CN111751694A - Multi-processor fusion measurement and control system, method and tester for microwave semiconductor device - Google Patents
Multi-processor fusion measurement and control system, method and tester for microwave semiconductor device Download PDFInfo
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Abstract
The system comprises a central processing unit, a gateway and a plurality of auxiliary processors, wherein the central processing unit is respectively in communication connection with the auxiliary processors through the gateway; a central processing unit: the method is configured to realize performance test control on the microwave semiconductor device, fuse state monitoring data information and production line scene interaction information, and obtain a test result containing a performance test result and a mapping relation with a corresponding test equipment state, an environment state and a production line running state. The microwave semiconductor device or microwave semiconductor integrated circuit testing system is provided with the plurality of processors, so that synchronous execution of different monitoring processes can be realized, the testing efficiency of the microwave semiconductor device or microwave semiconductor integrated circuit is improved, and the testing accuracy of the testing system is improved.
Description
Technical Field
The disclosure relates to the technical field related to microwave semiconductor device testing, in particular to a system, a method and a tester for multi-processor fusion measurement and control of microwave semiconductor devices.
Background
The statements in this section merely provide background information related to the present disclosure and may not necessarily constitute prior art.
With the industrial development of microwave semiconductor devices, the actual test requirements on microwave semiconductor devices, such as microwave semiconductor integrated circuits, on the production line (for short, production line) are higher and higher, and the test requirements on multi-parameter, multifunction, fast response and high efficiency need to be met.
The inventor finds that the traditional test instrument for the microwave semiconductor device adopts a measurement and control framework of a single processor, has the problems of single application function, low comprehensive application response efficiency and the like, and is difficult to adapt to the requirements of a production line for integrating the comprehensive application functions including sensing and real-time monitoring of the temperature, humidity, vibration, self-test and self-detection of faults, working states and the like of the instrument, the response efficiency, the application of the production line including scene-oriented multifunctional cooperative work such as automatic feeding and discharging, automatic loading and unloading, environmental stress application, production line state control, information interaction and the like, and quick response. Specifically, test control, test data analysis and processing, control and communication of peripheral interaction functions and the like of a microwave semiconductor device or integrated circuit test instrument are all realized by taking a single central processing unit as a control center, due to the resource limitation of concurrent work of supporting software and hardware, the instrument is usually guaranteed to realize the test function preferentially, and other functions need to adopt time-sharing processing and response. Other functions include real-time monitoring of various states of the instrument, such as temperature, humidity, vibration, fault self-checking, instrument working state and the like, or multifunctional cooperative work and quick response required by a production line scene: for example, automatic loading and unloading of a production line, automatic loading and unloading of devices, application of environmental stress, state control and information interaction of the production line and the like are included, and it is difficult to simultaneously control the test of a circuit and the cooperative work of internal parts of an instrument, so that the test efficiency is low, and the actual production line test requirements of microwave semiconductor devices or integrated circuits cannot be met. Based on the traditional method, whether a single processor of a microwave semiconductor device or an integrated circuit testing instrument is provided with a general time-sharing operating system and software or a real-time operating system and software, the requirements of a production line scene on the richness and the interaction capability of a measurement and control function, the measurement and control real-time performance and the like cannot be completely met, meanwhile, the corresponding functions are difficult to be effectively integrated into the complete capability of production line application automation and informatization, and the practical technical requirements in the field of testing engineering cannot be met.
Disclosure of Invention
In order to solve the above problems, the present disclosure provides a system, a method, and a tester for integrating measurement and control of a microwave semiconductor device multiprocessor, which are used to implement efficient integrated measurement and control of a microwave semiconductor device on a production line, integrate a test function, a real-time monitoring function of the state of the device itself, and a production line scene interaction control in an organic cooperative manner, and implement a multifunctional cooperative work and a fast response function. The problems of single application function, low comprehensive application response efficiency and the like of a traditional method and a circuit are effectively solved, and the application requirements of a production line scene on the aspects of comprehensive application function, response efficiency, production line application fusion and the like of a microwave semiconductor device testing instrument can be met.
In order to achieve the purpose, the following technical scheme is adopted in the disclosure:
one or more embodiments provide a microwave semiconductor device multiprocessor fusion measurement and control system, which comprises a central processing unit, a gateway and a plurality of auxiliary processors, wherein the central processing unit is respectively in communication connection with the auxiliary processors through the gateway;
a central processing unit: the method is configured to realize performance test control on the microwave semiconductor device, fuse state monitoring data information and production line scene interaction information, and obtain a test result containing a performance test result and a mapping relation with a corresponding test equipment state, an environment state and a production line running state.
One or more embodiments provide a microwave semiconductor device multi-processor fusion measurement and control method, which includes the following steps:
respectively sending test instructions aiming at the test equipment and the auxiliary equipment on the production line, and obtaining test results of the test equipment and the auxiliary equipment according to the test instructions;
when the test meets the requirement, controlling the test equipment to carry out performance test on the microwave semiconductor device to be tested;
acquiring test equipment state monitoring data sent by a state monitoring processor in a time-sharing manner, and an environment state and a production line running state sent by a production line interaction processor;
and establishing a performance test result and a mapping relation between the performance test result and the corresponding test equipment state, the environment state and the production line running state according to time synchronization, and taking the mapping relation as a final test result.
One or more embodiments provide a microwave semiconductor device tester, which adopts the microwave semiconductor device multi-processor fusion measurement and control system.
Compared with the prior art, the beneficial effect of this disclosure is:
the microwave semiconductor device or microwave semiconductor integrated circuit testing system is provided with the plurality of processors, so that synchronous execution of different monitoring processes can be realized, the testing efficiency of the microwave semiconductor device or microwave semiconductor integrated circuit is improved, and the testing accuracy of the testing system is improved. In the embodiment, the microwave semiconductor device or the microwave semiconductor integrated circuit with the functions of multi-processor, core gateway and information interaction is used for multi-function and multi-state measurement and control, so that the microwave semiconductor device tester or the equipment using the test system has the comprehensive capability of realizing integration with the production line application including the multi-function cooperative work and the quick response of scenes such as automatic loading and unloading, environmental stress application, production line state control, information interaction and the like of the production line while realizing the test function, the bottleneck problems of single application function, low comprehensive application response efficiency and the like caused by the adoption of a traditional single-processor mode measurement and control framework are solved, and the test effect is effectively improved, so that the comprehensive efficiency of the test and the application is greatly improved.
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The accompanying drawings, which are included to provide a further understanding of the disclosure, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure and not to limit the disclosure.
FIG. 1 is a block diagram of a system in accordance with one or more embodiments;
fig. 2 is a method flowchart of embodiment 2 of the present disclosure.
The specific implementation mode is as follows:
the present disclosure is further described with reference to the following drawings and examples.
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise. It should be noted that, in the case of no conflict, the embodiments and features in the embodiments in the present disclosure may be combined with each other. The embodiments will be described in detail below with reference to the accompanying drawings.
Example 1
In the technical solutions disclosed in one or more embodiments, as shown in fig. 1, a microwave semiconductor device multi-processor fusion measurement and control system, which is suitable for testing a microwave semiconductor device, such as a microwave semiconductor integrated circuit, applied in a production line, includes a central processing unit, a gateway, and a plurality of auxiliary processors, where the central processing unit is respectively in communication connection with the auxiliary processors through the gateway, and the auxiliary processors at least include a state monitoring processor for acquiring state monitoring data of a testing device in real time and a production line interaction processor for acquiring scene interaction information of the production line in real time;
a central processing unit: the method is configured to realize performance test control on the microwave semiconductor device, fuse state monitoring data information and production line scene interaction information, and obtain a test result containing a performance test result and a mapping relation with a corresponding test equipment state, an environment state and a production line running state.
The system integrates the testing function, the real-time monitoring function of the state of the testing equipment and the interactive control of the production line scene into a whole, and realizes the multifunctional cooperative work and the quick response function. Meanwhile, the test result comprises the state information of the equipment, the environment state and the running state of the production line in the performance test process, and a complete test result of the mapping relation between the performance test result and multiple elements and multiple dimensions such as the equipment state, the environment state and the running state of the production line at the same time is formed, so that the test process can be comprehensively reflected, the comprehensiveness of test data is improved, and data is provided for the consistency evaluation of production line products.
Specifically, the central processing unit is configured to control the microwave semiconductor device tester to perform performance testing on the microwave semiconductor device, meanwhile, real-time state monitoring data information of the microwave semiconductor device testing equipment and real-time state data information interacted with a production line application scene are fused, and a complete test result including a performance test result and multi-dimensional and multi-factor mapping relations of the corresponding instrument state, an environmental stress state, a production line running state and the like of the performance test result is formed through analysis and processing, so that support is provided for the microwave semiconductor device to achieve complete evaluation of same-batch consistency in the mass production testing process.
The microwave semiconductor device in this embodiment is a device or a circuit including a microwave semiconductor element, and may include a microwave semiconductor integrated circuit, a microwave oscillator, a microwave frequency synthesizer, a microwave frequency converter, a microwave amplifier, a microwave receiver, and the like.
The embodiment is provided with the plurality of processors, so that synchronous execution of different monitoring processes can be realized, the testing efficiency of the microwave semiconductor device or the microwave semiconductor integrated circuit is improved, and the testing accuracy of the testing system is improved. In the embodiment, the microwave semiconductor device or the microwave semiconductor integrated circuit with the functions of multi-processor, core gateway and information interaction is used for multi-function and multi-state measurement and control, so that the microwave semiconductor device tester or the equipment using the test system has the comprehensive capability of realizing integration with the production line application including the multi-function cooperative work and the quick response of scenes such as automatic loading and unloading, environmental stress application, production line state control, information interaction and the like of the production line while realizing the test function, the bottleneck problems of single application function, low comprehensive application response efficiency and the like caused by the adoption of a traditional single-processor mode measurement and control framework are solved, and the test effect is effectively improved, so that the comprehensive efficiency of the test and the application is greatly improved.
The system further comprises a clock and synchronization unit, wherein the clock and synchronization unit is respectively connected with the central processing unit, the gateway and the auxiliary processors and is used for providing a unified reference clock signal and compensating delayed synchronization and trigger signals, so that accurate synchronous cooperative work of an internal circuit of the test system and quick real-time response to peripheral interaction and control are realized.
In some embodiments, the state monitoring processor: the device is configured to obtain real-time state monitoring data of microwave semiconductor device testing equipment such as a tester, and realize real-time adjustment or fault response of the testing equipment according to the monitoring data.
Optionally, the state monitoring data information of the microwave semiconductor device testing equipment includes equipment function self-checking or fault information, and temperature, humidity, vibration and working state information of key parts or circuit nodes for realizing the testing function in the equipment.
Further, the state monitoring processor is also configured to transmit the state monitoring data information of the microwave semiconductor device testing equipment to the central processor through the gateway.
Optionally, the real-time adjustment or fault response of the test device by the detection data of the state monitoring processor may specifically be: the method comprises the steps of judging whether the running state is normal or not according to real-time state monitoring data of running of the testing equipment, controlling the testing equipment in a corresponding state according to a judgment result to enable the running state to be kept normal, sending monitoring data information of the corresponding state to a central processing unit to finish performance testing of the microwave semiconductor device, and timely performing shutdown response operation of high-priority safety protection and sending fault information to the central processing unit for processing when a fault which cannot be recovered through adjustment occurs.
In some embodiments, the test equipment is provided with a plurality of sensing and response functional units, the state monitoring processor is connected to each sensing and response functional unit, and the sensing and response functional units can be divided according to functions and include a temperature/humidity sensing and response functional circuit, a vibration sensing and response functional circuit, and a working state sensing and response functional circuit. The sensing and responding functional unit is used for acquiring information such as temperature, humidity, vibration and working voltage of key parts or key circuit nodes in the test equipment in real time.
Optionally, the key part or key circuit node in the test equipment may include a microwave signal generating circuit, a microwave signal receiving circuit, a microwave signal splitting/routing, a clamp or a carrier plate of the microwave semiconductor device to be tested, a clock synchronization and trigger circuit, and the like in the microwave semiconductor device test equipment.
Temperature/humidity sensing and response function circuit: the microwave semiconductor device testing equipment takes a tester as an example, can sense and monitor the temperature and humidity states of functional circuits such as microwave signal generation, microwave signal reception, microwave signal separation/routing, a clamp/carrier plate of a microwave semiconductor device to be tested, clock synchronization and triggering and the like in the microwave semiconductor device tester in real time, start a loop control circuit of the tester to carry out fine adjustment according to a state monitoring result, timely carry out shutdown response operation of high-priority security protection when a fault which cannot be recovered through adjustment occurs, and send fault information to a central processing unit for processing through a state monitoring processor;
vibration sensing and response function circuit: the device can be used for sensing and monitoring the vibration states of functional circuits such as microwave signal generation, microwave signal reception, microwave signal separation/routing, clamps/carrier plates of microwave semiconductor devices to be tested, clock synchronization and triggering and the like in a microwave semiconductor device tester in real time, and timely sending state or fault information to a central processing unit for processing through a state monitoring processor according to a state monitoring result.
The working state sensing and response function circuit comprises: the voltage state of the self-checking node in the functional circuits such as microwave signal generation, microwave signal receiving, microwave signal separation/routing, a clamp/carrier plate of a microwave semiconductor device to be tested, clock synchronization and triggering and the like in the microwave semiconductor device tester can be sensed and monitored in real time, and the state or fault information is sent to the central processing unit for processing through the state monitoring processor in time according to the state monitoring result.
Optionally, the production line interaction processor is configured to acquire production line station state information, and cooperate with auxiliary equipment on the production line to implement response control of the auxiliary equipment, and acquire operation state data of the auxiliary equipment.
Specifically, the production line station state information may include process capability state information of the station/process, task work information of the station/process, and task flow state information of the current station/process.
The auxiliary equipment on the production line comprises a mechanical arm, a sorting machine, a probe station and environmental test equipment, and response control on the auxiliary equipment comprises production line state control such as automatic feeding and discharging, automatic loading and unloading of devices, environmental stress application and the like. The operation state data of the auxiliary equipment includes an action state, real-time power consumption, an action object, and the like of the auxiliary equipment at each time.
Optionally, the scene interaction information of the production line includes: state sensing monitoring data information and corresponding control information of auxiliary equipment adapting to application requirements of a microwave semiconductor device or a microwave semiconductor integrated circuit test production line, such as accurate motion and positioning sensing and control information of a mechanical arm, accurate motion and positioning sensing and control information of a sorting machine/probe station, environmental stress sensing and control information provided by environmental test equipment and the like; the state information of the production line station, such as the process capability state information of the current station/procedure, the task work information of the current station/procedure, the task flow state information of the current station/procedure, etc.
Specifically, produce line interaction treater: the system is configured to monitor and judge whether the running state of the auxiliary equipment is normal or not in real time and meet the requirements of test application, control the auxiliary equipment to keep the running state or adjust the running state to a normal running state according to the judgment result, and send corresponding monitoring data information, state information of the station of the production line and the like to the central processing unit.
The production line interaction processor monitors the auxiliary equipment to realize the performance test of the microwave semiconductor device and the station/process flow task of the mass production test application process, and when the fault which cannot be recovered through adjustment occurs, the production line interaction processor timely makes a shutdown response operation of high-priority safety protection and sends fault information to the central processing unit for processing.
For the mechanical arm of the auxiliary equipment, the production line interaction processor is used for monitoring and controlling the multi-axis rotation motion of the mechanical arm until the mechanical arm is accurately positioned at a required position according to the terminal pose state of the mechanical arm, so that the microwave semiconductor device to be tested is accurately and directly connected with and tested by the testing end.
For a sorting machine/probe station, a production line interactive processor monitors the state of the sorting machine/probe station, and controls probe parts such as probes, chucks and the like connected to a microwave semiconductor device tester to be accurately positioned at test pins of microwave semiconductor devices to be tested for accurate direct connection and test.
For the environment test equipment, the environment test equipment can provide different environment stress conditions required by the test, including test temperature, humidity, vibration, electromagnetism and the like, the production line interaction processor monitors the state of the environment test equipment, and the environment test equipment is controlled to provide the required environment stress conditions according to the test requirements of the semiconductor device to be tested, so that the corresponding performance test and more complete performance evaluation are realized;
the communication gateway is a communication core for realizing data transmission and interaction among the multiple processors, realizes communication connection between the central processing unit and the state monitoring processing and production line interaction processors, and supports completion of cooperative response of the multiple processors.
In some embodiments, the central processing unit is configured to directly control the testing process to obtain the performance test result, and the central processing unit is respectively connected to the functional circuit units in the testing device, and the plurality of functional circuit units are connected to each other.
Optionally, the functional circuit units 1 and 2 … … N are key parts or key circuit nodes in a test apparatus configured to implement performance testing of a microwave semiconductor device or a microwave semiconductor integrated circuit, and may include functional circuit units such as generation of microwave signals of each channel, reception of microwave signals of each channel, separation/routing of microwave signals of each channel, a fixture/carrier board of the microwave semiconductor device to be tested, clock synchronization, and triggering.
The central processing unit uniformly coordinates and controls each functional circuit unit to realize the test application functions of microwave electrical property multi-parameter test such as microwave test excitation signals, power/frequency spectrum/network/frequency/noise and the like, multi-channel parallel test, test synchronization based on triggering, time sequence control and the like, and controls the corresponding functional circuit unit to perform the corresponding test process according to the test requirements of the test scale, the performance parameters and the like of the microwave semiconductor device to be tested.
Optionally, to implement the parallel interaction of the multiple processors, the central processing unit may perform data information interaction related to the test process in a time-sharing manner with the state monitoring processor and the production line interaction processor while performing the test process.
Specifically, the data related to the test process in this embodiment includes: the performance test result of the microwave semiconductor device, and the multi-dimensional multi-element information such as the instrument state, the environmental stress state, the production line station state and the like corresponding to the performance test result in the test process.
It will be appreciated that a power supply unit is also included to provide power for the operation of the various circuit units and processors in the system.
The working process of the fusion measurement and control system is as follows:
and the central processor receives data information related to the test application from the state monitoring processor, the production line interaction processor and the test application in a time-sharing manner through the core gateway and realizes interaction so as to carry out comprehensive management.
When a microwave semiconductor device or a microwave semiconductor integrated circuit is subjected to performance test, firstly, a production line interaction processor sends current production line station state information including process capability state information of a current station/procedure, task work information of the current station/procedure, task circulation state information of the current station/procedure and the like to a central processing unit, and the central processing unit generates a test evaluation program package including a corresponding process state according to the task circulation state information and the task work information; secondly, executing a test evaluation program, sending control information aiming at the auxiliary equipment required by the test to a production line interaction processor by the central processing unit, autonomously monitoring and sensing the state and controlling the auxiliary equipment in real time by the production line interaction processor under the environment of a real-time operating system, and sending the state information of the auxiliary equipment to the central processing unit for subsequent processing; synchronously, the central processing unit sends a requirement for providing self state information of test equipment for testing the microwave semiconductor device to the state monitoring processor, autonomously carries out state monitoring sensing and real-time control on the microwave semiconductor device test equipment under the environment of a real-time operating system through the state monitoring processor, and feeds back the state information to the central processing unit so as to facilitate the subsequent processing of the central processing unit; when the microwave semiconductor device tester is in a normal state, the central processing unit controls the microwave semiconductor device tester to perform performance test on the microwave semiconductor device, synchronously obtains and records test results, receives instrument state data, based on accurate triggering and synchronization and provided with time stamps, of the state monitoring processor, receives auxiliary equipment state data, based on accurate triggering and synchronization and provided with time stamps, of the production line interaction processor, and establishes a mapping relation according to synchronization time to form a complete test evaluation result with a certain quantity scale.
When a fault state occurs, the state monitoring processor and the production line interaction processor firstly carry out autonomous adjustment, and when a fault which cannot be recovered through adjustment occurs, a high-priority shutdown response operation is timely carried out and fault information is sent to the central processing unit for processing until the fault is eliminated and testing is continuously carried out;
when the test is finished, the central processing unit sends the information of the test completion to the state monitoring processor and the production line interaction processor so as to enable the state monitoring processor to be switched into a standby state, the production line interaction processor updates the task flow state of the current station/procedure, and controls whether to send the information to the central processing unit to start the next test task according to the work of the current task.
Example 2
The embodiment provides a method for measuring and controlling the fusion of multiple processors of a microwave semiconductor device, which can be implemented in the central processing unit of embodiment 1, and comprises the following steps:
step 1, a central processing unit respectively sends test instructions aiming at test equipment and auxiliary equipment on a production line; and if the test result of the equipment meets the test requirement of the microwave semiconductor device to be tested, executing the next step.
Step 2, the central processing unit controls the microwave semiconductor device test equipment to carry out performance test on the microwave semiconductor device to be tested;
acquiring test equipment state monitoring data sent by a state monitoring processor in a time-sharing manner, and an environment state and a production line running state sent by a production line interaction processor;
and 3, establishing a performance test result and a mapping relation between the performance test result and the corresponding test equipment state, the environment state and the production line running state according to time synchronization, and taking the mapping relation as a final test result.
And judging whether the performance of the device to be tested is qualified according to the test result, and simultaneously determining whether the test result is obtained in the state that the test equipment is normal and the production line equipment is normal, thereby obtaining a relatively comprehensive test result.
In step 1, the equipment state detection step performed before the device to be tested is tested may specifically be as follows:
step 11, a central processing unit acquires production line station state information of a production line collected by a production line interaction processor, and generates a test evaluation program for auxiliary equipment on the production line;
the production line station state information comprises process capability state information of a current station/procedure, task work information of the current station/procedure and task flow state information of the current station/procedure, and the central processing unit generates a test evaluation program package containing a corresponding process state according to the task flow state information and the task work information. Optionally, the test evaluation program includes control information for auxiliary devices such as a mechanical arm, a sorting machine, a probe station, an environmental test device, and the like, and the production line interaction processor autonomously performs state monitoring sensing and real-time control on the auxiliary devices in a real-time operating system environment, and acquires running state information of the devices.
Step 12, the central processing unit sends a test evaluation program to the production line interaction processor, so that the production line interaction processor evaluates the state of the auxiliary equipment according to the test evaluation program to obtain evaluation state information of the auxiliary equipment; the evaluation state information comprises normal state information provided when normal and fault information reported when fault occurs.
And step 13, the central processing unit sends a device self-checking instruction for the test device to the state monitoring processor, so that the state monitoring processor performs state monitoring sensing and real-time control on the test device according to the device self-checking instruction, and feedback state information of the test device is obtained.
And step 14, according to the test requirements of the microwave semiconductor device to be tested, combining the evaluation state information of the auxiliary equipment and the feedback state information of the test equipment, and judging whether the current equipment state meets the test requirements.
Further, the method comprises the following steps of detecting that the testing equipment or the auxiliary equipment of the production line fails in the step 1 and the step 2, or the environment state does not meet the testing requirements, and controlling and adjusting the testing equipment and the auxiliary equipment of the production line: the central processing unit acquires the fault data of the test equipment sent by the state monitoring processor or the fault data of the auxiliary equipment sent by the production line interaction processor, and sends alarm information or a fault removal program according to the fault type.
When a fault state occurs, the state monitoring processor and the production line interaction processor can firstly carry out autonomous adjustment, and when a fault which cannot be recovered through adjustment occurs, a shutdown response operation of high-priority safety protection is timely carried out, and fault information is sent to the central processing unit to process the fault.
When the test is finished, the central processing unit sends the information of the current test completion to the state monitoring processor and the production line interaction processor, and the state monitoring processor is switched into a standby state; and the production line interaction processor updates the task flow state of the current station/process, and controls whether to send information to the central processing unit to start the next test task according to the current task work.
In step 2, the central processing unit receives the state monitoring data of the testing equipment based on accurate triggering and synchronization and with a timestamp in a time-sharing manner, and the central processing unit receives the environment state and the production line running state of the production line interaction processor based on accurate triggering and synchronization and with a timestamp in a time-sharing manner;
and 3, establishing a performance test result and a mapping relation with the corresponding test equipment state, the environment state and the production line running state according to time synchronization, namely establishing a one-to-one correspondence relation of the information at the same time according to the timestamp.
In the process of testing the performance of the microwave semiconductor device to be tested by the test equipment, the state monitoring processor simultaneously executes the following steps:
step 21, sensing and controlling the state of the test environment of the microwave semiconductor device; sending test equipment state monitoring data based on accurate triggering and synchronization and provided with a timestamp to a central processing unit;
step 22, judging whether the running state of the microwave semiconductor device testing equipment is normal or not according to the state monitoring data;
and step 23, performing real-time control of autonomous adjustment or maintenance according to the autonomous determination result, and when a fault which cannot be recovered through adjustment occurs, performing shutdown response operation of high-priority security protection in time, and sending fault information to the central processing unit for processing.
In the test process of the test equipment for carrying out performance test on the microwave semiconductor device to be tested, the production line interaction processor simultaneously executes the following steps:
step 2-1: the production line interaction processor acquires production line station state information of the production line in real time and sends the production line station state information to the central processor, so that the central processor generates a test evaluation program containing a corresponding process state according to the production line station state information;
step 2-2: the production line interaction processor performs state monitoring sensing and real-time control on the auxiliary equipment according to a test evaluation program or autonomously; sending a production line environment state and a production line running state which are based on accurate triggering and synchronization and are provided with time stamps to a central processing unit;
step 2-3: autonomously judging whether the running state of the auxiliary equipment is normal or not according to the state monitoring data of the auxiliary equipment;
step 2-4: performing real-time control of autonomous adjustment or maintenance according to the autonomous determination result, when a fault which cannot be recovered through adjustment occurs, performing shutdown response operation of high-priority security protection in time, and sending fault information to a central processing unit for processing;
in the embodiment, in the process of controlling and executing the performance test by the central processing unit, the state monitoring processor executes control and state monitoring on the test equipment at the same time, the production line interaction processor executes control and state monitoring on the auxiliary equipment on the production line at the same time, the multiple processors work at the same time, and control and realize cooperative work of the system at the same time, and finally the central processing unit performs fusion processing to establish a mapping relation with information, so that comprehensive test data is obtained, the test efficiency is improved, and meanwhile, the consistency control level of product test can be improved.
Example 3
The embodiment provides a method for measuring and controlling the fusion of multiple processors of a microwave semiconductor device, which can be implemented in the state monitoring processor of the embodiment 1, and comprises the following steps:
step 1, sensing and controlling the state of a microwave semiconductor device test environment; sending test equipment state monitoring data based on accurate triggering and synchronization and provided with a timestamp to a central processing unit;
specifically, the state monitoring sensing and real-time control can be autonomously performed on the microwave semiconductor device test equipment under the real-time operating system environment;
step 2, judging whether the running state of the microwave semiconductor device testing equipment is normal or not according to the state monitoring data;
and 3, performing real-time control of autonomous adjustment or maintenance according to the autonomous judgment result, and when a fault which cannot be recovered through adjustment occurs, timely performing shutdown response operation of high-priority safety protection, and sending fault information to the central processing unit for processing.
Optionally, the state monitoring data of the microwave semiconductor device includes instrument state data information corresponding to a performance test result in a test process, function self-inspection or fault information of the microwave semiconductor device test equipment, information of temperature, humidity, vibration, working state and the like of each key part or circuit node inside the microwave semiconductor device, and corresponding fault state information and the like.
In the embodiment, the control and the state monitoring of the microwave semiconductor device testing equipment are realized by the state monitoring processor, and the control process can be executed simultaneously with the central processing unit, so that the monitoring of the testing equipment and the control of the testing process can be executed simultaneously.
Example 4
The embodiment provides a method for measuring and controlling the fusion of multiple processors of a microwave semiconductor device, which can be implemented in the production line interaction processor of the embodiment 1, and comprises the following steps:
step 1: the production line interaction processor acquires production line station state information of the production line in real time and sends the production line station state information to the central processor, so that the central processor generates a test evaluation program containing a corresponding process state according to the production line station state information;
optionally, the production line station state information includes process capability state information of the current station/process, task work information of the current station/process, and task flow state information of the current station/process, and the central processing unit generates a test evaluation package including a corresponding process state according to the task flow state information and the task work information. Optionally, the test evaluation program includes control information for auxiliary devices such as a mechanical arm, a sorting machine, a probe station, an environmental test device, and the like, and the production line interaction processor autonomously performs state monitoring sensing and real-time control on the auxiliary devices in a real-time operating system environment, and acquires running state information of the devices.
Step 2: the production line interaction processor performs state monitoring sensing and real-time control on the auxiliary equipment according to a test evaluation program or autonomously; sending a production line environment state and a production line running state which are based on accurate triggering and synchronization and are provided with time stamps to a central processing unit;
and step 3: autonomously judging whether the running state of the auxiliary equipment is normal or not according to the state monitoring data of the auxiliary equipment;
and 4, step 4: performing real-time control of autonomous adjustment or maintenance according to the autonomous determination result, when a fault which cannot be recovered through adjustment occurs, performing shutdown response operation of high-priority security protection in time, and sending fault information to a central processing unit for processing;
optionally, the production line interaction information data of the microwave semiconductor device includes state sensing monitoring data information and corresponding control information of auxiliary equipment, such as a mechanical arm, a sorting machine, a probe station, environment test equipment and the like, which meet the application requirements of a microwave semiconductor device test production line, such as accurate motion and positioning sensing and control information of the mechanical arm, accurate motion and positioning sensing and control information of the sorting machine/probe station, environment stress sensing and control information and the like provided by the environment test equipment; the state information of the production line station, such as the process capability state information of the current station/procedure, the task work information of the current station/procedure, the task flow state information of the current station/procedure, etc.
In the embodiment, the control and the state monitoring of the auxiliary equipment on the production line are realized through the production line interaction processor, the control process can be executed simultaneously with the central processing unit, and the monitoring of the auxiliary equipment on the auxiliary production line and the control of the test process can be executed simultaneously.
Example 5
The embodiment provides a microwave semiconductor device tester, which is characterized in that: the microwave semiconductor device multi-processor fusion measurement and control system as claimed in claim 1 is adopted.
The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure, and various modifications and changes may be made to the present disclosure by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present disclosure should be included in the protection scope of the present disclosure.
Although the present disclosure has been described with reference to specific embodiments, it should be understood that the scope of the present disclosure is not limited thereto, and those skilled in the art will appreciate that various modifications and changes can be made without departing from the spirit and scope of the present disclosure.
Claims (10)
1. The multi-processor fusion measurement and control system of the microwave semiconductor device is characterized in that: the system comprises a central processing unit, a gateway and a plurality of auxiliary processors, wherein the central processing unit is respectively in communication connection with the auxiliary processors through the gateway, and the auxiliary processors at least comprise a state monitoring processor for acquiring state monitoring data of test equipment in real time and a production line interaction processor for acquiring scene interaction information of a production line in real time;
a central processing unit: the method is configured to realize performance test control on the microwave semiconductor device, fuse state monitoring data information and production line scene interaction information, and obtain a test result containing a performance test result and a mapping relation with a corresponding test equipment state, an environment state and a production line running state.
2. The microwave semiconductor device multiprocessor fusion measurement and control system as claimed in claim 1, wherein the central processing unit performs data information interaction related to the test process while performing the test process and time-sharing with the state monitoring processor and the production line interaction processor;
alternatively, the state monitoring processor: the device is configured to obtain real-time state monitoring data of the microwave semiconductor device testing equipment, and realize real-time adjustment or fault response of the testing equipment according to the monitoring data.
3. The microwave semiconductor device multiprocessor fusion measurement and control system of claim 2, wherein: the state monitoring data information of the microwave semiconductor device testing equipment comprises equipment function self-checking or fault information, and temperature, humidity, vibration and working state information of key parts or circuit nodes for realizing the testing function in the equipment.
4. The microwave semiconductor device multiprocessor fusion measurement and control system of claim 2, wherein: the test equipment is characterized in that a plurality of sensing and response function units are arranged in the test equipment, the state monitoring processor is respectively connected with each sensing and response function unit, and each sensing and response function unit comprises a temperature/humidity sensing and response function circuit, a vibration sensing and response function circuit and a working state sensing and response function circuit which are respectively used for testing the temperature, humidity, vibration and working state information of key parts or circuit nodes for realizing the test function in the test equipment.
5. The microwave semiconductor device multiprocessor fusion measurement and control system of claim 4, wherein: the key part or key circuit node in the test equipment comprises a microwave signal generating circuit, a microwave signal receiving circuit, a microwave signal separating or routing circuit, a clamp or a carrier plate of the microwave semiconductor device to be tested or/and a clock synchronization and trigger circuit in the microwave semiconductor device test equipment.
6. The microwave semiconductor device multiprocessor fusion measurement and control system of claim 1, wherein: the production line interaction processor is configured to acquire production line station state information, and is cooperated with auxiliary equipment on a production line to realize response control of the auxiliary equipment and acquire running state data of the auxiliary equipment;
or the auxiliary equipment on the production line comprises a mechanical arm, a sorting machine, a probe station and environmental test equipment, and the response control on the auxiliary equipment comprises automatic feeding and discharging of the production line, automatic loading and unloading of devices and environmental stress application; the operation state data of the auxiliary equipment comprises the action state, the real-time power consumption and an action object of the auxiliary equipment at each moment;
the clock and synchronization unit is respectively connected with the central processing unit, the gateway and the auxiliary processors and is used for providing a uniform reference clock signal and compensating delayed synchronization and trigger signals.
7. The method for measuring and controlling the fusion of the multiple processors of the microwave semiconductor device is characterized by comprising the following steps of:
respectively sending test instructions aiming at the test equipment and the auxiliary equipment on the production line, and obtaining test results of the test equipment and the auxiliary equipment according to the test instructions;
when the test meets the requirement, controlling the test equipment to carry out performance test on the microwave semiconductor device to be tested;
acquiring test equipment state monitoring data sent by a state monitoring processor in a time-sharing manner, and an environment state and a production line running state sent by a production line interaction processor;
and establishing a performance test result and a mapping relation between the performance test result and the corresponding test equipment state, the environment state and the production line running state according to time synchronization, and taking the mapping relation as a final test result.
8. The method for measuring and controlling the fusion of the multiple processors of the microwave semiconductor device is characterized by comprising the following steps of:
sensing and controlling the state of the microwave semiconductor device test environment; sending test equipment state monitoring data based on accurate triggering and synchronization and provided with a timestamp to a central processing unit;
judging whether the running state of the microwave semiconductor device testing equipment is normal or not according to the state monitoring data;
and performing real-time control of autonomous adjustment or maintenance according to the autonomous determination result, and when a fault which cannot be recovered through adjustment occurs, performing shutdown response operation and sending fault information to the central processing unit for processing.
9. The method for measuring and controlling the fusion of the multiple processors of the microwave semiconductor device is characterized by comprising the following steps of:
acquiring production line station state information of a production line in real time and sending the production line station state information to a central processor, so that the central processor generates a test evaluation program containing a corresponding process state according to the production line station state information;
performing state monitoring sensing and real-time control on the auxiliary equipment according to a test evaluation program or autonomously; sending a production line environment state and a production line running state which are based on accurate triggering and synchronization and are provided with time stamps to a central processing unit;
autonomously judging whether the running state of the auxiliary equipment is normal or not according to the state monitoring data of the auxiliary equipment;
and performing real-time control of autonomous adjustment or maintenance according to the autonomous determination result, and when a fault which cannot be recovered through adjustment occurs, performing shutdown response operation and sending fault information to the central processing unit for processing.
10. Microwave semiconductor device tester, characterized by: a multi-processor fusion instrumentation system using the microwave semiconductor device claimed in any one of claims 1 to 6.
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