CN111696896A

CN111696896A - Chip packaging equipment

Info

Publication number: CN111696896A
Application number: CN202010419052.8A
Authority: CN
Inventors: 孙文檠
Original assignee: Ma'anshan Xinhai Technology Co ltd
Current assignee: Ma'anshan Xinhai Technology Co ltd
Priority date: 2020-05-18
Filing date: 2020-05-18
Publication date: 2020-09-22

Abstract

The invention discloses chip packaging equipment which comprises a high-pressure box, wherein a pressure relief pipe is fixedly connected and installed on the upper surface of the high-pressure box, a hydraulic pump is fixedly installed inside the high-pressure box, a control panel is fixedly installed on the front surface of the high-pressure box, a negative pressure meter is fixedly installed on the front surface of the high-pressure box, which is positioned above the control panel, an indicator lamp is fixedly installed on the upper surface of the high-pressure box, a function box is fixedly installed on the lower surface of the high-pressure box, a vacuum air pump is fixedly installed inside the function box, and a draught fan is fixedly installed on one side, which is positioned inside the vacuum air pump, of the function box. The chip packaging equipment can prevent the chip from being broken down or short-circuited due to the influence of moisture in the air on the gap which is not pressed in the chip packaging equipment, so that the chip packaging quality can be improved, the smoke can be purified, and the harm of harmful smoke generated in processing to human health is prevented.

Description

Chip packaging equipment

Technical Field

The invention relates to the field of packaging equipment, in particular to chip packaging equipment.

Background

The shell for installing semiconductor integrated circuit chip plays the role of placing, fixing, sealing, protecting chip and enhancing electrothermal property, and is also the bridge for communicating the internal world of chip with external circuit, the connection point on the chip is connected to the pin of the package shell by wire, these pins are connected with other devices by wire on the printed board, so that the package plays an important role for CPU and other LSI integrated circuits, generally, in the course of packaging, the chip-on-board process firstly covers the silicon chip placing point on the substrate surface by heat-conducting epoxy resin, then directly places the silicon chip on the substrate surface, makes heat treatment until the silicon chip is firmly fixed on the substrate, then directly establishes electric connection between the silicon chip and the substrate by wire-bonding method, and can complete the package, and said mode possesses good package effect and simple and convenient operation, the method is widely applied to the packaging protection of the chip;

however, the existing chip packaging equipment has certain disadvantages when in use, the traditional packaging generally finishes packaging operation in normal environment, so that the interference of external factors is large during packaging, gaps which are easy to appear during packaging are mixed with air to cause steam in the air to corrode chips, especially for the production and processing of some high-requirement chips, the later-stage use can not be ensured to operate well, and the air pollution is easily caused by the exhaust of smoke generated by heating and pressing after packaging.

Disclosure of Invention

The invention mainly aims to provide a chip packaging device which can effectively solve the problems in the background technology.

In order to achieve the purpose, the invention adopts the technical scheme that:

the utility model provides a chip packaging equipment, includes the high-pressure tank, the last fixed surface of high-pressure tank connects and installs the pressure release pipe, the inside fixed mounting of high-pressure tank has the hydraulic pump, the preceding fixed surface of high-pressure tank installs control panel, the front surface of high-pressure tank is located control panel's top fixed mounting has the negative pressure table, the last fixed surface of high-pressure tank installs the pilot lamp, the lower fixed surface of high-pressure tank installs the function case, the inside fixed mounting of function case has the vacuum aspiration pump, one side fixed mounting that the inside of function case is located the vacuum aspiration pump has the draught fan.

Preferably, the work window has been seted up to the front surface of high-pressure tank, the front surface of high-pressure tank is located a side border position movable mounting of work window has the sealing door, the inboard surface border position fixed mounting of sealing door has sealed frame, surface one side fixed mounting of sealing door has fixed bayonet socket, the front surface of high-pressure tank is located another side position fixed mounting of work window has the roating seat, the surface movable mounting of roating seat has the hob, the fastening spiral is installed to the surperficial spiral of hob.

Preferably, the high-pressure tank is connected with the sealing door in a sealing mode through a sealing frame, the sealing door is movably connected with the high-pressure tank through a hinge, a rotating shaft is arranged on the surface of the rotating seat, and the screw rod is movably connected with the rotating seat through the rotating shaft.

Preferably, the surface of the pressure relief pipe is fixedly provided with a pressure relief solenoid valve, the output end of the hydraulic pump is fixedly connected with a hot upper plate, the lower surface of the inner part of the high-pressure box is positioned below the hot upper plate and is fixedly provided with a hot-pressing lower plate, and the pressure relief pipe is communicated with the high-pressure box.

Preferably, the middle part of the lower surface of the function box is fixedly provided with an air exhaust screen plate, the front surface of the function box is provided with a sealing box door, the surface of the sealing box door is provided with an inner buckle handle, and the lower surface of the function box is positioned at four corners and is fixedly provided with supporting legs.

Preferably, the surface of the vacuum air pump is connected with a first motor, the upper surface of the vacuum air pump is fixedly connected with an air exhaust pipe, and the surface of one side of the vacuum air pump is fixedly connected with a first exhaust pipe.

Preferably, the vacuum air pump passes through the function box through an air suction pipe and is communicated with the high-pressure box.

Preferably, the fixed surface of draught fan is connected and is installed the motor No. two, the induced duct is installed to the last fixed surface of draught fan, the purifying box is installed to the fixed surface of induced duct connection, the top fixed connection that the surface of induced duct is located the purifying box installs sealed solenoid valve, one side fixed surface of draught fan installs No. two blast pipes, the inside of purifying box is fixed to inlay establishes and installs the active carbon otter board, the inside of purifying box is located the fixed top of active carbon otter board and inlays to establish and install well effect the filter screen, the inside of purifying box is located the top of well effect filter screen and is fixed to inlay to establish and install and just imitate the filter screen, the last fixed surface of purifying box installs the upper end cover, active carbon otter board, well effect the filter screen with just, the surface that imitates between the filter screen is located the edge and.

Preferably, the draught fan passes function case and high-pressure tank intercommunication through the induced duct, a motor with the equal fixed mounting in surface of No. two motors has radiating fin, the upper end cover passes through hinge and purge box swing joint, the upper end cover passes through set screw and sealing washer ring and purge box fixed seal.

Compared with the prior art, the invention has the following beneficial effects:

according to the invention, the vacuum air pump is arranged to pump the internal air out of the high-pressure box, so that the interior is in a vacuum state, external damp gas can be prevented from being mixed into the space which is not pressed when the interior is pressed and sealed, and the chip failure or short circuit caused by the influence of the damp in the air on the gap which is not pressed is prevented, therefore, the quality of chip packaging can be improved, and the chip packaging device is particularly used for packaging some chips with high quality and high requirements;

through the arranged draught fan, after the packaging is finished, the pressure relief electromagnetic valve is opened to enable external air to enter the interior of the high-pressure box from the pressure relief pipe, the second motor and the sealing electromagnetic valve are simultaneously opened, the draught fan enables gas in the high-pressure box and smoke generated by pressing, packaging and heating to be sucked by the draught pipe and led into the purifying box, then the smoke sequentially enters the primary filter screen, the intermediate filter screen and the activated carbon screen plate for filtering and absorption, the purified gas after absorption is discharged through the second exhaust pipe, the smoke is enabled to have a purifying effect, harmful smoke generated during processing is prevented from harming human health, meanwhile, when the first motor and the second motor work, the discharged gas is respectively discharged through the first exhaust pipe and the second exhaust pipe, and the discharged gas circulates in the functional box to enable the temperature of the surface heat dissipation fins of the first motor and the second motor and the surface temperature of other heating elements to be taken away through the screen plate exhaust, thereby reach the purpose of giving the cooling of a motor and No. two motors and other components, better protection the component.

Drawings

Fig. 1 is a schematic diagram of an overall structure of a chip packaging apparatus according to the present invention;

FIG. 2 is a partial cross-sectional view of a functional box of a chip packaging apparatus according to the present invention;

FIG. 3 is an enlarged view of a portion A of the chip packaging apparatus of the present invention shown in FIG. 1;

FIG. 4 is a partial cross-sectional view of a purge bin of a chip packaging apparatus of the present invention;

fig. 5 is a bottom view of a functional box of a chip packaging apparatus according to the present invention.

In the figure: 1. a high pressure tank; 101. a sealing door; 102. sealing the frame; 103. fixing the bayonet; 104. a rotating base; 105. a screw rod; 106. fastening the screw; 2. a pressure relief pipe; 201. a pressure relief solenoid valve; 3. a hydraulic pump; 301. hot pressing the upper plate; 302. hot-pressing the lower plate; 4. a control panel; 5. a negative pressure gauge; 6. an indicator light; 7. a function box; 701. an air exhaust net plate; 8. a vacuum pump; 801. a first motor; 802. an air exhaust pipe; 803. a first exhaust pipe; 9. an induced draft fan; 901. a second motor; 902. an induced draft pipe; 903. a purification box; 904. sealing the electromagnetic valve; 905. a second exhaust pipe; 906. an activated carbon screen plate; 907. a middle-effect filter screen; 908. a primary filter screen; 909. an upper end cover; 9010. and a gasket ring.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1 to 5, a chip packaging device includes a high-pressure tank 1, a pressure relief pipe 2 is fixedly connected and installed on the upper surface of the high-pressure tank 1, a hydraulic pump 3 is fixedly installed inside the high-pressure tank 1, a control panel 4 is fixedly installed on the front surface of the high-pressure tank 1, a negative pressure meter 5 is fixedly installed on the front surface of the high-pressure tank 1 above the control panel 4, an indicator lamp 6 is fixedly installed on the upper surface of the high-pressure tank 1, a function tank 7 is fixedly installed on the lower surface of the high-pressure tank 1, a vacuum air pump 8 is fixedly installed inside the function tank 7, and an induced draft fan 9 is fixedly installed on one side of the inside of the function tank 7, which is located on the vacuum air;

a working window is arranged on the front surface of the high-pressure tank 1, a sealing door 101 is movably mounted on the front surface of the high-pressure tank 1 at the edge of one side of the working window, a sealing frame 102 is fixedly mounted at the edge of the inner side surface of the sealing door 101, a fixing bayonet 103 is fixedly mounted on one side of the surface of the sealing door 101, a rotating seat 104 is fixedly mounted on the front surface of the high-pressure tank 1 at the other side of the working window, a spiral rod 105 is movably mounted on the surface of the rotating seat 104, and a fastening spiral 106 is spirally mounted on the surface of the spiral rod 105; the high-pressure tank 1 is hermetically connected with a sealing door 101 through a sealing frame 102, the sealing door 101 is movably connected with the high-pressure tank 1 through a hinge, a rotating shaft is arranged on the surface of a rotating seat 104, and a screw rod 105 is movably connected with the rotating seat 104 through the rotating shaft; the surface of the pressure relief pipe 2 is fixedly provided with a pressure relief electromagnetic valve 201, the output end of the hydraulic pump 3 is fixedly connected with a hot-pressing upper plate 301, the lower surface of the interior of the high-pressure box 1 is positioned below the hot-pressing upper plate 301 and is fixedly provided with a hot-pressing lower plate 302, and the pressure relief pipe 2 is communicated with the high-pressure box 1; the middle part of the lower surface of the function box 7 is fixedly provided with an air exhaust screen plate 701, the front surface of the function box 7 is provided with a sealing box door, the surface of the sealing box door is provided with an inner buckle handle, and the lower surface of the function box 7 is fixedly provided with supporting legs at four corners; the surface of the vacuum air pump 8 is connected with a first motor 801, the upper surface of the vacuum air pump 8 is fixedly connected with an air pumping pipe 802, and the surface of one side of the vacuum air pump 8 is fixedly connected with a first exhaust pipe 803; the vacuum air pump 8 penetrates through the functional box 7 through the air suction pipe 802 to be communicated with the high-pressure box 1, and the high-pressure box 1 is pumped out of the internal air through the arranged vacuum air pump 8, so that the interior is in a vacuum state, external damp gas can be prevented from being mixed into an internal non-pressed space when the interior is pressed and sealed, chip failure or short circuit caused by the influence of moisture in the air on an internal non-pressed gap can be prevented, and the chip packaging quality can be improved; a second motor 901 is fixedly connected and installed on the surface of an induced draft fan 9, an induced draft pipe 902 is fixedly connected and installed on the upper surface of the induced draft fan 9, a purification box 903 is fixedly connected and installed on the surface of the induced draft pipe 902, a sealing electromagnetic valve 904 is fixedly connected and installed on the surface of the induced draft pipe 902, an exhaust pipe 905 on one side of the induced draft fan 9 is fixedly installed on the surface of the induced draft pipe 902, an active carbon screen plate 906 is fixedly embedded and installed inside the purification box 903, a middle-effect filter screen 907 is fixedly embedded and installed above the active carbon screen plate 906 inside the purification box 903, a primary-effect filter screen 908 is fixedly embedded and installed inside the purification box 903 above the middle-effect filter screen 907, an upper end cover 909 is fixedly installed on the upper surface of the purification box 903, and sealing cushion rings 9010 are arranged on the edges of the surfaces among the active carbon screen plate 906; an induced draft fan 9 penetrates through a functional box 7 through an induced draft pipe 902 to be communicated with a high pressure box 1, heat radiating fins are fixedly arranged on the surfaces of a first motor 801 and a second motor 901, an upper end cover 909 is movably connected with a purification box 903 through hinges, the upper end cover 909 is fixedly sealed with the purification box 903 through fixing screws and a sealing gasket ring 9010, after packaging is completed, a pressure relief electromagnetic valve 201 is opened to enable external air to enter the inside of the high pressure box 1 from a pressure relief pipe 2, the second motor 901 and a sealing electromagnetic valve 904 are simultaneously opened to enable the induced draft fan 9 to enable gas inside the high pressure box 1 and flue gas generated by pressing packaging heating to be sucked and introduced into the purification box 903 through the induced draft pipe 902, then the flue gas sequentially enters a primary filter screen 908, a secondary filter screen 907 and an active carbon screen plate 906 to be filtered and absorbed, and the purified gas is discharged through a secondary exhaust pipe 905, so that the flue gas is purified, harmful smoke generated by processing is prevented from harming human health, and meanwhile, when the first motor 801 and the second motor 901 work, discharged gas is discharged through the first exhaust pipe 803 and the second exhaust pipe 905 respectively, and the discharged gas circulates in the functional box 7, so that the temperatures of the surface heat dissipation fins of the first motor 801 and the second motor 901 are taken away through the exhaust screen plate 701, and the purpose of cooling the first motor 801, the second motor 901 and other elements is achieved.

When the chip packaging equipment is used, firstly, a worker switches on a power supply of the chip packaging equipment, then, a packaged plastic substrate is placed on the upper surface of a hot-pressing lower plate 302, a chip is placed on the upper surface of the plastic substrate, the lower surface of the chip is covered, then, plastic on the upper portion is directly placed in a mold groove formed in the surface of the substrate, after placement and arrangement, a sealing door 101 is closed to enable a sealing frame 102 to form sealing with a high-pressure box 1, a screw rod 105 is rotationally clamped into a fixed bayonet 103 through a rotating seat 104, a fastening screw 106 is rotated to fix the sealing door 101 and the high-pressure box 1, after fixation and sealing, a control panel 4 starts a first motor 801 to drive a vacuum suction pump 8 to operate, so that air in the high-pressure box 1 is sucked through a suction pipe 802 to enable the interior to form a vacuum state, then, the control panel 4 is controlled, the hot pressing upper plate 301 and the hot pressing lower plate 302 are enabled to simultaneously generate heat, the hydraulic pump 3 is started to enable the output end to drive the hot pressing upper plate 301 to press and weld the metal wire and the welding area together by utilizing heating and pressurizing force, the principle is that the welding area is enabled to generate plastic deformation and simultaneously an oxide layer on a pressure welding interface is damaged through heating and pressurizing force, so that the purpose of bonding is achieved by generating attraction among atoms, when the bonding is realized through heating and pressurizing, internal air is pumped out of the high-pressure box 1 through the arranged vacuum air pump 8, the inside is in a vacuum state, so that external damp gas can be prevented from being mixed into an internal non-pressed space during pressing and sealing, the phenomenon that a chip fault or short circuit is caused by the influence of moisture in the air on an internal non-pressed gap can be prevented, and the quality of chip packaging can be improved, particularly the chip packaging with high quality requirements can be used, after the encapsulation is completed, the pressure relief solenoid valve 201 is opened to enable outside air to enter the interior of the high-pressure box 1 from the pressure relief pipe 2, the second motor 901 and the sealing solenoid valve 904 are opened simultaneously, the draught fan 9 sucks gas in the interior of the high-pressure box 1 and flue gas generated by pressing, encapsulating and heating through the induced duct 902 and introduces the sucked gas into the purification box 903, then the flue gas sequentially enters the primary filter screen 908, the intermediate filter screen 907 and the activated carbon screen 906 for filtering and absorption, the purified gas after absorption is discharged through the second exhaust pipe 905, so that the flue gas is purified, harmful flue gas generated by processing is prevented from harming human health, meanwhile, when the first motor 801 and the second motor 901 work, discharged gas is respectively discharged through the first exhaust pipe 803 and the second exhaust pipe 905, the discharged gas circulates in the functional box 7 to enable the exhaust screen 701 to take away the temperature of the surface heat dissipation fins of the first motor 801 and the second motor 901, therefore, the purpose of cooling the first motor 801, the second motor 901 and other elements is achieved, and after filtering is finished, a worker can open the sealing door 101 to take out the packaged chips.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A chip packaging device is characterized in that: including high-pressure tank (1), the last fixed surface of high-pressure tank (1) is connected and is installed pressure relief pipe (2), the inside fixed mounting of high-pressure tank (1) has hydraulic pump (3), the preceding fixed surface of high-pressure tank (1) installs control panel (4), the top fixed mounting that the front surface of high-pressure tank (1) is located control panel (4) has negative pressure table (5), the last fixed surface of high-pressure tank (1) installs pilot lamp (6), the lower fixed surface of high-pressure tank (1) is installed functional box (7), the inside fixed mounting of functional box (7) has vacuum aspiration pump (8), one side fixed mounting that the inside of functional box (7) is located vacuum aspiration pump (8) has draught fan (9).

2. The chip packaging apparatus according to claim 1, wherein: the front surface of high-pressure tank (1) has seted up the work window, the front surface of high-pressure tank (1) is located one side edge position movable mounting of work window has sealing door (101), the inboard surface edge position fixed mounting of sealing door (101) has sealed frame (102), the surperficial one side fixed mounting of sealing door (101) has fixed bayonet socket (103), the front surface of high-pressure tank (1) is located the opposite side position fixed mounting of work window and has roating seat (104), the surface movable mounting of roating seat (104) has hob (105), fastening spiral (106) are installed to the surperficial spiral of hob (105).

3. The chip packaging apparatus according to claim 2, wherein: high-pressure tank (1) is through sealed frame (102) and sealing door (101) sealing connection, sealing door (101) are through hinge and high-pressure tank (1) swing joint, the surface of roating seat (104) is equipped with the rotation axis, hob (105) are through rotation axis and roating seat (104) swing joint.

4. The chip packaging apparatus according to claim 1, wherein: the surface fixed mounting of pressure release pipe (2) has pressure release solenoid valve (201), the output fixed connection of hydraulic pump (3) installs hot-pressing upper plate (301), the inside lower surface of high-pressure tank (1) is located the below fixed mounting that hot-pressing upper plate (301) has hot-pressing hypoplastron (302), pressure release pipe (2) and high-pressure tank (1) intercommunication.

5. The chip packaging apparatus according to claim 1, wherein: the utility model discloses a multifunctional ventilating device, including function case (7), the lower surface middle part fixed mounting of function case (7) has exhaust otter board (701), the front surface of function case (7) is equipped with sealed chamber door, and the surface of sealed chamber door has seted up interior knot handle, the lower surface of function case (7) is located the equal fixed mounting in four corners position and has the supporting legs.

6. The chip packaging apparatus according to claim 1, wherein: the surface of the vacuum air pump (8) is connected with and installed with a motor (801), the upper surface of the vacuum air pump (8) is fixedly connected with and installed with an air pumping pipe (802), and one side of the vacuum air pump (8) is fixedly connected with and installed with an air exhaust pipe (803).

7. The chip packaging apparatus according to claim 6, wherein: the vacuum air pump (8) penetrates through the functional box (7) through an air pumping pipe (802) and is communicated with the high-pressure box (1).

8. The chip packaging apparatus according to claim 6, wherein: a second motor (901) is fixedly connected and installed on the surface of the draught fan (9), an induced air pipe (902) is fixedly connected and installed on the upper surface of the draught fan (9), a purification box (903) is fixedly connected and installed on the surface of the induced air pipe (902), a sealing electromagnetic valve (904) is fixedly connected and installed above the purification box (903) on the surface of the induced air pipe (902), a second exhaust pipe (905) is fixedly installed on the surface of one side of the draught fan (9), an active carbon screen plate (906) is fixedly embedded and installed inside the purification box (903), an intermediate-effect filter screen (907) is fixedly embedded and installed above the active carbon screen plate (906) inside the purification box (903), an initial-effect filter screen (908) is fixedly embedded and installed above the intermediate-effect filter screen (907) inside the purification box (903), and an upper end cover (909) is fixedly installed on the upper surface of the purification box (903), sealing gasket rings (9010) are arranged at the edges of the surfaces among the activated carbon mesh plate (906), the intermediate-effect filter screen (907) and the primary-effect filter screen (908).

9. The chip packaging apparatus according to claim 8, wherein: draught fan (9) pass function case (7) and high-pressure tank (1) intercommunication through induced duct (902), a motor (801) with the equal fixed mounting in surface of No. two motors (901) has radiating fin, upper end cover (909) are through hinge and purge tank (903) swing joint, upper end cover (909) are through set screw and sealing washer ring (9010) and purge tank (903) fixed seal.