CN111725110A - Semiconductor processing equipment - Google Patents

Semiconductor processing equipment Download PDF

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Publication number
CN111725110A
CN111725110A CN202010591899.4A CN202010591899A CN111725110A CN 111725110 A CN111725110 A CN 111725110A CN 202010591899 A CN202010591899 A CN 202010591899A CN 111725110 A CN111725110 A CN 111725110A
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CN
China
Prior art keywords
heat transfer
flange
semiconductor processing
transfer portion
processing apparatus
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Granted
Application number
CN202010591899.4A
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Chinese (zh)
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CN111725110B (en
Inventor
郭士选
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Beijing Naura Microelectronics Equipment Co Ltd
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Beijing Naura Microelectronics Equipment Co Ltd
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Priority to CN202010591899.4A priority Critical patent/CN111725110B/en
Publication of CN111725110A publication Critical patent/CN111725110A/en
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Publication of CN111725110B publication Critical patent/CN111725110B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32513—Sealing means, e.g. sealing between different parts of the vessel
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses semiconductor processing equipment, which comprises a cavity; the bracket is arranged on the side wall of the cavity; the sealing ring is arranged on the bracket; the dielectric window is arranged on the sealing ring; the heat transfer part is arranged around the medium window and is connected with the bracket through the flexible connecting part, and the heat transfer part can push the flexible connecting part to compress or stretch so that the heat transfer part can move along with the medium window; the heating part is arranged on one side of the heat transfer part, which is far away from the medium window in a surrounding way. The heat transfer part of the invention can move along with the medium window, so that the heat transfer part and the medium window can be in a relatively static state, and further, the heat transfer part can be prevented from wearing the medium window, and the service life of the medium window is prolonged.

Description

Semiconductor processing equipment
Technical Field
The invention relates to the technical field of semiconductor processing equipment, in particular to semiconductor processing equipment.
Background
In semiconductor processing equipment, radio frequency energy provided by a radio frequency power supply is generally transmitted into a reaction chamber, so as to ionize a special gas (such as argon Ar, helium He, nitrogen N2 or hydrogen H2) in a high vacuum state, thereby generating a plasma containing a large amount of active particles such as electrons, ions, excited atoms, molecules and radicals, which undergo various physical and chemical reactions with a wafer placed in the reaction chamber and exposed to a plasma environment, thereby changing the properties of the wafer surface, and further completing an etching process of the wafer.
The temperature control of the reaction chamber prior to each etch of the reaction chamber plays a crucial role in the outcome of the etch process, which directly affects the uniformity of the etch rate and the uniformity of the etch critical dimensions. In the process of controlling the temperature of the dielectric window of the reaction chamber, a heating device is generally wrapped in the circumferential direction of the dielectric window, so that the dielectric window is heated in the circumferential direction by the heating device, and the temperature of the dielectric window reaches the process required temperature.
In present semiconductor processing equipment, the medium window is usually supported on the sealing ring, and in the process of etching process, pressure difference can be generated between the reaction chamber and the external environment, so that the medium window can compress the sealing ring, the medium window moves relative to a support of the semiconductor processing equipment, the medium window is easy to wear, and the service life of the medium window can be influenced.
Disclosure of Invention
The invention discloses an observation window assembly and semiconductor processing equipment, and aims to solve the problem that a medium window is easily abraded in a heating mode of the medium window in the conventional semiconductor processing equipment.
In order to solve the problems, the invention adopts the following technical scheme:
a semiconductor processing apparatus, comprising:
a cavity;
the bracket is arranged on the side wall of the cavity;
the sealing ring is arranged on the bracket;
the dielectric window is arranged on the sealing ring;
the heat transfer part is arranged around the medium window and is connected with the bracket through a flexible connecting part, and the heat transfer part can push the flexible connecting part to compress or stretch so that the heat transfer part can move along with the medium window;
the heating part is arranged on one side, away from the medium window, of the heat transfer part in a surrounding mode.
The technical scheme adopted by the invention can achieve the following beneficial effects:
in the semiconductor processing equipment disclosed by the embodiment of the invention, the heat transfer part is connected with the bracket through the flexible connecting part, and in this case, the heat transfer part can move due to the flexible deformation capacity of the flexible connecting part, so that the heat transfer part can move along with the medium window under the condition that the medium window vibrates, the heat transfer part and the medium window can be in a relatively static state, the heat transfer part can be prevented from wearing the medium window, and the service life of the medium window can be prolonged.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a cross-sectional view of a semiconductor processing apparatus disclosed in an embodiment of the present invention;
FIG. 2 is a cross-sectional view of a semiconductor processing apparatus according to an embodiment of the present disclosure from another perspective;
FIG. 3 is a cross-sectional view of a flexible connection portion in a semiconductor processing apparatus according to an embodiment of the present invention;
FIG. 4 is a schematic structural view of a heat transfer portion in the semiconductor processing apparatus according to the embodiment of the present invention;
fig. 5 is a schematic structural view of a heat transfer portion of a semiconductor processing apparatus according to an embodiment of the present invention from another perspective.
Description of reference numerals:
100-a cavity;
200-support, 210-avoidance gap;
300-sealing ring;
400-a dielectric window;
500-heat transfer part, 510-heat transfer body, 520-first flanging, 530-second flanging, 540-fourth flanging and 541-positioning groove;
600-flexible connection, 610-first connection, 620-elastic, 630-second connection;
700-a heating part;
800-a first bolt;
900-support member.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
As shown in fig. 1 to 5, an embodiment of the present invention discloses a semiconductor processing apparatus including a chamber 100, a supporter 200, a sealing ring 300, a dielectric window 400, a heat transfer part 500, and a heating part 700.
The chamber 100 can provide a mounting location for other components of the semiconductor processing apparatus, and at the same time, the wafer can perform a corresponding physicochemical reaction in the chamber 100.
The support 200 is disposed on a sidewall of the chamber body 100, and the support 200 can facilitate assembly of other components of the semiconductor processing apparatus. The sealing ring 300 is arranged on the support 200, the dielectric window 400 is arranged on the sealing ring 300, and the dielectric window 400 can have light transmittance so that a worker can observe the reaction condition of the wafer in the cavity 100, and meanwhile, the sealing ring 300 can enable the dielectric window 400 and the cavity 100 to have a good sealing effect, so that the production yield of the wafer can be better improved.
Generally, before each etching of a semiconductor processing device, the temperature of the semiconductor processing device needs to be controlled, so that the uniformity of the etching rate and the uniformity of the etching critical dimension are better. Since the dielectric window 400 has a large wall thickness and diameter and a small thermal conductivity, it is very important to control the temperature of the dielectric window 400, and in the prior art, a heating device is usually wrapped around the dielectric window 400, so that the dielectric window 400 is heated in the circumferential direction by the heating device, so that the temperature of the dielectric window 400 reaches the process requirement temperature. However, generally, the heating device needs to be grounded, that is, one end of the heating device needs to be fixed to the support 200 of the semiconductor processing equipment, and therefore, when the dielectric window 400 moves, the dielectric window 400 and the heating device will move relatively, so that the heating device is prone to wear the dielectric window 400, and the service life of the dielectric window 400 is affected.
In the embodiment, the heat transfer portion 500 is disposed around the medium window 400, and the heat transfer portion 500 is connected to the bracket 200 through the flexible connection portion 600, and in particular, the heat transfer portion 500 may be electrically connected to the bracket 200 through the flexible connection portion 600, in which case the heat transfer portion 500 may push the flexible connection portion 600 to compress or stretch, so that the heat transfer portion 500 may move with the medium window 400, thereby allowing the heat transfer portion 500 and the medium window 400 to be in a relatively stationary state. Alternatively, the heat transfer portion 500 may be a ring-shaped structure so as to be able to wrap the dielectric window 400 better, so that the connection between the heat transfer portion 500 and the dielectric window 400 is better.
At the same time, the flexible connection portion 600 enables the heat transfer portion 500 to achieve grounding. Alternatively, the end surface of the flexible connection portion 600 facing the heat transfer portion 500 may be provided with a first nickel plating region, which may be in contact with the heat transfer portion 500, and the end surface of the flexible connection portion 600 facing the bracket 200 may be provided with a second nickel plating region, which may be in contact with a third nickel plating region on the bracket 200, thereby implementing a grounding process for the heat transfer portion 500. This way, the grounding effect of the heat transfer part 500 can be made good.
The heat transfer part 500 may be disposed around the dielectric window 400 by means of bonding, welding, screwing, or the like, so that the connection reliability between the heat transfer part 500 and the dielectric window 400 is good; alternatively, the heat transfer part 500 may be a flexible member so that the heat transfer part 500 can be elastically clamped to the medium window 400, thereby improving the reliability of the connection between the heat transfer part 500 and the medium window 400. Of course, the connection mode between the heat transfer portion 500 and the dielectric window 400 may be various, and the embodiment of the present invention is not limited thereto.
In the present embodiment, in order to prevent the heat transfer portion 500 from interfering with the bracket 200 and affecting the movement effect of the heat transfer portion 500, an escape gap 210 may be provided between the heat transfer portion 500 and the bracket 200, so that the heat transfer portion 500 can stably move along with the medium window 400, and the heat transfer portion 500 and the medium window 400 can be easily in a relatively stationary state.
The heating part 700 may generate heat when it is powered on, and specifically, the heating part 700 is disposed around a side of the heat transfer part 500 away from the dielectric window 400, so that heat is transferred to the dielectric window 400 through the heat transfer part 500, thereby controlling the temperature of the dielectric window 400. The heat transfer portion 500 can also prevent the heating portion 700 from directly contacting the dielectric window 400 and damaging the dielectric window 400. Alternatively, the heating part 700 may be an annular member, and the heating part 700 having such a structure may preferably wrap the heat transfer part 500, so that not only the heating effect on the dielectric window 400 is good, but also the connection reliability between the heating part 700 and the heat transfer part 500 may be improved.
As can be seen from the above, in the semiconductor processing apparatus according to the embodiment of the present invention, the heat transfer portion 500 is connected to the support 200 through the flexible connection portion 600, in this case, the heat transfer portion 500 can move due to the flexible deformation capability of the flexible connection portion 600, so that when the dielectric window 400 vibrates, the heat transfer portion 500 can move along with the dielectric window 400, so that the heat transfer portion 500 and the dielectric window 400 can be in a relatively stationary state, and the heat transfer portion 500 can be prevented from wearing the dielectric window 400, so as to improve the service life of the dielectric window 400, and further, the heat transfer portion 700 can achieve a good heating effect on the dielectric window 400 through the heat transfer portion 500.
In an embodiment of the present invention, the flexible connecting portion 600 may optionally include a first connecting member 610, an elastic member 620, and a second connecting member 630, which are connected in sequence, please refer to fig. 3. The flexible connection portion 600 may be connected to the heat transfer portion 500 by a first connection member 610, the flexible connection portion 600 may be connected to the bracket 200 by a second connection member 630, and the heat transfer portion 500 may push the elastic member 620 to compress or stretch. In this case, the first and second connection members 610 and 630 make the connection between the flexible connection portion 600 and the heat transfer portion 500 or the bracket 200 easier, and also can improve the connection reliability between the flexible connection portion 600 and the heat transfer portion 500 or the bracket 200; meanwhile, the first connection member 610 and the second connection member 630 are disposed at both ends of the elastic member 620, so that the elastic member 620 can better restrain the elastic member 620, so that the elastic member 620 can generate a more stable elastic force to the heat transfer part 500, and thus the heat transfer part 500 can better move along with the dielectric window 400.
Further, in order to facilitate the connection between the heat transfer part 500 and the bracket 200, the heat transfer part 500 may include a heat transfer body 510 and a first flange 520, the heat transfer body 510 may be disposed around an outer sidewall of the dielectric window 400 to enable the heat transfer body 510 to heat the dielectric window 400, the first flange 520 may be disposed outside the heat transfer body 510, and the first flange 520 may extend in a direction away from the dielectric window 400, and the first connector 610 may be connected to the first flange 520. In this case, the first flange 520 corresponds to a protruding structure on the heat transfer body 510, so that the first connector 610 and the heat transfer part 500 are more easily connected, and the reliability of connection between the first connector 610 and the heat transfer part 500 can be improved.
Meanwhile, in order to improve the connection effect between the heat transfer part 500 and the bracket 200, the number of the first flanges 520 may be multiple, and the multiple first flanges may be uniformly distributed around the outer sidewall of the dielectric window 400, and correspondingly, the number of the flexible connection parts 600 may also be multiple, and each flexible connection part 600 is connected to the corresponding first flange 520, so as to improve the connection stability between the heat transfer part 500 and the bracket 200. For example, in a specific processing process, in order to meet the working requirement, the number of the first flanges 520 may be 4 to 8, the extending length of the first flanges 520 may be 15 to 25mm, the width of the first flanges 520 may be 5 to 10mm, and the thickness of the first flanges 520 may be 1 to 3 mm.
Of course, the first connector 610 and the first flange 520 may be connected by bonding, welding, or screwing, and optionally, the first connector 610 and the first flange 520 may be connected by the first bolt 800. Specifically, a first threaded hole may be formed in the first connecting member 610, a first through hole may be formed in the first flange 520, the nut of the first bolt 800 may be in limit fit with the end of the first through hole deviating from the first threaded hole, and the bolt body of the first bolt 800 may pass through the first through hole and may be in threaded connection with the first threaded hole. In this way, the reliability of connection between the first connecting member 610 and the first flange 520 can be improved, and meanwhile, the first connecting member 610 and the first flange 520 can also be electrically connected through the first bolt 800, so that the stability of electrical connection between the first connecting member 610 and the first flange 520 can also be improved.
Accordingly, in order to make it easier to couple the flexible connection portion 600 to the support 200, the semiconductor processing apparatus may further include a support 900, the support 900 may be provided to the support 200, and the second coupling member 630 of the flexible connection portion 600 may be fixed to the support 900. In this case, the supporting member 900 not only facilitates the connection of the flexible connecting portion 600, but also prevents the flexible connecting portion 600 from interfering with other components of the stand 200.
Certainly, the second connecting member 630 and the supporting member 900 may be connected by bonding, welding, or threaded connection, optionally, the second connecting member 630 and the supporting member 900 may be connected by a second bolt, specifically, a second threaded hole may be formed in the second connecting member 630, the supporting member 900 may be provided with a second through hole, a nut of the second bolt may be in limit fit with one end of the second through hole departing from the second threaded hole, a bolt main body of the second bolt may pass through the second through hole, and may be in threaded connection with the second threaded hole. In this way, the connection reliability between the second connection member 630 and the support member 900 can be improved, and meanwhile, the second connection member 630 and the support member 900 can be electrically connected through the second bolt, so that the electrical connection stability between the second connection member 630 and the support member 900 can also be improved. Meanwhile, a gap may be formed between the supporter 900 and the bracket 200, thereby facilitating the above-described connection manner.
Alternatively, the elastic member 620 may be a bellows. The bellows has characteristics such as high strength, compression resistance, and impact resistance, so that not only can the service life of the flexible connection portion 600 be prolonged, but also a good elastic force can be generated to the heat transfer portion 500. Of course, the elastic element 620 may also be a coil spring, a spring plate, or other elastic components, which is not limited in the embodiment of the present invention. Optionally, the corrugated tube may be composed of a plurality of corrugated welding sheets, in an embodiment of the present invention, in order to improve the elastic effect of the elastic member 620, the thickness of the corrugated welding sheets may be 0.1 to 1mm, and the number of the corrugated welding sheets may be 2 to 10, so that the elastic displacement of the elastic member 620 may be 1 to 2mm, so that the elastic member 620 can generate a more stable elastic force to the heat transfer portion 500.
In the disclosed embodiment of the present invention, alternatively, the heat transfer part 500 may be connected to the bracket 200 by a plurality of flexible connection parts 600, and the plurality of flexible connection parts 600 may be uniformly distributed along the circumference of the heat transfer part 500. In this way, not only the connection reliability of the heat transfer part 500 and the bracket 200 can be better improved, but also the flexible connection part 600 can generate a more stable elastic force on the heat transfer part 500, so that the heat transfer part 500 can be better ensured to move along with the medium window 400, and the heat transfer part 500 can be better prevented from wearing the medium window 400.
In an embodiment of the present invention, the heat transfer portion 500 may include a heat transfer body 510 and a second flange 530, the heat transfer body 510 may be disposed around an outer sidewall of the dielectric window 400, so that the heat transfer body 510 can heat the dielectric window 400, the second flange 530 may be disposed on an inner side of the heat transfer body 510, and the second flange 530 may cover a portion of an end surface of the dielectric window 400 facing away from the sealing ring 300. In this case, the contact area between the heat transfer part 500 and the medium window 400 is large, so that the connection reliability between the heat transfer part 500 and the medium window 400 can be improved, the heat transfer part 500 can more easily move along with the medium window 400, and the medium window 400 can be more effectively prevented from being worn by the relative movement between the heat transfer part 500 and the medium window 400. Meanwhile, the heat conducting effect of the heat conducting part 500 on the dielectric window 400 is better in this way, so as to improve the heating effect of the dielectric window 400.
Further, the number of the second flanges 530 may be plural, and the plural second flanges 530 may be spaced apart from each other in the circumferential direction of the heat transfer portion 500, in which case, the contact area between the heat transfer portion 500 and the medium window 400 is larger, so that the connection reliability between the heat transfer portion 500 and the medium window 400 can be better improved, the heat transfer portion 500 can move with the medium window 400 more easily, and the medium window 400 can be better prevented from being worn due to relative movement between the heat transfer portion 500 and the medium window 400. For example, in order to meet the working requirement, the number of the second flanges 530 may be 4, the extension length of the second flanges 530 may be 10-30 mm, the width of the second flanges 530 may be 5-20 mm, and the thickness of the second flanges 530 may be 1-3 mm.
Of course, it is preferable that the heat transfer portion 500 may include the heat transfer body 510, the second flange 530, and the first flange 520 as described above, so that the heat transfer portion 500 can have better utility, so that the heat transfer portion 500 not only has better heat transfer effect to the dielectric window 400, but also can make the heat transfer portion 500 be more easily coupled to the bracket 200 or the dielectric window 400.
In an embodiment of the present invention, the heat transfer portion 500 may further include a heat transfer body 510, a third flange and a fourth flange 540, the heat transfer body 510 is disposed around an outer sidewall of the dielectric window 400, so that the heat transfer body 510 can heat the dielectric window 400, both the third flange and the fourth flange 540 may be disposed outside the heat transfer body 510, the third flange and the fourth flange 540 may be sequentially distributed along a thickness direction of the dielectric window 400, and both the third flange and the fourth flange 540 may extend in a direction away from the dielectric window 400, please refer to fig. 1 again, the heating portion 700 may be located between the third flange and the fourth flange 540. In this case, the third and fourth flanges 540 may position the heating part 700, thereby improving the mounting reliability of the heating part 700. Of course, the third cuff may be the first cuff 520 described above. Alternatively, the number of the third flanges and the number of the fourth flanges may be multiple, and the third flanges and the fourth flanges may be uniformly distributed along the circumferential direction of the heat transfer body 510, which may improve the installation stability of the heating part 700. For example, in order to satisfy the work needs, the quantity of third turn-ups and fourth turn-ups can be 4, and the extending length of third turn-ups and fourth turn-ups all can be 15 ~ 25mm, and the width of third turn-ups and fourth turn-ups all can be 20 ~ 30mm, and the thickness of third turn-ups and fourth turn-ups all can be 1 ~ 3 mm.
Further, a positioning groove 541 may be formed in a side of the fourth flange 540 facing the third flange, and a portion of the heating portion 700 may be located in the positioning groove 541. In this case, the positioning grooves 541 can position the heating part 700 so that the heating part 700 can be more closely attached to the heat transfer part 500, and the heating part 700 can provide a more excellent heating effect to the medium window 400 through the heat transfer part 500.
In an embodiment of the present invention, the heat transfer portion 500 described in any of the above embodiments may be an integrally bent molding member. In this case, not only the heat transfer portion 500 can be conveniently formed, but also the heat transfer portion 500 can be integrally formed by bending so that the thermal conductivity of each component on the heat transfer portion 500 can be consistent, so that the heat transfer portion 500 can uniformly conduct heat to each position of the dielectric window 400, and the heating effect of the dielectric window 400 is good.
In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims (12)

1. A semiconductor processing apparatus, comprising:
a chamber (100);
a bracket (200), the bracket (200) being disposed on a sidewall of the cavity (100);
a seal ring (300), the seal ring (300) being disposed on the bracket (200);
a dielectric window (400), the dielectric window (400) being disposed on the seal ring (300);
a heat transfer portion (500), the heat transfer portion (500) being disposed around the medium window (400), and the heat transfer portion (500) being connected to the bracket (200) through a flexible connection portion (600), the heat transfer portion (500) being capable of pushing the flexible connection portion (600) to compress or stretch so that the heat transfer portion (500) is movable with the medium window (400);
the heating part (700) is arranged on one side, away from the medium window (400), of the heat transfer part (500) in a surrounding mode.
2. The semiconductor processing apparatus of claim 1, wherein the flexible connecting portion (600) comprises a first connecting member (610), an elastic member (620) and a second connecting member (630) connected in sequence, the first connecting member (610) is connected to the heat transfer portion (500), the second connecting member (630) is connected to the support (200), and the heat transfer portion (500) can push the elastic member (620) to compress or stretch.
3. The semiconductor processing apparatus according to claim 2, wherein the heat transfer portion (500) comprises a heat transfer body (510) and a first flange (520), the heat transfer body (510) is disposed around an outer sidewall of the dielectric window (400), the first flange (520) is disposed outside the heat transfer body (510), the first flange (520) extends in a direction away from the dielectric window (400), and the first connector (610) is connected to the first flange (520).
4. The semiconductor processing apparatus of claim 3, wherein the first connector (610) is coupled to the first flange (520) by a first bolt (800).
5. The semiconductor processing apparatus of claim 2, further comprising a support member (900), wherein the support member (900) is disposed on the rack (200), and wherein the second connector (630) is fixed to the support member (900).
6. The semiconductor processing apparatus of claim 2, wherein the resilient member (620) is a bellows.
7. The semiconductor processing apparatus according to claim 1, wherein the heat transfer portion (500) is connected to the support (200) by a plurality of the flexible connection portions (600), and the plurality of the flexible connection portions (600) are uniformly distributed along a circumferential direction of the heat transfer portion (500).
8. The semiconductor processing equipment as claimed in claim 1, wherein the heat transfer part (500) comprises a heat transfer body (510) and a second flange (530), the heat transfer body (510) is arranged around the outer side wall of the medium window (400), the second flange (530) is arranged on the inner side of the heat transfer body (510), and the second flange (530) covers a part of the end face of the medium window (400) facing away from the sealing ring (300).
9. The semiconductor processing apparatus according to claim 8, wherein the second flange (530) is plural in number, and the plural second flanges (530) are spaced apart from each other in a circumferential direction of the heat transfer portion (500).
10. The semiconductor processing apparatus according to claim 1, wherein the heat transfer portion (500) includes a heat transfer body (510), a third flange and a fourth flange (540), the heat transfer body (510) is disposed around an outer sidewall of the dielectric window (400), the third flange and the fourth flange (540) are disposed outside the heat transfer body (510), the third flange and the fourth flange (540) are sequentially distributed along a thickness direction of the dielectric window (400), the third flange and the fourth flange (540) extend along a direction away from the dielectric window (400), and the heating portion (700) is located between the third flange and the fourth flange (540).
11. The semiconductor processing apparatus according to claim 10, wherein a positioning groove (541) is opened at a side of the fourth flange (540) facing the third flange, and a portion of the heating part (700) is located in the positioning groove (541).
12. The semiconductor processing apparatus according to claim 3, 8 or 10, wherein the heat transfer portion (500) is an integral bend molding.
CN202010591899.4A 2020-06-24 2020-06-24 Semiconductor processing equipment Active CN111725110B (en)

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CN202010591899.4A CN111725110B (en) 2020-06-24 2020-06-24 Semiconductor processing equipment

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Application Number Priority Date Filing Date Title
CN202010591899.4A CN111725110B (en) 2020-06-24 2020-06-24 Semiconductor processing equipment

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CN111725110A true CN111725110A (en) 2020-09-29
CN111725110B CN111725110B (en) 2023-09-08

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
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