CN111778530A - Nickel plating solution additive, nickel plating solution and electroplating process - Google Patents
Nickel plating solution additive, nickel plating solution and electroplating process Download PDFInfo
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- CN111778530A CN111778530A CN202010805999.2A CN202010805999A CN111778530A CN 111778530 A CN111778530 A CN 111778530A CN 202010805999 A CN202010805999 A CN 202010805999A CN 111778530 A CN111778530 A CN 111778530A
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
- C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
- C25D3/16—Acetylenic compounds
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- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
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Abstract
A nickel plating solution additive comprises a main polishing agent, a softening agent and coordination conductive salt. The components in the nickel plating solution additive have characteristics in high, medium and low current density regions, through the synergistic effect of the components, the main light agent can improve the brightness of a nickel plating layer, the softening agent can improve the brightness and flatness of the nickel plating layer and adjust the stress of the plating layer, the coordination conductive salt can refine the crystallization of the nickel layer, the uniform plating capacity and the metal ion impurity pollution resistance of the plating solution are improved, and the full-bright and leveled nickel plating layer is obtained.
Description
Technical Field
The invention belongs to the field of electroplating, and particularly relates to a nickel plating solution additive, a nickel plating solution and an electroplating process.
Background
The electroplating process mainly comprises a rack plating type and a barrel plating type. Rack plating is commonly used to plate expensive or large plated parts. Barrel plating is commonly used to plate small plated parts.
The nickel plating is an important plating species which is widely applied at present, and the existing nickel plating process is divided into acid nickel plating solution, alkaline nickel plating solution and neutral nickel plating solution from the acid-base part of the plating solution.
(1) Acid nickel plating solution: in the acidic nickel plating solution, nickel exists in the form of positively charged nickel hydrate ions. In the acidic nickel plating solution, nickel ions are easy to discharge and deposit on the cathode, the allowed cathode current density range is wide, a full bright and highly leveled nickel plating layer is easy to obtain, and the nickel plating layer can bear 8A/dm under strong air stirring2Of a cathodeThe excellent performances of high brightness and flatness and high deposition speed of the plating layer are particularly outstanding.
(2) Alkaline nickel plating solution: in the alkaline nickel plating solution, nickel and a complexing agent generate complex ions with stronger electronegativity. Under the alkaline environment, nickel complex ions have larger polarization in a cathode region and need graded discharge electrodeposition, and hydrogen can be separated out under higher current density, so that the coating is brittle. Therefore, the cathode current density of bright nickel plating under alkaline environment is not more than 2A/dm2. When the plating solution is weakly alkaline, nickel hydroxide is easily generated on the anode during electroplating, and the dissolution of the anode is influenced.
(3) Neutral nickel plating solution: in the neutral nickel plating solution, nickel ions and a complexing agent generate complex ions with electronegativity and medium strength. Under the neutral environment, the nickel complex ions have small polarization in the cathode region. At the current density of barrel plating, the nickel deposit has excellent brightness and leveling.
In the bright barrel plating nickel plating process, metal ions such as zinc ions are easily dissolved into a plating solution from a plated part under an acidic environment, so that a nickel plating layer becomes dark and black. In the neutral nickel solution, nickel ions and a complexing agent generate complex ions with medium electronegativity, and the nickel solution is suitable for barrel nickel plating production of zinc-aluminum alloy or steel; the neutral plating solution has wider tolerance to zinc impurities, so the method is particularly suitable for the electroplating processing of zinc-aluminum alloy.
During the electroplating process, various compounds adsorbed on the cathode or anode are continuously consumed, and the reduction or oxidation speed of various compounds on the electrode is different, so that the composition of the additive of the electroplating solution is a more complex system. In barrel plating, the components in the additive of the plating solution can form a synergistic effect and act on different current density areas, so that a bright and smooth plating layer can be obtained.
At present, the prior art can only obtain a semi-bright nickel plating layer by electroplating in a weak alkaline or neutral nickel plating process, and how to obtain a full-bright nickel plating layer with high leveling property by electroplating in a neutral solution is a hot problem in current research.
Disclosure of Invention
The invention aims to overcome the defects and shortcomings in the prior art and provide a nickel plating solution additive, wherein the nickel plating solution additive is used for electroplating nickel under a neutral condition, so that a nickel plating layer with full brightness and high leveling property can be obtained on a plated part.
The invention is realized by the following technical scheme: a nickel plating solution additive comprises a main light agent, wherein the main light agent comprises a first main light agent component, and the first main light agent component comprises one to three of benzenesulfonylimide salt, acetylenic compounds and alkylsulfopyridine humate salt; a main polishing agent second component, wherein the main polishing agent second component comprises one to three of alkyne alkyl ether, alkyne sulfonate and alkene alkyl sulfonate; the third component of the main polishing agent comprises one or two of alkynylamine and azathiocycle; the fourth component of the main polishing agent, the fourth component of the main polishing agent comprises one to three of aryl sulfonate, alkene alkyl sulfonate and aldehyde; the light stabilizer comprises a light stabilizer first component, a light stabilizer second component and a light stabilizer second component, wherein the light stabilizer second component comprises one to three of aryl sulfonate, alkynyl alkyl ether and aldehyde; the light stabilizer comprises a light stabilizer sixth component, wherein the light stabilizer sixth component comprises one to four of acetylene salt, butyl ether salt, acetylene amine compounds and sulfur-nitrogen heterocyclic compounds; a gloss reducing agent third component, the gloss reducing agent third component comprising a surfactant; the light stabilizer comprises a light stabilizer component A and a light stabilizer component B, wherein the light stabilizer component A comprises a light stabilizer component A and a light stabilizer component B, and the light stabilizer component B comprises a light stabilizer component B and a light stabilizer component B;
also includes a softening agent, the softening agent includes: a softener first component comprising one to three of arylsulfonylimide salts, acetylenic alkyl ethers, alkylaminopropyls; a softener second component, wherein the softener second component comprises one to three of acetylene sulfonate, alkene alkyl sulfonate and acetylene alkyl ether; a third component of a softening agent, wherein the third component of the softening agent comprises one or two of alkynylamine compounds and sulfur-nitrogen heterocyclic compounds; a fourth component of a softening agent, wherein the fourth component of the softening agent comprises one to three of aryl sulfonate, alkene alkyl sulfonate and aldehyde; a softening agent fifth component, wherein the softening agent fifth component comprises one to three of aryl sulfonate, alkynyl alkyl ether and aldehyde; the softening agent sixth component comprises one to four of acetylene salt, butyl ether salt, acetylene amine compounds and sulfur and nitrogen heterocyclic compounds; a softening agent seventh component, wherein the softening agent seventh component comprises one to four of acetylene salt, aldehyde, alkyl amino propyne and benzyl-alkyl alkynol pyridine inner salt;
also includes coordination conductive salt.
Compared with the prior art, the nickel plating solution additive is applied to a barrel plating process under a neutral environment, the components in the nickel plating solution additive have characteristics in a high current density area, a medium current density area and a low current density area respectively, the first component of the main brightener is easy to adsorb in the high current density area, the second component of the main brightener is easy to adsorb in the medium current density area, the third component of the main brightener is easy to adsorb in the low current density area, the fourth component of the main brightener can adsorb in the low current density area and the high current density area, the fifth component of the main brightener is easy to generate oxidation or reduction reaction on an electrode, the sixth component of the main brightener can improve the microscopic leveling performance of a plating layer, and the eighth component of the main brightener can adjust a desorption potential and coordinate competitive adsorption and induced adsorption of certain components of the additive; the first component of the softening agent is easy to adsorb in a high current density area, the second component of the softening agent is easy to adsorb in a medium current density area, the third component of the softening agent is easy to adsorb in a low current density area, the fourth component of the softening agent can adsorb in both the low current density area and the high current density area, the fifth component of the softening agent is easy to generate oxidation or reduction reaction on an electrode, the sixth component of the softening agent can improve the micro-leveling property of a plating layer, and the seventh component of the softening agent can adjust desorption potential and coordinate competitive adsorption and induced adsorption of certain components of additives. Through the synergistic effect of the components, the nickel plating solution additive can be used for barrel plating and nickel plating in a neutral environment to obtain a nickel plating layer with full brightness and high leveling property.
Further, the main brightening agent first component comprises six to eight of saccharin, propargyl alcohol propoxy ether, propargyl alcohol ethoxy ether, diethylaminopropyne, pyridinium propanesulfonate, propargyl alcohol, pyridinium hydroxypropanesulfonate and dimethylaminopropyne; the second component of the main light agent comprises three to four of butynediol diethoxy ether, butynediol monopropoxy ether, sodium propiolate, sodium allylsulfonate and sodium vinylsulfonate; the main light agent third component comprises two to three of sodium allylsulfonate, diethylamino propyne, sodium propyne sulfonate and s-hydroxyethyl isothiouronium salt; the fourth component of the main light agent comprises two to five of sodium benzene sulfinate, sodium propiolate, butynediol diethoxy ether, butynediol monopropoxy ether, sodium allyl sulfonate, sodium vinyl sulfonate and alkylsulfopyridine salt; the fifth component of the main light agent comprises one or two of formaldehyde, chloral hydrate and sodium benzene sulfinate; the sixth component of the main light agent comprises two to three of diethylamino propyne, butyl ether type humate, propane type humate and s-carboxyethyl isothiourea humate; the gloss reducing agent a seventh component comprising an anionic or nonionic surfactant; the eighth component of the main light agent comprises three to four of benzyl-methyl alkynol pyridine inner salt, propiolic salt, butyl ether salt, formaldehyde, dimethylamino propine and diethylamino propine. The main light agent is used for improving the brightness of the nickel coating.
Further, the first component of the softening agent comprises six to seven of saccharin, dibenzenesulfonyl imine, propargyl alcohol propoxy ether, propargyl alcohol ethoxy ether, diethylaminopropyne, pyridinium hydroxypropanesulfonate and dimethylamino propyne; the second component of the softening agent comprises three to four of butynediol diethoxy ether, sodium propiolate, sodium allylsulfonate and sodium vinylsulfonate; the third component of the softening agent comprises three to four of sodium allylsulfonate, diethylamino propyne, sodium propyne sulfonate, s-carboxyethyl isothiourea salt and diethylenetriamine; the fourth component of the softening agent comprises four to five of sodium benzene sulfinate, sodium propiolate, butynediol diethoxy ether, sodium allyl sulfonate and sodium vinyl sulfonate; the fifth component of the softening agent comprises one or two of formaldehyde, sodium benzene sulfinate and chloral hydrate; the sixth component of the softening agent comprises three to four of diethylamino propyne, butyl ether humate, propane sulfonic acid humate, formaldehyde and s-carboxyethyl isothiourea humate; the seventh component of the softening agent comprises four to five of diethylamino propine, propane salt, butyl ether salt, benzyl-methyl alkynol pyridine inner salt, formaldehyde and dimethylamino propine. The softening agent is used for improving the brightness and the flatness of the nickel coating and adjusting the stress of the coating.
Furthermore, each liter of the main light agent comprises 35-60g of phenylsulfonyl imide compounds, 5-15g of aryl sulfonate, 50-150g of alkenyl alkyl sulfonate, 78-89g of ether compounds, 0-2g of alcohol compounds, 40-60g of alkynyl sulfonate, 4-8g of alkyne compounds, 1-2g of aldehyde compounds, 10-15.1g of surfactant, 250g of pyridinium alkyl sulfonate, 2-4g of phosphonium alkyl ether and 2-3g of sulfur nitrogen heterocyclic compounds. The main polishing agent is used for optimizing the component concentration for improving the brightness of the nickel coating.
Each liter of softening agent comprises 90-110g of benzene sulfonyl imide compounds, 3-6g of aryl sulfonate, 150g of alkenyl alkyl sulfonate, 5-7g of ether compounds, 4-8g of alkynyl sulfonate, 0.3-0.6g of alkyne compounds, 1-3g of aldehyde compounds, 30-50g of pyridinium alkyl sulfonate, 0.05-0.3g of sulfur nitrogen heterocyclic compounds and 0.02-0.15g of polyethylene polyamine compounds. The softening agent is used for improving the brightness and the flatness of the nickel coating and adjusting the stress of the coating to optimize the component concentration.
Furthermore, each liter of the main light agent comprises 20-50g of saccharin, 0-20g of dibenzenesulfonylimide, 5-15g of sodium benzene sulfinate, 60-100g of sodium allylsulfonate, 5-10g of butynediol diethoxy ether, 30-60g of propiolic alcohol ethoxy ether, 20-40g of propiolic alcohol propoxy ether, 0-2g of propiolic alcohol, 30-60g of sodium propiolic sulfonate, 4-8g of diethylaminopropyne, 1-2g of formaldehyde, 10-15g of sodium isethionate, 0-0.1g of sodium dodecyl sulfate, 0-20g of pyridinium propane sulfonate, 250g of pyridinium hydroxy propane sulfonate, 2-4g of butylcellosolve salt and 2-3g of s-carboxyethylisothiouronium sulfonate. The main light agent is used for enabling the nickel coating to achieve better brightness.
Furthermore, each liter of softener comprises 40-50g of saccharin, 40-60g of dibenzenesulfonyl imide, 3-6g of sodium benzene sulfinate, 180g of sodium allyl sulfonate, 2-3g of butynediol diethoxy ether, 1-2g of propiolic alcohol ethoxy ether, 1-2g of propiolic alcohol propoxy ether, 4-8g of sodium propiolate, 0.3-0.6g of diethylaminopropyne, 1-3g of formaldehyde, 0-10g of pyridinium propanesulfonate, 0-50g of pyridinium carboxypropanesulfonate, 0.05-0.3g of s-carboxyethylisothiouronium salt and 0.02-0.15g of diethylenetriamine. The softening agent enables the nickel plating layer to be bright and have better flatness, and further adjusts the stress of the plating layer.
Further, the coordination conductive salt comprises one or more of citrate, gluconate and magnesium salt, and is used for improving the stability and the conductive capability of the plating solution.
Further, the coordination conductive salt comprises one or more of sodium citrate, potassium citrate, sodium gluconate, potassium gluconate and magnesium sulfate. The coordination conductive salt can refine the crystallization of the nickel coating, and improve the uniform plating capacity of the plating solution and the capacity of resisting metal ion impurity pollution.
Meanwhile, the invention also provides a nickel plating solution which is prepared by a nickel plating solution additive and a neutral solution containing nickel salt; the nickel plating solution additive is the nickel plating solution additive; the nickel plating solution comprises 0.1-0.2ml/L of main light agent, 8-10ml/L of softening agent and 180g/L of coordination conductive salt 130-; the nickel salt includes nickel sulfate heptahydrate and nickel chloride hexahydrate.
Compared with the prior art, the nickel plating solution of the invention is added with the nickel plating solution additive, so that a bright nickel plating layer with strong leveling property can be obtained.
Meanwhile, the invention also provides an electroplating process.
An electroplating process comprising the steps of: pre-treating a part to be plated; washing the parts with water, and then activating with weak acid; barrel plating nickel plating is carried out under the neutral condition; carrying out post-treatment; wherein the nickel plating solution used for barrel plating nickel plating is the nickel plating solution of the invention.
Compared with the prior art, the electroplating process provided by the invention adopts the nickel plating solution containing the nickel plating solution additive, so that a bright nickel plated product with strong leveling property can be obtained.
For a better understanding and practice, the present invention is described in detail below with reference to the following examples.
Detailed Description
The invention obtains the nickel plating solution additive applied to barrel plating nickel plating under the neutral condition and the electroplating process by researching the components and the proportion of the nickel plating solution additive, and obtains the nickel plating product with bright nickel plating layer and high leveling property. The following examples are intended to illustrate the details.
Example 1
The invention provides a nickel plating solution additive, which is applied to bright barrel plating nickel plating in a neutral environment in an electroplating process. The nickel plating solution additive comprises a main polishing agent, a softening agent and a coordination agent.
The primary light agent includes:
(ii) a primary light agent first component, said primary light agent first component being readily adsorbed in the high current density region, comprising: one to three of benzenesulfonylimide salt, acetylene compound and alkylsulfopyrimidine salt; the main light agent first component is selected from six to eight of saccharin, propargyl alcohol propoxy ether, propargyl alcohol ethoxy ether, diethylamino propyne, pyridinium propane sulfonate, propargyl alcohol, pyridinium hydroxy propane sulfonate and dimethylamino propyne;
the second component of the main light agent is easy to adsorb in a medium current density area and comprises one to three of alkyne alkyl ether, alkynyl sulfonate and alkene alkyl sulfonate; the main light agent second component is selected from three to four of butynediol diethoxy ether, butynediol monopropoxy ether, sodium propiolate, sodium allylsulfonate and sodium vinylsulfonate;
the third component of the main light agent is easy to adsorb in a low current density area and comprises one or two of alkyne amine and sulfur-nitrogen heterocycle; the organic compound which is easy to be adsorbed in the low current density area is selected from two to three of sodium allylsulfonate, diethylamino propyne, sodium propyne sulfonate and s-hydroxyethyl isothiourea;
fourthly, the fourth component of the main light agent can be adsorbed in a low-to-high current density area and comprises one to three of aryl sulfonate, alkene alkyl sulfonate and aldehyde; the fourth component of the main light agent is two to five of sodium benzene sulfinate, sodium propiolate, butynediol diethoxy ether, butynediol monopropoxy ether, sodium allyl sulfonate, sodium vinyl sulfonate and alkyl sulfo pyridine salt;
fifthly, a fifth component of the main light agent, wherein the fifth component of the main light agent is easy to generate oxidation or reduction reaction on the electrode and comprises one to three of aryl sulfonate, alkynyl alkyl ether and aldehyde; the fifth component of the main light agent is one or two selected from formaldehyde, chloral hydrate and sodium benzene sulfinate;
sixthly, a main polishing agent sixth component which can improve the microscopic leveling performance of the plating layer and comprises one to four of alkyne humate, butyl ether humate, alkyne amine compounds and sulfur nitrogen heterocyclic compounds; the sixth component of the main light agent is two to three selected from diethylamino propine, butyl ether humate, propane humate and s-carboxyethyl isothiourea humate;
seventhly, a seventh main light agent component which comprises an anionic or nonionic surfactant; the seventh component of the main light agent is one or two of hydroxyethyl sodium sulfonate, sodium dodecyl sulfate and sodium sulfosuccinate;
eighthly, an eighth main brightener component which can adjust desorption potential and coordinate competitive adsorption and induced adsorption of certain components of additives and comprises one to four of aldehydes, acetylene salt, benzyl-alkyl alkynol pyridine inner salt and alkyl amino propyne; the eighth component of the main light agent is three to four selected from benzyl-methyl alkynol pyridine inner salt, propiolic salt, butyl ether salt, formaldehyde, dimethylamino propine and diethylamino propine.
Preferably, the primary photosensitizer solution comprises per liter: 35-60g of phenylsulfonyl imine compounds, 5-15g of aryl sulfonate, 50-150g of alkenyl alkyl sulfonate, 78-89g of ether compounds, 0-2g of alcohol compounds, 40-60g of alkynyl sulfonate, 4-8g of alkyne compounds, 1-2g of aldehyde compounds, 10-15.1g of surfactant, 220-250g of pyridinium alkyl sulfonate, 2-4g of alkyl ether humate and 2-3g of sulfur nitrogen heterocyclic compounds.
Preferably, the brightener solution comprises, per liter: 20-50g of saccharin, 0-20g of dibenzenesulfonyl imine, 5-15g of sodium benzene sulfinate, 60-100g of sodium allylsulfonate, 5-10g of butynediol diethoxy ether, 30-60g of propiolic alcohol ethoxy ether, 20-40g of propiolic alcohol propoxy ether, 0-2g of propiolic alcohol, 30-60g of sodium propiolate, 4-8g of diethylaminopropiolic, 1-2g of formaldehyde, 10-15g of hydroxyethyl sodium sulfonate, 0-0.1g of sodium dodecyl sulfate, 0-20g of pyridinium propane sulfonate, 250g of pyridinium hydroxypropanesulfonate, 2-4g of butylcellosolve salt and 2-3g of s-carboxyethylisothiocarbonate salt.
The main light agent component classes are shown in table 1-1, the concentrations of different components can be configured according to specific requirements, but when the components belonging to the same class are configured, the total concentration after the summation needs to meet the concentration range of the class.
TABLE 1-1 Main photosensitizer classes
The softening agent comprises:
the softening agent comprises a first component, a second component and a third component, wherein the first component is easy to adsorb in a high current density area and comprises one to three of aryl sulfimide salt, alkyne alkyl ether and alkyne alkyl propyne; the softener first component is six to seven selected from saccharin, dibenzenesulfonyl imine, propiolic alcohol propoxy ether, propiolic alcohol ethoxy ether, diethylamino propine, pyridinium hydroxy propane sulfonate and dimethylamino propine;
a second component of the softening agent, wherein the second component of the softening agent is easily adsorbed in a medium current density region and comprises one to three of acetylene sulfonate, alkenyl sulfonate and acetylene alkyl ether; the second component of the softening agent is selected from three to four of butynediol diethoxy ether, sodium propiolate, sodium allylsulfonate and sodium vinylsulfonate;
a softening agent third component which is easy to adsorb in the low current density area and comprises one or two of alkynylamine compounds and sulfur-nitrogen heterocyclic compounds; the third component of the softening agent is selected from three to four of sodium allylsulfonate, diethylamino propyne, sodium propyne sulfonate, s-carboxyethyl isothiourea salt and diethylenetriamine;
fourthly, the fourth component of the softening agent can be adsorbed in a low-to-high current density area and comprises one to three of aryl sulfonate, alkene alkyl sulfonate and aldehyde; the fourth component of the softening agent is selected from four to five of sodium benzene sulfinate, sodium propiolate, butynediol diethoxy ether, sodium allyl sulfonate and sodium vinyl sulfonate;
fifthly, a softening agent fifth component, wherein the softening agent fifth component is easy to generate oxidation or reduction reaction on the electrode and comprises one to three of aryl sulfonate, alkynyl alkyl ether and aldehyde; the fifth component of the softening agent is one or two selected from formaldehyde, sodium benzene sulfinate and chloral hydrate;
sixthly, a softening agent which can improve the micro-leveling property of the plating layer and comprises one to four of acetylene salt, butyl ether salt, acetylene amine compounds and sulfur nitrogen heterocyclic compounds; the softening agent comprises a sixth component, wherein the sixth component is selected from three to four of diethylamino propyne, butyl ether humate, propane sulfonic acid humate, formaldehyde and s-carboxyethyl isothiourea humate;
seventh component of softening agent, wherein the seventh component of softening agent can adjust desorption potential and coordinate competitive adsorption and induced adsorption of some components of additives, and comprises one to three of acetylenic salt, aldehyde, alkyl amino propyne and benzyl-alkyl alkynol pyridine inner salt; the seventh component of the softening agent is selected from four to five of diethylamino propine, propane salt, butyl ether salt, benzyl-methyl alkynol pyridine inner salt, formaldehyde and dimethylamino propine.
Preferably, the softener solution comprises per liter: 90-110g of phenylsulfonyl imine compounds, 3-6g of aryl sulfonate, 150g of alkenyl alkyl sulfonate, 5-7g of ether compounds, 4-8g of alkynyl sulfonate, 0.3-0.6g of alkyne compounds, 1-3g of aldehyde compounds, 30-50g of alkyl pyridinium sulfonate, 0.05-0.3g of sulfur nitrogen heterocyclic compounds and 0.02-0.15g of polyethylene polyamine compounds.
Preferably, the softener solution comprises per liter: 40-50g of saccharin, 40-60g of dibenzenesulfonyl imine, 3-6g of sodium benzene sulfinate, 250g of sodium allylsulfonate, 2-3g of butynediol diethoxy ether, 1-2g of propiolic ethoxy ether, 1-2g of propiolic propoxy ether, 4-8g of sodium propiolate, 0.3-0.6g of diethylaminopropyne, 1-3g of formaldehyde, 0-10g of pyridinium propanesulfonate, 0-50g of pyridinium carboxypropanesulfonate, 0.05-0.3g of s-carboxyethylisothiouronium sulfonate and 0.02-0.15g of diethylenetriamine.
The classes of softeners are shown in tables 1-2, and the concentrations of the various ingredients can be configured according to specific needs.
TABLE 1-2 classes of softeners
The distribution conductive salt is composed of the following substances:
the citrate is selected from one of sodium citrate and potassium citrate;
② gluconate selected from one of sodium gluconate and potassium gluconate;
(iii) magnesium salt, selected from magnesium sulfate.
Preferably, the complex conducting salt comprises per kilogram: 1000g of citrate, 0-900g of gluconate and 0-30g of magnesium salt.
Preferably, the complex conducting salt per kilogram comprises: 1000g of sodium citrate 650-.
The nickel plating solution additive is added into a neutral solution containing nickel salt to prepare a nickel plating solution. The nickel plating solution comprises nickel salt, boric acid and sodium hydroxide, and also comprises a main light agent, a softening agent and an additive. Wherein the nickel plating solution comprises 0.1-0.2ml/L of main light agent, 8-10ml/L of softening agent and 180g/L of coordination conductive salt 130-; the nickel salt includes nickel sulfate heptahydrate and nickel chloride hexahydrate.
The components and the implementation conditions of the nickel plating solution are shown in tables 1-3:
TABLE 1-3 Nickel plating solution for barrel nickel plating under neutral environment and implementation conditions
Specifically, the preparation method of the nickel plating solution comprises the following steps: adding water into the plating tank to two thirds of the preset volume, heating to 55-65 ℃, adding the required nickel sulfate heptahydrate, nickel chloride hexahydrate, boric acid and coordination conductive salt, and stirring until the nickel sulfate heptahydrate, the nickel chloride hexahydrate, the boric acid and the coordination conductive salt are completely dissolved; dissolving the required sodium hydroxide with water in another container, adding into the tank in batches, measuring with a pH meter or precision test paper, adjusting the pH value of the plating solution to about 6.8, and adding water to the required volume; adding 0.5-1 ml/L30% hydrogen peroxide into the plating tank, stirring uniformly, keeping the temperature for 1-24h, adding 1g/L electroplating grade active carbon, continuing stirring for 0.5-1h, standing for 4-6h, and filtering; adding water to a predetermined volume, adding the main light agent and the softening agent, hanging on an iron plate conduction circuit, and using 0.6-1A/dm2The current can be used for trial production after electrolysis for 1-2 h.
The invention also provides an electroplating process for barrel plating nickel plating in a neutral environment, which comprises the following steps:
pre-treating a part to be plated; washing the parts with water, and then activating with weak acid; barrel plating nickel plating is carried out under the neutral condition; and (5) carrying out post-treatment. The nickel plating solution used in the barrel plating nickel plating includes a nickel plating solution additive, the nickel plating solution is the nickel plating solution described in this embodiment 1, and the nickel plating solution additive is the nickel plating solution additive described in this embodiment 1.
Specifically, the method comprises the following steps: pre-treating the part to be plated, and removing oil or rust to obtain a clean part to be plated;
washing the parts with water; activation with acid, optionally with dilute sulfuric acid;
preferably, electroplating copper to obtain a copper plating layer as a base layer of the nickel plating layer, recovering the plating solution after electroplating copper, and washing the part;
activation with acid, optionally with dilute sulfuric acid;
performing barrel plating nickel plating under a neutral condition to obtain a nickel plating layer, wherein a nickel plating solution used in the barrel plating nickel plating is the nickel plating solution described in the embodiment 1; recovering the nickel plating solution, and washing the parts with water;
and carrying out post-treatment according to the requirements of the actual process.
Wherein the part to be plated is a steel part to be plated or a zinc-aluminum alloy part to be plated.
Example 2
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in tables 2-1, 2-2 and 2-3.
TABLE 2-1 Primary light ingredient
TABLE 2-2 softener ingredients
TABLE 2-3 composition of complex conducting salts
Example 3
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in tables 3-1, 3-2 and 3-3.
TABLE 3-1 Primary light ingredient
TABLE 3-2 softener ingredients
TABLE 3-3 coordinate conducting salt compositions
Example 4
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in tables 4-1, 4-2 and 4-3.
TABLE 4-1 Primary light ingredient
TABLE 4-2 softener ingredients
TABLE 4-3 composition of complex conducting salts
Example 5
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in tables 5-1, 5-2 and 5-3.
TABLE 5-1 Primary light ingredient
TABLE 5-2 softener ingredients
TABLE 5-3 coordinate conducting salt compositions
Example 6
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in tables 6-1, 6-2 and 6-3.
TABLE 6-1 Primary light ingredient
TABLE 6-2 softener ingredients
TABLE 6-3 coordinate conducting salt compositions
Example 7
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in tables 7-1, 7-2 and 7-3.
TABLE 7-1 Primary light ingredient
TABLE 7-2 softener ingredients
TABLE 7-3 composition of complex conducting salts
Example 8
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in tables 8-1, 8-2 and 8-3.
TABLE 8-1 Primary light ingredient
TABLE 8-2 softener ingredients
TABLE 8-3 coordinate conducting salt compositions
Example 9
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in tables 9-1, 9-2 and 9-3.
TABLE 9-1 Primary light ingredient
TABLE 9-2 softener ingredients
TABLE 9-3 coordinate conducting salt compositions
Example 10
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in Table 10-1, Table 10-2 and Table 10-3.
TABLE 10-1 Main photosensitizer component
TABLE 10-2 softener ingredients
TABLE 10-3 coordinate conducting salt compositions
Example 11
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in tables 11-1, 11-2 and 11-3.
TABLE 11-1 Primary light ingredient
TABLE 11-2 softener ingredients
TABLE 11-3 coordinate conducting salt compositions
Example 12
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in tables 12-1, 12-2 and 12-3.
TABLE 12-2 Primary light ingredient
TABLE 12-2 softener ingredients
TABLE 12-3 coordinate conducting salt compositions
Example 13
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in tables 13-1, 13-2 and 13-3.
TABLE 13-1 Main photosensitizer component
TABLE 13-2 softener ingredients
TABLE 13-3 coordinate conducting salt compositions
Example 14
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in tables 14-1, 14-2 and 14-3.
TABLE 14-1 Primary light ingredient
TABLE 14-2 softener ingredients
TABLE 14-3 coordinate conducting salt compositions
Example 15
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in tables 15-1, 15-2 and 15-3.
TABLE 15-1 Primary light ingredient
TABLE 15-2 softener ingredients
TABLE 15-3 coordinate conducting salt compositions
Example 16
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in tables 16-1, 16-2 and 16-3.
TABLE 16-1 Primary light ingredient
TABLE 16-2 softener ingredients
TABLE 16-3 coordinate conducting salt compositions
Example 17
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in tables 17-1, 17-2 and 17-3.
TABLE 17-1 Primary light ingredient
TABLE 17-2 softener ingredients
TABLE 17-3 coordinate conducting salt compositions
Example 18
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in Table 18-1, Table 18-2 and Table 18-3.
TABLE 18-1 Primary light ingredient
TABLE 18-2 softener ingredients
TABLE 18-3 coordinate conducting salt compositions
Example 19
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in tables 19-1, 19-2 and 19-3.
TABLE 19-1 Primary light ingredient
TABLE 19-2 softener ingredients
TABLE 19-3 coordinate conducting salt compositions
Example 20
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in tables 20-1, 20-2 and 20-3.
TABLE 20-1 Main photosensitizer Components
TABLE 20-2 softener ingredients
TABLE 20-3 coordinate conducting salt compositions
Example 21
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in tables 21-1, 21-2 and 21-3.
TABLE 21-1 Primary light ingredient
TABLE 21-2 softener ingredients
TABLE 21-3 softener ingredients
Example 22
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in Table 22-1, Table 22-2 and Table 22-3.
TABLE 22-1 Main photosensitizer component
TABLE 22-2 softener ingredients
TABLE 22-3 softener ingredients
Example 23
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in tables 23-1, 23-2 and 23-3.
TABLE 23-1 Primary light ingredient
TABLE 23-2 softener ingredients
TABLE 23-3 softener ingredients
Example 24
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in Table 24-1, Table 24-2 and Table 24-3.
TABLE 24-1 Primary light ingredient
TABLE 24-2 softener ingredients
TABLE 24-3 softener ingredients
Example 25
The embodiment provides an additive used in neutral bright barrel nickel plating, which is applied to bright barrel nickel plating under a neutral environment in an electroplating process. The additives include a main gloss agent, a softening agent and a complexing agent as shown in tables 25-1, 25-2 and 25-3.
TABLE 25-1 Primary light ingredient
TABLE 25-2 softener ingredients
TABLE 25-3 softener ingredients
Example 26
The nickel plating solution additive is added into a neutral solution containing nickel salt to prepare a nickel plating solution, wherein the nickel plating solution comprises 150g/L of nickel sulfate heptahydrate 120-L, 20-30g/L of nickel chloride hexahydrate, 20-30g/L of boric acid, 180g/L of coordination conductive salt 130-L, 0.1-0.2ml/L of a main light agent, 8-10ml/L of a softening agent and the pH value is 6.7-7.2. The specific preparation method of the nickel plating solution is as described in example 1.
The nickel plating solution additives of examples 2 to 10, examples 12 to 15, examples 17 to 20 and examples 22 to 25 were prepared into nickel plating solutions in total 21 in the following three ways (formulation 1 to formulation 3), respectively, to obtain 63 kinds of nickel plating solutions. The proportion of the nickel plating solution is shown in table 26, the nickel plating solution is applied to an electroplating process to carry out barrel plating nickel plating in a neutral environment, and is suitable for steel parts to be plated or zinc-aluminum alloy parts to be plated, and the 63 nickel plating solutions are applied to barrel plating nickel plating in the neutral environment, so that a nickel plating product with a bright nickel plating layer and high leveling property can be obtained.
Watch 26
Electroplating in a Hull cell by using a test piece, and placing in a nickel plating solution for electroplating under the condition of inflation. 63 test pieces were taken out and plated, and the samples were made to correspond to the nickel plating solutions No. 1 to No. 63 prepared in example 26, respectively. The rolled brass sheet with the test piece size of 6.5 multiplied by 10cm is electroplated after the test piece is pretreated, and the electroplating time is 20 min/sheet each time. The nickel plating layers of the 63 test pieces obtained by the test were bright and had high leveling property.
Example 27
After the additive is prepared into nickel plating solution, barrel plating nickel plating is carried out in a neutral environment, and the barrel plating nickel plating is respectively carried out under acidic and alkaline conditions by adopting a conventional process. During electroplating, a copper plating layer is plated as a primer, and then nickel plating is carried out.
(1) Nickel coating brightness test of barrel nickel
The brightness ratio of the plated piece obtained by barrel plating nickel plating in acidic, alkaline and neutral environments is shown in table 27-1, wherein the nickel plating solution used in the barrel plating nickel plating in the neutral environment is the nickel plating solution of the invention, the pH value is 6.7-7.2: the nickel plating solution used in the acidic environment is acidic nickel plating solution, and the pH value is 3.8-4.8; the nickel plating solution used in the alkaline environment is a commercially available nickel plating solution, and the pH value is 8-9. From table 27-1, in the barrel plating, which is an electroplating process characterized by low current and slow deposition rate, bright to full bright nickel plating can be obtained by electroplating in the acidic nickel plating solution, and bright to full bright nickel plating can also be obtained by electroplating in the nickel plating solution of the present invention.
TABLE 27-1 contrast of coating luminance
(2) Coating deposition rate test
Barrel plating nickel under acidic, alkaline and neutral environments respectively, and barrel plating the test piece in a 100L test groove for 60 minutes within the process range, wherein the nickel plating solution used for barrel plating nickel under the neutral environment is the nickel plating solution of the invention, the pH value is 6.7-7.2: the nickel plating solution used in the acidic environment is a commercially available nickel plating solution, and the pH value is 3.8-4.8; the nickel plating solution used in the alkaline environment is a commercially available nickel plating solution, and the pH value is 8-9. The cathode deposition rate profiles for the three methods barrel plating nickel are shown in table 27-2:
TABLE 27-2 cathodic deposition Rate comparison
As can be seen from Table 27-1, in the barrel plating, which is a plating process characterized by a small current and a slow deposition rate, the deposition rate of plating in a commercially available acidic nickel plating solution is not significantly different from the plating rate of plating in the nickel plating solution of the present invention.
(3) Plating adhesion test
(ii) bending test of Single-layer coating
The binding force of the single-layer nickel coating is measured by a bending method: taking brass sheet with thickness of 0.2mm as test piece, barrel-plating nickel in the nickel plating solution, and cathode current density1A/dm2Electroplating for 60min, washing with water, drying, bending for 1 time to 180 degrees, repeatedly extruding at the folding position, and ensuring that the nickel plating layer is not broken, does not bubble and does not peel, so that the bonding force is good.
Cold-hot method test of single-layer coating
The binding force of the single-layer nickel coating is measured by a cold-hot method: surface area 0.25dm2Steel parts and surface area 0.3dm2Zinc-aluminium alloy parts are pretreated according to the technological requirements, and then barrel-plated with nickel in the nickel-plating solution of the invention, and the cathode current density is 1A/dm2Electroplating for 20min, taking out, drying, baking at 150 deg.C for 1 hr, taking out, and adding into cold water at room temperature. The steel part and the zinc-aluminum alloy part do not bubble or peel, and the binding force is good.
③ adhesion test of composite coating
After steel parts and zinc-aluminum alloy parts are pretreated according to the process requirements and plated with copper coatings, nickel is plated in the nickel plating solution, a bending method test and a cold-hot method test are carried out, the bonding force of the coating combination is detected, and the test mode and the evaluation standard are the same as those of the bending method test and the cold-hot method test of the single-layer coating in the embodiment. The results are shown in tables 27-3:
tables 27-3
From table 27-3, it can be seen that the plated article was plated with the copper plating layer and then with the nickel plating layer, the bonding force of the plated article was good at different plating layer thicknesses, the nickel plating layer did not break, blister or peel under the bending test, and blister or peel under the cold and hot test.
(4) Effect test of Zinc impurities
A0.2 mm thick brass plate was plated in a Hull cell at a total current of 0.5A for a period of 10min, and zinc sulfate solution was added to the Hull cell. When the content of zinc ions in the solution rises, part of the zinc ions are deposited on the part to be plated. When the appearance of the plating layer is the metal color of the nickel plating layer, the appearance of the plating layer is normal. When the appearance of the coating is light brown black or black, partial zinc ions are deposited on the nickel coating, and the obtained nickel coating is impure. The electric region is a short for current density region. The results are shown in tables 27-4:
tables 27-4
From tables 27-4, it can be seen that as the concentration of zinc ions increases, nickel plating is performed under acidic conditions when Zn is present2+When the concentration is more than or equal to 0.04g/L, the obtained nickel coating is brownish black or black, and the nickel coating is doped with zinc ions; electroplating Zn in the neutral nickel plating solution2+When the concentration is more than or equal to 0.5g/L, the obtained nickel plating layer is black. Namely, Zn is electroplated in the nickel plating solution of the invention2+The tolerance of impurities is higher than that of the acid nickel plating solution.
(5) Corrosion test of acid or neutral nickel plating solution on zinc-aluminum alloy parts
When the zinc-aluminum alloy part is immersed in the watt-type nickel plating solution sold in the market, the watt-type nickel plating solution is acidic, and zinc ions in the zinc-aluminum alloy part are easily dissolved in the solution in an acid solution, namely, the zinc-aluminum alloy part is corroded. Respectively immersing the zinc-aluminum alloy with the same surface area into the watt type nickel plating solution and the nickel plating solution of the invention, and detecting Zn in the solutions2+The concentration means the degree of corrosion of the zinc-aluminum alloy. The results are shown in tables 27 to 5. As can be seen from tables 27-5, after the zinc-aluminum alloy was immersed in the nickel plating bath, Zn was leached from the bath2+The concentration of the Zn in the watt type nickel plating solution is 2.5 to 3 times of that in the invention, and the dissolving speed of the Zn in the watt type nickel plating solution is 2.5 to 3 times of that in the invention, namely the invention is not easy to corrode the zinc-aluminum alloy parts.
Tables 27-5
(6) Pilot test effect on barrel plating productivity
100L of nickel plating solution is prepared, and a production pilot test is carried out according to the neutral bright barrel nickel plating process of the invention, under the barrel plating condition, steel parts and zinc-aluminum alloy parts both obtain bright nickel plating layers with good bonding force, and the deposition speed has no obvious difference compared with the acid nickel plating process.
Example 28
In this embodiment, the electroplating process provided by the present invention is used for electroplating steel parts or zinc-aluminum alloy parts, and compared with the acid barrel plating nickel plating process, the comparison results are shown in table 28:
watch 28
The nickel plating solution additive and the electroplating process can obtain a nickel plating product with bright nickel plating layer and high leveling property, the plating layer has fine crystallization, good bonding force with a matrix, higher plating uniformity and strong zinc impurity pollution resistance, and the electroplating solution does not contain lead, cadmium, mercury and hexavalent chromium and meets the environment-friendly electroplating requirement specified by European Union ROHS 2005/816/EC.
The present invention is not limited to the above-described embodiments, and various modifications and variations of the present invention are intended to be included within the scope of the claims and the equivalent technology of the present invention if they do not depart from the spirit and scope of the present invention.
Claims (10)
1. A nickel plating solution additive, comprising:
a primary light agent, the primary light agent comprising:
a main light agent first component, wherein the main light agent first component comprises one to three of benzene sulfonyl imide salt, alkyne compound and alkyl sulfo pyridine salt;
a main polishing agent second component, wherein the main polishing agent second component comprises one to three of alkyne alkyl ether, alkyne sulfonate and alkene alkyl sulfonate;
the third component of the main polishing agent comprises one or two of alkynylamine and azathiocycle;
the fourth component of the main polishing agent, the fourth component of the main polishing agent comprises one to three of aryl sulfonate, alkene alkyl sulfonate and aldehyde;
the light stabilizer comprises a light stabilizer first component, a light stabilizer second component and a light stabilizer second component, wherein the light stabilizer second component comprises one to three of aryl sulfonate, alkynyl alkyl ether and aldehyde;
the light stabilizer comprises a light stabilizer sixth component, wherein the light stabilizer sixth component comprises one to four of acetylene salt, butyl ether salt, acetylene amine compounds and sulfur-nitrogen heterocyclic compounds;
a gloss reducing agent third component, the gloss reducing agent third component comprising a surfactant;
the light stabilizer comprises a light stabilizer component A and a light stabilizer component B, wherein the light stabilizer component A comprises a light stabilizer component A and a light stabilizer component B, and the light stabilizer component B comprises a light stabilizer component B and a light stabilizer component B;
also includes a softening agent, the softening agent includes:
a softener first component comprising one to three of arylsulfonylimide salts, acetylenic alkyl ethers, alkylaminopropyls;
a softener second component, wherein the softener second component comprises one to three of acetylene sulfonate, alkene alkyl sulfonate and acetylene alkyl ether;
a third component of a softening agent, wherein the third component of the softening agent comprises one or two of alkynylamine compounds and sulfur-nitrogen heterocyclic compounds;
a fourth component of a softening agent, wherein the fourth component of the softening agent comprises one to three of aryl sulfonate, alkene alkyl sulfonate and aldehyde;
a softening agent fifth component, wherein the softening agent fifth component comprises one to three of aryl sulfonate, alkynyl alkyl ether and aldehyde;
the softening agent sixth component comprises one to four of acetylene salt, butyl ether salt, acetylene amine compounds and sulfur and nitrogen heterocyclic compounds;
a softening agent seventh component, wherein the softening agent seventh component comprises one to four of acetylene salt, aldehyde, alkyl amino propyne and benzyl-alkyl alkynol pyridine inner salt;
also includes coordination conductive salt.
2. The nickel plating solution additive according to claim 1, wherein:
the main light agent first component comprises six to eight of saccharin, propargyl alcohol propoxy ether, propargyl alcohol ethoxy ether, diethylaminopropyne, pyridinium propanesulfonate, propargyl alcohol, pyridinium hydroxypropanesulfonate and dimethylaminopropyne;
the second component of the main light agent comprises three to four of butynediol diethoxy ether, butynediol monopropoxy ether, sodium propiolate, sodium allylsulfonate and sodium vinylsulfonate;
the main light agent third component comprises two to three of sodium allylsulfonate, diethylamino propyne, sodium propyne sulfonate and s-hydroxyethyl isothiouronium salt;
the fourth component of the main light agent comprises two to five of sodium benzene sulfinate, sodium propiolate, butynediol diethoxy ether, butynediol monopropoxy ether, sodium allyl sulfonate, sodium vinyl sulfonate and alkylsulfopyridine salt;
the fifth component of the main light agent comprises one or two of formaldehyde, chloral hydrate and sodium benzene sulfinate;
the sixth component of the main light agent comprises two to three of diethylamino propyne, butyl ether type humate, propane type humate and s-carboxyethyl isothiourea humate;
the gloss reducing agent a seventh component comprising an anionic or nonionic surfactant;
the eighth component of the main light agent comprises three to four of benzyl-methyl alkynol pyridine inner salt, propiolic salt, butyl ether salt, formaldehyde, dimethylamino propine and diethylamino propine.
3. The nickel plating solution additive according to claim 2, wherein:
the first component of the softening agent comprises six to seven of saccharin, bisbenzenesulfonylimine, propargyl alcohol propoxy ether, propargyl alcohol ethoxy ether, diethylaminopropyne, pyridinium hydroxypropanesulfonate and dimethylaminopropyne;
the second component of the softening agent comprises three to four of butynediol diethoxy ether, sodium propiolate, sodium allylsulfonate and sodium vinylsulfonate;
the third component of the softening agent comprises three to four of sodium allylsulfonate, diethylamino propyne, sodium propyne sulfonate, s-carboxyethyl isothiourea salt and diethylenetriamine;
the fourth component of the softening agent comprises four to five of sodium benzene sulfinate, sodium propiolate, butynediol diethoxy ether, sodium allyl sulfonate and sodium vinyl sulfonate;
the fifth component of the softening agent comprises one or two of formaldehyde, sodium benzene sulfinate and chloral hydrate;
the sixth component of the softening agent comprises three to four of diethylamino propyne, butyl ether humate, propane sulfonic acid humate, formaldehyde and s-carboxyethyl isothiourea humate;
the seventh component of the softening agent comprises four to five of diethylamino propine, propane salt, butyl ether salt, benzyl-methyl alkynol pyridine inner salt, formaldehyde and dimethylamino propine.
4. The nickel plating solution additive according to claim 3, wherein:
the main optical agent comprises 35-60g of phenylsulfonyl imine compounds, 5-15g of aryl sulfonate, 50-150g of alkenyl alkyl sulfonate, 78-89g of ether compounds, 0-2g of alcohol compounds, 40-60g of alkynyl sulfonate, 4-8g of alkyne compounds, 1-2g of aldehyde compounds, 10-15.1g of surfactant, 250g of pyridinium alkyl sulfonate, 2-4g of pyridinium alkyl ether sulfonate and 2-3g of sulfur nitrogen heterocyclic compounds per liter.
Each liter of softening agent comprises 90-110g of benzene sulfonyl imide compounds, 3-6g of aryl sulfonate, 150g of alkenyl alkyl sulfonate, 5-7g of ether compounds, 4-8g of alkynyl sulfonate, 0.3-0.6g of alkyne compounds, 1-3g of aldehyde compounds, 30-50g of pyridinium alkyl sulfonate, 0.05-0.3g of sulfur nitrogen heterocyclic compounds and 0.02-0.15g of polyethylene polyamine compounds.
5. The nickel plating solution additive according to claim 4, wherein:
the main optical agent per liter comprises 20-50g of saccharin, 0-20g of dibenzenesulfonylimide, 5-15g of sodium benzene sulfinate, 60-100g of sodium allylsulfonate, 5-10g of butynediol diethoxy ether, 30-60g of propiolic alcohol ethoxy ether, 20-40g of propiolic alcohol propoxy ether, 0-2g of propiolic alcohol, 30-60g of sodium propiolic sulfonate, 4-8g of diethylaminopropiolic acid, 1-2g of formaldehyde, 10-15g of sodium isethionate, 0-0.1g of sodium dodecyl sulfate, 0-20g of pyridinium propane sulfonate, 200 g of pyridinium hydroxypropanesulfonate, 250g of butylate sulfonate and 2-3g of s-carboxyethylisothiouronium sulfonate.
6. The nickel plating solution additive according to claim 5, wherein:
each liter of softener comprises 40-50g of saccharin, 40-60g of dibenzenesulfonyl imide, 3-6g of sodium benzene sulfinate, 250g of sodium allylsulfonate, 2-3g of butynediol diethoxy ether, 1-2g of propiolic ethoxy ether, 1-2g of propiolic propoxy ether, 4-8g of sodium propiolate, 0.3-0.6g of diethylaminopropiolic acid, 1-3g of formaldehyde, 0-10g of pyridinium propanesulfonate, 0-50g of pyridinium carboxypropanesulfonate, 0.05-0.3g of s-carboxyethylisothiouronium salt and 0.02-0.15g of diethylenetriamine.
7. The nickel plating solution additive according to claim 6, wherein:
the coordination conductive salt comprises one or more of citrate, gluconate and magnesium salt.
8. The nickel plating solution additive according to claim 7, wherein:
the coordination conductive salt comprises one or more of sodium citrate, potassium citrate, sodium gluconate, potassium gluconate and magnesium sulfate.
9. A nickel plating solution is characterized in that:
prepared by nickel plating solution additive and neutral solution containing nickel salt; the nickel plating solution additive is the nickel plating solution additive according to any one of claims 1 to 8;
the nickel plating solution comprises 0.1-0.2ml/L of main light agent, 8-10ml/L of softening agent and 180g/L of coordination conductive salt 130-;
the nickel salt includes nickel sulfate heptahydrate and nickel chloride hexahydrate.
10. An electroplating process, comprising:
pre-treating a part to be plated; washing the parts with water, and then activating with weak acid; barrel plating nickel plating is carried out under the neutral condition; carrying out post-treatment; wherein the nickel plating solution used for barrel nickel plating is the nickel plating solution according to claim 9.
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| CN113151869A (en) * | 2021-04-13 | 2021-07-23 | 苏州磊屹光电科技有限公司 | Nickel pretreatment method for improving appearance of stainless steel/foreign copper material nickel layer |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101302635A (en) * | 2008-01-18 | 2008-11-12 | 梁国柱 | Steel member acidic electroplating additive for copper pre-plating and pre-plating process |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101302635A (en) * | 2008-01-18 | 2008-11-12 | 梁国柱 | Steel member acidic electroplating additive for copper pre-plating and pre-plating process |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113151869A (en) * | 2021-04-13 | 2021-07-23 | 苏州磊屹光电科技有限公司 | Nickel pretreatment method for improving appearance of stainless steel/foreign copper material nickel layer |
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Application publication date: 20201016 |