CN111732923A - Ultraviolet light curing conductive adhesive and preparation method thereof - Google Patents
Ultraviolet light curing conductive adhesive and preparation method thereof Download PDFInfo
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- CN111732923A CN111732923A CN202010695246.0A CN202010695246A CN111732923A CN 111732923 A CN111732923 A CN 111732923A CN 202010695246 A CN202010695246 A CN 202010695246A CN 111732923 A CN111732923 A CN 111732923A
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- conductive adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
Abstract
The invention discloses an ultraviolet light curing conductive adhesive and a preparation method thereof, the ultraviolet light curing conductive adhesive comprises the following components of epoxy acrylic resin, 1, 6-hexanediol diacrylate, pentaerythritol triacrylate, 2-ethyl-4-methylimidazole, copper, nickel and a photoinitiator, and the content of each component is as follows: the epoxy acrylic resin is prepared from 60-70 parts by weight of epoxy acrylic resin, 0.1-1 part by weight of 1, 6-hexanediol diacrylate, 0.5-1 part by weight of pentaerythritol triacrylate, 11-14 parts by weight of 2-ethyl-4-methylimidazole, 35-40 parts by weight of copper, 10-15 parts by weight of nickel and 1-1.5 parts by weight of a photoinitiator, wherein the epoxy acrylic resin is prepared from epoxy resin, hydroquinone, N-dimethylaniline and isooctyl acrylate serving as raw materials, and the photoinitiator is selected from at least one of aryl onium salt photoinitiators and diisopropyl peroxydicarbonate. Through the mode, the ultraviolet curing conductive adhesive disclosed by the invention is high in curing speed, can be cured without heating, is easy to prepare and has good stability.
Description
Technical Field
The invention relates to the technical field of adhesives, in particular to an ultraviolet light curing conductive adhesive and a preparation method thereof.
Background
The conductive adhesive is an adhesive which has certain conductivity after being cured or dried. It can connect multiple conductive materials together to form an electrical path between the connected materials. In the electronic industry, conductive adhesive has become an indispensable new material, and can be used instead of soldering. With the continuous development of science and technology, electronic components are rapidly developed towards miniaturization and microminiaturization, and meanwhile, the performance of the conductive adhesive is required to be continuously improved. The existing conductive adhesive needs to be heated during curing, can affect electronic components, cause damage and deformation of the electronic components, and is poor in use effect.
Disclosure of Invention
The invention mainly solves the technical problem of providing the ultraviolet curing conductive adhesive and the preparation method thereof, and the application effect is good.
In order to solve the technical problems, one technical scheme adopted by the invention is to provide an ultraviolet curing conductive adhesive, which comprises the following components of epoxy acrylic resin, 1, 6-hexanediol diacrylate, pentaerythritol triacrylate, 2-ethyl-4-methylimidazole, copper, nickel and a photoinitiator, wherein the ultraviolet curing conductive adhesive comprises the following components in percentage by weight: the epoxy acrylic resin is prepared from 60-70 parts by weight of epoxy acrylic resin, 0.1-1 part by weight of 1, 6-hexanediol diacrylate, 0.5-1 part by weight of pentaerythritol triacrylate, 11-14 parts by weight of 2-ethyl-4-methylimidazole, 35-40 parts by weight of copper, 10-15 parts by weight of nickel and 1-1.5 parts by weight of a photoinitiator, wherein the epoxy acrylic resin is prepared from epoxy resin, hydroquinone, N-dimethylaniline and isooctyl acrylate serving as raw materials, and the photoinitiator is selected from at least one of aryl onium salt photoinitiators and diisopropyl peroxydicarbonate.
In a preferred embodiment of the present invention, the aryl onium salt photoinitiator is one or a mixture of diaryl iodonium salt and triaryl sulfonium salt.
In a preferred embodiment of the present invention, the mesh number of the copper is 100-150 meshes.
In a preferred embodiment of the present invention, the mesh number of the nickel is 100-150 meshes.
In a preferred embodiment of the invention, the epoxy acrylic resin is obtained by taking epoxy resin, hydroquinone, N-dimethylaniline and isooctyl acrylate as raw materials.
In a preferred embodiment of the invention, the mass ratio of the epoxy resin, the hydroquinone, the N, N-dimethylaniline and the isooctyl acrylate is 100:0.5-1:0.5-1: 8-10.
The preparation method of the ultraviolet curing conductive adhesive comprises the following steps:
(1) preparing epoxy acrylic resin: dissolving epoxy resin, adding a mixed solution of hydroquinone, N-dimethylaniline and isooctyl acrylate, and reacting to obtain epoxy acrylic resin;
(2) uniformly mixing epoxy acrylic resin, 1, 6-hexanediol diacrylate, pentaerythritol triacrylate, 2-ethyl-4-methylimidazole, copper, nickel and a photoinitiator to obtain the ultraviolet curing conductive adhesive.
In a preferred embodiment of the present invention, the mixture of benzenediol, N-dimethylaniline and isooctyl acrylate in step (1) is added dropwise to the epoxy resin.
In a preferred embodiment of the present invention, the dropping time in the step (1) is 50 to 60 minutes.
In a preferred embodiment of the present invention, the reaction time in step (1) is 1-1.5 hours, and the reaction temperature is 85-95 ℃.
The invention has the beneficial effects that: the ultraviolet curing conductive adhesive and the preparation method thereof have the advantages of high curing speed, particularly remarkable effect on adhesive tapes with the required thickness of more than 100 micrometers, capability of realizing curing without heating, easiness in preparation, good stability, safety and environmental friendliness.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
the ultraviolet curing conductive adhesive comprises the following components of epoxy acrylic resin, 1, 6-hexanediol diacrylate, pentaerythritol triacrylate, 2-ethyl-4-methylimidazole, copper, nickel, diaryl iodonium salt and diisopropyl peroxydicarbonate, and the content of each component of the ultraviolet curing conductive adhesive is as follows: 65 parts of epoxy acrylic resin, 0.7 part of 1, 6-hexanediol diacrylate, 0.5 part of pentaerythritol triacrylate, 12 parts of 2-ethyl-4-methylimidazole, 36 parts of copper, 14 parts of nickel, 0.9 part of diaryl iodonium salt and 0.5 part of diisopropyl peroxydicarbonate. Wherein the mesh number of the copper is 120 meshes, and the mesh number of the nickel is 130 meshes.
The preparation method of the ultraviolet curing conductive adhesive comprises the following steps:
(1) preparing epoxy acrylic resin: dissolving epoxy resin in toluene, dropwise adding a mixed solution of hydroquinone, N-dimethylaniline and isooctyl acrylate into the epoxy resin for 50 minutes, reacting at 90 ℃ for 1 hour, and carrying out reduced pressure distillation to obtain epoxy acrylic resin, wherein the mass ratio of the epoxy resin, the hydroquinone, the N, N-dimethylaniline and the isooctyl acrylate is 100:0.7:0.7: 8;
(2) uniformly mixing epoxy acrylic resin, 1, 6-hexanediol diacrylate, pentaerythritol triacrylate, 2-ethyl-4-methylimidazole, copper, nickel, diaryl iodonium salt and diisopropyl peroxydicarbonate to obtain the ultraviolet curing conductive adhesive.
Example two:
the ultraviolet curing conductive adhesive comprises the following components of epoxy acrylic resin, 1, 6-hexanediol diacrylate, pentaerythritol triacrylate, 2-ethyl-4-methylimidazole, copper, nickel, triarylsulfonium salt and diisopropyl peroxydicarbonate, and the content of each component of the ultraviolet curing conductive adhesive is as follows: the adhesive comprises, by weight, 60 parts of epoxy acrylic resin, 1 part of 1, 6-hexanediol diacrylate, 0.7 part of pentaerythritol triacrylate, 11 parts of 2-ethyl-4-methylimidazole, 35 parts of copper, 15 parts of nickel, 1 part of triarylsulfonium salt and 0.5 part of diisopropyl peroxydicarbonate. Wherein the mesh number of the copper is 100 meshes, and the mesh number of the nickel is 100 meshes.
The preparation method of the ultraviolet curing conductive adhesive comprises the following steps:
(1) preparing epoxy acrylic resin: dissolving epoxy resin in toluene, dropwise adding a mixed solution of hydroquinone, N-dimethylaniline and isooctyl acrylate into the epoxy resin for 60 minutes, reacting at 85 ℃ for 1.5 hours, and carrying out reduced pressure distillation to obtain epoxy acrylic resin, wherein the mass ratio of the epoxy resin, the hydroquinone, the N, N-dimethylaniline and the isooctyl acrylate is 100:0.5:0.5: 9;
(2) uniformly mixing epoxy acrylic resin, 1, 6-hexanediol diacrylate, pentaerythritol triacrylate, 2-ethyl-4-methylimidazole, copper, nickel, triarylsulfonium salt and diisopropyl peroxydicarbonate to obtain the ultraviolet curing conductive adhesive.
Example three:
the ultraviolet curing conductive adhesive comprises the following components of epoxy acrylic resin, 1, 6-hexanediol diacrylate, pentaerythritol triacrylate, 2-ethyl-4-methylimidazole, copper, nickel, diaryl iodonium salt and diisopropyl peroxydicarbonate, and the content of each component of the ultraviolet curing conductive adhesive is as follows: the adhesive comprises, by weight, 70 parts of epoxy acrylic resin, 0.1 part of 1, 6-hexanediol diacrylate, 1 part of pentaerythritol triacrylate, 14 parts of 2-ethyl-4-methylimidazole, 40 parts of copper, 10 parts of nickel, 0.4 part of diaryl iodonium salt and 0.6 part of diisopropyl peroxydicarbonate. Wherein the mesh number of the copper is 150 meshes, and the mesh number of the nickel is 150 meshes.
The preparation method of the ultraviolet curing conductive adhesive comprises the following steps:
(1) preparing epoxy acrylic resin: dissolving epoxy resin in toluene, dropwise adding a mixed solution of hydroquinone, N-dimethylaniline and isooctyl acrylate into the epoxy resin for 55 minutes, reacting at 95 ℃ for 1.5 hours, and carrying out reduced pressure distillation to obtain epoxy acrylic resin, wherein the mass ratio of the epoxy resin, the hydroquinone, the N, N-dimethylaniline and the isooctyl acrylate is 100: 1: 1: 10;
(2) uniformly mixing epoxy acrylic resin, 1, 6-hexanediol diacrylate, pentaerythritol triacrylate, 2-ethyl-4-methylimidazole, copper, nickel, diaryl iodonium salt and diisopropyl peroxydicarbonate to obtain the ultraviolet curing conductive adhesive.
Comparative example 1
The ultraviolet curing conductive adhesive comprises the following components of epoxy acrylic resin, 1, 6-hexanediol diacrylate, pentaerythritol triacrylate, 2-ethyl-4-methylimidazole, copper, nickel, diaryl iodonium salt and diisopropyl peroxydicarbonate, and the content of each component of the ultraviolet curing conductive adhesive is as follows: the adhesive comprises, by weight, 75 parts of epoxy acrylic resin, 1.5 parts of 1, 6-hexanediol diacrylate, 1.5 parts of pentaerythritol triacrylate, 15 parts of 2-ethyl-4-methylimidazole, 45 parts of copper, 20 parts of nickel, 1.2 parts of diaryl iodonium salt and 0.7 part of diisopropyl peroxydicarbonate. Wherein the mesh number of the copper is 200 meshes, and the mesh number of the nickel is 200 meshes.
The preparation method of the ultraviolet curing conductive adhesive comprises the following steps:
(1) preparing epoxy acrylic resin: dissolving epoxy resin in toluene, dropwise adding a mixed solution of hydroquinone, N-dimethylaniline and isooctyl acrylate into the epoxy resin for 55 minutes, reacting at 95 ℃ for 1.5 hours, and carrying out reduced pressure distillation to obtain epoxy acrylic resin, wherein the mass ratio of the epoxy resin, the hydroquinone, the N, N-dimethylaniline and the isooctyl acrylate is 100: 1: 1: 12;
(2) uniformly mixing epoxy acrylic resin, 1, 6-hexanediol diacrylate, pentaerythritol triacrylate, 2-ethyl-4-methylimidazole, copper, nickel, diaryl iodonium salt and diisopropyl peroxydicarbonate to obtain the ultraviolet curing conductive adhesive.
Comparative example No. two
The ultraviolet curing conductive adhesive comprises the following components of epoxy acrylic resin, 1, 6-hexanediol diacrylate, pentaerythritol triacrylate, 2-ethyl-4-methylimidazole, copper, nickel, diaryl iodonium salt and diisopropyl peroxydicarbonate, and the content of each component of the ultraviolet curing conductive adhesive is as follows: 55 parts of epoxy acrylic resin, 0.05 part of 1, 6-hexanediol diacrylate, 0.4 part of pentaerythritol triacrylate, 10 parts of 2-ethyl-4-methylimidazole, 20 parts of copper, 8 parts of nickel, 0.6 part of diaryl iodonium salt and 0.2 part of diisopropyl peroxydicarbonate. Wherein the mesh number of the copper is 150 meshes, and the mesh number of the nickel is 150 meshes.
The preparation method of the ultraviolet curing conductive adhesive comprises the following steps:
(1) preparing epoxy acrylic resin: dissolving epoxy resin in toluene, dropwise adding a mixed solution of hydroquinone, N-dimethylaniline and isooctyl acrylate into the epoxy resin for 55 minutes, reacting at 95 ℃ for 1.5 hours, and carrying out reduced pressure distillation to obtain epoxy acrylic resin, wherein the mass ratio of the epoxy resin, the hydroquinone, the N, N-dimethylaniline and the isooctyl acrylate is 100: 1: 1: 6;
(2) uniformly mixing epoxy acrylic resin, 1, 6-hexanediol diacrylate, pentaerythritol triacrylate, 2-ethyl-4-methylimidazole, copper, nickel, diaryl iodonium salt and diisopropyl peroxydicarbonate to obtain the ultraviolet curing conductive adhesive.
A cuboid groove with the length of 10mm, the width of 4mm and the depth of 4mm is arranged on organic glass, and ultraviolet light curing conductive adhesive obtained in the first embodiment, the second embodiment, the third embodiment, the first comparative example and the second comparative example is placed in the groove and cured under an ultraviolet lamp. The results show that the cure time for example one is 6 minutes, the cure time for example two is 6 minutes, the cure time for example three is 7 minutes, the cure time for comparative example one is 15 minutes, and the cure time for comparative example two is 12 minutes.
The conductive rubber strips formed in the first, second and third examples and the first and second comparative examples were subjected to a resistance test to obtain a volume resistivity of 1.5 x 10 in the first example-3Ω · cm, volume resistivity of example two 1.4 x 10-3Ω · cm, volume resistivity of example three 1.5 × 10-3Omega cm, volume resistivity of comparative example one 2.5 x 10-3Omega cm, and the conductive adhesive has granular shapeVolume resistivity of ratio two is 2.2 x 10-3Ω·cm。
As can be seen from the above, the components of copper and nickel are added into the conductive adhesive, so that the ultraviolet light curing conductive adhesive has a conductive effect, and the component of epoxy acrylic resin mainly has an adhesive effect. The contents and the meshes of the components copper and nickel are determined, the content of the component epoxy acrylic resin is determined, the resistivity of the conductive adhesive can be ensured, if the contents of the components copper and nickel are too low, the resistivity cannot achieve the effect of the conductive adhesive, and if the contents of the components copper and nickel are too high, the resistivity cannot be improved, and the components copper and nickel are in a granular shape in the conductive adhesive, so that the appearance and the effect are influenced.
The components of aryl onium salt photoinitiator and diisopropyl peroxydicarbonate are used as the photoinitiator, and the two components are mixed and compounded with other components, so that the requirements under various ultraviolet light conditions can be met, and the curing time is short under various use conditions. 1, 6-hexanediol diacrylate, pentaerythritol triacrylate and 2-ethyl-4-methylimidazole are used as auxiliary materials of the conductive adhesive, so that the adhesive effect and stability of the conductive adhesive can be ensured.
The invention has the beneficial effects that:
the ultraviolet light curing conductive adhesive has high curing speed, is particularly remarkable for adhesive tapes with the required thickness of more than 100 micrometers, can be cured without heating, is easy to prepare, has good stability, and is environment-friendly and safe.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (9)
1. The ultraviolet-curing conductive adhesive is characterized by comprising the following components in percentage by weight: the epoxy acrylic resin is prepared from 60-70 parts by weight of epoxy acrylic resin, 0.1-1 part by weight of 1, 6-hexanediol diacrylate, 0.5-1 part by weight of pentaerythritol triacrylate, 11-14 parts by weight of 2-ethyl-4-methylimidazole, 35-40 parts by weight of copper, 10-15 parts by weight of nickel and 1-1.5 parts by weight of a photoinitiator, wherein the epoxy acrylic resin is prepared from epoxy resin, hydroquinone, N-dimethylaniline and isooctyl acrylate serving as raw materials, and the photoinitiator is selected from at least one of aryl onium salt photoinitiators and diisopropyl peroxydicarbonate.
2. The UV-curable conductive adhesive according to claim 1, wherein the arylonium salt photoinitiator is one or a mixture of diaryliodonium salt and triarylsulfonium salt.
3. The UV-curable conductive adhesive according to claim 1, wherein the copper mesh is 100-150 mesh.
4. The UV-curable conductive adhesive according to claim 1, wherein the nickel has a mesh size of 100-150 meshes.
5. The ultraviolet-curable conductive adhesive according to claim 1, wherein the mass ratio of the epoxy resin, the hydroquinone, the N, N-dimethylaniline and the isooctyl acrylate is 100:0.5-1:0.5-1: 8-10.
6. The method for preparing the ultraviolet curing conductive adhesive according to claim 1, comprising the steps of:
(1) preparing epoxy acrylic resin: dissolving epoxy resin, adding a mixed solution of hydroquinone, N-dimethylaniline and isooctyl acrylate, and reacting to obtain epoxy acrylic resin;
(2) uniformly mixing epoxy acrylic resin, 1, 6-hexanediol diacrylate, pentaerythritol triacrylate, 2-ethyl-4-methylimidazole, copper, nickel and a photoinitiator to obtain the ultraviolet curing conductive adhesive.
7. The method for preparing an ultraviolet light curing conductive adhesive according to claim 6, wherein the mixture of benzenediol, N-xylidine and isooctyl acrylate in the step (1) is added dropwise to the epoxy resin.
8. The method for preparing an ultraviolet light curing conductive adhesive according to claim 7, wherein the dropping time in the step (1) is 50 to 60 minutes.
9. The method for preparing the ultraviolet light curing conductive adhesive according to claim 6, wherein the reaction time in the step (1) is 1-1.5 hours, and the reaction temperature is 85-95 ℃.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010695246.0A CN111732923A (en) | 2020-07-19 | 2020-07-19 | Ultraviolet light curing conductive adhesive and preparation method thereof |
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| CN202010695246.0A CN111732923A (en) | 2020-07-19 | 2020-07-19 | Ultraviolet light curing conductive adhesive and preparation method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1339055A (en) * | 1999-02-08 | 2002-03-06 | 日立化成工业株式会社 | Adhesive, electrode-connecting structure, and method of connecting electrodes |
| CN1699492A (en) * | 2005-07-11 | 2005-11-23 | 大连轻工业学院 | Photo-curable conductive adhesive and method for making same |
| CN102127386A (en) * | 2010-12-29 | 2011-07-20 | 东莞市新懿电子材料技术有限公司 | Photocuring and thermocuring conductive adhesive and preparation method |
-
2020
- 2020-07-19 CN CN202010695246.0A patent/CN111732923A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1339055A (en) * | 1999-02-08 | 2002-03-06 | 日立化成工业株式会社 | Adhesive, electrode-connecting structure, and method of connecting electrodes |
| CN1699492A (en) * | 2005-07-11 | 2005-11-23 | 大连轻工业学院 | Photo-curable conductive adhesive and method for making same |
| CN102127386A (en) * | 2010-12-29 | 2011-07-20 | 东莞市新懿电子材料技术有限公司 | Photocuring and thermocuring conductive adhesive and preparation method |
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