CN111704866A - Anti PID encapsulation glued membrane and photovoltaic module - Google Patents
Anti PID encapsulation glued membrane and photovoltaic module Download PDFInfo
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- CN111704866A CN111704866A CN202010605207.7A CN202010605207A CN111704866A CN 111704866 A CN111704866 A CN 111704866A CN 202010605207 A CN202010605207 A CN 202010605207A CN 111704866 A CN111704866 A CN 111704866A
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- adhesive film
- pid
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- packaging adhesive
- insulating layer
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- 239000012528 membrane Substances 0.000 title description 5
- 238000005538 encapsulation Methods 0.000 title description 4
- 239000002313 adhesive film Substances 0.000 claims abstract description 73
- 238000004806 packaging method and process Methods 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 239000011231 conductive filler Substances 0.000 claims description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000002042 Silver nanowire Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 229920006280 packaging film Polymers 0.000 claims 1
- 239000012785 packaging film Substances 0.000 claims 1
- 150000002500 ions Chemical class 0.000 abstract description 14
- 230000015556 catabolic process Effects 0.000 abstract description 6
- 238000006731 degradation reaction Methods 0.000 abstract description 6
- 238000002161 passivation Methods 0.000 abstract description 6
- 239000003292 glue Substances 0.000 description 9
- 238000002360 preparation method Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
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- 101001073212 Arabidopsis thaliana Peroxidase 33 Proteins 0.000 description 4
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- 102100028961 Peroxisome proliferator-activated receptor gamma coactivator 1-beta Human genes 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
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- 238000010586 diagram Methods 0.000 description 3
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- 230000005012 migration Effects 0.000 description 3
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- 238000012360 testing method Methods 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 229910017107 AlOx Inorganic materials 0.000 description 2
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- 238000005516 engineering process Methods 0.000 description 2
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- 238000003475 lamination Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910001415 sodium ion Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
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- 238000009825 accumulation Methods 0.000 description 1
- 230000003679 aging effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
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- 238000012512 characterization method Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
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- 239000000843 powder Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C09J123/0815—Copolymers of ethene with aliphatic 1-olefins
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/041—Provisions for preventing damage caused by corpuscular radiation, e.g. for space applications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
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Abstract
The invention provides a PID (potential induced degradation) resistant packaging adhesive film and a photovoltaic module. The anti-PID packaging adhesive film comprises a base adhesive film layer, an insulating layer and a conducting layer, wherein the insulating layer is positioned on one side surface of the base adhesive film layer and is provided with a grid structure, the grid structure comprises grid lines and a plurality of hollow parts formed by the grid lines in a surrounding mode, and the grid lines are provided with structures corresponding to gaps of battery pieces; the conducting layer comprises a plurality of conducting parts, the conducting parts are filled in the hollow parts in a one-to-one correspondence mode, and the volume resistivity of the conducting parts is smaller than 100 omega cm. When the packaging adhesive film is actually assembled, the conductive parts are filled in the hollow parts in a one-to-one correspondence mode, so that after assembly is completed, each battery piece corresponds to each conductive part in structure and is arranged in a one-to-one correspondence mode, and grid lines are correspondingly arranged below gaps of the battery pieces. And ions or charges enriched on the surface of the battery piece or passing through the adhesive film can be conducted away through each conducting part, so that the charges causing the failure of the passivation layer are directly eliminated.
Description
Technical Field
The invention relates to the field of photovoltaics, in particular to a PID (potential induced degradation) resistant packaging adhesive film and a photovoltaic module.
Background
Crystalline silicon cell assemblies face long-term stability and reliability challenges during normal service, which ultimately results in power degradation. Among them, Potential Induced Degradation (PID) is relatively severe. For a conventional aluminum back field battery component, it is generally considered in the industry that the potential-induced attenuation is caused by migration of metal sodium ions, and therefore, the migration of sodium ions can be blocked by enhancing the compactness of an encapsulation adhesive film, so that the PID failure risk of the component is reduced. In recent years, double-sided batteries have become a trend, particularly double-sided PERC batteries, where the PID attenuation of the backside presents a greater challenge to the packaging adhesive film. The conventional PID-resistant adhesive film cannot meet the requirements of the current double-sided PERC battery component. AlOx passivation on the back of the double-sided PERC battery is the key of high efficiency, but under the potential induction, positive charges can be enriched on the back, the negative charges of AlOx are neutralized, and passivation failure is caused. Therefore, it is necessary to develop a packaging adhesive film that can effectively solve the problem of charge enrichment.
At present, the method of adding ions or charge trapping agents into matrix resin is commonly adopted in the anti-PID adhesive film, so that the relevant ions or charges are trapped in the migration process and cannot reach the surface (back surface) of the battery, and the accumulation of the charges on the surface of the battery is prevented. But the selection of the relevant material is not so easy, and not only the ion capturing ability is required, but also the compatibility with the matrix resin, the influence on the light transmittance of the matrix resin, and the influence on the aging property of the matrix resin need to be concerned. Meanwhile, the related ions or charge trapping agents are doped in the adhesive film, only ions or charges which are migrated into the adhesive film can be trapped, and ions or charges which are remained on the surface of the battery or pass through the adhesive film in a large amount are not trapped or have limited trapping capacity, which is not complete enough.
For the above reasons, there is a need for a PID-resistant packaging adhesive film having a better treatment effect on ions or charges remaining on the surface of a battery piece or passing through the adhesive film in a large amount.
Disclosure of Invention
The invention mainly aims to provide a PID (potential induced degradation) resistant packaging adhesive film and a photovoltaic module, so as to solve the PID problem of the photovoltaic module caused by ions or charges which are remained on the surface of a battery piece or pass through the adhesive film in the prior art.
In order to achieve the above object, according to one aspect of the present invention, there is provided a PID-resistant packaging adhesive film, comprising: a base glue film layer; the insulating layer is positioned on the surface of one side of the base adhesive film layer and is provided with a grid structure, the grid structure comprises grid lines and a plurality of hollow parts formed by the surrounding of the grid lines, and the grid lines are provided with structures corresponding to the gaps of the battery pieces; and the conducting layer comprises a plurality of conducting parts, the conducting parts are filled in the hollow parts in a one-to-one correspondence manner, and the volume resistivity of the conducting parts is less than 100 omega cm.
Further, the width of the grid lines is greater than the width of the gaps between the battery pieces.
Furthermore, the surface of one side, away from the base rubber film layer, of the conductive part has a shape matched with the surface of the battery piece, and the edge of the surface, away from one side of the base rubber film layer, of the conductive part is flush with the surface of the insulating layer.
Further, the thickness of the conductive layer is 5 to 50 μm.
Further, the conductive layer includes a resin base material and a conductive filler dispersed in the resin base material.
Further, the conductive filler is one or more of carbon nanotubes, nano silver powder, nano silver wires, silver-coated copper particles and silver-coated nickel particles.
Furthermore, the weight of the conductive filler is 0.5-20% of the weight of the resin base material.
Further, the materials of the insulating layer and the base adhesive film layer are respectively and independently selected from one or more of EVA, POE and PVB.
Furthermore, the insulating layer and the base glue film layer are of an integrated structure.
According to another aspect of the invention, a photovoltaic module is further provided, which includes a packaging adhesive film and a battery piece, wherein the packaging adhesive film is the above-mentioned PID-resistant packaging adhesive film, and the grid lines in the insulating layer in the PID-resistant packaging adhesive film are arranged corresponding to the gaps of the battery piece.
The invention provides a PID (potential induced degradation) resistant packaging adhesive film which comprises a base adhesive film layer, an insulating layer and a conducting layer, wherein the insulating layer is positioned on one side surface of the base adhesive film layer, the insulating layer is provided with a grid structure, the grid structure comprises grid lines and a plurality of hollowed-out parts formed by surrounding of the grid lines, the grid lines are provided with structures corresponding to gaps of battery pieces, the conducting layer comprises a plurality of conducting parts, the conducting parts are filled in the hollowed-out parts in a one-to-one correspondence mode, and the volume resistivity of the conducting parts is smaller than 100 omega cm. This encapsulation glued membrane is when actual assembly, will set up with the battery piece contact in insulating layer and the photovoltaic module, because of the gridlines have with the corresponding structure in clearance between the battery piece, the setting is filled in the fretwork portion to the conducting part one-to-one for each battery piece is corresponding and the one-to-one setting with each conducting part structure after the assembly is accomplished, the gridlines then corresponds the setting in order to form the insulation between each conducting part and each battery piece in the gap below of battery piece. Ions or charges enriched on the surface of the cell or passing through the adhesive film can be conducted away through each conductive part, and the charges causing the failure of the passivation layer are directly eliminated, so that the PID problem of the photovoltaic module can be effectively improved while the rest performances of the photovoltaic module are not influenced.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 shows a schematic structural diagram of a PID resistant packaging adhesive film according to an embodiment of the invention;
FIG. 2 shows a schematic structural diagram of a PID-resistant packaging adhesive film according to another embodiment of the invention;
FIG. 3 shows a top view of the PID resistant packaging adhesive film of FIG. 1;
fig. 4 shows a schematic structural diagram of a photovoltaic module according to an embodiment of the present invention.
Wherein the figures include the following reference numerals:
1. packaging the adhesive film; 2. a battery piece; 10. a base glue film layer; 20. an insulating layer; 30. and a conductive layer.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
As described in the background of the invention section, the ions or charges remaining on the surface of the cell or passing through the adhesive film in the prior art cause serious PID problem to the photovoltaic module.
In order to solve the above problems, the present invention provides a PID resistant packaging adhesive film, as shown in fig. 1 and 2, the PID resistant packaging adhesive film includes a base adhesive film layer 10, an insulating layer 20 and a conductive layer 30, the insulating layer 20 is located on one side surface of the base adhesive film layer 10, as shown in fig. 3, the insulating layer 20 has a grid structure, the grid structure includes grid lines and a plurality of hollowed-out portions surrounded by the grid lines, and the grid lines have a structure corresponding to gaps of battery pieces; the conductive layer 30 includes a plurality of conductive portions, each of which is filled in the hollow portion in a one-to-one correspondence, and the volume resistivity of the conductive portion is less than 100 Ω · cm.
When the packaging adhesive film is actually assembled, the packaging adhesive film is in contact with the insulating layer and the battery pieces in the photovoltaic assembly, and the grid lines have structures corresponding to gaps among the battery pieces, the conductive parts are filled in the hollow parts in a one-to-one correspondence mode, so that the battery pieces are in corresponding structures and are arranged in a one-to-one correspondence mode after assembly is finished, and the grid lines are correspondingly arranged below gaps of the battery pieces to insulate the conductive parts and the battery pieces. Ions or charges enriched on the surface of the cell or passing through the adhesive film can be conducted away through each conductive part, and the charges causing the failure of the passivation layer are directly eliminated, so that the PID problem of the photovoltaic module can be effectively improved while the rest performances of the photovoltaic module are not influenced. The specific mechanism of conduction of charges or ions is as follows: thin grid lines and main grid lines which can conduct electricity are arranged on the surface of the battery piece, the surface of an area between all the grid lines is non-conducting, and once charges are enriched on the surface, an electric field is formed, so that the passivation effect of the battery is influenced, and PID attenuation is caused. The conductive layer mainly transversely transfers the charges in the non-conductive area on the surface of the battery piece to the grid line through the conductive layer on the surface of the adhesive film, and finally conducts the charges away through the grid line.
To further prevent shorting problems between the cells, in a preferred embodiment, the width of the grid lines is greater than the width of the gaps between the cells. This is advantageous for further improving the reliability of the packaging adhesive film. More preferably, the surface of the side of the conductive part away from the base adhesive film layer 10 has a shape matched with the surface of the battery piece, and the edge of the surface of the side of the conductive part away from the base adhesive film layer 10 is flush with the surface of the insulating layer 20. Therefore, the contact area between the conductive part and the surface of the battery piece can be increased, and ions or charges on the surface of the battery piece can be led out more favorably, so that the PID effect is further improved.
For the purpose of better compromise between PID resistance and light transmittance, in a preferred embodiment, the thickness of the conductive layer 30 is 5 to 50 μm.
The conductive layer is made of a material that can satisfy the requirements of volume resistivity less than 100 Ω · cm and transparency, and in a preferred embodiment, the conductive layer 30 includes a resin base material and a conductive filler dispersed in the resin base material; preferably, the weight of the conductive filler is 0.5-20% of the weight of the resin base material. More preferably, the conductive filler is one or more of carbon nanotubes, silver nanopowder, silver nanowires, silver-coated copper particles, and silver-coated nickel particles. The conductive fillers have high conductivity, can ensure that the volume resistivity of the conductive layer is small on the basis of less using amount, and is beneficial to improving the light transmittance of the whole packaging adhesive film. More preferably, the resin substrate is one or more of acrylic resin, polyurethane, and epoxy resin.
In a preferred embodiment, the materials of the insulating layer 20 and the base adhesive film layer 10 are respectively selected from one or more of EVA, POE, and PVB, independently from each other.
The insulating layer 20 and the base adhesive film layer 10 may be two layers as shown in fig. 1, and may be fabricated separately in the manufacturing process, for example: the base body adhesive film layer 10 is extruded and tape-cast, the insulating layer 20 and the conductive layer 30 are both arranged in a fixed area on the base body adhesive film layer 10 by adopting the processes of screen printing, ink-jet printing, gravure printing, coating and the like, and are in a grid shape, each conductive part of the conductive layer 30 is arranged inside each grid, and the insulating layer is arranged on each grid line.
Of course, as shown in fig. 2, the insulating layer 20 and the base adhesive film layer 10 may be an integrated structure, and may be integrally manufactured in the preparation process, for example: the base body adhesive film layer 10 and the insulating layer 20 are made of the same material and are simultaneously extruded and cast, fixed patterns are arranged on a pattern roller, the pattern roller corresponds to the size of a battery piece, the insulating layer 20 is of a concave structure corresponding to the area of the battery piece, the concave depth is 5-50 micrometers, the conducting layer 30 is arranged in each concave area through the technologies of screen printing, ink-jet printing, gravure printing, coating and the like, and after lamination, the PID resistant layer is guaranteed to be free of overflow.
According to another aspect of the present invention, there is further provided a photovoltaic module, as shown in fig. 4, which includes an encapsulant film 1 and a battery piece 2, and the encapsulant film 1 is the above-mentioned PID-resistant encapsulant film, and the grid lines in the insulating layer 20 in the PID-resistant encapsulant film are disposed corresponding to the gaps between the battery pieces 2.
The present application is described in further detail below with reference to specific examples, which should not be construed as limiting the scope of the invention as claimed.
Example 1
The photovoltaic module shown in fig. 1 is prepared, and comprises a packaging adhesive film and a cell piece, and the specific preparation process comprises the following steps:
insulating layer and base member glued membrane layer structure as an organic whole, and base member glued membrane layer (thickness 500 microns) and insulating layer (thickness 30 microns) adopt same material to extrude the curtain coating simultaneously and form, and the flower roll sets up fixed decorative pattern, is corresponding to the battery piece size for the insulating layer is the sunk structure corresponding to the battery piece region, and the depth of sinking is 30 microns, and the conducting layer adopts the screen printing technology to set up the mixture of conducting layer base member resin and electrically conductive filler in each sunk region, guarantees that the lamination back, and anti PID layer does not have the excessive.
The individual layer materials and performance results are shown in table 1.
Example 2
The preparation process was the same as in example 1, some materials were different, and the performance results are shown in Table 1.
Example 3
The preparation process was the same as in example 1, some materials were different, and the performance results are shown in Table 1.
Example 4
The preparation process is the same as the embodiment except that: the insulating layer and the base glue film layer are of a non-integrated structure, the base glue film layer is cast into a film, and the insulating layer and the conducting layer are respectively arranged on the base glue film layer by adopting a screen printing process. Some of the materials were different and the performance results are shown in table 1.
Example 5
The preparation process is the same as the embodiment except that: the insulating layer and the base glue film layer are of a non-integrated structure, the base glue film layer is cast into a film, and the insulating layer and the conducting layer are respectively arranged on the base glue film layer by adopting a screen printing process. Some of the materials were different and the performance results are shown in table 1.
Comparative example 1
The packaging adhesive film is only one layer of EVA adhesive film, and the performance is shown in Table 1.
Comparative example 2
The packaging adhesive film is only a POE adhesive film, and the performance is shown in Table 1.
And (3) performance characterization: the photovoltaic modules (double-sided PERC modules) produced in examples 1 to 5 and comparative examples 1 to 2 were subjected to a power test (back power), followed by a PID test, and after 192 hours of PID, the power was measured and compared with the initial power, and the decay rate was calculated. PID testing was performed according to IEC TS 2804-1: 2015, and applying a constant DC voltage of minus 1500V under 85 deg.C and 85% RH. The results of the examples and comparative examples are as follows:
TABLE 1
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A PID resistant packaging adhesive film is characterized by comprising:
a base adhesive film layer (10);
the insulating layer (20) is positioned on one side surface of the base adhesive film layer (10), the insulating layer (20) is provided with a grid structure, the grid structure comprises grid lines and a plurality of hollow parts formed by surrounding of the grid lines, and the grid lines are provided with structures corresponding to gaps of the battery pieces;
and the conducting layer (30) comprises a plurality of conducting parts, the conducting parts are correspondingly filled in the hollow parts one by one, and the volume resistivity of the conducting parts is less than 100 omega cm.
2. The PID-resistant adhesive packaging film of claim 1, wherein the width of the grid lines is greater than the width of the gaps between the battery pieces.
3. The PID resistant packaging adhesive film according to claim 1, wherein the surface of the conductive part away from the base adhesive film layer (10) has a shape matched with the surface of the battery piece, and the surface edge of the conductive part away from the base adhesive film layer (10) is flush with the surface of the insulating layer (20).
4. The PID resistant packaging adhesive film according to any one of claims 1 to 3, wherein the thickness of the conductive layer (30) is 5 to 50 μm.
5. The PID resistant encapsulating film according to any one of claims 1 to 3, wherein the conductive layer (30) comprises a resin base material and a conductive filler dispersed in the resin base material.
6. The PID resistant packaging adhesive film of claim 5, wherein the conductive filler is one or more of carbon nanotubes, silver nanoparticles, silver nanowires, silver-clad copper particles, and silver-clad nickel particles.
7. The PID-resistant packaging adhesive film according to claim 5, wherein the weight of the conductive filler is 0.5-20% of the weight of the resin substrate.
8. The PID-resistant encapsulating film according to any one of claims 1 to 3, wherein the material of the insulating layer (20) and the base film layer (10) are each independently selected from one or more of EVA, POE, PVB.
9. The PID resistant packaging adhesive film according to any one of claims 1 to 3, wherein the insulating layer (20) and the base adhesive film layer (10) are of an integral structure.
10. A photovoltaic module, comprising a packaging adhesive film (1) and a battery piece (2), wherein the packaging adhesive film (1) is the PID-resistant packaging adhesive film according to any one of claims 1 to 9, and the grid lines in the insulating layer (20) in the PID-resistant packaging adhesive film are disposed corresponding to the gaps of the battery piece (2).
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| CN202010605207.7A CN111704866B (en) | 2020-06-29 | 2020-06-29 | Anti PID encapsulation glued membrane and photovoltaic module |
| PCT/CN2021/094955 WO2022001467A1 (en) | 2020-06-29 | 2021-05-20 | Anti-pid encapsulation adhesive film, photovoltaic module, and photovoltaic module manufacturing method |
| US18/011,193 US11987734B2 (en) | 2020-06-29 | 2021-05-20 | Anti-PID encapsulation adhesive film, photovoltaic module, and photovoltaic module manufacturing method |
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| CN114497254A (en) * | 2022-01-26 | 2022-05-13 | 福斯特(滁州)新材料有限公司 | Latticed connection adhesive film for photovoltaic module and photovoltaic module |
| CN114975646A (en) * | 2022-05-31 | 2022-08-30 | 杭州福斯特应用材料股份有限公司 | Conductive adhesive film, manufacturing method thereof and back contact solar cell |
| WO2023011209A1 (en) * | 2021-08-05 | 2023-02-09 | 嘉兴阿特斯技术研究院有限公司 | Preparation method for photovoltaic assembly and photovoltaic assembly |
| CN118039460A (en) * | 2024-04-15 | 2024-05-14 | 绵阳新能智造科技有限公司 | Method for thickening silicon wafer |
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| WO2022001467A1 (en) * | 2020-06-29 | 2022-01-06 | 杭州福斯特应用材料股份有限公司 | Anti-pid encapsulation adhesive film, photovoltaic module, and photovoltaic module manufacturing method |
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| CN114497254A (en) * | 2022-01-26 | 2022-05-13 | 福斯特(滁州)新材料有限公司 | Latticed connection adhesive film for photovoltaic module and photovoltaic module |
| CN114975646A (en) * | 2022-05-31 | 2022-08-30 | 杭州福斯特应用材料股份有限公司 | Conductive adhesive film, manufacturing method thereof and back contact solar cell |
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| CN118039460B (en) * | 2024-04-15 | 2024-06-28 | 绵阳新能智造科技有限公司 | Method for thickening silicon wafer |
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