CN111698890A - Improved heat radiation structure - Google Patents
Improved heat radiation structure Download PDFInfo
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- CN111698890A CN111698890A CN202010672029.XA CN202010672029A CN111698890A CN 111698890 A CN111698890 A CN 111698890A CN 202010672029 A CN202010672029 A CN 202010672029A CN 111698890 A CN111698890 A CN 111698890A
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- heat radiation
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- 230000005855 radiation Effects 0.000 title claims abstract description 29
- 230000017525 heat dissipation Effects 0.000 claims abstract description 59
- 238000010438 heat treatment Methods 0.000 claims abstract description 41
- 230000008859 change Effects 0.000 claims abstract description 34
- 239000012782 phase change material Substances 0.000 claims abstract description 23
- 238000002844 melting Methods 0.000 claims abstract description 16
- 230000008018 melting Effects 0.000 claims abstract description 16
- 238000007789 sealing Methods 0.000 claims abstract description 13
- 239000002245 particle Substances 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
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- 238000002791 soaking Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
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- 239000012530 fluid Substances 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
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- 239000004065 semiconductor Substances 0.000 description 2
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- 238000004078 waterproofing Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to an improved heat radiation structure, which is characterized in that a phase change contact layer on any contact surface between a heat radiation element and a heating element at least consists of two phase change materials with different melting points, and the phase change material with the higher melting point is closer to the outer side; any surface between the heat dissipation element and the heating element, which is adjacent to the contact surface of the phase change layer, is provided with a sealing structure; the thickness of any phase change layer contact surface between the heat dissipation element and the heating element is less than 0.01 mm; at least part of the surfaces of any heat dissipation element and heating element are non-sticky surfaces.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a heat dissipation structure of an element, and the element, a preformed piece, a shell, a middle frame and a heat dissipation device adopting the structure; the invention is particularly applicable in the field of electronics.
Background
The development of modern technology has driven a leap forward in electronic technology, and in particular, the development of IC semiconductor and MEMS technology has driven the continuous advancement of integrated circuit, chip, system on chip, encapsulated chip, application processor, artificial intelligence chip, display screen, display card, memory, radio frequency amplifier, LED, power device, server, power amplifier module, power management, and other electronic component technologies. The result of the advancement of electronic technology is the ultra-thin/small size, light weight, high frequency, high power, and high density of components and devices. When the GaN half-bridge circuit operates at 10MHz and 400V, the heating power per square centimeter can reach 6400W. The heating power of a single graphic processor can reach 40W per square centimeter, and the heating power of a single central processor can reach 30W per square centimeter. The heating power per square centimeter of future high-power devices and chips can reach 500W or even 1000W. The temperature resistance of the semiconducting material is usually 90 degrees, in particular 105 degrees. Statistical studies have shown that 50% of electronic product malfunction or degradation is associated with increased temperature; the heating elements are mostly electronic elements, and heat management of electronic products becomes a challenging problem. The heat dissipation process of the electronic product comprises heat transfer and heat dissipation. The heat transfer process is not only related to the nature and structure of the material, but also to the form of contact of the heat transfer material with the heat generating component. The contact form with the heating element in the heat transfer process of the existing electronic product is mainly two types: welding and bonding; a common form of contact is adhesive bonding. The surface of the heat dissipation element and the surface of the heating element in the prior art are contacted through a thermal interface material, and researches show that: the thermal resistance of the contact interface accounts for about 50% of the total thermal resistance; the thermal conductivity of the thermal interface material in organic form is mostly not more than the level of 10W/m.k; the heat conductivity coefficient of inorganic, especially liquid metal can reach 80W/m.k, the liquid metal has large surface tension and viscosity, the liquid metal has conductivity and shielding property, and the thickness, temperature, structure, alloy, variety and substrate surface property of the liquid metal are factors influencing the fluidity of the liquid metal; the disordered flow of the liquid metal is easy to generate circuit short circuit and wrong connection, and the liquid metal in the prior art has the problem of side leakage and seepage in practical application; the heat conductivity coefficient of the high heat conduction material is generally more than 150W/m.k; therefore, solving the problem of low heat transfer efficiency of the contact surface is an effective way to solve the problem of heat management; however, the flow control of the liquid metal is a necessary guarantee to improve the safety of the use of the device. When the heat conduction material is in contact with the heating surface, three forms can be provided according to the matching condition of the heat conduction material and the contact surface of the heating element: the surface processing precision can reach the normal state of air-tight contact, liquid-tight contact and low processing precision in the prior art; the heat transfer coefficients of the three forms of the contact surfaces of the heat conduction materials and the heating element are ordered, the air-tight contact is the largest, and the normal state is the smallest; if the existing problems of element heat dissipation method, heat dissipation structure, stable interface structure, ultra-thin and light weight of the device can be solved on the aspects of cost, technical difficulty and manufacturing efficiency, the effect of achieving twice the result with half the effort can be achieved. In the prior art, the waterproofing of electronic products mainly depends on welding, sealant and sealing elements; sometimes, due to limitations in use conditions, cost, technical difficulty and manufacturing efficiency, the prior art cannot simultaneously meet the requirements of production design.
Disclosure of Invention
Based on the problems of the existing heat dissipation and phase change layer, the invention provides an improved heat dissipation method and a structure adopting the improved heat dissipation method; a preform, a back shell and a middle frame using the element or the element heat dissipation structure; an electronic system or terminal, which adopts any electronic element heat dissipation structure of the claims, any electronic element adopting the electronic element heat dissipation structure, and any heat dissipation device or system.
The heating element is mostly an electronic element, especially a small-sized device terminal; the heat dissipation structure can be a multi-layer structure or a single-layer structure; the heat dissipation element can be a plurality of heat dissipation elements, or one heat dissipation element is provided with a plurality of heat dissipation surfaces with different shapes and sizes, and the heat dissipation surfaces with different shapes and sizes can correspond to different heating surfaces; determining the matching form of the contact surface of the heat dissipation material and the heating element by the processing precision of the contact surface and the interface material; the processing precision of the airtight contact is highest, and the processing precision of the liquid-tight contact surface is not higher than that of the airtight contact; when the contact surfaces are normally matched, the processing precision or the matching precision of the contact surfaces is not improved, and the heat transfer coefficient when the contact surfaces are in direct contact cannot be improved; the degree of contact between the contact surfaces can be characterized by measuring the machining precision of the surfaces, such as the magnitude of vacuum pressure, dimensional tolerance, profile, flatness or roughness, and the contact surfaces can be flat or curved; the liquid-tight contact can be obtained by direct contact, by grinding, by placing in a vacuum environment, by evacuating a liquid, at least one way being chosen; the contact surface comprises a direct contact surface and a side surface with a direct contact surface contact line, the side surface comprises an edge part, at least one surface is internally provided with a part of sealing structure, and the sealing structure can be a polymer, a coating, a sealant, an elastomer, a welding structure, a buckling structure, a thread structure and the like; the contact surface is at least partially of a fixed structure, the shape of the fixed structure can be points of various shapes, edges of various shapes, surfaces of various shapes and one-dimensional, two-dimensional or three-dimensional; the side surfaces surrounding the contact surfaces have at least a partly gastight sealing effect.
An improved heat dissipation structure generally comprises a heat dissipation element, a heating element and a phase change material; the heat dissipation element and the heating element form a heat dissipation structure through a phase change material; the phase-change material comprises organic and inorganic phase-change materials, and liquid metal is a better choice for the purpose of heat transfer, but the mobility management of the phase-change material is a practical problem when the phase-change material is fluid; in order to control the flow of the fluid, at least two phase-change materials with different melting points can be adopted, wherein the phase-change material with the high melting point is the outermost layer in the possible flow direction; a sealing structure can be arranged between the contact surfaces of the heat dissipation element and the heating element; the sealing structure is a fixing structure, and the fixing structure comprises at least one of bonding, welding, an elastic structure, a buckle structure, a thread structure, an embedding and clamping structure and a riveting structure; according to the materials and the structure, the existing various welding modes can be adopted; at least one surface of the contact surface is provided with at least one fixed structure; the adjacent surface of each contact surface corresponding to the heat dissipation element and the heating element can be provided with a non-stick structure, particularly a non-stick liquid metal surface, the adjacent surface comprises an adjacent surface which is coplanar with the contact surface and an adjacent surface which is not coplanar, and the non-stick surface can be processed and arranged by adopting methods such as a physical method, a chemical method, a bionic method, a metamaterial method and the like; the non-sticky surface comprises a contact surface and an adjacent surface, the contact surface is arranged to be non-sticky, so that a separable structure can be conveniently arranged between the radiating element and the heating element, and rework maintenance of defective products and maintenance of after-sale products in the production process are facilitated; the adjacent surfaces are non-sticky, so that the liquid metal can be prevented from flowing due to the fact that the liquid metal has large surface tension; the thickness of the liquid metal can be set to be an ultrathin form, for example, the thickness is less than 0.02mm, and the leakage is also prevented by utilizing the surface effect; when the thickness of the liquid metal is in an ultrathin form, the liquid metal can also be said to fill the gap between the heat dissipation element and the heating element; the heat dissipation element sometimes has other functions, such as a shielding case, the phase change layer can prevent the fluid from flowing, and can achieve the advantages of increasing the shielding effect, reducing the fluidity and the heat conduction performance by adding functional particles, wherein the functional particles can be electromagnetic shielding particles, magnetic shielding particles or heat conduction particles; one, two or more kinds of structures of the above-described methods or structures can be selected to be used on any one of the two surfaces in contact; two or more kinds of the above-described methods or structures may be selected for the same structure for different setting purposes.
The phase change material may be formed by melting, grinding, embedding, bonding, CNC machining, micro electro mechanical machining, high energy physics, and the like.
An improved heat radiation structure comprises heat radiation elements, a phase change layer and a heat generating element, and is characterized in that the phase change contact layer on any contact surface between the heat radiation elements and the heat generating element is at least composed of two phase change materials with different melting points, and the phase change material with the higher melting point is closer to the outer side.
An improved heat radiation structure comprises heat radiation elements, heating elements and a phase change layer, and is characterized in that a sealing structure is arranged on any adjacent surface between the heat radiation elements and the heating elements, which is in contact with the phase change layer; the contact surface comprises a direct contact surface and a side surface of the contact surface, and at least one contact surface is provided with a fixed structure; at least one side surface of the contact surface is provided with at least a sealing structure; the fixing structure comprises at least one of bonding, welding, an elastic structure, a buckle structure, a thread structure, an embedding and clamping structure and a riveting structure; according to the materials and the structure, the existing various welding modes can be adopted; the seal may be an adhesive polymer, coating, sealant, elastomer, or the like.
An improved heat radiation structure comprises heat radiation elements, a phase change layer and a heat radiation element, and is characterized in that the thickness of any phase change layer contact surface between the heat radiation elements and the heat radiation element is less than 0.01 mm; the reduction in thickness can both reduce liquid flow and increase heat dissipation efficiency, so that the difference in heat transfer efficiency between the prior art and the ultra-thin contact surface thickness can be measured; ideally, at least in the heat dissipation contact surface of the heat dissipation element or the heating element, the highest point of the crystal grains on the substrate surface of the heat dissipation element or the heating element is exposed out of the outer surface of the liquid metal phase change layer; the best state is that the surface processing precision of the heat dissipation element or the heating element can reach an airtight level or a liquid-tight level; at least partly gastight contact is made between the elements in a liquid-tight contact surface; comprises two contact surfaces, wherein one contact surface is an air-tight surface; a method of fixing the components by vacuum pressure generated at the contact surface between the components; at least one side surface of the contact surface is provided with at least a sealing structure; at least one face of the airtight contact face is provided with at least one fixed structure; at least one point in at least a portion of the fluid-tight contact surface is in non-fluid-tight contact.
An improved heat radiation structure comprises a heat radiation element and a heating element, and is characterized in that at least part of the surfaces of any heat radiation element and the heating element are non-sticky.
Preferred non-stick surfaces include the contact surface of the heat dissipating component with the heat generating component and the adjacent surface of the contact surface.
Preferred phase change layers have functional particles; electromagnetic shielding particles, magnetic particles, heat conducting materials or fibrous particles are arranged in the contact surface;
the preferred phase change layer is composed of at least a low melting point metal.
A preferred heat dissipation structure is a combination of at least any two of the heat dissipation structures claimed in any of the claims.
A preformed component, wherein the surface of the preformed component is at least partially formed using the improved heat dissipation structure of any one of claims 1-8; the preformed element is a separate heat dissipating element or a heat generating element, respectively, in combination with the phase change layer.
A housing, wherein at least a portion of a surface of the housing is formed by the improved heat dissipation structure of any one of claims 1-8; the preformed element is a heat dissipation element or a heating element, and before the heat dissipation structure is formed, the contact surface of the heat dissipation element or the heating element is subjected to surface arrangement in advance.
A frame, characterized in that the surface of the frame is at least partially formed by the improved heat dissipation structure as claimed in any one of claims 1 to 8.
The liquid-tight contact surface of the heat dissipation element is provided with a protruding part.
A waterproof method for electronic device features that the contact surface between elements is at least partially liquid-tight; at least partly gastight contact is made between the elements in a liquid-tight contact surface; one of the two contact surfaces is an airtight surface. A method of fixing the components by vacuum pressure generated at the contact surface between the components; the degree of contact between the contact surfaces can be directly characterized by measuring the surface machining precision, such as the magnitude of vacuum pressure, dimensional tolerance, profile, flatness or roughness, or by measuring whether the contact surfaces are liquid-tight; the liquid-tight contact surface can be a plane or a curved surface; liquid-tight contact can be obtained by grinding, or by placing in a vacuum environment, or by evacuating the liquid, at least one way being chosen; at least one side surface of the air-tight contact surface is provided with at least a sealing structure; at least one face of the airtight contact face has at least one fixing structure.
A waterproof structure of an electronic device is characterized in that at least part of contact surfaces between elements are of a waterproof structure which is in liquid-tight contact; the contact surface between the elements at least partially forms a waterproof structure in airtight contact; at least partly gastight contact is made between the elements in a liquid-tight contact surface; one of the two contact surfaces is an airtight surface. The contact surface between the components is at least partially brought into a gas-tight contact, and the components are fixed by vacuum pressure generated at the contact surface between the components. At least one side surface of the air-tight contact surface is provided with at least a sealing structure; at least one of the airtight contact surface and the side surface is provided with at least one fixed structure; waterproofing elements, devices, products and systems made by the method or the elements according to any of the preceding claims.
A heat sink device characterized by the heat sink device and system manufactured by the method or the structural element of any of the preceding claims.
An electronic component, characterized in that it is made by the method for dissipating heat of a heat generating component as claimed in any one of the preceding claims.
The invention has the beneficial effects that:
1. a new and improved heat dissipation structure is provided.
2. The back shell and the middle frame are made of improved radiating structures.
3. A preform is presented.
4. Any product, device or system that employs an improved heat dissipation structure.
Drawings
FIG. 1 is a schematic view of an improved heat dissipation structure
1. High melting point phase change layer, 2, low melting point phase change layer
Detailed Description
In a first embodiment, the preformed element is a shell, at least the part of the shell opposite to the matching element is physically arranged to be non-sticky to the surface in the surface of the shell opposite to the matching element after assembly, and the shell can be in non-stress or micro-stress contact with the matching element after assembly.
In the second embodiment, the preformed element is a heat-conducting copper plate, the shape is square, the thickness of the phase change layer on one surface is less than 0.01mm, and the grain height of the surface of the copper plate is in the same plane with the outer surface of the phase change layer; the opposite surface phase change layer is composed of phase change materials with high and low melting points, the thickness of the phase change layer is 0.01mm, and the phase change material with high melting point surrounds the phase change material with low melting point to form a contact line which is completely enclosed; the high-melting-point phase-change material is melted and formed, and then the low-melting-point phase-change material is melted and formed.
In the third embodiment, the heat dissipation element is a soaking plate radiator, and the heating element is an IGBT chip; the area that can cooperate of vapor chamber is greater than the surface that generates heat of IGBT chip, and the shape is the rectangle, the vapor chamber radiator passes through the phase change material layer cooperation with the assembly surface of chip, the surface outside the phase change material layer cooperation part that passes through of vapor chamber radiator assembly surface and chip sets up to be not stained with the surface, the assembly surface of vapor chamber radiator and chip passes through the assembly that melts of phase change material layer, the side of contact surface has fixed knot to construct, there is the elasticity bump along the appearance edge of IGBT chip in the vapor chamber radiator contact surface, bump and the contact of IGBT chip side buckle, the IGBT chip is fixed in the contact surface of vapor chamber radiator.
In a fourth embodiment, an electronic device terminal at least includes a heat dissipating portion, a rear case, a shielding cover, a battery portion and a heat generating portion, the heat generating portion is located on one side of a support portion of a middle frame of the terminal, the display portion is located on the other side of the support portion of the middle frame of the terminal, the heat generating portion is a PCB, the heat generating component is illustrated by a CPU fixed on the PCB, the heat generating component is mounted on the PCB, the battery portion and the heat generating portion are respectively fixed on the support portion of the middle frame of the terminal, the heat generating surface of the heat generating component faces the rear case, the shielding cover is fixed on the PCB to form a shielding space, the heat dissipating portion is disposed between the shielding cover and the rear case, the shielding cover is disposed between the heat dissipating portion and the heat generating component, the heat dissipating component is a flat heat pipe, two contact surfaces of the flat heat pipe and the shielding cover are processed so that the surfaces around the contact surfaces are not adhered to the surface, the back shell and the corresponding surface of the flat heat pipe are set to be non-sticky surfaces, the other surface of the flat heat pipe is in close contact with the heating surface of the shielding cover through a phase change layer, the other surface of the shielding cover is in contact with the heating surface of the CPU through the phase change layer, the battery is in contact with the middle frame, besides the fixed supporting part, a heat conducting part is arranged between the middle frame frames and is in contact with the battery, the processing precision of the contact surface of the middle frame supporting part and the display screen is air tightness, the air tightness of the display screen is fixed on the middle frame supporting part, and sealant is coated on the edge of the; the assembling surfaces respectively pass through the processing process before assembly, so that the precision of the assembling surfaces reaches the structure that the two assembled parts are in airtight contact; vacuum contact is formed between the two surfaces at least partially, and atmospheric vacuum pressure with a desired magnitude is generated, wherein the magnitude of the pressure is determined by the airtightness degree of the contact surface or the airtightness contact area; if a partial gas-tight contact area is required, the precision of the mounting surface of at least one mounting surface, which is obtained in each case by a machining process before mounting, is to be increased; the assembly effect can be determined by measuring the stress condition between the two; the airtight contact is obtained by a liquid exhaust assembly mode, and the used liquid is alcohol; and heat conducting particles are added in the phase change layer.
In the fifth embodiment, an electronic device terminal, a heat dissipating portion, a rear case, a battery portion and a heat generating portion are located on one side of a terminal middle frame support portion, a display portion is located on the other side of the terminal middle frame support portion, the heat generating portion is a PCB, a heat generating component is exemplified by a CPU, the heat generating component is mounted on the PCB, the battery portion and the heat generating component are respectively fixed on the terminal middle frame support portion, a heat generating surface of the heat generating component faces the rear case, the heat dissipating portion, a shielding case, and the heat generating component are sequentially opposite, the heat dissipating portion is a soaking plate, two contact surfaces of the soaking plate and the shielding case are both provided with a high-low melting-point phase change layer through a processing process, elastic fixing structures adapted to shapes of the soaking plate and the heat generating component are respectively arranged on two contact surfaces of the shielding case, the soaking plate is in close contact with the shielding case through the elastic fixing structures and the phase change layer, the, fixed knot constructs the four sides at shield cover and heating element contact edge, every edge has at least a through-hole, it is fixed to inject sealed glue through the through-hole, and with heating element in close contact with, radiating element is last to have the seal structure around shield cover contact edge, the side of contact surface has partial seal structure at least, the side includes limit portion, seal structure is the polymer, form the sealed effect of gas tightness around the side of contact surface, battery and center, except that the fixed stay portion, still be provided with heat conduction portion and battery contact between the center frame, the display screen is fixed at the center support portion.
This description is by way of example only, and not necessarily all of the prior art has been omitted; all possible forms, methods, shapes and configurations that may be known to a person skilled in the art, within the scope of the invention as defined by the appended claims, are within the scope of the invention.
Claims (11)
1. An improved heat radiation structure comprises heat radiation elements, a phase change layer and a heat generating element, and is characterized in that the phase change contact layer on any contact surface between the heat radiation elements and the heat generating element is at least composed of two phase change materials with different melting points, and the phase change material with the higher melting point is closer to the outer side.
2. An improved radiating structure comprises radiating elements, heating elements and a phase change layer, and is characterized in that a sealing structure is arranged on any adjacent surface between the radiating elements and the heating elements, which is in contact with the phase change layer.
3. An improved heat radiation structure comprises heat radiation elements, a phase change layer and a heat radiation element, and is characterized in that the thickness of any phase change layer contact surface between the heat radiation elements and the heat radiation element is less than 0.01 mm.
4. An improved heat radiation structure comprises a heat radiation element and a heating element, and is characterized in that at least part of the surfaces of any heat radiation element and the heating element are non-sticky.
5. The improved heat dissipating structure of claim 4, wherein the non-stick surface comprises a contact surface of the heat dissipating component with the heat generating component and an adjacent surface of the contact surface.
6. The improved heat dissipation structure as defined in any one of claims 1-5, wherein the phase change layer has functional particles.
7. The improved heat dissipation structure as defined in any of claims 1-6, wherein the phase change layer is composed of at least a low melting point metal.
8. The improved heat dissipation structure as defined in any one of claims 1 to 7, wherein the heat dissipation structure is a combination of at least two of the heat dissipation structures defined in any one of claims.
9. A preformed element, wherein the surface of the preformed element is at least partially formed using the improved heat dissipation structure of any one of claims 1 to 8.
10. A housing, wherein at least a portion of a surface of the housing is formed by the improved heat dissipation structure of any of claims 1-8.
11. A frame, characterized in that the surface of the frame is at least partially formed by the improved heat dissipation structure of any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010672029.XA CN111698890A (en) | 2020-07-14 | 2020-07-14 | Improved heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010672029.XA CN111698890A (en) | 2020-07-14 | 2020-07-14 | Improved heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111698890A true CN111698890A (en) | 2020-09-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010672029.XA Pending CN111698890A (en) | 2020-07-14 | 2020-07-14 | Improved heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111698890A (en) |
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2020
- 2020-07-14 CN CN202010672029.XA patent/CN111698890A/en active Pending
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Application publication date: 20200922 |