CN111721492A - Electronic product shock resistance testing device - Google Patents
Electronic product shock resistance testing device Download PDFInfo
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- CN111721492A CN111721492A CN202010620139.1A CN202010620139A CN111721492A CN 111721492 A CN111721492 A CN 111721492A CN 202010620139 A CN202010620139 A CN 202010620139A CN 111721492 A CN111721492 A CN 111721492A
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- Prior art keywords
- electronic product
- clamp
- electronic
- laser
- rack
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M7/00—Vibration-testing of structures; Shock-testing of structures
- G01M7/08—Shock-testing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
- G01B11/161—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge by interferometric means
- G01B11/162—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge by interferometric means by speckle- or shearing interferometry
Abstract
Disclosed is an electronic product impact resistance test device, including: the electronic product falling device comprises a rack, a base and a driving mechanism, wherein the rack is fixed on the base, the base is provided with an impact plate for bearing the impact force of an electronic product when the electronic product falls, and two sides of the rack are provided with rails; the electromagnetic releaser is fixed at the top of the rack; the top of the clamp is adsorbed on the electromagnetic releaser, and two ends of the clamp are arranged on the guide rail; the speed measuring device is used for measuring the falling speed of the clamp and the electronic product on the clamp after the electromagnetic releaser releases the clamp; and the electronic speckle interferometry system is used for obtaining the deformation field of the electronic product falling onto the impact plate. The electronic speckle interference technology is adopted to test the distribution of the deformation field when the electronic product is impacted, and the resistance and failure points of the electronic product to the external impact force can be effectively determined.
Description
Technical Field
The disclosure relates to an electronic product shock resistance testing device.
Background
Most of electronic products are frequently used, so that the collision and damage possibility of the electronic products is increased virtually, and in order to improve the quality of the electronic products, the damage resistance of the electronic products is strengthened. Therefore, in the reliability detection process, a destructive test of the product is required, the resistance capability and failure points of the product to external impact force are effectively determined, and reliable reference is provided for the selection of materials such as product appearance design, shells, screens and parts, so that the improvement of the impact resistance capability of the product is realized.
In the electronics industry, it is generally required that electronic products pass certain general standard tests in order to ensure their impact resistance. Suitable standards are ANSI/ASTM D3332-93 "test method for determining the brittleness value of a product using an impact tester", supplied by the American Society for Testing and Materials (ASTM); military standard MILI-STD-810F of the U.S. department of defense, "Standard test methods for environmental considerations and laboratory tests"; IEC68-2-27, "International Standard for basic environmental test procedures", supplied by the International Electrotechnical Commission (IEC); a series of test standards draft for handheld electronic products, etc., provided by Joint Electron Device Engineering Council (JEDEC), the most commonly used method of these standard tests includes drop test and impact test.
In the process of testing the shock resistance of electronic products, the traditional measuring tool is difficult to measure the tiny deformation of the products, so the expansion of the microcracks of the products is observed by means of an acoustic technology, an X-ray technology, a Moire interference measuring technology, an optical microscope and the like. However, these measurement methods have high sensitivity to mechanical vibration, low measurement accuracy, and time lag, or require complicated processing of the product surface, and it is difficult to obtain reliable test data under ordinary laboratory conditions.
Disclosure of Invention
The utility model provides an electronic product shock resistance testing arrangement, the device adopts electronic speckle pattern interference technique repetition, continuous test electronic product to receive the distribution of deformation field when assaulting.
At least one embodiment of the present disclosure provides an electronic product impact resistance testing apparatus, including:
the electronic product falling device comprises a rack, a base and a driving mechanism, wherein the rack is fixed on the base, the base is provided with an impact plate for bearing the impact force of an electronic product when the electronic product falls, and two sides of the rack are provided with rails;
the electromagnetic releaser is fixed at the top of the rack;
the top of the clamp is adsorbed on the electromagnetic releaser, and two ends of the clamp are arranged on the guide rail;
the speed measuring device is used for measuring the falling speed of the clamp and the electronic product on the clamp after the electromagnetic releaser releases the clamp; and
and the electronic speckle interferometry system is used for obtaining a deformation field of the electronic product falling onto the impact plate.
In some examples, the electronic speckle interferometry system comprises:
a laser;
the beam splitter is used for splitting the laser emitted by the laser into two beams of light;
the reflector is used for reflecting the two beams of light to a falling area of the electronic product to form a speckle pattern in the falling area;
the camera is used for shooting a speckle pattern when the electronic product falls onto the impact plate; and
and the computer is used for obtaining a deformation field of the electronic product according to the speckle pattern shot by the camera.
In some examples, the electronic speckle interferometry system comprises:
a laser;
the beam splitter prism is used for splitting laser emitted by the laser into two beams, one beam is made to strike an electronic product falling area to form a speckle pattern, the other beam is attenuated by the attenuator and then emitted to the horizontally arranged reflector, and the beam reflected by the reflector returns along the original path and is emitted to the camera through the beam splitter prism;
and the computer is used for obtaining a deformation field of the electronic product according to the speckle pattern shot by the camera.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly described below.
Fig. 1 is a schematic view of an apparatus for testing impact resistance of an electronic product according to an embodiment of the disclosure.
Fig. 2 is a schematic diagram of an electronic speckle interferometry system according to an embodiment of the present disclosure.
Fig. 3 is a schematic diagram of an electronic speckle interferometry system according to another embodiment of the disclosure.
Detailed Description
Referring to fig. 1, the apparatus for testing impact resistance of an electronic product includes a frame, an electromagnetic releaser 1, a clamp 5 for fixing the electronic product, and an impact plate 8. The frame is fixed on the base 4, and the impact plate 8 is arranged on the base 4. The electromagnetic releaser 1 is arranged on the top of the frame. The top of anchor clamps 5 adsorbs on electromagnetic release 1, and on the guide rail 7 of frame both sides was placed in to the both ends of anchor clamps 5, electromagnetic release 1 released anchor clamps 5 back, and anchor clamps 5 can be along guide rail 7 vertical whereabouts. The falling speed of the clamp 5 and the electronic product thereon is measured by the speed measuring device 2 on the side surface of the rack. In addition, the lower end of the guide rail 7 is provided with a limiting piece 3 for limiting the clamp 5 to move downwards continuously, when the clamp 5 moves to the limiting piece 3, the clamp does not move downwards continuously, and at the moment, the electronic product below the clamp 5 falls onto the impact plate 8. In addition, when the testing device is used for testing the impact resistance of the electronic product, the electronic product 6 can fall from different heights, and bases 4 made of different materials can be adopted.
As shown in fig. 2, the device for testing the shock resistance of the electronic product further comprises an electronic speckle interferometry system, which comprises a computer, a laser 9, a beam splitter 10, a reflector 11 and an array CCD camera 12. The beam splitter 10 is used for splitting the laser light emitted by the laser 9 into two laser beams, and the reflector 11 is used for reflecting the two laser beams to the electronic product dropping area. During testing, the laser 9 emits laser, the laser is divided into two beams by the beam splitter 10 and reflected to the falling area of the electronic product 6 by the reflector 11, and a speckle pattern is formed in the falling area; the electromagnetic releaser 1 is powered off, and the electronic product 6 falls down and falls onto the impact plate 8; the CCD camera 12 continuously shoots and records the interference speckle pattern, the computer subtracts the speckle patterns in the deformation state and the reference state (the state of the previous step of the next deformation is taken as the reference, and regular fringes appear when the new deformation is generated) to obtain regular light and dark interference fringe patterns, the interference fringe patterns are further converted into corresponding displacement cloud pictures, and researchers can analyze the deformation field of the electronic product according to the displacement cloud pictures, so that the resistance and failure points of the electronic product to the external impact force are effectively determined.
Fig. 3 is a schematic diagram of an electronic speckle interferometry system according to another embodiment of the disclosure. As shown in fig. 3, the electronic speckle interferometry system includes a computer, a laser 9, a mirror 11, an array CCD camera 12, a beam splitter prism 13, and an attenuator 14. The laser 9 emits laser, the laser is divided into two beams by the beam splitter prism 13, one beam of laser is irradiated to the falling area of the electronic product to form speckles, the other beam of laser is attenuated by the attenuator 14 and then is irradiated to the horizontally arranged reflector 11, the laser reflected by the reflector 11 returns along the original path and reaches the CCD camera 12 by the beam splitter prism 13, the CCD camera 12 continuously shoots and records an interference speckle pattern, the computer subtracts the speckle pattern in a deformation state and a reference state to obtain a regular interference fringe pattern with alternate light and dark, and further converts the interference fringe pattern into a corresponding displacement cloud pattern, and researchers can analyze the deformation field of the electronic product according to the displacement cloud pattern, so that the resistance capability and the failure point of the electronic product to external impact force are effectively determined.
Claims (3)
1. An electronic product shock resistance testing device, comprising:
the electronic product falling device comprises a rack, a base and a driving mechanism, wherein the rack is fixed on the base, the base is provided with an impact plate for bearing the impact force of an electronic product when the electronic product falls, and two sides of the rack are provided with rails;
the electromagnetic releaser is fixed at the top of the rack;
the top of the clamp is adsorbed on the electromagnetic releaser, and two ends of the clamp are arranged on the guide rail;
the speed measuring device is used for measuring the falling speed of the clamp and the electronic product on the clamp after the electromagnetic releaser releases the clamp; and
and the electronic speckle interferometry system is used for obtaining a deformation field of the electronic product falling onto the impact plate.
2. The electronic product impact resistance testing device of claim 1, wherein the electronic speckle interferometry system comprises:
a laser;
the beam splitter is used for splitting the laser emitted by the laser into two beams of light;
the reflector is used for reflecting the two beams of light to a falling area of the electronic product to form a speckle pattern in the falling area;
the camera is used for shooting a speckle pattern when the electronic product falls onto the impact plate; and
and the computer is used for obtaining a deformation field of the electronic product according to the speckle pattern shot by the camera.
3. The electronic product impact resistance testing device of claim 1, wherein the electronic speckle interferometry system comprises:
a laser;
the beam splitter prism is used for splitting laser emitted by the laser into two beams, one beam is made to strike an electronic product falling area to form a speckle pattern, the other beam is attenuated by the attenuator and then emitted to the horizontally arranged reflector, and the beam reflected by the reflector returns along the original path and is emitted to the camera through the beam splitter prism;
and the computer is used for obtaining a deformation field of the electronic product according to the speckle pattern shot by the camera.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010620139.1A CN111721492A (en) | 2020-06-30 | 2020-06-30 | Electronic product shock resistance testing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010620139.1A CN111721492A (en) | 2020-06-30 | 2020-06-30 | Electronic product shock resistance testing device |
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| CN111721492A true CN111721492A (en) | 2020-09-29 |
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| CN202010620139.1A Pending CN111721492A (en) | 2020-06-30 | 2020-06-30 | Electronic product shock resistance testing device |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101769722A (en) * | 2010-01-26 | 2010-07-07 | 北京交通大学 | Method for heterodyne temporal series speckle interferometry of object deformation |
| US20110299064A1 (en) * | 2010-06-04 | 2011-12-08 | Canon Kabushiki Kaisha | Deformation measuring apparatus and deformation measuring method |
| CN106404525A (en) * | 2016-10-17 | 2017-02-15 | 合肥工业大学 | Apparatus for testing micro-nano structure mechanical properties of material |
| CN209326925U (en) * | 2018-12-27 | 2019-08-30 | 苏州高新城市轨道交通检验认证有限公司 | A kind of band shield track falling weight impact test equipment |
| CN111157213A (en) * | 2020-02-06 | 2020-05-15 | 武汉大学 | Real-time monitoring device and method for drop damage of microelectronic product |
-
2020
- 2020-06-30 CN CN202010620139.1A patent/CN111721492A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101769722A (en) * | 2010-01-26 | 2010-07-07 | 北京交通大学 | Method for heterodyne temporal series speckle interferometry of object deformation |
| US20110299064A1 (en) * | 2010-06-04 | 2011-12-08 | Canon Kabushiki Kaisha | Deformation measuring apparatus and deformation measuring method |
| CN106404525A (en) * | 2016-10-17 | 2017-02-15 | 合肥工业大学 | Apparatus for testing micro-nano structure mechanical properties of material |
| CN209326925U (en) * | 2018-12-27 | 2019-08-30 | 苏州高新城市轨道交通检验认证有限公司 | A kind of band shield track falling weight impact test equipment |
| CN111157213A (en) * | 2020-02-06 | 2020-05-15 | 武汉大学 | Real-time monitoring device and method for drop damage of microelectronic product |
Non-Patent Citations (1)
| Title |
|---|
| 阮江涛: "含冲击损伤缝合和未缝合层合板压缩实验研究与数值分析", 《中国博士学位论文全文数据库工程科技I辑》 * |
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Application publication date: 20200929 |