CN111722967A - High and low temperature test method, system, processing terminal and computer readable storage medium - Google Patents
High and low temperature test method, system, processing terminal and computer readable storage medium Download PDFInfo
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Abstract
The invention discloses a high and low temperature testing method, a system, a processing end and a computer readable storage medium, wherein the high and low temperature testing method comprises the following steps: sending configuration information of a system-in-package SIP module to the SIP module so that the SIP module works based on the configuration information, and starting a self-checking program to perform self-checking in a high-low temperature box; receiving a self-checking result of the high and low temperature test returned by the SIP module; and judging whether the SIP module is in a normal working state or not according to the self-checking result. The invention can improve the efficiency of high and low temperature test of the SIP module.
Description
Technical Field
The invention relates to the field of performance testing, in particular to a high-low temperature testing method, a high-low temperature testing system, a high-low temperature testing processing terminal and a computer readable storage medium.
Background
With the development of electronic technology and integrated circuit technology, SIP (System In Package) modules are becoming more and more popular. Since the SIP module has a small size and has poor heat dissipation capability after molding, it is necessary to perform high and low temperature tests on the SIP module.
At present, the method for performing high and low temperature test on the SIP module is as follows: the method comprises the steps of firstly putting the powered SIP module into a high-low temperature box, then taking out the SIP module at intervals and manually testing various functions, and if the functions are normal, continuously putting the SIP module into the high-low temperature box to complete testing. In the existing testing process, a high-low temperature box needs to be opened frequently, then functions are tested manually one by one, and the testing efficiency is low, the time is long, and the cost is high. Therefore, how to improve the efficiency of the high and low temperature testing of the SIP module is a problem that needs to be solved.
Disclosure of Invention
The invention mainly aims to provide a high-low temperature testing method, a system, a processing end and a computer readable storage medium, aiming at improving the high-low temperature testing efficiency of an SIP module.
In order to achieve the above object, the present invention provides a high and low temperature testing method, which includes:
sending configuration information of a system-in-package SIP module to the SIP module so that the SIP module works based on the configuration information, and starting a self-checking program to perform self-checking in a high-low temperature box;
receiving a self-checking result of the high and low temperature test returned by the SIP module;
and judging whether the SIP module is in a normal working state or not according to the self-checking result.
Optionally, the step of determining whether the SIP module is in a normal operating state according to the self-checking result includes:
obtaining the working state of each device of the SIP module according to the self-checking result;
if at least one of the working states is an abnormal working state, judging that the SIP module is in the abnormal working state;
and if the working states are all normal working states, judging that the SIP module is in a normal working state.
Optionally, the high and low temperature test method further includes:
and if the working state of the SIP module is judged to be an abnormal working state, starting an alarm device to alarm.
Optionally, the high and low temperature test method further includes:
if the working state of the SIP module is judged to be an abnormal working state, obtaining the name of an abnormal device and the abnormal occurrence time according to the self-checking result;
and displaying the name of the abnormal device and the abnormal occurrence time.
Optionally, before the step of sending the configuration information of the system in package SIP module to the SIP module, so that the SIP module operates based on the configuration information and starts a self-test program to perform self-test in the high and low temperature boxes, the method further includes:
when a configuration information setting request of the SIP module is received, displaying a configuration information setting page according to the configuration information setting request so as to configure the working mode and the working duration of the SIP module;
and when a configuration information setting instruction triggered based on the configuration information setting page is received, acquiring the working mode and the working time of the configured SIP module according to the configuration information setting instruction, and generating the configuration information of the SIP module according to the working mode and the working time of the configured SIP module.
Optionally, the step of receiving a self-test result of the high and low temperature test returned by the SIP module includes:
establishing communication connection with the SIP module by controlling a multi-path selection switch;
and receiving a self-checking result of the high and low temperature test returned by the SIP module through the communication connection.
In addition, to achieve the above object, the present invention further provides a processing terminal, including: the system comprises a memory, a processor and a high and low temperature test program which is stored on the memory and can run on the processor, wherein the steps of the high and low temperature test method are realized when the high and low temperature test program is executed by the processor.
In addition, in order to achieve the above object, the present invention further provides a high and low temperature test system, which includes a processing terminal and an SIP module; wherein,
the processing end is the processing end described above;
the SIP module is used for receiving the configuration information of the SIP module sent by the processing terminal, then working based on the configuration information, and starting a self-checking program to perform self-checking in a high-low temperature box;
and the SIP module is also used for sending the self-checking result obtained by the self-checking program to the processing end.
Optionally, the high and low temperature test system further comprises: the system comprises a multi-path selection switch, an alarm device, a test tool, a high-low temperature box and a power supply device, wherein the multi-path selection switch and the alarm device are respectively connected with a processing end, the test tool is connected with the multi-path selection switch, the test tool is arranged in the high-low temperature box, the power supply device is connected with the test tool, and an SIP module is arranged in the test tool; wherein,
the multi-path selection switch is used for establishing communication connection between the processing terminal and the SIP module;
the alarm device is used for receiving the starting request of the processing terminal and giving an alarm;
the test tool is used for supplying power to the SIP module and providing a communication interface for communication between the SIP module and the processing end;
the high-low temperature box is used for providing an environment for the SIP module to perform high-low temperature test;
and the power supply device is used for supplying power to the SIP module in the test tool.
In addition, to achieve the above object, the present invention further provides a computer readable storage medium, which stores thereon a high and low temperature test program, which when executed by a processor implements the steps of the high and low temperature test method as described above.
The invention provides a high and low temperature testing method, a system, a processing end and a computer readable storage medium, which are characterized in that configuration information of a system-in-package (SIP) module is sent to the SIP module so that the SIP module works based on the configuration information, and a self-checking program is started to perform self-checking in a high and low temperature box; receiving a self-checking result of the high and low temperature test returned by the SIP module; and judging whether the SIP module is in a normal working state or not according to the self-checking result. Through the mode, only need place the SIP module in the high low temperature box to the configuration information of configuration SIP module, then, the SIP module starts the self-checking procedure, in order to obtain the self-checking result, finally, can judge whether the SIP module is in normal operating condition according to the self-checking result, consequently, need not frequently to open the high low temperature box, and take out the SIP module and carry out artifical the test, alright acquire the high low temperature test result of SIP module, can realize the automated processing of SIP module high low temperature test, thereby can improve the efficiency of SIP module high low temperature test.
Drawings
Fig. 1 is a schematic terminal structure diagram of a hardware operating environment according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart of a high and low temperature testing method according to a first embodiment of the present invention;
FIG. 3 is a schematic flow chart of a high and low temperature testing method according to a second embodiment of the present invention;
FIG. 4 is a schematic flow chart of a high and low temperature testing method according to a third embodiment of the present invention;
FIG. 5 is a schematic flow chart of a high and low temperature testing method according to a fourth embodiment of the present invention;
FIG. 6 is a schematic diagram of a first system architecture of the high and low temperature test system according to the present invention;
FIG. 7 is a second system architecture of the high and low temperature test system according to the present invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, fig. 1 is a schematic terminal structure diagram of a hardware operating environment according to an embodiment of the present invention.
The terminal in the embodiment of the present invention is a processing terminal, and the processing terminal may be a terminal device such as a PC (personal computer), a portable computer, a server, and the like.
As shown in fig. 1, the terminal may include: a processor 1001, such as a CPU (Central Processing Unit), a communication bus 1002, a user interface 1003, a network interface 1004, and a memory 1005. Wherein a communication bus 1002 is used to enable connective communication between these components. The user interface 1003 may include a Display screen (Display), an input unit such as a Keyboard (Keyboard), and the optional user interface 1003 may also include a standard wired interface, a wireless interface. The network interface 1004 may optionally include a standard wired interface, a wireless interface (e.g., WI-FI interface). The memory 1005 may be a high-speed RAM memory or a non-volatile memory (e.g., a magnetic disk memory). The memory 1005 may alternatively be a storage device separate from the processor 1001.
Those skilled in the art will appreciate that the terminal structure shown in fig. 1 is not intended to be limiting and may include more or fewer components than those shown, or some components may be combined, or a different arrangement of components.
As shown in fig. 1, a memory 1005, which is a kind of computer storage medium, may include therein an operating system, a network communication module, a user interface module, and a high and low temperature test program.
In the terminal shown in fig. 1, the processor 1001 may be configured to call a high and low temperature test program stored in the memory 1005, and perform the following operations:
sending configuration information of a system-in-package SIP module to the SIP module so that the SIP module works based on the configuration information, and starting a self-checking program to perform self-checking in a high-low temperature box;
receiving a self-checking result of the high and low temperature test returned by the SIP module;
and judging whether the SIP module is in a normal working state or not according to the self-checking result.
Further, the processor 1001 may be configured to call the high and low temperature test program stored in the memory 1005, and further perform the following operations:
obtaining the working state of each device of the SIP module according to the self-checking result;
if at least one of the working states is an abnormal working state, judging that the SIP module is in the abnormal working state;
and if the working states are all normal working states, judging that the SIP module is in a normal working state.
Further, the processor 1001 may be configured to call the high and low temperature test program stored in the memory 1005, and further perform the following operations:
and if the working state of the SIP module is judged to be an abnormal working state, starting an alarm device to alarm.
Further, the processor 1001 may be configured to call the high and low temperature test program stored in the memory 1005, and further perform the following operations:
if the working state of the SIP module is judged to be an abnormal working state, obtaining the name of an abnormal device and the abnormal occurrence time according to the self-checking result;
and displaying the name of the abnormal device and the abnormal occurrence time.
Further, the processor 1001 may be configured to call the high and low temperature test program stored in the memory 1005, and further perform the following operations:
when a configuration information setting request of the SIP module is received, displaying a configuration information setting page according to the configuration information setting request so as to configure the working mode and the working duration of the SIP module;
and when a configuration information setting instruction triggered based on the configuration information setting page is received, acquiring the working mode and the working time of the configured SIP module according to the configuration information setting instruction, and generating the configuration information of the SIP module according to the working mode and the working time of the configured SIP module.
Further, the processor 1001 may be configured to call the high and low temperature test program stored in the memory 1005, and further perform the following operations:
establishing communication connection with the SIP module by controlling a multi-path selection switch;
and receiving a self-checking result of the high and low temperature test returned by the SIP module through the communication connection.
Based on the hardware structure, the invention provides various embodiments of the high and low temperature test method.
The invention provides a high and low temperature test method.
Referring to fig. 2, fig. 2 is a schematic flow chart of a high and low temperature testing method according to a first embodiment of the invention.
In this embodiment, the high and low temperature test method includes:
step S10, sending configuration information of the SIP module to the SIP module so that the SIP module works based on the configuration information, and starting a self-checking program to perform self-checking in a high-temperature box and a low-temperature box;
in this embodiment, the high and low temperature testing method is applied to a high and low temperature testing system, and the high and low temperature testing system includes: a processing terminal and an SIP module. The processing end is used for executing the steps of each embodiment of the high and low temperature testing method; the SIP module is used for working based on the configuration information when receiving the configuration information of the SIP module sent by the processing end, starting a self-checking program to perform self-checking in the high-low temperature box, and sending a self-checking result obtained by self-checking to the processing end. The high-low temperature test system further comprises a multi-way selection switch, an alarm device, a test tool and a high-low temperature box, wherein the multi-way selection switch and the alarm device are respectively connected with the processing end, the test tool is connected with the multi-way selection switch, the test tool is arranged in the high-low temperature box, and the SIP module is arranged in the test tool. The multi-path selection switch is used for establishing communication connection between the processing end and the SIP module; the alarm device is used for receiving the starting request of the processing end and giving an alarm; the test tool is used for supplying power to the SIP module and providing a communication interface for communication between the SIP module and the processing end; and the high-low temperature box is used for providing an environment for the SIP module to perform high-low temperature test.
The test object of the high and low temperature test method of this embodiment is an SIP module, and the SIP module takes a wireless headset SIP module as an example for description.
In this embodiment, the configuration information of the SIP module is sent to the SIP module, so that the SIP module works based on the configuration information, and a self-check program is started to perform self-check in the high-temperature and low-temperature box. The sending method for sending the configuration information of the SIP module to the SIP module includes but is not limited to: 1) the processing end controls the multi-path selection switch, and sequentially establishes communication connection with the SIP modules, so that the configuration information of the SIP modules is sequentially sent to the corresponding SIP modules; 2) the processor establishes a plurality of communication connections with the SIP modules through a plurality of circuits, so that the configuration information of the SIP modules can be simultaneously sent to the corresponding SIP modules.
It should be noted that the SIP module may include one or more SIP modules, and when the number of the SIP modules includes a plurality of SIP modules, the SIP modules may be respectively labeled as SIP module 1, SIP module 2, SIP module 3, etc., so that the configuration information of the SIP may be a plurality of SIP modules, respectively labeled as configuration information of SIP module 1, configuration information of SIP module 2, configuration information of SIP module 3, etc.
In addition, it should be noted that the configuration information of the SIP module includes the working mode of the SIP module (e.g., bluetooth broadcast, microphone pickup, digital signal processing, sensor detection), the working duration of the SIP module (e.g., 100 hours, 200 hours), and so on, which can be set more according to the specific SIP module. The SIP module works based on the configuration information, such as bluetooth broadcast for 100 hours, microphone for 100 hours, digital signal processing for 100 hours, and sensor detection for 200 hours. Meanwhile, the SIP module starts a self-checking program to perform self-checking in the high-low temperature box, and the specific implementation modes of the self-checking program include but are not limited to: 1) the Bluetooth chip of the SIP module is communicated with other devices of the SIP module, then the communication condition is obtained, whether each device of the SIP module is in a normal working state or not is judged according to the communication condition, a self-checking result is generated according to the working state of each device of the SIP module, and finally the self-checking result is stored in a memory of the SIP module; 2) and receiving voltage information of each device of the SIP module, judging whether each device of the SIP module is in a normal working state or not according to the voltage information, generating a self-checking result according to the working state of each device of the SIP module, and finally storing the self-checking result into a memory of the SIP module. Wherein, its test temperature of high hypothermia case accessible manual work or automated control, specific test temperature is set for according to actual conditions.
Step S20, receiving a self-checking result of the high and low temperature test returned by the SIP module;
in this embodiment, the self-test result of the high and low temperature tests returned by the SIP module is received. It should be noted that, when receiving the self-test results of the high and low temperature tests returned by the SIP modules, there are a plurality of corresponding self-test results, and therefore, the processing end needs to generate the corresponding relationship between the SIP modules and the self-test results to avoid confusion among the self-test results.
Specifically, step S20 includes:
step a21, establishing communication connection with the SIP module by controlling a multi-way selection switch;
and a22, receiving the self-checking result of the high and low temperature test returned by the SIP module through the communication connection.
One way to receive the self-test result of the high and low temperature test returned by the SIP module is: and the processing end establishes communication connection with the SIP module by controlling the multi-path selection switch, so that self-checking results of high-low temperature tests returned by the SIP module are sequentially received.
It should be noted that the multi-way selector switches are set based on the number of SIP modules, and the multi-way selector switches may be a 4-to-1 multi-way selector switch, an 8-to-1 multi-way selector switch, a 16-to-1 multi-way selector switch, and the like; in addition, the multiplexer switch can also be generated by splicing two or more multiplexer switches. The processing end controls the multi-way selection switch to establish communication connection with the SIP module, and the communication connection can be wired connection or wireless communication connection (such as Bluetooth connection and WI-FI).
In addition, another way of receiving the self-test result of the high and low temperature test returned by the SIP module is as follows: the processor establishes a plurality of communication connections with the SIP module through a plurality of circuits, so that self-checking results of high and low temperature tests returned by the SIP modules can be received simultaneously.
And step S30, judging whether the SIP module is in a normal working state or not according to the self-checking result.
In this embodiment, whether the SIP module is in a normal operating state is determined according to the self-checking result. Specifically, if the number of self-checking results is multiple, whether the SIP module is in a normal working state or not is sequentially judged according to the self-checking results.
Specifically, step S30 includes:
a31, obtaining the working state of each component of the SIP module according to the self-checking result;
step a32, if at least one of the working states is an abnormal working state, determining that the SIP module is in the abnormal working state;
step a33, if all the working states are normal working states, determining that the SIP module is in a normal working state.
The specific judgment process of the working state of the SIP module is as follows:
and obtaining the working state of each device of the SIP module according to the self-checking result. The self-checking result comprises a device identifier and a working state identifier, the device identifier can be a device name or a serial number, the working state identifier comprises a normal identifier and an abnormal identifier, and can be represented by preset characters or directly represented by normal and abnormal. And respectively determining whether the working state of each device is a normal working state or an abnormal working state according to the working state identifier corresponding to each device.
Then, whether or not there is an abnormal operation state among the operation states of the respective devices is detected. If at least one of the working states is an abnormal working state, judging that the SIP module is in the abnormal working state; and if the working states are all normal working states, judging that the SIP module is in a normal working state.
It can be understood that, according to the self-checking result, determining whether the SIP module is in the normal working state may not only include the above manner, but also modify or replace the above manner, for example, the working states of some devices of the SIP module are abnormal working states, and the normal working of the SIP module is not affected, and then it may be determined that the SIP module is in the normal working state, which is not described in detail herein.
The embodiment of the invention provides a high and low temperature test method, which is characterized in that configuration information of a system-in-package (SIP) module is sent to the SIP module, so that the SIP module works based on the configuration information, and a self-checking program is started to perform self-checking in a high and low temperature box; receiving a self-checking result of the high and low temperature test returned by the SIP module; and judging whether the SIP module is in a normal working state or not according to the self-checking result. Through the mode, only need place the SIP module in the high low temperature box to the configuration information of configuration SIP module, then, the SIP module starts the self-checking procedure, in order to obtain the self-checking result, finally, can judge whether the SIP module is in normal operating condition according to the self-checking result, consequently, need not frequently to open the high low temperature box, and take out the SIP module and carry out artifical the test, alright acquire the high low temperature test result of SIP module, can realize the automated processing of SIP module high low temperature test, thereby can improve the efficiency of SIP module high low temperature test.
Further, based on the above first embodiment, a second embodiment of the high and low temperature test method of the present invention is proposed.
Referring to fig. 3, fig. 3 is a schematic flow chart of a high and low temperature testing method according to a second embodiment of the invention.
In this embodiment, after step S30, the method further includes:
and step S40, if the working state of the SIP module is judged to be an abnormal working state, an alarm device is started to give an alarm.
In this embodiment, if the operating state of the SIP module is determined to be an abnormal operating state, the alarm device is activated to alarm. The alarm device can be a visual alarm device, an auditory alarm device, a tactile alarm device and the like, and in addition, in order to enhance the display reliability, multiple displays can be adopted, such as an alarm device with visual and auditory simultaneous displays.
In this embodiment, in the high and low temperature testing process, when the processing end determines that the working state of the SIP module is the abnormal working state, the alarm device is started, so that the tester can quickly know that the SIP module is in the abnormal working state and can process the SIP module in time.
Further, based on the first embodiment described above, a third embodiment of the high and low temperature test method of the present invention is proposed.
Referring to fig. 4, fig. 4 is a schematic flow chart of a high and low temperature testing method according to a third embodiment of the present invention.
In this embodiment, after step S30, the method further includes:
step S50, if the working state of the SIP module is judged to be an abnormal working state, the name of an abnormal device and the abnormal occurrence time are obtained according to the self-checking result;
in this embodiment, if the operating state of the SIP module is determined to be an abnormal operating state, the name of the abnormal device and the abnormal occurrence time are obtained according to the self-checking result. Specifically, it is determined that the working state identifier in the self-checking result corresponds to an abnormal device identifier, then the name of the abnormal device is obtained according to the device identifier, and the abnormal occurrence time carried in the self-checking result is obtained.
Note that, the manner of generating the abnormality occurrence time of the SIP module is: in the self-checking program of the SIP module, if a certain device of the SIP module is judged to be in an abnormal working state, the time at the moment is obtained and is taken as the abnormal occurrence time, and the abnormal occurrence time, the name of the corresponding abnormal device and the working state of the abnormal device generate a self-checking result. That is, the self-test result may include the abnormality occurrence time in addition to the device identifier and the operating state identifier.
Step S60, the name of the abnormal device and the abnormality occurrence time are displayed.
Then, the name of the abnormal device and the abnormality occurrence time are displayed. Specifically, the processing terminal displays the name of the abnormal device and the abnormal occurrence time on a display screen of the processing terminal according to a preset display mode. Of course, in specific implementation, if the processing end does not have a display function, the processing end can display the abnormal information by means of other terminals, specifically, the processing end generates abnormal information according to the name of the abnormal device and the abnormal occurrence time, and then sends the abnormal information to the upper computer so as to be displayed on the display screen of the upper computer.
In addition, in order to avoid the loss of the display data, the display result can be saved for subsequent viewing.
In this embodiment, by displaying the device name and the abnormality occurrence time of the abnormal operating state, the tester can intuitively know specific abnormality information, thereby facilitating the tester to perform subsequent abnormality analysis.
Further, based on the first embodiment described above, a fourth embodiment of the high and low temperature test method of the present invention is proposed.
Referring to fig. 5, fig. 5 is a schematic flow chart of a high and low temperature testing method according to a fourth embodiment of the invention.
In this embodiment, before the step S10, the method further includes:
step S70, when receiving the configuration information setting request of the SIP module, displaying a configuration information setting page according to the configuration information setting request for configuring the working mode and the working duration of the SIP module;
in order to facilitate the working personnel to realize the test of the SIP module performance under different working modes, the embodiment of the invention provides a configuration information setting interface for the working personnel to flexibly set the working mode and the working duration aiming at different SIP modules.
Specifically, a worker can trigger a configuration information setting request of the SIP module by clicking a configuration option and the like in related software of the processing terminal, and at this time, when the processing terminal receives the configuration information setting request of the SIP module, the processing terminal displays a configuration information setting page according to the configuration information setting request so as to configure a working mode and a working duration of the SIP module. For example, the configuration information setting page of the SIP module of the wireless headset may include setting items of the operating mode of the SIP module (such as bluetooth broadcast, microphone pickup, digital signal processing, and sensor detection), setting items of the operating duration of the SIP module (such as 100 hours and 200 hours), and the like.
Step S80, when receiving a configuration information setting instruction triggered by the configuration information setting page, acquiring a configured operating mode and an operating duration of the SIP module according to the configuration information setting instruction, and generating configuration information of the SIP module according to the configured operating mode and the operating duration of the SIP module.
After the setting is completed, the staff can trigger a configuration information setting instruction, at the moment, when the processing end receives the configuration information setting instruction triggered based on the configuration information setting page, the processing end acquires the working mode and the working time of the configured SIP module according to the configuration information setting instruction, and generates the configuration information of the SIP module according to the working mode and the working time of the configured SIP module.
In the embodiment, in the high and low temperature testing process, the working mode and the working duration of the SIP module can be flexibly modified by configuring the working mode and the working duration of the SIP module, the working mode of the SIP module can be switched without manually switching the working mode of the SIP module, and the automatic switching of the high and low temperature testing of the SIP module can be realized, so that the efficiency of the high and low temperature testing of the SIP module can be improved.
The invention also provides a high and low temperature test system, which comprises: a processing terminal and an SIP module.
The processing end is the processing end described above and is configured to execute the steps in the above-described high and low temperature test method embodiment, and specific functions and implementation processes may refer to the above-described embodiment, which is not described herein again.
The SIP module is used for working based on the configuration information when receiving the configuration information of the SIP module sent by the processing end, and starting a self-checking program to perform self-checking in the high-low temperature box; and the self-checking module is also used for sending a self-checking result obtained by self-checking to the processing end.
In the embodiment of the invention, the configuration information of the SIP module is sent to the SIP module by the processing terminal through constructing the high-low temperature test system; the SIP module works based on the configuration information, and starts a self-checking program to perform self-checking in the high-low temperature box; the processing end receives a self-checking result of the high and low temperature test returned by the SIP module, and then judges whether the SIP module is in a normal working state or not according to the self-checking result, so that the automatic processing of the high and low temperature test of the SIP module is realized, and the high and low temperature test efficiency of the SIP module can be improved.
Further, as shown in fig. 6, the high and low temperature test system further includes: the system comprises a multi-path selection switch, an alarm device, a testing tool, a high-low temperature box and a power supply device, wherein the multi-path selection switch and the alarm device are respectively connected with a processing end, the testing tool is connected with the multi-path selection switch, the testing tool is arranged in the high-low temperature box, the power supply device is connected with the testing tool, and an SIP module is arranged in the testing tool.
The multi-path selection switch is used for establishing communication connection between the processing end and the SIP module;
the alarm device is used for receiving the starting request of the processing end and giving an alarm;
the test tool is used for supplying power to the SIP module and providing a communication interface for communication between the SIP module and the processing end;
the high-low temperature box is used for providing an environment for the SIP module to perform high-low temperature test;
and the power supply device is used for supplying power to the SIP module in the test tool.
In the embodiment of the invention, by constructing the high-low temperature test system and utilizing the multi-path selection switch, the processing end is in communication connection with the SIP modules so as to send the configuration information of the SIP modules to the SIP modules and receive the self-test result returned by the SIP modules; when the SIP module works abnormally, the alarm device is used for alarming after receiving a starting request of the processing end; the test tool can be used for simultaneously placing a plurality of SIP modules, distributing power provided by the power supply device to each SIP module and providing a communication interface for communication between the SIP modules and the processing end; the high-low temperature box is operated to provide an environment for the SIP module to perform high-low temperature test; utilize power supply unit, stably supply power to the SIP module in the test fixture.
In addition, during specific implementation, the upper computer can be used for carrying out relevant operation of configuring the SIP module configuration information and displaying the high and low temperature test result. As shown in fig. 7, the upper computer is connected to the processing terminal.
And the upper computer is used for providing a configuration information setting interface of the SIP module for the flexible setting of workers, and can generate the configuration information of the SIP module based on the received working mode and working duration of the configured SIP module and return the configuration information to the control end. In addition, the upper computer can be further used for receiving the high and low temperature test results (such as the judgment result of the working state of the SIP module, the name of the abnormal device, the abnormal occurrence time and the like) sent by the processing terminal and displaying the high and low temperature test results.
The present invention also provides a computer readable storage medium having stored thereon a high and low temperature test program, which when executed by a processor implements the steps of the high and low temperature test method according to any one of the above embodiments.
The specific embodiment of the computer readable storage medium of the present invention is substantially the same as the embodiments of the high and low temperature testing method described above, and is not repeated herein.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium (e.g., ROM/RAM, magnetic disk, optical disk) as described above and includes instructions for enabling a terminal device (e.g., a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present invention.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A high and low temperature test method is characterized by comprising the following steps:
sending configuration information of a system-in-package SIP module to the SIP module so that the SIP module works based on the configuration information, and starting a self-checking program to perform self-checking in a high-low temperature box;
receiving a self-checking result of the high and low temperature test returned by the SIP module;
and judging whether the SIP module is in a normal working state or not according to the self-checking result.
2. The method according to claim 1, wherein the step of determining whether the SIP module is in a normal operating state according to the self-test result comprises:
obtaining the working state of each device of the SIP module according to the self-checking result;
if at least one of the working states is an abnormal working state, judging that the SIP module is in the abnormal working state;
and if the working states are all normal working states, judging that the SIP module is in a normal working state.
3. The high and low temperature test method of claim 1, further comprising:
and if the working state of the SIP module is judged to be an abnormal working state, starting an alarm device to alarm.
4. The high and low temperature test method of claim 1, further comprising:
if the working state of the SIP module is judged to be an abnormal working state, obtaining the name of an abnormal device and the abnormal occurrence time according to the self-checking result;
and displaying the name of the abnormal device and the abnormal occurrence time.
5. The high and low temperature testing method according to any one of claims 1 to 4, wherein before the step of sending configuration information of the system-in-package SIP module to the SIP module so that the SIP module operates based on the configuration information and starts a self-test program to perform self-test in the high and low temperature box, the method further comprises:
when a configuration information setting request of the SIP module is received, displaying a configuration information setting page according to the configuration information setting request so as to configure the working mode and the working duration of the SIP module;
and when a configuration information setting instruction triggered based on the configuration information setting page is received, acquiring the working mode and the working time of the configured SIP module according to the configuration information setting instruction, and generating the configuration information of the SIP module according to the working mode and the working time of the configured SIP module.
6. The method according to any one of claims 1 to 4, wherein the step of receiving the self-test result of the high and low temperature test returned by the SIP module comprises:
establishing communication connection with the SIP module by controlling a multi-path selection switch;
and receiving a self-checking result of the high and low temperature test returned by the SIP module through the communication connection.
7. A processing end, characterized in that the processing end comprises: memory, a processor and a high and low temperature test program stored on the memory and executable on the processor, the high and low temperature test program when executed by the processor implementing the steps of the high and low temperature test method of any one of claims 1 to 6.
8. The high and low temperature test system is characterized by comprising a processing end and an SIP module; wherein,
the processing end is the processing end of claim 7;
the SIP module is used for working based on the configuration information when receiving the configuration information of the SIP module sent by the processing end, and starting a self-checking program to perform self-checking in a high-low temperature box;
and the SIP module is also used for sending a self-checking result obtained by self-checking to the processing end.
9. The high and low temperature test system of claim 8, further comprising: the system comprises a multi-path selection switch, an alarm device, a test tool, a high-low temperature box and a power supply device, wherein the multi-path selection switch and the alarm device are respectively connected with a processing end, the test tool is connected with the multi-path selection switch, the test tool is arranged in the high-low temperature box, the power supply device is connected with the test tool, and an SIP module is arranged in the test tool; wherein,
the multi-path selection switch is used for establishing communication connection between the processing terminal and the SIP module;
the alarm device is used for receiving the starting request of the processing terminal and giving an alarm;
the test tool is used for supplying power to the SIP module and providing a communication interface for communication between the SIP module and the processing end;
the high-low temperature box is used for providing an environment for the SIP module to perform high-low temperature test;
and the power supply device is used for supplying power to the SIP module in the test tool.
10. A computer-readable storage medium, having stored thereon a high and low temperature test program, which when executed by a processor implements the steps of the high and low temperature test method of any one of claims 1 to 6.
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