CN111733387B - High-temperature evaporation source and cooling device thereof - Google Patents
High-temperature evaporation source and cooling device thereof Download PDFInfo
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- CN111733387B CN111733387B CN202010594608.7A CN202010594608A CN111733387B CN 111733387 B CN111733387 B CN 111733387B CN 202010594608 A CN202010594608 A CN 202010594608A CN 111733387 B CN111733387 B CN 111733387B
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- 238000001816 cooling Methods 0.000 title claims abstract description 90
- 230000008020 evaporation Effects 0.000 title claims abstract description 55
- 238000001704 evaporation Methods 0.000 title claims abstract description 55
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 73
- 239000011733 molybdenum Substances 0.000 claims abstract description 73
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 72
- 238000010438 heat treatment Methods 0.000 claims abstract description 48
- 238000009413 insulation Methods 0.000 claims abstract description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 29
- 229910052802 copper Inorganic materials 0.000 claims description 29
- 239000010949 copper Substances 0.000 claims description 29
- 229910052594 sapphire Inorganic materials 0.000 claims description 18
- 239000010980 sapphire Substances 0.000 claims description 18
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical group [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 16
- 229910052721 tungsten Inorganic materials 0.000 claims description 16
- 239000010937 tungsten Substances 0.000 claims description 16
- 238000005219 brazing Methods 0.000 claims description 7
- 239000002826 coolant Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention provides a high-temperature evaporation source and a cooling device thereof, wherein the cooling device of the high-temperature evaporation source comprises: a heat insulating layer configured to wrap the heating wire and insulate heat of the heating wire from other components; a molybdenum base configured to support the thermal barrier; the water-cooled electrode is configured to receive the end part of the heating wire and extends out of the molybdenum base; the water cooling cover is configured to wrap the heat insulation layer and carry out water cooling on the outer surface of the heat insulation layer; the electrode base is configured to fix the water-cooled electrode and bear the water-cooled cover; an insulating ring configured to insulate and insulate the electrode base from the water-cooled electrode.
Description
Technical Field
The invention relates to the technical field of coating processes, in particular to a high-temperature evaporation source and a cooling device thereof.
Background
A common thermal evaporation source uses a metal heating wire (generally tantalum), is electrified to generate heat, and heats a crucible in a radiation heating mode. The evaporation material is placed in a crucible. The material is heated to evaporate and deposited on the substrate. Tantalum is relatively soft and requires the use of a ceramic spacer ring for fixation. The common ceramic material is Al2O3 or PBN. These ceramic materials grow themselves when heated to 1500-1600 c. So using this approach, the growth temperature typically does not exceed 1400 ℃.
Tungsten can be used as the heater filament material if it is desired to reach higher growth temperatures. The tungsten is harder in texture, and when the tungsten filament is thick enough, the tungsten filament can stand alone without the aid of a ceramic spacer ring. Thereby achieving higher growth temperature (1900-2000 ℃). In order for the tungsten filament to stand alone without softening at high temperatures, the tungsten filament needs to be thick enough. Since the resistivity of tungsten is lower, more current is required to achieve the same heating power. In order to pass larger currents, the electrodes also need to be thicker. Because the electrode and the heating tungsten wire are thicker, the thermal conductivity is higher, more heat can be transferred to the electrode, and the electrode can be damaged due to overhigh temperature if cooling treatment is not carried out. Therefore, the electrode needs to be cooled.
Disclosure of Invention
The invention aims to provide a high-temperature evaporation source and a cooling device thereof, which are used for solving the problem that the conventional high-temperature evaporation source is easy to cause damage caused by overhigh electrode temperature.
In order to solve the above technical problem, the present invention provides a cooling device for a high temperature evaporation source, comprising:
a heat insulating layer configured to wrap the heating wire and insulate heat of the heating wire from other components;
a molybdenum base configured to support the thermal barrier;
the water-cooled electrode is configured to receive the end part of the heating wire and extends out of the molybdenum base;
the water cooling cover is configured to wrap the heat insulation layer and carry out water cooling on the outer surface of the heat insulation layer;
the electrode base is configured to fix the water-cooled electrode and bear the water-cooled cover;
and the insulating ring is configured to isolate and insulate the electrode base from the water-cooled electrode.
Optionally, in the cooling device for a high-temperature evaporation source, the material of the heating wire is tungsten, and the diameter of the heating wire is 1.2 mm.
Optionally, in the cooling device of the high-temperature evaporation source, the high-temperature evaporation source includes a crucible and a crucible support, the heating wire is wound around the periphery of the crucible, and the crucible support is located at the bottom of the crucible.
Optionally, in the cooling device of the high-temperature evaporation source, the thermal insulation layer includes a bottom thermal shield layer and a side wall thermal shield layer, wherein:
the bottom heat shield layer consists of 6 or more than 6 heat insulation sheets;
the bottom heat shield layer is disposed between the molybdenum base and the crucible;
the sidewall thermal shield layer wraps around an outer edge of the insulation sheet.
Optionally, in the cooling device of the high-temperature evaporation source, the molybdenum base includes a first base, a second base, a first molybdenum screw, and a second molybdenum screw, the water-cooled electrode includes a molybdenum electrode, wherein:
the first base is used for supporting the bottom heat shield layer, the second base is used for supporting the side wall heat shield layer, the first molybdenum screw rod is used for connecting and fixing the first base and the second base, and the second molybdenum screw rod is used for connecting and fixing the second base and the electrode base;
the first base is provided with a through hole for the heating wire to pass through;
the second base is provided with a through hole for the molybdenum electrode to pass through;
the first end of the molybdenum electrode is connected with the end of the heating wire;
the diameter of the first molybdenum screw is 2 millimeters, and the diameter of the second molybdenum screw is 2 millimeters.
Optionally, in the cooling device for a high-temperature evaporation source, the electrode base includes a third base and a fourth base, the third base is in pressure contact with the fourth base,
the water-cooling electrode also comprises a copper electrode, the first end of the copper electrode is connected with the second end of the molybdenum electrode, and the second end of the copper electrode extends out of the fourth base;
the insulating ring wraps and fixes the connection part of the molybdenum electrode and the copper electrode, and extends out of the surfaces of the third base and the fourth base so as to clamp the body of the water-cooling electrode;
the third base is used for fixing the outer wall of the insulating ring.
Optionally, in the cooling device of the high-temperature evaporation source, the insulating ring is made of sapphire, and the molybdenum electrode and the copper electrode, the water-cooled electrode and the insulating ring, and the insulating ring and the third base are all fixed by brazing.
Optionally, in the cooling device for a high-temperature evaporation source, the third susceptor and the fourth susceptor have through holes at central positions so that the thermocouple can pass through the through holes, and the third susceptor and the fourth susceptor are pressed by bolts.
Optionally, in the cooling device of the high-temperature evaporation source, the water-cooling cover includes an inner wall, an outer wall, and a cover bottom, wherein:
the inner wall wraps the outer surface of the side wall heat shield layer, and the outer edge of the fourth base protrudes out of the outer edge of the third base;
the outer wall with the inner wall is concentric cylinder structure, the inner wall with the holding coolant liquid between the outer wall, the cover end is fixed in on the outward flange of fourth base.
The invention provides a high-temperature evaporation source, which comprises the cooling device.
In the high-temperature evaporation source and the cooling device thereof, the heat insulating layer wraps the heating wire, and the heat of the heating wire is isolated from other components, so that the heat is kept in the heat insulating layer as much as possible, and the heat is prevented from leaking to the outside; the molybdenum base supports the heat insulation layer, so that the heat insulation layer is reliable and stable, the material growth temperature of the molybdenum base is high, the material cannot be melted by heat in the heat insulation layer, and the material cannot easily grow under the influence of the heat; the end part of the heating wire is connected through the water-cooled electrode and extends out of the molybdenum base, so that the extension of the heating wire is realized, and the heat is taken out as little as possible; the heat insulation layer is wrapped by the water cooling cover, and the outer surface of the heat insulation layer is cooled by water, so that the cooling is further realized, and the double guarantee of the cooling effect is realized; the water-cooling electrode is fixed and the water-cooling cover is borne by the electrode base, so that the stability of the whole structure is realized; the electrode base and the water-cooling electrode are isolated by the insulating ring and are insulated, so that the high reliability of the cooling process is realized.
The water-cooled electrode and the high-temperature evaporation source integrally share the water-cooled cover, so that the structure is simple in manufacturing process and low in cost. The water-cooled electrode is installed on the electrode base, has the sapphire pipe between the two (the sapphire has fine insulating effect, and the heat conduction is good simultaneously), and the three welds together through brazed mode. The electrode base is fixed at the bottom of the water cooling cover, and the water cooling electrode is cooled through the water cooling cover. The water-cooled electrode and the electrode base are made of copper. The heating wire electrode is made of molybdenum and is welded with the water-cooling electrode in a brazing mode. The whole structure is stable in connection relation and high in reliability.
Drawings
FIG. 1 is a schematic view of a cooling apparatus for a high-temperature evaporation source according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a high-temperature evaporation source according to an embodiment of the present invention;
shown in the figure: 1-heating wires; 2-crucible and; 3-supporting the crucible; 4-a bottom thermal barrier layer; 5-a sidewall thermal shield; 6-a first base; 7-a second base; 8-a first molybdenum screw; 9-a second molybdenum screw; a 10-molybdenum electrode; 11-a third base; 12-a fourth base; 13-a copper electrode; 14-an insulating ring; 15-a through hole; 16-an inner wall; 17-an outer wall; 18-cover bottom; 19-a baffle; 20-installing a flange; 21-a vacuum electrode; 22-magnetic rotating means; 23-cooling means.
Detailed Description
The high-temperature evaporation source and the cooling device thereof according to the present invention will be described in detail with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
The core idea of the invention is to provide a high-temperature evaporation source and a cooling device thereof, so as to solve the problem that the existing high-temperature evaporation source is easy to cause damage due to overhigh electrode temperature.
In order to achieve the above idea, the present invention provides a high temperature evaporation source and a cooling device thereof, the cooling device of the high temperature evaporation source comprising: a heat insulating layer configured to wrap the heating wire and insulate heat of the heating wire from other components; a molybdenum base configured to support the thermal shield layer; the water-cooled electrode is configured to receive the end part of the heating wire and extends out of the molybdenum base; the water cooling cover is configured to wrap the heat insulation layer and carry out water cooling on the outer surface of the heat insulation layer; the electrode base is configured to fix the water-cooled electrode and bear the water-cooled cover; and the insulating ring is configured to isolate and insulate the electrode base from the water-cooled electrode.
< first embodiment >
The present embodiment provides a cooling device 23 for a high temperature evaporation source, as shown in fig. 1-2, the cooling device 23 for a high temperature evaporation source includes: a thermal insulation layer configured to wrap the heating wire 1 and insulate heat of the heating wire 1 from other components; a molybdenum base configured to support the thermal shield layer; a water-cooled electrode configured to receive an end of the heating wire 1 and extend out of the molybdenum base; the water cooling cover is configured to wrap the heat insulation layer and carry out water cooling on the outer surface of the heat insulation layer; the electrode base is configured to fix the water-cooled electrode and bear the water-cooled cover; an insulating ring 14 configured to insulate and isolate the electrode base from the water-cooled electrode.
Specifically, in the cooling device for the high-temperature evaporation source, the material of the heating wire 1 is tungsten, the tungsten is harder, and when the tungsten filament is thick enough, the heating wire can stand alone without a ceramic spacer ring. Thereby achieving higher growth temperature (1900-2000 ℃). In order for the tungsten filament to stand alone without softening at high temperature, the tungsten filament needs to be thick enough, and the diameter of the filament 1 is 1.2 mm. As shown in fig. 2, in the cooling apparatus of the high temperature evaporation source, the high temperature evaporation source includes a crucible 2 and a crucible support 3, the heating wire 1 is wound around the periphery of the crucible 2, and the crucible support 3 is located at the bottom of the crucible 2.
As shown in fig. 1, in the cooling apparatus for a high temperature evaporation source, the thermal insulation layer includes a bottom thermal shield layer 4 and a side wall thermal shield layer 5, wherein: the bottom heat shield layer 4 consists of 6 or more than 6 heat insulation sheets; the bottom thermal shield 4 is disposed between the molybdenum base and the crucible 2; the side wall heat shield layer 5 wraps the outer edge of the heat insulation sheet.
Further, in the cooling device of the high-temperature evaporation source, the molybdenum base includes a first base 6, a second base 7, a first molybdenum screw 8 and a second molybdenum screw 9, and the water-cooled electrode includes a molybdenum electrode 10, wherein: the first base 6 is used for supporting the bottom heat shield 4, the second base 7 is used for supporting the side wall heat shield 5, the first molybdenum screw 8 is used for connecting and fixing the first base 6 and the second base 7, and the second molybdenum screw 9 is used for connecting and fixing the second base 7 and the electrode base; the first pedestal 6 is provided with a through hole for the heating wire 1 to pass through; the second base 7 is provided with a through hole for the molybdenum electrode 10 to pass through; a first end of the molybdenum electrode 10 receives an end of the heating wire 1; the diameter of the first molybdenum screw 8 is set to be thin so as to reduce heat transfer, specifically, the diameter is 2 mm, and similarly, the diameter of the second molybdenum screw 9 is 2 mm. The material of the molybdenum electrode 10 can prevent the molybdenum electrode from being melted or growing out when the molybdenum electrode is directly connected with the tungsten filament of the high-temperature heating wire 1, the melting point of the molybdenum is 2610 ℃, the growth temperature is 2100 ℃, the growth temperature of heating to 1900-2000 ℃ can be met, and the molybdenum cannot be melted.
Specifically, in the cooling device for a high-temperature evaporation source, the electrode base includes a third base 11 and a fourth base 12, the third base 11 is in pressure contact with the fourth base 12, the water-cooled electrode further includes a copper electrode 13, the copper electrode has high thermal conductivity and can effectively dissipate heat, a first end of the copper electrode 13 is connected and fixed to a second end of the molybdenum electrode 10, and a second end of the copper electrode 13 extends out of the fourth base 12; the insulation ring is used for fixing the joint of the second end part of the molybdenum electrode 10 and the first end part of the copper electrode 13; so that the first end of the molybdenum electrode 10 is fixedly connected with the second end of the copper electrode 13; and the insulation ring 14 wraps the connection part of the molybdenum electrode 10 and the copper electrode 13 and extends out of the surfaces of the third base 11 and the fourth base 12 so as to clamp the body of the water-cooled electrode 13.
The molybdenum electrode 10, the copper electrode 13, the sapphire insulating ring 14 and the copper material third base 11 are welded together through brazing (the molybdenum electrode 10 and the copper electrode 13 are brazed together and then brazed on the inner wall of the sapphire insulating ring; the sapphire insulating ring outer wall is brazed with the third base 11, namely, the two electrodes, the sapphire ring and the like are all fixed on the third base 11 through brazing). The sapphire insulating ring plays an insulating role and prevents the two electrodes from being grounded (the water cooling cover is directly grounded). Meanwhile, because the sapphire has good thermal conductivity, the heat conducted by the upper layer tungsten heating wire can be transferred to the third base 11 through the copper electrode 13 and the sapphire ring 14. The third base 11 is fixed on the fourth base 12 through screws, and the fourth base 12 is fixed on the cover bottom 18 of the water cooling cover through screws. Therefore, heat is transferred from the third susceptor 11 to the cover bottom 18 through the fourth susceptor 12, and the cover bottom 18 is directly in contact with the cooling liquid, and the heat is taken away by the cooling liquid. That is, the purpose of the third base 11 is to maintain good thermal contact with the molybdenum electrode 10 and the copper electrode 13, while insulating (by means of a sapphire insulating ring), so that the purpose of cooling both electrodes can be achieved. The base is divided into a third base 11 and a fourth base 12 for convenient installation, otherwise, the base cannot be installed (the fourth base 12 is used for fixing the third base 11, and the surface of the fourth base 12 is provided with a hole for the copper electrode 13 and the sapphire insulating ring 14 to pass through, but a gap is formed in the middle and is not fixed with the copper electrode 13 and the sapphire insulating ring).
In the cooling device of the high-temperature evaporation source, the insulating ring 14 is made of sapphire, and the sapphire has good insulating property and high thermal conductivity and can effectively dissipate heat. The molybdenum electrode 10 and the copper electrode 13, the water-cooling electrode and the insulating ring 14, and the insulating ring 14 and the third base 11 are fixed through brazing. In the cooling device for a high-temperature evaporation source, the third susceptor 11 and the fourth susceptor 12 have a through hole 15 at a central position so that a thermocouple can pass through the through hole, and the third susceptor 11 and the fourth susceptor 12 are press-bonded by a bolt.
Further, in the cooling apparatus for a high temperature evaporation source, the water cooling cover includes an inner wall 16, an outer wall 17 and a cover bottom 18, wherein: the inner wall 16 wraps the outer surface of the side wall heat shield layer 5, and the outer edge of the fourth base 12 protrudes from the outer edge of the third base 11; the outer wall 17 with the inner wall 16 is concentric cylinder structure, the inner wall 16 with holding coolant liquid between the outer wall 17, 18 are fixed in at the bottom of the cover on the outward flange of fourth base 12, the water-cooling cover is inclosed concentric ring structure, and inner wall, outer wall and cover top welding are in the same place, form confined space, and the centre leads to the cooling water. In this way, the cooling fluid can cool the inner wall, the outer wall, the cover top and the cover bottom. The fourth base 12 is a copper material with good thermal conductivity and is fixed on the cover bottom 18, so that the cover bottom 18 takes away the heat transferred from the fourth base 12.
The present embodiment further provides a high-temperature evaporation source, comprising the cooling device 23 as described in any one of the above. A baffle 19 is arranged above a crucible 2 of the high-temperature evaporation source, a crucible 20 and a cooling device 23 form a high-temperature evaporation source main body which is fixed on a mounting flange 20, the model of the mounting flange 20 is DN40CF, and a vacuum electrode 21 and a magnetic force rotating device 22 are arranged below the mounting flange 20.
In the high-temperature evaporation source and the cooling device thereof, the heat insulating layer wraps the heating wire, and the heat of the heating wire is isolated from other components, so that the heat is kept in the heat insulating layer as much as possible, and the heat is prevented from leaking to the outside; the molybdenum base supports the heat insulation layer, so that the heat insulation layer is reliable and stable, the material growth temperature of the molybdenum base is high, the material cannot be melted by heat in the heat insulation layer, and the material cannot easily grow under the influence of the heat; the end part of the heating wire is connected through the water-cooled electrode and extends out of the molybdenum base, so that the extension of the heating wire is realized, and the heat is taken out as little as possible; the heat insulation layer is wrapped by the water cooling cover, and the outer surface of the heat insulation layer is cooled by water, so that the cooling is further realized, and the double guarantee of the cooling effect is realized; the water-cooled electrode is fixed and the water-cooled cover is carried by the electrode base, so that the stability of the whole structure is realized; the electrode base and the water-cooling electrode are isolated by the insulating ring and are insulated, so that the high reliability of the cooling process is realized.
The water-cooled electrode and the high-temperature evaporation source integrally share the water-cooled cover, so that the structure is simple in manufacturing process and low in cost. The water-cooled electrode is installed on the electrode base, has the sapphire pipe (the sapphire has fine insulating effect, and heat conduction is good simultaneously) between the two, and the three welds together through brazed mode. The water-cooling base is fixed at the bottom of the water-cooling cover and cools the water-cooling electrode through the water-cooling cover. The water-cooled electrode and the water-cooled base are made of copper. The heating wire electrode is made of molybdenum and is welded with the water-cooling electrode in a brazing mode. The whole structure is stable in connection relation and high in reliability.
In summary, the above embodiments have described the different configurations of the cooling device for the high temperature evaporation source in detail, but it is understood that the present invention includes, but is not limited to, the configurations listed in the above embodiments, and any modifications based on the configurations provided in the above embodiments are within the scope of the present invention. One skilled in the art can take the content of the above embodiments to take the inverse three.
The above description is only for the purpose of describing the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are intended to fall within the scope of the appended claims.
Claims (9)
1. A cooling device of a high-temperature evaporation source is characterized by comprising:
a heat insulating layer configured to wrap the heating wire and insulate heat of the heating wire from other components;
a molybdenum base configured to support the thermal shield layer;
the water-cooled electrode is configured to receive the end part of the heating wire and extends out of the molybdenum base;
a water-cooling cover configured to wrap the heat insulating layer and water-cool an outer surface of the heat insulating layer;
the electrode base is configured to fix the water-cooled electrode and bear the water-cooled cover;
an insulating ring configured to insulate and insulate the electrode base from the water-cooled electrode;
the electrode base comprises a third base and a fourth base, the third base is in pressure joint with the fourth base,
the water-cooling electrode also comprises a copper electrode, the first end of the copper electrode is connected with the second end of the molybdenum electrode, and the second end of the copper electrode extends out of the fourth base;
the insulating ring wraps and fixes the connection part of the molybdenum electrode and the copper electrode, and extends out of the surfaces of the third base and the fourth base so as to clamp the body of the water-cooling electrode;
the third base is used for fixing the outer wall of the insulating ring;
the molybdenum electrode and the copper electrode, the water-cooling electrode and the insulating ring, and the insulating ring and the third base are fixed through brazing.
2. The cooling apparatus of a high temperature evaporation source according to claim 1, wherein the material of the heating wire is tungsten, and the diameter of the heating wire is 1.2 mm.
3. The cooling apparatus for a high temperature evaporation source according to claim 1, wherein the high temperature evaporation source comprises a crucible and a crucible support, the heating wire is wound around the periphery of the crucible, and the crucible support is located at the bottom of the crucible.
4. The cooling apparatus of a high temperature evaporation source according to claim 3, wherein the thermal insulation layer comprises a bottom thermal shield layer and a side wall thermal shield layer, wherein:
the bottom heat shield layer is composed of more than 6 heat insulation sheets;
the bottom heat shield layer is disposed between the molybdenum base and the crucible;
the sidewall thermal shield layer wraps around an outer edge of the insulation sheet.
5. The cooling apparatus for a high temperature evaporation source according to claim 4, wherein the molybdenum base includes a first base, a second base, a first molybdenum screw, and a second molybdenum screw, and the water-cooled electrode includes a molybdenum electrode, wherein:
the first base is used for supporting the bottom heat shield layer, the second base is used for supporting the side wall heat shield layer, the first molybdenum screw rod is used for connecting and fixing the first base and the second base, and the second molybdenum screw rod is used for connecting and fixing the second base and the electrode base;
the first base is provided with a through hole for the heating wire to pass through;
the second base is provided with a through hole for the molybdenum electrode to pass through;
the first end of the molybdenum electrode is connected with the end of the heating wire;
the diameter of the first molybdenum screw is 2 millimeters, and the diameter of the second molybdenum screw is 2 millimeters.
6. The cooling device of a high-temperature evaporation source according to claim 5, wherein the material of the insulating ring is sapphire.
7. The cooling apparatus of a high temperature evaporation source according to claim 5, wherein the third susceptor and the fourth susceptor have a through hole at a central position so that a thermocouple passes through the through hole, and the third susceptor and the fourth susceptor are press-fitted by a bolt.
8. The cooling apparatus of a high temperature evaporation source according to claim 5, wherein the water cooling cover comprises an inner wall, an outer wall and a cover bottom, wherein:
the inner wall wraps the outer surface of the side wall heat shield layer, and the outer edge of the fourth base protrudes out of the outer edge of the third base;
the outer wall with the inner wall is concentric cylinder structure, the inner wall with the holding coolant liquid between the outer wall, the cover end is fixed in on the outward flange of fourth base.
9. A high-temperature evaporation source, comprising the cooling device according to any one of claims 1 to 8.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310135206.4A CN116516297A (en) | 2020-06-28 | 2020-06-28 | High-temperature evaporation source |
| CN202010594608.7A CN111733387B (en) | 2020-06-28 | 2020-06-28 | High-temperature evaporation source and cooling device thereof |
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| CN202010594608.7A CN111733387B (en) | 2020-06-28 | 2020-06-28 | High-temperature evaporation source and cooling device thereof |
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| CN202310135206.4A Division CN116516297A (en) | 2020-06-28 | 2020-06-28 | High-temperature evaporation source |
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| CN111733387B true CN111733387B (en) | 2023-01-06 |
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| CN112853276A (en) * | 2020-12-31 | 2021-05-28 | 凯盛光伏材料有限公司 | Oxidation-resistant and pollution-resistant durable compound evaporation source |
| CN117966103B (en) * | 2024-02-04 | 2024-06-18 | 浙江晟霖益嘉科技有限公司 | Evaporation vacuum equipment production line |
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| CN204825031U (en) * | 2015-08-05 | 2015-12-02 | 大连齐维科技发展有限公司 | High temperature evaporation source |
| CN105648405A (en) * | 2016-03-29 | 2016-06-08 | 苏州方昇光电装备技术有限公司 | Organic material evaporator |
| CN206916211U (en) * | 2017-06-08 | 2018-01-23 | 费勉仪器科技（上海）有限公司 | A kind of superhigh temperature evaporation source |
| CN109487217B (en) * | 2018-11-26 | 2021-04-27 | 昆明理工大学 | Molecular evaporation device capable of effectively cooling |
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| CN111733387A (en) | 2020-10-02 |
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