CN111726503B - Camera module and electronic equipment - Google Patents
Camera module and electronic equipment Download PDFInfo
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- CN111726503B CN111726503B CN202010601406.0A CN202010601406A CN111726503B CN 111726503 B CN111726503 B CN 111726503B CN 202010601406 A CN202010601406 A CN 202010601406A CN 111726503 B CN111726503 B CN 111726503B
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- lens
- adjusting mechanism
- path adjusting
- light
- photosensitive
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The application discloses camera module and electronic equipment belongs to electronic equipment and shoots technical field. The camera module comprises a module bracket, a first lens, a second lens, a light path adjusting mechanism and a photosensitive chip; the first lens, the second lens, the light path adjusting mechanism and the photosensitive chip are all arranged on the module bracket, and the light path adjusting mechanism is movably arranged on the module bracket; the light path adjusting mechanism is provided with a first position and a second position, and under the condition that the light path adjusting mechanism is positioned at the first position, light rays emitted into the first lens can be reflected to the photosensitive surface of the photosensitive chip through the light path adjusting mechanism; under the condition that the light path adjusting mechanism is at the second position, the light rays emitted into the second lens can be reflected to the photosensitive surface of the photosensitive chip through the light path adjusting mechanism. The scheme can solve the problem of high manufacturing cost of the electronic equipment.
Description
Technical Field
The application belongs to the technical field of electronic equipment shooting, and particularly relates to a camera module and electronic equipment.
Background
With the diversification of user demands, more and more electronic devices enter people's lives, such as mobile phones, tablet computers and the like. The shooting function is more and more widely applied to electronic equipment, so that a user can conveniently record life anytime and anywhere.
In the related art, in order to enable an electronic device to have a better shooting function, a camera module of the electronic device is generally provided with a plurality of lenses and a plurality of photosensitive chips, and the plurality of lenses and the plurality of photosensitive chips correspond to each other one to one. For example, the camera module can set up the camera lens of a conventional focus and the camera lens of a long focal length, and this kind of mode of setting can promote electronic equipment's shooting performance to it is better to make the shooting effect.
In the process of implementing the invention, the inventor finds that in the related art, each lens corresponds to one photosensitive chip, and at this time, the number of the photosensitive chips is large, so that the manufacturing cost of the camera module is increased, and the manufacturing cost of the electronic device is increased.
Disclosure of Invention
The embodiment of the application aims to provide a camera module and electronic equipment, and the problem that the manufacturing cost of the electronic equipment is high can be solved.
In order to solve the technical problem, the present application is implemented as follows:
the embodiment of the application provides a camera module, which comprises a module bracket, a first lens, a second lens, a light path adjusting mechanism and a photosensitive chip, wherein the first lens is arranged on the module bracket;
the first lens, the second lens, the light path adjusting mechanism and the photosensitive chip are all arranged on a module support, and the light path adjusting mechanism is movably arranged on the module support;
the light path adjusting mechanism is provided with a first position and a second position, and under the condition that the light path adjusting mechanism is located at the first position, light rays entering the first lens can be reflected to a light sensing surface of the light sensing chip through the light path adjusting mechanism; and under the condition that the light path adjusting mechanism is at the second position, the light rays emitted into the second lens can be reflected to the photosensitive surface of the photosensitive chip through the light path adjusting mechanism.
The embodiment of the application provides electronic equipment, which comprises the camera module.
In the embodiment of the application, the optical path adjusting mechanism has a first position and a second position, and when the optical path adjusting mechanism is in the first position, the light rays entering the first lens can be reflected to the photosensitive surface of the photosensitive chip through the optical path adjusting mechanism; under the condition that the light path adjusting mechanism is at the second position, the light rays emitted into the second lens can be reflected to the photosensitive surface of the photosensitive chip through the light path adjusting mechanism. In this scheme, light path adjustment mechanism can change the transfer path of light to can realize first camera lens and second camera lens sharing sensitization chip, and then make the quantity that sensitization chip can set up less, thereby make electronic equipment's manufacturing cost lower.
Drawings
Fig. 1 is a schematic structural diagram of an electronic device disclosed in an embodiment of the present application;
fig. 2 is a schematic structural diagram of a light path adjusting mechanism in a camera module according to an embodiment of the present disclosure, the light path adjusting mechanism being located at a first position;
fig. 3 is a schematic structural diagram of the optical path adjusting mechanism in the camera module according to the embodiment of the present application when the optical path adjusting mechanism is located at the second position.
Description of reference numerals:
100-module bracket,
210-first lens, 220-second lens,
300-optical path adjusting mechanism, 310-first reflecting surface, 320-second reflecting surface,
400-photosensitive chip,
500-a driving mechanism,
600-circuit board,
700-a shell,
800-main board.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The following describes the camera module provided in the embodiments of the present application in detail through specific embodiments and application scenarios thereof with reference to the accompanying drawings.
Referring to fig. 1 to 3, an embodiment of the present application discloses a camera module, which includes a module bracket 100, a first lens 210, a second lens 220, a light path adjusting mechanism 300, a photosensitive chip 400, and a circuit board 600.
The module bracket 100 provides an installation space for other components of the camera module, and the first lens 210, the second lens 220, the light path adjusting mechanism 300 and the photosensitive chip 400 are all arranged on the module bracket 100. The optical path adjusting mechanism 300 is movably disposed on the module bracket 100, and the optical path adjusting mechanism 300 can change the transmission direction of the light entering the first lens 210 or the second lens 220. The photosensitive chip 400 is disposed on the circuit board 600, the photosensitive chip 400 is electrically connected to the circuit board 600, and the circuit board 600 is electrically connected to the main board 800 of the electronic device. Light rays emitted by the first lens 210 or the second lens 220 enter the photosensitive chip 400, the photosensitive chip 400 converts the light signals into electrical signals, and the electrical signals are transmitted to the main board 800 of the electronic device through the circuit board 600, so that the shooting function of the electronic device is realized.
In a specific operation process, the optical path adjusting mechanism 300 has a first position and a second position, and when the optical path adjusting mechanism 300 is located at the first position, the light entering the first lens 210 can be reflected to the photosensitive surface of the photosensitive chip 400 through the optical path adjusting mechanism 300, and at this time, the transmission path of the light entering the second lens 220 is cut off, so that the light entering the second lens 220 cannot be transmitted to the photosensitive surface of the photosensitive chip 400, and therefore, the light received by the photosensitive chip 400 is only the light entering the first lens 210, the first lens 210 is in an open state, and the second lens 220 is in a closed state.
When the optical path adjusting mechanism 300 is in the second position, the light entering the second lens 220 can be reflected to the photosensitive surface of the photosensitive chip 400 through the optical path adjusting mechanism 300, and at this time, the transmission path of the light entering the first lens 210 is cut off, so that the light entering the first lens 210 cannot be transmitted to the photosensitive surface, and therefore, the light received by the photosensitive chip 400 is only the light entering the second lens 220, the second lens 220 is in an open state, and the first lens 210 is in a closed state.
In the embodiment of the present application, the light path adjusting mechanism 300 can change the transmission path of the light, so that the first lens 210 and the second lens 220 can share the photosensitive chip 400, and the number of the photosensitive chips 400 can be reduced, thereby reducing the manufacturing cost of the electronic device.
In addition, the number of the photosensitive chips 400 is small, so that the photosensitive chips 400 occupy a small installation space of the electronic device, the thickness of the electronic device is small, and the user experience can be improved.
In addition, the number of the photosensitive chips 400 is small, so that the resource occupation of the photosensitive chips 400 on chips such as a processor of the electronic device is improved, and the structural design of the electronic device is simpler.
As described above, the optical path adjusting mechanism 300 is movably disposed on the module bracket 100, optionally, the optical path adjusting mechanism 300 may be rotatably engaged with the module bracket 100, or may be linearly movably engaged with (e.g., slide or roll) the module bracket 100, and the optical path adjusting mechanism 300 may also be movably connected with the module bracket 100 in a combined manner of moving and rotating, and the specific movement form of the optical path adjusting mechanism 300 is not limited herein. A slide rail may be disposed on the module bracket 100, and the light path adjusting mechanism 300 may be slidably engaged with the slide rail, so that the light path adjusting mechanism 300 may be movably connected to the module bracket 100. Of course, the optical path adjusting mechanism 300 and the module holder 100 may be connected in other manners, which is not limited herein.
In order to improve the performance of the camera module, in an alternative embodiment, the optical parameters of the first lens 210 and the second lens 220 are different. The optical parameters may be the field angle, the focal length, the imaging size of the lens, the resolution of the lens, and the like of the first lens 210 and the second lens 220. For example, the first lens 210 may be a conventional focal length lens, and the second lens 220 may be a long focal length lens. Of course, the first lens 210 and the second lens 220 may also be lenses with other optical parameters, which is not limited herein. In this scheme, the user can use the camera lens of different optical parameters in the shooting environment of difference, and then improves the shooting effect of camera module, further improves user experience.
In an alternative embodiment, the optical path adjusting mechanism 300 may include a first reflective surface 310 and a second reflective surface 320, and the first reflective surface 310 and the second reflective surface 320 are used for reflecting the light of the first lens 210 and the second lens 220.
In a specific operation process, when the optical path adjusting mechanism 300 is in the first position, the light incident into the first lens 210 is reflected by the first reflecting surface 310 and the second reflecting surface 320 to the photosensitive surface of the photosensitive chip 400 in sequence. The light incident into the first lens 210 is reflected for the first time by the first reflecting surface 310, and the reflected light is emitted to the second reflecting surface 320, and then reflected for the second time by the second reflecting surface 320 and enters the photosensitive surface of the photosensitive chip 400.
When the optical path adjusting mechanism 300 is at the second position, the light entering the second lens 220 is reflected to the photosensitive surface of the photosensitive chip 400 by the second reflecting surface 320 and the first reflecting surface 310 in sequence, at this time, the light entering the second lens 220 is reflected for the first time by the second reflecting surface 320, the reflected light is emitted to the first reflecting surface 310, and then is reflected for the second time by the first reflecting surface 310 and enters the photosensitive surface of the photosensitive chip 400.
In this scheme, the angles of the first reflecting surface 310 and the second reflecting surface 320 are different, and the reflecting light rays in different directions can be formed, so that the positions of the first lens 210, the second lens 220 and the photosensitive chip 400 can be set flexibly, the setting positions of the first lens 210, the second lens 220 and the photosensitive chip 400 are not limited by the specific structure of the light path adjusting mechanism 300, and the structure of the camera module is simpler.
A specific structure of the optical path adjusting mechanism 300 is disclosed herein, but other structures may be adopted, which is not limited herein. Specifically, the optical path adjusting mechanism 300 may include a mechanism bracket, a first reflection portion and a second reflection portion, the mechanism bracket is used for mounting the first reflection portion and the second reflection portion, the first reflection portion and the second reflection portion may be respectively disposed at two ends of the mechanism bracket, the first reflection portion and the second reflection portion may be disposed oppositely, the first reflection surface 310 is a surface of the first reflection portion facing the second reflection portion, and the second reflection surface 320 is a surface of the second reflection portion facing the first reflection portion. According to the scheme, the two reflecting parts are combined, so that a required light path is obtained, and further the light path adjusting mechanism 300 is simple in structure, simple in manufacturing process and convenient to install. In addition, first reflection part and second reflection part are two independent reflection parts, and then make the mounted position of first reflection part and second reflection part can select according to the specific structure of camera module.
Optionally, the first reflection part and the second reflection part may be mirrors, or may be a reflection coating or a reflection film disposed on the mechanism support.
Further, the mechanism support can be provided with a light guide channel, and the first reflecting part and the second reflecting part can be located on the inner walls of two ends of the light guide channel. At this moment, light can be along the light guide channel transmission to prevent that external device from sheltering from light, thereby improve the utilization ratio of light.
In an alternative embodiment, in the orthogonal projection direction perpendicular to the photosensitive surface of the photosensitive chip 400, with the optical path adjusting mechanism 300 in the first position, the projection profile of the field of view range of the first lens 210 may be located within the projection profile of the first reflective surface 310, and the projection profile of the photosensitive surface of the photosensitive chip 400 is located within the projection profile of the second reflective surface 320. At this time, the reflection range of the first reflection surface 310 may cover the field of view range of the first lens 210, so that more light rays incident on the first lens 210 can be incident on the first reflection surface 310. The reflection range of the second reflection surface 320 may cover the photosensitive surface of the photosensitive chip 400, so that more light rays reflected by the second reflection surface 320 can enter the photosensitive surface.
With the optical path adjusting mechanism 300 in the second position, the projection profile of the field of view range of the second lens 220 is located within the projection profile of the second reflecting surface 320, and the projection profile of the photosensitive surface of the photosensitive chip 400 is located within the projection profile of the first reflecting surface 310. At this time, the reflection range of the second reflection surface 320 may cover the field of view of the second lens 220, so that most of the light incident on the second lens 220 can be incident on the second reflection surface 320. The reflection range of the first reflection surface 310 may cover the photosensitive surface of the photosensitive chip 400, so that most of the light reflected by the first reflection surface 310 can enter the photosensitive surface.
In this scheme, most of the light entering the first lens 210 or the second lens 220 can enter the first reflecting surface 310 and the second reflecting surface 320, so that the utilization rate of the light can be improved, and the optical performance of the camera module can be improved.
The optical path adjusting mechanism 300 in the above embodiment may adopt a mirror reflection mode, but the mirror reflection may absorb a part of light, so as to easily cause loss of light, and further make the optical performance of the camera module worse. For this, in another alternative embodiment, the optical path adjusting mechanism 300 may be a total reflection mirror, and the first reflection surface 310 and the second reflection surface 320 are respectively disposed at both sides of the total reflection mirror. In this scheme, the loss of light is difficult to cause at the in-process of reflection light to the holophote, and then makes the optical property of the module of making a video recording higher. The principle of the total reflection mirror for reflecting light is known in the art and will not be described in detail herein.
In another alternative embodiment, the included angle between the first reflective surface 310 and the second reflective surface 320 and the light-sensing surface of the light-sensing chip 400 may be 30 ° to 60 °, and specifically, the included angle may be 45 °. In this scheme, first plane of reflection 310 and the setting of the 320 slope 45 of second plane of reflection, and then make the light of penetrating into the camera lens parallel with the light of penetrating into sensitization chip 400, light can penetrate into sensitization chip 400 perpendicularly, and then make each regional received light of the sensitization face of sensitization chip 400 comparatively even to make the optical property of camera module better.
The movement of the optical path adjusting mechanism 300 relative to the module holder 100 can be manually driven by a user, but the manual operation has a problem of low precision. For this purpose, in an alternative embodiment, the camera module may further include a driving mechanism 500, the driving mechanism 500 is connected to the optical path adjusting mechanism 300, and the driving mechanism 500 drives the optical path adjusting mechanism 300 to switch between the first position and the second position. The driving mechanism 500 can precisely drive the optical path adjusting mechanism 300 to move, and meanwhile, the user can trigger the driving mechanism 500 to act in a wireless control mode, so that the optical path adjusting mechanism 300 is driven to move, and the switching operation of the optical path adjusting mechanism 300 is more convenient to implement.
Alternatively, the driving mechanism 500 may be a servo motor, a stepping electrode, a dc brushless electrode, or the like, which is not limited in this embodiment.
In another alternative embodiment, the driving mechanism 500 may include a driving source that drives the driving rod to move, and a driving rod that is connected to the optical path adjusting mechanism 300 and drives the optical path adjusting mechanism 300 to move. In this embodiment, the driving rod drives the optical path adjusting mechanism 300 to move along the extending direction of the driving rod, so that the movement mode of the optical path adjusting mechanism 300 is simple and reliable.
Alternatively, the transmission rod may be a screw rod, and the driving source may drive the screw rod to rotate, and the screw rod is in threaded connection with the optical path adjusting mechanism 300, so that the screw rod can drive the optical path adjusting mechanism 300 to move. Alternatively, the driving source may directly drive the transmission lever to move, so that the transmission lever moves the optical path adjustment mechanism 300. Still alternatively, the transmission rod may be a drive shaft of the drive source. The driving source may be a cylinder, a driving motor, a linear motor, or other power structures, which is not limited herein.
In another alternative embodiment, the driving mechanism 500 may be disposed on the housing 700 of the electronic device, and at this time, the module bracket 100 does not need to reserve an installation space for the driving mechanism 500, so that the size of the module bracket 100 can be smaller, and thus the structure of the camera module is smaller and more compact.
In an alternative embodiment, the module holder 100 may be located between the first lens 210 and the second lens 220, the sensor chip 400 may be located between the first lens 210 and the second lens 220, and the first lens 210, the second lens 220, and the sensor chip 400 may all be located on the same side of the optical path adjusting mechanism 500. In this scheme, the light incidence direction of the first lens 210 and the second lens 220 is the same, the photosensitive chip 400 is located between the first lens 210 and the second lens 220, at this time, the moving path of the light path adjusting mechanism 300 is short, and further the moving speed of the light path adjusting mechanism 300 is fast, so that the switching efficiency of the light path adjusting mechanism 300 between the first position and the second position can be improved, and further the use performance of the camera module can be improved.
Further, the orientation of the light-sensing surface of the light-sensing chip 400 is opposite to the orientation of the first lens 210 and the second lens 220. In this scheme, the incident direction of the light rays of the first lens 210 and the second lens 220 is opposite to and parallel to the incident direction of the light rays of the photosensitive surface of the photosensitive chip 400, so that the photosensitive chip 400 can be disposed between the first lens 210 and the second lens 220, thereby making the structure of the camera module more compact and the movement path of the light path adjusting mechanism 300 shorter.
In another alternative embodiment, the circuit board 600 may be disposed on the module holder 100, the circuit board 600 and the optical path adjusting mechanism 300 are respectively disposed at two sides of the photosensitive chip 400, the photosensitive chip 400 is electrically connected to the circuit board 600, a photosensitive surface of the photosensitive chip 400 may face the optical path adjusting mechanism 300, and the circuit board 600 may be disposed between the first lens 210 and the second lens 220. In this scheme, the circuit board 600 is located between the first lens 210 and the second lens 220, and at this time, two sides of the circuit board 600 may be connected to sidewalls of the first lens 210 and the second lens 220, so that the strength of the camera module is better.
In addition, the first lens 210 and the second lens 220 are close to the circuit board 600, so that the positions of the components such as the zoom motor, the optical anti-shake module and the like in the first lens 210 and the second lens 220 are close to the circuit board 600, so that the components such as the zoom motor, the optical anti-shake module and the like are more conveniently connected with the circuit board 600, and the structure of the camera module is more compact.
Optionally, in this embodiment of the application, the circuit board 600 may be a rigid circuit board, or may be a circuit board having flexibility. For example, the circuit board 600 may be a printed circuit board, a rigid-flex board, or a flexible circuit board and a stiffener that are attached to each other. Of course, other structures may be used and are not limited herein.
Based on the camera module of any one of the above embodiments of this application, this application embodiment still discloses an electronic equipment, and the electronic equipment who discloses includes any one of the above embodiments camera module.
The electronic device disclosed in the embodiment of the present application may be a smart phone, a tablet computer, an electronic book reader, a wearable device (e.g., a smart watch), an electronic game machine, and the like, and the specific kind of the electronic device is not limited in the embodiment of the present application.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (12)
1. A camera module is characterized by comprising a module bracket (100), a first lens (210), a second lens (220), a light path adjusting mechanism (300) and a photosensitive chip (400);
the first lens (210), the second lens (220), the light path adjusting mechanism (300) and the photosensitive chip (400) are all arranged on a module support (100), and the light path adjusting mechanism (300) is movably arranged on the module support (100);
the module bracket (100) is located between the first lens (210) and the second lens (220), the photosensitive chip (400) is located between the first lens (210) and the second lens (220), the first lens (210), the second lens (220) and the photosensitive chip (400) are all located on the same side of the light path adjusting mechanism (300), and the direction of the photosensitive surface of the photosensitive chip (400) is opposite to the direction of the first lens (210) and the second lens (220);
the light path adjusting mechanism (300) is provided with a first position and a second position, when the light path adjusting mechanism (300) is located at the first position, the light rays entering the first lens (210) can be reflected to the light sensing surface of the light sensing chip (400) through the light path adjusting mechanism (300), and the transmission path of the light rays entering the second lens (220) is cut off and cannot be transmitted to the light sensing surface; when the optical path adjusting mechanism (300) is in the second position, the transmission path of the light entering the first lens (210) is cut off and cannot be transmitted to the photosensitive surface, and the light entering the second lens (220) can be reflected to the photosensitive surface of the photosensitive chip (400) through the optical path adjusting mechanism (300).
2. The camera module of claim 1, wherein the optical parameters of the first lens (210) and the second lens (220) are different.
3. The camera module according to claim 1, wherein the optical path adjusting mechanism (300) comprises a first reflecting surface (310) and a second reflecting surface (320);
when the optical path adjusting mechanism (300) is at the first position, the light rays entering the first lens (210) are reflected to the photosensitive surface of the photosensitive chip (400) by the first reflecting surface (310) and the second reflecting surface (320) in sequence;
when the optical path adjusting mechanism (300) is in the second position, the light rays entering the second lens (220) are reflected to the photosensitive surface of the photosensitive chip (400) by the second reflecting surface (320) and the first reflecting surface (310) in sequence.
4. The camera module according to claim 3, wherein the optical path adjusting mechanism (300) includes a mechanism bracket, a first reflection portion and a second reflection portion, the first reflection portion and the second reflection portion are respectively disposed at two ends of the mechanism bracket, the first reflection portion and the second reflection portion are oppositely disposed, the first reflection surface (310) is a surface of the first reflection portion facing the second reflection portion, and the second reflection surface (320) is a surface of the second reflection portion facing the first reflection portion.
5. The camera module according to claim 4, wherein the mechanism holder defines a light guide channel, and the first and second reflection portions are disposed on inner walls of two ends of the light guide channel.
6. The camera module according to claim 3, wherein in a normal projection direction perpendicular to the photosensitive surface of the photosensitive chip (400), with the optical path adjusting mechanism (300) in the first position, a projection profile of the field of view range of the first lens (210) is located within a projection profile of the first reflective surface (310), and a projection profile of the photosensitive surface of the photosensitive chip (400) is located within a projection profile of the second reflective surface (320);
when the optical path adjusting mechanism (300) is in the second position, the projection profile of the field of view range of the second lens (220) is located within the projection profile of the second reflecting surface (320), and the projection profile of the photosensitive surface of the photosensitive chip (400) is located within the projection profile of the first reflecting surface (310).
7. The camera module according to claim 3, wherein the optical path adjusting mechanism (300) is a total reflection mirror, and the first reflection surface (310) and the second reflection surface (320) are respectively disposed on two sides of the total reflection mirror.
8. The camera module according to claim 3, wherein the first reflecting surface (310) and the second reflecting surface (320) form an angle of 45 ° with the photosensitive surface of the photosensitive chip (400).
9. The camera module according to claim 1, further comprising a driving mechanism (500), wherein the driving mechanism (500) is connected to the optical path adjusting mechanism (300), and the driving mechanism (500) drives the optical path adjusting mechanism (300) to switch between the first position and the second position.
10. The camera module according to claim 9, wherein the driving mechanism (500) comprises a driving source and a transmission rod, the driving source drives the transmission rod to move, the transmission rod is connected with the optical path adjusting mechanism (300), and the transmission rod drives the optical path adjusting mechanism (300) to move.
11. The camera module according to claim 1, further comprising a circuit board (600), wherein the circuit board (600) is disposed on the module support (100), the circuit board (600) and the optical path adjusting mechanism (300) are respectively disposed at two sides of the photosensitive chip (400), the photosensitive chip (400) is electrically connected to the circuit board (600), a photosensitive surface of the photosensitive chip (400) faces the optical path adjusting mechanism (300), and the circuit board (600) is disposed between the first lens (210) and the second lens (220).
12. An electronic device, comprising the camera module according to any one of claims 1 to 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010601406.0A CN111726503B (en) | 2020-06-28 | 2020-06-28 | Camera module and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010601406.0A CN111726503B (en) | 2020-06-28 | 2020-06-28 | Camera module and electronic equipment |
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| CN111726503A CN111726503A (en) | 2020-09-29 |
| CN111726503B true CN111726503B (en) | 2021-10-26 |
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| CN202010601406.0A Active CN111726503B (en) | 2020-06-28 | 2020-06-28 | Camera module and electronic equipment |
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| CN112422794A (en) * | 2020-11-16 | 2021-02-26 | 珠海格力电器股份有限公司 | Imaging device and terminal |
| CN112637464B (en) * | 2020-12-22 | 2022-04-29 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN112671960B (en) * | 2020-12-28 | 2023-12-15 | 维沃移动通信有限公司 | Electronic equipment |
| CN113660402A (en) * | 2021-08-19 | 2021-11-16 | 南昌逸勤科技有限公司 | Camera module and electronic equipment |
| CN113805408A (en) * | 2021-09-15 | 2021-12-17 | 东莞华贝电子科技有限公司 | Double-lens periscopic camera module and electronic equipment |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107465859A (en) * | 2017-09-19 | 2017-12-12 | 信利光电股份有限公司 | A kind of camera module and electronic equipment |
| CN109040561A (en) * | 2018-08-31 | 2018-12-18 | 维沃移动通信有限公司 | A kind of mobile terminal |
| CN110798602A (en) * | 2019-11-29 | 2020-02-14 | 维沃移动通信有限公司 | Camera module, electronic equipment, shooting control method and device |
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