CN111717840A

CN111717840A - Hoisting assembly and hoisting device

Info

Publication number: CN111717840A
Application number: CN202010588915.4A
Authority: CN
Inventors: 李晓军
Original assignee: Beijing Naura Microelectronics Equipment Co Ltd
Current assignee: Beijing Naura Microelectronics Equipment Co Ltd
Priority date: 2020-06-24
Filing date: 2020-06-24
Publication date: 2020-09-29
Anticipated expiration: 2040-06-24
Also published as: CN111717840B

Abstract

The application discloses hoist and mount subassembly and hoist device. This hoist and mount subassembly is used for hoisting semiconductor process equipment, including the installation sleeve, the axial passes the telescopic pivot of installation, the middle part of pivot is in the telescopic inside of installation, the both ends of pivot all are in the telescopic outside of installation, and the pivot can for the installation sleeve rotates with follow axial displacement to and davit, including two spaced apart connecting leg, the first end of pivot is connected to through a connecting piece reassembling type the first connecting leg of davit, seted up on the second connecting leg of davit and accomodate the hole, the second end of pivot can be followed the axial is inserted or is shifted out accomodate the hole. The volume and the weight of the suspension arm are obviously reduced compared with the hoisting tool in the prior art, and the suspension arm can be easily disassembled and assembled with the rotating shaft, so that the hoisting of semiconductor process equipment is facilitated.

Description

Hoisting assembly and hoisting device

Technical Field

The application relates to the field of semiconductor manufacturing, in particular to a hoisting assembly and a hoisting device for hoisting semiconductor process equipment.

Background

Generally, semiconductor process equipment is bulky and heavy, and when the equipment is installed, removed, and maintained, a separate lifting tool is often required to be mounted on the equipment (or a part of the equipment, such as a table), and then the equipment (or the part of the equipment) is lifted and displaced by a lifting device (such as a crown block). However, installation and removal of the lifting tool is often time consuming and laborious and therefore requires improvement.

Disclosure of Invention

The utility model provides a hoist and mount subassembly for hoist and mount semiconductor process equipment, a serial communication port, including the installation sleeve, the axial is passed the telescopic pivot of installation, the middle part of pivot is in the inside of installation sleeve, the both ends of pivot all are in the telescopic outside of installation, and the pivot can for the installation sleeve rotates and follows axial displacement to and davit, including two spaced apart connecting legs, the first end of pivot is connected to through a connecting piece reassembling type the first connecting leg of davit, seted up on the second connecting leg of davit and received the hole, the second end of pivot can be followed the axial is inserted or is shifted out receive the hole.

In one embodiment, bearings are arranged at two ends of the mounting sleeve, the bearings are located inside the mounting sleeve, and the rotating shaft penetrates through the bearings.

In one embodiment, bearing end covers are arranged at two ends of the mounting sleeve, the bearing end covers are used for limiting the bearing, and the rotating shaft penetrates through the bearing end covers.

In one embodiment, a through-hole is provided at the first end, the through-hole being located outside the mounting sleeve; the first connecting leg is configured to comprise two extending parts clamping the first end, and each extending part is provided with a through hole; the connecting piece comprises a locking pin, and the locking pin is detachably inserted into the through hole and the through hole.

In one embodiment, the hoisting assembly further comprises an elastic member, one end of the elastic member abuts against the bearing close to the first end, the other end of the elastic member is arranged on the rotating shaft, the elastic member is in a compressed state, and when the rotating shaft moves along the axial direction, the elastic member is further extruded or stretched.

In one embodiment, a retaining ring protruding outwards in the radial direction of the rotating shaft is arranged in the middle of the rotating shaft, and the other end of the elastic element abuts against the retaining ring.

In one embodiment, the shaft is provided with a shoulder, the shoulder is located outside the mounting sleeve, and the shoulder can abut against the bearing end cover close to the first end under the elastic force of the elastic element.

In one embodiment, a pull rod is disposed at the first end, and the rotating shaft can be driven to move along the axial direction when a driving force is applied to the pull rod along the axial direction.

A second aspect of the application proposes a hoisting device for hoisting semiconductor processing equipment, characterized in that it comprises a drive assembly, and a hoisting assembly according to the above, wherein the mounting sleeve is fixedly mounted on the drive assembly and is driven by the drive assembly to move.

In one embodiment, the driving assembly includes a driving member, a screw rod connected to the driving member, and a slider sleeved on the screw rod through a thread, the mounting sleeve is connected to the slider, and the driving member drives the screw rod to rotate, so that the slider rotates relative to the screw rod and moves along the axial direction of the screw rod, and drives the hoisting assembly to move. .

Compared with the prior art, the invention has the following beneficial effects: in the hoisting assembly, the hoisting arm is arranged on the semiconductor process equipment and can be conveniently detached from or installed on the installation sleeve or the rotating shaft, so that the hoisting assembly is separated from or connected with the hoisting device driving assembly. The volume and the weight of the suspension arm are obviously reduced compared with the hoisting tool in the prior art, and the suspension arm can be easily disassembled and assembled with the rotating shaft, so that the hoisting of semiconductor process equipment is facilitated.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

figure 1 schematically illustrates a hoist assembly according to one embodiment of the present application.

Fig. 2 schematically shows the fitting structure of the mounting sleeve and the rotating shaft.

Fig. 3 schematically shows the structure of the rotating shaft.

Fig. 4 schematically shows the construction of the boom.

Fig. 5 is a sectional view a-a of fig. 4.

Figure 6 schematically shows a lifting device according to an embodiment of the present application.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Figure 1 schematically shows a hoist assembly 1 according to an embodiment of the application. The hoist assembly 1 is used to hoist semiconductor processing equipment (such as reference numeral 605 in figure 6). As shown in fig. 1, the hoist assembly 1 includes a mounting sleeve 100, a rotating shaft 200 axially passing through the mounting sleeve 100, and a boom 300 detachably connected to the rotating shaft 200. The middle portion 203 of the rotating shaft 200 is located inside the mounting sleeve 100, the first end 201 and the second end 202 of the rotating shaft 200 are both located outside the mounting sleeve 100, and the rotating shaft 200 can rotate and move axially relative to the mounting sleeve 100. Boom 300 includes two spaced apart connecting

legs

301, 302. The first connecting leg 301 is detachably connected to the first end 201 of the rotating shaft 200 (e.g., via the locking pin 205), and the second connecting leg 302 is detachably connected to the second end 202 of the rotating shaft 200.

The hoist assembly 1 according to the present application may be used to hoist semiconductor processing equipment (or components thereof), such as silicon epitaxial equipment. Wherein the boom 300 is mounted on a semiconductor processing tool (as indicated by reference 605 in fig. 6), for example, a plurality of mounting holes 310 are provided on the boom 300 to facilitate connection; the mounting sleeve 100 is fixedly mounted on the lifting device (as indicated by reference numeral 6 in fig. 6). According to the hoisting assembly 1 of the present application, the first connecting leg 301 and the second connecting leg 302 of the boom 300 can be detached from or attached to the rotating shaft 200 as required, thereby realizing the separation or connection of the hoisting assembly 1 and the hoisting device. In the connection state, the semiconductor process equipment can be hoisted; and after the hoisting is finished, separating. Since the volume and weight of the boom 300 are significantly reduced compared to those of the related art, and can be easily disassembled from and assembled to the rotating shaft 200, the hoisting of the semiconductor process equipment is facilitated.

As shown in fig. 2,

bearings

101 and 102 are provided at both ends of the inside of the mounting sleeve 100, and the rotation shaft 200 extends through the

bearings

101 and 102. In this way, the rotation shaft 200 can be easily rotated with respect to the mounting sleeve 100. In a state where the boom 300 is coupled to the rotating shaft 200, the boom 300 can be easily rotated with respect to the mounting sleeve 100, which further facilitates the hoisting of the semiconductor process equipment by the hoisting assembly 1. In a specific embodiment, the number of bearings is two, the first bearing 101 is for carrying the first end 201 of the shaft 200, and the second bearing 102 is for carrying the second end 202 of the shaft 200. Thus, the two bearings make the rotating shaft 200 more stable and also make the hoisting of the semiconductor process equipment safer. It should be understood that the first bearing 101 and the second bearing 102 may also be equipped with

bearing caps

103, 104, respectively, to protect and limit the bearings. In this case, the rotary shaft 200 extends through both

bearing caps

103, 104.

As shown in fig. 2 and 3, a through-hole 204 is provided on the first end 201, and the through-hole 204 is outside the mounting sleeve 100; the first connecting leg 301 is provided with a through hole 303 (shown in fig. 4) corresponding to the through hole 204. The hoisting assembly 1 further comprises a locking pin 205, and the locking pin 205 is detachably inserted into the through hole 303 and the through hole 204. As also shown in fig. 4, an axial receiving hole 306 is formed in the second connecting leg 302, and the second end 202 is detachably inserted into the receiving hole 306. It should be understood that, in the present application, the axial direction of the rotating shaft 200 is taken as an axial direction. In this way, the first end 201 of the rotating shaft 200 is connected with the first connecting leg 301 of the boom arm 300 through the locking pin 205, and the second end 202 of the rotating shaft is inserted into the receiving hole 306 in the second connecting leg 302 of the boom arm 300, so that the connection between the boom arm 300 and the rotating shaft 200 is realized. When it is desired to disassemble the boom 300, the locking pin 205 is first pulled out and then the first end 201 is moved axially relative to the first coupling leg 301 to withdraw the second end 202 from the receiving hole 306 of the second coupling leg 302. Thus separating the boom 300 from the rotating shaft 200. This structure not only enables the boom 300 to be firmly connected to the rotating shaft, but also enables the boom to be easily disassembled or separated, which makes the lifting of the semiconductor process equipment simpler. In one embodiment, the receiving hole 306 may be a through hole or a blind hole.

In a preferred embodiment, as shown in fig. 5, the first connecting leg 301 is configured to include two extensions 307 holding the first end 201, a through hole 303 is provided on each extension 307, and the locking pin 205 is detachably inserted into the two through holes 303 and the through hole 204. The two extensions 307 are formed substantially as U-shaped slots as a whole. In this way, the two extensions 307 can pre-position the first end 201 so that the locking pin 205 can be smoothly inserted into the two through holes 303 and the through hole 204, thereby facilitating the assembly of the boom 300 with the rotating shaft 200. In another embodiment, the mating surfaces of the first end 201 and the extension 307 are planar, which further facilitates the pre-positioning of the first end 201 by the two extensions 307, thereby facilitating the assembly of the boom arm 300 with the rotating shaft 200.

As also shown in fig. 2, the hoist assembly 1 further comprises a resilient member 400. The elastic member 400 is connected (e.g., pressed) to the first bearing 101 at a first end and connected to the rotating shaft 200 (e.g., connected to the middle portion 203 of the rotating shaft 200) at a second end, and the elastic member 400 is in a compressed state. When the shaft 200 is axially moved, the elastic member 400 is further compressed or stretched. For example, when disassembling the boom 300, after separating the first end 201 from the first connecting leg 301, the elastic member 400 is compressed when pulling the rotation shaft 200 in a direction axially away from the second end 202. After the second end 202 is withdrawn from the receiving hole 306, the shaft 200 is released, and the shaft 200 automatically moves axially under the elastic force of the elastic member 400, so that the second end 202 automatically passes through the second bearing 102 and is outside the mounting sleeve 100. Thus, the attachment and detachment of the boom 300 are further simplified by the elastic member 400.

The shaft 200 is further provided with a shoulder 211 (shown in fig. 3). In the hoist assembly 1, the shoulder 211 is external to the mounting sleeve 100. The shoulder 211 can abut against the bearing cap 103 near the first end 201, for example, against the lower surface of the bearing cap 103, under the elastic force of the elastic member 400. In this way, during the axial movement of the rotating shaft 200, the shoulder 211 can limit the movement of the rotating shaft 200, so as to facilitate the use of the hoisting assembly 1.

Preferably, a pull rod 212 is provided on an end of the first end 201, and the rotation shaft 200 is axially moved when a driving force is applied to the pull rod 212 in an axial direction. By providing the pull rod 212, the user can conveniently pull or push the rotating shaft 200 manually, thereby facilitating the use of the user.

In one particular embodiment, the resilient member 400 is selected to be a coil spring. The coil spring is wound around the rotation shaft 200 to prevent the coil spring from being deflected during the axial movement of the rotation shaft 200. In addition, under the limiting action of the compression limit of the coil spring on the stroke of the rotating shaft 200, the second end 202 of the rotating shaft 200 does not completely retreat into the mounting sleeve 100, but is at least partially outside the mounting sleeve 100, so that not only the second connecting leg 302 of the boom 300 can be smoothly separated from the second end 202, but also the second bearing 102 or the bearing cover 104 can guide the rotating shaft 200 when the rotating shaft 200 returns, thereby facilitating the movement of the rotating shaft 200 and further facilitating the disassembly and assembly of the boom 300.

In another embodiment, a retainer ring 210 protruding outward in the radial direction of the rotation shaft 200 is disposed on the middle portion 203 of the rotation shaft 200, and the second end of the elastic member 400 (e.g., a coil spring) is connected to (e.g., abuts against) the retainer ring 210. For example, a groove is provided on the middle portion 203 of the rotation shaft 200, and the retainer ring 210 is embedded in the groove. This facilitates the installation of the elastic member 400. It should be noted that the size of the retainer ring 210 is smaller than the inner diameter of the mounting sleeve 100 to avoid affecting the axial movement of the spindle 200.

Figure 6 schematically shows a lifting device 6 according to an embodiment of the application. The semiconductor processing apparatus 6 may be a CVD apparatus, such as a silicon epitaxial apparatus; of course, other devices may be used, and are not described in detail herein. As shown in fig. 6, the lifting device 6 comprises a drive assembly 600 and a lifting assembly 1 according to the above. The mounting sleeve 100 is fixedly mounted on the driving assembly 600 and is driven to move by the driving assembly 600.

In one specific embodiment, as also shown in fig. 6, the driving assembly 600 includes a driving member 601, a lead screw 602 connected to the driving member 601, and a sliding block 603 threaded on the lead screw 602. The mounting sleeve 100 is connected with the sliding block 603, and the driving member 601 drives the lead screw 602 to rotate, so that the sliding block 603 rotates relative to the lead screw 602 to move along the axial direction of the lead screw 602, and drives the hoisting assembly 1 to move correspondingly. The semiconductor processing equipment 605 (or components thereof) attached to the hoist assembly 1 are thus moved accordingly. The lead screw 602 can be vertically mounted so that the slide 603 and the hoist assembly 1 move vertically, thereby lifting or lowering the semiconductor processing apparatus 605 (or a component thereof). The driving member 601 may be a motor, and the lead screw 602 is connected to an output shaft of the motor 601.

In order to make the lead screw 602 more stable when the lead screw 602 is vertically disposed, the driving assembly 600 may further include a support 606, and the lead screw 602 is fixed to the support 606. In other embodiments, the support 606 may not be a part of the driving assembly 600, but may be an additional support, such as a wall, which is not described herein.

The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A hoisting assembly for hoisting semiconductor process equipment is characterized by comprising

The sleeve is arranged on the base plate and is provided with a sleeve,

the axial passes installation telescopic pivot, the middle part of pivot is in installation telescopic inside, the both ends of pivot all are in installation telescopic outside, and the pivot can for installation sleeve rotates and follows axial displacement, and

the suspension arm comprises two spaced connecting legs, the first end of the rotating shaft is connected to the first connecting leg of the suspension arm in a dismounting mode through a connecting piece, a containing hole is formed in the second connecting leg of the suspension arm, and the second end of the rotating shaft can be inserted into or moved out of the containing hole along the axial direction.

2. The hoisting assembly of claim 1 wherein bearings are provided at both ends of the mounting sleeve, the bearings being located inside the mounting sleeve, the shaft passing through the bearings.

3. The hoisting assembly of claim 2, wherein bearing end caps are disposed at both ends of the mounting sleeve, the bearing end caps are used for limiting the bearing, and the rotating shaft passes through the bearing end caps.

4. A lifting assembly as claimed in any one of claims 1 to 3, wherein a through-hole is provided at the first end, the through-hole being located outside the mounting sleeve; the first connecting leg is configured to comprise two extending parts clamping the first end, and each extending part is provided with a through hole; the connecting piece comprises a locking pin, and the locking pin is detachably inserted into the through hole and the through hole.

5. The hoisting assembly of claim 3, further comprising an elastic member, wherein one end of the elastic member abuts against the bearing near the first end, the other end of the elastic member is disposed on the rotating shaft, the elastic member is in a compressed state, and when the rotating shaft moves along the axial direction, the elastic member is further compressed or stretched.

6. The hoisting assembly of claim 5, wherein the middle part of the rotating shaft is provided with a retaining ring protruding outwards along the radial direction of the rotating shaft, and the other end of the elastic member abuts against the retaining ring.

7. Hoisting assembly according to claim 5, wherein the shaft is provided with a shoulder, the shoulder being located outside the mounting sleeve, the shoulder being capable of abutting against the bearing end cap near the first end under the spring force of the spring member.

8. The hoist assembly of claim 7 wherein a tension rod is disposed on the first end and the shaft is movable in the axial direction upon application of a driving force to the tension rod in the axial direction.

9. A lifting device for lifting semiconductor processing equipment, comprising a drive assembly, and a lifting assembly according to any one of the preceding claims 1-8,

wherein, the installation sleeve is fixedly installed on the driving component and is driven by the driving component to move.

10. The hoisting device as recited in claim 9, wherein the drive assembly comprises a drive member, a lead screw connected to the drive member, and a slider threadingly received on the lead screw, the mounting sleeve being connected to the slider,

the driving piece drives the lead screw to rotate, so that the sliding block rotates relative to the lead screw and moves along the axial direction of the lead screw, and the hoisting assembly is driven to move.