CN111741607B - Method for compositely integrating reduced graphene oxide high-sensitivity sensing circuit and latex - Google Patents

Method for compositely integrating reduced graphene oxide high-sensitivity sensing circuit and latex Download PDF

Info

Publication number
CN111741607B
CN111741607B CN202010564621.8A CN202010564621A CN111741607B CN 111741607 B CN111741607 B CN 111741607B CN 202010564621 A CN202010564621 A CN 202010564621A CN 111741607 B CN111741607 B CN 111741607B
Authority
CN
China
Prior art keywords
graphene oxide
reduced graphene
latex
copper foil
sensing circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202010564621.8A
Other languages
Chinese (zh)
Other versions
CN111741607A (en
Inventor
张柏华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Liaoning Gelaifeier Health Technology Co ltd
Original Assignee
Liaoning Gelaifeier Health Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Liaoning Gelaifeier Health Technology Co ltd filed Critical Liaoning Gelaifeier Health Technology Co ltd
Priority to CN202010564621.8A priority Critical patent/CN111741607B/en
Publication of CN111741607A publication Critical patent/CN111741607A/en
Application granted granted Critical
Publication of CN111741607B publication Critical patent/CN111741607B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/007Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0147Carriers and holders
    • H05K2203/0152Temporary metallic carrier, e.g. for transferring material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107Using laser light

Abstract

The invention relates to the field of material integration and sensors, in particular to a method for compositely integrating a reduced graphene oxide high-sensitivity sensing circuit and latex. First, a pure copper foil is repeatedly dipped in an aqueous graphene oxide solution, dried, and reduced. And carrying out laser etching on the copper foil attached with the reduced graphene oxide film to form a required circuit. Then, the copper foil was put into the natural latex, and dipping and drying were repeatedly performed. And (3) placing the copper foil circuit loaded with the reduced graphene oxide into an etching solution, statically dissolving the copper foil, and introducing a water-insoluble organic solvent into the bottom of the etching solution to form an organic phase layer to lift the transparent reduced graphene oxide circuit film. And (4) discharging the etching liquid from the bottom, and repeatedly discharging and replacing the cleaning liquid from the bottom for replacement and cleaning. And finally, introducing natural latex, repeatedly dipping and drying to form composite integration of the graphene circuit and the latex, and realizing lossless integration of the graphene high-sensitivity sensing circuit in a latex polymer film.

Description

Method for compositely integrating reduced graphene oxide high-sensitivity sensing circuit and latex
Technical Field
The invention relates to the field of material integration and sensors, in particular to a method for compositely integrating a reduced graphene oxide high-sensitivity sensing circuit and latex.
Background
The products such as gloves, condoms, medical rubber tubes and the like in the latex products have the advantages of softness, skin affinity, biological safety and the like. The products are easy to contact with bacteria and viruses, and how to realize intelligent detection of the viruses or the bacteria on the products and realize biosensing self-checking functions of the products is a significant development direction.
Graphene oxide can be easily attached to a metal surface due to the abundant functional groups on the surface. After the graphene oxide is reduced, the graphene oxide has good conductivity. As a two-dimensional material, the reduced graphene oxide can realize high-sensitivity integration when being compounded with latex to manufacture a biosensor. However, how to completely transfer the reduced graphene oxide nano film to the latex film and package the reduced graphene oxide nano film by the latex film is an unexplored process, and the invention is an important breakthrough to the process.
Disclosure of Invention
The invention aims to provide a method for compounding and integrating a reduced graphene oxide high-sensitivity sensing circuit and latex, wherein the obtained compound latex does not contain metal components, is only the circuit integration of high-molecular polymer latex and pure carbon, and the reduced graphene oxide high-sensitivity sensing circuit and latex compound product has the characteristics of ultrathin thickness, high sensitivity, high biological safety and the like.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method for compositely integrating a reduced graphene oxide high-sensitivity sensing circuit and latex comprises the following steps:
(1) dipping pure copper foil in a graphene oxide aqueous solution, lifting, drying, reducing, forming a reduced graphene oxide film on the surface of the copper foil, and carrying out laser etching on the copper foil attached with the reduced graphene oxide film to form a required circuit;
(2) putting the copper foil attached with the reduced graphene oxide film after laser etching into natural latex, dipping, lifting and drying;
(3) placing the copper foil circuit loaded with the reduced graphene oxide into an etching solution, statically dissolving the copper foil, and introducing a water-insoluble organic solvent from the bottom of a container containing the etching solution to form an organic phase layer with the thickness of 0.5-30 mm to lift up a transparent reduced graphene oxide circuit film;
(4) discharging the etching solution from the bottom of the container, charging and discharging the cleaning solution from the bottom of the container, and repeatedly performing replacement cleaning to form a membrane material;
(5) and introducing natural latex into the container, lifting the membrane material and drying to form the composite integration of the graphene circuit and the latex.
The method for compounding and integrating the reduced graphene oxide high-sensitivity sensing circuit and the latex comprises the step (1), dipping and lifting → drying → repeating the reduction process for 2-30 times, wherein the thickness of the reduced graphene oxide film is 0.5-20 mu m.
According to the method for compositely integrating the reduced graphene oxide high-sensitivity sensing circuit and the latex, in the step (1), the mass concentration of the used graphene oxide aqueous solution is 0.0001-0.001%.
In the method for compositely integrating the reduced graphene oxide high-sensitivity sensing circuit and the latex, in the step (1), a chemical reducing agent is used for reducing the graphene oxide, the chemical reducing agent is an aqueous solution of one or more than two of formaldehyde, hydroiodic acid and zinc acetate, and the mass concentration of the chemical reducing agent is 20-80%.
The method for compounding and integrating the reduced graphene oxide high-sensitivity sensing circuit and the latex comprises the step (1) that the reduction temperature is 50-120 ℃ and the reduction time is 5-120 minutes.
According to the method for compounding and integrating the reduced graphene oxide high-sensitivity sensing circuit and the latex, in the step (2), dipping and lifting → drying processes are repeated for 2-10 times, and the thickness of a natural latex layer is 5-50 microns.
In the method for compositely integrating the reduced graphene oxide high-sensitivity sensing circuit and the latex, in the step (3), the copper foil etching solution comprises the following components in percentage by mass: 25-35% of ferric chloride, 0.5-2% of disodium bicarbonate, 1-2% of ammonium persulfate, 15-25% of ethanol and the balance of water.
According to the method for compounding and integrating the reduced graphene oxide high-sensitivity sensing circuit and the latex, in the step (3), an organic solvent is one or a mixture of more than two of alkane with normal C16-21.
In the method for compositely integrating the reduced graphene oxide high-sensitivity sensing circuit and the latex, in the step (4), the replaced cleaning solution comprises the following components in percentage by mass: ethanol 20-40%, ether 5-20%, acetone 15-40%, and water in balance, and the replacement and cleaning are repeated for 2-10 times.
According to the method for compounding and integrating the reduced graphene oxide high-sensitivity sensing circuit and the latex, in the step (5), a membrane material is dipped and lifted → the drying process is repeated for 2-10 times, and the thickness of a natural latex layer is 5-50 microns.
The design idea of the invention is as follows:
the rich functional groups on the surface of the graphene oxide can be tightly attached to the copper foil. After reduction, the conductive and flexible alloy has good conductivity and flexibility. The reduced graphene oxide film can be well attached to the flexible latex film, and the reduced graphene oxide film is suitable for being processed into a circuit by laser etching. Meanwhile, the reduced graphene oxide has biological safety, and biochemical substances are stable on the surface of the membrane. The stable biological flexible sensing film device with high conductivity and high sensitivity can be prepared by compounding the reduced graphene oxide circuit and latex.
Compared with the prior art, the invention has the advantages and beneficial effects that:
1. the film material compositely integrated by the reduced graphene oxide high-sensitivity sensing circuit and the latex has small resistance and high sensitivity, and the overall resistance is 1-8 omega.
2. The thickness of the film compositely integrated by the reduced graphene oxide high-sensitivity sensing circuit and the latex can be very thin, the thinnest overall thickness can reach 10.5 mu m, and the film can be repeatedly folded without foreign body sensation.
3. The film compositely integrated by the reduced graphene oxide high-sensitivity sensing circuit and the latex can be repeatedly rolled and folded for at least more than 200 times without damage, the resistance value basically keeps stable, and the change is +/-3 omega.
Drawings
FIG. 1 is a schematic diagram of the overall appearance and partial longitudinal section of a latex condom with a reduced graphene oxide circuit integrated therein.
In the figure, 1, a condom; 2. a reduced graphene oxide circuit integrated in the interlayer; 3. inner and outer emulsion layers.
FIG. 2 is a schematic diagram of the overall appearance and partial longitudinal section of a latex glove with a reduced graphene oxide circuit integrated therein.
In the figure, 2. reduced graphene oxide circuits integrated in the interlayer; 3. an inner and outer latex layer; 4. latex gloves.
Detailed Description
In the specific implementation process, firstly, pure copper foil is dipped and extracted once in the graphene oxide aqueous solution and dried, then reduction is carried out, and the dipping and reduction operations are repeated for several times. And carrying out laser etching on the copper foil attached with the reduced graphene oxide film to form a required circuit. Then, the copper foil is put into the natural latex to dip and extract for one time, and the drying is repeated for several times, and the effects are as follows: and compounding latex on one surface of the graphene membrane to form a membrane surface supporting substrate. The copper foil circuit carrying the reduced graphene oxide is placed in an etching solution, after the copper foil is statically dissolved, a water-insoluble organic solvent is slowly introduced from the bottom of a container containing the etching solution, an organic phase layer with a certain thickness is formed to lift a transparent reduced graphene oxide circuit film, and the organic phase layer plays a role of: the liquid phase lifts the fragile graphene composite membrane surface, so that no folds or damages are generated. Slowly release the etching solution from the container bottom, organic phase layer remains, fills the displacement washing liquid from the container bottom again and fills and to replace and wash, and its effect is: the water-insoluble organic phase is effectively diluted and cleaned by successively using an organic mixed solvent which can be dissolved in the characteristics of the organic phase and the water phase, and the subsequent addition of the water-based latex is facilitated to form the compounding and lifting of the membrane material. Finally, the natural latex is filled into the container, and then the membrane material is lifted and dried. And repeating the steps for several times to form the composite integration of the graphene circuit and the latex. The method can realize the lossless integration of the graphene high-sensitivity sensing circuit in the latex polymer film.
The present invention will be described in further detail with reference to examples and test results.
Example 1
In this embodiment, a method for compositely integrating a reduced graphene oxide high-sensitivity sensing circuit with latex includes:
firstly, a pure copper foil is dipped in a graphene oxide aqueous solution with the mass concentration of 0.0005%, lifted and dried once, and then reduced in a mixed aqueous solution of zinc acetate and hydriodic acid (the mass ratio of the zinc acetate to the hydriodic acid is 1: 1) at the temperature of 60 ℃ for 20 minutes, wherein the mass concentration of the mixed aqueous solution is 80%, the dipping, lifting, drying and reducing operations are repeatedly carried out for 5 times, and the thickness of a reduced graphene oxide film is 5 micrometers. And carrying out laser etching on the copper foil attached with the reduced graphene oxide film to form a required circuit. Then, the copper foil was dipped in the natural latex, dried once, and then repeated 3 times, and the thickness of the natural latex layer was 15 μm. Placing the copper foil circuit loaded with the reduced graphene oxide into a copper foil etching solution to statically dissolve the copper foil, wherein the etching solution comprises the following components in percentage by mass: 35% of ferric chloride, 1% of disodium hydrogen carbonate, 1% of ammonium persulfate, 40% of water and 23% of ethanol. Then, a water-insoluble organic solvent is slowly introduced from the bottom of the container for containing the etching solution to form an organic phase layer with the thickness of 25mm to lift up the transparent reduced graphene oxide circuit film. The organic solvent is a mixed solution of n-hexadecane hydrocarbon and n-eicosane hydrocarbon according to the volume ratio of 1: 1. Then, the etching solution was slowly drained from the bottom of the container, and the cleaning solution was repeatedly filled and drained from the bottom of the container to perform the replacement cleaning 3 times. The displacement cleaning solution comprises the following components: 20% of ethanol, 10% of diethyl ether, 20% of acetone and 50% of water. And finally, introducing natural latex into the container, lifting the membrane material and drying. And repeating the steps for 3 times to form the composite integration of the graphene circuit and the latex, wherein the thickness of the natural latex layer is 15 microns. In the preparation process, a polyurethane adhesive film sealing end is reserved and used as an external lead interface of the graphene high-sensitivity sensing circuit.
As shown in fig. 1, the reduced graphene oxide circuit is integrated into the overall appearance of the latex condom, and the condom 1 is formed by compounding an inner and outer latex layer 3 and a reduced graphene oxide circuit 2 integrated in an interlayer.
The test results are: the intelligent membrane resistance of the graphene high-sensitivity sensing circuit and latex composite integration is less than 2 omega, and the thickness is 35 mu m. The film is not damaged after being repeatedly rolled and folded for 200 times, and the resistance value is less than 3 omega.
Example 2
In this embodiment, a method for compositely integrating a reduced graphene oxide high-sensitivity sensing circuit with latex includes:
firstly, a pure copper foil is dipped in a graphene oxide aqueous solution with the mass concentration of 0.0002% and is lifted and dried once, then the pure copper foil is reduced in a mixed aqueous solution of zinc acetate and hydriodic acid (the mass ratio of the zinc acetate to the hydriodic acid is 1: 1) at the temperature of 50 ℃ for 40 minutes, the mass concentration of the mixed aqueous solution is 20%, the dipping, lifting, drying and reducing operations are repeatedly carried out for 2 times, and the thickness of a reduced graphene oxide film is 1 mu m. And carrying out laser etching on the copper foil attached with the reduced graphene oxide film to form a required circuit. Then, the copper foil was dipped in the natural latex, dried once, and then repeated 2 times, and the thickness of the natural latex layer was 7 μm. Placing the copper foil circuit loaded with the reduced graphene oxide into a copper foil etching solution to statically dissolve the copper foil, wherein the etching solution comprises the following components in percentage by mass: 25% of ferric chloride, 2% of disodium hydrogen carbonate, 2% of ammonium persulfate, 55% of water and 16% of ethanol. Then, a water-insoluble organic solvent is slowly introduced from the bottom of the container for containing the etching solution to form an organic phase layer with the thickness of 20mm to lift up the transparent reduced graphene oxide circuit film. The organic solvent is a mixed solution of n-hexadecane hydrocarbon and n-eicosane hydrocarbon according to the volume ratio of 1: 1. Then, the etching solution was slowly drained from the bottom of the container, and the cleaning solution was repeatedly filled and drained from the bottom of the container to perform the replacement cleaning 8 times. The displacement cleaning solution comprises the following components: 30% of ethanol, 20% of diethyl ether, 20% of acetone and 30% of water. And finally, introducing natural latex into the container, lifting the membrane material and drying. And repeating the steps for 3 times to form the composite integration of the graphene circuit and the latex, wherein the thickness of the natural latex layer is 7 microns. In the preparation process, a polyurethane adhesive film sealing end is reserved and used as an external lead interface of the graphene high-sensitivity sensing circuit.
As shown in fig. 1, the reduced graphene oxide circuit is integrated into the overall appearance of the latex condom, and the condom 1 is formed by compounding an inner and outer latex layer 3 and a reduced graphene oxide circuit 2 integrated in an interlayer.
The test results are: the intelligent membrane resistance of the graphene high-sensitivity sensing circuit and latex composite integration is less than 2 omega, and the thickness is 15 mu m. The film is not damaged after being repeatedly rolled and folded for 200 times, and the resistance value is less than 3 omega.
Example 3
In this embodiment, a method for compositely integrating a reduced graphene oxide high-sensitivity sensing circuit with latex includes:
firstly, a pure copper foil is dipped in a graphene oxide aqueous solution with the mass concentration of 0.001%, lifted and dried once, and then is reduced in a mixed aqueous solution of formaldehyde and hydroiodic acid (the mass ratio of the formaldehyde to the hydroiodic acid is 1: 1) at the temperature of 55 ℃ for 30 minutes, the mass concentration of the mixed aqueous solution is 60%, the dipping, lifting, drying and reducing operations are repeatedly carried out for 4 times, and the thickness of a reduced graphene oxide film is 6 mu m. And carrying out laser etching on the copper foil attached with the reduced graphene oxide film to form a required circuit. Then, the copper foil was dipped in the natural latex, dried once, and then repeated 3 times, and the thickness of the natural latex layer was 15 μm. Placing the copper foil circuit loaded with the reduced graphene oxide into a copper foil etching solution to statically dissolve the copper foil, wherein the etching solution comprises the following components in percentage by mass: 35% of ferric chloride, 1% of disodium hydrogen carbonate, 2% of ammonium persulfate, 45% of water and 17% of ethanol. Then, a water-insoluble organic solvent is slowly introduced from the bottom of the container for containing the etching solution to form an organic phase layer with the thickness of 30mm to lift up the transparent reduced graphene oxide circuit film. The organic solvent is a mixed solution of n-hexadecane hydrocarbon and n-eicosane hydrocarbon according to the volume ratio of 1: 1. Then, the etching solution was slowly drained from the bottom of the container, and the cleaning solution was repeatedly filled and drained from the bottom of the container to perform the replacement cleaning 3 times. The displacement cleaning solution comprises the following components: 25% of ethanol, 15% of diethyl ether, 15% of acetone and 45% of water. And finally, introducing natural latex into the container, lifting the membrane material and drying. And repeating the steps for 3 times to form the composite integration of the graphene circuit and the latex, wherein the thickness of the natural latex layer is 15 microns. In the preparation process, a polyurethane adhesive film sealing end is reserved and used as an external lead interface of the graphene high-sensitivity sensing circuit.
As shown in fig. 2, the reduced graphene oxide circuit is integrated into the overall shape of the latex glove, and the latex glove 4 is formed by compounding the inner and outer latex layers 3 and the reduced graphene oxide circuit 2 integrated in the interlayer.
The test results are: the intelligent membrane resistance of the graphene high-sensitivity sensing circuit and latex composite integration is less than 3 omega, and the thickness is 36 mu m. The film is not damaged after being repeatedly rolled and folded for 200 times, and the resistance value is less than 3 omega.
Example 4
In this embodiment, a method for compositely integrating a reduced graphene oxide high-sensitivity sensing circuit with latex includes:
firstly, a pure copper foil is dipped in a graphene oxide aqueous solution with the mass concentration of 0.0008% and is lifted and dried once, then the pure copper foil is reduced in a mixed aqueous solution of formaldehyde and hydroiodic acid (the mass ratio of the formaldehyde to the hydroiodic acid is 1: 1) at the temperature of 40 ℃ for 60 minutes, the mass concentration of the mixed aqueous solution is 40%, the dipping, lifting, drying and reducing operations are repeatedly carried out for 6 times, and the thickness of a reduced graphene oxide film is 10 microns. And carrying out laser etching on the copper foil attached with the reduced graphene oxide film to form a required circuit. Then, the copper foil was dipped in the natural latex, dried once, and then repeated 5 times, and the thickness of the natural latex layer was 30 μm. Placing the copper foil circuit loaded with the reduced graphene oxide into a copper foil etching solution to statically dissolve the copper foil, wherein the etching solution comprises the following components in percentage by mass: 30% of ferric chloride, 0.5% of disodium hydrogen carbonate, 1.5% of ammonium persulfate, 50% of water and 18% of ethanol. Then, a water-insoluble organic solvent is slowly introduced from the bottom of the container for containing the etching solution to form an organic phase layer with the thickness of 10mm to lift up the transparent reduced graphene oxide circuit film. The organic solvent is a mixed solution of n-hexadecane hydrocarbon and n-eicosane hydrocarbon according to the volume ratio of 1: 1. Then, the etching solution was slowly drained from the bottom of the container, and the cleaning solution was repeatedly filled and drained from the bottom of the container to perform the replacement cleaning 6 times. The displacement cleaning solution comprises the following components: 20% of ethanol, 10% of diethyl ether, 15% of acetone and 55% of water. And finally, introducing natural latex into the container, lifting the membrane material and drying. And repeating for 5 times to form composite integration of the graphene circuit and the latex, wherein the thickness of the natural latex layer is 30 microns. In the preparation process, a polyurethane adhesive film sealing end is reserved and used as an external lead interface of the graphene high-sensitivity sensing circuit.
As shown in fig. 2, the reduced graphene oxide circuit is integrated into the overall shape of the latex glove, and the latex glove 4 is formed by compounding the inner and outer latex layers 3 and the reduced graphene oxide circuit 2 integrated in the interlayer.
The test results are: the intelligent membrane resistance of the graphene high-sensitivity sensing circuit and latex composite integration is less than 3 omega, and the thickness is 70 mu m. The film is not damaged after being repeatedly rolled and folded for 200 times, and the resistance value is less than 3 omega.

Claims (10)

1. A method for compositely integrating a reduced graphene oxide high-sensitivity sensing circuit and latex is characterized by comprising the following steps:
(1) dipping pure copper foil in a graphene oxide aqueous solution, lifting, drying, reducing, forming a reduced graphene oxide film on the surface of the copper foil, and carrying out laser etching on the copper foil attached with the reduced graphene oxide film to form a required circuit;
(2) putting the copper foil attached with the reduced graphene oxide film after laser etching into natural latex, dipping, lifting and drying;
(3) placing the copper foil circuit loaded with the reduced graphene oxide into an etching solution, statically dissolving the copper foil, and introducing a water-insoluble organic solvent from the bottom of a container containing the etching solution to form an organic phase layer with the thickness of 0.5-30 mm to lift up a transparent reduced graphene oxide circuit film;
(4) discharging the etching solution from the bottom of the container, charging and discharging the cleaning solution from the bottom of the container, and repeatedly performing replacement cleaning to form a membrane material;
(5) and introducing natural latex into the container, lifting the membrane material and drying to form the composite integration of the graphene circuit and the latex.
2. The method for compositely integrating the reduced graphene oxide high-sensitivity sensing circuit with the latex according to claim 1, wherein in the step (1), dipping, lifting → drying → reduction process is repeated for 2-30 times, and the thickness of the reduced graphene oxide film is 0.5-20 μm.
3. The method for compositely integrating the reduced graphene oxide high-sensitivity sensing circuit with the latex according to claim 1, wherein in the step (1), the mass concentration of the graphene oxide aqueous solution is 0.0001-0.001%.
4. The method for compositely integrating the reduced graphene oxide high-sensitivity sensing circuit and the latex according to claim 1, wherein in the step (1), a chemical reducing agent is used for reducing the graphene oxide, the chemical reducing agent is an aqueous solution of one or more than two of formaldehyde, hydroiodic acid and zinc acetate, and the mass concentration of the chemical reducing agent is 20-80%.
5. The method for compounding and integrating the reduced graphene oxide high-sensitivity sensing circuit and the latex according to claim 1 or 4, wherein in the step (1), the reduction temperature is 50-120 ℃, and the single reduction time is 5-120 minutes.
6. The method for compositely integrating the reduced graphene oxide high-sensitivity sensing circuit with the latex according to claim 1, wherein in the step (2), dipping and lifting → drying processes are repeated for 2-10 times, and the thickness of the natural latex layer is 5-50 μm.
7. The method for compositely integrating the reduced graphene oxide high-sensitivity sensing circuit with the latex according to claim 1, wherein in the step (3), the copper foil etching solution comprises the following components in percentage by mass: 25-35% of ferric chloride, 0.5-2% of disodium bicarbonate, 1-2% of ammonium persulfate, 15-25% of ethanol and the balance of water.
8. The method for compositely integrating the reduced graphene oxide high-sensitivity sensing circuit with the latex according to claim 1, wherein in the step (3), the organic solvent is one or a mixture of more than two of n-C16-21 alkanes.
9. The method for compositely integrating the reduced graphene oxide high-sensitivity sensing circuit with the latex according to claim 1, wherein in the step (4), the components of the displacement cleaning solution are as follows by mass percent: ethanol 20-40%, ether 5-20%, acetone 15-40%, and water in balance, and the replacement and cleaning are repeated for 2-10 times.
10. The method for compositely integrating the reduced graphene oxide high-sensitivity sensing circuit with the latex according to claim 1, wherein in the step (5), dipping and lifting → drying process of the membrane material is repeated for 2-10 times, and the thickness of the natural latex layer is 5-50 μm.
CN202010564621.8A 2020-06-19 2020-06-19 Method for compositely integrating reduced graphene oxide high-sensitivity sensing circuit and latex Active CN111741607B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010564621.8A CN111741607B (en) 2020-06-19 2020-06-19 Method for compositely integrating reduced graphene oxide high-sensitivity sensing circuit and latex

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010564621.8A CN111741607B (en) 2020-06-19 2020-06-19 Method for compositely integrating reduced graphene oxide high-sensitivity sensing circuit and latex

Publications (2)

Publication Number Publication Date
CN111741607A CN111741607A (en) 2020-10-02
CN111741607B true CN111741607B (en) 2021-05-18

Family

ID=72650264

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010564621.8A Active CN111741607B (en) 2020-06-19 2020-06-19 Method for compositely integrating reduced graphene oxide high-sensitivity sensing circuit and latex

Country Status (1)

Country Link
CN (1) CN111741607B (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103966644B (en) * 2014-04-10 2016-08-17 同济大学 A kind of preparation method of graphene/polymer emulsion composite film material
CN105220214B (en) * 2015-11-13 2018-02-06 中国科学院上海高等研究院 A kind of preparation method of graphene film
CN110092952A (en) * 2018-01-31 2019-08-06 薛玉溪 Graphene/nano silver compounded latex and preparation method thereof
US20210050279A1 (en) * 2018-05-07 2021-02-18 Hewlett-Packard Development Company, L.P. Composite films
CN109957155A (en) * 2019-03-20 2019-07-02 中红普林(北京)医疗用品高新技术研究院有限公司 A kind of preparation method of the modified polyisoprene surgical operation gloves of graphene oxide

Also Published As

Publication number Publication date
CN111741607A (en) 2020-10-02

Similar Documents

Publication Publication Date Title
CN101942689A (en) Micro-arc oxidation treatment method of magnesium alloy
Sun et al. Bioinspired flexible, breathable, waterproof and self-cleaning iontronic tactile sensors for special underwater sensing applications
CN107501612B (en) 3D printing graphene oxide/cellulose composite material and preparation method and application thereof
CN113243920B (en) Flexible skin-adhering electrode and preparation method and application thereof
CN111741607B (en) Method for compositely integrating reduced graphene oxide high-sensitivity sensing circuit and latex
CN107345840A (en) A kind of flexible force sensitive sensor based on silver-carrying nano fiber and preparation method thereof
CN110763377B (en) Super-hydrophobic piezoresistive pressure sensor and preparation method and application thereof
Ning et al. Highly stretchable liquid metal/polyurethane sponge conductors with excellent electrical conductivity stability and good mechanical properties
Lee et al. Highly stretchable and sensitive strain sensors based on single-walled carbon nanotube-coated nylon textile
CN109321919A (en) A kind of chemical method of the MCrAlY coating removal on high temperature alloy part
CN106115656B (en) A kind of preparation method of carbon nano-tube film
Kim et al. Flexible pressure sensors based on silicon nanowire array built by metal-assisted chemical etching
CN108379670A (en) A kind of surface carries the magnesium alloy materials and its preparation method and application of heparin
CN1908644A (en) Method for detecting univalent metal cations with polypyrrole-PVC membrane decorative taste sensor
CN106929856B (en) A kind of method that hf etching changes metallic nickel surface wettability
Kim et al. Self-powered pressure sensor for detecting static and dynamic stimuli through electrochemical reactions
Jeon et al. PEDOT: PSS/regenerated cellulose composite microelectrode for high-performance micro-supercapacitor
CN113514176A (en) Low-temperature stretchable flexible stress sensor based on 3D printing and preparation method
CN106283027B (en) The method that brass surfaces prepare silvery white chemical composition coating
CN111748112B (en) Method for compounding and integrating graphene high-sensitivity sensing circuit and latex
CN102345117B (en) Method for preparing super-hydrophobic high-adhesion metal surface based on peanut leaf surface bionics
CN107652676A (en) A kind of method for improving conducting polymer hydrogel adhesive capacity on matrix material
CN106206252B (en) In the method for surface of semiconductor substrates one-step method chemical graft organic film
Li et al. Sensitive determination of bisphenol A based on Ag nanoparticles/polyguanine modified electrode
CN111745875B (en) Method for integrating graphene biosensor circuit in condom or latex glove process

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant