CN111756883A

CN111756883A - Terminal device and display screen and application thereof

Info

Publication number: CN111756883A
Application number: CN201910243075.5A
Authority: CN
Inventors: 吴旭东; 景燎; 刘思远
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2019-03-28
Filing date: 2019-03-28
Publication date: 2020-10-09
Anticipated expiration: 2039-03-28
Also published as: CN111756883B

Abstract

The invention provides a terminal device, a display screen and application thereof, wherein the terminal device comprises a terminal device main body, the display screen and a camera module, wherein the display screen is provided with a light through hole, the camera module is positioned below the display screen, the camera module is provided with a front end, the front end of the camera module is fixedly attached to the display screen, and the camera module is aligned to the light through hole of the display screen, so that light rays outside the display screen are received by the camera module through the light through hole.

Description

Terminal device and display screen and application thereof

Technical Field

The invention relates to the field of electronic equipment, in particular to terminal equipment with a full-face screen, a display screen and application thereof.

Background

Present electronic equipment has the function of making a video recording usually, for this reason, among the current cell-phone terminal, generally has the front and back module of making a video recording, wherein the front module of making a video recording through being set up in the homonymy of display screen for satisfy demands such as user auto heterodyne. The front camera module occupies a larger screen space, which is contrary to the current trend of seeking a full screen.

The current practice is to design the camera module as a telescoping camera module to hide and use the camera function. When the camera shooting function of the electronic equipment needs to be used, at least part of the camera shooting module is controlled to extend out of the shell of the electronic equipment, and when the camera shooting function is finished, at least part of the camera shooting module is controlled to retract into the shell of the electronic equipment. However, the camera module itself is a relatively precise component, the service life of the camera module in the high-frequency back-and-forth movement is still to be examined, and the camera module is easily damaged due to the blocking of external force in the moving process.

Therefore, how to guarantee the front camera function of the electronic device and also consider the pursuit of a full screen is still an urgent problem to be solved.

Disclosure of Invention

An object of the present invention is to provide a terminal device, a display screen and an application thereof, wherein a camera module of the terminal device can collect sufficient light and a screen ratio of the terminal device can be improved.

Another object of the present invention is to provide a terminal device, a display screen and an application thereof, wherein the camera module of the terminal device is configured as an off-screen camera module and can receive sufficient light through the light-passing hole of the display screen.

Another object of the present invention is to provide a terminal device, a display screen and an application thereof, wherein the camera module of the terminal device is configured as an under-screen camera module and can receive sufficient light through a light-passing hole located at an edge of the display screen.

Another objective of the present invention is to provide a terminal device, a display screen thereof and an application thereof, wherein the light passing through the light-passing hole can be guided to the camera module along a predetermined path to be received by the camera module.

Another object of the present invention is to provide a terminal device, a display screen and an application thereof, wherein the camera module and the display screen can be assembled together to facilitate maintaining the relative positions of the camera module and the display screen.

Another object of the present invention is to provide a terminal device, a display screen and an application thereof, wherein the camera module of the terminal device can be designed to be smaller in size, so as to facilitate reduction of the overall height of the display screen and the camera module located below the display screen.

Drawings

Fig. 1 is a schematic diagram of a terminal device according to the prior art.

FIG. 2 is a schematic diagram of a display screen and a camera module according to the prior art

FIG. 3 is a diagram of a display screen according to a preferred embodiment of the present invention.

FIG. 4A is a schematic diagram of a display panel according to a preferred embodiment of the invention.

FIG. 4B is a schematic diagram illustrating a display panel according to a preferred embodiment of the invention.

FIG. 5A is a schematic view of a display panel according to a preferred embodiment of the invention.

FIG. 5B is a schematic diagram illustrating a display panel according to a preferred embodiment of the invention.

FIG. 6A is a diagram of a display screen according to a preferred embodiment of the invention.

FIG. 6B is a schematic diagram of the display screen according to the preferred embodiment of the invention.

FIG. 7 is a diagram of a display screen according to a preferred embodiment of the present invention.

FIG. 8 is a diagram of a display screen according to a preferred embodiment of the present invention.

FIG. 9 is a diagram of a display screen according to a preferred embodiment of the present invention.

FIG. 10 is a diagram of a display screen according to a preferred embodiment of the present invention.

FIG. 11 is a schematic view of a display panel according to a preferred embodiment of the invention.

FIG. 12 is a schematic view of a display panel according to a preferred embodiment of the invention.

FIG. 13 is a diagram of a display screen according to a preferred embodiment of the present invention.

FIG. 14A is a schematic view of a display panel according to a preferred embodiment of the invention.

FIG. 14B is a schematic view of a display panel according to a preferred embodiment of the invention.

FIG. 15 is a diagram of a display screen according to a preferred embodiment of the present invention.

FIG. 16 is a schematic view of a display panel according to a preferred embodiment of the invention.

FIG. 17 is a diagram of a display screen according to a preferred embodiment of the present invention.

FIG. 18A is a diagram illustrating an application of a display screen according to a preferred embodiment of the present invention.

FIG. 18B is a diagram illustrating an application of a display screen according to a preferred embodiment of the present invention.

FIG. 19 is a diagram illustrating an application of a display screen according to a preferred embodiment of the present invention.

FIG. 20 is a diagram illustrating an application of a display screen according to a preferred embodiment of the present invention.

FIG. 21 is a diagram illustrating an application of a display screen according to a preferred embodiment of the present invention.

FIG. 22 is a diagram illustrating an application of a display screen according to a preferred embodiment of the present invention.

FIG. 23 is a diagram illustrating an application of a display screen according to a preferred embodiment of the present invention.

FIG. 24 is a diagram illustrating an application of a display screen according to a preferred embodiment of the present invention.

FIG. 25 is a diagram illustrating an application of a display screen according to a preferred embodiment of the present invention.

FIG. 26 is a diagram illustrating an application of a display screen according to a preferred embodiment of the present invention.

FIG. 27 is a diagram illustrating an application of a display screen according to a preferred embodiment of the present invention.

FIG. 28 is a diagram of a display screen according to a preferred embodiment of the present invention.

FIG. 29 is a diagram of a display screen according to a preferred embodiment of the invention.

Fig. 30 illustrates a specific example of a camera module according to an embodiment of the present application.

Fig. 31 illustrates another specific example of the camera module according to the embodiment of the present application.

Fig. 32 illustrates still another specific example of the camera module according to the embodiment of the present application.

Fig. 33 illustrates still another specific example of the camera module according to the embodiment of the present application.

Fig. 34 illustrates still another specific example of the camera module according to the embodiment of the present application.

Fig. 35 illustrates still another specific example of the camera module according to the embodiment of the present application.

Fig. 36 illustrates still another specific example of the camera module according to the embodiment of the present application.

Fig. 37 illustrates still another specific example of the camera module according to the embodiment of the present application.

Fig. 38 illustrates still another specific example of the camera module according to the embodiment of the present application.

Fig. 39 illustrates still another specific example of the camera module according to the embodiment of the present application.

Fig. 40 illustrates still another specific example of the camera module according to the embodiment of the present application.

Fig. 41 illustrates still another specific example of the image pickup module according to the embodiment of the present application.

Fig. 42 illustrates still another specific example of the camera module according to the embodiment of the present application.

Fig. 43 illustrates a schematic view of a conventional camera module based on a molding process.

FIG. 44 illustrates a specific schematic of the photosensitive chip of the camera module

Fig. 45 illustrates another specific illustration of the photosensitive chip of the image pickup module.

Fig. 46 illustrates a specific illustration of the photosensitive layer of the photosensitive chip of the camera module.

FIG. 47 illustrates another specific illustration of the photosensitive layer of the photo-sensing chip of the camera module.

FIG. 48A is a schematic view of an assembly system according to a preferred embodiment of the present invention.

FIG. 48B is a schematic diagram of an assembly process according to a preferred embodiment of the present invention.

FIG. 49 is a schematic view of the support platform of the mounting system according to a preferred embodiment of the invention.

FIG. 50 is a schematic diagram of an assembly process according to a preferred embodiment of the present invention.

FIG. 51A is a schematic diagram of an assembly process according to a preferred embodiment of the present invention.

FIG. 51B is a schematic diagram of an assembly process according to a preferred embodiment of the present invention.

FIG. 51C is a schematic diagram of an assembly process according to a preferred embodiment of the present invention.

FIG. 52 is a schematic diagram of an assembly process according to a preferred embodiment of the present invention.

FIG. 53 is a schematic diagram of an assembly process according to a preferred embodiment of the present invention.

FIG. 54 is a schematic diagram of an assembly process according to a preferred embodiment of the present invention.

FIG. 55 is a schematic diagram of an assembly process according to a preferred embodiment of the present invention.

FIG. 56 is a schematic illustration of an assembly process according to a preferred embodiment of the present invention.

FIG. 57 is a schematic diagram of an assembly process according to a preferred embodiment of the present invention.

FIG. 58 is a schematic view of an assembly process according to a preferred embodiment of the present invention.

FIG. 59 is a schematic illustration of an assembly process according to a preferred embodiment of the present invention.

Fig. 60A is a schematic view of a lens barrel according to a preferred embodiment of the present invention.

Fig. 60B is a schematic view of a lens barrel according to a preferred embodiment of the present invention.

Fig. 60C is a schematic view of a lens barrel according to a preferred embodiment of the present invention.

Fig. 60D is a schematic view of a lens barrel according to a preferred embodiment of the present invention.

Fig. 60E is a schematic view of a lens barrel according to a preferred embodiment of the present invention.

Fig. 61A is a diagram of a terminal device according to a preferred embodiment of the invention.

FIG. 61B is a diagram of a display unit according to a preferred embodiment of the invention.

FIG. 61C is a partial schematic view of another operating state of the display unit according to the above preferred embodiment of the invention.

FIG. 62A is a partial schematic view of a display unit according to a preferred embodiment of the invention.

FIG. 62B is a partial schematic view of a display unit according to a preferred embodiment of the invention.

FIG. 62C is a partial schematic view of a display unit according to a preferred embodiment of the invention.

FIG. 63 is a diagram of a display unit according to a preferred embodiment of the invention.

FIG. 64 is a diagram of a display unit according to a preferred embodiment of the invention.

FIG. 65 is a diagram of a display unit according to a preferred embodiment of the invention.

FIG. 66 is a diagram of a display unit according to a preferred embodiment of the invention.

FIG. 67 is a diagram of a display unit according to a preferred embodiment of the invention.

FIG. 68 is a diagram of a display unit according to a preferred embodiment of the invention.

FIG. 69 is a diagram of a display unit according to a preferred embodiment of the invention.

FIG. 70 is a diagram of a display unit according to a preferred embodiment of the invention.

FIG. 71 is a diagram of a display unit according to a preferred embodiment of the invention.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be in a particular orientation, constructed and operated in a particular orientation, and thus the above terms are not to be construed as limiting the present invention.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

While ordinal numbers such as "first," "second," etc., will be used to describe various components, those components are not limited herein. The term is used only to distinguish one element from another. For example, a first component could be termed a second component, and, similarly, a second component could be termed a first component, without departing from the teachings of the inventive concepts. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The terminology used herein is for the purpose of describing various embodiments only and is not intended to be limiting. As used herein, the singular forms are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, numbers, steps, operations, components, elements, or combinations thereof, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, elements, or groups thereof.

Terms used herein, including technical and scientific terms, have the same meaning as terms commonly understood by one of ordinary skill in the art, unless otherwise defined. It will be understood that terms defined in commonly used dictionaries have meanings that are consistent with their meanings in the prior art.

The invention is described in further detail below with reference to the following figures and detailed description:

application overview:

in recent years, a technical solution of an under-screen camera module is proposed, in which the camera module is held below a display screen, is mounted on a main board of an electronic device such as a mobile phone, and is limited to a manufacturing process, and a large light-transmitting area is reserved in the display screen, so that the camera module can normally view through the light-transmitting area. The size of the light-transmitting area is far larger than a light-receiving area of the camera module, and once the field angle theta of the camera module is set to be larger, the light-transmitting area also needs to be set to be larger so as to meet the view finding requirement of the camera module in the process of moving back and forth. The light receiving area of the camera module is an area where a lens part of the camera module is used for light entering.

Reference may be made to fig. 1A and 1B, which are schematic diagrams of a conventional under-screen camera module 30P. As shown in fig. 1, the display screen 20P has a light-transmitting area S, wherein the light-transmitting area S is limited to the previous manufacturing process and is much larger than the light-receiving area P of the camera module 30P, and the light-transmitting area S needs to be made larger when the camera module 30P needs to move back and forth relative to the display screen 20P.

When viewed from above the display screen 20P, the light-transmitting area S occupies a larger area of the display screen 20P, and further, since the light-transmitting area S in the prior art cannot be used for displaying in order to ensure the light-entering amount of the module, it is not beneficial to improve the screen occupation ratio of the entire display screen 20P.

The invention provides a display screen 20P, wherein the display screen 20P can meet imaging light required by a camera module 30P arranged below the display screen 20P and simultaneously improve the screen ratio of the display screen 20P as much as possible.

Referring to fig. 2-5B, there are shown schematic views of the display screen 20 and a manner of making the same according to some embodiments of the present invention.

The display screen 20 has a light hole 200, wherein the light hole 200 is used as the light transmission area, and the camera module 30 is located below the display screen 20. The camera module 30 forms an image by receiving light passing through the light passing hole 200.

It should be noted that the camera module 30 can be fixed to the display screen 20, so that no reserved space is required between the camera module 30 and the display screen 20, the overall height can be reduced, and the camera module 30 is tightly attached to the display screen 20, so that the requirement of the camera module 30 on the size of the area of the light-transmitting area S can be reduced. Of course, the camera module 30 can also be moved relative to the display screen 20, but the light-transmitting area of the display screen 20 can be made smaller.

The light-transmitting area, i.e., the light-transmitting hole 200, can be designed to be smaller, which also puts higher demands on the manufacturing process of the display screen 20.

In the present example, the display screen 20 is implemented as an OLED display screen 20. The display screen 20 includes: the touch screen display panel comprises a cover plate layer 21, a touch layer 22, a polarizing layer 23, an encapsulation layer 24, a pixel layer 25, a driving circuit layer 26 and a back plate layer 27 which are distributed from top to bottom, wherein the back plate layer 27 is positioned at the bottom side, the cover plate layer is positioned at the top side, and the driving circuit layer 26 is formed at the bottom side of the pixel layer 25 and is electrically connected to the pixel layer 25 and used for driving the pixel layer 25 to work; the encapsulation layer 24 is formed on the top side of the pixel layer 25 for encapsulating the pixel layer 25; and the pixel layer 25 includes pixels distributed in an array, and a gap is formed between each of the pixels, so that light sequentially passing through the cover plate layer 21, the touch layer 22, the polarization layer 23, and the encapsulation layer 24 can pass through the pixel layer 25 through the gap.

In particular, the display screen 20 further has the light passing hole 200, wherein the light passing hole 200 passes through the touch layer 22, the polarization layer 23, the encapsulation layer 24, the pixel layer 25, and the driving circuit layer 26. It should be noted that the light passing hole 200 may or may not pass through the cover plate layer 21. The cover plate layer 21 is generally made of a material having a good light transmittance, such as glass, so that the cover plate layer 21 allows light to pass through efficiently without being perforated.

Further, the cover plate layer 21 is located above the display screen 20, and if the cover plate layer 21 is a complete structure, the cover plate layer 21 located above each layer of the display screen 20 may protect other layers, such as moisture or contaminants such as dust entering other layers of the display screen 20. In this example, it is preferable that the light passing hole 200 does not pass through the cover sheet layer 21.

The camera module 30 can be installed below the display screen 20 and receive a sufficient amount of light from above the display screen 20 through the light-passing hole 200.

Further, the camera module 30 is fixedly mounted on the display screen 20, and the size of the light-passing hole 200 of the display screen 20 can be designed to be smaller.

As shown in fig. 3A and fig. 3B, in the present embodiment, the display screen 20 is implemented as an OLED (organic light-emitting Diode) display screen 20. It should be appreciated by those skilled in the art that the OLED display 20 has the advantages of self-luminescence, wide viewing angle, high contrast, low power consumption, high response speed, full color, etc.

The cover plate layer 21 is generally implemented as a glass layer, which is located at the topmost layer of the display screen 20 for protecting the layers located below the cover plate layer 21, and it should be understood that the glass layer is made of a glass material, which is a material with high light transmittance.

The touch layer 22 is located below the cover layer 21, and typically the cover layer 21 and the touch layer 22 are connected by an adhesive. Those skilled in the art will appreciate that the touch layer 22 is an indispensable configuration for realizing the display screen 20 with a touch function.

The polarizing layer 23 is located below the touch layer 22, wherein the polarizing layer 23 is typically implemented as circularly polarized light or the like.

The encapsulation layer 24 is located below the polarization layer 23, wherein the encapsulation layer 24 is used for encapsulating the pixel layer 25 located below the encapsulation layer 24, so that the pixel layer 25 is in a sealed environment, and the organic material in the pixel layer 25 is not polluted or volatilized by the outside. Specifically, the encapsulation layer 24 is of two types, wherein, when the display screen 20 is a rigid screen, the encapsulation layer 24 is made of a rigid light-permeable material, such as glass, plastic, etc.; when the display 20 is a flexible display, the encapsulation layer 24 is made of a flexible light-permeable material, such as a PI Film (Polyimide Film).

The pixel layer 25 is wrapped by the encapsulation layer 24 and is located below the encapsulation layer 24. For the OLED display screen 20, the pixel units in the pixel layer 25 are implemented as OLEDs, i.e., Organic Light-emitting diodes (OLEDs).

The driving circuit layer 26 is located below the pixel layer 25, wherein the driving circuit layer 26 can be electrically connected to the pixel layer 25 to drive the pixel layer 25 to operate.

The back plate layer 27 is located below the driving circuit layer 26, wherein the back plate layer 27 can reinforce the structural strength of the entire display screen 20. The backsheet layer 27 is typically made of a plastic material.

For the OLED display panel 20, care should be taken during the opening process to avoid the pixel layer 25 and the driving circuit layer 26. The driving circuit layer 26 is provided with a circuit structure, and the pixel layer 25 includes a plurality of pixels, and once the light-passing hole 200 destroys the circuit structure of the driving circuit layer 26 or the pixel structure of the pixel layer 25, it is likely to affect the working performance of the OLED display 20.

The hole forming method of the OLED display panel 20 mainly includes three types, one is to perform hole forming processing on each layer of the OLED display panel 20 after each layer of the OLED display panel 20 is assembled, one is to perform hole forming processing on each layer of the OLED display panel 20 layer by layer, and the other is to perform hole forming processing on some layers of the OLED display panel 20, for example, the pixel layer 25 and/or the driving circuit layer 26 in advance, and then perform hole forming processing on the layers after other layers are mounted to form the OLED display panel 20.

It is noted that the opening herein refers not only to the actual aperture, but also to the display 20 forming an area having a function similar to a hole. For example, the display screen 20 may be perforated, and then the position of the perforation is filled with a transparent material so that the area can have a light-transmitting function similar to that of a hole.

It should be noted that, when the display panel 20 with a light-passing hole 200 is obtained in the first way, an opening area may be reserved in the process of manufacturing the driving circuit layer 26 and the pixel layer 25, and the circuit structure of the driving circuit layer 26 and the pixels of the pixel layer 25 are not in the opening area, so as to reduce the influence of the light-passing hole 200 on the working performance of the OLED display panel 20 after subsequent opening.

The pixel layer 25 is formed on the driving circuit layer 26 by vapor deposition. The pixel layer 25 includes an anode layer 251, a light emitting layer 252, a cathode layer 253, and a protection layer 254, wherein the anode layer 251 is located above the driving circuit layer 26, the light emitting layer 252 is located between the anode layer 251 and the cathode layer 253, and the cathode layer 253 is located above the light emitting layer 252 and below the protection layer 254.

The light-passing hole 200 penetrates the pixel layer 25. Specifically, the light passing hole 200 penetrates the pixel layer 25 and the layers of the display panel 20 in a direction perpendicular to the layers of the pixel layer 25 except for the cover plate layer 21 of the display panel 20.

The pixel layer 25 may further include other film layers, such as a planarization layer, a passivation layer, etc., which are not limited herein. In this example, the light hole 200 may be disposed in the display area of the display screen 20, since the diameter of the light hole 200 related to the present invention is less than or equal to 3.99mm, preferably less than or equal to 2mm, and the light hole 200 does not affect the normal display of the display screen 20, the camera module 30 is installed at a preset position corresponding to the light hole 200 and located below the display screen 20.

It should be noted that the preset position should be determined according to the diameter of the light-passing hole 200 and the optical path parameters of the camera module 30, that is, the camera module 30 is disposed at the preset position and can receive light through the light-passing hole 200 on the display screen 20 and perform normal imaging, because the size of the light-passing hole 200 is smaller than that of the existing light-passing hole, the display area is increased, and the manufacturing of the full-face screen is facilitated.

It is noted that the shape of the light passing hole 200 may be triangular, rectangular or circular, and in this example, the light passing hole 200 is preferably circular.

Referring to fig. 4A, a single opening process is applied to the OLED display 20 to open the whole OLED display 20.

After the pixel layer 25 is formed on the driving circuit layer 26, at least a portion of the protection layer 254 of the pixel layer 25 may be removed by etching, or direct drilling, etc. to form a recess, wherein the recess may be filled with at least a portion of a marking material, and the marking material may be used to indicate the opening region. The marking substance may be a transparent material, and the position of the marking substance may be determined based on a difference in light transmittance between the marking substance and a surrounding material.

And mounting other layers of the OLED display screen 20 on the driving circuit layer 26 or the pixel layer 25 to obtain the complete OLED display screen 20. The opening region may be determined from above the OLED display 20 based on the marker substance, and then the opening process may be performed for the OLED display 20. The range of the light passing hole 200 may be larger than the size of the area occupied by the marker substance during the hole forming process, so that the marker substance may be completely removed after the hole forming process is completed.

It will be appreciated that the manner in which the marker substance is used to locate the open pore region at this time is by way of example only. It will be understood by those skilled in the art that the manner of opening the OLED display panel 20 and bypassing the circuit structure of the driving circuit layer 26 and/or the pixel structure of the pixel layer 25 is not limited to the above examples.

Referring to fig. 4B, a specific embodiment of the OLED display 20 that uses a multi-hole process to form holes in the whole OLED display 20 is illustrated.

In this example, the driving circuit layer 26 and the pixel layer 25 are first subjected to a hole opening process, and then the other layers of the OLED display panel 20 are subjected to a hole opening process to obtain the display panel 20 with the light passing hole 200.

The area enclosed by the dashed line frame is the position of the light-passing hole 200, and the light-passing hole 200 penetrates through the display screen 20 in the direction perpendicular to the pixel layer 25 and the driving circuit layer 26. It should be understood by those skilled in the art that the structure of the pixel layer 25 in the figures is only an illustration, each functional layer may be disposed as required, and the specific through position of the light hole 200 may be disposed as required, and is not limited to the position shown in the figures.

Further, the driving circuit layer 26 includes a plurality of TFT structures 261 and a substrate 262, wherein the TFT structures 261 are sequentially disposed on the substrate 262 to form a TFT array. The substrate 262 is located below the TFT structure 261, and the TFT structure 261 is located below the pixel layer 25.

The light-passing hole 200 penetrates from the pixel layer 25 to the substrate 262 of the driving circuit layer 26.

The pixel layer 25 further includes a planarization layer 255 and a pixel definition layer 256, wherein the planarization layer 255 is located between the TFT structure 261 and the anode layer 251, and the pixel definition layer 256 is located between the anode layer 251 and the light-emitting layer 252. The pixel defining layer 256 has at least one pixel groove 2560, wherein at least a portion of the light emitting layer 252 and at least a portion of the anode layer 251 are recess-formed in the pixel groove 2560, so that the pixel defining layer 256 can be used to define the pixel 257.

In this example, the light-passing hole 200 is formed between two TFT structures 261, so as to reduce the circuit influence on the driving circuit layer 26, and the light-passing hole 200 is covered with at least a part of the protection layer 254, so that the anode layer 251, the light-emitting layer 252 and the cathode layer 253 near the light-passing hole 200 are not exposed to the outside, so as to reduce the influence of the outside on the anode layer 251, the light-emitting layer 252 and the cathode layer 253, such as air and moisture, or dust and the like.

The light-passing hole 200 may be formed by designing a small hole in advance during the process of manufacturing the driving circuit layer 26, and the position of the small hole may be as far away from the TFT structure 261 as possible to avoid damaging the structure of the driving circuit layer 26. The small holes may be formed in the driving circuit layer 26 by direct laser drilling or etching.

After the aperture is formed in the driving circuit layer 26, the aperture in the driving circuit layer 26 is covered when the driving circuit layer 26 is formed in the pixel layer 25, and then the driving circuit layer 26 and the pixel layer 25 may be perforated in alignment with the aperture position of the driving circuit layer 26 so that the driving circuit layer 26 and the pixel layer 25 are perforated.

The encapsulation layer 24 is mounted on the driver circuit layer 26 and the pixel layer 25, and holes may be punched in the encapsulation layer 24 in alignment with the driver circuit layer 26 and the pixel layer 25. And continuously installing the polarization layer 23, the touch layer 22, the cover plate layer 21 and the back plate layer 27 to the driving circuit layer 26 and the pixel layer 25, and punching the polarization layer 23, the touch layer 22 and the back plate layer 27 layer by layer to obtain the display screen 20 with the light through hole 200.

According to other embodiments of the present invention, at this time, the small hole located in the driving circuit layer 26 is covered by the pixel layer 25, and then the encapsulation layer 24, the polarization layer 23, the touch layer 22, the cover plate layer 21, and the back plate layer 27 are continuously mounted, after the complete display screen 20 is obtained, a hole is punched in the thickness direction of the display screen 20 in alignment with the small hole, so as to obtain the light through hole 200 penetrating through the display screen 20. It will be appreciated that the layers of the display screen 20 may be assembled to obtain a complete display screen 20, and then the layers other than the cover sheet layer 21 may be perforated in unison. It is also possible to mount the layers of the display screen 20 except the cover plate layer 21, then punch holes, and finally mount the cover plate layer 21 to obtain the complete display screen 20.

According to other embodiments of the present invention, it is understood that the light-passing hole 200 may be formed by first designing a small hole in the process of manufacturing the driving circuit layer 26, the position of the small hole may be as far away from the TFT structure 261 as possible to avoid damaging the structure of the driving circuit layer 26, and then forming the pixel layer 25 on the basis of the driving circuit layer 26. The pixel layer 25 may be punched in alignment with the driving circuit layer 26, and then the encapsulation layer 24, the polarization layer 23, the touch layer 22, the cover plate layer 21, and the back plate layer 27 are mounted, after the complete display screen 20 is obtained, holes are punched in the thickness direction of the display screen 20 in alignment with the small holes, so as to obtain the light-passing holes 200 penetrating through the layers of the display screen 20 except the cover plate layer 21. It will be appreciated that the layers of the display screen 20 may be assembled to obtain a complete display screen 20, and then the layers other than the cover sheet layer 21 may be perforated in unison. It is also possible to mount the layers of the display screen 20 except the cover plate layer 21, then punch holes, and finally mount the cover plate layer 21 to obtain the complete display screen 20.

Referring to fig. 5A and 5B, an embodiment of the OLED display 20 that uses a multi-hole process to open holes through the OLED display 20 is illustrated.

In this example, the driver circuit layer 26 and the pixel layer 25 are obtained first, and then the opening process is performed simultaneously for the driver circuit layer 26 and the pixel layer 25.

Specifically, the anode layer 251, the light emitting layer 252, and the cathode layer 253 of the pixel layer 25 are formed on the driving circuit layer 26, and then at least a portion of the cathode layer 253 is removed by etching to form an opening region in the cathode layer 253.

At least a portion of the pixel layer 25 is exposed through the opening region. Specifically, at least a portion of the pixel defining layer 256 of the pixel layer 25 is exposed through the opening region. Preferably, the projection of the opening area in the vertical direction of the pixel layer 25 and the driving circuit layer 26 is located between the adjacent TFT structures 261, so as to reduce the influence on the circuit of the display screen 20 as much as possible.

After the opening region is formed, the protection layer 254 is continuously formed on the cathode layer 253 and at least a portion of the pixel defining layer 256, wherein the protection material of the protection layer 254 fills the opening region and the region around the opening region is also filled with the protection material of the protection layer 254.

Then, at least a part of the light passing hole 200 is formed in the opening region by drilling or cutting. For example, a laser cutting process is used to cut off at least a part of the pixel layer 25 and the driving circuit layer 26 in the height direction of the opening region along the driving circuit layer 26, so that the light above the pixel layer 25 passes through the pixel layer 25 and the driving circuit layer 26 to reach the lower side of the driving circuit layer 26. The specific method of opening the holes may be to use a mask with a central opening, then etch each layer corresponding to the area of the holes, and cover other parts.

In this example, at least a portion of the cathode layer 253 needs to be removed prior to forming the protective layer 254, and in other embodiments of the invention, at least a portion of the cathode layer 253 and at least a portion of the light emitting layer 252 need to be removed prior to forming the protective layer 254. Specifically, the dry etching process may be performed by a dry etching method, for example, the dry etching process may be performed by a plasma enhanced chemical vapor deposition etching apparatus, or may be performed by an inductively coupled plasma etching apparatus. And the etching gas may be an oxygen-containing gas capable of reacting with the organic material in the light emitting layer 252 or the cathode layer 253, such as oxygen, nitrous oxide, or carbon dioxide; or, the etching gas is oxygen-containing gas and inert gas nitrogen gas which are used simultaneously.

It is to be noted that the size of the opening area and the light-passing hole 200 may not be the same, and when the opening area is larger than the light-passing hole 200 and the light-passing hole 200 is located within the opening area, the cathode layer 253 around the light-passing hole 200 can be protected by the protective layer 254 so as not to be exposed to the outside. When the size of the opening area is the same as that of the light-passing hole 200 or the light-passing hole 200 is larger than the opening area, the cathode layer 253 around the light-passing hole 200 is exposed.

After the pixel layer 25 is formed on the driving circuit layer 26, the light passing hole 200 can penetrate through the driving circuit layer 26 and the pixel layer 25.

Further, the encapsulation layer 24, the polarization layer 23, the touch layer 22, and the cover sheet layer 21 can be mounted with the pixel layer 25 and the driving circuit layer 26 in this order. After the encapsulation layer 24, the polarization layer 23, the touch layer 22 and the cover plate layer 21 are respectively and fixedly mounted on the pixel layer 25 and the driving circuit layer 26, holes are drilled or cut so that the light passing holes 200 pass through the entire display screen 20 except the cover plate layer 21.

When the display panel 20 includes the back plate layer 27, the back plate layer 27 is mounted on the driving circuit layer 26, and the light passing hole 200 passes through the back plate layer 27 in a height direction of the display panel 20.

Of course, it is understood that the encapsulation layer 24, the polarization layer 23, the touch layer 22, and the back plate layer 27 may be perforated after being fixedly mounted to the driving circuit layer 26 and the pixel layer 25, respectively. In other words, when the encapsulation layer 24 is mounted on the pixel layer 25, the opening can be formed in the encapsulation layer 24 in alignment with the pixel layer 25. The polarizer layer 23 may be perforated after the polarizer layer 23 is mounted to the encapsulation layer 24. After the touch layer 22 is mounted on the polarizing layer 23, the touch layer 22 may be perforated. The back plate layer 27 may be perforated after the back plate layer 27 is mounted to the driving circuit layer 26.

The opening timing of the display panel 20 other than the driving circuit layer 26 and the pixel layer 25 is not limited to the above-described example. For example, the encapsulation layer 24, the polarization layer 23, and the touch layer 22 are located on the same side of the pixel layer 25, and the opening process can be performed simultaneously. The back plate layer 27 is located on the other side of the pixel layer 25, and may be subjected to a hole opening process alone or together with the encapsulation layer 24, the polarization layer 23, and the touch layer 22.

It is worth mentioning that other layers of the display screen 20 may be drilled or cut layer by layer before or after the driver circuit layer 26 forms the pixel layer 25, and then interpenetrated by adjusting the relative positions of the layers to align the apertures in the layers.

Further, the inner diameters of the portions of the light passing holes 200 corresponding to the respective layers of the display screen 20 may be different. For example, the inner diameter of the portion of the light-passing hole 200 corresponding to the upper touch layer 22 may be larger than the inner diameter of the portion of the light-passing hole 200 corresponding to the lower back plate layer 27. Each of the small holes corresponding to each layer of the display screen 20 may be independently manufactured, so that the inner diameters of the finally formed light passing holes 200 corresponding to each layer may be different.

Further, for each layer of the display screen 20, taking the driving circuit layer 26 as an example, the small holes of the driving circuit layer 26 may be cylindrical, that is, the inner diameters of the small holes at different height positions of the driving circuit layer 26 are the same. The small holes of the driving circuit layer 26 may also be conical, that is, the inner diameters of the small holes at different height positions of the driving circuit layer 26 are different, for example, the inner diameters of the small holes gradually decrease from top to bottom.

It will be appreciated by the person skilled in the art that the shape of the apertures is not limited to the examples described above.

Referring to fig. 6A and 6B, and to fig. 5A and 5B, another embodiment of the display screen 20 according to the present invention is illustrated. In this example, a protective material 2812 is provided near the position of the light passing hole 200 of the display screen 20. Particularly near the positions of the light passing holes 200 corresponding to the pixel layer 25 and the driving circuit layer 26. The protective material 2812 may be made of the same material as the protective layer 254 of the pixel layer 25, or may be made of a material different from the protective layer 254 of the pixel layer 25.

The protective material 2812 is located near the position of the light hole 200, and can protect the exposed internal structure of each layer of the display screen 20. Especially for the pixel layer 25 and the driver circuit layer 26. The internal structures of the pixel layer 25 and the driving circuit layer 26 are exposed in the light passing hole 200, and when dust, moisture, or air enters the light passing hole 200, damage may be caused to the pixel layer 25 and the driving circuit layer 26. The protective material 2812 can cover the exposed portions of the pixel layer 25 and the driving circuit layer 26 at the position of the light-passing hole 200, so as to protect the pixel layer 25 and the driving circuit layer 26, so that the pixel layer 25 and the driving circuit layer 26 can be in a stable working environment.

After obtaining the display screen 20 with the light hole 200, the protective material 2812 may be poured into the light hole 200 of the display screen 20, and then the protective material 2812 is subjected to a hole opening process to form a new light hole 200. The protective material 2812 can cover each layer of the display screen 20. Of course, the filling height of the protective material 2812 in the light passing hole 200 can be controlled according to the user's requirement, so that the covering position of the protective material 2812 is selected. The protective material 2812 may not completely fill the light passing hole 200, for example, the position of the back plate layer 27 corresponding to the light passing hole 200 may not be protected by the protective material.

It should be noted that, in this example, the cover plate layer 21 is not perforated, and the cover plate layer 21 is generally made of glass and has a good light transmission performance, so that the cover plate layer 21 may not be perforated, and the cover plate layer 21 may also be located above to protect other layers of the display screen 20.

In this way, the original light hole 200 can be made larger in advance, and then the protective material 2812 is cut or drilled at a later stage to control the light hole 200 so as to make the light hole 200 reach a desired size. It is noted that the protective material 2812 around the light passing hole 200 may be the same as the material of the protective layer 254 or different from the material of the retention layer.

Referring to fig. 6B, a specific method for manufacturing the display screen 20 is illustrated.

In this example, the layers making up the display screen 20 are first perforated and then filled with the protective material 2812. The protective material 2812 is a transparent material. That is, the corresponding light-passing hole 200 of the display screen 20 is filled with the transparent material.

Specifically, the touch layer 22, the polarizing layer 23, the encapsulation layer 24, the pixel layer 25, the driving circuit layer 26, and the back plate layer 27 may be respectively subjected to an opening process, and then the protection material 2812 may be filled in the opening position.

The touch layer 22, the polarizer layer 23, the encapsulation layer 24, the pixel layer 25, the driver circuit layer 26, and the backplane layer 27 are then mounted together in alignment to form the display screen 20. The display 20 may now be used as a display with "holes". The transparent materials corresponding to the touch layer 22, the polarization layer 23, the encapsulation layer 24, the pixel layer 25, the driving circuit layer 26 and the back plate layer 27 may function as holes.

Further, the touch layer 22, the polarization layer 23, the encapsulation layer 24, the pixel layer 25, the driving circuit layer 26, and the back plate layer 27 may be simultaneously perforated, and a portion of the protection material 2812 may be left around the light hole 200. The cover sheet layer 21 is then mounted to obtain the display screen 20 shown in fig. 6A.

Referring to fig. 7, another embodiment of the display screen 20 according to the present invention is illustrated.

In this example, at least a portion of the protective material 2812 is formed around the light passing hole 200 of the display screen 20. The protective material 2812 can protect the key layers around the light through hole 200, such as the cathode layer 253, the pixel defining layer 256, the TFT structure 261, and the like.

The position of the protective material 2812 around the light passing hole 200 may be set as needed. For example, after obtaining the display screen 20 with the light passing hole 200, the diameter of the light passing hole 200 may be slightly larger than a desired design value, and then the protective material 2812 is filled into the light passing hole 200 until the whole light passing hole 200 is completely filled, and then the light passing hole 200 is cut at the position to obtain the light passing hole 200 with a desired size according to the need.

In this example, it is optional to protect the driver circuit layer 26 and the pixel layer 25 in the display screen 20 separately.

Specifically, the driving circuit layer 26 is obtained first, and the driving circuit layer 26 may be obtained by forming a film on a substrate, coating a photoresist, exposing, developing, etching, peeling, or the like. After the driving circuit layer 26 is prepared, a small hole penetrating in the height direction may be prepared in the driving circuit layer 26 by etching or drilling. Preferably, the small holes are formed between adjacent TFT structures 261 of the driving circuit layer 26.

The pixel layer 25 is then formed in the driver circuit layer 26, and the small holes are filled in this process. The materials corresponding to the positions of the small holes of the pixel layer 25 and the driving circuit layer 26 can be removed to obtain the light passing hole 200.

The protective material 2812 is then filled toward the light-passing holes 200 corresponding to the pixel layer 25 and the driving circuit layer 26, and then the protective material 2812 in the light-passing holes 200 is subjected to a hole opening process to obtain a hole slightly smaller than the original light-passing hole 200 again. Portions of the pixel layer 25 and the driving circuit layer 26 exposed within the light passing hole 200 at this time may be coated with the protective material 2812, and thus may be protected by the protective material 2812.

The other layers of the display screen 20 are then mounted to the driver circuit layer 26 and the pixel layer 25. Alternatively, the layers may be drilled or cut after the installation so that the light-passing holes 200 extend through the display 20, or drilled or cut in alignment with the small holes after each layer is installed so that the light-passing holes 200 extend through the layers of the display 20.

Referring to fig. 8, and to fig. 2-5B, another embodiment of the display screen 20 according to the present invention is illustrated.

In this example, the periphery of the light passing hole 200 of the display screen 20 corresponding to the pixel layer 25 is filled with at least a part of a protective material 2812.

The manufacturing method of the display screen 20 may include the steps of: the TFT structure 261, the anode layer 251, the light emitting layer 252, and the cathode layer 253 are sequentially formed on the substrate 262, and further, the planarization layer 255 is formed after the TFT structure 261 is formed on the substrate 262 and before the anode layer 251, and at least a portion of the planarization layer 255 in a thickness direction is removed and the light passing hole 200 is formed by a single patterning process. The light passing hole 200 is formed through the driving circuit layer 26 and the planarization layer 255, and then the anode layer 251, the pixel defining layer 256, and the cathode layer 253 are formed on the planarization layer 255. ,

at least portions of the light emitting layer 252 and the cathode layer 253 corresponding to the open region in the thickness direction are removed by an etching process. Specifically, at least portions of the pixel defining layer 256, the light emitting layer 252, and the cathode layer 253 corresponding to the opening regions may be removed using an etching process such that at least portions of the planarization layer 255 are exposed.

Then, the pixel layer 25 is encapsulated by a protection material 2812, at least a portion of the planarization layer 255 is covered by the protection material 2812, and then the light hole 200 is formed in the opening region by cutting or drilling, so that the planarization layer 255 and the pixel definition layer 256 at the edge of the light hole 200 can be covered by the protection material 2812.

In this way, the pixel layer 25 and the driving circuit layer 26 corresponding to the edge of the light hole 200 can be selectively covered with the protection material 2812 according to the requirement. The protective material 2812 can not only protect the pixel layer 25, but also control the size of the light passing hole 200 by controlling the thickness of the protective material 2812 in the radial direction.

In this example, the positions of the light holes 200 may be preset, and are preferably set between the adjacent TFT structures 261 or between the adjacent pixels, so as to avoid affecting the performance of the whole display screen 20 while the light holes 200 are set.

Further, after the pixel layer 25 and the driving circuit layer 26 with the light passing hole 200 are manufactured, the encapsulation layer 24, the polarization layer 23, the touch layer 22, and the cover plate layer 21 or the back plate layer 27 may be continuously mounted on the pixel layer 25 and the driving circuit layer 26 as required. The encapsulation layer 24, the polarization layer 23, the touch layer 22, and the back plate layer 27 may be formed with holes in advance, may be formed with holes after being mounted on the pixel layer 25 and the driving circuit layer 26, or may be formed with holes uniformly after the entire display screen 20 is mounted.

It is noted that the cover sheet layer 21 is not perforated, and the layers of the display screen 20 other than the cover sheet layer 21 may be perforated collectively from the back sheet layer 27 side of the display screen 20 after the layers of the display screen 20 are mounted together.

Further, the cover sheet layer 21 may be partially perforated. Specifically, at least a portion of the cover sheet layer 21 in the thickness direction may be perforated, for example, when the display screen 20 is perforated from the back sheet layer 27 side of the display screen 20 toward the cover sheet layer 21 from the back sheet layer 27, at least a portion of the cover sheet layer 21 in the thickness direction may be removed. But when looking inward from the cover plate layer 21 side of the display screen 20, the cover plate layer 21 still completely covers the touch layer 22. The cover sheet layer 21 may still protect the other layers of the display screen 20.

Referring to fig. 9, a specific embodiment of the display screen 20 with the camera module 30 according to the present invention is illustrated.

The camera module 30 is fixedly mounted on the display screen 20, and the camera module 30 is aligned with the light-passing hole 200.

Specifically, the display screen 20 has a mounting channel 201, wherein at least a portion of the camera module 30 can be received in the mounting channel 201. The display 20 with the back plate layer 27 is taken as an example for explanation. The mounting channel 201 is formed in the backplate layer 27.

The mounting channel 201 is located at the position of the light passing hole 200, the mounting channel 201 is communicated with the light passing hole 200, and the mounting channel 201 and the light passing hole 200 are located in the height direction of the display screen 20. Preferably, the inner diameter of the installation channel 201 is larger than the inner diameter of the light passing hole 200 at other positions, and at this time, the cross-sectional size of the light passing hole 200 of the display screen 20 is non-constant.

When the camera module 30 is mounted to the display screen 20 and is partially received in the mounting channel 201, the overall height of the camera module 30 and the display screen 20 can be reduced, thereby facilitating the reduction of the height dimension of the mobile terminal.

The mounting channel 201 is slightly larger than the camera module 30, and the part of the mounting channel 201 not filled by the camera module 30 can be filled with colloid so that the camera module 30 can be more stably fixed on the display screen 20.

For example, the side of the camera module 30 may be adhered to the back plate layer 27 by glue, so that the camera module 30 is fixedly held to the mounting channel 201. The top surface of the camera module 30 may also be fixed to a back surface of the driving circuit layer 26 by an adhesive such as glue, so as to facilitate the camera module 30 to be firmly held in the mounting channel 201.

At least part of the camera module 30 extends into the light hole 200 of the display screen 20. When the camera module 30 extends into the light-passing hole 200, the size of each layer of the display screen 20 corresponding to the light-passing hole 200 can control the depth of the camera module 30 entering the light-passing hole 200.

In this example, at least a part of the camera module 30 is accommodated in the portion of the light-passing hole 200 corresponding to the back plate layer 27, and the portions of the layers above the back plate layer 27, for example, the portions of the light-passing hole 200 corresponding to the driving circuit layer 26 and the pixel layer 25, may be smaller than the portions of the light-passing hole 200 corresponding to the back plate layer 27, so that the area of the display screen 20 occupied by the light-passing hole 200 is smaller when viewed from the front side of the display screen 20. The front side of the display 20 is referred to herein as the side that faces the user during normal use.

In other embodiments of the present invention, a front portion of the camera module 30 may extend to the driving circuit layer 26, or even a portion of the light-passing hole 200 corresponding to the pixel layer 25. Through to each layer corresponding the control of logical unthreaded hole 200 size, the degree of depth that the module 30 of making a video recording stretched into display screen 20 can be controlled to through the design logical unthreaded hole 200 corresponds the size of each layer of display screen 20, controls the module 30 of making a video recording with the whole size of display screen 20, especially the module 30 of making a video recording with the height dimension of display screen 20.

Referring to fig. 10, a display 20A with a light passing hole 200A according to a preferred embodiment of the present invention is illustrated.

In this example, the display screen 20A is implemented as an LCD display screen 20A. The display screen 20A includes: the touch panel comprises a cover plate layer 21A, a touch layer 22A, a polarization layer 23A, an encapsulation layer 24A, a pixel layer 25A, a driving circuit layer 26A and a back plate layer 27A, wherein the driving circuit layer 26A is formed on the bottom side of the pixel layer 25A and is electrically connected to the pixel layer 25A for driving the pixel layer 25A to work; the encapsulation layer 24A is formed on the top side of the pixel layer 25A for encapsulating the pixel layer 25A; the pixel layer 25A includes pixels distributed in an array, and a gap is formed between each of the pixels, so that light rays sequentially passing through the cover plate layer 21A, the touch layer 22A, the polarization layer 23A, and the encapsulation layer 24A can pass through the pixel layer 25A through the gap.

For the LCD panel 20A, the liquid crystals of the pixel layer 25A exhibit an ordered arrangement when energized.

In particular, the display screen 20A further has the light passing hole 200A, wherein the light passing hole 200A passes through the touch layer 22A, the polarizing layer 23A, the encapsulating layer 24A, the pixel layer 25A and the driving circuit layer 26A.

The polarizing layers 23A may be implemented as a first polarizing plate and a second polarizing plate on both sides of the pixel layer 25A, respectively.

The pixel layer 25A includes a filter layer 251A (cf) and a liquid crystal 252A, and the liquid crystal 252A is located between the filter layer 251A and the driving circuit layer 26A. Taking a TFT-LCD as an example, the driving circuit layer 26A may include a plurality of TFT structures and the substrate, and the TFT structures are formed on the substrate through thin film, photolithography, etching, film stripping, and the like.

The light passing hole 200A is formed in each layer of the display panel 20A except for the cover plate layer 21A, and penetrates each layer of the display panel 20A except for the cover plate layer 21A in the height direction of the display panel 20A.

Light from above the display screen 20A or outside the display screen 20A can pass through the light-passing hole 200A to be received by the camera module 30 located below the display screen 20A or inside the display screen 20A.

The periphery of the light through hole 200A is provided with a sealing material, so that the liquid crystal 252A cannot flow into the light through hole 200A, thereby avoiding affecting the working performance of the camera module 30 or the display performance of the display screen 20A.

Further, the LCD panel 20A includes a liquid crystal layer 28A, wherein the liquid crystal layer 28A includes the liquid crystal 252A, the filter layer 251A, and the driving circuit layer 26A.

The method for manufacturing the LCD display 20A with the light-passing holes 200A mainly includes three ways, one is to perform uniform hole opening on each layer of the LCD display 20A after each layer of the LCD display 20A is assembled together, the other layers of the LCD display 20A are then installed on the liquid crystal layer 28A, the other layers of the LCD display 20A are then uniformly opened, the other layers of the LCD display 20A are then individually opened, the liquid crystal layer 28A of the LCD display 20A is then separately opened, the other layers of the LCD display 20A are then installed on the liquid crystal layer 28A layer by layer, and the holes are formed on each layer of the LCD display 20A layer by layer.

It should be understood by those skilled in the art that the foregoing is only exemplary, and the method for manufacturing the LCD panel 20A with the light passing hole 200A is not limited to the foregoing examples.

Referring to fig. 11, a specific method for manufacturing the LCD panel 20A with the light passing hole 200A according to the present invention is illustrated.

In this example, the LCD display 20A with the clear aperture 200A is obtained by a single opening.

Specifically, in the process of manufacturing the liquid crystal layer 28A, a sealing region 281A is formed between the driver circuit layer 26A of the liquid crystal layer 28A and the filter layer 251A, wherein the sealing region 281A may be formed by being surrounded by a sealing material 2811A. The liquid crystal 252A of the liquid crystal layer 28A is mainly disposed outside the seal region 281A.

The layers of the LCD panel 20A are then assembled into a complete LCD panel 20A. The LCD display 20A is perforated based on the sealing region 281A.

The LCD display 20A has an opening area 282A, wherein the opening area 282A overlaps the sealing area 281A and is not larger than the sealing area 281A. After the hole opening process is performed on the LCD panel 20A, at least a portion of the sealing regions 281A is removed, and the liquid crystal 252A located between the sealing regions 281A cannot pass over the sealing material 2811A due to the blocking effect of the sealing material 2811A, so that the liquid crystal 252A cannot overflow to the position of the light passing hole 200A.

In this way, the LCD display 20A can obtain the light passing hole 200A through a single hole forming operation.

More specifically, the sealing material 2811A may be disposed at a predetermined position of the driving circuit layer 26A of the liquid crystal layer 28A to form the sealing region 281A, and the shape of the sealing region 281A may be a circle, a triangle or a rectangle. The liquid crystal 252A is then filled in a position outside the sealing region 281A of the driving circuit layer 26A.

After the liquid crystal 252A is filled, the filter layer 251A may be mounted on the driving circuit layer 26A. The liquid crystal 252A is located between the driving circuit layer 26A and the filter layer 251A, and is confined to a fixed area.

After the hole opening processing is performed on the liquid crystal layer 28A, the hole opening region 282A is smaller than the sealing region 281A, and at least a part of the sealing material 2811A can be held between the driver circuit layer 26A and the filter layer 251A, so that the liquid crystal 252A does not overflow at the position of the sealing material 2811A. The liquid crystal 252A can still be confined to the original fixed area.

In this way, the hole opening process for the liquid crystal layer 28A can be completed while the liquid crystal 252A of the liquid crystal layer 28A is kept from overflowing.

It should be noted that, after the display screen 20A is installed, if the hole can be formed outside the display screen 20A in alignment with the sealing region 281A, the hole forming process can be directly performed, for example, in a case where the sealing region 281A is visible outside the display screen 20A.

If the sealing material 2811A is an opaque material and the position of the sealing region 281A cannot be determined outside the display screen 20A, a mark may be provided in the sealing region 281A so that the position of the sealing region 281A can be determined outside the display screen 20A.

Note that the position of the sealing material 2811A may be set to avoid a corresponding circuit portion of the driver circuit layer 26A in the height direction, so as to reduce the influence on the circuit of the driver circuit layer 26A.

Referring to fig. 12, a specific method for manufacturing the LCD panel 20A with the light passing hole 200A according to the present invention is illustrated.

In this example, the liquid crystal layer 28A is first apertured, and then the other layers of the display screen 20A are apertured.

Specifically, a sealing region 281A is disposed in a predetermined region of the driving circuit layer 26A to prevent the liquid crystal 252A outside the sealing region 281A from flowing into the sealing region 281A during the subsequent filling of the liquid crystal 252A. The driving circuit layer 26A may be perforated along a perforated region 282A after the sealing region 281A is disposed. The perforated region 282A is located within the sealing region 281A. The opening process may be performed on the driving circuit layer 26A and the filter layer 251A along the opening region 282A at the same time after the filter layer 251A is mounted on the driving circuit layer 26A.

According to some embodiments of the present invention, the order of opening the liquid crystal layer 28A may be to open the driving circuit layer 26A first and then open the filter layer 251A.

For example, based on the sealing region 281A, an opening process is performed on the driving circuit layer 26A within the sealing region 281A, then a liquid crystal 252A is filled in a predetermined region of the driving circuit layer 26A, then the filter layer 251A is mounted on the driving circuit layer 26A, and then the opening process is performed on the filter layer 251A.

Further, after the opening process is performed on the driving circuit layer 26A in the sealing region 281A, the region outside the sealing region 281A of the driving circuit layer 26A needs to be filled with the liquid crystal 252A so that the display panel 20A can normally operate in the subsequent step.

Further, according to other embodiments of the present invention, a hole opening process may be performed on a hole opening region 282A of the driving circuit layer 26A, and then a sealing material 2811A is disposed around the hole opening region 282A to form the sealing region 281A. The liquid crystal 252A is filled outside the sealing region 281A and cannot flow into the sealing region 281A through the sealant 2811A by being blocked by the sealant 2811A. That is, after the hole is opened, the liquid crystal 252A cannot flow to the position of the light passing hole 200A, so as to ensure the light collecting effect of the light passing hole 200A in the subsequent steps.

The filter layer 251A is then mounted on the driving circuit layer 26A, and an opening is formed in alignment with the opening area 282A of the driving circuit layer 26A. At this time, the liquid crystal 252A between the filter layer 251A and the driving circuit layer 26A is still held outside the sealing region 281A and does not flow to the position of the light passing hole 200A.

Then, other layers of the display panel 20A, such as the encapsulation layer 24A, the polarization layer 23A, the touch layer 22A, and the cover plate layer 21A, may be mounted to the liquid crystal layer 28A in a certain order. The hole opening process may be performed for each layer by layer while each functional layer is being mounted, or may be performed for each layer simultaneously after the other layers are mounted.

Preferably, in this example, the cover plate layer 21A of the display screen 20A is not perforated, and the display screen 20A with the light passing holes 200A may be obtained by first installing each layer of the display screen 20A to obtain a complete display screen 20A, and then uniformly perforating each layer except the cover plate layer 21A. Alternatively, the layers of the display screen 20A except the cover plate layer 21A may be mounted, and then holes are punched, and finally the cover plate layer 21A is mounted to obtain the complete display screen 20A.

It should be noted that, the cover plate layer 21A of the display panel 20A may be perforated, and then the cover plate layer 21A may be filled with a transparent material, so that contaminants such as dust or moisture may enter other layers of the display panel 20A through the portion of the light passing hole 200A corresponding to the cover plate layer 21A located at the outermost side.

It should be noted that the opening area 282A can be positioned in various ways to facilitate accurate subsequent opening before each layer is installed to be opened uniformly or before each layer is opened layer by layer. The hole areas 282A can be located, for example, by mechanical recognition, and then the other layers can be perforated at the same positions based on this data.

Note that the sealing material 2811A for separating the light hole 200A and the liquid crystal 252A may be provided in the driver circuit layer 26A, the filter layer 251A, or the driver circuit layer 26A and the filter layer 251A, respectively.

According to another embodiment of the present invention, for example, the sealing material 2811A is disposed on the filter layer 251A, after the driving circuit layer 26A is filled with the liquid crystal 252A, the filter layer 251A disposed with the sealing material 2811A is covered on the driving circuit layer 26A, and the liquid crystal 252A is separated from the sealing region 281A and the sealing region 281A by the sealing material 2811A. The sealant 2811A provided in the filter layer 251A is in close contact with the driver circuit layer 26A, and the liquid crystal 252A located outside the seal region 281A cannot pass through the sealant 2811A and reach the inside of the seal region 281A. Then, an opening process is performed on the driving circuit layer 26A and the filter layer 251A within the sealing region 281A to obtain the light passing hole 200A passing through the driving circuit layer 26A and the filter layer 251A.

According to other embodiments of the present invention, the order of opening the liquid crystal layer 28A may be to open the filter layer 251A first and then open the driving circuit layer 26A.

For example, an opening process may be performed on an opening region 282A of the filter layer 251A, and then an encapsulant 2811A is disposed around the opening region 282A to form the sealing region 281A. The liquid crystal 252A is filled outside the sealing region 281A and cannot flow into the sealing region 281A through the sealant 2811A by being blocked by the sealant 2811A. That is, after the hole is opened, the liquid crystal 252A cannot flow to the position of the light passing hole 200A, so as to ensure the light collecting effect of the light passing hole 200A in the subsequent steps.

After the filter layer 251A is opened, the filter layer 251A is mounted on the driver circuit layer 26A, and the sealing material 2811A provided in the filter layer 251A is brought into close contact with the driver circuit layer 26A, and the sealing material 2811A forms the sealing region 281A.

Then, an opening process is performed on the driving circuit layer 26A in alignment with the opening region 282A of the filter layer 251A. After the driving circuit layer 26A is perforated, the liquid crystal 252A located in the sealing region 281A can flow to the outside.

Further, after the other layers of the display 20A, for example, the encapsulation layer 24A, the polarization layer 23A, the touch layer 22A, and the back plate layer 27A are mounted, a hole opening process may be performed on the entire display 20A so that the light passing hole 200A of the filter layer 251A passes through the other layers of the entire display 20A except for the cover plate layer 21A.

In the process of mounting other layers of the display screen 20A, holes may be formed in each of the layers that have been mounted in alignment, for example, after the polarizing layer 23A and the touch layer 22A are mounted, holes may be formed in the polarizing layer 23A and the touch layer 22A so that the light passing hole 200A of the filter layer 251A passes through the entire display screen 20A except for the cover sheet layer 21A. The cover sheet layer 21A is then mounted to complete the display screen 20A.

According to other embodiments of the present invention, the order of opening the liquid crystal layer 28A may be opening the filter layer 251A and the driving circuit layer 26A simultaneously.

For example, the sealing material 2811A is provided between the filter layer 251A and the driver circuit layer 26A. The sealing material 2811A may be provided in the filter layer 251A, the driver circuit layer 26A, or both the filter layer 251A and the driver circuit layer 26A.

The opening region 282A is formed within the sealing region 281A. After the liquid crystal layer 28A is subjected to the hole opening process, at least a part of the sealing material 2811A remains between the filter layer 251A and the driver circuit layer 26A to prevent the liquid crystal 252A between the filter layer 251A and the driver circuit layer 26A from flowing out.

The liquid crystal layer 28A may be opened by first disposing the sealant 2811A on the driving circuit layer 26A, and then filling the liquid crystal 252A material in the driving circuit layer 26A. The liquid crystal 252A material is located outside the sealing region 281A formed by the sealant 2811A.

It is understood that the sealant 2811A may be transparent or have high transmittance, which is beneficial to the light transmission at the position of the light hole 200A corresponding to the liquid crystal layer 28A. The sealant 2811A may be a light blocking material to reduce an influence of stray light near the position of the light passing hole 200A corresponding to the liquid crystal layer 28A on the light passing effect of the light passing hole 200A. That is, the type of the sealing material 2811A may be selectively set according to the need.

Then, the filter layer 251A is mounted on the driving circuit layer 26A. One sealing region 281A is formed between the sealing material 2811A, the driver circuit layer 26A, and the filter layer 251A. For the sealing region 281A, the liquid crystal 252A outside the sealing region 281A cannot flow into the sealing region 281A.

After the filter layer 251A and the driving circuit layer 26A are mounted together to form the liquid crystal layer 28A, a hole opening process may be performed on the liquid crystal layer 28A, or a hole opening process may be performed on the entire display screen 20A in alignment with the sealing region 281A after the entire display screen 20A is mounted.

Further, it is understood that after the liquid crystal layer 28A is subjected to the opening process, the opening sequence of the other layers of the display panel 20A can be selected according to the requirement. The encapsulation layer 24A may be mounted on the liquid crystal layer 28A, and then the encapsulation layer 24A may be perforated in alignment with the liquid crystal layer 28A. The touch layer 22A is then mounted on the encapsulation layer 24A, and the touch layer 22A is then perforated in alignment with the liquid crystal layer 28A and the encapsulation layer 24A.

After the layers above the liquid crystal layer 28A are mounted, the layers above the liquid crystal layer 28A may be collectively subjected to a hole opening process. After the layers below the liquid crystal layer 28A are mounted, the layers below the liquid crystal layer 28A are collectively subjected to a hole opening process.

The layers of the display 20A may also be pre-drilled and then mounted in alignment with the liquid crystal layer 28A.

Further, if the hole opening process is required for the whole LCD panel 20A, that is, in the case of opening the cover plate layer 21A, the polarizing layer 23A is made of an opaque material, and the cover plate layer 21A and the touch layer 22A may be made of a transparent material when the hole opening process is performed for the whole LCD panel 20A. The sealing region 281A of the liquid crystal layer 28A is blocked from being viewed from the outside of the display panel 20A by a light-impermeable material, and thus it is not easy to open the hole in alignment with the sealing region 281A, so that the polarizing layer 23A may be subjected to a hole opening process, and then the cover plate layer 21A may be subjected to a hole opening process, so that the cover plate layer 21A may be opened based on the light-passing hole 200A portion of the polarizing layer 23A when the hole opening process is performed, thereby allowing the light-passing hole 200A portions of the respective layers to be aligned with each other.

Referring to fig. 13, an embodiment of the LCD panel 20A of the present invention is illustrated. In the above embodiment, the inner diameters of the portions of the light passing holes 200A corresponding to the respective layers of the LCD panel 20A are the same.

In this embodiment, the inner diameters of the portions of the light passing holes 200A corresponding to the respective layers of the LCD panel 20A are different.

After the liquid crystal layer 28A is formed, the encapsulation layer 24A, the polarization layer 23A, the touch layer 22A, and the cover sheet layer 21A may be mounted above the liquid crystal layer 28A, and the other polarization layer 23A and the back sheet layer 27A may be mounted below the liquid crystal layer 28A. The back plate layer 27A of the LCD display 20A is indispensable, and the back plate layer 27A can emit light when energized.

The liquid crystal layer 28A may be perforated in advance and then the encapsulation layer 24A, the polarization layer 23A, the touch layer 22A, and the cover plate layer 21A are mounted, wherein the encapsulation layer 24A, the polarization layer 23A, and the touch layer 22A may be perforated in advance or may be mounted together and then perforated in unison. The other polarizing layer 23A installed below the liquid crystal layer 28A may be formed with a hole in advance, or may be formed with a hole after being installed in the liquid crystal layer 28A. The cover plate layer 21A may be mounted on the touch layer 22A after other layers of the display screen 20A are perforated, or may be perforated on the layers of the display screen 20A other than the cover plate layer 21A after the layers including the cover plate layer 21A are mounted together.

The inner diameter of the portion of the liquid crystal layer 28A corresponding to the light-passing hole 200A may be different from the inner diameters of the other layers of the display screen 20A, for example, in this example, the inner diameter of the portion of the liquid crystal layer 28A corresponding to the light-passing hole 200A is slightly smaller than the inner diameters of the encapsulation layer 24A, the polarization layer 23A, and the touch layer 22A.

In other embodiments of the present invention, the light passing holes 200A with the same inner diameter may be obtained by performing processes such as laser cutting and drilling on the touch layer 22A, the polarization layer 23A, the encapsulation layer 24A and the liquid crystal layer 28A of the LCD display screen 20A from top to bottom.

For the back plate layer 27A located below the liquid crystal layer 28A, the back plate layer 27A may be separately perforated, and the inner diameter of the portion of the light passing hole 200A corresponding to the back plate layer 27A may be different from the inner diameter of the portion of the light passing hole 200A corresponding to the liquid crystal layer 28A, the touch layer 22A, and the polarizing layer 23A.

In this example, the inner diameter of the portion of the light passing hole 200A corresponding to the back plate layer 27A is larger than the inner diameter of the portion of the light passing hole 200A corresponding to the liquid crystal layer 28A. The light-passing hole 200A portion corresponding to the back plate layer 27A penetrates the light-passing hole 200A portion corresponding to the liquid crystal layer 28A.

The display screen 20A has a mounting passage 201A, wherein the mounting passage 201A is formed in the back plate layer 27A and is communicated with the light passing hole 200A.

Optionally, the portion of the light passing hole 200A corresponding to the back plate layer 27A is larger than the sealing region 281A. At least a portion of the camera module 30 may be accommodated in the back plate layer 27A, thereby facilitating a reduction in height dimensions of the camera module 30 and the display screen 20A.

Further, referring to fig. 9, a mounting end of the camera module 30 includes a part of a lens and a lens barrel, a portion of the light-passing hole 200A of the back plate layer 27A can be designed to be large enough to accommodate the lens and the lens barrel, and for the liquid crystal layer 28A and the portion of each layer above the liquid crystal layer 28A corresponding to the light-passing hole 200A, the aperture size of the light-passing hole 200A may satisfy the light-entering requirement of the camera module 30. In other words, when the camera module 30 extends into the LCD display screen 20A, so that the camera module 30 is installed in the LCD display screen 20A, and thus the installation height of the camera module 30 and the LCD display screen 20A is reduced, the light passing hole 200A located above can still be designed to be small enough, so that the light passing hole 200A is not easy to be observed outside the display screen 20A, and meanwhile, the light passing hole 200A can provide enough installation space for the camera module 30.

It is understood that the camera module 30 can be accommodated not only in the portion of the light-passing hole 200A corresponding to the back plate layer 27A, but also that the camera module 30 can be inserted into the LCD display 20A, for example, the camera module 30 can be accommodated in the portion of the light-passing hole 200A corresponding to the driving circuit layer 26A.

Referring to fig. 14A, an embodiment of the LCD panel 20A of the present invention is illustrated.

In this embodiment, the cover plate layer 21A of the display panel 20A is not perforated. The touch layer 22, the polarizing layer 23, the encapsulation layer 24, the pixel layer 25, the driving circuit layer 26, and the back plate layer 27 are respectively subjected to an opening process, and then the opening positions are filled with the protective material 2812.

The light quality of the camera module 30 is affected by the light-passing hole 200A. Specifically, each layer of material of the LCD 20A around the light-passing hole 200A reflects and refracts the light entering the light-passing hole 200A, so that the light entering the camera module 30 is affected by the material around the light-passing hole 200A.

Based on the difference of materials of each layer and the difference of the positions of the light through holes 200A, the materials around each light through hole 200A are difficult to achieve the same level on a production line, namely, the light inlet quality of the light through holes 200A is difficult to keep consistent, and debugging processing needs to be carried out at the later stage.

In this example, after obtaining the LCD panel 20A with the light hole 200A, a certain protection material 2812A may be poured into the light hole 200A, wherein the protection material 2812A may protect the layers around the light hole 200A, for example, the driving circuit layer 26A, so as to reduce the corrosion of the driving circuit layer 26A caused by water and oxygen.

After the light hole 200A is filled with the protection material 2812A, at least a portion of the protection material 2812A may be removed by drilling or laser cutting, so that at least a portion of the position around the light hole 200A is filled with the protection material 2812A.

The protective material 2812A may be a light-transmitting material, and light can transmit through the protective material 2812A. The protective material 2812A may be an opaque material, and stray light from the surroundings of the light hole 200A may not be received by the camera module 30 through the protective material 2812A. The material of the protective material 2812A may be selected based on requirements to control the light quality of the light tunnel 200A by controlling the protective material 2812A within the light tunnel 200A.

It is worth mentioning that when the light through holes 200A of each layer have a certain deviation due to the machining process or the mounting process, a certain compensation can be performed by the protection material 2812A.

Fig. 14B is another embodiment of the LCD panel 20A of the present invention. The difference from the display panel 20A shown in fig. 14A is that in the present embodiment, each layer of the display panel 20A is individually perforated and then filled with a protective material 2812A.

Specifically, the touch layer 22A, the polarizing layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, and the back plate layer 27A may be respectively subjected to an opening process, and then the opening positions may be filled with the protective material 2812A.

The touch layer 22A, the polarizer layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driver circuit layer 26A, and the backplane layer 27A are then mounted together in alignment to form the display screen 20A. The display 20A may now be used as a display with "holes". The transparent materials corresponding to the touch layer 22A, the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, and the back plate layer 27A may function as holes.

Further, the touch layer 22A, the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, and the back plate layer 27A may be simultaneously perforated, and a portion of the protection material 2812A may be left around the light passing hole 200A. The cover sheet layer 21A is then mounted to obtain the display screen 20A.

Referring to fig. 15 and 16, an embodiment of the LCD panel 20A of the present invention is illustrated.

The part of the light-passing hole 200A corresponding to the liquid crystal layer 28A, the part of the light-passing hole 200A corresponding to the polarizing layer 23A, and the part of the light-passing hole 200A corresponding to the cover plate layer 21A are not aligned, which may be caused by various factors, such as a factor for controlling the hole-opening position precision during the hole-opening process, or a factor for the alignment precision during the installation process, or a factor for generating a deviation during the fixing during the installation process.

The protective material 2812A is poured into the light hole 200A, the protective material 2812A fills the light hole 200A, and then at least a portion of the protective material 2812A is removed according to a certain opening region 282A to form the light hole 200A again. At this time, the inner diameter of the light passing hole 200A can be kept uniform.

It will be appreciated of course that in this example, the entire LCD display 20A is reprocessed for the clear aperture 200A after installation. In other embodiments of the present invention, the light passing holes 200A may be adjusted after some of the functional layers of the LCD display 20A are mounted together.

For example, when the liquid crystal layer 28A, the polarizing layer 23A, and the touch layer 22A are assembled together, but there is a certain deviation in the portions of the light holes 200A corresponding to the liquid crystal layer 28A, the polarizing layer 23A, and the touch layer 22A, the portions of the light holes 200A corresponding to the liquid crystal layer 28A, the polarizing layer 23A, and the touch layer 22A may be filled with a protective material 2812A, and then the light holes 200A are formed twice. Then, another polarizing layer 23A and the backlight are mounted on the liquid crystal layer 28A.

The protection material 2812A may not cover the polarization layer 23A and the portion of the light passing hole 200A corresponding to the back plate layer 27A, as shown in fig. 15.

In this manner, the protective material 2812A can be selectively coated on the layers of the LCD display screen 20A.

Referring to fig. 17, a specific embodiment of the LCD panel 20A of the present invention is illustrated.

The LCD display 20A has a light hole 200A, and a light guide assembly 50A is disposed in the light hole 200A, the light guide assembly 50A has a light guide channel 500A, and light can pass through the LCD display 20A along the light guide channel 500A.

Specifically, the LCD panel 20A includes a cover layer 21A, a touch layer 22A, a polarizer layer 23A, a packaging layer 24A, a pixel layer 25A, a driving circuit layer 26A, and a back plate layer 27A, wherein the polarizer layer 23A is disposed on two opposite sides of the pixel layer 25A.

The cover layer 21A is located on top of the LCD display 20A, the touch layer 22A is capable of transmitting signals when touched, the encapsulation layer 24A is used for encapsulation, the pixel layer 25A includes a filter layer 251A (cf) and a liquid crystal 252A, and the liquid crystal 252A is located between the filter layer 251A and the driving circuit layer 26A. The driving circuit layer 26A includes a plurality of TFT structures and the substrate, and the TFT structures are formed on the substrate through thin film, yellow light, etching, film stripping, and the like. The back sheet layer 27A serves to emit light.

The LCD panel 20A further includes a liquid crystal layer 28A, wherein the liquid crystal layer 28A includes the pixel layer 25A and the driving circuit layer 26A. The liquid crystal 252A is located between the filter layer 251A and the driving circuit layer 26A.

The light passing hole 200A passes through each layer of the LCD panel 20A, and the light guide member 50A is received in the light passing hole 200A.

The light-passing holes 200A may be formed by opening holes in each layer of the LCD panel 20A, or by opening holes in the liquid crystal layer 28A of the LCD panel 20A, sealing the liquid crystal layer 28A to prevent the liquid crystal 252A in the liquid crystal layer 28A from leaking to the outside, and then opening holes in other layers of the LCD panel 20A.

In the former way, specifically, the liquid crystal layer 28A is processed in advance during the manufacturing process to form a sealing region 281A, wherein the sealing region 281A is not filled with the liquid crystal 252A, and the liquid crystal 252A is located outside the sealing region 281A. For example, an encapsulant 2811A may be disposed between the filter layer 251A and the driver circuit layer 26A to form the sealing region 281A.

In the latter case, specifically, the liquid crystal layer 28A is processed in advance during the manufacturing process to form a sealing region 281A, wherein the sealing region 281A is not filled with the liquid crystal 252A, and the liquid crystal 252A is located outside the sealing region 281A. For example, an encapsulant 2811A may be disposed between the filter layer 251A and the driver circuit layer 26A to form the sealing region 281A.

Then, an opening process is performed for the liquid crystal layer 28A on the basis of the seal region 281A. The other layers of the LCD panel 20A are aligned with the liquid crystal layer 28A for opening.

In this example, the inner diameter of the light passing hole 200A may be set slightly larger to accommodate the light guide assembly 50A. It should be noted that, when the portions of the light passing holes 200A corresponding to the layers of the LCD panel 20A are slightly deviated, the light guide assembly 50A can compensate the deviation between the layers of the LCD panel 20A caused in the installation process to some extent.

Specifically, when the portions of the light passing holes 200A corresponding to the respective layers of the LCD panel 20A are slightly deviated, at least a portion of the light entering the light passing holes 200A is lost when passing through the light passing holes 200A. When the light guide assembly 50A is disposed in the light through hole 200A, most of the light can directly propagate along the light guide channel 500A of the light guide assembly 50A, thereby reducing the loss of the light in the LCD display 20A due to the installation deviation between the layers.

The light guiding performance of the light guiding assembly 50A may be set based on the requirements. When the light guide efficiency requirement of the light guide assembly 50A is high, the light guide assembly 50A may be set to be a transparent material, and when the influence of external parasitic light on the light in the light guide channel 500A needs to be reduced, the outer wall of the light guide assembly 50A may be coated with a light shielding material.

Referring to fig. 18A and 18B, an embodiment of the terminal device 1 according to the present invention is illustrated.

The terminal device 1 includes a terminal device main body 10, a display screen 20 and a camera module 30, wherein the display screen 20 and the camera module 30 are respectively disposed on the terminal device main body 10. The display screen 20 is used for displaying images, and the camera module 30 is kept below the display screen 20, so that the display screen 20 is designed as a full-face screen.

The terminal device 1 further comprises a housing 40 and a light guide channel 500, wherein the display screen 20 is mounted on the housing 40, and the housing 40 is located at the periphery of the display screen 20, and on one hand, the housing supports the display screen 20 and on the other hand, the housing protects the display screen 20.

The light guide channel 500 is formed between the display screen 20 and the housing 40, and the light guide channel 500 communicates with the outside and the camera module 30, so that the outside light is transmitted to the camera module 30 through the light guide channel 500.

In this way, the camera module 30 can be disposed below the display screen 20 and does not occupy the display area of the display screen 20, so that the display screen 20 can achieve the effect of a full screen.

Specifically, the terminal device 1 has at least one light guide channel 500, wherein at least a portion of the light guide channel 500 is formed between the display screen 20 and the housing 40, and at least a portion of the light guide channel 500 is formed in the display screen 20, so as to transmit light to the camera module 30 located below the display screen 20. Some light guide elements may be disposed in the light guide channel 500 so that the propagation direction of the light rays propagating in a straight line can be changed, and the light rays are conducted from the outer side of the display screen 20 to the camera module 30 located at the inner side of the display screen 20 through the light guide channel 500. The light guiding element may be a reflective film or a mirror.

In other embodiments of the present invention, at least a portion of the light guide channel 500 is located between the display screen 20 and the housing 40, and the rest of the light guide channel may be located below the display screen 20. That is, the light guide channel 500 winds from the side of the display screen 20 to the lower side of the display screen 20, and then guides the light to the camera module 30.

In this example, taking the OLED display panel 20 as an example, the light guide channel 500 may be selectively formed on each layer of the OLED display panel 20, such as the pixel layer 25, the driving circuit layer 26, or the back plate layer 27. Preferably, when the light guide channel 500 passes through the pixel layer 25, the light guide channel 500 is disposed between adjacent pixels to reduce the influence on the imaging effect. Preferably, when the light-guiding channel 500 passes through the driving circuit layer 26, the light-guiding channel 500 is disposed on the non-circuit portion of the driving circuit layer 26 to reduce the influence on the operation performance of the driving circuit layer 26.

In this example, the light guide channel 500 passes through the back plate layer 27, and then transmits light to the camera module 30 under the display screen 20 through the light guide channel 500.

The light guide channel 500 includes a first portion 501, a second portion 502 and a third portion 503, wherein the first portion 501 is located between the display 20 and the housing 40. It is noted that when the display 20 is mounted on the housing 40, a gap naturally exists between the display 20 and the housing 40, and the desired first portion of the light guide channel 501 can be obtained by designing the edge of the display 20 or the edge of the housing 40.

A second portion of light-conducting channels 502 is located within the display screen 20 and a third portion of light-conducting channels 503 is located within the display screen 20. The second portion light guide channel 502 is used for transmitting light from the outside through the first portion light guide channel 501 to the display screen 20. The third light guide channel 503 is used for transmitting the light in the display screen 20 to the camera module 30.

The second portion of light guide channels 502 may conduct light along the length and width directions of the display 20, and the third portion of light guide channels 503 may conduct light along the height direction of the display 20.

Further, the first portion of the light guide channel 501 of the light guide channel 500 may function to converge light, so that more light may enter the second portion of the light guide channel 502 after passing through the first portion of the light guide channel 501. The second portion of light-conducting channels 502 may function to transmit light.

In this example, the camera module 30 is mounted to the display screen 20 and is located below the display screen 20. The camera module 30 forms an image based on the light of the light guide channel 500. The third light guide channel 503 may be configured to diffuse light so that the diffused light matches the light receiving area of the image capturing module 30.

The first portion of the light guide channel 501 may be provided with a micro convex lens to converge light. The second portion of the light-conducting channel 502 may be provided with at least one mirror or other modulation device to allow light to pass along the second portion of the light-conducting channel 502 to the third portion of the light-conducting channel 503. The third portion of the light-guiding channel 503 may be provided with a micro-concave lens to enable the light to be diffused.

Further, the camera module 30 includes an optical unit 31A and a photosensitive unit 32A, wherein the optical unit 31A collects light, and the photosensitive unit 32A receives the light collected by the optical unit 31A and converts the optical signal into an electrical signal based on photoelectric conversion for subsequent imaging. The optical unit 31A may include a converging part 311A, a modulating part 312A, and a diverging part 313A. The converging part 311A can converge light, the modulating part 312A can modulate light, such as filtering, dispersing, collimating, etc., and the diffusing part 313A can diffuse light.

The optical unit 31A may be disposed in the light guide channel 500, for example, the first portion light guide channel 501, the second portion light guide channel 502, and the third portion light guide channel 503. The light sensing unit 32A is disposed directly on the display screen 20 and below the display screen 20. After the optical unit 31A collects the light, the photosensitive unit 32A converts the light signal into an electrical signal.

Specifically, the converging part 311A may be disposed on the first part light guide channel 501, and is configured to converge light entering the light guide channel 500 from the outside, so that the inner diameter of the second part light guide channel 502 can be designed to be smaller and at the same time can transmit more light. The modulation 312A may be disposed on the second light guide channel 500. The diffuser 313A may be disposed in the third partial light-guiding channel 503 to diffuse light to a light-sensing area corresponding to the light-sensing unit 32A of the camera module 30.

In this way, the portion of the light-conducting channel 500 within the display screen 20 may be sized smaller to reduce the effect of the light-conducting channel 500 on the imaging of the display screen 20. Reference is made to the above description for the fabrication and formation of the light-conducting channel 500 in the display 20.

The optical unit 31A may include, but is not limited to, the concave lens, the convex lens, and the like.

Further, in other embodiments of the present invention, the concave lens located in the third portion of the light guiding channel 503 may be disposed on the display 20, for example, the packaging layer 24, and the diffuser 313A is disposed on the packaging layer 24. Light from the outside is diffused after passing through the diffuser 313A of the encapsulation layer 24, and then transmitted to the light sensing unit 32A of the camera module 30 through the third partial light guide channel 503, so as to be converted into an electrical signal.

The diffuser 313A may be integrally formed with the encapsulation layer 24, wherein the encapsulation layer 24 is usually made of glass. According to some embodiments of the present invention, the diffuser 313A may be concavely integrally formed on the top surface of the encapsulation layer 24.

Referring to fig. 19, and also to fig. 18A, another embodiment of the terminal device 1 according to the invention is illustrated.

In this example, the terminal device 1 includes a terminal device main body 10, a display screen 20, and a camera module 30, wherein the display screen 20 and the camera module 30 are respectively disposed on the terminal device main body 10. The display screen 20 is used for displaying images, and the camera module 30 is kept below the display screen 20, so that the display screen 20 is designed as a full-face screen.

At least a portion of the light-conducting channel 500 is located between the display screen 20 and the housing 40 and extends to the display screen 20. Light from the outside reaches the display screen 20 after passing through a gap between the display screen 20 and the housing 40, and is then received by the camera module 30 located below the display screen 20.

The terminal device 1 further comprises an optical unit 31A, wherein the optical unit 31A is disposed in the light-guiding channel 500. The optical unit 31A may be used for converging, diffusing, or collimating light.

The camera module 30 includes an optical mechanism 31A 'and a photosensitive unit 32A, wherein the optical mechanism 31A' is held in a photosensitive path of the photosensitive unit 32A. The light sensing unit 32A can convert an optical signal into an electrical signal based on photoelectric conversion. The optical mechanism 31A' may include an optical lens or the like.

In this example, the camera module 30 is a single, complete camera module 30. With the premise that the optical unit 31A is not disposed in the light guide channel 500, the camera module 30 can still image based on the light passing through the light guide channel 500.

Some light guide elements may be disposed in the light guide channel 500 so that the propagation direction of the light rays propagating in a straight line can be changed, and the light rays are conducted from the outer side of the display screen 20 to the camera module 30 located at the inner side of the display screen 20 through the light guide channel 500. The light guiding element may be a reflective film or a mirror.

The light guide channel 500 may include a first portion light guide channel 501, a second portion light guide channel 502 and a third portion light guide channel 503, wherein the first portion light guide channel 501 is located between the housing 40 and the display screen 20, the second portion light guide channel 502 guides the light of the first portion light guide channel 501 into the display screen 20, and the third portion light guide channel 503 guides the light of the second portion light guide channel 502 out of the display screen 20 to be received by the camera module 30.

The optical unit 31A may be disposed in the first portion light guide channel 501, the second portion light guide channel 502, and the third portion light guide channel 503.

It can be understood that the type and the arrangement position of the optical unit 31A can be selected according to the requirement, so that the light can be adjusted to meet the light input requirement of the camera module 30 under the action of the optical unit 31A when the light passes through the light guide channel 500 of the light guide assembly 50.

Referring to fig. 20, and also to fig. 18A, another preferred embodiment of the terminal device 1 according to the present invention is illustrated.

In this example, the terminal device 1 includes a terminal device main body 10, a display 20, a camera module 30, a housing 40, and a light guide assembly 50, wherein the display 20 is mounted on the terminal device main body 10, the display 20 and the terminal device main body 10 are mounted on the housing 40, and the camera module 30 is mounted on the display 20 and is held under the display 20. The light guide assembly 50 is used for guiding light from the outside to the camera module 30 below the display screen 20.

Specifically, the terminal device 1 has a light guide channel 500, wherein at least a portion of the light guide channel 500 is formed in the light guide element 50.

The light guide assembly 50 includes a light guide tube, wherein the light guide tube has a shape and a size. The light guide conduit may extend from outside the display screen 20 between the display screen 20 and the housing 40 towards the display screen 20.

The entire light guide conduit may be light transmissive or may be light opaque. The light guide pipe may be made of a light-transmitting material, and then, in order to prevent the stray light around the light guide pipe from entering the light guide channel 500, the light guide pipe may be coated with a light-shielding material to reduce the influence of the stray light around.

Preferably, when the light guide assembly 50 needs to pass through the pixel layer 25, the light guide assembly 50 is disposed between two adjacent pixels of the pixel layer 25.

For the same display screen 20, the number of the light guide assemblies 50 may be multiple, the corresponding light guide channels 500 may be multiple, and at least parts of the multiple light guide channels 500 are overlapped with each other.

The light guide assembly 50 may conduct a plurality of positions inside the display 20 and outside the display 20, for example, a front of the display 20, a left side of the display 20, a right side of the display 20, or the like. The light guide channel 500 of the light guide assembly 50 can guide the light passing through the gap between the display screen 20 and the housing 40 to the camera module 30.

When the number of the light guide channels 500 is plural, the amount of light entering the camera module 30 can be increased.

Referring to fig. 21, and also to fig. 18A, another embodiment of the terminal device 1 according to the invention is illustrated.

The terminal device 1 includes a terminal device main body 10, a display 20, a camera module 30, a housing 40, and a light guide assembly 50, wherein the display 20 is mounted on the terminal device main body 10, the display 20 and the terminal device main body 10 are mounted on the housing 40, and the camera module 30 is mounted on the display 20 and is held under the display 20. The light guide assembly 50 is used for guiding light from the outside to the camera module 30 below the display screen 20.

The terminal device 1 has at least one light guide channel 500 and a light through hole 200, wherein the light through hole 200 penetrates through the display 20 of the terminal device 1 from top to bottom, and the light guide channel 500 is formed in the light guide assembly 50. The light guide channel 500 extends downward from the gap between the display screen 20 and the housing 40 of the terminal device 1 to the display screen 20.

Both the light guide channel 500 and the light passing hole 200 may be used to conduct light. The light passing hole 200 penetrates through the display screen 20, and the camera module 30 aligned with the light passing hole 200 of the display screen 20 can receive light from the outer side of the display screen 20 through the light passing hole 200. The camera module 30 aligned with the light guide channel 500 can receive light from the outside of the display screen 20 through the light guide channel 500.

It should be noted that the light guide channel 500 and the light through hole 200 may be independent from each other, and the light guide channel 500 and the light through hole 200 may be aligned to different camera modules 30 respectively. In other words, a plurality of the camera modules 30 may be mounted on the display screen 20 and located below the display screen 20.

In this example, the light guide channel 500 and the light through hole 200 are at least partially overlapped with each other, so that the light received by the light guide channel 500 and the light through hole 200 can enter the same camera module 30 and be received by the same photosensitive unit 32A, thereby forming an image.

Specifically, at least a portion of the light guide channel 500 is located between the display screen 20 and the housing 40, and at least a portion of the light guide channel 500 is located within the display screen 20.

The light guide channel 500 may include a first portion light guide channel 501, a second portion light guide channel 502, and a third portion light guide channel 503, where the first portion light guide channel 501 is located between the display screen 20 and the housing 40, and the second portion light guide channel 502 and the third portion light guide channel 503 are respectively located inside the display screen 20.

The light guide channel 500 is communicated with the light through hole 200, and the third portion light guide channel 503 is overlapped with the light through hole 200.

The first portion of light guide channels 501 is located at one side of the display screen 20, the second portion of light guide channels 502 extends inward from the side of the display screen 20, and the third portion of light guide channels 503 extends from the inside of the display screen 20 toward the back side of the display screen 20.

The terminal device 1 further comprises an optical unit 31A, and the optical unit 31A is disposed in the light-guiding channel 500. The optical unit 31A may include a converging element 311A, a modulating element 312A, and a diverging element 313A, wherein the converging element 311A may be disposed in the first portion light guide channel 501 for converging light from the outside, the modulating element 312A may be disposed in the second portion light guide channel 502 for modulating light from the first portion light guide channel 501, and the diverging element 313A may be disposed in the third portion light guide channel 503 for transmitting the light to the camera module 30 after being diffused.

It should be noted that, since the paths of the light entering the camera module 30 through the light guide channel 500 and the light through hole 200 are different, the light of different paths has an optical path difference when reaching the camera module 30, and the light beam reaching a photo sensor of the camera module 30 has different phases, and may finally present different images. To avoid this problem, the optical path formed by the optical unit 31A in the display screen 20 is designed so that the light reaching the camera module 30 can present a consistent image.

In this example, the camera module 30 includes an optical mechanism 31A ' and a light sensing unit 32A, wherein the optical mechanism 31A ' is aligned with the light-passing hole 200 and the light-guiding channel 500 and the optical mechanism 31A ' is held in a light sensing path of the light sensing unit 32A, wherein at least parts of the light-passing hole 200 and the light-guiding channel 500 are shared with each other.

In other embodiments of the present invention, the camera module 30 includes the optical unit 31A and a light sensing unit 32A, wherein the optical unit 31A is disposed in the light guide channel 500, and the light sensing unit 32A is mounted on the back side of the display screen 20.

In the case where the light guide channel 500 and the light passing hole 200 coexist, since the camera module 30 can receive light through the light guide channel 500, the size of the light passing hole 200 can be designed to be smaller.

The light-guiding channel 500 may not be visible from the outside of the display screen 20, for example, when the second portion of the light-guiding channel 502 is located on the encapsulation layer 24 of the display screen 20, the light-guiding channel 500 may not be visible from the outside of the display screen 20 due to the polarizing layer located above the encapsulation layer 24, and therefore the inner diameter of at least a portion of the light-guiding channel 500 may be designed to be slightly larger than the inner diameter of the light-passing hole 200, so that a portion of the optical elements may be placed in the light-guiding channel 500.

When the size of the light passing hole 200 is designed to be small, it is more difficult to observe the light passing hole 200 from the outside of the display screen 20, which is advantageous to increase the screen occupation ratio of the display screen 20.

Further, as for the light passing hole 200, the inner diameter of the light passing hole 200 may be set to be gradually increased from top to bottom. Some optical elements of the optical unit 31A may be disposed in the light passing hole 200, such as the diffuser 313A.

For example, when the light-passing region provided by the light-passing hole 200 is smaller than the light-receiving region of the light-receiving unit 32A of the camera module 30, one of the diffusers 313A may be disposed in the light-passing hole 200, and the diffuser 313A may diffuse the light in the light-passing hole 200 to match the light-passing region provided by the light-passing hole 200 with the light-receiving region of the light-receiving unit 32A.

Referring to fig. 22, and also to fig. 18A, an embodiment of a display screen assembly according to the present invention is illustrated.

In this embodiment, the present invention provides the display panel assembly, wherein the display panel assembly includes the display panel 20 and the light guide assembly 50. The display panel 20 has a light hole 200 penetrating from top to bottom, and the light guide element 50 is partially received in the light hole 200.

The light guide assembly 50 provides a light guide channel 500. The desired light-guiding channel 500 can be obtained by designing the shape and structure of the light-guiding assembly 50.

The light guide assembly 50 includes two light guide pipes, one of which is accommodated in the light hole 200, and the other of which extends from the gap between the display screen 20 and the housing 40 to the light hole 200. That is, one of the light guide channels can guide the light above the display screen 20 to pass through the display screen 20 from top to bottom, and then reach the camera module 30. The other light guide pipe can guide the light between the display screen 20 and the shell 40 to reach the camera module 30. The light-passing hole 200 can be made in the manner described above.

The light conducting pipe may be cylindrical, triangular prism, quadrangular prism. The inner diameter of the light guide pipe corresponding to each position can be different.

The light guide channel may be made of a light-transmitting material so that the light guide channel is difficult to observe from the outside of the display panel 20, and may be coated with a light-shielding material in order to reduce the influence of stray light, for example, the influence of light from the pixel layer 25 of the display panel 20.

Further, the light guide assembly 50 includes an optical unit 31A, wherein the optical unit 31A is held in a light path of the light passing hole 200. The optical element may be a filter, a diffuser 313A or a modulator 312A. The optical unit 31A may pre-process the light to make the light entering the camera module 30 reach a desired value.

It should be noted that, since the paths of the light entering the image capturing module 30 through the different light guide channels 500 are different, the light of different paths has an optical path difference when reaching the image capturing module 30, and the light beam reaching a photosensitive chip of the image capturing module 30 has different phases, and may finally present different images. To avoid this problem, the optical path formed by the optical unit 31A in the display screen 20 is designed so that the light reaching the camera module 30 can present a consistent image.

Referring to fig. 23, and to fig. 18A and 10, another embodiment of the display screen assembly according to the present invention is illustrated.

In this example, the display screen 20 is implemented as an LCD display screen 20A. The LCD panel 20A has a light guide channel 500, wherein the light guide channel 500 can guide the light outside the LCD panel 20A to the inside of the LCD panel 20A or the inside of the LCD panel 20A.

Specifically, at least a portion of the light-guiding channel 500 is located between the LCD display 20A and the housing 40, and at least a portion of the light-guiding channel 500 is located inside the LCD display 20A.

The light guide channel 500 part between the LCD display screen 20A and the housing 40 can guide external light from the outside of the LCD display screen 20A to a side surface of the LCD display screen 20A, and then guides the light into the LCD display screen 20A through the other light guide channel 500 part, and the light reaches the camera module 30 after passing through the inside of the LCD display screen 20A, so that the camera module 30 below the display screen 20A can receive the light from the top of the display screen 20A, so that the camera module 30 below the display screen 20A can use the light to form images, and further, the camera module 30 below the display screen 20A can obtain sufficient light images through the light guide channel 500.

More specifically, the light-guiding channel 500 includes a first portion of light-guiding channel 501, a second portion of light-guiding channel 502 and a third portion of light-guiding channel 503, wherein the first portion of light-guiding channel 501 is located between the LCD panel 20A and the housing 40, the second portion of light-guiding channel 502 is located inside the LCD panel 20A and guides the light from the first portion of light-guiding channel 501 to the inside of the LCD panel 20A, and the third portion of light-guiding channel 503 is located inside the LCD panel 20A and guides the light from the second portion of light-guiding channel 502 to the outside of the LCD panel 20A.

The LCD display 20A further includes at least one optical unit 31A, wherein the optical unit 31A can be disposed in the light-guiding channel 500 to enable light to propagate in the light-guiding channel 500 according to the user's expectation. The optical unit 31A may include a converging part 311A, a modulating part 312A, and a diverging part 313A. The converging part 311A can converge light, the modulating part 312A can modulate light, such as filtering, dispersing, collimating, etc., and the diffusing part 313A can diffuse light.

The converging part 311A may be disposed on the first portion of the light guide channel 501 of the light guide channel 500, for example, a light inlet of the light guide channel 500, where the converging part 311A is located at the light inlet. The modulation member 312A may be disposed in the second portion of the light guide channel 502 of the light guide channel 500 to modulate the light passing through the second portion of the light guide channel 502. The diffusion member 313A may be disposed on the third portion of the light guide channel 503 of the light guide channel 500, for example, a light outlet of the light guide channel 500, wherein the diffusion member 313A is disposed on the light outlet and can diffuse light to adapt to a light-sensing surface of the camera module 30, so that, when the light-sensing surface of the camera module 30 is large, the light can be diffused to improve the light-sensing area of the light-sensing surface by the diffusion member 313A, thereby improving the working efficiency of the camera module 30.

The camera module 30 has a light inlet and includes a light sensing unit 32A. The size of the light inlet corresponds to the photosensitive area of the photosensitive unit 32A, so that the photosensitive area of the photosensitive unit 32A receives light as much as possible, and the photosensitive area of the photosensitive unit 32A can be utilized as much as possible.

Further, the LCD display screen 20A includes the cover plate layer 21A, the touch layer 22A, the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, and the back plate layer 27A. The polarizing layers 23A are respectively disposed on both sides of the pixel layer 25A.

The LCD display 20A has a side, a front and a back, wherein the front of the LCD display 20A faces the user, the back of the LCD display 20A faces away from the user, and the sides are connected to the front and the back, respectively. The light guide channel 500 extends from the gap between the LCD panel 20A and the housing 40 to the side of the LCD panel 20A and then to the back of the LCD panel 20A. Light can pass through the LCD display 20A from the side of the LCD display 20A to the back of the LCD display 20A through the light-guiding channel 500.

The LCD panel 20A is a multi-layer structure, and the light guide channel 500 may penetrate through one or more layers of the cover plate layer 21A, the touch layer 22A, the polarizer layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, and the back plate layer 27A.

The light guide channel 500 may pass through the cover plate layer 21A and the back plate layer 27A, for example, sequentially pass through the cover plate layer 21A, the touch layer 22A, a polarizer of the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, another polarizer of the polarization layer 23A, and the back plate layer 27A from top to bottom. It should be understood by those skilled in the art that the arrangement of the various layers of the LCD display 20A described herein is illustrative only and not limiting of the present invention.

The light guide channel 500 may pass through the touch layer 22A and the back plate layer 27A, for example, the light guide channel 500 sequentially passes through a gap between the display screen 20A and the housing 40, the touch layer 22A, the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, the polarization layer 23A, and the back plate layer 27A from top to bottom. It should be understood by those skilled in the art that the arrangement of the layers of the LCD panel 20A is illustrative only and not limiting.

The light guide channel 500 may pass through the polarization layer 23A and the back plate layer 27A, for example, the light guide channel 500 may pass through the gap between the display screen 20A and the housing 40, the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, the polarization layer 23A, and the back plate layer 27A in sequence from top to bottom. It should be understood by those skilled in the art that the arrangement of the layers of the LCD panel 20A is illustrative only and not limiting.

The light guide channel 500 may pass through the encapsulation layer 24A and the back plate layer 27A, for example, the light guide channel 500 may pass through the gap between the display screen 20A and the housing 40, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, the polarization layer 23A, and the back plate layer 27A in sequence from top to bottom. It should be understood by those skilled in the art that the arrangement of the layers of the LCD panel 20A is illustrative only and not limiting.

The light guide channel 500 may extend from the pixel layer 25A to the back plate layer 27A, for example, the light guide channel 500 sequentially passes through the gap between the display screen 20A and the housing 40, the pixel layer 25A, the driving circuit layer 26A, the polarization layer 23A, and the back plate layer 27A from top to bottom. It should be understood by those skilled in the art that the arrangement of the layers of the LCD panel 20A is illustrative only and not limiting.

The light guide channel 500 may extend from the driving circuit layer 26A to the back plate layer 27A, for example, the light guide channel 500 may sequentially pass through the gap between the display screen 20A and the housing 40, the driving circuit layer 26A, the polarization layer 23A, and the back plate layer 27A. It should be understood by those skilled in the art that the arrangement of the layers of the LCD panel 20A is illustrative only and not limiting.

The light guide channel 500 may extend from the polarizing layer 23A under the pixel layer 25A to the back plate layer 27A, for example, the light guide channel 500 may pass through the polarizing layer 23A and the back plate layer 27A in sequence from under the pixel layer 25A.

The light-guiding channel 500 may extend through the back plate layer 27A, for example, the light-guiding channel 500 may extend from a gap between the back plate layer 27A and the polarization layer 23A or a connection medium to the back plate layer 27A and through the back plate layer 27A.

The light-guiding channel 500 is illustrated as passing through the pixel layer 25A. The pixel layer 25A includes the filter layer 251A and the liquid crystal 252A. The LCD panel 20A includes a liquid crystal layer 28A, wherein the liquid crystal layer 28A includes the liquid crystal 252A, the filter layer 251A, and the driving circuit layer 26A.

The liquid crystal 252A is held between the filter layer 251A and the driver circuit layer 26A. The light-guiding channel 500 passes through the liquid crystal layer 28A and the liquid crystal 252A can not leak to the light-guiding channel 500.

The liquid crystal layer 28A may be fabricated with holes that are at least part of the light guide channels 500, and then holes are formed at corresponding positions of the layers of the LCD panel 20A to form at least part of the light guide channels 500.

The holes of the liquid crystal layer 28A may be located in the height direction of the liquid crystal layer 28A, and the holes may also be formed in the liquid crystal layer 28A obliquely along a certain inclination angle to meet the setting requirement of the light guide channel 500.

Specifically, a sealing material 2811A is provided on the driving circuit layer 26A or the filter layer 251A of the liquid crystal layer 28A, so that when the driving circuit layer 26A and the filter layer 251A are attached to each other, the sealing material 2811A forms a sealing region 281A, and the liquid crystal 252A cannot enter the sealing region 281A. In the subsequent step, as long as the liquid crystal layer 28A is opened within the seal region 281A, the liquid crystal 252A of the liquid crystal layer 28A does not leak out.

The layers mounted above the liquid crystal layer 28A of the LCD panel 20A may be respectively apertured to form the light passing apertures 200 extending from the side of the LCD panel 20A toward the back of the LCD panel 20A. In this manner, the LCD display 20A may be disposed through the holes of the side surface of the LCD display 20A and the back surface of the LCD display 20A.

Further, part light-directing channel 500 is located display screen 20A with between the casing 40, part light-directing channel 500 is set up in inside LCD display screen 20A, can accomplish from LCD display screen 20A the front side can't be observed light-directing channel 500 to be favorable to realizing the full face screen.

Further, after forming a portion of the light guide channel 500 in the LCD panel 20A, the optical unit 31A may be mounted on the light guide channel 500.

It is understood that the optical elements may be mounted on the light guide channel 500 after the entire LCD panel 20A is manufactured, the optical units 31A may be mounted at predetermined positions of the layers of the LCD panel 20A during the process of mounting the LCD panel 20A layer by layer or during the process of forming the light guide channel 500 corresponding to each layer of the LCD panel 20A, and then the functional layers are assembled to form the complete LCD panel 20A, or at least a part of the optical units 31A may be formed during the process of manufacturing the LCD panel 20A.

For example, a microlens layer is integrally formed on the encapsulation layer 24A, and then the encapsulation layer 24A is disposed above the pixel layer 25A, wherein the microlens layer is corresponding to the light-passing hole 200 of the pixel layer 25A, a layer of the driving circuit layer 26A is disposed on the bottom side of the pixel layer 25A, and the driving circuit layer 26A is electrically connected to the pixel layer 25A for driving the pixel layer 25A to operate. The polarization layer 23A, the touch layer 22A and the cover plate layer 21A are sequentially disposed on the encapsulation layer 24A.

The cover plate layer 21A, the touch layer 22A, the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A and the driving circuit layer 26A form the through light guide channel 500. The microlens layer is held to the light guide channel 500.

The optical unit 31A may be disposed inside the LCD panel 20A or formed on each layer of the LCD panel 20A in other manners. It should be understood by those skilled in the art that the above-mentioned manufacturing method of the optical unit 31A is only illustrative and not limited to the above-mentioned example.

Referring to fig. 24, another embodiment of the LCD display 20A according to the present invention is illustrated.

In this example, the camera module 30 includes the light sensing unit 32A, and the light sensing unit 32A directly receives the light from the light guide channel 500. The light may be received by the light sensing unit 32A after being processed by the optical unit 31A located in the light guide channel 500.

In this way, the optical mechanism 31A 'of the camera module 30 can be disposed in the light guide channel 500, or the optical unit 31A located in the light guide channel 500 serves as the optical mechanism 31A' of the camera module 30, so as to reduce the height dimension of the camera module 30, and thus, the height dimension of the LCD display screen 20A and the camera module 30 can be reduced.

Referring to fig. 25, another embodiment of the LCD display 20A according to the present invention is illustrated.

In this example, the LCD display 20A has at least one light guide channel 500 and the LCD display 20A further includes at least one light guide assembly 50, wherein the light guide channel 500 is formed in the light guide assembly 50.

The LCD display 20A provides another light hole 200A, and the light hole 200A is used for installing the light guide assembly 50.

The LCD display 20A is a multi-layer structure, and the light-passing hole 200A can penetrate through one or more of the cover plate layer 21A, the touch layer 22A, the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, and the back plate layer 27A.

The light-passing hole 200 may pass through the cover plate layer 21A and the back plate layer 27A, for example, sequentially pass through the cover plate layer 21A, the touch layer 22A, one polarizer of the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, the other polarizer of the polarization layer 23A, and the back plate layer 27A from top to bottom. It should be understood by those skilled in the art that the arrangement of the various layers of the LCD display 20A described herein is illustrative only and not limiting of the present invention.

The light-passing hole 200A may pass through the touch layer 22A and the back plate layer 27A, for example, the light-passing hole 200A passes through the touch layer 22A, one polarizer of the polarization layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, the other polarizer of the polarization layer 23A, and the back plate layer 27A in sequence from top to bottom. It should be understood by those skilled in the art that the arrangement of the layers of the LCD panel 20A is illustrative only and not limiting.

The light-passing hole 200A may pass through the polarizing layer 23A and the back plate layer 27A, for example, the light-passing hole 200A passes through one polarizer of the polarizing layer 23A, the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, the other polarizer of the polarizing layer 23A, and the back plate layer 27A in sequence from top to bottom. It should be understood by those skilled in the art that the arrangement of the layers of the LCD panel 20A is illustrative only and not limiting.

The light-passing hole 200A may pass through the encapsulation layer 24A and the back plate layer 27A, for example, the light-passing hole 200A may pass through the encapsulation layer 24A, the pixel layer 25A, the driving circuit layer 26A, the polarization layer 23A, and the back plate layer 27A in sequence from top to bottom. It should be understood by those skilled in the art that the arrangement of the layers of the LCD panel 20A is illustrative only and not limiting.

The light passing hole 200A may extend from the pixel layer 25A to the back plate layer 27A, for example, the light passing hole 200A passes through the pixel layer 25A, the driving circuit layer 26A, the polarizing layer 23A and the back plate layer 27A in sequence from top to bottom. It should be understood by those skilled in the art that the arrangement of the layers of the LCD panel 20A is illustrative only and not limiting.

The light passing hole 200A may extend from the driving circuit layer 26A to the back plate layer 27A, for example, the light passing hole 200A may sequentially pass through the driving circuit layer 26A, the polarizing layer 23A and the back plate layer 27A. It should be understood by those skilled in the art that the arrangement of the layers of the LCD panel 20A is illustrative only and not limiting.

The light passing hole 200A may extend from the polarizing layer 23A located below the pixel layer 25A to the back plate layer 27A, for example, the light passing hole 200A passes through the polarizing layer 23A and the back plate layer 27A in this order from below the pixel layer 25A.

The light passing hole 200A may extend from a gap between the back plate layer 27A and the polarization layer 23A or a connection medium to the back plate layer 27A and through the back plate layer 27A, for example, the light passing hole 200A.

The light passing hole 200A is illustrated as passing through the pixel layer 25A. The pixel layer 25A includes the liquid crystal 252A and the filter layer 251A. The LCD panel 20A includes a liquid crystal layer 28A, wherein the liquid crystal layer 28A includes the liquid crystal 252A, the filter layer 251A, and the driving circuit layer 26A.

The liquid crystal 252A is held between the filter layer 251A and the driver circuit layer 26A. The light passing hole 200 passes through the liquid crystal layer 28A and the liquid crystal 252A can not be leaked to the light passing hole 200.

The liquid crystal layer 28A having the light passing holes 200 may be fabricated, and then holes may be formed at corresponding positions of the layers of the LCD panel 20A to form at least a portion of the light passing holes 200.

The light-passing hole 200 of the liquid crystal layer 28A may be located in the height direction of the liquid crystal layer 28A, and the light-passing hole 200A may also be formed in the liquid crystal layer 28A obliquely along a certain inclination angle to meet the setting requirement of the light-passing hole 200A.

Specifically, a sealing material 2811 is provided on the driving circuit layer 26A or the filter layer 251A of the liquid crystal layer 28A, so that when the driving circuit layer 26A and the filter layer 251A are attached to each other, the sealing material 2811A forms a sealing region 281A, and the liquid crystal 252A cannot enter the sealing region 281A. In the subsequent step, as long as the liquid crystal layer 28A is opened within the seal region 281A, the liquid crystal 252A of the liquid crystal layer 28A does not leak out.

The layers above the liquid crystal layer 28A of the LCD panel 20A may be respectively perforated to form the light passing holes 200 facing the liquid crystal layer 28A of the LCD panel 20A from the side of the LCD panel 20A. In this way, the LCD panel 20A may be provided with the light passing hole 200A penetrating the side surface of the LCD panel 20A and the back surface of the LCD panel 20A.

Part of the light guide assembly 50 is installed between the LCD panel 20A and the housing 40, and part of the light guide assembly 50 is installed in the light passing hole 200A of the LCD panel 20A.

The light guide assembly 50 may include at least one light guide channel. The number of the light guide pipes may be plural to be adapted to the light passing holes 200A of different shapes. The light passing hole 200A may be linear or curved.

When the number of the light guide pipes is plural, the light guide pipes may be sequentially installed in the light through holes 200A, or the light guide pipes may be sequentially installed in the LCD panel 20A, for example, when the liquid crystal layer 28A is installed on the polarizing layer 23A, one light guide pipe may be installed on the light through hole 200 portion corresponding to the liquid crystal layer 28A and the polarizing layer 23A, and then when the back plate layer 27A is installed on the liquid crystal layer 28A, another light guide pipe may be installed on the light through hole 200 portion corresponding to the back plate layer 27A.

The shape and position of the whole light-passing hole 200A can be set on the LCD display 20A according to the user's needs. The shape and location of the light guide assembly 50 may be designed according to the anticipated needs of the light guide channel 500.

The external light propagates along the light guide channel 500 to the camera module 30 on the back side of the LCD panel 20A. In this process, light may be reflected, diffused, or collimated within the light guide channel 500 of the light guide assembly 50.

Further, the optical unit 31A may be disposed in the light guide channel 500 of the light guide assembly 50. The optical unit 31A may be integrally formed with the light guide assembly 50, and the optical unit 31A may also be disposed in the light guide channel 500 of the light guide assembly 50.

The light guide assembly 50 may be transparent, such as glass or resin. The light guide assembly 50 may also be opaque, for example, the outer wall of the light guide assembly 50 may be coated with a layer of opaque material to reduce the influence of light outside the light guide assembly 50 on light inside the light guide channel 500 of the light guide assembly 50.

Referring to fig. 26, and to fig. 18A and 10, another embodiment of the LCD display 20A according to the present invention is illustrated.

In this example, the LCD display 20A has a light hole 200 and a light guide channel 500, wherein the light hole 200 penetrates the display 20A of the terminal device 1 from top to bottom. The light guide channel 500 extends downward from a gap between the display screen 20A and the housing 40 of the terminal device 1 to the display screen 20A. It is understood that the number of the light holes 200 may be plural, the light holes 200 may penetrate the display screen 20A from top to bottom, and the light holes 200 may also penetrate the display screen 20A from the side surface of the display screen 20A to the bottom surface of the display screen 20A.

Both the light guide channel 500 and the light passing hole 200 may be used to conduct light. The light passing hole 200 penetrates through the display screen 20A, and the camera module 30 aligned with the light passing hole 200 of the display screen 20A can receive light from the outer side of the display screen 20A through the light passing hole 200. The camera module 30 aligned with the light guide channel 500 can receive light from the outside of the display screen 20A through the light hole 200.

It should be noted that the light guide channel 500 and the light through hole 200 may be independent from each other, and the light guide channel 500 and the light through hole 200 may be aligned to different camera modules 30 respectively. In other words, a plurality of the camera modules 30 may be mounted on the display screen 20A and located below the display screen 20A.

Specifically, at least a portion of the light guide channel 500 is located between the display screen 20A and the housing 40, and at least a portion of the light guide channel 500 is located in the display screen 20A.

The light guide channel 500 may include a first portion light guide channel 501, a second portion light guide channel 502, and a third portion light guide channel 503, wherein the first portion light guide channel 501 is located between the display 20A and the housing 40, and the second portion light guide channel 502 and the third portion light guide channel 503 are respectively located inside the display 20A.

The first part of light guide channel 501 is located on a side surface of the display screen 20A, the second part of light guide channel 502 extends inwards from the side surface of the display screen 20A, and the third part of light guide channel 503 extends downwards from the inside of the display screen 20A.

In other embodiments of the present invention, the camera module 30 includes an optical mechanism 31A ' and a photosensitive unit 32A, wherein the optical mechanism 31A ' is aligned with the light-passing hole 200 and the light-guiding channel 500 and the optical mechanism 31A ' is maintained in a photosensitive path of the photosensitive unit 32A. The light-passing hole 200 and at least part of the light-guiding channel 500 are shared.

In this example, the camera module 30 includes the optical unit 31A and a light sensing unit 32A, wherein the optical unit 31A is disposed on the light guide channel 500, and the light sensing unit 32A is mounted on the back side of the display screen 20A.

The light-guiding channel 500 may not be visible from the outside of the display screen 20A, for example, when the second part of the light-guiding channel 502 is located on the encapsulation layer 24A of the display screen 20A, the light-guiding channel 500 may not be visible from the outside of the display screen 20A due to the polarizing layer located above the encapsulation layer 24A, and therefore at least part of the inner diameter of the light-guiding channel 500 may be designed to be slightly larger than the inner diameter of the light-passing hole 200, so that part of the optical elements may be placed in the light-guiding channel 500.

When the size of the light passing hole 200 is designed to be small, it is more difficult to observe the light passing hole 200 from the outside of the display screen 20A, which is advantageous to improve the screen occupation ratio of the display screen 20A.

Referring to fig. 27, and also to fig. 18A, another embodiment of the LCD display 20A according to the present invention is illustrated.

In this example, the LCD panel 20A has a light hole 200, wherein the light hole 200 penetrates the LCD panel 20A in the height direction. At least a portion of the light guide assembly 50 is disposed within the light hole 200.

The light guide assembly 50 includes two light guide pipes, one of which is accommodated in the light hole 200, and the other of which extends from the gap between the display screen 20A and the housing 40 to the light hole 200. That is to say, one light guide pipeline can guide light above the display screen 20A to pass through the display screen 20A from top to bottom and then reach the camera module 30. The other light guide pipe can guide the light between the display screen 20A and the casing 40 to reach the camera module 30. The light-passing hole 200 can be made in the manner described above.

The light guide duct may be made of a light-transmitting material so that the light guide duct is difficult to be observed from the outside of the display panel 20A, and may be coated with a light-shielding material in order to reduce the influence of stray light, for example, the influence of light from the pixel layer 25A of the display panel 20A.

Further, the LCD panel 20A includes an optical unit 31A, wherein the optical unit 31A is held in the light guide channel 500 of the light guide assembly 50, and the optical unit 31A may be a filter, a diffuser 313A, or a modulation 312A. The optical unit 31A may pre-process the light to make the light entering the camera module 30 reach a desired value.

In order to further reduce the overall height dimension of the terminal device 1, it is preferable in the present invention to employ the camera module 30 having a lower height dimension.

Fig. 28 illustrates a specific example of the camera module 30 according to the present invention. The camera module 30 includes an optical mechanism 31A 'and a photosensitive unit 32A, wherein the camera module 30 further includes a diaphragm 33A, wherein the diaphragm 33A is located at the position of the light-passing hole 200, and the optical mechanism 31A' is held in a photosensitive path of the photosensitive unit 32A.

The diaphragm 33A may act as a restriction for light passing through the optical mechanism 31A'. Specifically, the control of the light entering amount of the optical mechanism 31A' can be realized by controlling the size of the light-transmitting aperture of the stop 33A.

The diaphragm 33A may be circular, triangular or rectangular. The size of the diaphragm 33A is such as to limit the light entering the optical means 31A' through the diaphragm 33A.

In this example, the display screen 20 has the light passing hole 200, and the camera module 30 is installed below the display screen 20. The light-passing hole 200 allows light to pass through the display screen 20 and then reach the camera module 30.

The light-passing hole 200 can function as the diaphragm 33A of the camera module 30, so that for the camera module 30 itself, the camera module 30 does not need to separately set the diaphragm 33A, the control of the light quantity entering the camera module 30 can be realized by controlling the size of the light-passing hole 200 of the display screen 20, and the light-passing hole 200 functions as the diaphragm 33A.

In this way, the height dimension of the camera module 30 can be reduced, so that the height dimensions of the display screen 20 and the camera module 30 can also be reduced, which is beneficial to the lightness and thinness of the terminal device 1.

Further, before the camera module 30 is installed on the display screen 20, the optical path design of the camera module 30 is fixed, parameters such as the amount of light entering and the exposure time required by the camera module 30 can be determined, and based on these parameters, the size of the diaphragm 33A can be determined, so that the light-transmitting hole 200 meeting the requirements can be manufactured according to the requirements of the camera module 30 in the process of manufacturing and forming the light-transmitting hole 200 by the display screen 20. Reference may be made to the above-mentioned method for manufacturing the light-passing hole 200, and the aperture size and position of the light-passing hole 200 may be designed according to the requirement.

Furthermore, the camera module 30 and the diaphragm 33A are located on the photosensitive path of the photosensitive unit 32A, and the distance between the camera module 30 and the diaphragm 33A is determined based on the optical requirement of the camera module 30, and the camera module 30 can be located on the display screen 20 according to the requirement by adjusting the relative position between the camera module 30 and the display screen 20, so as to adjust the distance between the camera module 30 and the diaphragm 33A, and meet the requirement of the optical path of the camera module 30.

Fig. 29 illustrates an embodiment of the camera module 30 according to the present invention.

The image pickup module 30 includes an optical mechanism 31A ', a photosensitive unit 32A, and a diaphragm 33A ', wherein the diaphragm 33A ' is provided to the optical mechanism 31A ', and the optical mechanism 31A ' is held in a photosensitive path of the photosensitive unit 32A. The size of the amount of light transmitted by the optical mechanism 31A 'can be controlled by controlling the size of the diaphragm 33A'.

When the camera module 30 is installed on the display screen 20, the light-passing hole 200 of the display screen 20 allows light to pass through the light-passing hole 200 from the outside of the display screen 20 and then reach the camera module 30. The light-passing hole 200 can affect the imaging result of the camera module 30.

The light-passing hole 200 functions like a diaphragm, and by controlling the aperture of the light-passing hole 200, the imaging light beam can be controlled. The light-passing hole 200 of the display screen 20 can restrict the imaging light beam of the camera module 30, and the diaphragm 33A' of the camera module 30 also restricts the imaging light beam. The light-passing hole 200 of the display screen 20 and the diaphragm 33A' of the camera module 30 can work in cooperation.

Before the camera module 30 is mounted on the display screen 20, the light path design of the camera module 30 may be determined approximately, so that the size of the light passing hole 200 of the display screen 20 may be set based on the requirements of the camera module 30. After the camera module 30 is mounted on the display screen 20, the size of the light-passing hole 200 is fixed, the relative position between the camera module 30 and the light-passing hole 200 can be fixed, and the imaging light beam can be further controlled by controlling the diaphragm 33A' of the camera module 30.

Further, the light-passing hole 200 of the display screen 20 may play a role in restricting the imaging light beam, and the diaphragm 33A' of the camera module 30 may play a role in restricting the imaging light beam, and may also be set as a diaphragm capable of eliminating stray light, so as to perform stray light elimination processing on the light beam passing through the light-passing hole 200. In other words, the light-passing hole 200 of the display screen 20 and the diaphragm 33A' of the camera module 30 can cooperate with each other to limit the imaging light beam. The light-passing hole 200 of the display screen 20 and the diaphragm 33A' of the camera module 30 may also play different roles, specifically set according to the light path requirements of the camera module 30.

It should be noted that the diaphragm 33A 'of the camera module 30 may be an iris diaphragm, and the aperture of the diaphragm 33A' is adjustable, so that the control of the light transmission amount of the camera module 30 is realized by adjusting the aperture thereof.

Fig. 30 illustrates a specific example of the camera module 30 according to the present invention. As shown in fig. 30, in this embodiment, the camera module 30 includes a circuit board 31, a photosensitive chip 32 and a light-transmitting component 33, wherein the circuit board 31 has a recess 310, the photosensitive chip 32 is disposed in the recess 310 and electrically connected to the circuit board 31, and the light-transmitting component 33 is located on a photosensitive path of the photosensitive chip 32. Thus, the imaging light passing through the display screen 20 reaches the light-transmitting component 33 first, and then reaches the photosensitive chip 32 to be sensed by the photosensitive chip 32 for performing an imaging reaction.

As will be appreciated by those skilled in the art, in the conventional COB process-based camera module, the circuit board has a flat surface, and the photosensitive chip is directly attached and electrically connected to the flat surface of the circuit board. Since each camera module has a predetermined optical back focus requirement, the mounting reference height of the photo-sensing chip directly determines the overall height of the camera module 30.

Accordingly, compared to the conventional camera module based on the COB process, in this specific example, the groove 310 is provided on the circuit board 31, so that the installation reference height of the photosensitive chip 32 is reduced by the groove 310. In other words, in the present invention, the top surface of the wiring board 31 is a non-flat surface in which the region of the wiring board 31 for mounting the photosensitive chip 32 is recessed downward, so that the mounting reference height of the photosensitive chip 32 is reduced. It should be understood that the mounting height of the optical lens 332 relative to the circuit board 31 can be reduced, and thus the overall height dimension of the camera module 30 can be reduced, while the optical back focus requirement remains unchanged.

Preferably, in this specific example, the size of the groove 310 is consistent with the size of the photosensitive chip 32, so that the groove 310 itself can be used to position and limit the photosensitive chip 32. Specifically, in the process of installing the photosensitive chip 32 in the groove 310, the photosensitive chip 32 can be directly embedded into the groove 310 in a fitting manner, and the conventional COB-based process camera module does not need to continuously calibrate and position the installation position of the photosensitive chip on the circuit board. Further, after the photo sensor chip 32 is mounted in the groove 310 and electrically connected to the circuit board 31, the photo sensor chip 32 is "captured" in the groove 310 to prevent the photo sensor chip 32 from being separated from or displaced from the groove 310.

Further, the camera module 30 further includes a set of leads 34, wherein after the photosensitive chip 32 is attached in the groove 310 of the circuit board 31, the photosensitive chip 32 is electrically connected to the circuit board 31 through the leads 34. Because the distance from the upper surface of the photosensitive chip 32 to the upper surface of the circuit board 31 is reduced, the arc height of a gold wire connecting the photosensitive chip 32 and a bonding pad of the circuit board 31 is also reduced, and the routing difficulty is reduced.

Specifically, each of the leads 34 extends between the photo sensor chip 32 and the circuit board 31 in a bending manner, so that the photo sensor chip 32 is connected to the circuit board 31 through the leads 34, the circuit board 31 can supply power to the photo sensor chip 32 according to the leads 34, and the photo sensor chip 32 can transmit the collected signals according to the leads 34.

It is worth mentioning that in this specific example, the type of the lead 34 is not limited by the present application, for example, the lead 34 may be a gold wire, a silver wire, a copper wire. The lead 34 can be mounted between the circuit board 31 and the light sensing chip 32 by a "gold wire bonding" process for electrical connection therebetween.

Specifically, "gold wire bonding" processes generally fall into two types: the 'forward bonding of gold thread' process and the 'reverse bonding of gold thread' process. The "direct bonding gold wire" process means that in the process of laying the lead wires 34, one end of the lead wires 34 is first formed on the conductive end of the circuit board 31, the lead wires 34 are then extended in a bent manner, and finally the other end of the lead wires 34 is formed on the conductive end of the photosensitive chip 32, in such a manner that the lead wires 34 are formed between the photosensitive chip 32 and the circuit board 31. The "reverse gold wire bonding" process means that in the process of laying the lead 34, one end of the lead 34 is first formed on the conductive end of the photosensitive chip 32, the lead 34 is then extended curvedly, and finally the other end of the lead 34 is formed on the conductive end of the circuit board 31, in such a manner that the lead 34 is formed between the photosensitive chip 32 and the circuit board 31. It is worth mentioning that the height of the upward protrusion of the lead 34 formed by the "reverse bonding wire" process is smaller than the height of the upward protrusion of the lead 34 formed by the "forward bonding wire" process, and therefore, preferably, in this embodiment, the lead 34 is formed by the "reverse bonding wire" process.

Further, the camera module 30 further includes a base 35, and the base 35 is disposed on the circuit board 31 for supporting the light-transmitting component 33. The light-transmitting component 33 includes a color filter 331 and an optical lens 332, and the color filter 331 and the optical lens 332 are sequentially disposed on a light-sensing path of the light-sensing chip 32. It should be noted that if the arc height of the lead 34 is reduced, the height of the inner cavity of the base 35 can also be reduced, and further, the height of the base 35 can also be reduced, and further, the overall height of the camera module 30 can also be reduced.

Specifically, in this particular example, the base 35 may be implemented as a conventional plastic bracket that is pre-formed and affixed to the top surface of the wiring board 31; alternatively, the base 35 may be implemented as a molded base, which may be integrally formed at the corresponding positions of the circuit board 31 and/or the photosensitive chip 32 by a mob (molding on board), moc (molding on chip) process. As will be known to those skilled in the art, the mob (molding on board) process refers to integrally molding the molding base on the circuit board 31 by a molding process, wherein the molding base after molding integrally covers the circuit board 31, the electronic component 312 on the circuit board 31 and the leads 34. The MOC process refers to integrally forming the mold base on the circuit board 31 by a molding process, wherein the molded base after forming covers at least a portion of the lead 34, or covers at least a portion of the lead 34 and the photosensitive chip 32 (wherein at least a portion of the photosensitive chip 32 is a non-photosensitive region of the photosensitive chip 32), in addition to the circuit board 31 and the electronic component 312 located on the circuit board 31.

In this specific example, the color filter 331 is disposed between the optical lens 332 and the light-sensing element, so that the light entering the camera module 30 from the optical lens 332 can be received and photoelectrically converted by the light-sensing chip 32 after being filtered by the color filter 331, so as to improve the imaging quality of the camera module 30. For example, the color filter 331 can be used to filter the infrared portion of the light entering the camera module 30 from the optical lens 332.

Those skilled in the art will appreciate that the color filter 331 can be implemented in different types, including but not limited to the color filter 331 can be implemented as an infrared cut filter, a full transmittance spectral filter, and other filters or combinations of filters. Specifically, for example, when the color filter 331 is implemented as a combination of an infrared cut filter and a full transmittance spectral filter, that is, the infrared cut filter and the full transmittance spectrum filter can be switched to be selectively located on the light sensing path of the light sensing chip 32, and thus, when the camera module 30 is used in an environment with sufficient light, such as daytime, the infrared cut-off filter can be switched to the photosensitive path of the photosensitive chip 32, so as to filter the infrared ray in the light reflected by the object entering the camera module 30 by the infrared cut filter, in addition, when the camera module 30 is used in a dark environment such as at night, the full-transmission spectral filter can be switched to the photosensitive path of the photosensitive chip 32, to allow the infrared portion of the light reflected by the object entering the camera module 30 to pass through.

It should be noted that the color filter 331 may also be disposed at other positions on the photosensitive path of the photosensitive chip 32, for example, the color filter 331 is disposed at the bottom of the optical lens 332, and the like, which is not limited in this application.

It should be noted that, in this specific example, the camera module 30 may be implemented as a fixed Focus module or a movable Focus module, wherein, when the camera module 30 is a movable Focus module, the camera module 30 further includes a driver 36 connected to the circuit board 31, and the driver 36 is configured to controllably drive the lens to move so as to implement Auto-Focus (Auto-Focus).

Fig. 31 illustrates another specific example of the camera module 30 according to the present invention, wherein the camera module 30 illustrated in fig. 31 is a modified implementation of the camera module 30 illustrated in fig. 30.

Specifically, as shown in fig. 31, in this specific example, the camera module 30 includes a circuit board 31, a photosensitive chip 32, a light-transmitting component 33 and a reinforcing plate 37, wherein the circuit board 31 has an opening 310A formed through the circuit board 31, the reinforcing plate 37 is attached to the bottom surface of the circuit board 31, the photosensitive chip 32 is disposed at the opening 310A of the circuit board 31 and attached to the reinforcing plate 37, the photosensitive chip 32 is conductively connected to the circuit board 31, and the light-transmitting component 33 is disposed on a photosensitive path of the photosensitive chip 32. Thus, the imaging light passing through the display screen 20 reaches the light-transmitting component 33 first, and then reaches the photosensitive chip 32 to be sensed by the photosensitive chip 32 for performing an imaging reaction.

The reinforcing plate 37 may be implemented as a steel plate having a more flat surface than the circuit board 31, and when the photo chip 32 is attached thereon, it is more flat and has a better imaging effect, and in addition, the heat conductive property of the metal is better, and the steel plate can play a role of heat dissipation.

In other words, compared to the camera module 30 illustrated in fig. 30, in this specific example, the circuit board 31 has the opening 310A formed through the circuit board 31 to reduce the mounting reference height of the photosensitive chip 32 through the opening 310A. In other words, in the present invention, the top surface of the wiring board 31 is a non-flat surface in which the region of the wiring board 31 where the photosensitive chip 32 is mounted is recessed downward and penetrates through the wiring board 31, so that the mounting reference height of the photosensitive chip 32 is further reduced. It should be understood that each camera module has a predetermined optical back focus requirement, so that the installation height of the optical lens 332 relative to the circuit board 31 can be further reduced on the premise of keeping the optical back focus requirement unchanged, and thus the overall height dimension of the camera module 30 can be further reduced.

As shown in fig. 31, it should be particularly noted that, in this specific example, the bottom surface of the photosensitive chip 32 is flush with the bottom surface of the circuit board 31, that is, the mounting reference height of the photosensitive chip 32 is the height of the bottom surface of the circuit board 31, so that the mounting position of the photosensitive chip 32 can be further lowered on the premise of ensuring the preset optical back focus, so as to further reduce the overall height dimension of the image pickup module 30.

Preferably, in this specific example, the size of the opening 310A is consistent with the size of the photosensitive chip 32, so that the opening 310A itself can be used to position and limit the photosensitive chip 32. Specifically, in the process of installing the photo sensor chip 32 in the opening 310A, the photo sensor chip 32 can be directly embedded into the opening 310A and finally attached to the stiffener 37 without continuously calibrating and positioning the installation position of the photo sensor chip 32 on the circuit board 31 as in the conventional COB process-based camera module. Further, after the photo sensor chip 32 is mounted in the opening 310A and electrically connected to the circuit board 31, the photo sensor chip 32 is "captured" in the opening 310A to prevent the photo sensor chip 32 from being separated from or displaced from the opening 310A.

Further, the camera module 30 further includes a set of leads 34, wherein after the photosensitive chip 32 is mounted in the opening 310A of the circuit board 31, the photosensitive chip 32 is electrically connected to the circuit board 31 through the leads 34. Specifically, each of the leads 34 extends between the photo sensor chip 32 and the circuit board 31 in a bending manner, so that the photo sensor chip 32 is connected to the circuit board 31 through the leads 34, the circuit board 31 can supply power to the photo sensor chip 32 according to the leads 34, and the photo sensor chip 32 can transmit the collected signals according to the leads 34.

Further, the camera module 30 further includes a base 35, and the base 35 is disposed on the circuit board 31 for supporting the light-transmitting component 33. The light-transmitting component 33 includes a color filter 331 and an optical lens 332, and the color filter 331 and the optical lens 332 are sequentially disposed on a light-sensing path of the light-sensing chip 32.

It is also worth mentioning that in this specific example, the camera module 30 can be implemented as a fixed Focus camera module or a moving Focus camera module, wherein when the camera module 30 is a moving Focus camera module, the camera module 30 further includes a driver 36 electrically connected to the circuit board 31, and the driver 36 is configured to controllably drive the lens to move so as to realize Auto-Focus (Auto-Focus).

Fig. 32 illustrates a further specific illustration of the camera module 30 according to the present invention, wherein the camera module 30 illustrated in fig. 32 is a modified implementation of the camera module 30 illustrated in fig. 31.

Specifically, in contrast to the camera module 30 illustrated in fig. 31, in this specific example, the base 35 is directly provided and mounted on the reinforcing plate 37. In other words, in this specific example, the mounting reference height of the base 35 is reduced, and thus the mounting reference height of the optical lens 332 mounted to the base 35 is reduced, so that the overall height dimension of the camera module 30 can be reduced.

Accordingly, in this particular embodiment, the base 35 may be implemented as a conventional plastic bracket that is pre-formed and affixed to the top surface of the stiffener 37; alternatively, the base 35 may be implemented as a molded base, which may be integrally formed at the corresponding positions of the reinforcing plate 37, the circuit board 31 and/or the photosensitive chip 32 by a mob (molding on board), moc (molding on chip) process. As will be known to those skilled in the art, the mob (molding on board) process refers to integrally molding the molding base on the circuit board 31 by a molding process, wherein the molding base after molding integrally covers the reinforcing plate 37, the circuit board 31, the electronic component 312 on the circuit board 31, and the leads 34. The MOC process refers to integrally forming the mold base on the circuit board 31 by a molding process, wherein the molded base after forming covers at least a portion of the lead 34, or covers at least a portion of the lead 34 and the photo-sensing chip 32 (wherein at least a portion of the photo-sensing chip 32 is a non-photo-sensing area of the photo-sensing chip 32), in addition to the reinforcement plate 37, the circuit board 31 and the electronic component 312 located on the circuit board 31.

Fig. 33 illustrates yet another specific example of the camera module 30 according to the present invention, wherein the camera module 30 illustrated in fig. 33 is another modified implementation of the camera module 30 illustrated in fig. 31.

Specifically, compared to the camera module 30 illustrated in fig. 31, in this specific example, the base 35 has at least two positioning posts 351 extending downward, the circuit board 31 has at least two openings 311, and the positioning posts 351 are disposed on the reinforcing plate 37 through the openings 311, so that the mounting reference height of the base 35 is reduced, and the overall height of the camera module 30 is reduced.

Fig. 34 and 35 illustrate yet another specific example of the camera module 30 according to the present invention, wherein the camera module 30 illustrated in fig. 34 and 35 is implemented as yet another variation of the camera module 30 illustrated in fig. 31.

As shown in fig. 34 and 35, in this specific example, the reinforcing plate 37 has a projection 371A or a groove 371 at the opening 310A of the wiring board 31 to adjust the mounting reference height of the photosensitive chip 32 by the projection 371A or the groove 371. In other words, in this specific example, the bottom surface of the photosensitive chip 32 is not flush with the bottom surface of the wiring board 31.

Specifically, as shown in fig. 34, when the reinforcing plate 37 has a groove 371 at the opening 310A of the circuit board 31, the mounting reference height of the photosensitive chip 32 is further reduced, so that the overall height dimension of the image pickup module 30 is further reduced while satisfying the design requirement of the preset optical back focus. It should be noted that when the reinforcing plate 37 has the groove 371 at the opening 310A of the wiring board 31, the photosensitive chip 32 is attached to the reinforcing plate 37, whereupon the bottom surface of the photosensitive chip 32 is lower than the bottom surface of the wiring board 31.

Specifically, as shown in fig. 35, when the reinforcing plate 37 has a boss 371A at the opening 310A of the circuit board 31, the mounting standard height of the photosensitive chip 32 is reduced compared to the conventional imaging module based on the COB process, so that the overall height of the imaging module 30 is reduced while the design requirement of the predetermined optical back focus is satisfied. It should be noted that when the reinforcing plate 37 has the projection 371A at the opening 310A of the wiring board 31, the photosensitive chip 32 is attached to the reinforcing plate 37, whereupon the bottom surface of the photosensitive chip 32 is higher than the bottom surface of the wiring board 31 but lower than the top surface of the wiring board 31.

Fig. 36 illustrates yet another specific example of the camera module 30 according to the present invention, wherein the camera module 30 illustrated in fig. 36 is a modified implementation of the camera module 30 illustrated in fig. 33.

Specifically, as shown in fig. 36, in this specific example, the image pickup module 30 includes a circuit board 31, a photosensitive chip 32, a base 35, an optical lens 332, a color filter 331, and a reinforcing plate 37, wherein the circuit board 31 has an opening 310A formed through the circuit board 31, the reinforcing plate 37 is attached to the bottom surface of the circuit board 31, the photosensitive chip 32 is disposed at the opening 310A of the circuit board 31 and attached to the reinforcing plate 37, the photosensitive chip 32 is conductively connected to the circuit board 31, and the color filter 331 and the optical lens 332 are sequentially disposed on a photosensitive path of the photosensitive chip 32. Thus, the imaging light passing through the display screen 20 first reaches the optical lens 332, is filtered by the color filter 331, and then reaches the photosensitive chip 32 to be sensed by the photosensitive chip 32 for performing an imaging reaction.

In particular, in this implementation, the optical lens 332 and the mount 35 have a unitary structure, i.e., the optical lens 332 and the mount 35 are already assembled into a single piece before participating in the assembly of the camera module 30. In other words, in this particular example, the optical lens 332 is an integral lens 333 that is assembled with the mount 35 to form a single element unit. Further, in this specific example, the chassis 35 has at least two positioning posts extending downward, the circuit board 31 has at least two openings, and the positioning posts are provided to the reinforcing plate 37 through the openings, in such a manner that the integrated lens 333 and the photosensitive chip 32 have the same mounting reference surface (i.e., the top surface of the reinforcing plate 37). Thus, the overall height of the camera module 30 can be reduced while meeting the design requirements of the preset optical back focus.

It is worth mentioning that in this specific example of the application, the integral lens 333 may further include the color filter unit 331, i.e., in this specific implementation, the optical lens 332, the base 35, and the color filter unit 331 have an integral structure, i.e., the optical lens 332, the base 35, and the color filter unit 331 are already assembled into a whole before participating in the assembly of the camera module 30. Thus, the assembly of the camera module 30 can be made more compact, so that the overall height dimension of the camera module 30 can be reduced.

Fig. 37 illustrates still another specific example of the camera module 30 according to the present invention. As shown in fig. 37, in this specific example, the image capturing module 30 includes an optical lens 332, a base 35, a color filter 331, a light sensing chip 32, and a circuit board 31, wherein the light sensing chip 32 is disposed on the circuit board 31 in a conductive manner, the base 35 is disposed on the circuit board 31, and the lens and the color filter 331 are sequentially disposed on a light sensing path of the light sensing chip 32, wherein the base 35 is configured to support the color filter 331. Thus, the imaging light passing through the display screen 20 first reaches the optical lens 332, is filtered by the color filter 331, and then reaches the photosensitive chip 32 to be sensed by the photosensitive chip 32 for performing an imaging reaction.

Further, the camera module 30 further includes a set of leads 34, wherein after the photosensitive chip 32 is attached to the circuit board, the photosensitive chip 32 is electrically connected to the circuit board 31 through the leads 34. Specifically, each of the leads 34 extends between the photo sensor chip 32 and the circuit board 31 in a bending manner, so that the photo sensor chip 32 is connected to the circuit board 31 through the leads 34, the circuit board 31 can supply power to the photo sensor chip 32 according to the leads 34, and the photo sensor chip 32 can transmit the collected signals according to the leads 34.

A set of electronic components 312 is further disposed on the circuit board 31, wherein each of the electronic components 312 may be mounted on an edge region of the circuit board 31 at intervals (compared with the mounting position of the photo-sensor chip 32) by a process such as smt (surface Mount technology). The electronic components 312 include, but are not limited to, resistors, capacitors, inductors, and the like. It should be noted that the photosensitive chip 32 and each of the electronic components 312 may be respectively located on the same side or opposite sides of the circuit board 31. For example, the photosensitive chip 32 and each of the electronic components 312 may be respectively located on the same side of the circuit board 31, and each of the electronic components 312 is mounted on the edge region of the circuit board 31 at intervals.

In particular, as shown in fig. 37, in this particular example, the base 35 is supported on the top surface of the circuit board 31, and the base 35 includes a main body 352 and a side wall 353 extending downward along the main body 352, and the main body 352 and the side wall 353 define a receiving cavity 354. When the base 35 is disposed on the circuit board 31, the side wall 353 supports the circuit board 31, and the bottom surface of the base 35, the upper surface of the circuit board 31 and the side wall 353 define the accommodating cavity 354, wherein the electronic component 312 disposed on the circuit board 31 is accommodated in the accommodating cavity 354. Preferably, the height dimension of the receiving cavity 354 is less than 0.2mm, such as 0.1 mm.

Further, as shown in fig. 37, in this specific example, the base 35 further has at least one receiving hole 355, and the receiving hole 355 is disposed through the base 35 to communicate the receiving cavity 354 with the external environment. It is appreciated that in this particular embodiment, the receiving cavity 354 is lower in height than the relatively tall electronic component 312, such as a capacitor or the like. Therefore, when the base 35 is disposed on the circuit board 31, since the height from the bottom surface of the main body 352 of the base 35 to the top surface of the circuit board 31 is smaller than the electronic component 312 having a relatively large size such as a capacitor, the electronic component 312 cannot be accommodated without the accommodating hole 355. That is, the accommodation hole 355 serves to avoid the electronic component 312 having a large size, so that the electronic component 312 can be accommodated in the base 35 even when the height of the base 35 is lowered. In other words, by providing the receiving hole 355 on the base 35, the overall design height of the base 35 can be reduced, so that the overall height of the camera module 30 can be reduced.

For example, but not limited to, the height of the capacitor in the electronic component 312 is 0.38mm, the height of the accommodating cavity 354 is 0.1mm, and the thickness of the main body 352 of the base 35 is set to 0.4mm, that is, the height of the accommodating hole 355 is 0.4 mm. Thus, when the base 35 is disposed on the circuit board 31, the capacitor in the electronic component 312 cannot be completely accommodated in the accommodating cavity 354, and accordingly, the upper end of the capacitor in the electronic component 312 extends into the accommodating hole 355 and is accommodated in the accommodating hole 355. It should be understood that, in the present invention, the receiving hole 355 should be arranged to match the electronic component 312 of the circuit board 31, and the horizontal size of the electronic component 312 determines the size of the receiving hole 355, i.e. the electronic component 312 should be ensured to be received in the receiving hole 355.

Further, as shown in fig. 37, in this specific example, the base 35 further has a light passing hole 356, the light passing hole 356 is formed in the main body 352 of the base 35 and corresponds to the light sensing chip 32, wherein the light passing hole 356 is used for placing the color filter 331. Accordingly, the main body 352 of the base 35 further has a cantilever 357 integrally extending from the main body 352 and defining the size of the light through hole 356, wherein the color filter 331 is disposed on the cantilever 357 and filters the light received by the module. It is noted that, in this specific example, when the base 35 is disposed on the circuit board 31, the color filter 331 is placed on the cantilever 357 of the main body 352, and the upper end of at least one of the electronic components 312 is received in the receiving hole 355, it can be observed that a part of the top surface of the electronic component 312 is higher than the bottom surface of the color filter 331.

It is worth mentioning that in this particular example, the color filter 331 can be implemented in different types, including but not limited to the color filter 331 can be implemented as an infrared cut filter, a full transmission spectrum filter, and other filters or combinations of filters. Specifically, for example, when the color filter 331 is implemented as a combination of an infrared cut filter and a full transmittance spectral filter, that is, the infrared cut filter and the full transmittance spectrum filter can be switched to be selectively located on the light sensing path of the light sensing chip 32, and thus, when the camera module 30 is used in an environment with sufficient light, such as daytime, the infrared cut-off filter can be switched to the photosensitive path of the photosensitive chip 32, so as to filter the infrared ray in the light reflected by the object entering the camera module 30 by the infrared cut filter, in addition, when the camera module 30 is used in a dark environment such as at night, the full-transmission spectral filter can be switched to the photosensitive path of the photosensitive chip 32, to allow the infrared portion of the light reflected by the object entering the camera module 30 to pass through.

Of course, the color filter 331 may also be disposed at other positions on the photosensitive path of the photosensitive chip 32, for example, the color filter 331 is disposed at the bottom of the optical lens 332, and the like, which is not limited in this application.

In particular, as shown in fig. 37, in this particular example, the base 35 may be implemented as a conventional plastic bracket that is preformed and affixed to the top surface of the wiring board 31; alternatively, the chassis 35 may be implemented as a molded chassis, which may be integrally formed and attached to the top surface of the wiring board 31 through an injection molding process. However, due to the limitation of the molding process of the base 35, the receiving hole 355 is configured as a light-passing hole, i.e., the receiving hole 355 is connected to the receiving cavity 354 and the external environment. It is conceivable that, when the camera module 30 is assembled, dirt easily enters through the housing hole 355, causing dirt on the photosensitive chip 32.

Therefore, as shown in fig. 37, in this specific example, the camera module 30 further includes a protection member 38, the protection member 38 integrally extends downward from the main body 352, when the base 35 is disposed on the circuit board 31, the protection member 38 surrounds the photosensitive chip 32, and the protection member 38, the main body 352 of the base 35 and the color filter 331 disposed on the main body 352 form a sealed space to prevent dirt from entering the photosensitive chip 32.

In a specific implementation, the protection member 38 may be implemented as a portion of the main body 352 of the base 35, which integrally extends downward from the main body 352, wherein when the base 35 is disposed on the circuit board 31, the protection member 38 surrounds the photosensitive chip 32, and the protection member 38, the main body 352 of the base 35 and the color filter 331 disposed on the main body 352 form a sealed space to prevent dirt from entering the photosensitive chip 32. Alternatively, the protection member 38 and the base 35 are separately disposed, as shown in fig. 38, for example, the protection member 38 is attached to the base 35 by a process such as adhesion, so as to reduce the difficulty in molding the base 35.

Preferably, the upper end of the accommodating hole 355 can be sealed by a film or glue, so as to prevent the electronic component 312 from being damaged, and further enhance the sealing effect to prevent dirt from entering the photosensitive chip 32.

It should be noted that, in this specific example, the camera module 30 can be implemented as a fixed Focus module or a movable Focus module, wherein, when the camera module 30 is a movable Focus module, the camera module 30 further includes an actuator 36 (for example, but not limited to, the actuator can be implemented as a motor, etc.) electrically connected to the circuit board 31, and the actuator 36 is used for controllably driving the lens to move so as to implement Auto-Focus (Auto-Focus), as shown in fig. 39.

Specifically, as shown in fig. 39, the driver 36 includes at least one positioning pillar 361 extending from a lower end of the driver 36, and the at least one positioning pillar 361 is formed at a position of the driver 36 corresponding to the at least one receiving hole 355, so that when the driver 36 is mounted on the base 35, the positioning pillar is engaged with the receiving hole 355 in a latch manner. Thus, the positioning posts 361 and the receiving holes 355 cooperate to improve the mounting accuracy of the driving member, and the positioning posts and the receiving holes 355 cooperate to improve the reliability of the driver 36.

Fig. 40 illustrates yet another specific example of the camera module 30 according to the present invention, wherein the camera module 30 illustrated in fig. 40 is a modified implementation of the camera module 30 illustrated in fig. 37.

Specifically, as shown in fig. 40, in this specific example, the protection member 38 is implemented as a protection film attached to the upper end of the housing hole 355 (the top surface of the main body 352), so that when the base 35 is disposed on the circuit board 31, the protection film ensures that the housing hole 355 and the housing cavity 354 are a sealed space, thereby also preventing dirt from entering the photosensitive chip 32, and the protection film can also protect the electronic component 312. For example, the protective film may be implemented as a sticker, or formed on the upper end of the accommodation hole 355 by a process such as potting, to seal the accommodation hole 355.

Fig. 41 illustrates yet another specific example of the camera module 30 according to the present invention, wherein the camera module 30 illustrated in fig. 41 is a modified implementation of the camera module 30 illustrated in fig. 37.

Specifically, as shown in fig. 41, in this specific example, the electronic components 312 provided on the wiring board 31 are provided on both sides of the wiring board 31, that is, the photosensitive chip 32 is provided on the wiring board 31, and the electronic components 312 are located on both sides of the photosensitive chip 32. Those skilled in the art will appreciate that most of the electronic components 312 on the circuit board 31 in the conventional camera module are disposed around (or on four sides of) the circuit board 31.

Further, as shown in fig. 41, in this specific example, the protector 38 is integrally formed with the main body 352 and extends downward from the main body 352. Preferably, the protection member 38 extends downward from the main body 352 in parallel with the side wall 353 to form a receiving cavity 358 between the side wall 353 and the protection member 38, and the receiving hole 355 is formed between the side wall 353 and the protection member 38 and communicates with the receiving cavity 358.

In particular, as shown in fig. 41, in this specific example, the electronic component 312 is disposed at a position on the circuit board 31 such that when the base 35 is attached to the top surface of the circuit board 31, the electronic component 312 is received in the receiving cavity 358, and a portion of the electronic component 312 higher than the height of the receiving cavity 358 can be received in the receiving hole 355.

It should be understood that in this embodiment, the positions of the side walls 353 and the protection members 38 should be determined by the arrangement of the electronic components 312 on the circuit board 31. For example, when the electronic components 312 are arranged in a matrix on both sides of the circuit board 31, the protection member 38 extends downward from the main body 352 in parallel with the side wall 353 and is formed between the electronic components 312 and the photo sensor chip 32 for isolating the photo sensor chip 32 and preventing dirt from entering the photo sensor chip 32 through the housing hole 355.

It is to be noted that, in this specific example, the protection members 38 only need to be respectively formed between the photo sensor chip 32 and the electronic component 312 for isolating the photo sensor chip 32, that is, the protection members 38 do not need to be disposed around the photo sensor chip 32, and only need to be formed on two sides of the photo sensor chip 32. In other words, in this specific example, the image pickup module 30 has a very narrow side formed on the side of the circuit board 31 where the electronic component 312 is not disposed, and the mounting positions of the photosensitive chip 32 and the optical lens 332 are close to the edge of the circuit board 31. In particular, the very narrow sides may enable the camera module 30 to be placed at the edge of a smartphone.

Fig. 42 illustrates still another specific example of the camera module 30 according to the present invention. As shown in fig. 42, in this specific example, the image capturing module 30 includes an optical lens 332, a base 35, a color filter 331, a light sensing chip 32, and a circuit board 31, wherein the light sensing chip 32 is disposed on the circuit board 31 in a conductive manner, the base 35 is integrally formed on the circuit board 31 by a molding process, the optical lens 332 and the color filter 331 are sequentially disposed on a light sensing path of the light sensing chip 32, and the base 35 is configured to support the color filter 331. Thus, the imaging light passing through the display screen 20 first reaches the optical lens 332, is filtered by the color filter 331, and then reaches the photosensitive chip 32 to be sensed by the photosensitive chip 32 for performing an imaging reaction.

In particular, this specific example is an optimization of existing camera modules based on a molding process. Those skilled in the art will appreciate that in the conventional camera module based on molding process, the photosensitive chip and the electronic components are usually mounted on the circuit board, then the molding base is formed on the circuit board by the molding process, and then the lens is mounted on the filter assembly after the optical filter is mounted on the lens holder, so that the lens is kept on the photosensitive path of the chip, as shown in fig. 42. However, the assembly method of the prior art has great limitation on the height of the camera module.

In detail, although the conventional lens holder is replaced by the mold base, the transverse size and height of the camera module can be reduced, in the molding process, the used mold needs to avoid electronic components such as capacitors and resistors on a circuit board (particularly, the size of the capacitor is large, and the height of the current minimum capacitor is 0.38mm), and a certain safety distance is reserved between the mold and various electronic components, so that the height of the mold base is at least larger than 0.4 mm; on the other hand, the optical filter is usually combined with a supporting member to form an optical filter assembly, and then the optical filter assembly is attached to the molding base, since the supporting member is usually made by an injection molding process, the thickness of the portion of the supporting member for supporting the optical filter is required to be substantially greater than 0.15mm, and the thickness of the optical filter itself is usually more than 0.21mm, so the thickness of the optical filter assembly is at least greater than 0.36 mm.

That is, the distance between the lens and the circuit board 31 is equal to the sum of the height of the mold base and the thickness of the optical filter assembly (at least greater than 0.76mm), and limited by all the above factors, the distance between the lens and the circuit board 31 of the camera module of the prior art cannot be further reduced, that is, the height of the camera module of the prior art cannot be further reduced, so that the market demand for the slimness and miniaturization of the camera module cannot be satisfied.

Accordingly, as shown in fig. 43, in this specific example, the mold base has a depressed step portion for mounting the color filter 331 thereon. That is, compared to the existing camera module based on the molding process, in this specific example, the top surface of the mold base is a non-flat surface having a depressed step portion. Accordingly, by mounting the color filter 331 on the recessed step of the mold base, the color filter support can be eliminated, and the distance between the color filter 331 and the circuit board 31 can be reduced, thereby achieving the effect of reducing the height of the module.

Specifically, as shown in fig. 43, in this specific example, the mold base has a stepped peripheral groove 350, wherein the color filter element 331 of the light transmission member 33 is provided to the stepped peripheral groove 350 of the mold base. In this way, the distance between the optical lens 332 and the circuit board 31 is no longer limited by the thickness of the color filter 331 itself, that is, the distance between the optical lens 332 and the circuit board 31 can be reduced to be smaller than the sum of the thickness of the color filter 331 and the height of the mold base to reduce the overall height dimension of the image pickup module 30.

FIG. 44 illustrates yet another implementation of the photo-sensing chip 32B according to the present invention. As shown in fig. 44, in this specific example, optimization is performed from the viewpoint of the structure of the photosensitive chip itself to reduce the overall height dimension of the image pickup module 30. In other words, in this embodiment, the camera module 30 can be implemented as the camera module and its modified implementation as described in any one of fig. 39 to 43.

Specifically, in this particular example, the camera module 30 employs a quantum dot thin film photo-sensor chip 32A instead of a conventional CMOS/CCD photo-sensor chip. Compared with the conventional CMOS/CCD photosensitive chip, the quantum dot thin film photosensitive chip 32B has the advantages of both planar size and height size.

First, the use of the quantum dot thin film photosensitive chip 32B enables the size of the photosensitive chip in the Z-axis direction to be reduced. As shown in fig. 44, the quantum dot thin film photosensitive chip 32B includes, from top to bottom, a color filter 321B, a top electrode 322B, a quantum dot thin film 323B, a bottom electrode 324B and a pixel circuit 325B, wherein the top electrode 322B, the quantum dot thin film 323B and the bottom electrode 324B constitute a photosensitive layer of the quantum dot thin film photosensitive chip 32B, the quantum dot thin film 323B electrically connects two electrodes, and a current and/or a voltage between the two electrodes is related to an intensity of light received by the quantum dot thin film 323B; the pixel circuit 325B includes charge storage and read circuitry. In particular, the color filter may be implemented as a Bayer filter or a Mono filter, which is not intended to limit the present application.

In operation, light passing through the color filter 321B impinges on the photosensitive layer, which under a given bias generates charge between the top and bottom electrodes, such that a voltage is accumulated in the charge storage during an integration period, and the pixel circuit 325B reads an electrical signal transmitted to the chip, which reflects the intensity of light absorbed by the photosensitive layer during the integration period, the electrical signal being the intensity of light generated by the light passing through the color filter 321B, and thus corresponds to the light passed by the color filter 321B, i.e., if the color filter 321B is red, indicating only red light is transmitted, the electrical signal generated by the photosensitive layer corresponding to the color filter 321B represents the intensity of red light in the light at that location.

Compared with the existing CMOS or CCD chip, the quantum dot thin film photosensitive chip 32B has a relatively small thickness dimension.

Fig. 45 illustrates yet another specific illustration of the photosensitive chip 32B of the camera module 30 according to the present invention, wherein the photosensitive chip 32B illustrated in fig. 45 is a modified implementation of the photosensitive chip illustrated in fig. 44.

Specifically, as shown in fig. 45, in this particular example, the quantum dot thin film 323B of the photosensitive layer is configured to respond to light of a selected color or group of colors, for example, a photoconductive material and a wavelength selective absorbing material (such as the material forming the array of color filters 321B) may be combined to form a color sensitive pixel to achieve sensitivity to the color. Accordingly, the quantum dot thin film 323B may be configured to be sensitive to three colors of red (R), green (G), and blue (B), respectively, so that the color filter 321B in the light sensing chip may be directly eliminated.

In the working process, when light passes through the color sensitive pixel, the color sensitive pixel can absorb the corresponding light, the light intensity of the light with the wavelength or the waveband is converted into an electric signal, the electric signal is transmitted to the chip through the pixel circuit 325B to be processed and imaged, and the rest light is continuously transmitted forwards without influencing the photoelectric conversion of the pixel point. Accordingly, the technical scheme can not only reduce the Z-direction size of the photosensitive chip, but also receive more light and image the photosensitive chip more clearly because the photosensitive chip does not filter the light by the color filter 321B.

Further, the adoption of the quantum dot thin film photosensitive chip 32B can enable the size of the photosensitive chip in the XY axis direction to be reduced. Specifically, since the quantum dot film 323B has a high light transmittance, after being configured as a material sensitive to a certain wavelength or wavelength band, the quantum dot film 323B may only absorb the corresponding light, and the other light may pass through the layer of film and continue to propagate forward, so that a plurality of quantum dot films 323B sensitive to a certain wavelength or wavelength band may be vertically arranged.

In other words, the light intensity information of multiple wavelengths or wavelength bands can be obtained at one pixel point position simultaneously. For example, three quantum dot films 323B of a red color sensitive pixel, a green color sensitive pixel and a blue color sensitive pixel are vertically arranged, when light passes through the red color sensitive pixel, red light is absorbed and converted into an electric signal, the rest of the light continues to propagate forward, after the light passes through the green color sensitive pixel, green light is absorbed and converted into an electric signal, the rest of the light continues to propagate forward, and after the light passes through the blue color sensitive pixel, blue light is also absorbed and converted into an electric signal. Therefore, the light intensity information of light with various wavelengths or wave bands can be obtained at the same time at the point of the size of one pixel point.

It should be noted that the three RGB colors described in this specific example of the application are not limited, and each quantum dot film 323B may absorb and convert any desired light, and only the quantum dot film 323B needs to be configured to be sensitive to the desired light.

Also, in this specific example, since the conventional color filter 321B is not used, not only can a stronger light intensity be obtained, but also a higher resolution can be obtained for a photosensitive chip of the same specification. In other words, under the same resolution, the method adopted by the present scheme can reduce the XY-direction size of the photosensitive chip, thereby further reducing the plane size of the image pickup module 30.

The quantum dot thin film 323B in the quantum dot thin film 323B chip according to the present invention may be prepared by the following process.

In one form, the quantum dot material may be processed by puddle casting to form the quantum dot film 323B. Puddle casting may include depositing the measured quantum dot material onto a substrate and allowing the solution to evaporate, the resulting film may or may not crack.

In one form, the quantum dot material may be processed by electrodeposition to form the quantum dot thin film 323B.

In one formation, the quantum dot thin film 323B may be formed by processing a quantum dot material through vapor deposition.

In one formation, the quantum dot thin film 323B may be formed by spray-treating a quantum dot material through a spray gun. Lance injection may include treatment from a gas. The lance injection may include entrainment in the solvent.

In one form, the quantum dot material may be processed by growth from solution to form the quantum dot thin film 323B. The growth of the film from solution may include cross-linking. A cross-linking agent may be attached to at least a portion of the substrate to cross-link the quantum dots. When the substrate with the attached cross-linker is immersed in the quantum dot solution, the quantum dots may become cross-linked and grow on the substrate at the locations where the cross-linker is attached, the process of growth may be similar to that of seed growth. Since growth occurs where the crosslinker has been attached, the formation of a patterned film on the substrate can be achieved by depositing the crosslinker along the patterned substrate.

In one form, the film may be formed by treating the quantum dot material with a hydrophobic system. The hydrophobic system may enable deposition of a single layer of the quantum dot thin film 323B of quantum dots, and the single layer of the quantum dot thin film 323B may be deposited in a pattern.

In one formation, the quantum dot thin film 323B may be formed by processing a quantum dot material by acceleration or evaporation in a gas phase.

In one formation, the quantum dot thin film 323B may be formed by processing a quantum dot material by a photolithography method.

In one formation, the quantum dot thin film 323B may be formed by processing a quantum dot material by an inkjet printing method.

In summary, the camera module 30 disposed below the display screen can adopt, but is not limited to, the above listed technical solutions and their modifications, so that the size of the camera module 30 in the height direction thereof is reduced to meet the requirement of thinning the smart phone.

A specific illustration of the photosensitive layer of the photosensitive chip 32B described above is shown with reference to fig. 46. The photosensitive layer includes the top electrode 322B, the quantum dot thin film 323B, and the bottom electrode 324B.

In this example, the top electrode 322B and the bottom electrode 324B of the photosensitive layer are disposed in a horizontal distribution, thereby reducing the influence on the propagation of light.

Specifically, the photosensitive layer further includes a nanocrystal film 326B and a substrate 327B, wherein the nanocrystal film 326B is located above the top electrode 322B and the bottom electrode 324B, the nanocrystal film 326B is a transparent material, and the substrate 327B is located at the lowest end of the photosensitive layer.

The top electrode 322B and the bottom electrode 324B are located between the nanocrystal film 326B and the substrate 327B, and at least a portion of the nanocrystal film 326B extends to the substrate 327B.

The entire photosensitive layer may be a laterally stacked structure, the top electrode 322B of the photosensitive layer is located between the nanocrystal film 326B and the substrate 327B, the bottom electrode 324B of the photosensitive layer is located between the nanocrystal film 326B and the substrate 327B, and the bottom electrode 324B and the top electrode 322B are supported on the substrate 327B, respectively. The top electrode 322B and the bottom electrode 324B do not overlap in the height direction. The top electrode 322B and the bottom electrode 324B are horizontally disposed between the nanocrystal film 326B and the substrate 327B. The substrate 327B may be a glass substrate 327B, the top electrode 322B may be a metal contact, and the bottom electrode 324B may be a metal contact.

The quantum dot thin film 323B covers the top of the substrate 327B and the bottom electrode 324B is located on top of the quantum dot thin film 323B.

A specific illustration of the photosensitive layer of the photosensitive chip 32B described above is shown with reference to fig. 47. The photosensitive layer includes the top electrode 322B, the quantum dot thin film 323B, and the bottom electrode 324B.

The top electrode 322B and the bottom electrode 324B at least partially overlap in a height direction.

In this example, the top electrode 322B is located on top of the photosensitive layer and the bottom electrode 324B is located below the top electrode 322B.

The photosensitive layer further includes a nanocrystal film 326B and a substrate 327B, wherein the nanocrystal film 326B is located between the top electrode 322B and the bottom electrode 324B, and the substrate 327B is located below the bottom electrode 324B.

The top electrode 322B is provided as a transparent material, thereby reducing the influence on the light passing through the top electrode 322B.

Further, the quantum dot thin film 323B is located between the substrate 327B and the bottom electrode 324B.

Referring to fig. 48A to 51C, a method for assembling the camera module 30 and the display panel 20 with the light hole 200 according to the present invention is illustrated. It is understood that the display screen 20 may also be provided with the light guide channel 500 and/or the light passing hole 200. Here, the light transmitting hole 200 penetrating in the height direction is exemplified.

The invention provides an assembling system 60, wherein the assembling system 60 comprises a clamping device 61, a testing unit 62 and a supporting platform 63, wherein the clamping device 61 is positioned above the supporting platform 63 and is used for clamping the camera module 30, and the display screen 20 is supported on the supporting platform 63.

The clamping device 61 can clamp the camera module 30 to drive the camera module 30 to move, so that the camera module 30 and the display screen 20 supported by the supporting platform 63 are in relative positions, the imaging effect of the camera module 30 is obtained by the testing unit 62 when the camera module 30 and the display screen 20 are in each position, and the mounting positions of the camera module 30 and the display screen 20 are determined.

The mounting system 60 further includes a loading unit 64, wherein after determining the relative positions of the camera module 30 and the display screen 20 based on the testing unit 62, the loading unit 64 can load the camera module 30 and/or the display screen 20 so that the camera module 30 and the display screen 20 can be fixed at a position determined to be suitable for mounting.

Further, the testing unit 62 includes a light source 621, a target 622, and a sensing device 623, wherein the light source 621 is disposed near a light incident position of the camera module 30, and the target 622 can be located in front of the light source 621, that is, the light source 621 is located between the target 622 and the camera module 30. The target 622 may also be located behind the light source 621, that is, the target 622 is located between the light source 621 and the camera module 30. The light source 621 may also be located on the target 622 to provide uniform light to the target 622.

The light source 621 emits light during operation, and the sensing device 623 adjusts a real-time working image about the target 622 obtained from the camera module 30 based on the working image to the position of the camera module 30 until the imaging effect of the camera module 30 reaches a desired level.

Specifically, the assembly method of the display screen 20 may be that, first, the distance from the camera module 30 to the display screen 20 is adjusted to an appropriate value, and then the optical axis of the camera module 30 and the center of the light-passing hole 200 of the display screen 20 are adjusted to coincide with each other. Wherein the latter adjustment may be:

when the camera module 30 is located at a position relative to the display screen 20, the sensing device 623 may sense the position of the camera module 30 and the display screen 20, particularly the overlapping condition of the optical axes, then calculate another relative adjustment amount (the adjustment amount of the camera module 30 relative to the display screen 20) based on one of the positions (for example, based on the display screen 20), and perform corresponding adjustment according to the adjustment amount, after the adjustment, calculate the optical axis condition of the camera module 30 and the display screen 20 again, if the detection result is in accordance with the expectation, assemble the module at the position, otherwise, continue the adjustment until the positions of the camera module 30 and the display screen 20 reach the optimal state, that is, the shooting of the camera module 30 has the optimal state, and meanwhile, the assembly of the camera module 30 and the display screen 20 does not affect the installation and work of other components. Of course, the adjustment of the position of the camera module 30 relative to the display screen 20 is also within the range of allowing the camera module 30 to be installed.

Further, in this example, the camera module 30 is located above the display screen 20, and the camera module 30 is located above the support platform 63. The light source 621 and the target 622 are located below the display screen 20. In other words, the display screen 20 is supported on the support platform 63 with its back side facing upward. The camera module 30 is mounted on the back side of the display screen 20 in a subsequent step.

The clamping device 61 and the feeding unit 64 operate above the supporting platform 63, so that the relative positions of the camera module 30 and the display screen 20 can be observed above the supporting platform 63 in time, and the operation is convenient, especially under the condition of manual operation. Of course, it will be understood by those skilled in the art that the assembly of the camera module 30 and the display screen 20 can be accomplished by a complete set of automated equipment.

In other embodiments of the present invention, the camera module 30 is located below the display screen 20, the light source 621 and the target 622 are located above the display screen 20, and the camera module 30 receives light from top to bottom to perform photoelectric conversion. At this time, if the relative positions of the camera module 30 and the display screen 20 need to be observed, the observation needs to be performed from the lower side of the supporting platform 63.

Further, preferably, the display screen 20 is located at a horizontal position, and based on the difference of the orientations of the back side of the display screen 20, the camera module 30 may be located above the display screen 20 or below the display screen 20.

It is of course understood that the display screen 20 may be in an inclined position, for example, the support platform 63 is inclined, and the position of the camera module 30 may be adjusted relative to the position of the display screen 20 by the clamping device 61. The display screen 20 may also be located at a vertical position, for example, the supporting platform 63 is located at a vertical position, and the camera module 30 and the display screen 20 are respectively adjusted at the vertical positions relatively.

Further, the supporting platform 63 has a mounting space 630, wherein the mounting space 630 is located on the supporting platform 63, and the display screen 20 can be fixedly received in the mounting space 630.

The support platform 63 has a test hole 6300, wherein the installation space 630 is communicated with the test hole 6300. When the display screen 20 is fixed in the installation space 630, the test hole 6300 is corresponding to the light-passing hole 200 of the display screen 20, so that light can enter the light-passing hole 200 of the display screen 20 through the test hole 6300 and then reach the camera module 30 through the light-passing hole 200.

The testing hole 6300 penetrates through the supporting platform 63, so that light rays on one side of the supporting platform 63 can reach the other side of the supporting platform 63 through the testing hole 6300.

The test hole 6300 may be configured to have a certain shape according to the requirement of the test, for example, in this example, the test hole 6300 is conical. The closer to the display screen 20, the smaller the inner diameter of the test hole 6300, and the farther from the display screen 20, the larger the inner diameter of the test hole 6300.

The test holes 6300 may function to collect light.

The supporting platform 63 includes a platform main body 631 and a fixing member 632, wherein the fixing member 632 is disposed on the platform main body 631, and the fixing member 632 is used for fixing the display screen 20.

In this example, the fixing member 632 is integrally formed with the platform main body 631, the installation space 630 is formed in the platform main body 631, and the fixing member 632 is provided to the platform main body 631 and received in the installation space 630.

The display screen 20 can be installed in the fixed component 632, with the assistance of the fixed component 632, the relative position of the display screen 20 and the platform main body 631 is fixed, so that the adjustment of the relative position of the display screen 20 and the camera module 30 can be realized only by the position of the camera module 30, and the camera module 30 can be found relative to the display screen 20 at a position with a better imaging effect.

In other embodiments of the present invention, the fixing assembly 632 is detachably mounted to the platform body 631. The size of the fixing member 632 may be adjusted to fit the size of the display screen 20. Say the mounting space 630 provides a 7 inch area, the fixing component 632 may provide about 6 inches for mounting the display screen 20, and if it is required to assemble the display screen 20 with 5 inches, the fixing component 632 may be replaced with the fixing component 632 capable of providing about 5 inches to adapt to the adjustment of the size of the display screen 20.

Further, in other embodiments of the present invention, the clamping device 61 clamps the camera module 30 and the display screen 20, and then searches for a suitable assembly position by changing the relative positions of the camera module 30 and the display screen 20.

In other embodiments of the present invention, the supporting platform 63 supports the camera module 30, the clamping device 61 clamps the display screen 20, and then the clamping device 61 drives the display screen 20 to move so as to change the position of the display screen 20, so that on the premise of keeping the camera module 30 fixed, the relative position of the camera module 30 and the display screen 20 is changed until a satisfactory imaging effect is obtained.

Further, in this example, the mounting system 60 includes a position limiting mechanism 65, wherein the position limiting mechanism 65 is disposed on the display screen 20 and is located near the position of the light passing hole 200 of the display screen 20.

The limiting mechanism 65 is used for limiting the position of the camera module 30 so as to improve the alignment precision of the camera module 30 and the display screen 20.

Specifically, when the relative position of the camera module 30 and the display screen 20 is changed to test the imaging effect, the limiting mechanism 65 can limit the position change of the camera module 30, so that the position adjustment of the camera module 30 is controlled within a certain range, and the single-time position adjustment amplitude of the camera module 30 is avoided being too large, thereby being beneficial to improving the alignment accuracy of the camera module 30 and the display screen 20.

The limiting mechanism 65 is disposed on the back side of the display screen 20 and aligned with the light-passing hole 200 of the display screen 20, so that the camera module 30 can be aligned with the light-passing hole 200 of the display screen 20 after the camera module 30 is mounted on the limiting mechanism 65.

Then, the camera module 30 is mounted on the limiting mechanism 65. The camera module 30 mounted on the limiting mechanism 65 is aligned with the light-passing hole 200 of the display screen 20 and the relative positions of the camera module 30 and the limiting mechanism 65 can be finely adjusted.

Then, the image formed by the camera module 30 is obtained through the testing equipment, and the camera module 30 and the limiting mechanism 65 are adjusted based on the imaging effect of the camera module 30, so that the relative position of the camera module 30 and the display screen 20 is changed. The adjustment space provided by the limiting mechanism 65 is limited, and the relative position adjustment of the camera module 30 and the display screen 20 can only be adjusted within a small range, so that the position of the camera module 30 cannot be greatly deviated in the adjustment process, and the alignment accuracy of the camera module 30 and the display screen 20 can be improved.

After determining the relative position between the camera module 30 and the display screen 20 based on the imaging effect of the camera module 30, the relative position between the camera module 30 and the limiting mechanism 65 is fixed, so that the relative position between the camera module 30 and the display screen 20 is fixed. The camera module 30 is assembled to the display screen 20, and the camera module 30 can obtain enough light through the light-passing hole 200 of the display screen 20 and obtain a desired imaging effect.

Further, in other embodiments of the present invention, the limiting mechanism 65 is disposed on the camera module 30. Specifically, the limiting mechanism 65 and the camera module 30 are first mounted to each other, and then the limiting mechanism 65 is fixed to the display screen 20, so that the camera module 30 located on the limiting mechanism 65 can correspond to the light-passing hole 200 of the display screen 20.

The limiting mechanism 65 provides a certain adjustment space for the camera module 30 mounted on the limiting mechanism 65.

After the limiting mechanism 65 is installed on the display screen 20, the relative position between the camera module 30 and the limiting mechanism 65 can be adjusted based on the imaging effect of the camera module 30, so as to confirm the relative position between the camera module 30 and the display screen 20.

It should be noted that when the limiting mechanism 65 is installed on the display screen 20, the camera module 30 is already installed on the limiting mechanism 65, so that the relative position between the limiting mechanism 65 and the display screen can be determined based on the imaging effect of the camera module 30, and then the limiting mechanism 65 is positioned on the display screen 20. The fixing means between the limiting mechanism 65 and the display screen 20 can be gluing or welding.

In other words, the limiting mechanism 65 can be installed on the camera module 30 or the display screen 20 before the camera module 30 is installed on the display screen 20. Then, the relative position of the camera module 30 and the limiting mechanism 65 is adjusted within the available adjusting range of the limiting mechanism 65 based on the imaging effect of the camera module 30, so that the relative position of the camera module 30 and the display screen 20 is adjusted.

Further, the limiting mechanism 65 has a limiting channel 650, and the lens assembly of the camera module 30 can be at least partially accommodated in the limiting channel 650.

When the position limiting mechanism 65 is located on the display screen 20, the position limiting channel 650 of the position limiting mechanism 65 is aligned with the light through hole 200 of the display screen 20.

The limiting mechanism 65 and the camera module 30 cooperate with each other so that when the camera module 30 is mounted on the limiting mechanism 65, the limiting mechanism 65 can limit the camera module 30, and meanwhile, the camera module 30 can be adjusted within a certain range through the limiting channel 650 provided by the limiting mechanism 65 to change the relative positions of the camera module 30 and the display screen 20.

Specifically, the spacing mechanism 65 may include a sleeve 651 and a spacing assembly 652, wherein the sleeve 651 surrounds the spacing channel 650. The position-limiting assembly 652 includes a first position-limiting member 6521 and a second position-limiting member 6522, wherein the first position-limiting member 6521 is disposed on an inner wall of the sleeve 651, and the second position-limiting member 6522 is disposed on an outer wall of the lens assembly of the camera module 30.

When the camera module 30 is mounted on the limiting mechanism 65, the first limiting member 6521 and the second limiting member 6522 are relatively engaged to limit the position of the camera module 30.

The first limiting member 6521 may be a directional groove, and the second limiting member 6522 may be a protrusion, and when the camera module 30 is mounted on the limiting mechanism 65, the second limiting member 6522 extends into the first limiting member 6521.

The first limiting member 6521 may be a protrusion, and the second limiting member 6522 may be a groove, and when the camera module 30 is mounted on the limiting mechanism 65, the first limiting member 6521 extends into the second limiting member 6522.

It should be noted that, when the camera module 30 is installed in the limiting mechanism 65, the first limiting member 6521 and the second limiting member 6522 are not completely fixed and engaged, and a certain moving space is still left between the first limiting member 6521 and the second limiting member 6522, so that the position of the camera module 30 relative to the sleeve 651 can be further adjusted while being limited by the limiting assembly 652.

Further, the inner wall of the sleeve 651 may be provided with a screw structure, and the outer wall of the upper portion of the camera module 30, i.e., the outer wall of the lens barrel of the lens assembly, may be at least partially provided with a screw structure.

When the camera module 30 is mounted on the limiting mechanism 65, not only the relative positions of the camera module 30 and the limiting mechanism 65, especially the axial center of the camera module 30 and the center of the light-passing hole 200 of the display screen 20, but also the distance between the camera module 30 and the display screen 20 can be adjusted.

It is understood that, if the limiting mechanism 65 needs to be installed on the display screen 20, the distance between the camera module 30 and the display screen 20 can be adjusted by controlling the distance between the limiting mechanism 65 and the display screen 20 during the process of installing the limiting mechanism 65 on the display screen 20.

Preferably, the center of the sleeve 651 of the position limiting mechanism 65 is aligned with the center of the light passing hole 200 of the display screen 20. Further, preferably, the center of the sleeve 651 of the limiting mechanism 65 is aligned with the center of the testing hole 6300 of the testing platform 63.

Referring to fig. 51A-51C, an embodiment of the spacing mechanism 65 according to the present invention is illustrated. In this example, the limiting mechanism 65 needs to be mounted to the display screen 20. That is, the limiting mechanism 65 and the display 20 are independent from each other.

The assembling method of the camera module 30 includes the steps of: the mounting the limiting mechanism 65 in the display screen 20, the mounting the camera module 30 in the limiting mechanism 65, for the limiting mechanism 65 adjusts the position of the camera module 30 to achieve the purpose of adjusting the position of the camera module 30 relative to the display screen 20, the relative position of the camera module 30 and the display screen 20 is confirmed based on the imaging effect of the camera module 30, and the camera module 30 and the display screen 20 are fixed in the adjusted positions by fixing the camera module 30 in the limiting mechanism 65.

It is noted that the position limiting mechanism 65 can be mounted to the display screen 20 by aligning the position limiting mechanism 65 with the light passing hole 200 of the display screen 20.

It is understood that during the process of mounting the position limiting mechanism 65 on the display screen 20, the position limiting mechanism 65 can be fixed on the display screen 20 based on the alignment degree of the position limiting channel 650 of the position limiting mechanism 65 and the light passing hole 200 of the display screen 20. In this way, in the subsequent adjustment process, the adjustment of the relative position between the camera module 30 and the display screen 20 only needs to adjust the relative position between the camera module 30 and the limiting mechanism 65.

The assembly method of the camera module 30 may also be implemented as the following steps: the installation the module of making a video recording 30 in stop gear 65, the installation stop gear 65 in display screen 20, it is relative stop gear 65 adjusts thereby the position of the module of making a video recording 30 reaches the adjustment the module of making a video recording 30 for the purpose of the position of display screen 20, with the imaging effect of the module of making a video recording 30 confirms as the basis the module of making a video recording 30 with the relative position of display screen 20, through fixed the module of making a video recording 30 in stop gear 65's mode is fixed the module of making a video recording 30 with in the position after the adjustment of display screen 20.

It can be understood that, in the process of installing the position-limiting mechanism 65 on the display screen 20, the position-limiting mechanism 65 can be installed on the display screen 20 based on the imaging effect of the camera module 30.

The assembly method of the camera module 30 may also be implemented as the following steps: adjusting the relative position of the camera module 30 and the display screen 20 to a satisfactory position, wherein the limiting mechanism 65 is installed on the display screen 20, and then adjusting the relative position of the camera module 30 and the limiting mechanism 65 within the adjusting range of the limiting mechanism 65 for the camera module 30, thereby adjusting the relative position of the camera module 30 and the display screen 20.

It can be understood that, after the camera module 30 is mounted on the limiting mechanism 65, the limiting mechanism 65 can be fixed on the display screen 20, so that the camera module 30 can be adjusted in a relatively small range through the limiting mechanism 65, and the adjustment accuracy of the camera module 30 and the limiting mechanism 65 can be improved. After the camera module 30 is mounted on the limiting mechanism 65, the limiting mechanism 65 is not temporarily fixed to the display screen 20, the relative position between the camera module 30 and the display screen 20 is continuously changed to obtain a satisfactory imaging effect, and then the limiting mechanism 65 is fixed to the display screen 20.

Further, in this example, the back side of the display screen 20 is implemented as a planar structure, that is, the back plate of the display screen 20 is a planar structure, and the position limiting mechanism 65 is mounted on the back plate of the display screen 20. When the relative position between the position-limiting mechanism 65 and the display screen 20 needs to be adjusted, the position-limiting mechanism 65 freely adjusts the position on the display screen 20 until the position-limiting channel 650 of the position-limiting mechanism 65 is aligned with the light-passing hole 200 of the display screen 20, or the camera module 30 mounted on the position-limiting mechanism 65 obtains a desired imaging effect.

It is understood that the relative position between the camera module 30 and the display screen 20 can also be directly adjusted, and when the relative position between the camera module 30 and the display screen 20 is determined, the camera module 30 can be directly fixed to the display screen 20 by gluing or welding, and the positions of the camera module 30 and the display screen 20 are kept at the adjusted position.

Furthermore, after the relative position between the limiting mechanism 65 and the camera module 30 is confirmed based on the imaging effect of the camera module 30, the limiting mechanism 65 and the camera module 30 may be fixed by gluing or welding.

For example, when the camera module 30 is mounted on the limiting mechanism 65, when the relative positions of the camera module 30 and the limiting mechanism 65 are adjusted, the limiting channel 650 of the limiting mechanism 65 has a gap for fine adjustment between the camera module 30 and the limiting mechanism 65.

When the relative position between the camera module 30 and the limiting mechanism 65 is confirmed, the space of the limiting channel 650 of the limiting mechanism 65 not occupied by the camera module 30 can be filled with glue to fix the relative position between the camera module 30 and the limiting mechanism 65.

When the relative position between the camera module 30 and the limiting mechanism 65 is confirmed, an insert sheet can be inserted between the camera module 30 and the sleeve 651 of the limiting mechanism 65 to fix the relative position between the camera module 30 and the limiting mechanism 65. The insert sheet limits the displacement of the camera module 30 relative to the limiting mechanism 65.

When the relative position between the camera module 30 and the limiting mechanism 65 is determined, a pad may be disposed on the outer side of the lens barrel of the camera module 30 or on the inner wall of the sleeve 651 of the limiting mechanism 65, and then the camera module 30 and the limiting mechanism 65 are fixed by welding.

It is understood that the colloid for fixing the camera module 30 and the limiting mechanism 65 may be a thermoplastic fluid, and the thermoplastic fluid of the camera module 30 and the limiting mechanism 65 may be solidified by heating after the thermoplastic fluid fills the gap between the camera module 30 and the limiting mechanism 65.

Further, the sleeve 651 of the limiting mechanism 65 is made of opaque material, so as to reduce the influence of external light on the camera module 30 located in the limiting channel 650 of the limiting mechanism 65. Especially, when the display screen 20 is an LCD display screen 20, the back plate layer 27 can actively emit light, and the light-tight limiting mechanism 65 can reduce the influence of the light-emitting back plate layer 27 on the camera module 30.

Referring to fig. 52, a specific embodiment of the spacing mechanism 65 according to the present invention is illustrated. In this example, the limiting mechanism 65 further includes a connecting portion 653, where the connecting portion 653 is used to connect the sleeve 651 to the display screen 20.

Specifically, the sleeve 651 has a free end 6511 and a connecting end 6512, wherein the free end 6511 and the connecting end 6512 are located at opposite ends, respectively, and the connecting portion 653 is located at the connecting end 6512 of the sleeve 651.

The connecting portion 653 may be configured to extend outwardly from the connecting end 6512 of the sleeve 651. When the limiting mechanism 65 and the display screen 20 are mounted, the connecting portion 653 of the limiting mechanism 65 can be connected to the display screen 20. Meanwhile, the connection portion 653 allows the limiting mechanism 65 to be connected to the display screen 20 in an increased area size, so as to facilitate the stable connection between the limiting mechanism 65 and the display screen 20, and thus facilitate the camera module 30 to be stably installed on the display screen 20 through the limiting mechanism 65.

Referring to fig. 53, a specific embodiment of the spacing mechanism 65 according to the present invention is illustrated. In this example, the relative positions of the limiting mechanism 65 and the display screen 20 are fixed in advance, and only the relative positions of the camera module 30 and the limiting mechanism 65 need to be adjusted.

The position limiting mechanism 65 is combined with the display screen 20, so that the combination strength of the position limiting mechanism 65 and the display screen 20 is enhanced.

In this example, the stopper mechanism 65 is fitted to the display screen 20.

For example, when the display screen 20 is an OLED display screen 20, the display screen 20 includes the cover plate layer 21, the touch layer 22, the polarization layer 23, the encapsulation layer 24, the pixel layer 25, the driving circuit layer 26, and the back plate layer 27, and reference may be made to the foregoing drawings. The back side of the display panel 20 is a planar structure, that is, the back plate layer 27 is a planar structure, and the display panel 20 has the light passing hole 200 penetrating at least a part of the display panel, for example, the light passing hole 200 penetrates through other layers except the cover plate layer 21 in the height direction. Of course, the light hole 200 may also extend completely through the layers of the display 20 in the height direction.

At least a part of the stopper mechanism 65 is fitted to the drive circuit layer 26 and the back plate layer 27.

The position limiting mechanism 65 further comprises at least one connecting pin 654, wherein the connecting pin 654 extends from the connecting end 6512 of the sleeve 651 along the length direction of the sleeve 651. Preferably, the number of the connecting pins 654 may be plural.

The display screen 20 has at least one engaging channel 203, wherein the engaging channel 203 is located around the light-passing hole 200 of the display screen 20, and the engaging channel 203 is matched with the connecting pin 654 of the limiting mechanism 65.

The fitting passage 203 extends from the back plate layer 27 to the driving circuit layer 26. Preferably, the fitting channel 203 is configured to avoid the circuit structure of the driving circuit layer 26, so as to reduce the influence on the working efficiency of the display screen 20.

When the position-limiting mechanism 65 is mounted on the display screen 20, the connecting pin 654 of the position-limiting mechanism 65 extends into the engaging channel 203 of the display screen 20. The connecting leg 654 may be fitted into the fitting passage 203. The engaging channel 203 may be slightly larger than the connecting pin 654, and after the connecting pin 654 extends into the engaging channel 203, a gap is left in the engaging channel 203, so that glue may be filled into the gap, so that the connecting pin 654 of the position-limiting mechanism 65 can be fixed to the engaging channel 203 of the display 20, thereby facilitating the position-limiting mechanism 65 to be stably mounted on the display 20.

Further, the fitting channel 203 may be formed on the back plate layer 27 and the driving circuit layer 26 of the display panel 20 by means of an opening. For example, from the backplate layer 27 of the display screen 20 towards the driver circuitry layer 26.

It should be understood by those skilled in the art that the formation manner of the fitting channel 203 or the position of the fitting channel 203 is not limited to the above examples.

Further, according to other embodiments of the present invention, the engaging channel 203 may be formed on the sleeve 651, and the connecting leg 654 may be formed on the display 20.

When the position limiting mechanism 65 is mounted on the display screen 20, the connecting leg 654 of the display screen 20 extends into the engaging channel 203 of the sleeve 651, thereby facilitating the fixation between the position limiting mechanism 65 and the display screen 20.

The connecting pins 654 can be formed on the display panel 20 by deposition, evaporation, or the like. The connecting pins 654 may be integrally formed with the display screen 20.

Further, according to other embodiments of the present invention, the fitting channel 203 may be formed in the sleeve 651 and the display screen 20, respectively, and the connecting leg 654 may be fitted in the sleeve 651 and the display screen 20, respectively. For example, one end of the connecting leg 654 extends into the engaging channel 203 of the display screen 20, and then the other end of the connecting leg 654 extends into the engaging channel 203 of the sleeve 651, thereby respectively fixing the connecting leg 654 and the display screen 20 and the connecting leg 654 and the sleeve 651, and thus fixing the sleeve 651 to the display screen 20.

Referring to fig. 54, another embodiment of the spacing mechanism 65 according to the present invention is illustrated.

In this example, the display screen 20 has a mounting channel 201, wherein the mounting channel 201 is penetrated through the light passing hole 200. The light passing hole 200 passes through the layers of the display panel 20 except the cover sheet layer 21 in the height direction, and the mounting passage 201 is exposed to the back side of the display panel 20.

The inner diameter of the installation channel 201 is larger than that of the light passing hole 200. At least a portion of the spacing mechanism 65 can be received in the mounting channel 201.

For example, the mounting channel 201 is formed in the back plate layer 27 of the display screen 20.

The mounting channel 201 penetrates the back plate layer 27 and the inner diameter of the mounting channel 201 is larger than that of the light passing hole 200. The mounting passage 201 penetrates the light passing hole 200 of the back plate layer 27 in the height direction. Light from the outside of the display screen 20 passes through the light-passing hole 200 and the installation channel 201, and is then received by the camera module 30.

The mounting channel 201 is sized and the spacing mechanism 65 is sized. The mounting channel 201 is sized larger than the size of the spacing mechanism 65 such that at least a portion of the spacing mechanism 65 can be received in the mounting channel 201.

In this example, the limiting mechanism 65 needs to be mounted to the display screen 20. That is, the limiting mechanism 65 and the display 20 are independent from each other.

The assembling method of the camera module 30 includes the steps of: the installation stop gear 65 in the display screen 20 the installation passageway 201, the installation the module 30 of making a video recording in stop gear 65, for stop gear 65 adjustment the position of the module 30 of making a video recording thereby reaches the adjustment the module 30 of making a video recording for the purpose of the position of display screen 20, with the imaging effect of the module 30 of making a video recording confirms as the basis the module 30 of making a video recording 30 with the relative position of display screen 20, through fixed the module 30 of making a video recording in stop gear 65 mode is fixed the module 30 of making a video recording 30 with in the position after the adjustment of display screen 20.

The size control of the installation channel 201 of the display screen 20 can play a certain limiting role for the limiting mechanism 65, so as to be beneficial to providing the positioning accuracy of the limiting mechanism 65 and the display screen 20.

It is understood that during the process of mounting the position limiting mechanism 65 on the mounting channel 201 of the display screen 20, the position limiting mechanism 65 can be fixed to the display screen 20 based on the alignment degree of the position limiting channel 650 of the position limiting mechanism 65 and the light passing hole 200 of the display screen 20. In this way, in the subsequent adjustment process, the adjustment of the relative position between the camera module 30 and the display screen 20 only needs to adjust the relative position between the camera module 30 and the limiting mechanism 65.

The assembly method of the camera module 30 may also be implemented as the following steps: the installation the module of making a video recording 30 in stop gear 65, the installation stop gear 65 in the display screen 20 the installation passageway 201, it is relative stop gear 65 adjustment thereby the position of the module of making a video recording 30 reaches the adjustment the module of making a video recording 30 for the purpose of the position of display screen 20, with the imaging effect of the module of making a video recording 30 confirms as the basis the module of making a video recording 30 with the relative position of display screen 20, through fixing the module of making a video recording 30 in stop gear 65's mode is fixed the module of making a video recording 30 with in the position after the adjustment of display screen 20.

The assembly method of the camera module 30 may also be implemented as the following steps: adjusting the relative position of the camera module 30 and the display screen 20 to a satisfactory position, installing the camera module 30 on the limiting mechanism 65 so that the camera module 30 can be fixed at the position, wherein the limiting mechanism 65 is installed on the installation channel 201 of the display screen 20, and then adjusting the relative position of the camera module 30 and the limiting mechanism 65 within the adjustment range of the limiting mechanism 65 for the camera module 30, thereby adjusting the relative position of the camera module 30 and the display screen 20.

It can be understood that, after the camera module 30 is mounted on the limiting mechanism 65, the limiting mechanism 65 can be fixed on the display screen 20, so that the camera module 30 can be adjusted in a relatively small range through the limiting mechanism 65, and the adjustment accuracy of the camera module 30 and the limiting mechanism 65 can be improved. After the camera module 30 is mounted on the limiting mechanism 65, the camera module 30 is not temporarily fixed to the limiting mechanism 65 on the display screen 20, the relative position between the camera module 30 and the display screen 20 is continuously changed to obtain a satisfactory imaging effect, and then the limiting mechanism 65 is fixed to the display screen 20.

Further, in this example, the back side of the display screen 20 is implemented as a planar structure, that is, the driving circuit layer 26 of the display screen 20 is a planar structure, and the position limiting mechanism 65 is mounted on the driving circuit layer 26 of the display screen 20. When the relative position between the limiting mechanism 65 and the display screen 20 needs to be adjusted, the adjustment of the position of the limiting mechanism 65 on the display screen 20 is limited by the installation channel 201 of the display screen 20.

The position limiting mechanism 65 may be fixed to the driving circuit layer 26 by gluing or welding.

Referring now to fig. 55, one embodiment of the spacing mechanism 65 according to the present invention is illustrated. In this example, the limiting mechanism 65 further includes a connecting portion 653, where the connecting portion 653 is used to connect the sleeve 651 to the display screen 20.

More specifically, taking the case where the mounting passage 201 is formed in the back plate layer 27 as an example, at least the driving circuit layer 26 is exposed to the outside. The connecting portion 653 of the position limiting mechanism 65 extends horizontally along the surface of the driving circuit layer 26, and the position limiting mechanism 65 and the display screen 20 can be fixed by fixing the connecting portion 653 and the driving circuit layer 26 of the display screen 20.

The mounting channel 201 may be designed slightly larger to accommodate the connection 653.

It is worth mentioning that, in this way, the height size of the display screen 20 and the camera module 30 can be reduced, so as to facilitate reducing the thickness size of the terminal device.

Referring to fig. 56, a specific embodiment of the limiting mechanism 65 according to the present invention is illustrated. In this example, the relative positions of the limiting mechanism 65 and the display screen 20 are fixed in advance, and only the relative positions of the camera module 30 and the limiting mechanism 65 need to be adjusted.

In this example, the display screen 20 has a mounting channel 201, wherein the mounting channel 201 is penetrated through the light passing hole 200. The light passing hole 200 passes through each layer of the display panel 20 in a height direction, and the mounting passage 201 is exposed to a back side of the display panel 20.

In this example, the stopper mechanism 65 is fitted to the display screen 20.

For example, when the display screen 20 is an OLED display screen 20, the display screen 20 includes the cover plate layer 21, the touch layer 22, the polarization layer 23, the encapsulation layer 24, the pixel layer 25, the driving circuit layer 26, and the back plate layer 27. For example, the mounting channel 201 is formed in the back plate layer 27, and at least a portion of the driving circuit layer 26 is exposed to the mounting channel 201.

At least part of the limiting mechanism 65 passes through the installation channel 201 and is embedded in the driving circuit layer 26.

The fitting channel 203 extends from the driving circuit layer 26. Preferably, the fitting channel 203 is configured to avoid the circuit structure of the driving circuit layer 26, so as to reduce the influence on the working efficiency of the display screen 20.

Of course, it will be understood by those skilled in the art that the engaging channel 203 may extend from the driving circuit layer 26 to other layers of the display panel 20.

Further, when the mounting channel 201 of the display screen 20 is slightly larger than the sleeve 651 of the limiting mechanism 65, the limiting mechanism 65 may be fixed to the portion of the display screen 20 corresponding to the mounting channel 201, for example, the back plate layer 27, by filling glue into the mounting channel 201, or by mounting an inserting sheet or by welding. In this way, the combination of the limiting mechanism 65 and the display screen 20 can be firmer, so as to facilitate the firm combination between the limiting mechanism 65 and the camera module 30.

Further, the fitting channel 203 may be formed on the driving circuit layer 26 of the display panel 20 by opening. For example, holes are drilled into the driving circuit layer 26 of the display screen 20 in the mounting channels 201. The fitting channel 203 may be formed by etching.

The connecting pins 654 can be formed on the display panel 20 by deposition, evaporation, or the like. The connecting pins 654 may be integrally formed with the display screen 20. The connection pins 654 may be formed at portions of the driving circuit layer 26 of the display screen 20 exposed to the mounting channels 201.

Referring to fig. 57, another embodiment of the spacing mechanism 65 according to the present invention is illustrated.

The mobile terminal comprises a substrate 70, wherein the substrate 70 is used for installing the camera module 30, and the camera module 30 is located between the substrate 70 and the display screen 20.

The position between the substrate 70 and the display 20 can be relatively fixed, for example, by the housing 40 of the mobile terminal. The substrate 70 may be mounted to the mobile terminal after the camera module 30 is mounted to the mobile terminal, and then the housing 40 is mounted to the mobile terminal, and the mobile terminal may provide a sufficient operating space when the camera module 30 is mounted.

The limiting mechanism 65 is located on the substrate 70, so that the relative displacement between the camera module 30 and the display screen 20 is limited by limiting the relative displacement between the camera module 30 and the substrate 70.

In this example, the limiting mechanism 65 needs to be mounted to the display screen 20. That is, the stopper mechanism 65 and the base plate 70 are originally independent of each other.

The assembling method of the camera module 30 includes the steps of: the limiting mechanism 65 is mounted on the substrate 70, the camera module 30 is mounted on the limiting mechanism 65, the position of the camera module 30 is adjusted relative to the limiting mechanism 65, so that the purpose of adjusting the position of the camera module 30 relative to the display screen 20 is achieved, the relative position of the camera module 30 and the display screen 20 is confirmed based on the imaging effect of the camera module 30, and the camera module 30 is fixed on the adjusted position of the display screen 20 in a mode of fixing the camera module 30 on the limiting mechanism 65. It is understood that, during the process of mounting the position limiting mechanism 65 on the substrate 70, the position limiting mechanism 65 can be fixed on the substrate 70 based on the alignment degree of the position limiting channel 650 of the position limiting mechanism 65 and the light passing hole 200 of the display screen 20. That is, the mounting position of the position limiting mechanism 65 on the substrate 70 is determined according to the alignment state of the position limiting channel 650 of the position limiting mechanism 65 and the light passing hole 200 of the display screen 20. In this way, in the subsequent adjustment process, the adjustment of the relative position between the camera module 30 and the display screen 20 only needs to adjust the relative position between the camera module 30 and the limiting mechanism 65.

The assembly method of the camera module 30 may also be implemented as the following steps: the camera module 30 is mounted on the limiting mechanism 65, the limiting mechanism 65 is mounted on the substrate 70, the position of the camera module 30 is adjusted relative to the limiting mechanism 65, so that the purpose of adjusting the position of the camera module 30 relative to the display screen 20 is achieved, the relative position of the camera module 30 and the display screen 20 is confirmed based on the imaging effect of the camera module 30, and the camera module 30 and the display screen 20 are fixed at the adjusted positions in a mode of fixing the camera module 30 to the limiting mechanism 65.

It can be understood that, in the process of mounting the limiting mechanism 65 on the substrate 70, the limiting mechanism 65 can be mounted on the substrate 70 based on the imaging effect of the camera module 30.

The assembly method of the camera module 30 may also be implemented as the following steps: adjusting the relative position between the camera module 30 and the display screen 20 to a satisfactory position, installing the camera module 30 on the limiting mechanism 65 to fix the camera module 30 at the position, wherein the limiting mechanism 65 is installed on the substrate 70, and then adjusting the relative position between the camera module 30 and the limiting mechanism 65 within the adjustment range of the limiting mechanism 65 for the camera module 30, thereby adjusting the relative position between the camera module 30 and the display screen 20.

It can be understood that after the camera module 30 is mounted on the limiting mechanism 65, the limiting mechanism 65 can be fixed on the substrate 70, so that the camera module 30 can be adjusted in a relatively small range through the limiting mechanism 65, thereby improving the adjustment accuracy of the camera module 30 and the limiting mechanism 65. After the camera module 30 is mounted on the limiting mechanism 65, the camera module 30 is temporarily not fixed to the limiting mechanism 65 on the substrate 70, the relative position between the camera module 30 and the display screen 20 is continuously changed to obtain a satisfactory imaging effect, and then the limiting mechanism 65 is fixed to the substrate 70.

Further, in this example, one side of the base plate 70 is implemented as a planar structure, and the stopper mechanism 65 is mounted to the one side of the base plate 70. When the relative position between the position-limiting mechanism 65 and the display screen 20 needs to be adjusted, the position-limiting mechanism 65 is freely adjusted on the substrate 70 until the position-limiting channel 650 of the position-limiting mechanism 65 is aligned with the light-passing hole 200 of the display screen 20, or the camera module 30 mounted on the position-limiting mechanism 65 obtains a desired imaging effect.

Further, the sleeve 651 of the limiting mechanism 65 is made of opaque material, so as to reduce the influence of external light on the camera module 30 located in the limiting channel 650 of the limiting mechanism 65. Especially when the display screen 20 is the LCD display screen 20, the back plate layer can actively emit light, and the lightproof limiting mechanism 65 can reduce the influence of the back plate layer on the camera module 30.

It should be noted that the camera module 30 has a high end and a low end, when the limiting mechanism 65 is located on the display screen 20, the high end of the camera module 30 is installed on the limiting mechanism 65, the high end of the camera module 30 is a light incident position of the camera module 30, and the low end of the camera module 30 is a light sensing position of the camera module 30. When the position limiting mechanism 65 is located on the substrate 70, the bottom end of the camera module 30 is mounted on the position limiting mechanism 65.

In this embodiment, the lower end of the camera module 30 is mounted on the limiting mechanism 65, and when the relative position between the camera module 30 and the limiting mechanism 65 is determined, that is, the relative position between the camera module 30 and the display screen 20 is determined, the higher end of the camera module 30 can be mounted on the display screen 20.

Referring to fig. 58, a specific embodiment of the spacing mechanism 65 according to the present invention is illustrated. In this example, the limiting mechanism 65 further includes a connecting portion 653, and the connecting portion 653 is used for connecting the sleeve 651 to the base plate 70.

The connecting portion 653 may be configured to extend outwardly from the connecting end 6512 of the sleeve 651. When the stopper mechanism 65 and the substrate 70 are mounted, the connection part 653 of the stopper mechanism 65 can be connected to the substrate 70. Meanwhile, the connection part 653 increases the area of the limiting mechanism 65 that can be connected to the substrate 70, so as to facilitate the stable connection between the limiting mechanism 65 and the substrate 70, and thus facilitate the stable installation of the camera module 30 on the display screen 20 through the limiting mechanism 65.

Referring to fig. 59, one embodiment of the spacing mechanism 65 according to the present invention is illustrated. In this example, the relative positions of the limiting mechanism 65 and the substrate 70 are fixed in advance, and only the relative positions of the image pickup module 30 and the limiting mechanism 65 need to be adjusted.

The limiting mechanism 65 is combined with the substrate 70 to facilitate enhancing the combination strength of the limiting mechanism 65 and the substrate 70.

In this example, the stopper mechanism 65 is fitted to the substrate 70.

The position-limiting mechanism 65 further includes at least one connecting pin 654, wherein the connecting pin 654 extends from the connecting end 6512 of the sleeve 651 along the height direction of the sleeve 651. Preferably, the number of the connecting pins 654 may be plural.

The substrate 70 has at least one engaging channel 203, wherein the engaging channel 203 is located around the light-passing hole 200 of the display panel 20, and the engaging channel 203 is matched with the connecting pin 654 of the limiting mechanism 65.

Preferably, the fitting channel 203 is disposed to avoid the circuit structure of the substrate 70, so as to reduce the influence on the working efficiency of the substrate 70.

When the position-limiting mechanism 65 is mounted on the substrate 70, the connecting leg 654 of the position-limiting mechanism 65 extends into the engaging channel 203 of the substrate 70. The connecting leg 654 may be fitted into the fitting passage 203. The engaging channel 203 may be slightly larger than the connecting leg 654, and when the connecting leg 654 extends into the engaging channel 203, the engaging channel 203 may still have a gap, so that glue may be filled into the gap, so that the connecting leg 654 of the position-limiting mechanism 65 can be fixed to the engaging channel 203 of the substrate 70, thereby facilitating the position-limiting mechanism 65 to be stably mounted on the substrate 70.

Further, the fitting passage 203 may be formed in the substrate 70 by opening a hole. For example, drilled inward from the surface of the substrate 70.

Further, according to other embodiments of the present invention, the fitting channel 203 may be formed on the sleeve 651, and the connecting leg 654 may be formed on the base plate 70.

When the position limiting mechanism 65 is mounted on the base plate 70, the connecting leg 654 of the base plate 70 extends into the engaging channel 203 of the sleeve 651, thereby facilitating the fixation between the position limiting mechanism 65 and the base plate 70.

The connection pins 654 may be formed on the substrate 70 by deposition, evaporation, or the like. The connecting pins 654 may be integrally formed with the substrate 70.

Further, according to other embodiments of the present invention, the fitting passage 203 may be formed in the sleeve 651 and the base plate 70, respectively, and the connecting leg 654 may be fitted in the sleeve 651 and the base plate 70, respectively. For example, one end of the connecting leg 654 extends into the fitting channel 203 of the base plate 70, and then the other end of the connecting leg 654 extends into the fitting channel 203 of the sleeve 651, thereby fixing the connecting leg 654 and the base plate 70 and the connecting leg 654 and the sleeve 651, respectively, and thus fixing the sleeve 651 to the base plate 70.

Further, in other embodiments of the present invention, the substrate 70 may have at least one mounting channel 201, wherein the substrate 70 invaginates to form the mounting channel 201. At least a part of the stopper mechanism 65 may be accommodated in the mounting passage 201, and then the substrate 70 and the stopper mechanism 65 may be fixed by filling a gel between the gap between the substrate 70 and the stopper mechanism 65.

In order to reduce the requirement for the assembly accuracy of the camera module 30 and the display screen 20, a lens barrel of the camera module 30 is preferably specially designed.

Referring to fig. 60A and 60B, and referring to fig. 28, the image capturing module 30 includes an optical mechanism 31A 'and a photosensitive unit 32A, wherein the optical mechanism 31A' includes an optical lens 311A ', and the optical lens 311A' is held in the photosensitive path of the photosensitive unit 32A.

The optical mechanism 31A' may further include a motor, a base, a filter element, and the like.

The optical lens 311A ' includes the lens barrel 3111A ' and a plurality of lenses, wherein the plurality of lenses are held to the lens barrel 3111A '.

The lens barrel 3111A' has an end surface. When the camera module 30 is mounted on the display screen 20, the end surface of the lens barrel 3111A' is adapted to be close to the display screen 20 and then fixed to the display screen 20.

One of the lenses is a first lens 3112A ', and generally, the first lens 3112A ' is closest to the end surface of the lens barrel 3111A ' relative to the other lenses.

In this example, the end surfaces of the first lens 3112A 'and the lens barrel 3111A' are set at a large distance.

Specifically, the lens barrel 3111A ' includes a barrel wall 31111A ' and a barrel cavity 31110A ', wherein the lens 3112A ' is accommodated in the barrel cavity 31110A ', and the barrel wall 31111A ' surrounds the barrel cavity 31110A '.

The lens barrel 3111A 'further includes an extending wall 31112A', wherein the extending wall 31112A 'extends vertically upward from one end of the barrel wall 31111A'. The barrel wall 31111A ' has a high end and a low end, wherein the extension wall 31112A ' extends upward from the high end of the barrel wall 31111A ' a distance to increase the distance between the first lens 3112A ' and the end surface of the barrel 3111A '.

The camera module 30 can be directly assembled to the display screen 20, and the first lens 3112A' is prevented from being affected.

In this way, the requirements for the assembly accuracy between the camera module 30 and the display screen 20 can be reduced. The camera module 30 can be directly supported on the display screen 20 and then the relative position between the camera module 30 and the display screen 20 can be adjusted.

Further, in the example shown in fig. 60A, the extension wall 31112A ' is provided to extend horizontally inward after extending a certain distance from the barrel wall 31111A ', and in the example shown in fig. 60B, the extension wall 31112A ″ may be formed to extend upward all the way from the barrel wall 31111A '.

Referring to fig. 60C, there is another embodiment of the optical mechanism 31A 'according to the above embodiment of the present invention, in this embodiment, the extension wall 31112A' extends upward from the high end of the barrel wall 31111A 'by a certain distance and the inner diameter of the extension wall 31112A' is set to be gradually reduced from top to bottom. The inner diameter of the extension wall 31112A 'is smaller closer to the high end of the barrel wall 31111A', that is, the barrel cavity 31110A 'is smaller closer to the high end of the barrel wall 31111A'. Meanwhile, the outer diameter of the extension wall 31112A' is also set to be gradually reduced from top to bottom.

Referring to fig. 60D, another embodiment of the optical mechanism 31A ' according to the above embodiment of the present invention is shown, in this embodiment, the extension wall 31112A ' extends upward from the high end of the barrel wall 31111A ' by a certain distance and the inner diameter of the extension wall 31112A ' is set to be constant from top to bottom, but the outer diameter of the extension wall 31112A ' is set to be gradually smaller from top to bottom. The outer diameter of the extension wall 31112A 'is smaller closer to the high end of the barrel wall 31111A'.

Referring to fig. 60E, there is another embodiment of the optical mechanism 31A ' according to the above embodiment of the present invention, in this embodiment, the extension wall 31112A ' extends upward from the high end of the barrel wall 31111A ' by a certain distance and the inner diameter of the extension wall 31112A ' is set to be gradually enlarged from top to bottom, and the outer diameter of the extension wall 31112A ' is set to be gradually enlarged from top to bottom. The inner and outer diameters of the extension wall 31112A 'are both enlarged closer to the high end of the barrel wall 31111A'.

Further, for the display screen 20 with the light passing hole 200, due to the existence of the through hole 200, the edge of the light passing hole 200, that is, the transition area between the display screen and the non-display area of the display screen 20, may have a black edge, which affects the normal display of the entire display screen 20. The light-passing hole 200 penetrates at least a portion of the display panel 20 in a height direction, for example, a pixel layer of the display panel 20.

According to another aspect of the present invention, referring to fig. 61A to 61C, a terminal device 1 is provided according to the present invention, wherein the terminal device 1 includes a terminal device body 10, a display unit, and a camera module 30, wherein the camera module 30 is located below the display unit, the camera module 30 has a front end, the front end of the camera module 30 is mounted on the display screen 20 of the display unit, and the camera module 30 is aligned with the light-passing hole 200 of the display screen 20, so that light outside the display screen 20 is received by the camera module 30 through the light-passing hole 200.

The display unit includes the display screen 20 that has the clear hole 200 and a light filling unit 80, wherein the light filling unit 80 can to the display screen 20 clear hole 200 position carry out illumination supplementary in order to be favorable to wholly the display effect of display screen 20.

In this embodiment, the light supplement unit 80 is located between the display screen 20 and the camera module 30, and may be installed on the bottom surface of the display screen 20. Light from the outer side of the display screen 20 passes through the light-passing hole 200 of the display screen 20 and the light supplement unit 80, and then reaches the camera module 30.

Further, in this example, the display panel 20 is taken as an OLED display panel, and the light-passing hole 200 penetrates through the layers of the display panel except the cover plate layer 21. Of course, it can be understood by those skilled in the art that the type of the display screen 20 is not limited to the OLED display screen and the position of the light passing hole 200 inside the display screen 20 may not be limited to the above examples.

The light supplement unit 80 not only can supplement light to the through hole 200 of the display screen 20, but also the light supplement unit 80 can control the light entering amount of the camera module 30.

Specifically, the light filling unit 80 includes an aperture structure 81 and a light emitting structure 82, wherein the light emitting structure 82 is disposed on the aperture structure 81.

The light emitting structure 82 can radiate light outwards, and at least part of the diaphragm structure 81 is located at the light through hole 200 or aligned with the light through hole 200. At least a part of the light emitting structure 82 disposed on the diaphragm structure 81 is disposed to be able to be located at the light passing hole 200 or near the light passing hole 200 or aligned with the light passing hole 200, so that when the light emitting structure 82 emits light, the problem of insufficient illumination of the display area and the non-display area of the display screen 20 corresponding to the position of the light passing hole 200 can be compensated.

The diaphragm structure 81 includes a diaphragm moving portion 811, a diaphragm carrier 812 and a diaphragm driving portion 813, wherein the diaphragm moving portion 811 is supported on the diaphragm carrier 812, the diaphragm moving portion 811 is drivably connected to the diaphragm driving portion 813, and the diaphragm moving portion 811 is movable by the diaphragm driving portion 813 to form an aperture 810 with a variable size.

Specifically, the stop moving portion 811 is moved by the stop driving portion 813, and the size of the optical path corresponding to the image pickup module 30 can be changed as the relative position of the stop moving portion 811 and the light-passing hole is changed.

The light emitting structure 82 is provided in the diaphragm moving portion 811. Specifically, the diaphragm moving portion 811 has an upper surface facing the outside of the display screen 20 and a lower surface facing the camera module 30, and the light emitting structure 82 is located on the upper surface of the diaphragm moving portion 811, so as to supplement light to the side of the display screen 20 facing the outside when the light emitting structure 82 emits light.

The whole diaphragm moving portion 811 may be opaque, and when the light emitting structure 82 emits light, the light emitted by the light emitting structure 82 is difficult to reach the camera module 30 located below the display screen 20. When the camera module 30 is in operation, the amount of light entering through the stop moving portion 811 can be controlled based on the size of the aperture 810.

The entire diaphragm moving portion 811 may also be transparent, but the lower surface of the diaphragm moving portion 811 may be provided with an opaque material, so that when the light-emitting structure 82 emits light, the light emitted by the light-emitting structure 82 is difficult to reach the camera module 30 located below the display screen 20. When the camera module 30 is in operation, the amount of light entering through the stop moving portion 811 can be controlled based on the size of the aperture 810.

The light passes through the light-passing hole 200 of the display screen 20 and then passes through the light-passing hole 810 of the diaphragm structure 81, and then is received by the camera module 30. The light aperture 810 of the diaphragm structure 81 is aligned with the through hole 200 of the display screen 20. Further, the light hole 810 of the diaphragm structure 81 and the light passing hole 200 of the display screen 20 may be located on the same axis.

The light emitting structure 82 includes at least one light emitting element 821, wherein the light emitting element 821 is disposed on the upper surface of the diaphragm moving portion 811 of the diaphragm structure 81. The light emitting element 821 may be one pixel (pixel) or a plurality of pixels. When one of the light emitting elements 821 is energized, the light emitting element 821 emits light, and when a plurality of the light emitting elements 821 are energized, the magnitude of illumination of the light emitting structure 82 is increased. The brightness of the light-emitting structure 82 may be controlled by controlling the magnitude of the current supplied to the light-emitting element 821.

When the camera module 30 needs to work, the diaphragm moving portion 811 can move under the driving of the diaphragm driving portion 813 to form the light hole 810 or enlarge the light hole 810. At this time, the stop moving portion 811 may stop light emission.

When the camera module 30 is not operated and the display screen 20 plays a role of displaying, the diaphragm moving portion 811 makes at least a portion of the light emitting structure 82 correspond to the light passing hole 200 under the driving of the diaphragm driving portion 813, so that the light emitting structure 82 can radiate light outward through the light passing hole 200. At this time, the light hole 810 of the diaphragm structure 81 may be completely closed, or the light hole 810 of the diaphragm structure 81 may be opened, light may reach the camera module 30, and the camera module 30 may be started to work at any time.

Further, the light supplement unit 80 is detachably mounted to the display screen 20, so as to facilitate maintenance and replacement of the light supplement unit 80.

The light compensation unit 80 comprises a control mechanism 83, wherein the diaphragm structure 81 is controllably connected to the control mechanism 83. The control mechanism 83 may control the size of the aperture 810 of the diaphragm structure 81 by controlling the diaphragm driving section 813 to control the movement of the diaphragm moving section 811 of the diaphragm structure 81. The control unit 83 may control the light-emitting intensity, the power-on/off operation, and other operation states of the light-emitting structure 82. The control mechanism 83 may be implemented as a control chip of the terminal device, for example, a control chip of the camera module 30.

According to another aspect of the present invention, there is provided a method of operating a display unit, wherein the method comprises the steps of:

when the display screen 20 with the light through hole 200 works, the light supplementing unit 80 is operated to emit light to supplement the light intensity at the position of the light through hole 200.

According to some embodiments of the present invention, when the camera module 30 located below the display screen 20 and aligned with the light-passing hole 200 works, the diaphragm structure 81 of the light supplement unit 80 located above the camera module 30 is operated to form the light-passing hole 810, and light reaches the camera module 30 after passing through the light-passing hole 810 and the constraint of the light supplement unit 80.

Referring to fig. 62A and 62C, and referring to fig. 61A to 61C, there is another embodiment of the terminal device 1 according to the above-described embodiment of the present invention.

In this example, the diaphragm moving section 811 includes a plurality of blades 8111, each of the blades 8111 is supported by the diaphragm carrier 812 and distances between the plurality of blades 8111 can be changed mutually by the driving of the diaphragm driving section 813, so that the diaphragm structure 81 can pass light and also can control the amount of light passing.

The light emitting structure 82 includes a plurality of light emitting elements 821, and each of the light emitting elements 821 corresponds to one of the blades 8111 of the diaphragm moving portion 811.

Each of the blades 8111 may be respectively and drivably connected to the diaphragm driving portion 813. All the blades 8111 may be simultaneously connected to the diaphragm driving unit 813 in a driving manner.

The position of the light emitting element 821 can move with the movement of the blade 8111. Referring to fig. 62A to 62C, as the blade 8111 moves, the aperture size of the light hole 810 of the diaphragm structure 81 of the fill-in unit 80 may be adjusted, and the light hole 810 may be enlarged or reduced to control the light entering amount of the camera module 30.

According to other embodiments of the present invention, the diaphragm moving portion 811 includes a plurality of blades 8111, and a plurality of the light emitting elements 821 are provided to one of the blades 8111. Each of the blades 8111 is mounted with a plurality of the light emitting elements 821.

The light emitting element 821 may be one pixel, and the entire diaphragm moving portion 811 may be used as a display portion of the display screen 20. Especially when the blades 8111 of the diaphragm moving portion 811 are folded to close the light aperture 810, the light passing hole 200 of the display screen 20 appears to be integrated with the display area of the display screen 20.

Referring to fig. 63, there is shown another embodiment of the display unit according to the above preferred embodiment of the present invention.

In this example, the fill-in light unit 80 includes the aperture structure 81 and the light emitting structure 82, and further includes a reflective structure 84, wherein the reflective structure 84 is disposed on the aperture moving portion 811 of the aperture structure 81 and between the light emitting structure 82 and the aperture moving portion 811.

When the light emitting structure 82 emits light, a part of light emitted by the light emitting structure 82 is radiated to the outside of the display screen 20, a part of light is radiated to the reflecting structure 84, and the reflecting structure 84 can radiate light to the outside of the display screen 20.

Further, the reflectivity of the reflective structure 84 may be varied. For example, the reflecting structure 84 is implemented as a reflecting film and is disposed on the upper surface of the diaphragm moving portion 811.

The reflecting film can be a substance doped with a reflecting function or a high-elasticity film coated with a reflecting layer. When the reflective film is stretched, the reflectance of the reflective film decreases, and the transmittance of the reflective film increases. When the reflective film is reduced by tensile deformation, the reflectance of the reflective film increases and the transmittance decreases.

One end of the highly elastic reflective film may be fixed to the diaphragm carrier 812 of the diaphragm structure 81, and the other end may be fixed to a side of the diaphragm moving portion 811 of the diaphragm structure 81 that is close to the aperture 810. When the aperture 810 of the diaphragm moving portion 811 is tapered, the highly elastic reflective film is stretched, and the reflectance is lowered. When the aperture 810 of the diaphragm moving portion 811 is gradually enlarged, the highly elastic reflective film is stretched and reduced, and thus the reflectance is increased.

The brightness and color of the light supplement unit 80 are controlled by controlling the aperture size of the light hole 810 of the diaphragm structure 81.

Referring to fig. 64, there is shown another embodiment of the display unit according to the above preferred embodiment of the present invention.

In this example, the light supplement unit 80 includes one of the diaphragm structures 81, and the diaphragm structure 81 itself can emit light, and the diaphragm structure 81 itself may be made of a luminescent material, and can radiate light outwards when being powered on.

The aperture structure 81 may be an OLED structure, which is capable of emitting light and displaying when energized. When the camera module 30 is in operation, the aperture structure 81 may stop the energization, and the control of the aperture 810 is realized by controlling the position of the aperture moving portion 811 of the aperture structure 81. When the camera module 30 is not in operation, the diaphragm structure 81 can be energized, then emit light and perform a display function, so as to facilitate the display effect of the whole display screen 20.

Referring to fig. 65, there is shown another embodiment of the display unit according to the present invention.

In this example, the display unit includes a display screen 20 and a light filling unit 80, wherein the display screen 20 includes, from top to bottom, a cover plate layer 21, an encapsulation layer 22, a touch layer 23, a polarization layer 24, a pixel layer 25, a driving circuit layer 26 and a back plate layer 27, wherein the driving circuit layer 26 is formed on the bottom side of the pixel layer 25 and is electrically connected to the pixel layer 25 to drive the pixel layer 25 to operate, wherein the encapsulation layer 22 is formed on the top side of the pixel layer 25 for encapsulating the pixel layer 25, wherein the light through hole 200 penetrates the touch layer 23, the polarization layer 24, the encapsulation layer 22, the pixel layer 25, the driving circuit layer 26 and the back plate layer 27 in the height direction, and wherein the back plate layer 27 is located at the bottom layer.

The display screen 20 is an OLED screen and the light supplement unit 80 is located inside the display screen 20.

Specifically, the light supplement unit 80 is located on the driving circuit layer 26 below the pixel layer 25. The light filling unit 80 is mounted on the driving circuit layer 26 and an aperture structure 81 of the light filling unit 80 is aligned with the light passing hole 200 of the display screen 20. The driving circuit layer 26 includes a plurality of TFT structures 261 and a substrate 262, wherein the TFT structures 261 are disposed on the substrate 262. Preferably, the light filling unit 80 is disposed between the adjacent TFT structures 261.

The light rays outside the display screen 20 can reach the position of the camera module 30 below the display screen 20 only after passing through the diaphragm structure 81.

The light supplement unit 80 includes the aperture structure 81 and a light emitting structure 82, wherein the light emitting structure 82 is disposed on at least a portion of the aperture structure 81 to radiate light outwards, especially, to radiate light outwards from the display screen 20, so as to facilitate the display effect of the position of the light passing hole 200 of the display screen 20.

It should be noted that the light emitting intensity of the light emitting structure 82 can be controlled based on the requirement, and the light emitting structure 82 can be matched with the display requirements of different display areas of the display screen 20, so that the overall display effect of the entire display screen 20 can achieve a natural transition effect.

The diaphragm structure 81 includes a diaphragm moving portion 811, a diaphragm carrier 812 and a diaphragm driving portion 813, wherein the diaphragm moving portion 811 is disposed on the diaphragm carrier 812. The diaphragm moving section 811 is drivably connected to the diaphragm driving section 813.

The aperture structure 81 can form an aperture 810, and the aperture 810 can allow light to pass through. Further, the light aperture 810 is formed in the diaphragm moving section 811 and the aperture size of the light aperture 810 may be adjusted as the diaphragm moving section 811 is driven by the diaphragm driving section 813.

The light emitting structure 82 is provided in the diaphragm moving portion 811. Preferably, the light emitting structure 82 is disposed on an upper surface of the diaphragm moving portion 811. When the display screen 20 needs to display, the light-emitting structure 82 can emit light to fill light around the light-passing hole 200 of the display screen 20. When the camera module 30 is in operation, the light-emitting structure 82 can stop emitting light, and the size of the aperture 810 of the diaphragm structure 81 can be adjusted to control the amount of light entering the camera module 30.

In the present embodiment, the diaphragm moving portion 811 includes a plurality of blades 8111, and the light emitting structure 82 is provided to the blades 8111 of the diaphragm moving portion 811. The blade 8111 is drivably connected to the diaphragm driving portion 813.

According to other embodiments of the present invention, the diaphragm moving portion 811 of the diaphragm structure 81 is made of a light emitting material itself, and can emit light.

According to other embodiments of the present invention, the light emitting structure 82 may cover, fit, or be at least partially embedded in the upper surface of the diaphragm moving portion 811 of the diaphragm structure 81.

According to other embodiments of the present invention, wherein the diaphragm moving portion 811 of the diaphragm structure 81 may be completely transparent, and the lower surface of the diaphragm moving portion 811 of the diaphragm structure 81 may be provided with a light shielding material, wherein the diaphragm structure 81 may also be at least partially light transmissive, the light emitting structure 82 may be embedded in the diaphragm moving portion 811 of the diaphragm structure 81, and then radiate light outward through the light transmissive portion of the diaphragm moving portion 811.

Referring to fig. 66, there is shown another embodiment of the display unit according to the present invention.

In this example, the display unit includes a display screen 20 and a light filling unit 80, wherein the display screen 20 includes, from top to bottom, a cover plate layer 21, an encapsulation layer 22, a touch layer 23, a polarization layer 24, a pixel layer 25, a driving circuit layer 26 and a back plate layer 27, wherein the driving circuit layer 26 is formed on the bottom side of the pixel layer 25 and is electrically connected to the pixel layer 25 to drive the pixel layer 25 to operate, wherein the encapsulation layer 22 is formed on the top side of the pixel layer 25 for encapsulating the pixel layer 25, wherein the light through hole 200 penetrates through the touch layer 23, the polarization layer 24, the encapsulation layer 22, the pixel layer 25 and the driving circuit layer 26 in the height direction, and wherein the back plate layer 27 is located at the bottom layer.

Specifically, the light supplement unit 80 is located on the back plate layer 27 below the pixel layer 25. The light supplement unit 80 is mounted on the back plate layer 27 and an aperture structure 81 of the light supplement unit 80 is aligned with the light passing hole 200 of the display screen 20. The aperture structure 81 of the light filling unit 80 may be mounted on the back plate layer 27 by drilling the back plate layer 27.

The light rays outside the display screen 20 can reach the position of the camera module 30 below the display screen 20 only after passing through the diaphragm structure 81. The display screen 20 has a mounting channel 201, wherein the mounting channel 201 is formed on the back plate layer 27 of the display screen 20 and is used for accommodating at least a part of the camera module 30.

Referring to fig. 67, there is shown another embodiment of the display unit according to the present invention.

In this embodiment, the display screen 20A is an LCD display screen. The light supplement unit 80A is located between the display screen 20A and the camera module 30A. For example, the light supplement unit 80A is mounted on the bottom surface of the display screen 20A.

The light hole 810A of the diaphragm structure 81A of the light filling unit 80A can be aligned with the light passing hole 200A and can be aligned with a photosensitive path of the camera module 30A.

The display unit comprises the display screen 20A and the light supplement unit 80A, wherein the display screen 20A comprises a cover plate layer 21A, a packaging layer 22A, a touch layer 23A, a polarization layer 24A, a pixel layer 25A, a driving circuit layer 26A and a back plate layer 27A from top to bottom, wherein the driving circuit layer 26A is formed at the bottom side of the pixel layer 25A and is electrically connected to the pixel layer 25A to drive the pixel layer 25A to work, wherein the encapsulation layer 22A is formed on the top side of the pixel layer 25A for encapsulating the pixel layer 25A, the light-passing hole 200A penetrates through the touch layer 23A, the polarization layer 24A, the encapsulation layer 22A, the pixel layer 25A, the driving circuit layer 26A, and the back plate layer 27A in the height direction, wherein the back plate layer 27A is located at the bottom layer. The pixel layer 25A includes a filter layer 251A and liquid crystal 252A, wherein the liquid crystal 252A is located between the filter layer 251A and the driving circuit layer 26A.

The light passing hole 200A penetrates the touch layer 23A, the polarization layer 24A, the pixel layer 25A, the driving circuit layer 26A, and the back plate layer 27A of the display screen 20A except for the cover plate layer 21A in the height direction.

The entire diaphragm moving portion 811A may be opaque, and when the light emitting structure 82A emits light, the light emitted by the light emitting structure 82A is difficult to reach the camera module 30A located below the display screen 20A. When the camera module 30A is in operation, the amount of light entering at the position of the stop moving portion 811A can be controlled based on the size of the aperture 810A.

The entire diaphragm moving portion 811A may be transparent, but the lower surface of the diaphragm moving portion 811A may be provided with an opaque material, so that when the light-emitting structure 82A emits light, the light emitted by the light-emitting structure 82A is difficult to reach the camera module 30A located below the display screen 20A. When the camera module 30A is in operation, the amount of light entering at the position of the stop moving portion 811A can be controlled based on the size of the aperture 810A.

The light passes through the light passing hole 200A of the display screen 20A and then passes through the light passing hole 810A of the diaphragm structure 81A, and then is received by the camera module 30A.

The aperture 810A of the diaphragm structure 81A is aligned with the clear aperture 200A of the display screen 20A. Further, the light hole 810A of the diaphragm structure 81A and the light passing hole 200A of the display screen 20A may be located on the same axis.

The light emitting structure 82A includes at least one light emitting element 821A, wherein the light emitting element 821A is disposed on the upper surface of the diaphragm moving portion 811A of the diaphragm structure 81A. The light emitting element 821A may be one pixel (pixel) or a plurality of pixels. When one of the light emitting elements 821A is energized, the light emitting element 821A emits light, and when a plurality of the light emitting elements 821A are energized, the light emitting structure 82A is increased in illumination amplitude. The brightness of the light-emitting structure 82A may also be controlled by controlling the magnitude of the current flowing through the light-emitting element 821A, so as to meet the requirements of different positions around the through hole for the display brightness.

The light emitting intensity of the light emitting structure 82 can be controlled based on the requirement, and the light emitting structure 82 can be matched with the display requirements of different display areas of the display screen 20, so that the whole display effect of the whole display screen 20 can achieve a natural transition effect.

When the camera module 30A needs to work, the diaphragm moving portion 811A can move under the driving of the diaphragm driving portion 813A to form the aperture 810A or enlarge the aperture 810A. At this time, the stop moving portion 811A may stop light emission.

When the camera module 30A is not operated and the display screen 20A functions as the display screen 20A, the diaphragm moving portion 811A is driven by the diaphragm moving portion 811A to make at least a part of the light emitting structure 82A correspond to the light passing hole 200A, so that the light emitting structure 82A can radiate light outward through the light passing hole 200A. At this time, the light hole 810A of the diaphragm structure 81A may be completely closed, or the light hole 810A of the diaphragm structure 81A may be opened, light may reach the camera module 30A, and the camera module 30A may be started to work at any time.

Further, the light supplement unit 80A is detachably mounted on the display screen 20A, so as to facilitate maintenance and replacement of the light supplement unit 80A.

The light supplementing unit 80A comprises a control mechanism 83A, wherein the diaphragm structure 81A is controllably connected to the control mechanism 83A. The control structure may control the size of the aperture 810A of the diaphragm structure 81A by controlling the diaphragm driving section 813A to control the movement of the diaphragm moving section 811A of the diaphragm structure 81A. The control structure may also control the light-emitting intensity, power on/off, and other operating states of the light-emitting structure 82A.

According to some embodiments of the present invention, for example, referring to fig. 62 at the same time, the diaphragm moving portion 811A includes a plurality of blades 8111A, each of the blades 8111A is supported by the diaphragm carrier 812A and the distances between the plurality of blades 8111A can be changed mutually under the driving of the diaphragm driver 813A, so that the diaphragm structure 81A can be passed through by light, and the amount of light passing can also be controlled.

The light emitting structure 82A includes a plurality of the light emitting elements 821A, and each of the light emitting elements 821A corresponds to one of the blades 8111A of the diaphragm moving portion 811A.

Each of the blades 8111A may be respectively drivably connected to the diaphragm driver 813A. All the blades 8111A may also be connected to the diaphragm driver 813A in a drivable manner at the same time.

The position of the light emitting element 821A can move with the movement of the blade 8111A.

According to some embodiments of the present invention, for example, referring to fig. 62 at the same time, the diaphragm moving portion 811A includes a plurality of blades 8111A, and a plurality of the light emitting elements 821A are provided to one of the blades 8111A. Each of the blades 8111A is mounted with a plurality of the light emitting elements 821A.

The light emitting element 821A may be one pixel, and the entire diaphragm moving portion 811A may be used as a display portion of the display screen 20A. Especially when the blades 8111A of the diaphragm moving portion 811A are closed to each other to close the light aperture 810A, the light passing aperture 200A position of the display screen 20A appears to be integrated with the display area of the display screen 20A.

Referring to fig. 68, there is shown another embodiment of the display unit according to the above preferred embodiment of the present invention.

In this example, the fill light unit 80A includes the aperture structure 81A and the light emitting structure 82A, and further includes a reflective structure 84A, wherein the reflective structure 84A is disposed at the aperture moving part 811A of the aperture structure 81A and between the light emitting structure 82A and the aperture moving part 811A.

When the light emitting structure 82A emits light, a part of light emitted by the light emitting structure 82A is radiated to the outside of the display screen 20A, a part of light is radiated to the reflecting structure 84A, and the reflecting structure 84A can radiate the light to the outside of the display screen 20A.

Further, the reflectivity of the reflective structure 84A may be varied. For example, the reflecting structure 84A is implemented as a reflecting film and is disposed on the upper surface of the diaphragm moving portion 811A.

One end of the highly elastic reflective film may be fixed to the diaphragm carrier 812A of the diaphragm structure 81A, and the other end may be fixed to a side of the diaphragm moving portion 811A of the diaphragm structure 81A close to the aperture 810A. When the aperture 810A of the diaphragm moving portion 811A is tapered, the highly elastic reflective film is stretched, and the reflectance is lowered. When the aperture 810A of the diaphragm moving portion 811A is gradually enlarged, the highly elastic reflective film is stretched and reduced, and the reflectance is increased.

The brightness and color of the light supplement unit 80A are controlled by controlling the aperture size of the light hole 810A of the diaphragm structure 81A.

Referring to fig. 69, there is shown another embodiment of the display unit according to the above preferred embodiment of the present invention.

In this example, the light supplement unit 80A includes one of the diaphragm structures 81A, and the diaphragm structure 81A itself can emit light, and the diaphragm structure 81A itself may be made of a luminescent material, and can radiate light outwards when being powered on.

The aperture structure 81A may be an OLED structure, which emits light and displays the light when energized. When the camera module 30A is in operation, the aperture structure 81A may stop the energization, and the control of the aperture 810A is realized by the control of the position of the aperture moving portion 811A of the aperture structure 81A. When the camera module 30A is not in operation, the diaphragm structure 81A can be energized, and then emit light and perform a display function, so as to facilitate the display effect of the whole display screen 20A.

Referring to fig. 70, there is shown another embodiment of the display unit according to the present invention.

In this example, the display unit includes a display screen 20A and a fill light unit 80A, wherein the display screen 20A comprises a cover plate layer 21A, a touch layer 23A, a polarization layer 24A, a pixel layer 25A, a driving circuit layer 26A and a back plate layer 27A from top to bottom, wherein the driving circuit layer 26A is formed at the bottom side of the pixel layer 25A and is electrically connected to the pixel layer 25A to drive the pixel layer 25A to work, wherein the encapsulation layer 22A is formed on the top side of the pixel layer 25A for encapsulating the pixel layer 25A, the light-passing hole 200A penetrates through the touch layer 23A, the polarization layer 24A, the encapsulation layer 22A, the pixel layer 25A, the driving circuit layer 26A, and the back plate layer 27A in the height direction, wherein the back plate layer 27A is located at the bottom layer.

The display screen 20A is an LCD screen and the fill light unit 80A is located inside the display screen 20A.

Specifically, the light supplement unit 80A is located on the driving circuit layer 26A below the pixel layer 25A. The light filling unit 80A is mounted on the driving circuit layer 26A and an aperture structure 81A of the light filling unit 80A is aligned with the light passing hole 200A of the display screen 20A. The driving circuit layer 26A includes a plurality of TFT structures 261A and a substrate 262A, wherein the TFT structures 261A are disposed on the substrate 262A. Preferably, the light filling unit 80A is disposed between the adjacent TFT structures 261A.

The light rays outside the display screen 20A can reach the position of the camera module 30A below the display screen 20A only after passing through the diaphragm structure 81A. The display screen 20A has a mounting channel 201A, wherein the mounting channel 201A is formed on the back plate layer 27A of the display screen 20A and is used for accommodating at least a part of the camera module 30A.

The light supplement unit 80A includes the aperture structure 81A and a light emitting structure 82A, wherein the light emitting structure 82A is disposed on at least a portion of the aperture structure 81A to radiate light outwards, especially, towards the outside of the display screen 20A, so as to facilitate the display effect of the position of the light passing hole 200A of the display screen 20A.

The aperture structure 81A includes an aperture moving portion 811A, an aperture carrier 812A, and an aperture driving portion 813A, wherein the aperture moving portion 811A is disposed on the aperture carrier 812A. The diaphragm moving section 811A is drivably connected to the diaphragm driving section 813A.

The aperture structure 81A can form an aperture 810A, and the aperture 810A can allow light to pass through. Further, the aperture 810A is formed in the diaphragm moving section 811A and the aperture size of the aperture 810A can be adjusted as the diaphragm moving section 811A is driven by the diaphragm driving section 813A.

The light emitting structure 82A is provided in the diaphragm moving portion 811A. Preferably, the light emitting structure 82A is disposed on an upper surface of the diaphragm moving portion 811A. When the display screen 20A needs to display, the light-emitting structure 82A can emit light to fill light around the light-passing hole 200A of the display screen 20A. When the camera module 30A is in operation, the light-emitting structure 82A can stop emitting light, and the size of the aperture 810A of the diaphragm structure 81A can be adjusted to control the amount of light entering the camera module 30A.

In the present embodiment, the diaphragm moving portion 811A includes a plurality of blades 8111A, and the light emitting structure 82A is provided to the blades 8111A of the diaphragm moving portion 811A. The blade 8111A is drivably connected to the diaphragm driving portion 813A.

According to other embodiments of the present invention, the diaphragm moving portion 811A of the diaphragm structure 81A is itself made of a light emitting material, and can emit light.

According to other embodiments of the present invention, the light emitting structure 82A may cover, fit, or be at least partially embedded in the upper surface of the diaphragm moving portion 811A of the diaphragm structure 81A.

According to other embodiments of the present invention, wherein the diaphragm moving portion 811A of the diaphragm structure 81A may be completely transparent, and the lower surface of the diaphragm moving portion 811A of the diaphragm structure 81A may be provided with a light shielding material, wherein the diaphragm structure 81A may also be at least partially light transmissive, the light emitting structure 82A may be embedded in the diaphragm moving portion 811A of the diaphragm structure 81A, and then radiate light outward through the light transmissive portion of the diaphragm moving portion 811A.

Referring to fig. 71, there is shown another embodiment of the display unit according to the present invention.

In this example, the display unit includes a display panel 20A and a light filling unit 80A, wherein the display panel 20A includes a cover plate layer 21A, a touch layer 23A, a polarization layer 24A, a pixel layer 25A, a driving circuit layer 26A and a back plate layer 27A, wherein the driving circuit layer 26A is formed at a bottom side of the pixel layer 25A and is electrically connected to the pixel layer 25A to drive the pixel layer 25A to operate, wherein the encapsulation layer 22A is formed at a top side of the pixel layer 25A to encapsulate the pixel layer 25A, wherein the light through hole 200A penetrates through the touch layer 23A, the polarization layer 24A, the encapsulation layer 22A, the pixel layer 25A, the driving circuit layer 26A and the back plate layer 27A in a height direction, and the back plate layer 27A is located at a bottom layer.

Specifically, the light supplement unit 80A is located on the back plate layer 27A below the pixel layer 25A. The light supplement unit 80A is mounted on the back plate layer 27A and an aperture structure 81A of the light supplement unit 80A is aligned with the light passing hole 200A of the display screen 20A. The aperture structure 81A of the light filling unit 80A may be installed on the back plate layer 27A by opening the back plate layer 27A.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims

1. A terminal device, comprising:

a terminal device main body;

the display screen is provided with a light through hole; and

a camera module, wherein the camera module is located below the display screen, the camera module has a front end, the front end of the camera module is installed in the display screen and the camera module is aimed at the light through hole of the display screen, so that the light outside the display screen passes through the light through hole to be received by the camera module.

2. The terminal device according to claim 1, wherein the display screen comprises a cover plate layer, a touch layer, a polarization layer, an encapsulation layer, a pixel layer and a driving circuit layer, wherein the driving circuit layer is formed on a bottom side of the pixel layer and is electrically connected to the pixel layer to drive the pixel layer to operate, wherein the encapsulation layer is formed on a top side of the pixel layer to encapsulate the pixel layer, and wherein the light hole penetrates through the touch layer, the polarization layer, the encapsulation layer, the pixel layer and the driving circuit layer in a height direction.

3. The terminal device of claim 2, wherein the driver circuit layer includes a substrate base and a plurality of TFT structures, wherein the TFT structures are disposed on the substrate base, and the light passing holes are located between adjacent TFT structures.

4. The terminal device according to claim 2, wherein the pixel layer includes a plurality of pixels, and the light passing hole is located between adjacent pixels.

5. The terminal device of claim 4, wherein the driver circuit layer includes a substrate base and a plurality of TFT structures, wherein the TFT structures are disposed on the substrate base, and the light passing holes are located between adjacent TFT structures.

6. A terminal device according to any one of claims 2 to 5, wherein the terminal device is provided with a protective material, wherein the protective material is located in the light-passing aperture and is applied to the pixel layer and/or the driver circuit layer.

7. A terminal device according to any one of claims 2 to 5, wherein said pixel layer comprises an anode layer, a light emitting layer, a cathode layer and a protective layer, wherein said anode layer is located above said driver circuit layer, said light emitting layer is located between said anode layer and said cathode layer, and said cathode layer is located above said light emitting layer and below said protective layer.

8. The terminal device of claim 7, wherein the terminal device is provided with a protective material, wherein the protective material is located at the light passing hole and the protective material is extended from the protective layer down to the cathode layer; or the protective material extends from the protective layer down to the light-emitting layer; or the protective material extends from the protective layer down to the anode layer.

9. A terminal device according to any one of claims 2 to 5, wherein said terminal device comprises a back plate layer located below said driver circuit layer and adapted to emit light, said pixel layer comprising a filter layer and liquid crystal, wherein said liquid crystal is located between said filter layer and said driver circuit layer, said pixel layer being provided with a sealing material, wherein said sealing material is located between said filter layer and said driver circuit layer, said liquid crystal being blocked from leaking to said light through hole by said sealing material.

10. The terminal device according to claim 9, wherein the terminal device is provided with a protective material, wherein the protective material is located at the light passing hole, and the protective material is applied to the pixel layer and/or the driving circuit layer.

11. The manufacturing method of the display screen with the light through hole is characterized by comprising the following steps of:

forming a hole penetrating through a driving circuit layer in a height direction in the driving circuit layer;

a cover plate layer, a touch layer, a polarization layer, a packaging layer and a pixel layer are respectively arranged above the driving circuit layer; and

and a light through hole penetrating through the touch layer, the polarization layer, the packaging layer and the pixel layer of the display screen is formed along the hole of the driving circuit layer.

12. The method of manufacturing according to claim 11, wherein the light passing hole is formed by drilling or cutting.

13. The method of manufacturing as claimed in claim 11, wherein in the method, further comprising the steps of:

forming the pixel layer at the driving circuit layer with the hole;

forming holes penetrating through the pixel layer and the driving circuit layer on the pixel layer and the driving circuit layer; and

and a cover plate layer, a touch layer, a polarization layer and a packaging layer are respectively arranged above the driving circuit layer.

14. The method of manufacturing as claimed in claim 11, wherein in the method, further comprising the steps of:

Providing the pixel layer with a hole on the driving circuit layer with the hole, and the driving circuit layer is aligned to the pixel layer;

15. The manufacturing method according to claim 14, wherein in the method, the pixel layer is formed on the driver circuit layer having the hole, and then a hole penetrating the pixel layer and the driver circuit layer in a height direction is formed in the pixel layer and the driver circuit layer.

16. A method of making a display screen with holes, comprising the steps of:

a cover plate layer, a touch layer, a polarization layer, a packaging layer and a back plate layer are respectively arranged on two sides of a liquid crystal layer; and

and perforating each layer of the display screen by aligning to a sealing area of the liquid crystal layer so as to obtain a light through hole which penetrates through the touch layer, the polarization layer, the packaging layer and the back plate layer of the display screen in the height direction.

17. The method of claim 16, wherein the liquid crystal layer has a hole therethrough.

18. The manufacturing method of claim 16, wherein in the method, the liquid crystal layer forms a sealing region penetrating in a height direction, and when the liquid crystal layer is perforated, the perforated region is located between the sealing regions and is smaller than the sealing regions.

19. The manufacturing method according to claim 18, wherein in the above method, a method of manufacturing the liquid crystal layer with holes includes the steps of:

disposing a sealing material between a filter layer and a driver circuit layer to form the sealing region; and

and filling liquid crystal outside the sealing area.

20. The manufacturing method according to claim 19, wherein in the above method, the method of manufacturing the liquid crystal with holes further comprises the steps of:

arranging a sealing material with a certain height on the surface of a driving circuit layer to form the sealing area;

filling liquid crystal outside the sealing area; and

the filter layer covers the liquid crystal and is attached to the driving circuit layer.