CN111693739B - Solder joint structure of crystal oscillator test tool seat - Google Patents
Solder joint structure of crystal oscillator test tool seat Download PDFInfo
- Publication number
- CN111693739B CN111693739B CN202010431376.3A CN202010431376A CN111693739B CN 111693739 B CN111693739 B CN 111693739B CN 202010431376 A CN202010431376 A CN 202010431376A CN 111693739 B CN111693739 B CN 111693739B
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- test
- card
- seat
- mounting hole
- test card
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
Abstract
The invention discloses a soldering connection structure of a crystal oscillator test tool seat in the technical field of crystal oscillator test tool seats, which comprises a test card, wherein the upper end surface of the test card is provided with a test seat mounting hole, a test seat pin is inserted in the test seat mounting hole, one side of the test seat pin is provided with a test card bonding pad, a soldering tin for soldering is arranged between the test seat pin and the test card bonding pad, the test card bonding pad is fixedly connected at the position of the upper end surface of the test card close to the test seat mounting hole, the test seat pin protrudes out of the test seat mounting hole, the number of the test card bonding pad and the number of the test seat mounting hole are the same, one of the test card bonding pad and the test seat mounting hole corresponds to the other, a second pin is arranged between one end of the soldering tin for soldering and the test card bonding pad, a structure without a tin through hole is arranged on the test seat pin, the adjacent connection of the test card bonding pad structure is convenient for mounting and fixing the test seat pin, and nondestructive connection points can be conveniently removed when the test seat pin is maintained and disassembled, therefore, the contact pin of the test socket can be replaced quickly, the contact surface is large, and the heat dissipation is quick.
Description
Technical Field
The invention relates to the technical field of crystal oscillator test tool bases, in particular to a soldering connection structure of a crystal oscillator test tool base.
Background
The crystal oscillator is taken as the heart of the electronic equipment, and the importance degree in the equipment is self-evident; along with the development of the technology, the crystal oscillator is gradually pasted and miniaturized, so that higher requirements are met on a connecting structure of a test tool, the existing test seat is installed on a test board card, a test seat needle is directly welded into a test card installation hole, when the test seat needs to be maintained and replaced, welded welding pads need to be sucked and welded one by one, soldering tin is removed, the test seat can be taken down, the operation is difficult, the welding pads are easy to damage, the soldering tin is arranged in the test card installation hole, the heat dissipation effect of the device is also hindered in the using process, and the defect exists in the use.
Disclosure of Invention
The invention aims to provide a soldering connection structure of a crystal oscillator test tool seat, which aims to solve the problems that soldering pads are required to be sucked and soldered one by one, soldering tin is removed, and then the test seat can be taken down, so that the operation is difficult and the soldering pads are easy to damage.
In order to achieve the purpose, the invention provides the following technical scheme: the lapping tin connection structure of the crystal oscillator test tool base comprises a test card, wherein a test base mounting hole is formed in the upper end face of the test card, a test base contact pin is inserted into the test base mounting hole in an inserting mode, a test card bonding pad is arranged on one side of the test base contact pin, and lapping welding tin is arranged between the test base contact pin and the test card bonding pad.
Preferably, the test card bonding pad is fixedly connected to the position, close to the test seat mounting hole, of the upper end face of the test card, and the test seat pin protrudes out of the test seat mounting hole.
Preferably, the number of the test card pads is the same as that of the test socket mounting holes, and one of the test card pads corresponds to one of the test socket mounting holes.
Preferably, a second welding leg is arranged between one end of the lap welding soldering tin and the testing card welding pad, and a first welding leg is arranged between the other end of the lap welding soldering tin and the testing seat contact pin.
Preferably, the lap welding soldering tin is fixedly connected with the test socket contact pin and the test card welding disc through the first welding leg and the second welding leg respectively.
Preferably, the area of the upper end surface of the test card pad is larger than the area of one end surface of the lap welding soldering tin.
Compared with the prior art, the invention has the beneficial effects that: when the test socket contact pin needs to be taken down for maintenance, the test socket contact pin is not directly connected with the inside of the test socket mounting hole in a soldering manner, and only the lap welding soldering tin on the plane of the test card needs to be fused, so that the soldering tin in the test socket mounting hole does not need to be absorbed, the test socket is very easy to replace, the test socket contact pin is provided with a tin-free via hole structure, the adjacent test card pad structure is connected, and the test socket contact pin is convenient to mount and fix through the tin-free via hole; and be connected test seat contact pin and test card through the mode of taking tin, take off when easy to assemble and maintenance and change the test seat contact pin, the maintainability of reinforcing crystal oscillator test fixture can conveniently be harmless when the test seat contact pin is dismantled in the maintenance and demolish the tie point to swiftly change the test seat contact pin, the contact surface is big, and the heat dissipation is fast.
Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a view of the combination of the test card and the mounting hole of the test socket;
FIG. 3 is a combination view of a test card pad and socket pins according to the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. a test card; 2. a test seat mounting hole; 3. testing a card pad; 4. a test socket pin is inserted; 5. lap welding tin soldering; 6. a first solder tail; 7. a second solder tail.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 3, the present invention provides a solder joint structure for a crystal oscillator test tool seat, which comprises: the soldering connecting structure of the crystal oscillator test tool base comprises a test card 1, wherein a test base mounting hole 2 is formed in the upper end face of the test card 1, a test base pin 4 is inserted into the test base mounting hole 2, a test card pad 3 is arranged on one side of the test base pin 4, a soldering tin 5 is arranged between the test base pin 4 and the test card pad 3, the test base pin 4 is not directly connected with the inside of the test base mounting hole 2 in a soldering manner, and only the soldering tin 5 on the plane of the test card is required to be fused, so that soldering tin in the test base mounting hole 2 is not required to be absorbed, the test base is very easy to replace, a tin-free through hole structure is arranged on the test base pin 4, the test card pad 3 structures are adjacently connected, and the test base pin 4 is convenient to mount and fix through the tin-free through holes; and be connected test seat contact pin 4 and test card 1 through the mode of taking tin, take off when easy to assemble and maintenance and change test seat contact pin 4, the maintainability of reinforcing crystal oscillator test fixture can conveniently be harmless when dismantling test seat contact pin 4 in the maintenance demolishs the tie point to swiftly change test seat contact pin 4, the contact surface is big, and the heat dissipation is fast.
The test card pad 3 is fixedly connected to the position, close to the test seat mounting hole 2, of the upper end face of the test card 1, and the test seat pin 4 protrudes out of the test seat mounting hole 2, so that the lap welding soldering tin 5 can be conveniently connected, welded and fixed.
The number of the test card bonding pads 3 is the same as that of the test seat mounting holes 2, one of the test card bonding pads corresponds to one of the test seat mounting holes, and the test seat pins 4 can be dismounted in a damage-free mode through each test seat mounting hole 2.
A second leg 7 is arranged between one end of the lap welding soldering tin 5 and the testing card pad 3, a first leg 6 is arranged between the other end of the lap welding soldering tin 5 and the testing seat pin 4, and the two ends of the lap welding soldering tin 5 are connected.
The lap welding soldering tin 5 is respectively fixedly connected with the test socket contact pin 4 and the test card bonding pad 3 through the first bonding leg 6 and the second bonding leg 7, and the test card bonding pad 3 and the test socket contact pin 4 are arranged in a stable triangle mode, so that the stability of the test card bonding pad is guaranteed.
The area of the upper end face of the test card welding plate 3 is larger than the area of one end face of the lap welding soldering tin 5, and therefore workers can fix the lap welding soldering tin conveniently.
One specific application of this embodiment is: when the device is installed and used, the test socket pin 4 can be inserted into the test socket mounting hole 2, then the lap welding soldering tin 5 is arranged between the test card pad 3 and the test socket pin 4, then the two ends of the lap welding soldering tin 5 are respectively fixed on the test socket pin 4 and the test card pad 3 through the first pin 6 and the second pin 7, at the moment, the lap welding soldering tin 5, the test card pad 3 and the test socket pin 4 are arranged in a stable triangle shape, the test socket pin 4 can be fixed, when the test socket pin 4 needs to be taken down in maintenance, because the test socket pin 4 is not directly connected with the inside of the test socket mounting hole 2 in a soldering way, only the lap welding soldering tin 5 on the plane of the test card needs to be fused, the soldering tin in the test socket mounting hole 2 does not need to be sucked, the test socket is very easy to be replaced, the test socket pin 4 is provided with a tin-free through hole structure, and the adjacent test card pad 3 structure is connected, through the tin-free through hole, the pin 4 of the test socket is convenient to mount and fix; and be connected test seat contact pin 4 and test card 1 through the tinning mode, take off when easy to assemble and maintenance and change test seat contact pin 4, the maintainability of reinforcing crystal oscillator test fixture can conveniently be harmless when test seat contact pin 4 is dismantled in the maintenance and demolish the tie point to swiftly change test seat contact pin 4, the contact surface is big, and the heat dissipation is fast.
In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (5)
1. The scrap tin connection structure of the crystal oscillator test tool seat is characterized in that: including test card (1), test seat mounting hole (2) have been seted up to the up end of test card (1), and the inside grafting of test seat mounting hole (2) has test seat contact pin (4), one side of test seat contact pin (4) is provided with test card pad (3), and is provided with between test seat contact pin (4) and test card pad (3) overlap welding soldering tin (5), test card pad (3) fixed connection is in the position that test card (1) up end is close to test seat mounting hole (2), test seat contact pin (4) salient in test seat mounting hole (2).
2. The soldering connection structure of the crystal oscillator test tool base according to claim 1, characterized in that: the number of the test card welding pads (3) is the same as that of the test seat mounting holes (2), and one of the test card welding pads corresponds to one of the test seat mounting holes.
3. The soldering connection structure of the crystal oscillator test tool base according to claim 1, characterized in that: a second welding leg (7) is arranged between one end of the lap welding soldering tin (5) and the testing card welding pad (3), and a first welding leg (6) is arranged between the other end of the lap welding soldering tin (5) and the testing base contact pin (4).
4. The bonding connection structure of the crystal oscillator test tool base according to claim 3, characterized in that: the lap welding soldering tin (5) is fixedly connected with the test socket contact pin (4) and the test card pad (3) through the first welding leg (6) and the second welding leg (7) respectively.
5. The solder joint structure of the crystal oscillator test tool base according to claim 3, wherein: the area of the upper end face of the test card welding pad (3) is larger than that of one end face of the lap welding soldering tin (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010431376.3A CN111693739B (en) | 2020-05-20 | 2020-05-20 | Solder joint structure of crystal oscillator test tool seat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010431376.3A CN111693739B (en) | 2020-05-20 | 2020-05-20 | Solder joint structure of crystal oscillator test tool seat |
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| Publication Number | Publication Date |
|---|---|
| CN111693739A CN111693739A (en) | 2020-09-22 |
| CN111693739B true CN111693739B (en) | 2022-07-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010431376.3A Active CN111693739B (en) | 2020-05-20 | 2020-05-20 | Solder joint structure of crystal oscillator test tool seat |
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| CN (1) | CN111693739B (en) |
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| JPS59103275A (en) * | 1983-11-14 | 1984-06-14 | Matsushita Electric Ind Co Ltd | Battery socket |
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| CN208188288U (en) * | 2018-06-11 | 2018-12-04 | 南京尤尼泰信息科技有限公司 | A kind of test plate suitable for plurality of specifications crystal oscillator |
| CN109490738A (en) * | 2018-11-05 | 2019-03-19 | 南京中电熊猫晶体科技有限公司 | A kind of measuring device of crystal oscillator diode characteristic |
| CN110524083A (en) * | 2019-08-20 | 2019-12-03 | 中国航空工业集团公司西安飞行自动控制研究所 | A kind of automation for QFN device goes metal working to fill and go golden method |
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| US7759949B2 (en) * | 2004-05-21 | 2010-07-20 | Microprobe, Inc. | Probes with self-cleaning blunt skates for contacting conductive pads |
| CN102544884B (en) * | 2011-12-23 | 2015-04-01 | 富士康(昆山)电脑接插件有限公司 | Electric connector, electric connector casing and surface treatment method of electric connector casing |
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2020
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| CN202918586U (en) * | 2012-11-15 | 2013-05-01 | 佛山市顺德区顺达电脑厂有限公司 | Pull-button type structure for connecting pad and through hole |
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| CN107800399A (en) * | 2017-10-23 | 2018-03-13 | 郑州云海信息技术有限公司 | A kind of anti-tampering crystal oscillator mounting structure and installation method |
| CN208188288U (en) * | 2018-06-11 | 2018-12-04 | 南京尤尼泰信息科技有限公司 | A kind of test plate suitable for plurality of specifications crystal oscillator |
| CN109490738A (en) * | 2018-11-05 | 2019-03-19 | 南京中电熊猫晶体科技有限公司 | A kind of measuring device of crystal oscillator diode characteristic |
| CN110524083A (en) * | 2019-08-20 | 2019-12-03 | 中国航空工业集团公司西安飞行自动控制研究所 | A kind of automation for QFN device goes metal working to fill and go golden method |
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| CN111693739A (en) | 2020-09-22 |
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