CN111721031A

CN111721031A - Method and device for controlling temperature adjusting device, semiconductor temperature adjusting device and medium

Info

Publication number: CN111721031A
Application number: CN202010519340.0A
Authority: CN
Inventors: 刘建华
Original assignee: Shenzhen Caiguo Technology Co ltd
Current assignee: Guangdong Caiguo Technology Co.,Ltd.
Priority date: 2020-06-09
Filing date: 2020-06-09
Publication date: 2020-09-29

Abstract

The present invention relates to a method for controlling a temperature control device, a control device for a temperature control device, a semiconductor temperature control device, and a storage medium. The control method of the temperature adjusting device comprises the following steps: acquiring an ambient temperature and a current temperature of a working end of a temperature adjusting device; judging the magnitude of the environment temperature and the current temperature; when the ambient temperature is higher than the current temperature, controlling the temperature adjusting device to work in a refrigeration mode; and when the environment temperature is lower than the current temperature, controlling the temperature adjusting device to work in a heating mode. The control method of the temperature adjusting device, the control device of the temperature adjusting device, the semiconductor temperature adjusting device and the storage medium can automatically control the temperature adjusting mode, have higher intelligent level, have simple control logic and are not easy to make mistakes.

Description

Method and device for controlling temperature adjusting device, semiconductor temperature adjusting device and medium

Technical Field

The present invention relates to the field of temperature control technologies, and in particular, to a method for controlling a temperature control device, a control device for a temperature control device, a semiconductor temperature control device, and a storage medium.

Background

The temperature adjusting device generally has functions of cooling and heating. When the temperature adjusting device is controlled to adjust the temperature in the prior art, the temperature adjusting device is usually manually set to be in a cooling or heating mode. For example, assuming that the ambient temperature is 15 ℃, the target temperature is 20 ℃, and the temperature of the working end of the temperature adjustment device is 18 ℃, the temperature adjustment device needs to be manually set to a heating mode, and when the temperature of the working end rises to the target temperature, the temperature is naturally reduced, and the heating is restarted when the temperature drops to a certain degree, so that the temperature of the working end is always kept close to the target temperature; assuming that the ambient temperature is 25 ℃, the target temperature is 20 ℃ and the temperature of the working end of the temperature adjusting device is 23 ℃, the temperature adjusting device needs to be manually set to be in a refrigeration mode, the temperature of the working end naturally rises after falling to the target temperature, and refrigeration is restarted after the temperature rises to a certain degree.

However, when the ambient temperature is greater than the target temperature and greater than the temperature of the working end, for example, assuming that the ambient temperature is 25 ℃, the target temperature is 20 ℃, and the temperature of the current working end is 18 ℃, the thermostat should be manually set to the heating mode at this time according to the control logic of the conventional thermostat. When the temperature of the working end is increased from 18 ℃ to 20 ℃ of the target temperature, heating is not performed any more, and the temperature of the working end is gradually increased from 20 ℃ of the target temperature to 25 ℃ of the ambient temperature due to the fact that the ambient temperature is higher than the target temperature, so that the control effect cannot be achieved. Therefore, it is true that the thermostat should be manually set to the cooling mode.

When the ambient temperature is lower than the target temperature and lower than the temperature of the working end, for example, assuming that the ambient temperature is 16 ℃, the target temperature is 20 ℃, and the temperature of the current working end is 23 ℃, the temperature adjustment device should be manually set to the cooling mode according to the control logic of the conventional temperature adjustment device. When the temperature of the working end is reduced to 20 ℃ from 23 ℃, refrigeration is not carried out any more, and the temperature of the working end is naturally reduced to 16 ℃ from 20 ℃ to 16 ℃ from the target temperature because the ambient temperature is lower than the target temperature, so that the control effect can not be achieved. It is therefore appropriate to manually set the thermostat into the heating mode.

In the traditional technology, the temperature adjusting device is manually set to be in a cooling mode or a heating mode, the control logic is complex, and errors are easy to occur, so that the control effect cannot be achieved.

Disclosure of Invention

In view of the above, it is necessary to provide a control method of a temperature adjustment device, a control device of a temperature adjustment device, a semiconductor temperature adjustment device, and a storage medium, in order to solve the problems that in the conventional technology, the temperature adjustment device is manually set to a cooling mode or a heating mode, the control logic is complicated, and errors are prone to occur, so that the control effect cannot be achieved.

A method of controlling a thermostat, comprising:

acquiring an ambient temperature and a current temperature of a working end of a temperature adjusting device;

judging the magnitude of the environment temperature and the current temperature;

when the ambient temperature is higher than the current temperature, controlling the temperature adjusting device to work in a refrigeration mode; and

and when the environment temperature is lower than the current temperature, controlling the temperature adjusting device to work in a heating mode.

In one embodiment, the method further comprises the following steps:

acquiring a target temperature and setting a temperature control dead zone;

when the temperature adjusting device works in a refrigeration mode, if the current temperature is judged to be smaller than the difference between the target temperature and the temperature control dead zone, controlling the temperature adjusting device to stop refrigerating; and/or controlling the temperature adjusting device to start refrigeration if the current temperature is judged to be greater than the sum of the target temperature and the temperature control dead zone; and

when the temperature adjusting device works in a heating mode, if the current temperature is judged to be greater than the sum of the target temperature and the temperature control dead zone, controlling the temperature adjusting device to stop heating; and/or controlling the temperature adjusting device to start heating if the current temperature is judged to be less than the difference between the target temperature and the temperature control dead zone.

In one embodiment, the temperature regulating device comprises a control circuit and a thermoelectric semiconductor connected with the control circuit; the control circuit controls the refrigerating effect of the refrigerating mode or the heating effect of the heating mode by controlling the magnitude of the working current output to the thermoelectric semiconductor, and the larger the working current is, the better the refrigerating effect is or the better the heating effect is;

the control method of the temperature adjusting device further comprises the following steps:

setting a current regulation temperature according to the target temperature; and

reducing the operating current when the present temperature reaches the current regulation temperature;

when the temperature adjusting device works in a cooling mode, the current adjusting temperature is higher than the target temperature; and when the temperature adjusting device works in a heating mode, the current adjusting temperature is lower than the target temperature.

In one embodiment, the controlling the temperature adjusting device to stop heating and/or the controlling the temperature adjusting device to stop cooling includes:

the current of the thermoelectric semiconductor is disconnected by the control circuit.

A control device for a thermostat, comprising:

the acquisition module is used for acquiring the ambient temperature and the current temperature of the working end of the temperature regulating device;

the judging module is used for judging the sizes of the environment temperature and the current temperature; and

the control module is used for controlling the temperature adjusting device to work in a refrigeration mode when the ambient temperature is higher than the current temperature; and when the environment temperature is lower than the current temperature, controlling the temperature adjusting device to work in a heating mode.

A semiconductor temperature regulating device comprising:

thermoelectric semiconductors for cooling or heating;

the control circuit is connected with the thermoelectric semiconductor and is used for controlling the thermoelectric semiconductor to refrigerate or heat by controlling the current direction of the working current output to the thermoelectric semiconductor;

the temperature exchange module is connected with the thermoelectric semiconductor and used for conducting the cold or heat output by the thermoelectric semiconductor to a working end;

the temperature detection module is used for detecting the ambient temperature and the current temperature of the working end; and

the calculation control module is connected with the temperature detection module and the control circuit and is used for executing the following steps:

when the ambient temperature is higher than the current temperature, the thermoelectric semiconductor is controlled to refrigerate through the control circuit;

and when the ambient temperature is lower than the current temperature, the thermoelectric semiconductor is controlled to heat through the control circuit.

In one embodiment, the control circuit includes a power supply, a first switching unit, a second switching unit, a third switching unit, a fourth switching unit, and a control unit;

the first switch unit and the second switch unit are connected in series and then connected in parallel to two ends of the power supply, and the first switch unit is connected to the positive pole of the power supply;

the third switching unit and the fourth switching unit are connected in series and then connected in parallel to two ends of the power supply, and the fourth switching unit is connected to the positive electrode of the power supply;

a first electrical connection terminal of the thermoelectric semiconductor is connected between the first switching unit and the second switching unit, and a second electrical connection terminal of the thermoelectric semiconductor is connected between the third switching unit and the fourth switching unit;

the control unit is connected with the first switch unit, the second switch unit, the third switch unit and the fourth switch unit;

wherein the control unit controls the first switching unit and the third switching unit to be closed when the thermoelectric semiconductor is controlled to heat; when the thermoelectric semiconductor is controlled to refrigerate, the control unit controls the second switch unit and the fourth switch unit to be closed.

In one embodiment, the calculation control module has a target temperature and a temperature control dead band stored therein, and is further configured to:

when the thermoelectric semiconductor is cooled, if the current temperature is judged to be lower than the difference between the target temperature and the temperature control dead zone, the thermoelectric semiconductor is controlled to stop cooling through the control circuit; and/or, if the current temperature is judged to be greater than the sum of the target temperature and the temperature control dead zone, controlling the thermoelectric semiconductor to start cooling through the control circuit; and

when the thermoelectric semiconductor is used for heating, if the current temperature is judged to be greater than the sum of the target temperature and the temperature control dead zone, the control circuit controls the temperature adjusting device to stop heating; and/or controlling the temperature adjusting device to start heating through the control circuit if the current temperature is judged to be smaller than the difference between the target temperature and the temperature control dead zone.

In one embodiment, the calculation control module is further configured to:

controlling the working current to decrease by the control circuit when the current temperature reaches the current regulation temperature;

wherein the current regulation temperature is greater than the target temperature when the thermoelectric semiconductor is cooling; the current regulation temperature is less than the target temperature while the thermoelectric semiconductor is heating.

A storage medium having stored thereon a computer program which, when executed by a processor, carries out the steps of the method according to any one of the preceding claims.

According to the control method of the temperature adjusting device, the control device of the temperature adjusting device, the semiconductor temperature adjusting device and the storage medium, the control logic is set, so that the temperature adjusting device is controlled to work in the cooling mode when the ambient temperature is higher than the current temperature, and the temperature adjusting device is controlled to work in the heating mode when the ambient temperature is lower than the current temperature, so that the temperature adjusting mode is automatically controlled, the intelligent level is high, the control logic is simple, and errors are not easy to occur.

Drawings

Fig. 1 is a block diagram of a semiconductor temperature control device according to an embodiment.

Fig. 2 is a circuit diagram of a control circuit in an embodiment.

Fig. 3 is a flowchart of a method for controlling a thermostat according to an embodiment.

Fig. 4 is a flowchart of a method for controlling a thermostat according to another embodiment.

Fig. 5 is a flowchart of steps further included in a method for controlling a thermostat according to an embodiment.

Fig. 6 is a block diagram of a control device of the temperature adjustment device in an embodiment.

FIG. 7 is a block diagram of a computer device in an embodiment.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

With the development of the thermoelectric system technology and the rise of the smart home, electronic products and the internet of things technology, the acceptance of people to intelligent equipment combining thermoelectric cooling or thermoelectric heating functions is continuously improved, and along with that, people also put forward more functional requirements on the intelligent daily articles. With the continuous development of electronic devices and the pursuit of high-quality life, thermoelectric refrigeration has increasingly wide application in various fields of production and life due to the advantages of small volume, light weight, accurate temperature control, rapid refrigeration and the like. Such as semiconductor refrigerators, drinking water dispensers, cups and semiconductor children cooling pastes, greatly facilitating the life of people.

In the traditional technology, most of products for temperature regulation control by utilizing a thermoelectric system based on the Peltier effect and the semiconductor refrigeration principle simply lead out heat generated at the hot end of a semiconductor temperature regulation device by utilizing a radiating fin and then radiate the heat by using an air cooling method or a liquid cooling method, and the cold end usually uses a metal or ceramic hard connection method to refrigerate an object needing temperature reduction, so that the universality of the traditional semiconductor temperature regulation device is poor.

In addition, the traditional semiconductor temperature adjusting device usually needs manual setting when being controlled to work in a cooling mode or a heating mode, and the intelligent degree is low. Moreover, when the temperature adjusting mode is manually set, errors are prone to occur, for example, when the ambient temperature is higher than the target temperature and higher than the temperature of the working end and the ambient temperature is lower than the target temperature and lower than the temperature of the working end, the control effect cannot be achieved due to the influence of the ambient temperature. Based on the problems that the universality of the traditional semiconductor temperature adjusting device is poor, the intelligent degree is low, and the manual setting of the refrigeration or heating mode is easy to make mistakes so that the control effect cannot be achieved, the semiconductor temperature adjusting device capable of automatically controlling the temperature adjusting mode, simple in control logic and difficult to cause the problem that the control effect cannot be achieved is provided.

Fig. 1 is a block diagram of a semiconductor temperature control device according to an embodiment. As shown in fig. 1, the semiconductor temperature regulating device includes a thermoelectric semiconductor 110, a control circuit 120, a temperature exchanging module 130, a temperature detecting module 150, and a calculation control module 160.

The thermoelectric semiconductor 110 is used for cooling or heating. When the thermoelectric semiconductor 110 cools, the semiconductor temperature control device operates in a cooling mode, and when the thermoelectric semiconductor 110 heats, the semiconductor temperature control device operates in a heating mode. The semiconductor temperature adjusting device can be automatically controlled to work in a cooling mode or a heating mode according to actual requirements.

The control circuit 120 is connected to the thermoelectric semiconductor 110, and the control circuit 120 is configured to control the thermoelectric semiconductor 110 to cool or heat by controlling a current direction of the operating current output to the thermoelectric semiconductor 110. The thermoelectric semiconductor 110 has a current direction for cooling opposite to an operation current direction for heating. The temperature exchanging module 130 is connected to the thermoelectric semiconductor 110, and the temperature exchanging module 130 is used for conducting the cold or heat output by the thermoelectric semiconductor 110 to the working end 140.

Illustratively, the thermoelectric semiconductor 110 includes P-type thermoelectric semiconductor elements and N-type thermoelectric semiconductor elements alternately arranged in parallel, and adjacent P-type thermoelectric semiconductor elements and N-type thermoelectric semiconductor elements are connected in series by electrical arms. The working principle is that by applying a dc voltage to the two ends of the thermoelectric semiconductor 110, heat flows from one end of the element to the other end, and the direction of the current is changed, so that the direction of the heat flow can be changed, and the heat is transferred to the other end, thereby achieving the effect of heating or cooling. The thermoelectric semiconductor 110 generally includes a cold side and a hot side, and conventionally, only the cold side or the hot side is usually used, for example, for a product to be heated, the temperature exchange module is connected to the hot side of the thermoelectric semiconductor, when the thermoelectric semiconductor is applied to a product to be cooled, the temperature exchange module is connected to the cold side of the thermoelectric semiconductor, and after being connected to a direct current power supply, a fixed cooling or heating function is realized. In the semiconductor temperature adjusting device of the present application, the control circuit 120 changes the direction of the current output to the thermoelectric semiconductor 110 to switch between the cooling mode and the heating mode, so that when the temperature exchanging module 130 is connected to the hot side of the thermoelectric semiconductor 110, the hot side can either heat or cool as long as the direction of the current is changed, and when the temperature exchanging module 130 is connected to the cold side of the thermoelectric semiconductor 110, the cold side can both cool and heat.

Referring to fig. 2, the thermoelectric semiconductor 110 includes a first electrical connection terminal 1 and a second electrical connection terminal 2, and the control circuit 120 is connected to the first electrical connection terminal 1 and the second electrical connection terminal 2 of the thermoelectric semiconductor 110. When the semiconductor temperature regulating device needs to be controlled to work in a heating mode, the control circuit 120 outputs current flowing from the first electric connection terminal 1 to the second electric connection terminal 2 to the thermoelectric semiconductor 110 so that the thermoelectric semiconductor 110 heats; when the semiconductor temperature regulating device needs to be controlled to work in the cooling mode, the control circuit 120 outputs current flowing from the second electric connection terminal 2 to the first electric connection terminal 1 to the thermoelectric semiconductor 110 so that the thermoelectric semiconductor 110 cools.

The temperature exchanging module 130 may include a device or apparatus having a thermal conductivity, for example, a water circulating system composed of a water pump, a water pipe and circulating water, so as to conduct the heat or cold of the thermoelectric semiconductor 110 to the working end 140 through water, wherein the water pipe includes a water inlet and a water outlet, the water inlet is connected to the hot end of the thermoelectric semiconductor 110, and the water inlet and the water outlet are communicated through the water pipe at the hot end of the thermoelectric semiconductor 110. In other embodiments, the temperature exchange module 130 may also be implemented using a metal sheet.

The working end 140 may be a product that needs to be heated or cooled, such as a hat, a head sticker, a mattress, clothes, a refrigerator, and a part of the water pipe of the temperature exchanging module 130 contacts with the working end 140 to conduct heat or cold of the thermoelectric semiconductor 110 to the working end 140 to achieve temperature adjustment of the working end 140.

The temperature detection module 150 is used for detecting the ambient temperature and the current temperature of the working end 140. For example, the temperature detection module 150 collects the temperature to be detected using a temperature sensor or a thermocouple.

The calculation control module 160 is connected to the temperature detection module 150 to receive the ambient temperature and the current temperature collected by the temperature detection module 150, and is used to determine the magnitudes of the ambient temperature and the current temperature. The calculation control module 160 is further connected to the control circuit 120, and when the calculation control module 160 determines that the ambient temperature is higher than the current temperature, the thermoelectric semiconductor 110 is controlled to refrigerate by the control circuit 120; and controls the thermoelectric semiconductor 110 to heat through the control circuit 120 when it is judged that the ambient temperature is less than the current temperature.

It should be noted that, in the heating mode, when the current temperature exceeds the target temperature, the semiconductor temperature adjustment device does not cool, and controls the thermoelectric semiconductor 110 not to heat, so that the current temperature of the working end 140 naturally drops, and heating is resumed after the current temperature drops to a certain extent. In the cooling mode, when the current temperature is lower than the target temperature, the semiconductor temperature adjusting device does not heat, and controls the thermoelectric semiconductor 110 not to cool again, so that the current temperature of the working end 140 naturally rises until the current temperature rises to a certain degree and then starts cooling again.

For example, when the ambient temperature is lower than the current temperature and is lower than the target temperature, assuming that the ambient temperature is 15 ℃, the target temperature is 20 ℃, and the current temperature of the working end 140 is 18 ℃, the calculation control module 160 determines that the ambient temperature is lower than the current temperature, and controls the thermoelectric semiconductor 110 to heat through the control circuit 120, and the semiconductor temperature adjustment device operates in the heating mode, and the control logic is correct.

When the environmental temperature is lower than the target temperature and lower than the current temperature, assuming that the environmental temperature is 16 ℃, the target temperature is 20 ℃ and the current temperature of the working end 140 is 23 ℃, the calculation control module 160 determines that the environmental temperature is lower than the current temperature, and then the thermoelectric semiconductor 110 is controlled to heat through the control circuit 120, and the semiconductor temperature adjustment device works in a heating mode, so that the control logic is correct.

When the ambient temperature is higher than the current temperature and higher than the target temperature, assuming that the ambient temperature is 25 ℃, the target temperature is 20 ℃, and the current temperature of the working end 140 is 23 ℃, the calculation control module 160 determines that the ambient temperature is higher than the current temperature, and then the thermoelectric semiconductor 110 is controlled to refrigerate through the control circuit 120, and the semiconductor temperature adjustment device works in a refrigeration mode, so that the control logic is correct.

When the ambient temperature is higher than the target temperature and higher than the current temperature, assuming that the ambient temperature is 25 ℃, the target temperature is 20 ℃ and the current temperature of the working end 140 is 18 ℃, the calculation control module 160 determines that the ambient temperature is higher than the current temperature, and then the thermoelectric semiconductor 110 is controlled to refrigerate through the control circuit 120, and the semiconductor temperature adjusting device works in a refrigeration mode, so that the control logic is correct.

The rest cases are not listed, but it is clear that the control logic of the semiconductor temperature regulating device can control the semiconductor temperature regulating device to work in the correct temperature regulating mode under any combination of the target temperature, the current temperature of the working end 140 and the magnitude relation of the ambient temperature.

In other embodiments, any device of the prior art that does not conflict with the semiconductor temperature control device of the present application, for example, a heat sink such as an electric fan, may optionally be incorporated into the semiconductor temperature control device.

In the semiconductor temperature adjusting device, the control circuit 120 is used for controlling the direction of the current output to the thermoelectric semiconductor 110 so as to switch the temperature adjusting mode of the semiconductor temperature adjusting device between the cooling mode and the heating mode, so that the semiconductor temperature adjusting device has better universality compared with the traditional semiconductor temperature adjusting device; by setting the control logic in the calculation control module 160, when the ambient temperature is higher than the current temperature, the thermoelectric semiconductor 110 is controlled to cool by the control circuit 120, and when the ambient temperature is lower than the current temperature, the thermoelectric semiconductor 110 is controlled to heat by the control circuit 120, so that the temperature adjusting mode of the semiconductor temperature adjusting device is automatically controlled, the intelligent level is high, the control logic is simple, and errors are not easy to occur.

In one embodiment, the calculation control module 160 has a target temperature and a temperature control dead band stored therein. The target temperature may be a fixed temperature stored in the calculation control module 160, or may be input to the calculation control module 160 by a user through an input device such as a button, a mouse, a touch screen, or a voice device as needed. The temperature control dead zone can be adjusted according to the requirements of users.

In this embodiment, the calculation control module 160 is further configured to:

when the thermoelectric semiconductor 110 is cooled, if it is determined that the current temperature is lower than the difference between the target temperature and the temperature control dead zone, the control circuit 120 controls the thermoelectric semiconductor 110 to stop cooling. In another embodiment, when the thermoelectric semiconductor 110 cools, if it is determined that the current temperature is greater than the sum of the target temperature and the temperature control dead zone, the thermoelectric semiconductor 110 is controlled by the control circuit 120 to start cooling.

When the thermoelectric semiconductor 110 is heated, if it is determined that the current temperature is higher than the sum of the target temperature and the temperature control dead zone, the control circuit 120 controls the temperature control device to stop heating. In another embodiment, if the current temperature is less than the difference between the target temperature and the temperature control dead zone, the control circuit 120 controls the thermostat to start heating.

Illustratively, the temperature control dead band is set to 1 ℃. When the thermoelectric semiconductor 110 is cooled, that is, the semiconductor temperature adjustment device operates in the cooling mode, the current temperature of the working end 140 is decreased due to the cooling of the thermoelectric semiconductor 110 until the current temperature is decreased to 1 ℃ lower than the target temperature, the calculation control module 160 turns off the cooling output of the thermoelectric semiconductor 110 through the control circuit 120, the temperature adjustment is not performed any more, and the control circuit 120 enters a standby state. Then, since the ambient temperature is higher than the current temperature and the thermoelectric semiconductor 110 stops cooling in the cooling mode, the current temperature of the working end 140 starts to rise naturally until the current temperature rises to 1 ℃ higher than the target temperature, and the calculation control module 160 controls the thermoelectric semiconductor 110 to restart cooling through the control circuit 120, so as to circulate.

When the thermoelectric semiconductor 110 heats, that is, the semiconductor temperature adjustment device operates in the heating mode, the current temperature of the working end 140 rises due to the heating of the thermoelectric semiconductor 110, and until the current temperature rises to 1 ℃ higher than the target temperature, the calculation control module 160 turns off the heating output of the thermoelectric semiconductor 110 through the control circuit 120, so that the temperature adjustment is not performed any more, and the control circuit 120 enters a standby state. Then, since the ambient temperature is lower than the current temperature and the thermoelectric semiconductor 110 stops heating in the heating mode, the current temperature of the working end 140 starts to naturally decrease until the current temperature decreases to 1 ℃ lower than the target temperature, and the calculation control module 160 controls the thermoelectric semiconductor 110 to restart heating through the control circuit 120, so as to perform the cycle.

It should be noted that the temperature control dead zone in this embodiment may be set according to the temperature adjustment requirement, and when the temperature control dead zone is larger, the interval between the start and the stop of the control circuit 120 is longer, which saves more energy and has less noise; when the temperature control dead zone is small, the temperature adjustment accuracy is higher, and the current temperature of the working end 140 is always kept closer to the target temperature.

In this embodiment, the semiconductor temperature adjustment device can maintain the current temperature of the working end 140 near the target temperature (the maximum temperature difference from the target temperature is a temperature control dead zone), that is, close to the constant temperature, and can avoid frequent start and stop of the control circuit 120, thereby saving energy and reducing noise. When the control circuit 120 comprises relay switch control, frequent operation of the control circuit 120 can be avoided and frequent ringing of the relay in the control circuit 120 can also be avoided due to the arrangement of the temperature control dead zone, so that the user experience is improved.

In one embodiment, the calculation control module 160 is further configured to:

setting current regulation temperature according to the target temperature; and

when the present temperature reaches the current regulation temperature, the operating current is controlled to decrease by the control circuit 120.

Specifically, the current regulation temperature is a temperature close to the target temperature, and the current regulation temperature is set according to the target temperature. When the thermoelectric semiconductor 110 is cooling, i.e., the thermostat is operating in a cooling mode, the current regulation temperature is greater than the target temperature. When the thermoelectric semiconductor 110 heats, i.e., the thermostat operates in the heating mode, the current regulation temperature is less than the target temperature.

The inventor finds that the cooling or heating effect of the thermoelectric semiconductor 110 is related to the magnitude of the current output to the thermoelectric semiconductor 110 by the control circuit 120. Specifically, the larger the operating current output by the control circuit 120 to the thermoelectric semiconductor 110 is, the better the cooling or heating effect of the thermoelectric semiconductor 110 is, and correspondingly, the faster the current temperature of the operating end 140 decreases or increases. When the present temperature reaches the current regulation temperature, the operating current is controlled to decrease by the control circuit 120. That is, when the current temperature of the working terminal 140 drops to the current regulation temperature close to the target temperature while the thermoelectric semiconductor 110 is cooling, the working current is reduced so that the cooling effect of the thermoelectric semiconductor 110 is reduced; when the current temperature of the working terminal 140 rises to the current regulation temperature close to the target temperature while the thermoelectric semiconductor 110 heats, the reduction of the working current causes the heating effect of the thermoelectric semiconductor 110 to be reduced. In this embodiment, the current regulation temperature may be regulated according to parameters such as the magnitude of the cooling or heating effect of the thermoelectric semiconductor 110. For example, in the heating mode, the heating effect of the thermoelectric semiconductor 110 is better, and the temperature of the working end rises faster, so that the current regulation temperature can be set to be smaller (larger than the target temperature), for example, the target temperature is 25 ℃, and the current regulation temperature can be set to be 20 ℃; in contrast, if the thermoelectric semiconductor 110 has a poor heating effect and the temperature of the working end rises slowly, the current regulation temperature may be set to be larger (smaller than the target temperature), for example, the target temperature is 25 ℃, and the current regulation temperature may be set to be 23 ℃.

For example, assuming that when the thermoelectric semiconductor 110 is used for cooling, the ambient temperature is 23 ℃, the target temperature is 16 ℃, the temperature control dead zone is 1 ℃, the current regulation temperature is 18 ℃, the current temperature of the working end 140 is 20 ℃, and a large working current is output to the thermoelectric semiconductor 110 through the control circuit 120, so that the cooling effect of the thermoelectric semiconductor 110 is good, and the temperature drop speed of the working end 140 is high. Until the current temperature of the working end 140 drops to 18 ℃, the control circuit 120 reduces the working current output to the thermoelectric semiconductor 110, so that the cooling effect of the thermoelectric semiconductor 110 is reduced and the temperature drop speed of the working end 140 is reduced. Then, until the current temperature of the working end 140 decreases to 15 ℃, the control circuit 120 cuts off the working current output to the thermoelectric semiconductor 110, and the control circuit 120 enters a standby state, so that the cooling of the thermoelectric semiconductor 110 is stopped, the temperature of the working end 140 naturally rises, and the thermoelectric semiconductor 110 is controlled to restart cooling until the temperature of the working end 140 increases to 17 ℃, so as to circulate.

In this embodiment, when the thermoelectric semiconductor 110 is cooling, the operating current output by the control circuit 120 to the thermoelectric semiconductor 110 may be a variable current or a fixed current during the process that the temperature of the operating end 140 decreases from the current temperature to the current regulation temperature, and correspondingly, the operating current output by the control circuit 120 to the thermoelectric semiconductor 110 may be a variable current or a fixed current during the process that the temperature of the operating end 140 decreases from the current regulation temperature by the difference between the target temperature and the temperature control dead zone, as long as the operating current during the process that the temperature of the operating end 140 decreases from the current temperature to the current regulation temperature is ensured to be greater than the operating current during the process that the temperature of the operating end 140 decreases from the current regulation temperature by the difference between the target temperature and the temperature control dead zone.

The principle of the thermoelectric semiconductor 110 during heating is similar to that during cooling, and is not described herein again by way of example.

Fig. 2 is a circuit diagram of the control circuit 120 according to an embodiment. As shown in fig. 2, the control circuit 120 includes a power supply 121, a first switching unit 122, a second switching unit 123, a third switching unit 124, a fourth switching unit 125, and a control unit 126.

The first switch unit 122 and the second switch unit 123 are connected in series and then connected in parallel to two ends of the power supply 121, the first switch unit 122 is connected to the positive pole of the power supply 121, and the second switch unit 123 is connected to the negative pole of the power supply 121. The third switching unit 124 and the fourth switching unit 125 are connected in series and then connected in parallel to two ends of the power supply 121, the fourth switching unit 125 is connected to the positive pole of the power supply 121, and the third switching unit 124 is connected to the negative pole of the power supply 121. The first electrical connection terminal 1 of the thermoelectric semiconductor 110 is connected between the first switching unit 122 and the second switching unit 123, and the second electrical connection terminal 2 of the thermoelectric semiconductor 110 is connected between the third switching unit 124 and the fourth switching unit 125. The control unit 126 is connected to the first switch unit 122, the second switch unit 123, the third switch unit 124, and the fourth switch unit 125.

Wherein, when controlling the thermoelectric semiconductor 110 to heat, the control unit 126 controls the first switching unit 122 and the third switching unit 124 to be closed; in controlling the thermoelectric semiconductor 110 to cool, the control unit 126 controls the second switching unit 123 and the fourth switching unit 125 to be closed.

Illustratively, the first switching unit 122, the second switching unit 123, the third switching unit 124 and the fourth switching unit 125 employ a triode. The calculation control module 160 includes a DSP controller, and the control unit 126 includes a first PWM driving module connected to the DSP controller. The first PWM driving module is further connected to the first switching unit 122, the second switching unit 123, the third switching unit 124, and the fourth switching unit 125.

When the DSP controller judges that the ambient temperature is lower than the current temperature, the semiconductor temperature adjusting device is controlled to work in a heating mode, namely, the thermoelectric semiconductor 110 is controlled to heat, the first DSP controller outputs a heating PWM signal, so that the first switching unit 122 and the third switching unit 124 are closed, the first electric connection end 1 of the thermoelectric semiconductor 110 is connected with the positive pole of the power supply 121, and the second electric connection end 2 of the thermoelectric semiconductor 110 is connected with the negative pole of the power supply 121. And, the magnitude of the operating current of the thermoelectric semiconductor 110 can be changed by adjusting the duty ratio of the heating PWM signal to change the heating effect of the thermoelectric semiconductor 110, thereby changing the temperature rising speed of the operating terminal 140.

When the DSP controller judges that the ambient temperature is higher than the current temperature, the semiconductor temperature adjusting device is controlled to work in a refrigeration mode, namely, the thermoelectric semiconductor 110 is controlled to refrigerate, the first DSP controller outputs a refrigeration PWM signal, so that the second switch unit 123 and the fourth switch unit 125 are closed, the first electric connection end 1 of the thermoelectric semiconductor 110 is connected with the negative electrode of the power supply 121, and the second electric connection end 2 of the thermoelectric semiconductor 110 is connected with the positive electrode of the power supply 121. And, the magnitude of the operating current of the thermoelectric semiconductor 110 can be changed by adjusting the duty ratio of the cooling PWM signal to change the cooling effect of the thermoelectric semiconductor 110, thereby changing the temperature drop speed of the operating terminal 140.

In this embodiment, the first switch unit 122, the second switch unit 123, the third switch unit 124 and the fourth switch unit 125 form a full bridge circuit, and the first PWM driving module controls the PWM signal output to the full bridge circuit to control the cooling or heating of the thermoelectric semiconductor 110 and to control the cooling or heating effect of the thermoelectric semiconductor 110. In other embodiments, the control unit 126 may further include a second PWM driving module (not shown) connected to the DSP controller. Correspondingly, the control circuit 120 further includes a half-bridge circuit connected to the second PWM driving module and the temperature exchanging module 130, and the DSP controller controls the temperature exchanging power of the temperature exchanging module 130 by controlling the duty ratio of the second PWM driving module to further change the temperature rising speed or the temperature falling speed of the working end 140 according to the requirement.

The application also provides a control method of the temperature adjusting device. The method for controlling the temperature control device may be a method for controlling any temperature control device in the conventional art, or a method for controlling the semiconductor temperature control device provided in the above embodiment. Fig. 3 is a control method of a temperature adjusting device in an embodiment, as shown in fig. 3, the control method of the temperature adjusting device includes the following steps:

step S310, acquiring the ambient temperature and the current temperature of the working end of the temperature adjusting device.

In step S320, the ambient temperature and the current temperature are determined.

And step S330, controlling the temperature adjusting device to work in a refrigeration mode when the ambient temperature is higher than the current temperature.

And step S340, controlling the temperature adjusting device to work in a heating mode when the ambient temperature is lower than the current temperature.

Specifically, the ambient temperature is the temperature at which the working end of the temperature adjustment device is located in the environment. The working end may be a product that needs to be heated or cooled, such as a hat, a head patch, a mattress, clothing, a refrigerator. Acquiring the ambient temperature and the current temperature of the working end of the temperature adjusting device may employ temperature detection equipment such as a temperature sensor, a thermocouple, and the like to acquire the ambient temperature and the current temperature of the working end. In this embodiment, the ambient temperature and the current temperature of the working end are both temperatures detected in real time.

Judging the magnitude relation between the environment temperature and the current temperature, and controlling the temperature adjusting device to work in a refrigeration mode when the environment temperature is higher than the current temperature so as to reduce the temperature of a working end; and when the ambient temperature is lower than the current temperature, controlling the temperature adjusting device to work in a heating mode, so that the temperature of the working end is increased.

It should be noted that, in the heating mode, when the current temperature exceeds the target temperature, the temperature adjustment device does not cool or heat, so that the current temperature of the working end naturally decreases, and heating is resumed after the current temperature decreases to a certain extent. In the cooling mode, when the current temperature is lower than the target temperature, the temperature regulating device does not heat and does not cool, so that the current temperature of the working end naturally rises until the current temperature rises to a certain degree, and cooling is restarted.

For example, when the ambient temperature is lower than the current temperature and is lower than the target temperature, assuming that the ambient temperature is 15 ℃, the target temperature is 20 ℃ and the current temperature is 18 ℃, when it is determined that the ambient temperature is lower than the current temperature, the temperature control device is controlled to operate in the heating mode, and the temperature of the working end starts to rise until the temperature rises to the target temperature or exceeds the target temperature (for example, 1 ℃ higher than the target temperature 20 ℃) and then heating is not performed. At this time, the working end is naturally cooled due to the low ambient temperature, and the temperature control device is controlled to restart heating after the temperature of the working end is cooled to a certain degree (for example, 1 ℃ lower than the target temperature of 20 ℃), thereby circulating the heating.

When the environmental temperature is lower than the target temperature and is lower than the current temperature, assuming that the environmental temperature is 16 ℃, the target temperature is 20 ℃ and the current temperature is 23 ℃, judging that the environmental temperature is lower than the current temperature, controlling the temperature adjusting device to work in a heating mode, naturally cooling the working end due to the lower environmental temperature until the temperature of the working end is cooled to a certain degree (for example, 1 ℃ lower than the target temperature 20 ℃), starting heating by the temperature adjusting device, and stopping heating until the temperature of the working end is raised to a certain degree (for example, 1 ℃ higher than the target temperature 20 ℃), so as to circulate.

When the ambient temperature is higher than the current temperature and higher than the target temperature, assuming that the ambient temperature is 25 ℃, the target temperature is 20 ℃ and the current temperature is 23 ℃, judging that the ambient temperature is higher than the current temperature, controlling the temperature adjusting device to work in a refrigeration mode, and starting to reduce the temperature of a working end until the temperature is reduced to the target temperature or lower than the target temperature (for example, lower than the target temperature by 20 ℃ and lower by 1 ℃) and then not refrigerating. At this time, the ambient temperature is higher, so that the working end naturally rises, and the temperature adjusting device restarts cooling after the temperature of the working end rises to a certain extent (for example, 1 ℃ higher than the target temperature of 20 ℃), thereby circulating.

When the ambient temperature is higher than the target temperature and is higher than the current temperature, assuming that the ambient temperature is 25 ℃, the target temperature is 20 ℃ and the current temperature of the working end is 18 ℃, judging that the ambient temperature is higher than the current temperature, controlling the temperature regulating device to work in a refrigeration mode, wherein the temperature of the working end naturally rises due to higher ambient temperature until the temperature of the working end rises to a certain degree (for example, 1 ℃ higher than the target temperature of 20 ℃), starting refrigeration by the temperature regulating device, and stopping refrigeration until the temperature of the working end drops to a certain degree (for example, 1 ℃ lower than the target temperature of 20 ℃), so as to circulate.

The rest cases are not listed, but it is clear that the control logic of the semiconductor temperature regulating device can control the semiconductor temperature regulating device to work in the correct temperature regulating mode under any combination of the target temperature, the current temperature of the working end and the magnitude relation of the ambient temperature.

According to the control method of the temperature adjusting device, the temperature adjusting device is controlled to work in the cooling mode when the ambient temperature is higher than the current temperature and to work in the heating mode when the ambient temperature is lower than the current temperature by setting the control logic, so that the temperature adjusting mode is automatically controlled, the intelligent level is high, the control logic is simple, and errors are not easy to occur.

Fig. 4 shows a method for controlling a thermostat according to another embodiment. As shown in fig. 4, the method for controlling the temperature adjusting device includes:

In step S350, a target temperature is acquired and a temperature control dead zone is set.

And step S331, when the temperature adjusting device works in the cooling mode, judging whether the current temperature is less than the difference between the target temperature and the temperature control dead zone.

And step S332, if yes, controlling the temperature adjusting device to stop cooling.

If not, the temperature adjusting device is controlled to continue cooling and the step S331 is continuously executed.

Step S333, judging whether the current temperature is larger than the sum of the target temperature and the temperature control dead zone.

And step S334, if yes, controlling the temperature adjusting device to start cooling.

If not, the temperature adjusting device is controlled to stop cooling and the step S333 is continuously executed.

Specifically, the target temperature may be input by using an input device such as a key, a mouse, a touch screen, or a voice device, so as to obtain the target temperature. The temperature control dead zone can be adjusted according to the requirement, the temperature control dead zone can avoid frequent starting of the temperature adjusting device, and when the set value of the temperature control dead zone is small, the temperature of the working end can be always kept in a small difference with the target temperature, so that the temperature control is approximate to constant temperature control. For example, the temperature control dead zone may be set to 1 ℃.

And when the temperature adjusting device works in a cooling mode, judging whether the current temperature is smaller than the difference between the target temperature and the temperature control dead zone. And if so, controlling the temperature adjusting device to stop refrigerating. At the moment, the ambient temperature is higher than the current temperature, so that the working end naturally heats up; if not, controlling the temperature adjusting device to continuously cool and continuously judging whether the current temperature is less than the difference between the target temperature and the temperature control dead zone. Controlling the temperature adjusting device to restart refrigeration until the current temperature of the working end rises to exceed the sum of the target temperature and the temperature control dead zone; if the current temperature of the working end does not rise to exceed the sum of the target temperature and the temperature control dead zone, the temperature adjusting device is controlled to continue to stop refrigerating, so that the working end continues to naturally rise in temperature, and the circulation is performed. After the current temperature of the working end is stable, the current temperature is always between the difference between the target temperature and the temperature control dead zone and the sum of the target temperature and the temperature control dead zone, and is approximately constant.

And step S341, judging whether the current temperature is greater than the sum of the target temperature and the temperature control dead zone when the temperature adjusting device works in the heating mode.

In step S342, if yes, the temperature control device is controlled to stop heating.

If not, the temperature control device is controlled to continue heating and to continue to execute step S341.

In step S343, it is determined whether the current temperature and the target temperature are smaller than the difference between the temperature control dead zones.

In step S344, if yes, the temperature control device is controlled to start heating.

If not, the temperature adjusting device is controlled to stop heating and the step S343 is continuously executed.

Specifically, when the temperature adjusting device works in the heating mode, whether the current temperature is greater than the sum of the target temperature and the temperature control dead zone is judged. And if so, controlling the temperature adjusting device to stop heating. At the moment, the working end is naturally cooled because the ambient temperature is lower than the current temperature and is lower; if not, controlling the temperature adjusting device to continue heating and continuously judging whether the current temperature is greater than the sum of the target temperature and the temperature control dead zone. Controlling the temperature adjusting device to restart heating until the current temperature of the working end is cooled to be lower than the difference between the target temperature and the temperature control dead zone; if the current temperature of the working end is not cooled to be lower than the difference between the target temperature and the temperature control dead zone, the temperature adjusting device is controlled to continue heating, so that the working end continues to be naturally cooled, and the circulation is performed. After the current temperature of the working end is stable, the current temperature is always between the difference between the target temperature and the temperature control dead zone and the sum of the target temperature and the temperature control dead zone, and is approximately constant.

In one embodiment, a temperature conditioning device includes a control circuit and a thermoelectric semiconductor coupled to the control circuit. The control circuit controls the refrigerating effect of the refrigerating mode or the heating effect of the heating mode by controlling the magnitude of the working current output to the thermoelectric semiconductor, and the larger the working current is, the better the refrigerating effect or the heating effect is.

In this embodiment, the semiconductor temperature control device in any of the above embodiments is controlled. As shown in fig. 5, the method for controlling the temperature adjustment device further includes:

step S510, setting a current regulation temperature according to the target temperature.

In step S520, it is determined whether the current temperature reaches the current regulation temperature.

In step S530, if yes, the operating current is decreased.

Specifically, the current regulation temperature is a temperature close to the target temperature, and the current regulation temperature is set according to the target temperature. When the thermoelectric semiconductor refrigeration, namely the temperature adjusting device works in a refrigeration mode, the current adjusting temperature is higher than the target temperature. When the thermoelectric semiconductor heating, namely the temperature adjusting device works in a heating mode, the current adjusting temperature is lower than the target temperature.

The inventor researches and finds that the cooling or heating effect of the thermoelectric semiconductor is related to the current output to the thermoelectric semiconductor by the control circuit. Specifically, the larger the working current output by the control circuit to the thermoelectric semiconductor is, the better the cooling or heating effect of the thermoelectric semiconductor is, and correspondingly, the faster the current temperature of the working end drops or rises. And when the current temperature reaches the current regulation temperature, controlling the working current to be reduced through the control circuit. That is, when the current temperature of the working end is decreased to the current regulation temperature close to the target temperature during the cooling of the thermoelectric semiconductor, the working current is decreased so that the cooling effect of the thermoelectric semiconductor is decreased; when the current temperature of the working end is increased to the current regulation temperature close to the target temperature during the heating of the thermoelectric semiconductor, the working current is reduced, so that the heating effect of the thermoelectric semiconductor is reduced. In this embodiment, the current regulation temperature may be regulated according to parameters such as the cooling or heating effect of the thermoelectric semiconductor. For example, in the heating mode, the heating effect of the thermoelectric semiconductor is good, and the temperature of the working end rises faster, so that the current regulation temperature can be set to be smaller (larger than the target temperature), for example, the target temperature is 25 ℃, and the current regulation temperature can be set to be 20 ℃; in contrast, the thermoelectric semiconductor has a poor heating effect, and the temperature of the working end rises slowly, so that the current regulation temperature can be set to be larger (smaller than the target temperature), for example, the target temperature is 25 ℃, and the current regulation temperature can be set to be 23 ℃.

For example, when the thermoelectric semiconductor is used for refrigerating, the environment temperature is 23 ℃, the target temperature is 16 ℃, the temperature control dead zone is 1 ℃, the set current regulation temperature is 18 ℃, the current temperature of the working end is 20 ℃, and a larger working current is output to the thermoelectric semiconductor through the control circuit, so that the thermoelectric semiconductor has a better refrigerating effect and the temperature of the working end is reduced at a higher speed. And reducing the working current output to the thermoelectric semiconductor by the control circuit until the current temperature of the working end is reduced to 18 ℃, so that the refrigeration effect of the thermoelectric semiconductor is reduced, and the temperature reduction speed of the working end is reduced. And then, the control circuit cuts off the working current output to the thermoelectric semiconductor until the current temperature of the working end is reduced to 15 ℃, and enters a standby state, so that the thermoelectric semiconductor stops cooling, the temperature of the working end naturally rises, and the thermoelectric semiconductor is controlled to restart cooling until the temperature of the working end is increased to 17 ℃, so as to circulate.

In this embodiment, when the thermoelectric semiconductor cools, in the process that the temperature of the working end drops from the current temperature to the current regulation temperature, the control circuit may output the working current to the thermoelectric semiconductor as a variable current or a fixed current, and correspondingly, in the process that the current temperature of the working end drops from the current regulation temperature by the difference between the target temperature and the temperature control dead zone, the control circuit may output the working current to the thermoelectric semiconductor as a variable current or a fixed current, as long as it is ensured that the working current in the process that the temperature of the working end drops from the current temperature to the current regulation temperature is greater than the working current in the process that the temperature of the working end drops from the current regulation temperature by the difference between the target temperature and the temperature control dead zone.

The principle of heating by thermoelectric semiconductor is similar to that of cooling, and is not described herein again by way of example.

In this embodiment, controlling the temperature conditioning device to stop heating and/or controlling the temperature conditioning device to stop cooling includes disconnecting the current of the thermoelectric semiconductor through the control circuit.

The application also provides a control device of the temperature adjusting device. The control device of the temperature adjustment device may perform the control method of the temperature adjustment device in any of the above embodiments. Fig. 6 illustrates a method for controlling a temperature adjustment device in an embodiment, and as shown in fig. 6, the control device of the temperature adjustment device includes an obtaining module 610, a determining module 620, and a control module 630.

The obtaining module 610 is used for obtaining the ambient temperature and the current temperature of the working end of the temperature adjusting device. The determining module 620 is used for determining the ambient temperature and the current temperature. The control module 630 is configured to control the temperature adjustment device to operate in the cooling mode when the ambient temperature is higher than the current temperature, and to control the temperature adjustment device to operate in the heating mode when the ambient temperature is lower than the current temperature.

In one embodiment, the obtaining module 610 is further configured to obtain a target temperature and set a temperature control dead band. The control module 630 is further configured to, when the temperature adjustment device operates in the cooling mode, control the temperature adjustment device to stop cooling if it is determined that the current temperature is less than the difference between the target temperature and the temperature control dead zone; and/or controlling the temperature adjusting device to start refrigeration if the current temperature is judged to be greater than the sum of the target temperature and the temperature control dead zone; when the temperature adjusting device works in a heating mode, if the current temperature is judged to be greater than the sum of the target temperature and the temperature control dead zone, the temperature adjusting device is controlled to stop heating; and/or controlling the temperature adjusting device to start heating if the current temperature is judged to be less than the difference between the target temperature and the temperature control dead zone.

In one embodiment, the temperature regulating device comprises a control circuit and a thermoelectric semiconductor connected with the control circuit; the control circuit controls the refrigerating effect of the refrigerating mode or the heating effect of the heating mode by controlling the magnitude of the working current output to the thermoelectric semiconductor, and the larger the working current is, the better the refrigerating effect or the heating effect is;

the control module 630 is further configured to set a current regulation temperature according to the target temperature; and reducing the operating current when the present temperature reaches the current regulation temperature. When the temperature adjusting device works in a refrigeration mode, the current adjusting temperature is higher than the target temperature; when the temperature adjusting device works in a heating mode, the current adjusting temperature is lower than the target temperature. In this embodiment, the current regulation temperature may be regulated according to parameters such as the cooling or heating effect of the thermoelectric semiconductor. For example, in the heating mode, the heating effect of the thermoelectric semiconductor is good, and the temperature of the working end rises faster, so that the current regulation temperature can be set to be smaller (larger than the target temperature), for example, the target temperature is 25 ℃, and the current regulation temperature can be set to be 20 ℃; in contrast, the thermoelectric semiconductor has a poor heating effect, and the temperature of the working end rises slowly, so that the current regulation temperature can be set to be larger (smaller than the target temperature), for example, the target temperature is 25 ℃, and the current regulation temperature can be set to be 23 ℃.

In one embodiment, the control module 630 controls the temperature conditioning device to stop heating and/or controls the temperature conditioning device to stop cooling includes disconnecting the current from the thermoelectric semiconductor via the control circuit.

The above-described method and system may be implemented in a computer device. The internal structure of the computer device is shown in fig. 7. The computer device includes a processor, a memory, and a network interface connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The network interface of the computer device is used for communicating with an external terminal through a network connection. The computer program is executed by a processor to implement the steps of the method of controlling a thermostat according to any of the preceding embodiments. Those skilled in the art will appreciate that the architecture shown in fig. 7 is merely a block diagram of some of the structures associated with the disclosed aspects and is not intended to limit the computing devices to which the disclosed aspects apply, as particular computing devices may include more or less components than those shown, or may combine certain components, or have a different arrangement of components.

The present application also provides a storage medium having a computer program stored thereon. Which when executed by a processor implements the steps of any of the methods described above.

It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, storage, database, or other medium used in the embodiments provided herein may include non-volatile and/or volatile memory, among others. Non-volatile memory can include read-only memory (ROM), Programmable ROM (PROM), Electrically Programmable ROM (EPROM), Electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDRSDRAM), Enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), Rambus Direct RAM (RDRAM), direct bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A method of controlling a thermostat, comprising:

2. The method for controlling a temperature adjusting device according to claim 1, further comprising:

acquiring a target temperature and setting a temperature control dead zone;

3. The method for controlling a temperature-adjusting device according to claim 2, wherein the temperature-adjusting device includes a control circuit and a thermoelectric semiconductor connected to the control circuit; the control circuit controls the refrigerating effect of the refrigerating mode or the heating effect of the heating mode by controlling the magnitude of the working current output to the thermoelectric semiconductor, and the larger the working current is, the better the refrigerating effect is or the better the heating effect is;

4. The method for controlling a thermostat of claim 3, wherein the controlling the thermostat to stop heating and/or the thermostat to stop cooling comprises:

5. A control device for a thermostat, comprising:

6. A semiconductor temperature conditioning device, comprising:

thermoelectric semiconductors for cooling or heating;

7. The semiconductor temperature regulating device according to claim 6, wherein the control circuit comprises a power supply, a first switching unit, a second switching unit, a third switching unit, a fourth switching unit, and a control unit;

8. The semiconductor temperature regulating device according to claim 6, wherein the computational control module has stored therein a target temperature and a temperature control dead band, the computational control module further configured to:

9. The semiconductor temperature conditioning device of claim 8, wherein the computational control module is further configured to:

10. A storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the steps of the method according to any of claims 1 to 4.