CN111761786B - Cutting method of semiconductor packaging material sheet - Google Patents
Cutting method of semiconductor packaging material sheet Download PDFInfo
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- CN111761786B CN111761786B CN202010567145.5A CN202010567145A CN111761786B CN 111761786 B CN111761786 B CN 111761786B CN 202010567145 A CN202010567145 A CN 202010567145A CN 111761786 B CN111761786 B CN 111761786B
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- cutting
- cutters
- semiconductor packaging
- material sheet
- packaging material
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- 238000005520 cutting process Methods 0.000 title claims abstract description 143
- 239000004065 semiconductor Substances 0.000 title claims abstract description 85
- 239000005022 packaging material Substances 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000004806 packaging method and process Methods 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 6
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 230000009471 action Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1769—Handling of moulded articles or runners, e.g. sorting, stacking, grinding of runners
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Packages (AREA)
Abstract
The invention provides a method for cutting a semiconductor packaging material sheet, which comprises the following steps: positioning the material sheet; presetting cutting lines, x cutting lines and y cutting lines; cutting in the first direction, moving the two cutters oppositely from two ends of the x cutting line to cut the semiconductor packaging material sheet until the distance between the two cutters is P, and cutting the semiconductor packaging material sheet by the two cutters moving in the same direction with the length P as the advancing distance; cutting in the second direction, wherein the two cutters move oppositely from two ends of the y cutting line to cut the semiconductor packaging material sheet until the distance between the two cutters is the length Q, and the two cutters move in the same direction by taking the length Q as the advancing distance to cut the semiconductor packaging sheet; and repeating the cutting, and completing the cutting of each x cutting line and each y cutting line. The invention can effectively shorten the cutting time, improve the cutting efficiency, has high cutting yield and regular and non-offset edges of the cut products.
Description
Technical Field
The invention relates to semiconductor packaging, and particularly discloses a cutting method of a semiconductor packaging material sheet.
Background
The semiconductor device generally comprises a packaging body, chips and conductive pins, in order to improve the processing efficiency, a large number of conductive pins are manufactured on the same lead frame, then each chip is welded to the corresponding position of the lead frame, finally the lead frame welded with the chips is sent to injection molding, and finally a semiconductor packaging material sheet is obtained.
The semiconductor packaging material sheet contains a plurality of semiconductor packaging units, namely semiconductor devices, and after the semiconductor packaging material sheet is obtained after injection molding, the semiconductor packaging material sheet needs to be cut, and finally a plurality of independent semiconductor packaging units are obtained. In the prior art, the semiconductor packaging material sheet is cut at one time by a cutting blade, the semiconductor packaging material sheet can form large stress for obstructing the cutting of the cutting blade in the cutting process, the cutting precision is influenced, and the reject ratio of cutting is high.
Disclosure of Invention
Therefore, it is necessary to provide a method for cutting a semiconductor package material sheet, which can effectively improve the cutting efficiency and the cutting accuracy by opposite cutting, and has a high yield in cutting.
In order to solve the problems of the prior art, the invention discloses a method for cutting a semiconductor packaging material sheet, which comprises the following steps:
s1, positioning a material sheet, namely positioning a semiconductor packaging material sheet on a cutting platform, wherein the semiconductor packaging material sheet comprises a plurality of semiconductor packaging units;
s2, presetting cutting lines, designing a plurality of X cutting lines and Y cutting lines which are arranged in a staggered mode on a semiconductor packaging material plate, and accommodating a semiconductor packaging unit in each grid formed between all the X cutting lines and all the Y cutting lines;
s3, cutting in the first direction, moving the two cutters oppositely from the two ends of the x cutting line to cut the semiconductor packaging material sheet until the distance between the two cutters is P, cutting the semiconductor packaging sheet by the two cutters moving in the same direction with the length P as the advancing distance, and moving the two cutters oppositely to separate from the semiconductor packaging material sheet, wherein P is greater than P;
s4, cutting in a second direction, wherein the two cutters move oppositely from two ends of the y cutting line to cut the semiconductor packaging material sheet until the distance between the two cutters is Q, the two cutters move in the same direction with the length Q as the advancing distance to cut the semiconductor packaging sheet, the two cutters move oppositely to separate from the semiconductor packaging material sheet, and Q is greater than Q;
and S5, repeating the cutting, repeating the steps S3 and S4, and completing the cutting of each x cutting line and each y cutting line.
Further, in steps S3 and S4, both cutters are diamond blades.
Further, in the steps S3 and S4, the feeding speeds of the two cutters are both 45-60 mm/r, and the rotating speeds of the two cutters are 2800-3200 r/min.
Further, in steps S3 and S4, the rotation directions of the two cutters are opposite.
Further, in steps S3 and S4, the semiconductor packaging material sheet is placed in a sealed box with the temperature of 0-10 ℃ for cutting processing.
Further, the lengths of the semiconductor packaging units in the x cutting line direction and the y cutting line direction are a and b respectively, p is more than or equal to a and less than or equal to 2a, and q is more than or equal to b and less than or equal to 2 b.
Furthermore, P is less than or equal to 3a, and Q is less than or equal to 3 b.
Further, in step S5, the cutting sequence of each x-cut line is performed sequentially from both edges to the middle.
Further, in step S5, the cutting sequence of each y-cut line is performed in order from both edges to the middle.
The invention has the beneficial effects that: the invention discloses a method for cutting a semiconductor packaging material sheet, which can effectively shorten the cutting time and improve the cutting efficiency by cutting the semiconductor packaging material sheet in a special opposite cutting mode, wherein the vibration forces generated by two cutters during cutting can be mutually offset, the stress formed by the semiconductor packaging material sheet during the cutting process can be effectively reduced, and the barrier force borne by the cutters can be effectively reduced, so that the cutting precision is effectively improved, the cutting yield is high, and the edges of products obtained by cutting are regular and have no offset.
Drawings
Fig. 1 is a schematic structural view of a semiconductor package web according to the present invention.
Detailed Description
For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
Refer to fig. 1.
The embodiment of the invention discloses a method for cutting a semiconductor packaging material sheet, which comprises the following steps:
s1, positioning a material sheet, namely positioning a semiconductor packaging material sheet on a cutting platform, wherein the semiconductor packaging material sheet comprises a plurality of semiconductor packaging units, a connecting rib is arranged between every two adjacent semiconductor packaging units, and each semiconductor packaging unit comprises a packaging body, a chip and a conductive pin;
s2, presetting cutting lines, as shown in fig. 1, designing a plurality of x cutting lines and y cutting lines arranged in a staggered manner on the semiconductor package loading plate, wherein the x cutting lines and the y cutting lines are preferably perpendicular, each grid formed between all the x cutting lines and the y cutting lines contains a semiconductor package unit, the x cutting lines and the y cutting lines are respectively located at two adjacent sides of the semiconductor package units, and the x cutting lines and the y cutting lines are respectively perpendicular to the connecting ribs;
s3, cutting in a first direction, moving two cutters oppositely along the x-cutting line from two ends of the x-cutting line to cut the semiconductor packaging material sheet, cutting the semiconductor packaging material sheet oppositely from two ends of the semiconductor packaging material sheet by the cutters, effectively shortening the cutting stroke of the cutters, effectively reducing the stress of the semiconductor packaging material sheet on the cutters in the cutting process, effectively improving the cutting stability and the cutting precision, and in addition, the vibration force generated when the two cutters oppositely cut can be mutually counteracted, thereby further improving the stability of the cutting action until the distance between the two cutters is P, at the moment, the part of the semiconductor packaging material sheet with the residual length of P on the x-cutting line is not cut, after the two cutters cut the semiconductor packaging material sheet by the same-direction movement with the length of P as the advancing distance, moving the two cutters oppositely to separate from the semiconductor packaging material sheet, and P is greater than P, the two cutters can be ensured to realize complete cutting along the x cutting line, the two cutters move in the same direction to cut the rest part with the length of p, and the cutters moving in the opposite direction are moved away by the cutters moving in the forward direction, so that collision between the two cutters is avoided;
s4, cutting in a second direction, moving the two cutters oppositely along the y cutting line from the two ends of the y cutting line to cut the semiconductor packaging material sheet, cutting the semiconductor packaging material sheet from the two ends of the semiconductor packaging material sheet by the cutters oppositely, effectively shortening the cutting stroke of the cutters, effectively reducing the stress of the semiconductor packaging material sheet on the cutters in the cutting process, effectively improving the cutting stability and the cutting precision, in addition, the vibration force generated when the two cutters oppositely cut can be mutually counteracted, thereby further improving the stability of the cutting action until the distance between the two cutters is Q, at the moment, the part of the semiconductor packaging material sheet with the residual length of Q on the y cutting line is not cut, after the two cutters cut the semiconductor packaging material sheet by the same-direction movement with the length of Q as the advancing distance, moving the two cutters oppositely to separate from the semiconductor packaging material sheet, and Q is greater than Q, the two cutters can be ensured to realize complete cutting along the y-cutting line, the two cutters move in the same direction to cut the remaining part with the length of q, and the cutters moving in the opposite direction are moved away from the cutters moving in the forward direction, so that collision between the two cutters is avoided;
and S5, repeating the cutting, repeating the steps S3 and S4, completing the cutting of each x cutting line and each y cutting line respectively, and finally obtaining a plurality of independent semiconductor packaging units.
The product obtained by cutting has no deviation, the cutting opening is flat, the cutting efficiency is improved by 3.6 times or more, the reject ratio of cutting is low, and the reject ratio formed by poor cutting is as low as 0.2 percent and is far lower than the reject ratio of more than 7 percent in the prior art.
In the present embodiment, both the cutters are diamond blades in steps S3 and S4.
In the present embodiment, in steps S3 and S4, the feeding speed of the two cutters is 45 to 60mm/r, and the rotation speed of the two cutters is 2800 to 3200r/min, preferably 50mm/r and 2900 r/min.
In this embodiment, the rotation directions of the two cutting knives during cutting are opposite in steps S3 and S4, so that the effect of the two cutting knives on canceling out the vibration force generated by the semiconductor package web can be further improved, and the reliability of the cutting operation can be further improved.
In this embodiment, in steps S3 and S4, the semiconductor package web is placed in a sealed box at a temperature of 0-10 ℃ for dicing, and the sealed box at a sufficiently low temperature can effectively prevent the semiconductor package web from being heated too high during dicing to affect the performance of the semiconductor package unit.
In the embodiment, the lengths of the semiconductor packaging unit in the x-cutting line direction and the y-cutting line direction are a and b respectively, p is more than or equal to 2a in the step S3, and q is more than or equal to 2b in the step S4, so that the cutting effect is prevented from being influenced by too large distance between two cutters which are formed backwards.
Based on the above embodiment, in step S3, P is less than or equal to 3a, and in step S4, Q is less than or equal to 3b, so that the cutting efficiency is prevented from being reduced due to the fact that the length of the two cutters moving in the same direction is too large.
In this embodiment, in step S5, the cutting sequence of each x-cut line is performed sequentially from both edges to the middle, that is, the x-cut lines at the edges of the semiconductor package web are first subjected to the cutting process of S3, and the x-cut lines are individually subjected to the cutting process from both edges to the middle.
Based on the above embodiment, in step S5, the cutting sequence of each y-cut line is performed sequentially from both edges to the middle, that is, the y-cut lines at the edges of the semiconductor package web are first subjected to the cutting process of S4, and the y-cut lines are individually subjected to the cutting process from both edges to the middle.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (8)
1. A method for cutting a semiconductor packaging material sheet is characterized by comprising the following steps:
s1, positioning a material sheet, namely positioning a semiconductor packaging material sheet on a cutting platform, wherein the semiconductor packaging material sheet comprises a plurality of semiconductor packaging units;
s2, presetting cutting lines, designing a plurality of X cutting lines and Y cutting lines which are arranged in a staggered mode on a semiconductor packaging material plate, and accommodating a semiconductor packaging unit in each grid formed between all the X cutting lines and all the Y cutting lines;
s3, cutting in the first direction, moving the two cutters oppositely from the two ends of the x cutting line to cut the semiconductor packaging material sheet until the distance between the two cutters is P, cutting the semiconductor packaging sheet by the two cutters moving in the same direction with the length P as the advancing distance, moving the two cutters oppositely to separate from the semiconductor packaging material sheet, wherein the rotating directions of the two cutters are opposite;
s4, cutting in a second direction, wherein the two cutters move oppositely from two ends of the y cutting line to cut the semiconductor packaging material sheet until the distance between the two cutters is Q, the two cutters move in the same direction with the length Q as the advancing distance to cut the semiconductor packaging sheet, the two cutters move oppositely to separate from the semiconductor packaging material sheet, and the rotating directions of the two cutters are opposite;
and S5, repeating the cutting, repeating the steps S3 and S4, and completing the cutting of each x cutting line and each y cutting line.
2. The method of cutting a semiconductor package web according to claim 1, wherein in steps S3 and S4, both cutters are diamond blades.
3. The method of claim 1, wherein in steps S3 and S4, the feeding speed of the two cutting knives is 45-60 mm/r, and the rotating speed of the two cutting knives is 2800-3200 r/min.
4. The method of claim 1, wherein the semiconductor package web is placed in a sealed box at a temperature of 0-10 ℃ for dicing in steps S3 and S4.
5. The method of cutting a sheet of semiconductor package material as recited in claim 1, wherein the lengths of the semiconductor package units in the x-cut line direction and the y-cut line direction are a and b, respectively, a ≦ p ≦ 2a, b ≦ q ≦ 2 b.
6. The method of claim 5, wherein P.ltoreq.3 a and Q.ltoreq.3 b.
7. The method of claim 1, wherein in step S5, the cutting sequence of each x-cut line is from two edges to the middle.
8. The method of claim 7, wherein in step S5, the cutting sequence of each y-cut line is from two edges to the middle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010567145.5A CN111761786B (en) | 2020-06-19 | 2020-06-19 | Cutting method of semiconductor packaging material sheet |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010567145.5A CN111761786B (en) | 2020-06-19 | 2020-06-19 | Cutting method of semiconductor packaging material sheet |
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| Publication Number | Publication Date |
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| CN111761786A CN111761786A (en) | 2020-10-13 |
| CN111761786B true CN111761786B (en) | 2022-03-25 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114346328B (en) * | 2021-12-29 | 2023-03-28 | 河北中瓷电子科技股份有限公司 | Automatic segmentation method of metal cover plate for packaging |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1126402A (en) * | 1997-07-02 | 1999-01-29 | Disco Abrasive Syst Ltd | Device and method for precise cutting |
| JP2005223130A (en) * | 2004-02-05 | 2005-08-18 | Disco Abrasive Syst Ltd | Splitting method of semiconductor wafer |
| CN102496602A (en) * | 2011-12-26 | 2012-06-13 | 成都先进功率半导体股份有限公司 | Chip cutting method |
| CN102826744A (en) * | 2012-08-31 | 2012-12-19 | 深圳市华星光电技术有限公司 | Device and method for cutting glass substrate |
| CN110732790A (en) * | 2019-10-28 | 2020-01-31 | 东莞记忆存储科技有限公司 | processing method for cutting package substrate |
-
2020
- 2020-06-19 CN CN202010567145.5A patent/CN111761786B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1126402A (en) * | 1997-07-02 | 1999-01-29 | Disco Abrasive Syst Ltd | Device and method for precise cutting |
| JP2005223130A (en) * | 2004-02-05 | 2005-08-18 | Disco Abrasive Syst Ltd | Splitting method of semiconductor wafer |
| CN102496602A (en) * | 2011-12-26 | 2012-06-13 | 成都先进功率半导体股份有限公司 | Chip cutting method |
| CN102826744A (en) * | 2012-08-31 | 2012-12-19 | 深圳市华星光电技术有限公司 | Device and method for cutting glass substrate |
| CN110732790A (en) * | 2019-10-28 | 2020-01-31 | 东莞记忆存储科技有限公司 | processing method for cutting package substrate |
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| CN111761786A (en) | 2020-10-13 |
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