CN111712039A - Ear stud light-emitting component and production method thereof - Google Patents

Ear stud light-emitting component and production method thereof Download PDF

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Publication number
CN111712039A
CN111712039A CN202010739237.7A CN202010739237A CN111712039A CN 111712039 A CN111712039 A CN 111712039A CN 202010739237 A CN202010739237 A CN 202010739237A CN 111712039 A CN111712039 A CN 111712039A
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CN
China
Prior art keywords
circuit board
light
chip
board
ear stud
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010739237.7A
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Chinese (zh)
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CN111712039B (en
Inventor
余忠林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wannian County Zhongai Toys Co ltd
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Wannian County Zhongai Toys Co ltd
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Priority to CN202010739237.7A priority Critical patent/CN111712039B/en
Publication of CN111712039A publication Critical patent/CN111712039A/en
Application granted granted Critical
Publication of CN111712039B publication Critical patent/CN111712039B/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10212—Programmable component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

The invention provides an ear stud light-emitting component and a production method thereof, wherein the light-emitting component comprises a circuit board, an IC chip and a plurality of light-emitting diodes which are arranged on the circuit board, and leads which are connected with the circuit board and are respectively conducted with the IC chip and the light-emitting diodes, the circuit board is provided with a printed circuit and a lead hole, one end of each lead is arranged in the lead hole, and the IC chip and the plurality of light-emitting diodes are respectively conducted with the circuit board and the leads through the printed circuit. According to the method, the IC chip and the plurality of light emitting diodes are additionally arranged on the circuit board, and the combination of the IC chip and the circuit board is combined, so that the plurality of light emitting diodes can emit decorative lights with various colors, the decorative effect of the ear nail is enriched, and the technical problem of monotonous decorative effect of the ear nail in the prior art is solved.

Description

Ear stud light-emitting component and production method thereof
Technical Field
The invention relates to the technical field of ear nails, in particular to an ear nail light-emitting component and a production method thereof.
Background
Along with the use of ear nail on people's ornaments is more and more, people also pay more attention to the decorative effect of ear nail when selecting the ear nail.
The ear nail is a decorative article on the ear, is smaller than an ear ring as a decoration for dressing the appearance of a woman, is needle-shaped, and can be worn only by passing through an ear hole, and generally comprises a lampshade and a luminous piece arranged in the lampshade.
In the prior art, the ear nail can only emit decorative light with single color, so that the decorative effect is monotonous.
Disclosure of Invention
Based on this, the invention aims to provide an ear stud light-emitting component and a production method thereof, which are used for solving the technical problem of monotonous ear stud decoration effect in the prior art.
This application one aspect provides an ear nail light emitting component, light emitting component includes the circuit board, locates IC chip and a plurality of emitting diode on the circuit board, and connect the circuit board and respectively with the IC chip with the wire that emitting diode switched on, be equipped with printed circuit and wire guide on the circuit board, the one end of wire is located in the wire guide, IC chip and a plurality of emitting diode passes through respectively printed circuit switches on the circuit board reaches the wire.
The present application also provides a method for producing an ear stud light-emitting component, which is used for producing the above light-emitting component, and the production method comprises the following process steps:
fixedly arranging the circuit board on a positioning die, wherein the positioning die is provided with a via hole;
one end of a lead is inserted into the lead hole of the circuit board from the back of the circuit board through the through hole and is fixedly adhered through the adhesive;
fixing the IC chip and the light-emitting diode on the circuit board by using a surface mounting technology so that the light-emitting diode is connected with a control pin corresponding to the IC chip through a printed circuit on the circuit board, and one end of a lead positioned in a wire hole is connected with a power supply pin of the IC chip;
moving the positioning die provided with the circuit board to a baking device with a set baking temperature for baking, and presetting baking time;
and taking out the circuit board.
According to the ear nail light-emitting component and the production method, the IC chip and the plurality of light-emitting diodes are additionally arranged on the circuit board, and the combination of the IC chip and the circuit board is combined, so that the plurality of light-emitting diodes can emit decorative lights with various colors, the decorative effect of the ear nail is enriched, and the technical problem of monotonous decorative effect of the ear nail in the prior art is solved.
Furthermore, the plurality of circuit boards are fixed on a whole board, the step of fixing the circuit boards on a positioning die comprises fixing the whole board on the positioning die, and the plurality of circuit boards and the via holes are arranged in a one-to-one correspondence manner.
Furthermore, a plurality of accommodating holes are uniformly formed in the whole board, and the circuit board is arranged in the accommodating holes.
Furthermore, the positioning mould and the whole plate are respectively provided with a positioning structure at the corresponding position.
Furthermore, a power supply part is arranged in the ear nail, the negative pole of the power supply part is connected with the negative pole pin of the IC chip through a wire, and the positive pole of the power supply part is connected with the positive pole pin of the IC chip through the shell of the ear nail.
Furthermore, the anode of the light emitting diode is connected with the anode of the power supply part through the shell of the ear nail, and the cathode of the light emitting diode is connected with the control pin corresponding to the IC chip.
Further, the step of removing the circuit board includes removing the entire board, and moving the entire board to a demolding device so that the circuit board is separated from the entire board.
Further, shedder include the terrace die and with terrace die matched with die, evenly be equipped with a plurality of stay tubes on the terrace die, the stay tube supports the circuit board, just the wire is held in the stay tube, the whole board is unsettled, the die with be equipped with the holding tank on the corresponding position of stay tube, work as the die pushes down during the whole board, the circuit board falls into in the holding tank, thereby the circuit board breaks away from the whole board.
Drawings
FIG. 1 is a cross-sectional view of an ear stud configuration;
FIG. 2 shows a step of a first embodiment of a process for manufacturing a light emitting device;
FIG. 3 is a step of a second embodiment of a process for manufacturing a light emitting device;
FIG. 4 is a schematic view of a wire connecting circuit board;
FIG. 5 is a view showing the structure of the whole panel in the second embodiment of the present invention;
FIG. 6 is a structural view of a positioning mold for a whole plate assembly according to a second embodiment of the present invention;
FIG. 7 is an exploded view of FIG. 6;
FIG. 8 is a schematic view of the light emitting assembly;
FIG. 9 is a view showing the structure of a mold releasing device in a second embodiment of the present invention.
Description of the main element symbols:
circuit board 100 IC chip 110
L1 red light LED 120 L2 blue light LED 130
L3 green light LED 140 Conducting wire 200
Ear nail 300 Power supply 400
Whole plate 500 Locating hole 510
Positioning die 600 Via hole 610
Male die 700 Supporting tube 710
Concave die 800
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Several embodiments of the invention are presented in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 and 4, an ear stud light emitting assembly according to a first embodiment of the present invention is shown, where the light emitting assembly includes a circuit board 100, an IC chip 110 and a plurality of light emitting diodes disposed on the circuit board 100, and a conducting wire 200 connected to the circuit board 100 and respectively connected to the IC chip 110 and the light emitting diodes, a printed circuit (not shown) and a conducting wire hole (not shown) are disposed on the circuit board 100, one end of the conducting wire 200 is disposed in the conducting wire hole, and the IC chip 110 and the plurality of light emitting diodes are respectively connected to the circuit board 100 and the conducting wire 200 through the printed circuit.
Referring to fig. 2, a method for producing an ear stud light emitting device according to a first embodiment of the present invention is shown, the method for producing an ear stud light emitting device is used to produce the above light emitting device, and the method includes steps S101 to S105:
step S101: the circuit board 100 is fixedly arranged on a positioning die 600;
step S102: the positioning mold 600 is provided with a via hole 610, one end of the lead 200 is inserted into the lead hole of the circuit board 100 from the back of the circuit board 100 through the via hole 610, and is fixed by adhesive glue, and the lead is leveled;
step S103: fixing the IC chip 110 and the light emitting diode on the circuit board 100 by using a surface mount technology, so that the light emitting diode is connected with the control pin corresponding to the IC chip 110 through the printed circuit on the circuit board 100, and one end of the lead 200 positioned in the lead hole is connected with the power pin of the IC chip 110;
step S104: moving the positioning die 600 provided with the circuit board 100 to a baking device with a set baking temperature for baking, and presetting baking time;
preferably, in this embodiment, the baking temperature is 120 ℃, the baking time is 40 minutes, it should be further explained that the baking temperature is not limited to 120 ℃, and the baking time is not limited to 40 minutes, and the baking temperature can be appropriately adjusted according to the corresponding environmental factors.
Step S105: the wiring board 100 is taken out.
Referring to fig. 3, a method for producing a light emitting device of an ear stud 300 according to a second embodiment of the present invention includes steps S201 to S205:
step S201: a plurality of circuit boards 100 are fixed on a whole board 500, and the whole board is fixed on a positioning mould;
specifically, the step of fixing the circuit board 100 on a positioning mold 600 includes fixing the whole board 500 on the positioning mold 600, and the plurality of circuit boards 100 are arranged in one-to-one correspondence with the via holes 610.
Referring to fig. 4 to 7, a plurality of receiving holes are uniformly formed in the entire board 500, and the circuit board 100 is disposed in the receiving holes. The positioning mold 600 and the whole plate 500 are respectively provided with a positioning structure at corresponding positions. Specifically, the positioning structure is a positioning hole 510, and a positioning pin (shown in the figure) is combined with the positioning hole 510, so that the whole board 500 is fixed on the positioning mold 600, and the lead 200 is fixed conveniently.
Step S202: the positioning mold is provided with a via hole, one end of the lead 200 passes through the via hole 610 and is inserted into the lead hole of the circuit board 100 from the back of the circuit board 100, and after the lead is fixed by adhesive, the lead is leveled.
Specifically, the wire 200 is flattened on the device, so that the wire 200 in the finished product can meet the use requirement.
Further, after the lead 200 is fixed on the circuit board 100, the IC chip 110 and the light emitting diode are connected to the circuit board 100 by a bonding machine through a surface mount technology, so that the circuit board 100 forms a functional part.
Step S203: fixing the IC chip and the light-emitting diode on the circuit board by using a surface mounting technology so that the light-emitting diode is connected with a control pin corresponding to the IC chip through a printed circuit on the circuit board, and one end of a lead positioned in a wire hole is connected with a power supply pin of the IC chip;
in this embodiment, referring to fig. 8, a power supply 400 is disposed in the ear nail 300, the wire 200 connects a negative electrode of the power supply 400 and a negative electrode pin of the IC chip 110, and a positive electrode of the power supply 400 is connected to a positive electrode pin of the IC chip 110 through a housing of the ear nail 300.
The anode of the led is connected to the anode of the power supply 400 through the housing of the ear nail 300, and the cathode of the led is connected to the control pin corresponding to the IC chip 110.
In this embodiment, be equipped with three control stitch on the IC chip 110, correspond three colours that the three emitting diode of control corresponds respectively, it is specific, three emitting diode be L1 red light emitting diode 120, L2 blue light emitting diode 130 and L3 green light emitting diode 140 respectively, power 400 positive pole is all connected to emitting diode's positive pole, with the positive pole of IC chip 110 can set up to same interface, L1 red light emitting diode 120's negative pole is connected A1 control stitch, L2 blue light emitting diode 130's negative pole is connected A2 control stitch, L3 green light emitting diode 140's negative pole is connected A3 control stitch.
Step S204: moving the fixed die provided with the whole plate to a baking device with a preset temperature for baking, and presetting baking time;
in the above steps, after the IC chip 110 and the light emitting diode are fixedly connected to the circuit board 100, the circuit board 100 and the positioning mold 600 are together moved to a baking device with a set baking temperature for baking, and the baking time is preset;
preferably, in this embodiment, the baking temperature is 120 ℃, the baking time is 40 minutes, it should be further explained that the baking temperature is not limited to 120 ℃, and the baking time is not limited to 40 minutes, and the baking temperature can be appropriately adjusted according to the corresponding environmental factors.
Step S205: and taking out the whole board, and demolding the circuit board to obtain the circuit board.
In the above steps, after the baking is completed, the circuit board 100 is taken out, and the step of taking out the circuit board 100 includes taking out the whole board 500, and moving the whole board 500 to a demolding device, so that the circuit board 100 is separated from the whole board 500.
Specifically, referring to fig. 9, the demolding device includes a male mold 700 and a female mold 800 matched with the male mold 700, a plurality of support tubes 710 are uniformly arranged on the male mold 700, the support tubes 710 support the circuit board 100, the wires 200 are accommodated in the support tubes 710, the whole circuit board 500 is suspended, accommodating grooves are arranged at corresponding positions of the female mold 800 and the support tubes 710, and when the female mold 800 presses the whole circuit board 500, the circuit board 100 falls into the accommodating grooves, so that the circuit board 100 is separated from the whole circuit board 500.
In summary, in the method for producing the ear nail light-emitting component in the above embodiment of the invention, the IC chip and the plurality of light-emitting diodes are additionally arranged on the circuit board, and the combination of the IC chip and the circuit board is combined, so that the plurality of light-emitting diodes can emit decorative lights of various colors, and further, the decorative effect of the ear nail is enriched, and the technical problem of the prior art that the ear nail decorative effect is monotonous is solved.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (9)

1. The ear stud light-emitting component is characterized by comprising a circuit board, an IC chip and a plurality of light-emitting diodes, wherein the IC chip and the light-emitting diodes are arranged on the circuit board, and wires are connected with the circuit board and are respectively conducted with the IC chip and the light-emitting diodes, a printed circuit and a wire hole are arranged on the circuit board, one end of each wire is arranged in the wire hole, and the IC chip and the light-emitting diodes are respectively conducted with the circuit board and the wires through the printed circuit.
2. An ear stud light emitting assembly production method, characterized in that the ear stud light emitting assembly production method is used for producing the light emitting assembly of claim 1, and the production method comprises the following process steps:
fixedly arranging the circuit board on a positioning die;
the positioning die is provided with a through hole, one end of a lead penetrates through the through hole and is inserted into the lead hole of the circuit board from the back of the circuit board, and the lead is adhered and fixed through adhesive glue and leveled;
fixing the IC chip and the light-emitting diode on the circuit board by using a surface mounting technology so that the light-emitting diode is connected with a control pin corresponding to the IC chip through a printed circuit on the circuit board, and one end of a lead positioned in a wire hole is connected with a power supply pin of the IC chip;
moving the positioning die provided with the circuit board to a baking device with a set baking temperature for baking, and presetting baking time;
and taking out the circuit board.
3. The method of claim 2, wherein the plurality of circuit boards are mounted on a single board, and the step of mounting the circuit boards on a positioning mold comprises mounting the single board on the positioning mold, the plurality of circuit boards corresponding to the plurality of vias.
4. The method for producing an ear stud lighting assembly according to claim 3, wherein the whole board is uniformly provided with a plurality of receiving holes, and the circuit board is disposed in the receiving holes.
5. The method for producing an ear stud light-emitting assembly according to claim 2, wherein the positioning mold and the whole plate are respectively provided with a positioning structure at corresponding positions.
6. The method for producing the ear stud light-emitting component according to claim 2, wherein a power supply part is arranged in the ear stud, the wire connects a negative electrode of the power supply part with a negative electrode pin of the IC chip, and a positive electrode of the power supply part is connected with a positive electrode pin of the IC chip through a shell of the ear stud.
7. The method for producing an ear stud light-emitting assembly according to claim 6, wherein the anode of the light-emitting diode is connected to the anode of the power supply through the housing of the ear stud, and the cathode of the light-emitting diode is connected to the corresponding control pin of the IC chip.
8. The method of claim 3, wherein the step of removing the circuit board comprises removing the entire board and moving the entire board to a demolding device to detach the circuit board from the entire board.
9. The method for producing the ear stud light-emitting component according to claim 4, wherein the demolding device comprises a male mold and a female mold matched with the male mold, a plurality of supporting tubes are uniformly arranged on the male mold, the supporting tubes support the circuit board, the conducting wire is accommodated in the supporting tubes, the whole plate is suspended, accommodating grooves are arranged at corresponding positions of the female mold and the supporting tubes, and when the female mold presses down the whole plate, the circuit board falls into the accommodating grooves, so that the circuit board is separated from the whole plate.
CN202010739237.7A 2020-07-28 2020-07-28 Ear stud light-emitting component and production method thereof Active CN111712039B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010739237.7A CN111712039B (en) 2020-07-28 2020-07-28 Ear stud light-emitting component and production method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010739237.7A CN111712039B (en) 2020-07-28 2020-07-28 Ear stud light-emitting component and production method thereof

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CN111712039A true CN111712039A (en) 2020-09-25
CN111712039B CN111712039B (en) 2021-08-17

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2244851Y (en) * 1996-03-01 1997-01-15 朱四维 Electronic luminous discolouring adornments for personal wear
CN201375109Y (en) * 2008-09-02 2010-01-06 宁波艾森饰品有限公司 Lock catch for jewelries and earring and necklace utilizing same
CN203735607U (en) * 2013-12-30 2014-07-30 梅祖祥 Luminous ear stud
US20150013381A1 (en) * 2013-07-15 2015-01-15 Shannon K. Duffy Disinfecting jewelry holder and method
CN105578786A (en) * 2015-12-14 2016-05-11 天津华迈科技有限公司 Processing and positioning component for pcb

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2244851Y (en) * 1996-03-01 1997-01-15 朱四维 Electronic luminous discolouring adornments for personal wear
CN201375109Y (en) * 2008-09-02 2010-01-06 宁波艾森饰品有限公司 Lock catch for jewelries and earring and necklace utilizing same
US20150013381A1 (en) * 2013-07-15 2015-01-15 Shannon K. Duffy Disinfecting jewelry holder and method
CN203735607U (en) * 2013-12-30 2014-07-30 梅祖祥 Luminous ear stud
CN105578786A (en) * 2015-12-14 2016-05-11 天津华迈科技有限公司 Processing and positioning component for pcb

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