CN111739825A - Adjustable packaging device for semiconductor chip - Google Patents
Adjustable packaging device for semiconductor chip Download PDFInfo
- Publication number
- CN111739825A CN111739825A CN202010635983.1A CN202010635983A CN111739825A CN 111739825 A CN111739825 A CN 111739825A CN 202010635983 A CN202010635983 A CN 202010635983A CN 111739825 A CN111739825 A CN 111739825A
- Authority
- CN
- China
- Prior art keywords
- screw
- base
- buffer
- plate
- fixedly connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses an adjustable packaging device for a semiconductor chip, belongs to the technical field of semiconductor chip processing, and solves the problem that chips with different sizes cannot be clamped by the conventional device, so that the chips are easy to fall off during packaging; the technical characteristics are as follows: the clamping device comprises a base and a fixed seat, wherein the fixed seat is fixedly arranged on the base, an adjusting seat is fixedly arranged on the left side of the fixed seat, an adjusting component is arranged in the adjusting seat, the adjusting component is connected with a lower clamping component, and an upper clamping component is arranged on the base; according to the embodiment of the invention, the upper clamping assembly and the lower clamping assembly are arranged, the upper clamping assembly and the lower clamping assembly work in a matching manner to fix the position of the chip, the chip packaging work is facilitated, and meanwhile, the positioning accuracy of the chip is further realized by the arrangement of the side clamping plate.
Description
Technical Field
The invention relates to the technical field of semiconductor chip processing, in particular to an adjustable packaging device for a semiconductor chip.
Background
In the field of semiconductor packaging, it is necessary to adhere a semiconductor chip to a corresponding frame through a bonding material to achieve package fixing of the semiconductor chip. However, during the semiconductor chip attachment process, air bubbles are easily generated in the bonding material and on the adhesion interface of the bonding material. The existence of the bubbles can cause thermal expansion when the semiconductor chip works, so that certain pressure is generated on the semiconductor chip, and the performance of the semiconductor chip is influenced.
Chinese patent CN209374443U discloses a chip packaging structure and packaging method, including: the bottom surfaces of the first chip and the second chip are oppositely attached; a plurality of conductive pillars distributed around the first chip; a lead connected between the front surface of the second chip and the first surface of the metal terminal; the packaging layer encapsulates the first chip, the second chip, the lead and the conductive column, and is provided with a first surface and a second surface opposite to the first surface, the first surface exposes the front surface of the first chip and the second surface of the conductive column, and the second surface exposes the preset area of the front surface of the second chip.
Disclosure of Invention
The invention aims to provide an adjustable packaging device for a semiconductor chip, which comprises a base and a fixed seat, wherein the fixed seat is fixedly arranged on the base, an adjusting seat is fixedly arranged on the left side of the fixed seat, an adjusting assembly is arranged in the adjusting seat, the adjusting assembly is connected with a lower clamping assembly, and an upper clamping assembly is arranged on the base, so that the problem that chips with different sizes can not be clamped by the conventional device, and the chips are easy to fall off during packaging is solved.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides an encapsulating device with adjustable semiconductor chip is used, includes base and fixing base, and fixed mounting has the fixing base on the base, and the left side fixed mounting of fixing base has the regulation seat, is equipped with adjusting part in the regulation seat, and adjusting part is connected with down centre gripping subassembly, is equipped with centre gripping subassembly on the base.
As a further scheme of the invention: lower centre gripping subassembly includes first runner, first screw rod and first screw thread piece, and the lower extreme of first screw rod passes through the bearing and adjusts the seat rotation and be connected, and the upper end of first screw rod runs through the upper wall of adjusting the seat to the first runner of fixedly connected with, the cover is equipped with first screw thread piece on the first screw rod, passes through threaded connection between first screw rod and the first screw thread piece, and bolt fixedly connected with lift seat is passed through to one side of first screw thread piece.
As a still further scheme of the invention: be equipped with the lower grip block that is used for the centre gripping chip on the lift seat, be equipped with a plurality of buffering subassemblies in the lower grip block, the buffering subassembly is the matrix distribution on grip block down.
As a still further scheme of the invention: the buffer assembly comprises a buffer plate and a buffer cavity, the buffer cavity is fixedly connected with the lower clamping plate through a bolt, the buffer plate is installed in the buffer cavity, the buffer plate is connected with the buffer cavity in a sliding mode, the bottom of the buffer plate is fixedly provided with a positioning plate, two positioning rods are symmetrically arranged in the buffer cavity, the positioning rods are connected with the positioning plate in a sliding mode, and a buffer spring used for protecting the positioning plate is further sleeved on each positioning rod.
As a still further scheme of the invention: go up the centre gripping subassembly and include second runner, second screw rod and second screw thread piece, the lower extreme of second screw rod passes through the bearing and is connected with the lower wall rotation of fixing base, and the upper end of second screw rod runs through the upper wall of fixing base to fixedly connected with second runner, the outside cover of second screw rod are equipped with second screw thread piece, through threaded connection between second screw rod and the second screw thread piece, grip block on one side fixedly connected with of second screw thread piece, it adopts the elastomer material to make to go up the grip block.
As a still further scheme of the invention: the middle part fixed mounting of second screw rod has first bevel gear, and first bevel gear's rear side is equipped with the second bevel gear, first bevel gear and second bevel gear meshing transmission, the fixedly connected with third screw rod of second bevel gear, third screw rod and fixing base rotate to be connected, and the cover is equipped with the third internal thread sleeve on the third screw rod, and passes through threaded connection between third screw rod and the third internal thread sleeve.
As a still further scheme of the invention: the third internal thread sleeve fixedly connected with centre gripping base, fixed mounting has the pneumatic cylinder on the centre gripping base, and the flexible end fixedly connected with side splint of pneumatic cylinder.
In conclusion, the beneficial effects of the invention are as follows: according to the embodiment of the invention, the upper clamping assembly and the lower clamping assembly are arranged, the upper clamping assembly and the lower clamping assembly work in a matching manner to fix the position of the chip, the chip packaging work is facilitated, and meanwhile, the positioning accuracy of the chip is further realized by the arrangement of the side clamping plate.
Drawings
Fig. 1 is a schematic structural diagram of the invention.
Fig. 2 is a schematic structural view of a clamping base according to the present invention.
Fig. 3 is a schematic structural view of the side clamping plate of the invention.
Fig. 4 is a partially enlarged schematic view of a in fig. 1.
Fig. 5 is a schematic structural view of the fixing base of the present invention.
FIG. 6 is a schematic structural view of a lower clamping plate according to the present invention.
FIG. 7 is a schematic view of a cushion assembly according to the present invention.
Fig. 8 is a schematic structural view of the upper clamping plate according to the present invention.
In the figure: 1-base, 2-fixed base, 3-adjusting base, 4-first rotating wheel, 5-first screw, 6-first thread block, 7-lifting base, 8-lower clamping plate, 9-second rotating wheel, 10-second screw, 11-second thread block, 12-upper clamping plate, 13-first bevel gear, 14-second bevel gear, 15-third screw, 16-third internal thread sleeve, 17-clamping base, 18-side clamping plate, 19-hydraulic cylinder, 20-buffer component, 21-buffer plate, 22-positioning plate, 23-buffer cavity, 24-positioning rod and 25-buffer spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
As shown in fig. 1, in the embodiment of the present invention, an adjustable packaging apparatus for a semiconductor chip includes a base 1 and a fixing seat 2, the fixing seat 2 is fixedly installed on the base 1, as shown in fig. 5, an adjusting seat 3 is fixedly installed on the left side of the fixing seat 2, an adjusting assembly is arranged in the adjusting seat 3, the adjusting assembly is connected to a lower clamping assembly, and an upper clamping assembly is arranged on the base 1;
the lower clamping assembly comprises a first rotating wheel 4, a first screw rod 5 and a first threaded block 6, the lower end of the first screw rod 5 is rotatably connected with the adjusting seat 3 through a bearing, the upper end of the first screw rod 5 penetrates through the upper wall of the adjusting seat 3 and is fixedly connected with the first rotating wheel 4, the first threaded block 6 is sleeved on the first screw rod 5, the first screw rod 5 is in threaded connection with the first threaded block 6, one side of the first threaded block 6 is fixedly connected with a lifting seat 7 through a bolt, a lower clamping plate 8 used for clamping a chip is arranged on the lifting seat 7, and a plurality of buffer assemblies 20 are arranged in the lower clamping plate 8;
the buffer components 20 are distributed on the lower clamping plate 8 in a matrix manner;
as shown in fig. 6-7, the buffer assembly 20 includes a buffer plate 21 and a buffer chamber 23, the buffer chamber 23 is fixedly connected to the lower clamping plate 8 through a bolt, the buffer plate 21 is installed in the buffer chamber 23, the buffer plate 21 is slidably connected to the buffer chamber 23, a positioning plate 22 is fixedly installed at the bottom of the buffer plate 21, two positioning rods 24 are symmetrically arranged in the buffer chamber 23, the positioning rods 24 are slidably connected to the positioning plate 22, and a buffer spring 25 for protecting the positioning plate 22 is further sleeved on the positioning rods 24.
The clamping of chip lower part has been realized to setting up of buffering subassembly 20, also can protect the chip simultaneously, avoids the fracture of chip, has improved chip packaging efficiency.
Example 2
As shown in fig. 1, in the embodiment of the present invention, an adjustable packaging apparatus for a semiconductor chip includes a base 1 and a fixing seat 2, the fixing seat 2 is fixedly installed on the base 1, as shown in fig. 5, an adjusting seat 3 is fixedly installed on the left side of the fixing seat 2, an adjusting assembly is arranged in the adjusting seat 3, the adjusting assembly is connected to a lower clamping assembly, and an upper clamping assembly is arranged on the base 1;
the lower clamping assembly comprises a first rotating wheel 4, a first screw rod 5 and a first threaded block 6, the lower end of the first screw rod 5 is rotatably connected with the adjusting seat 3 through a bearing, the upper end of the first screw rod 5 penetrates through the upper wall of the adjusting seat 3 and is fixedly connected with the first rotating wheel 4, the first threaded block 6 is sleeved on the first screw rod 5, the first screw rod 5 is in threaded connection with the first threaded block 6, one side of the first threaded block 6 is fixedly connected with a lifting seat 7 through a bolt, a lower clamping plate 8 used for clamping a chip is arranged on the lifting seat 7, and a plurality of buffer assemblies 20 are arranged in the lower clamping plate 8;
the buffer components 20 are distributed on the lower clamping plate 8 in a matrix manner;
as shown in fig. 6-7, the buffer assembly 20 includes a buffer plate 21 and a buffer chamber 23, the buffer chamber 23 is fixedly connected to the lower clamping plate 8 through a bolt, the buffer plate 21 is installed in the buffer chamber 23, the buffer plate 21 is slidably connected to the buffer chamber 23, a positioning plate 22 is fixedly installed at the bottom of the buffer plate 21, two positioning rods 24 are symmetrically arranged in the buffer chamber 23, the positioning rods 24 are slidably connected to the positioning plate 22, and a buffer spring 25 for protecting the positioning plate 22 is further sleeved on the positioning rods 24.
The clamping of chip lower part has been realized to setting up of buffering subassembly 20, also can protect the chip simultaneously, avoids the fracture of chip, has improved chip packaging efficiency.
When the position of lift seat 7 need be adjusted in order to adapt to the chip of different models, rotate first runner 4, first runner 4 drives first screw rod 5 and rotates, and first screw rod 5 drives first screw thread piece 6 and lift seat 7 and reciprocates, has realized the regulation to lift seat 7 and 8 positions of lower grip block, and then does benefit to the centre gripping location to different model chips.
As shown in fig. 8, the upper clamping assembly includes a second runner 9, a second screw 10 and a second thread block 11, a lower end of the second screw 10 is rotatably connected with a lower wall of the fixing base 2 through a bearing, an upper end of the second screw 10 penetrates through an upper wall of the fixing base 2 and is fixedly connected with the second runner 9, the second thread block 11 is sleeved outside the second screw 10, the second screw 10 and the second thread block 11 are connected through a thread, and an upper clamping plate 12 is fixedly connected to one side of the second thread block 11;
when the upper part of the chip needs to be fixed, the second rotating wheel 9 is rotated, the second rotating wheel 9 drives the second screw rod 10 to rotate, so that the second screw rod 10 drives the second thread block 11 and the upper clamping plate 12 to move up and down, and the chip is clamped and fixed;
the upper clamping plate 12 is made of an elastomer material.
As shown in fig. 2-4, a first bevel gear 13 is fixedly installed in the middle of the second screw 10, a second bevel gear 14 is arranged on the rear side of the first bevel gear 13, the first bevel gear 13 and the second bevel gear 14 are in meshing transmission, a third screw 15 is fixedly connected to the second bevel gear 14, the third screw 15 is rotatably connected to the fixed seat 2, a third internal thread sleeve 16 is sleeved on the third screw 15, the third screw 15 is in threaded connection with the third internal thread sleeve 16, the third internal thread sleeve 16 is fixedly connected to a clamping base 17, a hydraulic cylinder 19 is fixedly installed on the clamping base 17, and a side clamping plate 18 is fixedly connected to the telescopic end of the hydraulic cylinder 19;
when the second screw 10 rotates, the second screw 10 drives the first bevel gear 13 to rotate, the first bevel gear 13 drives the second bevel gear 14 and the third screw 15 to rotate, and then the third screw 15 drives the third internal thread sleeve 16 and the clamping base 17 to move, so that the side wall of the chip is clamped, the chip is conveniently positioned, and the chip is favorably packaged and processed.
In summary, the working principle of the invention is as follows: when the position of lift seat 7 need be adjusted in order to adapt to the chip of different models, rotate first runner 4, first runner 4 drives first screw rod 5 and rotates, and first screw rod 5 drives first screw thread piece 6 and lift seat 7 and reciprocates, has realized the regulation to lift seat 7 and 8 positions of lower grip block, and then does benefit to the centre gripping location to different model chips.
When the upper part of the chip needs to be fixed, the second rotating wheel 9 is rotated, the second rotating wheel 9 drives the second screw rod 10 to rotate, so that the second screw rod 10 drives the second thread block 11 and the upper clamping plate 12 to move up and down, and the chip is clamped and fixed;
when the second screw 10 rotates, the second screw 10 drives the first bevel gear 13 to rotate, the first bevel gear 13 drives the second bevel gear 14 and the third screw 15 to rotate, and then the third screw 15 drives the third internal thread sleeve 16 and the clamping base 17 to move, so that the side wall of the chip is clamped, the chip is conveniently positioned, and the chip is favorably packaged and processed.
According to the embodiment of the invention, the upper clamping assembly and the lower clamping assembly are arranged, the upper clamping assembly and the lower clamping assembly work in a matching manner to fix the position of the chip, the chip packaging work is facilitated, and meanwhile, the positioning accuracy of the chip is further realized by the arrangement of the side clamping plate 18.
Although several embodiments and examples of the present invention have been described for those skilled in the art, these embodiments and examples are presented as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in other various ways, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalent scope thereof.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (9)
1. The utility model provides an encapsulating device with adjustable semiconductor chip is used, includes base (1) and fixing base (2), and fixed mounting has fixing base (2) on base (1), and its characterized in that, the left side fixed mounting of fixing base (2) has regulation seat (3), is equipped with adjusting part in regulation seat (3), and adjusting part is connected with down the centre gripping subassembly, is equipped with last centre gripping subassembly on base (1).
2. The adjustable packaging device for the semiconductor chip according to claim 1, wherein the lower clamping assembly comprises a first rotating wheel (4), a first screw (5) and a first thread block (6), a lower end of the first screw (5) is rotatably connected with the adjusting base (3) through a bearing, an upper end of the first screw (5) penetrates through an upper wall of the adjusting base (3) and is fixedly connected with the first rotating wheel (4), the first screw (5) is sleeved with the first thread block (6), the first screw (5) and the first thread block (6) are connected through a thread, and one side of the first thread block (6) is fixedly connected with the lifting base (7) through a bolt.
3. The adjustable package device for semiconductor chips as claimed in claim 2, wherein the lifting seat (7) is provided with a lower clamping plate (8) for clamping the chip, and the lower clamping plate (8) is provided with a plurality of buffer assemblies (20).
4. The adjustable package device for semiconductor chips as claimed in claim 3, wherein the buffer members (20) are arranged in a matrix on the lower clamping plate (8).
5. The adjustable packaging device for the semiconductor chip according to claim 3, wherein the buffer assembly (20) comprises a buffer plate (21) and a buffer cavity (23), the buffer cavity (23) is fixedly connected with the lower clamping plate (8) through a bolt, the buffer plate (21) is installed in the buffer cavity (23), the buffer plate (21) is slidably connected with the buffer cavity (23), the positioning plate (22) is fixedly installed at the bottom of the buffer plate (21), two positioning rods (24) are symmetrically arranged in the buffer cavity (23), the positioning rods (24) are slidably connected with the positioning plate (22), and a buffer spring (25) for protecting the positioning plate (22) is further sleeved on the positioning rod (24).
6. The adjustable packaging device for the semiconductor chip according to any one of claims 1 to 5, wherein the upper clamping assembly comprises a second rotating wheel (9), a second screw (10) and a second thread block (11), the lower end of the second screw (10) is rotatably connected with the lower wall of the fixing base (2) through a bearing, the upper end of the second screw (10) penetrates through the upper wall of the fixing base (2) and is fixedly connected with the second rotating wheel (9), the second thread block (11) is sleeved outside the second screw (10), the second screw (10) and the second thread block (11) are connected through a thread, and an upper clamping plate (12) is fixedly connected to one side of the second thread block (11).
7. The tunable packaging apparatus for semiconductor chips according to claim 6, wherein the upper clamping plate (12) is made of an elastomer material.
8. The adjustable packaging device for the semiconductor chip according to claim 6, wherein a first bevel gear (13) is fixedly mounted in the middle of the second screw (10), a second bevel gear (14) is disposed on the rear side of the first bevel gear (13), the first bevel gear (13) and the second bevel gear (14) are in meshing transmission, a third screw (15) is fixedly connected to the second bevel gear (14), the third screw (15) is rotatably connected to the fixing base (2), a third internal threaded sleeve (16) is sleeved on the third screw (15), and the third screw (15) is in threaded connection with the third internal threaded sleeve (16).
9. The adjustable packaging device for semiconductor chips as claimed in claim 8, wherein the third internally threaded sleeve (16) is fixedly connected with a clamping base (17), a hydraulic cylinder (19) is fixedly mounted on the clamping base (17), and a side clamping plate (18) is fixedly connected with the telescopic end of the hydraulic cylinder (19).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010635983.1A CN111739825A (en) | 2020-07-03 | 2020-07-03 | Adjustable packaging device for semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010635983.1A CN111739825A (en) | 2020-07-03 | 2020-07-03 | Adjustable packaging device for semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111739825A true CN111739825A (en) | 2020-10-02 |
Family
ID=72653486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010635983.1A Withdrawn CN111739825A (en) | 2020-07-03 | 2020-07-03 | Adjustable packaging device for semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111739825A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114256109A (en) * | 2021-12-22 | 2022-03-29 | 荣耀智能(山东)电子有限公司 | Packaging manufacturing equipment for multi-chip integrated circuit |
| CN116779496A (en) * | 2023-08-21 | 2023-09-19 | 成都汉芯国科集成技术有限公司 | 3D packaging system and packaging method suitable for heterogeneous integrated multiple chips |
-
2020
- 2020-07-03 CN CN202010635983.1A patent/CN111739825A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114256109A (en) * | 2021-12-22 | 2022-03-29 | 荣耀智能(山东)电子有限公司 | Packaging manufacturing equipment for multi-chip integrated circuit |
| CN116779496A (en) * | 2023-08-21 | 2023-09-19 | 成都汉芯国科集成技术有限公司 | 3D packaging system and packaging method suitable for heterogeneous integrated multiple chips |
| CN116779496B (en) * | 2023-08-21 | 2023-12-26 | 成都汉芯国科集成技术有限公司 | 3D packaging system and packaging method suitable for heterogeneous integrated multiple chips |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111739825A (en) | Adjustable packaging device for semiconductor chip | |
| CN116417380A (en) | Auxiliary pressurizing device for chip bonding | |
| CN110843230A (en) | Hot press forming device for carbon fiber reinforced composite material | |
| CN113471150A (en) | Integrated circuit package | |
| CN207551155U (en) | A kind of belt conveyor with height adjusting function | |
| CN215044260U (en) | Plant draws uses encapsulation equipment convenient to operation | |
| CN213437084U (en) | Special die casting die of big specification die casting aluminium radiator | |
| CN109648863B (en) | Anti-scraping laminating machine for computer | |
| CN208409596U (en) | A kind of bicycle aluminium alloy sanding burr fixing tool | |
| CN221057401U (en) | Small-sized metal ceramic surface-mounted SOP (silicon on insulator) packaging four-transistor array | |
| CN218333704U (en) | Fixing clamp for chip packaging | |
| CN213288834U (en) | Cosmetics aluminum pipe milling flutes device | |
| CN207522103U (en) | A kind of processing unit (plant) for being molded radiation tooth | |
| CN216449089U (en) | Visual identification adjusting device for multiple pressure gauges | |
| CN220509384U (en) | Computer radiator capable of adjusting position of fan | |
| CN215845466U (en) | Precision forging die for turbine blades of aero-engines | |
| CN211238179U (en) | Chip packaging based prepressing device | |
| CN218225159U (en) | Wafer cutting machine for integrated circuit packaging | |
| CN214640571U (en) | Main board for intercooler of engine | |
| CN109175826B (en) | Welding device with heat dissipation structure for aluminum product machining | |
| CN220067851U (en) | Encapsulation structure of electronic element | |
| CN214078930U (en) | Position calibration device for stamping part | |
| CN218136332U (en) | Lifting platform device of CNC (computer numerical control) machining center | |
| CN218313102U (en) | Angle-adjustable clamp for chip processing | |
| CN213343150U (en) | Unmanned aerial vehicle remote sensing measurement and control heat abstractor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20201002 |
|
| WW01 | Invention patent application withdrawn after publication |