CN111769144A - Manufacturing method of wavy wiring, mask plate and display device - Google Patents
Manufacturing method of wavy wiring, mask plate and display device Download PDFInfo
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- CN111769144A CN111769144A CN202010590119.4A CN202010590119A CN111769144A CN 111769144 A CN111769144 A CN 111769144A CN 202010590119 A CN202010590119 A CN 202010590119A CN 111769144 A CN111769144 A CN 111769144A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
- H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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Abstract
The invention provides a manufacturing method of wavy routing wires, a mask plate and a display device. The manufacturing method of the wavy routing wire comprises the following steps: manufacturing a substrate layer, manufacturing a metal layer, manufacturing a light resistance layer, arranging a mask plate, patterning the light resistance layer and manufacturing wavy undulating wiring. According to the invention, the mask plate is properly corrected and compensated according to the difference deviation between the actual value and the designed value of the wavy routing, so that the wavy routing with uniform width in the extending direction is realized, the technical problem that the wavy routing cannot realize uniform width in the extending direction is solved, and the uniform width of the wavy routing is realized.
Description
Technical Field
The invention relates to the field of display, in particular to a manufacturing method of wavy wiring, a mask plate and a display device.
Background
Organic Light-Emitting Diode (OLED) display screens are becoming the mainstream trend of current displays due to their characteristics of self-luminescence, wide viewing angle, high contrast, fast response speed, etc.
Currently, with the pursuit of people for the extreme display experience, a full screen, a narrow frame and the like become hot spots for display and development at present. When the OLED display screen realizes a full-screen and a narrow frame, a bonding Pad (Pad, or referred to as a "Pad") binding region of the flexible screen is usually required to be bent, and metal wires distributed in the region may have cracks, cracks and other defects due to stress/strain generated by bending, so that signal transmission is affected, performance is affected, and even display failure is caused.
Therefore, various optimization designs are carried out on the metal wires in the bonding pad binding area, so that the bending resistance of the metal wires is improved, and a typical wave-shaped wire routing mode is that a wave-shaped substrate layer is formed by manufacturing structures such as grooves and holes on a film layer deposited in a previous process, then a metal film layer is deposited on the substrate layer, and then exposure and etching processes are carried out to obtain wave-shaped wavy wires in the film layer stacking direction. Obviously, the wavy routing wire is in a flat position on the substrate layer, is also in the bottom of the groove or the hole, and is also in a climbing position at the edge of the groove or the hole.
As shown in fig. 1, a schematic structural diagram of a wavy undulating trace 90 manufactured by the existing method is shown, the wavy undulating trace 90 obviously has differences in exposure and etching processes due to different positions on a substrate layer where the wavy undulating trace 90 is located, the wavy undulating trace 90 forms an up-down undulating structure along structures such as grooves and holes on the substrate layer, and the width of the manufactured wavy undulating trace 90 in the extending direction thereof cannot be uniform. In fig. 1, the width D1 of the undulating trace 90 at the top position is smaller than the width D2 at the bottom of the groove and hole.
As shown in fig. 2, it is a schematic structural diagram of a mask plate 91 for manufacturing wavy undulating traces in the conventional exposure and etching processes, and it is found through research that the gaps 910 corresponding to the positions of the wavy undulating traces 90 in the mask plate 91 used in the exposure and etching processes are uniform in width, and the gaps are caused by the difference in distance between the upper surface of the substrate layer and the mask plate 91.
Disclosure of Invention
The invention aims to provide a manufacturing method of wavy undulating wiring, a mask plate and a display device, and solves the technical problem that the widths of the wavy undulating wiring in the extending direction cannot be uniform by properly correcting and compensating the mask plate.
In order to solve the above problems, the present invention provides a method for manufacturing a wavy trace, comprising:
the manufacturing method comprises the following steps of manufacturing a substrate layer, wherein the substrate layer is provided with a plurality of fluctuation structures, the fluctuation structures are provided with continuous bulges and grooves, and the extending directions of the fluctuation structures are a left climbing slope, a top end, a right climbing slope and a valley bottom in sequence, so that the upper surface of the substrate layer is in a wave shape with fluctuation;
manufacturing a metal layer, namely manufacturing a metal layer on the substrate layer, wherein the metal layer covers the upper surface of the substrate layer;
a step of manufacturing a light resistance layer, which is to manufacture a light resistance layer on the metal layer, wherein the light resistance layer is a positive light resistance or a negative light resistance;
setting a mask plate, namely setting a mask plate above the photoresist layer; when the photoresist layer is a positive photoresist, the mask plate is provided with a shading part at the position corresponding to the prefabricated wavy undulating routing, and the shading part is provided with a left transition shading area, a top shading area, a right transition shading area and a valley bottom shading area which are sequentially connected at the positions corresponding to the left climbing slope, the top end and the right climbing slope of the extending direction of the undulating structure and the valley bottom, wherein the width of the valley bottom shading area is smaller than that of the top shading area; when the photoresist layer is a negative photoresist, the mask plate is provided with a light transmission part at the position corresponding to the prefabricated wavy fluctuation wiring, the light transmission part is provided with a left transition light transmission area, a top end light transmission area, a right transition light transmission area and a valley bottom light transmission area which are sequentially connected at the positions corresponding to the left climbing slope, the top end and the right climbing slope of the extending direction of the fluctuation structure and the valley bottom, and the width of the valley bottom light transmission area is smaller than that of the top end light transmission area;
a photoresist layer patterning step, forming a patterned photoresist layer by exposing and etching the photoresist layer; and
and a step of manufacturing the wavy routing wire, wherein the wavy routing wire with uniform width is manufactured in a mode of etching the metal layer.
Further, the photoresist layer patterning step includes:
exposing the light resistance layer, namely exposing the light resistance layer above the mask plate;
etching the light resistance layer, namely etching the light resistance layer by a dry method; when the light resistance layer is a positive light resistance, the exposed light resistance layer is separated from the metal layer; when the light resistance layer is a negative light resistance layer, the unexposed light resistance layer is separated from the metal layer; and
and removing the removed photoresist layer by stripping.
Further, the material of the metal layer includes copper, aluminum or an alloy thereof.
Further, the step of manufacturing the substrate layer comprises:
manufacturing at least one dielectric layer, namely manufacturing at least one dielectric layer, wherein the dielectric layer is made of an organic material or an inorganic material; and
and a step of manufacturing a relief structure, wherein the dielectric layer is etched to form continuous bulges and grooves, and the bulges and the grooves are connected with each other to form a plurality of relief structures.
Furthermore, in the step of manufacturing the undulating structure, the dielectric layer is provided with two or more layers, and the groove bottom of the groove is positioned in the inner part or on the upper surface or on the lower surface of any layer of the dielectric layer below the upper surface of the substrate layer.
Further, the method also comprises the following steps after the step of wavy undulating routing: and a step of manufacturing a covering layer, namely manufacturing at least one covering layer on the wavy undulating routing, wherein the covering layer is made of an organic material or an inorganic material.
The invention also provides a mask plate which comprises a shading part and a light transmission part and is used for manufacturing the wavy wiring with uniform width; when the photoresist layer covered on the prefabricated wavy undulating routing line is a positive photoresist, the mask plate is provided with a shading part at the position corresponding to the prefabricated wavy undulating routing line, and the shading part is provided with a left transition shading area, a top shading area, a right transition shading area and a valley bottom shading area which are sequentially connected at the positions of a left climbing slope, a top end, a right climbing slope and a valley bottom corresponding to the extending direction of the undulating structure, wherein the width of the valley bottom shading area is less than that of the top shading area; when the light resistance layer that covers on the line is walked to prefabricated wave undulation is negative light resistance, the mask plate is equipped with printing opacity portion corresponding prefabricated wave undulation line position, printing opacity portion is being corresponded left side climbing, top, right climbing, the bottom of a valley position of the extending direction of undulation structure are equipped with left transition printing opacity district, top printing opacity district, right transition printing opacity district, the bottom of a valley printing opacity district that connects gradually, wherein the width in bottom of a valley printing opacity district is less than the width in top printing opacity district.
Further, when the mask plate is used for manufacturing the wavy routing, the manufacturing method of the wavy routing is adopted.
The invention also provides a display device, which comprises a display area and a non-display area adjacent to the edge of the display area; the wavy undulating wiring manufactured by the manufacturing method of the wavy undulating wiring is arranged in the non-display area.
Further, the display device further includes: a substrate provided with the display region and the non-display region; a display unit adjacent to the outer region, the display unit located over the substrate, the display unit including a pixel array. Each of the pixels includes: the organic light emitting device includes an organic light emitting element on a substrate, and a thin film transistor connected to the organic light emitting element. Wherein the organic light emitting element includes: a first electrode electrically connected to the thin film transistor; an organic emission layer on the first electrode; and a second electrode on the organic emission layer. Wherein the thin film transistor includes: an active layer on the substrate; a gate electrode on the active layer; and a source electrode and a drain electrode electrically connected to ends of the active layer, respectively.
The invention has the advantages that the manufacturing method of the wavy undulating wiring, the mask plate and the display device are provided, the mask plate is corrected and compensated properly according to the difference deviation between the actual value and the designed value of the wavy undulating wiring, so that the wavy undulating wiring with uniform width in the extending direction is realized, the technical problem that the width of the wavy undulating wiring in the extending direction cannot be uniform is solved, and the uniform width of the wavy undulating wiring is realized.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a schematic structural view of a wavy trace manufactured by a conventional method;
FIG. 2 is a schematic structural diagram of a mask for manufacturing wavy traces in the conventional exposure and etching processes;
fig. 3 is a flowchart of a method for manufacturing a wavy trace according to an embodiment of the present invention;
FIG. 4 is a cross-sectional view of the substrate layer in an embodiment of the invention;
FIG. 5 is a flow chart of steps in fabricating a substrate layer in an embodiment of the invention;
FIG. 6 is a schematic structural diagram of a mask when the photoresist layer is a positive photoresist in the embodiment of the present invention;
FIG. 7 is a schematic structural diagram of a mask when the photoresist layer is a negative photoresist in the embodiment of the present invention;
FIG. 8 is a flow chart of a photoresist layer patterning step in an embodiment of the present invention;
FIG. 9 is a schematic diagram of a completed photoresist layer according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of a wavy trace fabricated in the embodiment of the present invention;
fig. 11 is a schematic structural diagram of a display device in an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
Referring to fig. 3 to 10, in an embodiment of the invention, a method for manufacturing a wavy trace is provided, as shown in fig. 3, the method includes steps S1-S7.
S1, a step of manufacturing a substrate layer, which is to manufacture a substrate layer 1, as shown in fig. 4, is a cross-sectional view of the substrate layer 1, the substrate layer 1 is provided with a plurality of relief structures 11, each relief structure 11 is provided with continuous protrusions 111 and grooves 112, and the extension direction of each relief structure 11 is a left climbing slope 110, a top end 120, a right climbing slope 130 and a valley bottom 140 in sequence, so that the upper surface of the substrate layer 1 is in a wave shape with high and low undulations.
As shown in fig. 4 and 5, the step S1 of fabricating the substrate layer specifically includes S11-S12. S11, fabricating at least one dielectric layer, and fabricating at least one dielectric layer 113, wherein the dielectric layer 113 is made of an organic material or an inorganic material. And S12, a step of manufacturing the relief structure, wherein the dielectric layer 113 is etched to form continuous protrusions 111 and grooves 112, and the protrusions 111 and the grooves 112 are connected with each other to form a plurality of relief structures 11. In the step S12 of fabricating the relief structure, the dielectric layer 113 has two or more layers, and the bottom of the groove 112 is located in the inner part, or on the upper surface or on the lower surface of any layer of the dielectric layer 113 below the upper surface of the substrate layer 1.
And S2, manufacturing a metal layer, namely manufacturing a metal layer 2 on the substrate layer 1, wherein the metal layer 2 covers the upper surface of the substrate layer 1. The material of the metal layer 2 includes copper, aluminum or alloy thereof.
S3, forming a photoresist layer 3 on the metal layer 2, wherein the photoresist layer 3 is a positive photoresist or a negative photoresist.
S4, setting a mask plate, namely setting a mask plate 20 above the photoresist layer 3; as shown in fig. 6 and 7, the mask 20 includes a light shielding portion 21 and a light transmitting portion 22.
As shown in fig. 6, when the photoresist layer 3 is a positive photoresist, the mask plate 20 is provided with a light shielding portion 21 at a position corresponding to the pre-fabricated wavy undulating routing, and the light shielding portion 21 is provided with a left transition light shielding region 211, a top light shielding region 212, a right transition light shielding region 213, and a valley bottom light shielding region 214, which are sequentially connected at positions corresponding to the left climbing slope 110, the top end 120, the right climbing slope 130, and the valley bottom 140 of the extending direction of the undulating structure 11, wherein the width of the valley bottom light shielding region 214 is smaller than the width of the top light shielding region 212. Preferably, the projections of the top light-shielding region 212 and the valley light-shielding region 214 on the photoresist layer 3 are rectangular, and the projections of the left transition light-shielding region 211 and the right transition light-shielding region 213 on the photoresist layer 3 are trapezoidal, so as to connect the top light-shielding region 212 and the valley light-shielding region 214.
As shown in fig. 7, when the photoresist layer 3 is a negative photoresist, the mask 20 is provided with a light-transmitting portion 22 at a position corresponding to the pre-fabricated wavy undulating routing, and the light-transmitting portion 22 is provided with a left transition light-transmitting region 221, a top light-transmitting region 222, a right transition light-transmitting region 223, and a valley bottom light-transmitting region 224, which are sequentially connected, at positions corresponding to the left climbing slope 110, the top end 120, the right climbing slope 130, and the valley bottom 140 of the extending direction of the undulating structure 11, wherein the width of the valley bottom light-transmitting region 224 is smaller than the width of the top light-transmitting region 222. Preferably, the projections of the top transparent region 222 and the bottom transparent region 224 on the photoresist layer 3 are rectangular, and the projections of the left transition transparent region 221 and the right transition transparent region 223 on the photoresist layer 3 are trapezoidal, for connecting the top transparent region 222 and the bottom transparent region 224.
S5, a photoresist layer patterning step, forming a patterned photoresist layer by exposing and etching the photoresist layer 3. As shown in fig. 8, the photoresist layer patterning step S5 specifically includes S51-S53. S51, exposing the photoresist layer 3 above the mask 20. S52, etching the light resistance layer, namely etching the light resistance layer 3 by a dry method; when the photoresist layer 3 is a positive photoresist, the exposed photoresist layer 3 is separated from the metal layer; when the photoresist layer 3 is a negative photoresist, the unexposed photoresist layer 3 is separated from the metal layer. S53, removing the photoresist layer, and removing the photoresist layer 3 by stripping. Fig. 9 is a schematic structural view of the completed photoresist layer 3 of this embodiment.
And S6, manufacturing the wavy undulating routing, namely manufacturing the wavy undulating routing 30 with uniform width by etching the metal layer 2. Fig. 10 is a schematic structural diagram of the wave-shaped undulating trace 30 manufactured in this embodiment. According to the embodiment, the mask plate 20 is properly corrected and compensated according to the difference deviation between the actual value and the design value of the wavy undulating wiring, so that the wavy undulating wiring 30 with uniform width in the extending direction is realized, the technical problem that the width of the wavy undulating wiring in the extending direction cannot be uniform is solved, and the uniform width of the wavy undulating wiring 30 is realized.
S7, fabricating at least one cover layer (not shown) on the undulating trace 20, wherein the cover layer is made of an organic material or an inorganic material.
As shown in fig. 6 and 7, the present invention further provides a mask 20, which includes a light shielding portion 21 and a light transmitting portion 22, and is used for manufacturing a wavy undulating trace 30 with a uniform width.
In one case, as shown in fig. 6, when the photoresist layer 3 covered on the pre-fabricated wavy undulating trace 30 is a positive photoresist, the mask plate 20 is provided with a light shielding portion 21 at a position corresponding to the pre-fabricated wavy undulating trace, and the light shielding portion 21 is provided with a left transition light shielding region 211, a top light shielding region 212, a right transition light shielding region 213 and a valley bottom light shielding region 214 which are sequentially connected at positions corresponding to the left climbing slope 110, the top end 120, the right climbing slope 130 and the valley bottom 140 of the extending direction of the undulating structure 11, wherein the width of the valley bottom light shielding region 214 is smaller than the width of the top light shielding region 212. Preferably, the projections of the top light-shielding region 212 and the valley light-shielding region 214 on the photoresist layer 3 are rectangular, and the projections of the left transition light-shielding region 211 and the right transition light-shielding region 213 on the photoresist layer 3 are trapezoidal, so as to connect the top light-shielding region 212 and the valley light-shielding region 214.
In another case, as shown in fig. 7, when the photoresist layer 3 covered on the pre-fabricated wavy undulating trace 30 is a negative photoresist, the mask plate 20 is provided with a light-transmitting portion 22 at a position corresponding to the pre-fabricated wavy undulating trace, and the light-transmitting portion 22 is provided with a left transition light-transmitting region 221, a top light-transmitting region 222, a right transition light-transmitting region 223, and a valley bottom light-transmitting region 224 which are sequentially connected at positions corresponding to the left slope 110, the top 120, the right slope 130, and the valley bottom 140 of the extending direction of the undulating structure 11, wherein the width of the valley bottom light-transmitting region 224 is smaller than the width of the top light-transmitting region 222. Preferably, the projections of the top transparent region 222 and the bottom transparent region 224 on the photoresist layer 3 are rectangular, and the projections of the left transition transparent region 221 and the right transition transparent region 223 on the photoresist layer 3 are trapezoidal, for connecting the top transparent region 222 and the bottom transparent region 224.
In this embodiment, when the mask 20 is used to manufacture the wavy routing line 30, the method for manufacturing the wavy routing line is adopted.
As shown in fig. 11, the present invention also provides a display device 100, which includes a display area 101 and a non-display area 102 adjacent to an edge of the display area 101; the wavy undulating trace 30 fabricated by the method for fabricating wavy undulating trace described above is disposed in the non-display area 102.
As shown in fig. 11, in this embodiment, the display device 100 further includes: a substrate 1001 provided with the display region 101 and the non-display region 102, the substrate 1001 including the substrate layer 10; a display unit 1002 is disposed in the display area 101, the display unit 1002 is disposed on a substrate 1001, and the display unit 1002 includes a pixel array. Each of the pixels includes: an organic light emitting element 4 on a substrate 1001, and a thin film transistor 5 connected to the organic light emitting element 4. Wherein the organic light emitting element 4 includes: a first electrode 41 electrically connected to the thin film transistor 5; an organic emission layer 42 on the first electrode 41; and a second electrode 43 on the organic emission layer 42. Wherein the thin film transistor 5 includes: an active layer 51 on the substrate 1001; a gate electrode 52 on the active layer 51; and a source electrode 53 and a drain electrode 54 electrically connected to ends of the active layer 51, respectively.
The display device in the embodiments of the present disclosure may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
The invention has the advantages that the manufacturing method of the wavy undulating wiring, the mask plate and the display device are provided, the mask plate is corrected and compensated properly according to the difference deviation between the actual value and the designed value of the wavy undulating wiring, so that the wavy undulating wiring with uniform width in the extending direction is realized, the technical problem that the width of the wavy undulating wiring in the extending direction cannot be uniform is solved, and the uniform width of the wavy undulating wiring is realized.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A manufacturing method of a wavy routing wire is characterized by comprising the following steps:
the manufacturing method comprises the following steps of manufacturing a substrate layer, wherein the substrate layer is provided with a plurality of fluctuation structures, the fluctuation structures are provided with continuous bulges and grooves, and the extending directions of the fluctuation structures are a left climbing slope, a top end, a right climbing slope and a valley bottom in sequence, so that the upper surface of the substrate layer is in a wave shape with fluctuation;
manufacturing a metal layer, namely manufacturing a metal layer on the substrate layer, wherein the metal layer covers the upper surface of the substrate layer;
a step of manufacturing a light resistance layer, which is to manufacture a light resistance layer on the metal layer, wherein the light resistance layer is a positive light resistance or a negative light resistance;
setting a mask plate, namely setting a mask plate above the photoresist layer; when the photoresist layer is a positive photoresist, the mask plate is provided with a shading part at the position corresponding to the prefabricated wavy undulating routing, and the shading part is provided with a left transition shading area, a top shading area, a right transition shading area and a valley bottom shading area which are sequentially connected at the positions corresponding to the left climbing slope, the top end and the right climbing slope of the extending direction of the undulating structure and the valley bottom, wherein the width of the valley bottom shading area is smaller than that of the top shading area; when the photoresist layer is a negative photoresist, the mask plate is provided with a light transmission part at the position corresponding to the prefabricated wavy fluctuation wiring, the light transmission part is provided with a left transition light transmission area, a top end light transmission area, a right transition light transmission area and a valley bottom light transmission area which are sequentially connected at the positions corresponding to the left climbing slope, the top end and the right climbing slope of the extending direction of the fluctuation structure and the valley bottom, and the width of the valley bottom light transmission area is smaller than that of the top end light transmission area;
a photoresist layer patterning step, forming a patterned photoresist layer by exposing and etching the photoresist layer; and
and a step of manufacturing the wavy routing wire, wherein the wavy routing wire with uniform width is manufactured in a mode of etching the metal layer.
2. The method for manufacturing wavy undulating routing according to claim 1, wherein the step of patterning the photoresist layer includes:
exposing the light resistance layer, namely exposing the light resistance layer above the mask plate;
etching the light resistance layer, namely etching the light resistance layer by a dry method; when the light resistance layer is a positive light resistance, the exposed light resistance layer is separated from the metal layer; when the light resistance layer is a negative light resistance layer, the unexposed light resistance layer is separated from the metal layer; and
and removing the removed photoresist layer by stripping.
3. The method for manufacturing a wavy undulating trace according to claim 1, wherein the material of the metal layer includes copper, aluminum or an alloy thereof.
4. The method for manufacturing the wavy undulating trace according to claim 1, wherein the step of manufacturing the substrate layer includes:
manufacturing at least one dielectric layer, namely manufacturing at least one dielectric layer, wherein the dielectric layer is made of an organic material or an inorganic material; and
and a step of manufacturing a relief structure, wherein the dielectric layer is etched to form continuous bulges and grooves, and the bulges and the grooves are connected with each other to form a plurality of relief structures.
5. The method for manufacturing wavy undulating trace according to claim 1,
in the step of manufacturing the undulating structure, the dielectric layer is provided with two or more layers, and the groove bottom of the groove is positioned in the inner part or the upper surface or the lower surface of any layer of the dielectric layer below the upper surface of the substrate layer.
6. The method for manufacturing the wavy undulating trace according to claim 1, further comprising, after the step of manufacturing the wavy undulating trace:
and a step of manufacturing a covering layer, namely manufacturing at least one covering layer on the wavy undulating routing, wherein the covering layer is made of an organic material or an inorganic material.
7. A mask plate is characterized by comprising a light shielding part and a light transmitting part, wherein the light shielding part and the light transmitting part are used for manufacturing wavy undulating routing lines with uniform width;
when the photoresist layer covered on the prefabricated wavy undulating routing line is a positive photoresist, the mask plate is provided with a shading part at the position corresponding to the prefabricated wavy undulating routing line, and the shading part is provided with a left transition shading area, a top shading area, a right transition shading area and a valley bottom shading area which are sequentially connected at the positions of a left climbing slope, a top end, a right climbing slope and a valley bottom corresponding to the extending direction of the undulating structure, wherein the width of the valley bottom shading area is less than that of the top shading area; when the light resistance layer that covers on the line is walked to prefabricated wave undulation is negative light resistance, the mask plate is equipped with printing opacity portion corresponding prefabricated wave undulation line position, printing opacity portion is being corresponded left side climbing, top, right climbing, the bottom of a valley position of the extending direction of undulation structure are equipped with left transition printing opacity district, top printing opacity district, right transition printing opacity district, the bottom of a valley printing opacity district that connects gradually, wherein the width in bottom of a valley printing opacity district is less than the width in top printing opacity district.
8. A mask according to claim 7, wherein when the mask is used for manufacturing the wavy undulating trace, the manufacturing method of the wavy undulating trace according to any one of claims 1 to 6 is adopted.
9. A display device comprising a display area and a non-display area adjacent to an edge of the display area; the wavy undulating trace manufactured by the manufacturing method of the wavy undulating trace according to any one of claims 1 to 6 is arranged in the non-display area.
10. The display device according to claim 9, further comprising:
a substrate provided with the display region and the non-display region;
a display unit on the substrate, the display unit including a pixel array; each pixel includes an organic light emitting element on a substrate and a thin film transistor connected to the organic light emitting element;
wherein the organic light emitting element includes:
a first electrode electrically connected to the thin film transistor;
an organic emission layer on the first electrode; and
a second electrode on the organic emission layer;
wherein the thin film transistor includes:
an active layer on the substrate;
a gate electrode on the active layer; and
and the source electrode and the drain electrode are respectively electrically connected with the end part of the active layer.
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| CN202010590119.4A CN111769144B (en) | 2020-06-24 | 2020-06-24 | Manufacturing method of wavy wiring, mask plate and display device |
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| CN111769144B CN111769144B (en) | 2022-07-12 |
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