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201016 |