CN111701805B - Flip-chip direct-connection type double-dispensing mechanism and dispensing method thereof - Google Patents
Flip-chip direct-connection type double-dispensing mechanism and dispensing method thereof Download PDFInfo
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- CN111701805B CN111701805B CN202010606771.0A CN202010606771A CN111701805B CN 111701805 B CN111701805 B CN 111701805B CN 202010606771 A CN202010606771 A CN 202010606771A CN 111701805 B CN111701805 B CN 111701805B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1044—Apparatus or installations for supplying liquid or other fluent material to several applying apparatus or several dispensing outlets, e.g. to several extrusion nozzles
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The flip chip direct connection type double-dispensing mechanism comprises a dispensing control mechanism, a first dispensing assembly with a first dispensing head and a second dispensing assembly with a second dispensing head, wherein the dispensing control mechanism is used for driving the first dispensing assembly and the second dispensing assembly to reciprocate from a glue dipping position to a glue dispensing position, the dispensing control mechanism comprises a mounting bottom plate, a first dispensing control motor, a first dispensing eccentric shaft, a connecting rod and a Z-direction mounting plate for bearing the first dispensing assembly and the second dispensing assembly, the first dispensing control motor is arranged on the mounting bottom plate, one end of the first dispensing eccentric shaft is connected with an output shaft of the first dispensing control motor, the other end of the first dispensing eccentric shaft is connected with one end of the connecting rod through a first bearing, the other end of the connecting rod is connected with the Z-direction mounting plate through a second bearing, and the Z-direction mounting plate is connected with the mounting bottom plate through a linear guide rail pair. The invention has the advantages of improving the production efficiency and not generating the spin coating problem.
Description
Technical Field
The invention relates to semiconductor packaging equipment, in particular to a flip-chip direct-connection type double-dispensing mechanism and a dispensing method thereof.
Background
Die bonding is an important process in the semiconductor packaging industry, and along with the maturation and massive popularization of flip chips, the importance of die bonding in the whole flip chip packaging process is particularly outstanding. Two glue points are required to be glued when one flip chip is subjected to die bonding, the size of the chip is very tiny, the length and width of the smallest size are about 0.5 mm x 0.15 mm, a traditional single-point glue mechanism can only point one glue point at a time in a reciprocating way, and the required two glue points can be glued only by carrying out two reciprocating actions when the flip chip is subjected to die bonding, so that the efficiency is very low, and the production efficiency is reduced; if the traditional dispensing head is changed into a fixed single-rod double-pointed dispensing head which is used for dispensing two glue points at a time, the distance between the two glue points cannot be adjusted, and the problems of glue connection and poor quality of the glue points are easy to generate because the two glue points are very close to each other, meanwhile, the double-pointed dispensing head is required to be made very thin, and the service life of the double-pointed dispensing head is much shorter than that of the traditional dispensing head.
To solve the above-mentioned problem, chinese patent document CN 105618332A discloses a dual dispensing mechanism and a dispensing method thereof, wherein the dual dispensing mechanism includes a dispensing control mechanism and a dispensing arm with a dispensing head, the dispensing arm includes a first dispensing arm and a second dispensing arm, and the dispensing control mechanism includes a dispensing control mechanism for driving the first dispensing arm and the second dispensing arm to perform a rotational movement and a second dispensing control mechanism for driving the first dispensing arm and the second dispensing arm to perform a vertical movement. According to the invention, the rotary motion precision of the two dispensing arms is realized through the dispensing control mechanism, the vertical motion precision of the two dispensing arms is realized through the second dispensing control mechanism, and the independent control structure of the rotary motion and the vertical motion of the two dispensing arms greatly improves the die bonding efficiency of the flip chip, the consistency and the stability of dispensing, and the production efficiency and the product quality.
However, the double-dispensing mechanism adopts a structure that the two dispensing arms are rotated from a dispensing point to a dispensing point through the dispensing control mechanism, namely, the two dispensing arms are in an arc line from the dispensing point to the dispensing point, and because the glue is liquid, when the two dispensing arms are in the arc line, the glue on the two dispensing heads on the two dispensing arms can generate certain centrifugal force when moving in the arc line, so that the movement speed of the two dispensing arms of the structure is limited, when the movement speed is too high, the glue can be thrown off, the movement speed is reduced, and the production efficiency is reduced, so that the production efficiency of the double-dispensing mechanism of the structure is clamped by the dispensing control mechanism; in addition, when the second dispensing mechanism drives the two dispensing arms to move vertically, the second dispensing mechanism drives the two dispensing arms to move downwards, meanwhile, the second dispensing mechanism enables the springs to store force, when the second dispensing mechanism moves upwards, the two dispensing arms are enabled to reset upwards under the action of the springs, and the problem of the structure is that the driving frequency of the second dispensing mechanism is very high, the expansion frequency of the springs is very high, after the dispensing machine is used for a period of time, the springs can generate fatigue, the retraction force is insufficient, so that the upward displacement of the two dispensing arms is not in place, and the dispensing heads on the two dispensing arms are easy to scratch a substrate to be dispensed when the dispensing control mechanism rotates.
Disclosure of Invention
In order to solve the problems of low spin coating and production efficiency of the dispensing mechanism, the invention provides a flip-chip direct-connection type double-dispensing mechanism capable of improving the production efficiency and avoiding the spin coating problem and a dispensing method thereof for society.
The invention also has the advantages that the descending or ascending of the two dispensing arms is not affected by the fatigue of the springs, and the problem of scratching the substrate is avoided.
The technical scheme of the invention is as follows: the utility model provides a flip-chip direct-connection type double-dispensing mechanism, including dispensing control mechanism, have first some glue head first some glue assembly and have the second some glue head second glue assembly, dispensing control mechanism is used for the drive first some glue assembly with the second some glue assembly comes and goes to dip in gluey position and glues the position, dispensing control mechanism includes mounting plate, first some glue control motor, first some glue eccentric shaft, connecting rod, is used for bearing first some glue assembly and second some glue assembly's Z to the mounting plate, first some glue control motor establishes on the mounting plate, the one end of first some glue eccentric shaft with the output shaft of first some glue control motor, the other end of first some glue eccentric shaft through first bearing with the one end of connecting rod is connected, the other end of connecting rod through the second bearing with Z to the mounting plate is connected, Z to the mounting plate through linear guide pair with mounting plate is connected.
As an improvement to the invention, the first adhesive dispensing assembly comprises a first adhesive dispensing assembly motor, a first adhesive dispensing assembly eccentric shaft, a first adhesive dispensing assembly Z-direction control groove, a first adhesive dispensing assembly Z-direction moving plate, a first adhesive dispensing arm and a first adhesive dispensing head, wherein the first adhesive dispensing assembly motor is arranged on the mounting bottom plate, the input end of the first adhesive dispensing assembly eccentric shaft is connected with the output shaft of the first adhesive dispensing assembly motor, the output end of the first adhesive dispensing assembly eccentric shaft is connected with a first adhesive dispensing assembly bearing group, the first adhesive dispensing assembly bearing group is in rolling contact with the inner wall of the first adhesive dispensing assembly Z-direction control groove, the first adhesive dispensing assembly Z-direction control groove is connected with the upper part of the first adhesive dispensing assembly Z-direction moving plate, and the first adhesive dispensing assembly Z-direction moving plate is connected with the Z-direction mounting plate through a first adhesive dispensing assembly linear guide rail pair; the first dispensing arm is connected with the lower part of the Z-direction mounting plate, and the first dispensing head is connected with the first dispensing arm.
As an improvement of the invention, the first adhesive dispensing component bearing set comprises a first bearing and a second bearing, the first bearing and the second bearing are concentrically connected to the first output end of the first adhesive dispensing component eccentric shaft, the first adhesive dispensing component Z-direction control groove comprises a first upper folded edge and a first lower folded edge, a first standing edge is arranged between the first upper folded edge and the first lower folded edge, the first upper folded edge is arranged so that the inner wall of the first upper folded edge is only in rolling contact with the outer wall of the outer steel ring of the second bearing, the first lower folded edge is arranged so that the inner wall of the first upper folded edge is only in rolling contact with the outer wall of the outer steel ring of the first bearing, and a first gap exists between the first lower folded edge and the outer wall of the outer steel ring of the second bearing.
The invention further comprises a first up-down displacement sensing mechanism, wherein the first up-down displacement sensing mechanism comprises a first up-down displacement sensing piece and a first up-down infrared sensor, and the first up-down displacement sensing mechanism is used for determining the zero point of the first dispensing component.
As an improvement of the invention, the invention also comprises a horizontal displacement sensing mechanism which comprises a horizontal displacement sensing piece and a horizontal infrared sensor, wherein the horizontal displacement sensing mechanism is used for determining the zero point of the adhesive dispensing control mechanism.
As an improvement to the invention, the second dispensing assembly comprises a second dispensing assembly motor, a second dispensing assembly eccentric shaft, a second dispensing assembly Z-direction control groove, a second dispensing assembly Z-direction moving plate, a second dispensing arm and a second dispensing head, wherein the second dispensing assembly motor is arranged on the mounting bottom plate, the second dispensing assembly eccentric shaft is connected with the second output shaft of the second dispensing assembly motor, the second dispensing assembly eccentric shaft is connected with a second dispensing assembly bearing group, the second dispensing assembly bearing group is in rolling contact with the inner wall of the second dispensing assembly Z-direction control groove, the second dispensing assembly Z-direction control groove is connected with the upper part of the second dispensing assembly Z-direction moving plate, and the second dispensing assembly Z-direction moving plate is connected with the Z-direction mounting plate through a second dispensing assembly linear guide rail pair; the second dispensing arm is connected with the lower part of the Z-direction mounting plate, and the second dispensing head is connected with the second dispensing arm.
As an improvement to the invention, the second dispensing assembly bearing group comprises a bearing III and a bearing IV, the bearing III and the bearing IV are concentrically connected to the output end II of the eccentric shaft of the second dispensing assembly, the Z-direction control groove of the second dispensing assembly comprises a second upper folded edge and a second lower folded edge, a second standing edge is arranged between the second upper folded edge and the second lower folded edge, the inner wall of the second upper folded edge is in rolling contact with the outer wall of the outer steel ring of the bearing IV only, the inner wall of the second lower folded edge is in rolling contact with the outer wall of the outer steel ring of the bearing III only, and a second gap exists between the second upper folded edge and the outer wall of the outer steel ring of the bearing IV.
As an improvement of the invention, the invention further comprises a second up-down displacement sensing mechanism, wherein the second up-down displacement sensing mechanism comprises a second up-down displacement sensing piece and a second up-down infrared sensor, and the second up-down displacement sensing mechanism is used for determining the zero point of the second dispensing component.
The invention also provides a dispensing method using the flip chip direct-connection type double dispensing mechanism, which comprises the following steps:
s1, a dispensing control mechanism drives a first dispensing component Z-direction moving plate, a first dispensing arm and a first dispensing head of a first dispensing component, and a second dispensing component Z-direction moving plate, a second dispensing arm and a second dispensing head of a second dispensing component 3 to translate to a set dispensing position;
s2, the first dispensing assembly and the second dispensing assembly respectively drive the first dispensing head and the second dispensing head to move downwards to a dispensing height, the same or different types of glue are dipped, and after the dispensing is completed, the first dispensing head and the second dispensing head move upwards to the dispensing height;
s3, the dispensing control mechanism drives a first dispensing component Z-direction moving plate, a first dispensing arm and a first dispensing head of the first dispensing component, and a second dispensing component Z-direction moving plate, a second dispensing arm and a second dispensing head of the second dispensing component 3 to translate to a set dispensing position;
s4, the first dispensing head and the second dispensing head move downwards until the dispensing height is reached to dispense the same or different types of glue.
As an improvement of the present invention, in S4, the first dispensing head and the second dispensing head are asynchronously dispensing, and in S4, the following steps are further included:
s41, driving a first dispensing head to move downwards to a dispensing height by a motor of a first dispensing assembly to dispense, and moving upwards to the dispensing height after dispensing is completed, so as to complete dispensing of the first dispensing point;
s42, the dispensing control mechanism drives the first dispensing head and the second dispensing head to translate to a set second dispensing position;
s43, the second dispensing assembly motor drives the second dispensing head to move downwards to the dispensing height for dispensing, and after dispensing is completed, the second dispensing head moves upwards to the dispensing height to be dispensed, so that dispensing of the second dispensing point is completed.
The first dispensing mechanism and the second dispensing mechanism move in an arc manner from the glue dipping position to the glue dispensing position, so that the invention has the advantage of high production efficiency under the condition of the same movement speed of the two mechanisms; under the condition that the movement time of the two is the same, the invention has lower movement speed and can not generate the problem of whirling glue; in addition, the first dispensing component bearing group comprises a first bearing and a second bearing, the first bearing and the second bearing are concentrically connected to the first output end of the first dispensing component eccentric shaft, the first dispensing component Z-direction control groove comprises a first upper folded edge and a first lower folded edge, a first standing edge is arranged between the first upper folded edge and the first lower folded edge, the first upper folded edge is arranged so that the inner wall of the first upper folded edge is only in rolling contact with the outer wall of the outer steel ring of the second bearing, and the first lower folded edge is arranged so that the inner wall of the first upper folded edge is only in rolling contact with the outer wall of the outer steel ring of the first bearing and a first gap exists between the first lower folded edge and the outer wall of the outer steel ring of the second bearing; the second dispensing assembly bearing group comprises a bearing III and a bearing IV, the bearing III and the bearing IV are concentrically connected to the output end II of the second dispensing assembly eccentric shaft, the second dispensing assembly Z-direction control groove comprises a second upper folding edge and a second lower folding edge, a second standing edge is arranged between the second upper folding edge and the second lower folding edge, the inner wall of the second upper folding edge is in rolling contact with the outer wall of the outer steel ring of the bearing IV only, the inner wall of the second lower folding edge is in rolling contact with the outer wall of the outer steel ring of the bearing III only, and a second gap structure exists between the second lower folding edge and the outer wall of the outer steel ring of the bearing IV, so that the spring reset structure is not used, and the problem of incomplete reset caused by spring fatigue is avoided.
Drawings
Fig. 1 is a schematic perspective exploded view of an embodiment of the present invention.
Fig. 2 is a schematic perspective exploded view of the dispensing control mechanism of fig. 1.
Fig. 3 is a schematic perspective view of the first dispensing assembly of fig. 1.
Fig. 4 is a schematic perspective view of the second dispensing assembly in fig. 1.
Fig. 5 is a schematic plan view of an assembly structure of the dispensing assembly bearing set and the Z-direction control slot of the dispensing assembly in fig. 1.
Fig. 6 is a schematic perspective view of fig. 5.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Referring to fig. 1 and 2, fig. 1 and 2 disclose a flip-chip direct-connection type double-dispensing mechanism, which comprises a dispensing control mechanism 1, a first dispensing assembly 2 with a first dispensing head 21 and a second dispensing assembly 3 with a second dispensing head 31, wherein the dispensing control mechanism 1 is used for driving the first dispensing assembly 2 and the second dispensing assembly 3 to and from a glue dipping position and a glue dispensing position, the dispensing control mechanism 1 comprises a mounting bottom plate 11, a first dispensing control motor 12, a first dispensing eccentric shaft 13, a connecting rod 14, a Z-direction mounting plate 15 for carrying the first dispensing assembly 3 and the second dispensing assembly 4, the first dispensing control motor 12 is arranged on the mounting bottom plate 11, one end 131 of the first dispensing eccentric shaft 13 is connected with an output shaft of the first dispensing control motor 12, the other end 132 of the first dispensing eccentric shaft 13 is connected with one end 142 of the second mounting plate 14 through a first bearing 141 (the first bearing 141 in this embodiment is a back-to-back bearing 143 to-back bearing to ensure stability), the other end 132 is connected with one end 14 through a second bearing 15 in this embodiment through a second bearing 144, and the connecting rod 14 is connected with the Z-direction mounting plate 15 through a second bearing 15; in this embodiment, the Z-direction mounting plate 15 is connected to the slider of the linear guide pair 16, and the rail of the linear guide pair 16 is connected to the mounting base plate 11. In this embodiment, the first dispensing control motor 12 drives the Z-directional mounting plate 15 to make a linear motion along the linear guide rail pair 16 through the first dispensing eccentric shaft 13 and the connecting rod 14, so that the first dispensing head 21 and the second dispensing head 31 are in a linear distance from a glue dipping position to a glue dispensing position, and the invention has higher production efficiency under the condition that the motion speeds of the first dispensing head and the second dispensing head are equal to those of the prior art; under the condition that the movement time of the first dispensing head and the second dispensing head is equal to that of the prior art, the invention can operate at a lower speed, so that the spin coating phenomenon can not occur.
Preferably, the invention further comprises a horizontal displacement sensing mechanism 6, wherein the horizontal displacement sensing mechanism 6 comprises a horizontal displacement sensing piece 61 and a horizontal infrared sensor 62, and the horizontal displacement sensing mechanism 6 is used for determining the zero point of the adhesive dispensing control mechanism 1.
Referring to fig. 1 and 3, it can be seen from the drawing that the first glue dispensing assembly 2 includes a first glue dispensing assembly motor 22, a first glue dispensing assembly eccentric shaft 23, a first glue dispensing assembly Z-direction control slot 24, a first glue dispensing assembly Z-direction moving plate 25, a first glue dispensing arm 26, and a first glue dispensing head 21, the first glue dispensing assembly motor 22 is disposed on the mounting base plate 11, an input end 231 of the first glue dispensing assembly eccentric shaft 23 is connected with an output shaft of the first glue dispensing assembly motor 22, an output end 232 of the first glue dispensing assembly eccentric shaft 23 is connected with a first glue dispensing assembly bearing group 241, the first glue dispensing assembly bearing group 241 is in rolling contact with an inner wall of the first glue dispensing assembly Z-direction control slot 24, the first glue dispensing assembly Z-direction control slot 24 is connected with an upper portion of the first glue dispensing assembly Z-direction moving plate 25, and the first glue dispensing assembly Z-direction moving plate 25 is connected with the Z-direction mounting plate 15 through a first glue dispensing assembly linear guide rail pair 27; the first dispensing arm 26 is connected to the lower portion of the Z-direction mounting plate 15, and the first dispensing head 21 is connected to the first dispensing arm 26.
In this embodiment, the present invention further includes a first up-down displacement sensing mechanism 5, where the first up-down displacement sensing mechanism 5 includes a first up-down displacement sensing piece 51 and a first up-down infrared sensor 52 (in this embodiment, the first up-down displacement sensing piece 51 is disposed on the input end 231 of the first glue dispensing assembly eccentric shaft 23 and can rotate along with the input end 231 of the first glue dispensing assembly eccentric shaft 23), and the first up-down displacement sensing mechanism 5 is used to determine the zero point of the first glue dispensing assembly 2; when the first dispensing assembly 2 starts to operate, the first dispensing assembly 2 is reset to zero through the first up-down displacement sensing mechanism 5.
Referring to fig. 5 and 6, the first dispensing assembly bearing set 241 includes a first bearing 2411 and a second bearing 2412, the first bearing 2411 and the second bearing 2412 are concentrically connected to the first output end 232 of the first dispensing assembly eccentric shaft 23, the first dispensing assembly Z-direction control slot 24 includes a first upper flange 242 and a first lower flange 243, a first vertical edge 244 is disposed between the first upper flange 242 and the first lower flange 243, the first upper flange 242 is disposed such that an inner wall thereof is in rolling contact with only an outer wall of an outer rim of the second bearing 2412, and the first lower flange 243 is disposed such that an inner wall thereof is in rolling contact with only an outer wall of the outer rim of the first bearing 2411 and a first gap 245 is present between the first upper flange 242 and the outer wall of the outer rim of the second bearing 2412. When the first dispensing assembly bearing set 241 is in the down-running state, the first dispensing assembly Z-direction control groove 24 is acted only through the first bearing 2411, so that the first dispensing head 21 is in the down-running state, and the first gap 245 exists between the first dispensing assembly Z-direction control groove 24 and the outer wall of the outer steel ring of the second bearing 2412, so that interference with the second bearing 2412 is not generated when the first dispensing assembly Z-direction control groove is in the down-running state; when the first dispensing assembly bearing set 241 is in the upward direction, since the upper portion of the first bearing 2411 is not in contact with the first upper flange 242, but only the outer rim of the second bearing 2412 is in contact with the inner wall of the first dispensing assembly Z-direction control groove 24, only the second bearing 2412 acts on the first dispensing assembly Z-direction control groove 24 and does not interfere with the first bearing 2411. Since no spring return is used in the present invention, there is no series of problems due to spring fatigue.
Referring to fig. 1 and 4, the second dispensing assembly 3 includes a second dispensing assembly motor 32, a second dispensing assembly eccentric shaft 33, a second dispensing assembly Z-direction control slot 34, a second dispensing assembly Z-direction moving plate 35, a second dispensing arm 36, and a second dispensing head 31, the second dispensing assembly motor 32 is disposed on the mounting base plate 11, an input end two 331 of the second dispensing assembly eccentric shaft 33 is connected with an output shaft two of the second dispensing assembly motor 32, an output end two 332 of the second dispensing assembly eccentric shaft 33 is connected with a second dispensing assembly bearing group 341, the second dispensing assembly bearing group 341 is in rolling contact with an inner wall of the second dispensing assembly Z-direction control slot 34, the second dispensing assembly Z-direction control slot 34 is connected with an upper portion of the second dispensing assembly Z-direction moving plate 35, and the second dispensing assembly Z-direction moving plate 35 is connected with the Z-direction mounting plate 15 through a second dispensing assembly linear guide pair 37; the second dispensing arm 36 is connected to the lower portion of the Z-direction mounting plate 15, and the second dispensing head 31 is connected to the second dispensing arm 36.
Referring to fig. 5 and 6 again, the second dispensing assembly bearing set 341 has the same structure as the first dispensing assembly bearing set 241, the second dispensing assembly bearing set 341 includes a third bearing 3411 and a fourth bearing 3412, the third bearing 3411 and the fourth bearing 3412 are concentrically connected to the output end 332 of the second dispensing assembly eccentric shaft 33, the second dispensing assembly Z-direction control slot 34 includes a second upper flange 342 and a second lower flange 343, a second standing edge 344 is disposed between the second upper flange 342 and the second lower flange 343, the second upper flange 342 is disposed such that an inner wall thereof is in rolling contact with only an outer wall of the outer ring of the fourth bearing 3412, and the second lower flange 343 is disposed such that an inner wall thereof is in rolling contact with only an outer wall of the outer ring of the third bearing 3411, and a second gap 345 is present between the second lower flange 343 and an outer wall of the outer ring of the fourth bearing 3412. When the second dispensing assembly bearing set 341 is in the down-running state, the second dispensing assembly Z-direction control groove 34 is acted only through the third bearing 3411, so that the second dispensing head 31 is in the down-running state, and the second gap 345 exists between the second dispensing assembly Z-direction control groove 34 and the outer wall of the outer steel ring of the fourth bearing 3412, so that interference with the fourth bearing 3412 is not generated when the second dispensing assembly Z-direction control groove is in the down-running state; when the second dispensing assembly bearing set 341 is in the up-going state, since the upper portion of the third bearing 3411 is not in contact with the second upper flange 342, but only the outer steel ring of the fourth bearing 3412 is in contact with the inner wall of the second dispensing assembly Z-direction control groove 34, only the fourth bearing 3412 acts on the second dispensing assembly Z-direction control groove 34 when in the up-going state, and no interference is generated between the fourth bearing 3411 and the third bearing 3411. Since no spring return is used in the present invention, there is no series of problems due to spring fatigue.
Preferably, the present invention further includes a second up-down displacement sensing mechanism 7, where the second up-down displacement sensing mechanism 7 includes a second up-down displacement sensing piece 71 and a second up-down infrared sensor 72 (in this embodiment, the second up-down displacement sensing piece 71 is disposed on the input end 331 of the second dispensing component eccentric shaft 33 and can rotate along with the input end 331 of the second dispensing component eccentric shaft 33), and the second up-down displacement sensing mechanism 7 is used to determine the zero point of the second dispensing component 3; when the second dispensing assembly 3 starts to operate, the second dispensing assembly 3 is reset to zero through the first up-down displacement sensing mechanism 6.
The invention also provides a dispensing method using the flip chip direct-connection type double dispensing mechanism, which comprises the following steps:
s1, a dispensing control mechanism 1 drives a first dispensing component Z-direction moving plate 25, a first dispensing arm 26 and a first dispensing head 21 of a first dispensing component 2, and a second dispensing component Z-direction moving plate 35, a second dispensing arm 36 and a second dispensing head 31 of a second dispensing component 3 to translate to a set glue dipping position;
s2, the first dispensing assembly 2 and the second dispensing assembly 2 respectively drive the first dispensing head 21 and the second dispensing head 31 to move downwards to a dispensing height, dip the same or different types of glue, and move the first dispensing head 21 and the second dispensing head 31 upwards to the dispensing height after the dispensing is completed;
s3, the dispensing control mechanism drives the first dispensing component Z-direction moving plate 25, the first dispensing arm 26 and the first dispensing head 21 of the first dispensing component 2, and the second dispensing component Z-direction moving plate 35, the second dispensing arm 36 and the second dispensing head 31 of the second dispensing component 3 to translate to the set dispensing positions;
and S4, the first dispensing head 21 and the second dispensing head 31 move downwards to the dispensing height to dispense the same or different types of glue.
Preferably, in S4, the first dispensing head 21 and the second dispensing head 31 are asynchronously dispensing, and in S4, the following steps are further included:
s41, driving a first dispensing head 21 to move downwards to a dispensing height by a first dispensing assembly motor 22 to dispense, and moving upwards to the dispensing height after dispensing is completed to complete dispensing of a first dispensing point;
s42, the dispensing control mechanism drives the first dispensing head 21 and the second dispensing head 31 to translate to a set second dispensing position;
s43, the second dispensing assembly motor 32 drives the second dispensing head 31 to move downwards to the dispensing height for dispensing, and after dispensing is completed, the second dispensing head 31 moves upwards to the dispensing height to complete dispensing of the second dispensing point.
The invention is not limited to the specific embodiments described herein, but is intended to cover modifications of the invention and equivalents thereof included within the scope of the appended claims.
Claims (9)
1. The utility model provides a two point gum machines of flip-chip direct connection formula, is including point gum control mechanism (1), has first point gum head (21) first point gum subassembly (2) and has second point gum head (31) second point gum subassembly (3), point gum control mechanism (1) are used for driving first point gum subassembly (2) with second point gum subassembly (3) come and go in dipping in gluey position and gluey position, its characterized in that: the dispensing control mechanism (1) comprises a mounting base plate (11), a first dispensing control motor (12), a first dispensing eccentric shaft (13), a connecting rod (14) and a Z-direction mounting plate (15) for bearing the first dispensing assembly (2) and the second dispensing assembly (3), wherein the first dispensing control motor (12) is arranged on the mounting base plate (11), one end (131) of the first dispensing eccentric shaft (13) is connected with an output shaft of the first dispensing control motor (12), the other end (132) of the first dispensing eccentric shaft (13) is connected with one end (142) of the connecting rod (14) through a first bearing (141), the other end (143) of the connecting rod (14) is connected with the Z-direction mounting plate (15) through a second bearing (144), and the Z-direction mounting plate (15) is connected with the mounting base plate (11) through a linear guide rail pair (16). The second dispensing assembly (3) comprises a second dispensing assembly motor (32), a second dispensing assembly eccentric shaft (33), a second dispensing assembly Z-direction control groove (34), a second dispensing assembly Z-direction moving plate (35), a second dispensing arm (36) and a second dispensing head (31), wherein the second dispensing assembly motor (32) is arranged on the mounting base plate (11), the second dispensing assembly eccentric shaft (33) is connected with the second dispensing assembly motor (32) at the input end (331), the second dispensing assembly eccentric shaft (33) is connected with the second dispensing assembly motor (32) at the output end (332), the second dispensing assembly eccentric shaft (33) is connected with a second dispensing assembly bearing group (341), the second dispensing assembly bearing group (341) is in rolling contact with the inner wall of the second dispensing assembly Z-direction control groove (34), the second dispensing assembly Z-direction control groove (34) is connected with the upper part of the second dispensing assembly Z-direction moving plate (35), and the second dispensing assembly Z-direction moving plate (35) is connected with the mounting plate (37) in the direction of the linear guide rail (15); the second dispensing arm (36) is connected with the lower part of the Z-direction mounting plate (15), and the second dispensing head (31) is connected with the second dispensing arm (36).
2. The flip chip direct-connection type double dispensing mechanism according to claim 1, wherein: the first adhesive dispensing assembly (2) comprises a first adhesive dispensing assembly motor (22), a first adhesive dispensing assembly eccentric shaft (23), a first adhesive dispensing assembly Z-direction control groove (24), a first adhesive dispensing assembly Z-direction moving plate (25), a first adhesive dispensing arm (26) and a first adhesive dispensing head (21), wherein the first adhesive dispensing assembly motor (22) is arranged on the mounting bottom plate (11), an input end (231) of the first adhesive dispensing assembly eccentric shaft (23) is connected with an output shaft of the first adhesive dispensing assembly motor (22), an output end I (232) of the first adhesive dispensing assembly eccentric shaft (23) is connected with a first adhesive dispensing assembly bearing group (241), the first adhesive dispensing assembly bearing group (241) is in rolling contact with the inner wall of the first adhesive dispensing assembly Z-direction control groove (24), the first adhesive dispensing assembly Z-direction control groove (24) is connected with the upper part of the first adhesive dispensing assembly Z-direction moving plate (25), and the first adhesive dispensing assembly Z-direction moving plate (25) is connected with the Z-direction mounting plate (15) through a first adhesive dispensing assembly linear guide rail pair (27); the first dispensing arm (26) is connected with the lower part of the Z-direction mounting plate (15), and the first dispensing head (21) is connected with the first dispensing arm (26).
3. The flip chip direct-connection type double dispensing mechanism according to claim 2, wherein: the first dispensing assembly bearing set (241) comprises a first bearing (2411) and a second bearing (2412), the first bearing (2411) and the second bearing (2412) are concentrically connected to the first output end (232) of the first dispensing assembly eccentric shaft (23), the first dispensing assembly Z-direction control groove (24) comprises a first upper flange (242) and a first lower flange (243), a first standing edge (244) is arranged between the first upper flange (242) and the first lower flange (243), the first upper flange (242) is arranged so that the inner wall of the first upper flange is only in rolling contact with the outer wall of the outer steel ring of the second bearing (2412), and the first lower flange (243) is arranged so that the inner wall of the first lower flange is only in rolling contact with the outer wall of the outer steel ring of the first bearing (2411), and a first gap (245) exists between the first upper flange (242) and the outer wall of the outer steel ring of the second bearing (2412).
4. The flip chip direct-connection type double dispensing mechanism according to claim 1, 2 or 3, wherein: the automatic glue dispensing device is characterized by further comprising a first vertical displacement induction mechanism (5), wherein the first vertical displacement induction mechanism (5) comprises a first vertical displacement induction sheet (51) and a first vertical infrared inductor (52), and the first vertical displacement induction mechanism (5) is used for determining the zero point of the first glue dispensing component (2).
5. The flip chip direct-connection type double dispensing mechanism according to claim 1, 2 or 3, wherein: the automatic glue dispensing device is characterized by further comprising a horizontal displacement sensing mechanism (6), wherein the horizontal displacement sensing mechanism (6) comprises a horizontal displacement sensing piece (61) and a horizontal infrared sensor (62), and the horizontal displacement sensing mechanism (6) is used for determining a zero point of the glue dispensing control mechanism (1).
6. The flip chip direct-connection type double dispensing mechanism according to claim 1, 2 or 3, wherein: the second dispensing assembly bearing set (341) comprises a bearing three (3411) and a bearing four (3412), the bearing three (3411) and the bearing four (3412) are concentrically connected to the output end two (332) of the second dispensing assembly eccentric shaft (33), the second dispensing assembly Z-direction control groove (34) comprises a second upper hem (342) and a second lower hem (343), a second standing edge (344) is arranged between the second upper hem (342) and the second lower hem (343), the second upper hem (342) is arranged so that the inner wall of the second upper hem is only in rolling contact with the outer wall of the outer steel ring of the bearing four (3412), and the second lower hem (343) is arranged so that the inner wall of the second lower hem is only in rolling contact with the outer wall of the outer steel ring of the bearing three (3411), and a second gap (345) exists between the second upper hem (342) and the outer wall of the outer steel ring of the bearing four (3412).
7. The flip chip direct-connection type double dispensing mechanism according to claim 1, 2 or 3, wherein: the automatic glue dispensing device is characterized by further comprising a second vertical displacement induction mechanism (7), wherein the second vertical displacement induction mechanism (7) comprises a second vertical displacement induction sheet (71) and a second vertical infrared inductor (72), and the second vertical displacement induction mechanism (7) is used for determining the zero point of the second glue dispensing component (3).
8. A dispensing method using the flip chip direct-connection type double dispensing mechanism as claimed in claim 1, comprising the steps of:
s1, a dispensing control mechanism (1) drives a first dispensing component Z-direction moving plate (25), a first dispensing arm (26) and a first dispensing head (21) of a first dispensing component (2), and a second dispensing component Z-direction moving plate (35), a second dispensing arm (36) and a second dispensing head (31) of a second dispensing component (3) to translate to a set glue dipping position;
s2, the first dispensing assembly (2) and the second dispensing assembly (3) respectively drive the first dispensing head (21) and the second dispensing head (31) to move downwards to the dispensing height, the same or different types of glue are dipped, and after the dispensing is completed, the first dispensing head (21) and the second dispensing head (31) move upwards to the dispensing height;
s3, the dispensing control mechanism drives a first dispensing component Z-direction moving plate (25), a first dispensing arm (26) and a first dispensing head (21) of the first dispensing component (2), and a second dispensing component Z-direction moving plate (35), a second dispensing arm (36) and a second dispensing head (31) of the second dispensing component (3) to translate to a set dispensing position;
s4, the first dispensing head (21) and the second dispensing head (31) move downwards to the dispensing height to dispense the same or different types of glue.
9. The dispensing method of the flip chip direct connection type double dispensing mechanism according to claim 8, wherein in S4, the first dispensing head (21) and the second dispensing head (31) are asynchronously dispensed, and in S4, the following steps are further included:
s41, driving a first dispensing assembly motor (22) to move a first dispensing head (21) downwards to a dispensing height for dispensing, and moving upwards to the dispensing height after dispensing is completed, so as to complete dispensing of the first dispensing point;
s42, the dispensing control mechanism drives the first dispensing head (21) and the second dispensing head (31) to translate to a set second dispensing position;
s43, the second dispensing assembly motor (32) drives the second dispensing head (31) to move downwards to the dispensing height for dispensing, and after dispensing is completed, the second dispensing head (31) moves upwards to the dispensing height to complete dispensing of the second dispensing point.
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| CN113695171A (en) * | 2021-10-16 | 2021-11-26 | 深圳市佳思特光电设备有限公司 | High-speed high-precision double-point gluing device and double-point gluing method thereof |
| CN114220901A (en) * | 2021-12-15 | 2022-03-22 | 惠州视维新技术有限公司 | Packaging assembly and packaging method thereof |
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| CN103599871A (en) * | 2013-10-25 | 2014-02-26 | 深圳市恒睿智达科技有限公司 | Separated type dispensing mechanism |
| CN204486142U (en) * | 2014-12-23 | 2015-07-22 | 深圳市鹏创达自动化有限公司 | Double end rotates point gum machine |
| JP6540332B2 (en) * | 2015-07-29 | 2019-07-10 | ブラザー工業株式会社 | Bonding device |
| CN105618332B (en) * | 2016-03-29 | 2018-06-26 | 深圳市微恒自动化设备有限公司 | Two point gluing mechanism and its dispensing method |
| CN106345655A (en) * | 2016-10-26 | 2017-01-25 | 华南智能机器人创新研究院 | Six-degree-of-freedom (DOF) adjustable parallel automatic dispensing mechanism |
| CN207628678U (en) * | 2017-11-30 | 2018-07-20 | 陈官海 | It is a kind of fixed point pick formula dispensing and fixed point pick and place structure |
| CN110639751B (en) * | 2019-11-04 | 2020-10-09 | 深圳新益昌科技股份有限公司 | Double-dispensing mechanism of LED die bonder and dispensing method thereof |
| CN212820813U (en) * | 2020-06-29 | 2021-03-30 | 深圳市佳思特光电设备有限公司 | Flip-chip direct-connected double-point glue mechanism |
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