CN111683485B - Processing method and electronic equipment - Google Patents
Processing method and electronic equipment Download PDFInfo
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- CN111683485B CN111683485B CN202010609905.4A CN202010609905A CN111683485B CN 111683485 B CN111683485 B CN 111683485B CN 202010609905 A CN202010609905 A CN 202010609905A CN 111683485 B CN111683485 B CN 111683485B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
Abstract
The embodiment of the application provides a processing method and electronic equipment, wherein the processing method comprises the following steps: in the first process space, an oxide layer is formed on the first surface of the electronic equipment, then, in the first process space, an anti-fingerprint film layer is formed on the surface of one side, away from the first surface of the electronic equipment, of the oxide layer, so that the processing time from the oxide layer to the anti-fingerprint film layer sequentially formed on the first surface of the electronic equipment is reduced, the product supply period of products is shortened, and the anti-fingerprint effect of the electronic equipment can be effectively improved due to the fact that the anti-fingerprint film layer is provided with a plurality of protrusions.
Description
Technical Field
The present disclosure relates to the field of manufacturing technologies, and in particular, to a processing method and an electronic device using the processing method.
Background
With the continuous development of electronic technology, more and more housings of the existing electronic devices are made of metal materials to improve the texture of the housings of the electronic devices. However, when the existing electronic device with a metal shell is used, various stains caused by fingerprints are easily left on the metal shell, and the user experience is affected.
Disclosure of Invention
In a first aspect, an embodiment of the present application provides a processing method, including:
forming an oxide layer on a first surface of the electronic device in the first process space;
and continuously forming an anti-fingerprint film layer on the surface of one side, deviating from the first surface of the electronic equipment, of the oxide layer in the first process space, wherein the anti-fingerprint film layer is provided with a plurality of bulges.
Optionally, after the oxide layer is formed and before the anti-fingerprint film layer is formed, the method further includes:
in the first process space, a sealing layer is formed on one side surface, away from the first surface of the electronic equipment, of the oxidation layer, and the anti-fingerprint film layer is formed on one side surface, away from the first surface of the electronic equipment, of the sealing layer.
Optionally, forming the anti-fingerprint film layer on a side surface of the sealing layer facing away from the first surface of the electronic device includes:
adding a first material with a negative potential to a solvent to obtain a solution comprising the first material;
placing the first surface of the electronic device after forming the sealing layer into the solution comprising the first material;
applying a positive potential to the first surface of the electronic device and a negative potential to the solution comprising the first material, growing an anti-fingerprint film layer on a surface of the sealing layer facing away from the first surface of the electronic device.
Optionally, before adding the first material with negative potential to the solvent to obtain the solution comprising the first material, the method further comprises:
the first material is electrochemically treated such that the first material has a negative potential.
Optionally, the first material is a fluoropolyether material.
Optionally, the forming an oxide layer on the first surface of the electronic device includes:
and forming an oxide layer on the first surface of the electronic device by using an anodic oxidation process.
Optionally, after the formation of the oxide layer and before the formation of the sealing layer, the method further includes:
in the first process space, a dyeing layer is formed on one side, away from the first surface of the electronic device, of the oxidation layer, and the sealing layer is formed on one side, away from the oxidation layer, of the dyeing layer.
In a second aspect, an embodiment of the present application provides an electronic device, where an oxide layer is formed on a first surface of the electronic device, and a side of the oxide layer, which faces away from the first surface of the electronic device, is formed with an anti-fingerprint film layer, where the anti-fingerprint film layer has a plurality of protrusions;
wherein the oxide layer and the anti-fingerprint film layer are formed in the same process space.
Optionally, the material of the protrusion is a fluoropolyether material.
Optionally, the method further includes: the anti-fingerprint film layer is arranged on the surface of the substrate and is provided with an oxidation layer, a dyeing layer and a sealing layer, wherein the dyeing layer is arranged between the oxidation layer and the anti-fingerprint film layer, and the sealing layer is arranged between the dyeing layer and the anti-fingerprint film layer.
In the processing method that this application embodiment provided, the oxide layer with anti fingerprint rete is all in form in the first process space, thereby make on the basis that the electronic equipment first surface has anti fingerprint effect, need not shift the workshop, reduced the transit time, avoided at the transfer in-process electronic equipment's surface can be by the problem of tiny particle pollution such as dust in the air, flock, consequently, form behind the oxide layer, form before the anti fingerprint rete, need not be right again electronic equipment's surface is washd, plasma polishing to reduce again the time of technologies such as washing, plasma polishing, production cycle is shorter, thereby has effectively shortened the supply cycle of product.
Moreover, the anti-fingerprint film layer is provided with a plurality of bulges, so that when a target object such as a finger is contacted, the contact area of the anti-fingerprint film layer and the target object can be reduced, the adhesion capacity of dirt such as the fingerprint is reduced, and the anti-fingerprint effect of the first surface of the electronic equipment is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a flow chart of a processing method provided by the prior art;
FIG. 2 is a flowchart of a processing method according to an embodiment of the present application;
fig. 3-6 are schematic structural diagrams illustrating a first surface of the electronic device after forming a structure of each film layer in a processing method according to an embodiment of the present disclosure;
FIG. 7 is a top view of an electronic device provided in an embodiment of the present application;
fig. 8 is a cross-sectional view of an electronic device provided in an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, but the present application may be practiced in other ways than those described herein, and it will be apparent to those of ordinary skill in the art that the present application is not limited to the specific embodiments disclosed below.
As described in the background section, the existing electronic device with a metal housing is prone to leave various fingerprints on the metal housing thereof when in use, which affects the user experience.
The inventor researches and discovers that the fingerprint resistance of the surface of the electronic equipment can be improved by spraying a layer of fingerprint-resistant paint on the surface of the electronic equipment, and as shown in fig. 1, the method specifically comprises the following steps:
firstly, forming an anodic oxidation layer on the surface of electronic equipment in an anodic oxidation process workshop, and sealing and baking the anodic oxidation layer; and then, transferring the electronic equipment with the anodic oxidation layer to a spraying workshop, cleaning and plasma polishing the surface of the electronic equipment with the anodic oxidation layer in the spraying workshop, spraying at least one anti-fingerprint paint layer on the surface of the anodic oxidation layer, and baking each paint layer at 90 ℃ for 90 minutes to solidify the anti-fingerprint paint layer to form an anti-fingerprint film layer.
However, in the above method, an anodic oxidation layer is formed on the surface of the electronic device in an anodic oxidation process workshop, and then the electronic device is transferred to a spraying workshop, and an anti-fingerprint paint layer is sprayed on the surface of the anodic oxidation layer, compared with the case that only the anodic oxidation layer is formed, an anti-fingerprint film layer is not formed, so that the transportation time is increased, and in the transferring process, the surface of the electronic device may be polluted by fine particles such as dust, swarf and the like in the air, so that the surface of the electronic device needs to be cleaned and plasma polished again before the anti-fingerprint paint layer is sprayed, and thus the time of the processes such as cleaning and plasma polishing is increased, the production cycle is longer, and the product supply period is long.
In addition, when the anti-fingerprint paint layer is sprayed, the spraying process is a nano spraying process, and multiple spraying and baking are needed during specific implementation to form a good anti-fingerprint effect, so that the process cost is very high, the cost of the method is high, and the cost of the product is high.
Moreover, the anti-fingerprint paint is not only high in cost, but also is mostly transparent paint, any flaws (such as dust, flock and other particles in the spraying process) in the spraying process can be visible in the appearance of the electronic equipment, the appearance of the electronic equipment is influenced, and the yield is low.
In view of this, embodiments of the present application provide a processing method and an electronic device, so as to effectively improve the fingerprint resistance of the surface of the electronic device and improve user experience. The processing method and the electronic device provided by the embodiment of the application are described below with reference to the drawings.
As shown in fig. 2, a processing method provided in the embodiment of the present application includes:
s10: as shown in fig. 3, an oxide layer 20 is formed on a first surface of the electronic device 10 in the first process space.
In this embodiment, forming an oxide layer on the first surface of the electronic device includes forming an oxide layer on the first surface of the housing of the electronic device, where the first surface of the housing of the electronic device may be any surface of the housing of the electronic device.
Specifically, in an embodiment of the present application, the electronic device is a notebook computer, the first surface of the electronic device may be an a surface of the electronic device, and may also be a C surface of the electronic device, specifically, the electronic device includes a display screen and a device main body that are rotatably connected, the a surface of the electronic device is that the display screen deviates from a side surface of the device main body, and the C surface of the electronic device is that the device main body faces a side surface of the display screen, that is, a surface on one side of a keyboard.
In another embodiment of the present application, the electronic device is a mobile communication device such as a mobile phone or a tablet, and the first surface of the electronic device may be a rear housing surface of the electronic device; in other embodiments of the present application, the electronic device may further include a television, a refrigerator, and other household appliances, and the first surface of the electronic device is any surface of the casing of the electronic device exposed outside.
Optionally, on the basis of the foregoing embodiment, in an embodiment of the present application, the housing of the electronic device is a metal housing, and optionally an aluminum housing, and in the embodiment of the present application, the forming an oxide layer on the first surface of the electronic device includes: and forming an oxide layer on the first surface of the electronic equipment by using an anodic oxidation process so as to improve the metallic luster of the first surface of the electronic equipment. However, the present application is not limited thereto, and in other embodiments of the present application, other forming processes may be adopted to form the oxide layer on the first surface of the electronic device, as the case may be.
It should be noted that in the embodiments of the present application, the anodic oxidation refers to electrochemical oxidation of metal or alloy, for example, aluminum and its alloy form an oxide film on the aluminum product (anode) under the action of the corresponding electrolyte and specific process conditions due to the applied current.
It should be noted that, in order to ensure the cleanliness of the first surface of the electronic device, on the basis of the foregoing embodiments, in an embodiment of the present application, the method further includes, before forming an oxide layer on the first surface of the electronic device: and performing acid cleaning and/or alkali cleaning on the first surface of the electronic equipment, namely performing acid cleaning and/or alkali cleaning on the first surface of the metal shell of the electronic equipment to remove impurities such as dust on the first surface of the electronic equipment, so as to improve the quality of an oxide layer formed on the first surface of the electronic equipment subsequently.
S20: as shown in fig. 4, continuing to form an anti-fingerprint film layer 30 on a side surface of the oxide layer 20 facing away from the first surface of the electronic device in the first process space, the anti-fingerprint film layer 30 has a plurality of protrusions.
It should be noted that, in the embodiment of the present application, the anti-fingerprint film layer has a plurality of protrusions, so that when a target object such as a finger is contacted, a contact area between the anti-fingerprint film layer and the target object can be reduced, an adhesion capability of stains such as the fingerprint is reduced, and an anti-fingerprint effect of the first surface of the electronic device is improved.
In the embodiment of this application, the oxide layer with anti fingerprint rete is all in form in the first process space, thereby make on the basis that electronic equipment first surface has anti fingerprint effect, need not shift the workshop, reduced the transit time, avoided at the transfer in-process electronic equipment's surface can be by the problem of tiny particle pollution such as dust in the air, flock, consequently, is forming behind the oxide layer, form before the anti fingerprint rete, need not be right again electronic equipment's surface is washd, plasma polishing to the time of processes such as washing, plasma polishing has been reduced again, and production cycle is shorter, thereby has effectively shortened the supply period of product.
On the basis of the above embodiment, in an embodiment of the present application, the anti-fingerprint film layer is formed by a dye having an anti-fingerprint effect, so that the anti-fingerprint film layer has a certain color on the basis of the anti-fingerprint effect, thereby avoiding the problem of the reduction of the yield of the electronic device caused by the flaws on the surface of the anti-fingerprint film layer.
Moreover, the price of the anti-fingerprint dye is lower, so that the cost of the shell of the electronic equipment is lower, and the cost of the electronic equipment is reduced.
In view of the above, the processing method provided by the embodiment of the application can form the anti-fingerprint film layer on the first surface of the electronic device, so that the first surface of the electronic device has an anti-fingerprint effect, and the processing method has the advantages of short supply cycle, low cost and high yield.
On the basis of any one of the above embodiments, in an embodiment of the present application, after the formation of the oxide layer and before the formation of the anti-fingerprint film layer, the method further includes:
as shown in fig. 5, in the first process space, a sealing layer 22 is formed on a side surface of the oxide layer 20 away from the first surface of the electronic device 10, and the anti-fingerprint film layer 30 is formed on a side surface of the sealing layer 22 away from the first surface of the electronic device 10, so that the oxide layer is protected by the sealing layer, and the oxide layer and/or a metal shell of the electronic device are prevented from being corroded by moisture and oxygen in an external environment. .
Optionally, on the basis of the foregoing embodiment, in an embodiment of the present application, a thickness value range of the sealing layer is 1um to 2um, including an end point value, so as to reduce the thickness of the sealing layer on the basis of ensuring an effect of the sealing layer for isolating moisture and oxygen, thereby reducing the thickness of the electronic device, adapting to development of lightness and thinness of the electronic device, and reducing an influence of the sealing layer on an appearance color of the first surface of the electronic device.
On the basis of any one of the foregoing embodiments, in an embodiment of the present application, in the first process space, the forming of the anti-fingerprint film layer on a side surface of the oxide layer facing away from the first surface of the electronic device includes: and in the first process space, a dipping process is adopted, and an anti-fingerprint film layer is grown on the surface of one side of the sealing layer, which is far away from the first surface of the electronic equipment.
On the basis of the above embodiments, in an embodiment of the present application, the forming process of the anti-fingerprint film layer is an electrochemical treatment process, so as to reduce the process cost when the anti-fingerprint film layer is formed, thereby further reducing the cost of the housing of the electronic device.
On the basis of the above embodiment, in an embodiment of the present application, the forming of the anti-fingerprint film layer on a side surface of the sealing layer facing away from the first surface of the electronic device includes:
adding a first material having a negative potential to a solvent to obtain a solution comprising the first material;
placing the first surface of the electronic device after the sealing layer is formed into the solution comprising the first material;
applying a positive potential to the first surface of the electronic device and applying a negative potential to the solution comprising the first material, so as to grow an anti-fingerprint film layer on a surface of the sealing layer on a side facing away from the first surface of the electronic device, using an electric field formed between the positive potential of the first surface and the negative potential in the solution.
Optionally, on the basis of the foregoing embodiment, in an embodiment of the present application, before adding the first material with negative potential to the solvent to obtain the solution including the first material, the method further includes:
and electrochemically treating the first material so that the first material has a negative potential to facilitate subsequent application of a positive potential to the first surface of the electronic device, wherein when a solution comprising the first material is applied with a negative potential, the first material moves towards the first surface of the electronic device to increase the adhesion of the first material, thereby benefiting the growth of an anti-fingerprint film layer on the surface of the sealing layer facing away from the first surface of the electronic device.
It should be noted that, in an embodiment of the present application, the solvent is water, but the present application is not limited thereto, and in other embodiments of the present application, the solvent may also be other solutions, and it is only necessary to ensure that the solvent has conductivity, so that the first material with a negative potential is added to the solvent, and a positive potential is applied to the first surface of the electronic device, and after the negative potential is applied to the solution including the first material, the first material in the solution including the first material may move to the first surface of the electronic device, and an anti-fingerprint film layer is formed on a surface of the sealing layer on a side facing away from the first surface of the electronic device.
On the basis of the above embodiments, in one embodiment of the present application, the first material is a fluoropolyether material, but the present application is not limited thereto, and in other embodiments of the present application, the first material may also be other types of materials as long as the first material is ensured to have the anti-fingerprint effect, and the anti-fingerprint film layer can be formed on the first surface of the electronic device after the negative potential is applied.
Optionally, in an embodiment of the present application, the first material is in a powder form, so that the solution including the first material can be obtained only by mixing the first material in a solvent after the first material is negatively charged, and the process is very simple.
Moreover, in the above embodiment, when the first material with a negative potential is added to the solvent to obtain the solution including the first material, only a small amount of the first material needs to be added, that is, the requirement for forming the anti-fingerprint film layer on the first surface of the electronic device subsequently is met, so that the amount of the first material used is small, and the cost is low.
In addition, in this application embodiment, when the first surface of the electronic device is formed with the anti-fingerprint film layer by using the electrochemical treatment process, the first surface of the electronic device can be formed with the anti-fingerprint film layer only by immersing the first surface of the electronic device in the solution containing the first material, and then applying the positive potential to the first surface of the electronic device and applying the negative potential to the solution containing the first material for the preset time, without repeatedly immersing the first surface of the electronic device in the solution containing the first material, and repeating the process, so that the process flow is simplified, and the problem that the yield of the anti-fingerprint film layer is affected by impurities such as dust and flock in the internal formation process of the anti-fingerprint film layer is avoided.
It should be noted that, when the electrochemical treatment process is used to form the anti-fingerprint film layer on the first surface of the electronic device, even if dust, lint, or the like falls into the solution containing the first material, the dust, lint, or the like is uncharged, when the electrochemical treatment process is used to form the anti-fingerprint film layer on the first surface of the electronic device, the dust, lint, or the like will not move toward the first surface of the electronic device, and therefore, impurities such as dust, lint, or the like will not be contaminated inside the anti-fingerprint film layer, which improves the yield of the anti-fingerprint film layer, and improves the yield of the electronic device
On the basis of any of the foregoing embodiments, in an embodiment of the present application, the growing process of the anti-fingerprint film layer is an in-situ growing process, that is, in this embodiment, applying a positive potential to the first surface of the electronic device and applying a negative potential to the solution including the first material, so that growing the anti-fingerprint film layer on the surface of the sealing layer on the side facing away from the first surface of the electronic device by using an electric field formed between the positive potential of the first surface and the negative potential in the solution includes: applying a positive potential to the first surface of the electronic device and applying a negative potential to the solution comprising the first material, so as to grow an anti-fingerprint film layer in-situ on a surface of the sealing layer at a side facing away from the first surface of the electronic device, by means of an electric field formed between the positive potential of the first surface and the negative potential in the solution, so as to improve the bonding strength of the anti-fingerprint film layer and the sealing layer. However, the present application is not limited thereto, as the case may be.
It should be noted that, with the development of electronic technology, users have higher and higher requirements for the appearance color of electronic devices, and electronic devices with a single appearance color have been gradually unable to meet diversified appearance requirements. Therefore, on the basis of any one of the above embodiments, in an embodiment of the present application, after the formation of the oxide layer and before the formation of the sealing layer, the method further includes:
as shown in fig. 6, in the first process space, a dyed layer 21 is formed on one side of the oxide layer 20 away from the first surface of the electronic device 10, and the sealing layer 22 is formed on one side of the dyed layer 21 away from the oxide layer 20, so as to enrich the appearance color of the first surface of the electronic device by using the dyed layer, thereby satisfying the diversified appearance requirements of users and improving the user experience.
It should be noted that, in the embodiment of the present application, the dyed layer may be any color, but the application does not limit this, which is determined according to the needs of the user. Moreover, when the dyeing layer is a dark dyeing layer, even if the sealing layer and/or the anti-fingerprint film layer formed subsequently have certain flaws, the dyeing layer also has a certain visual shielding effect, so that the flaws are not easy to see, and the yield of the electronic equipment is improved.
On the basis of any one of the above embodiments, in an embodiment of the present application, the processing method further includes:
after the anti-fingerprint film layer 30 is formed on the side surface of the sealing layer 22 away from the first surface of the electronic device in the first process space, the first surface of the electronic device is continuously baked in the first process space, so that the film structures formed on the side surface of the first surface of the electronic device are firmer.
It should be noted that, when the forming process of the oxide layer on the first surface of the electronic device is an anodic oxidation process, and the formation of the oxide layer, the formation of the sealing layer, and the subsequent baking process are all necessary processes in the processing process flow of the first surface of the electronic device, it can be seen that, in the processing method provided in the embodiment of the present application, compared with the anodic oxidation process flow, only one process of forming the anti-fingerprint film layer is added, which has no influence on the original supply cycle and is low in cost.
To sum up, in the processing method that this application embodiment provided, the oxide layer with anti fingerprint rete is all in form in the first process space, thereby make on the first surface of electronic equipment has the basis of anti fingerprint effect, need not shift the workshop, reduced the transit time, avoided in shift process the surface of electronic equipment can be by the problem of tiny particle pollution such as dust in the air, flock, consequently, form behind the oxide layer, form before anti fingerprint rete, need not be right again electronic equipment's surface is washd, plasma polishing to reduce the time of technologies such as washing, plasma polishing again, production cycle is shorter, thereby has effectively shortened the supply period of product.
Moreover, the anti-fingerprint film layer is provided with a plurality of bulges, so that when a target object such as a finger is contacted, the contact area of the anti-fingerprint film layer and the target object can be reduced, the dirt adhesion capability of the fingerprint and the like is reduced, and the anti-fingerprint effect of the first surface of the electronic equipment is improved.
Correspondingly, the embodiment of the application also provides an electronic device, which can be a mobile phone, a tablet, a notebook computer and the like, but the electronic device is not limited in the application and is determined according to the situation.
Specifically, as shown in fig. 7 and fig. 8, fig. 7 is a top view and fig. 8 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure, in the embodiment of the present disclosure, an oxide layer 20 is formed on a first surface of the electronic device 10, and an anti-fingerprint film layer 30 is formed on a side of the oxide layer 20 away from the first surface of the electronic device 10, so that the first surface of the electronic device has an anti-fingerprint effect.
In this embodiment, forming an oxide layer on the first surface of the electronic device includes forming an oxide layer on the first surface of the housing of the electronic device, where the first surface of the housing of the electronic device may be any surface of the housing of the electronic device.
Specifically, in an embodiment of the present application, the electronic device is a notebook computer, the first surface of the electronic device may be an a surface of the electronic device, and may also be a C surface of the electronic device, specifically, the electronic device includes a display screen and a device main body that are rotatably connected, the a surface of the electronic device is the display screen deviates from a side surface of the device main body, and the C surface of the electronic device is the device main body facing the side surface of the display screen, that is, the surface on one side of the keyboard.
In another embodiment of the present application, the electronic device is a mobile communication device such as a mobile phone or a tablet, and the first surface of the electronic device may be a rear housing surface of the electronic device; in other embodiments of the present application, the electronic device may be a household appliance such as a television, a refrigerator, or the like, and the first surface of the electronic device is any surface of the casing of the electronic device exposed outside.
Optionally, on the basis of the foregoing embodiment, in an embodiment of the present application, the housing of the electronic device is a metal housing, and specifically may be an aluminum housing, and correspondingly, the forming process of the oxide layer may be an anodic oxidation process, but the present application does not limit this process, and the process is specifically determined as the case may be.
It should be noted that, in the embodiment of the present application, the anti-fingerprint film layer has a plurality of protrusions, so that when the first surface of the electronic device contacts a target object such as a finger, a contact area between the anti-fingerprint film layer and the target object may be reduced, an adhesion capability of dirt such as the fingerprint may be reduced, and an anti-fingerprint effect of the first surface of the electronic device may be improved.
Moreover, in this embodiment, the oxide layer and the anti-fingerprint film layer are formed in the same process space, so that on the basis that the first surface of the electronic device has the anti-fingerprint effect, a transfer workshop is not required, the transportation time is reduced, and the problem that the surface of the electronic device may be polluted by fine particles such as dust, flock and the like in the air in the transfer process is avoided.
On the basis of the above embodiment, in an embodiment of the present application, the anti-fingerprint film layer is formed by a dye having an anti-fingerprint effect, so that the anti-fingerprint film layer has a certain color on the basis of having the anti-fingerprint effect, thereby avoiding a problem that the yield of the electronic device is reduced due to defects on the surface of the anti-fingerprint film layer.
Moreover, the price of the anti-fingerprint dye is lower, so that the cost of the shell of the electronic equipment is lower, and the cost of the electronic equipment is reduced.
On the basis of the above embodiments, in an embodiment of the present application, the material of the fingerprint-resistant film layer-summarizing protrusion is a fluoropolyether material, so as to improve the fingerprint-resistant effect of the protrusion, but the present application does not limit this, and the present application is determined as the case may be.
On the basis of any of the above embodiments, in an embodiment of the present application, with continued reference to fig. 8, the electronic device further includes: lie in oxide layer 20 with dye layer 21 between anti fingerprint rete 30, in order to utilize dye layer is abundant the outward appearance colour of electronic equipment's first surface satisfies user diversified outward appearance demand, improves user experience.
It should be noted that, in the embodiment of the present application, the dyed layer may be any color, but the application does not limit this, which is determined according to the needs of the user. Moreover, when the dyeing layer is a dark dyeing layer, even if the subsequently formed anti-fingerprint film layer has certain flaws, the dyeing layer also has a certain visual shielding effect, so that the flaws are not easy to see, and the yield of the electronic equipment is improved.
On the basis of the above embodiment, in an embodiment of the present application, with continued reference to fig. 8, the electronic device further includes: and the sealing layer 22 is positioned between the dyeing layer 21 and the anti-fingerprint film layer 30, so that the oxidation layer and the dyeing layer are protected by the sealing layer, and the corrosion of water vapor and oxygen in the external environment on the dyeing layer and/or the oxidation layer and/or a metal shell of the electronic equipment is avoided.
On the basis of the foregoing embodiment, in an embodiment of the present application, a thickness of the sealing layer ranges from 1um to 2um, so as to reduce the thickness of the sealing layer on the basis of ensuring an effect of the sealing layer for isolating moisture and oxygen, thereby reducing the thickness of the electronic device, adapting to development of lightness and thinness of the electronic device, and reducing an influence of the sealing layer on an appearance color of a first surface of the electronic device.
In summary, in the electronic device provided by the present application, the anti-fingerprint film layer is formed on the first surface of the electronic device, so that the first surface of the electronic device has an anti-fingerprint effect, and the anti-fingerprint film layer has a plurality of protrusions, so that when the first surface of the electronic device contacts a target object such as a finger, a contact area between the anti-fingerprint film layer and the target object can be reduced, an adhesion capability of stains such as the fingerprint can be reduced, and the anti-fingerprint effect of the first surface of the electronic device can be improved.
In addition, in the electronic equipment that this application embodiment provided, the oxide layer with anti fingerprint rete forms in same process space, thereby makes on the basis that electronic equipment first surface has anti fingerprint effect, need not shift the workshop, has reduced the transit time, has avoided at the transfer in-process electronic equipment's surface can be by the problem of tiny particle pollution such as dust in the air, chad, consequently, is forming behind the oxide layer, form before anti fingerprint rete, need not be right again electronic equipment's surface is washd, plasma polishing to the time of processes such as washing, plasma polishing has been reduced again, and production cycle is shorter, thereby has effectively shortened the supply period of product.
In the description, each part is described in a progressive manner, each part is emphasized to be different from other parts, and the same and similar parts among the parts are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. A method of processing, comprising:
forming an oxide layer on a first surface of a metal shell of the electronic equipment by using an anodic oxidation process in the first process space;
and continuously forming an anti-fingerprint film layer on the surface of one side, deviating from the first surface of the metal shell of the electronic equipment, of the oxidation layer in the first process space, wherein the anti-fingerprint film layer is provided with a plurality of bulges, and the forming process of the anti-fingerprint film layer is an impregnation process.
2. The processing method according to claim 1, further comprising, after the formation of the oxide layer and before the formation of the anti-fingerprint film layer:
in the first process space, a sealing layer is formed on one side surface, departing from the first surface of the electronic equipment, of the oxidation layer, and the anti-fingerprint film layer is formed on one side surface, departing from the first surface of the electronic equipment, of the sealing layer.
3. The processing method according to claim 2, wherein forming the anti-fingerprint film layer on a side surface of the sealing layer facing away from the first surface of the electronic device comprises:
adding a first material having a negative potential to a solvent to obtain a solution comprising the first material;
placing the first surface of the electronic device after forming the sealing layer into the solution comprising the first material;
applying a positive potential to the first surface of the electronic device and applying a negative potential to the solution comprising the first material, and growing an anti-fingerprint film layer on a surface of the sealing layer on a side facing away from the first surface of the electronic device.
4. The process of claim 3, further comprising, prior to adding the first material having a negative potential to the solvent to obtain a solution comprising the first material:
electrochemically treating the first material such that the first material has a negative potential.
5. The process of claim 3 or 4, the first material being a fluoropolyether based material.
6. The process of any of claims 2-4, further comprising, after the formation of the oxide layer and before the formation of the sealing layer:
in the first process space, a dyeing layer is formed on one side, away from the first surface of the electronic equipment, of the oxide layer, and the sealing layer is formed on one side surface, away from the oxide layer, of the dyeing layer.
7. An electronic device is provided, wherein an oxide layer is formed on a first surface of the electronic device, an anti-fingerprint film layer is formed on one side of the oxide layer, which is far away from the first surface of the electronic device, and the anti-fingerprint film layer is provided with a plurality of bulges;
the forming process of the oxidation layer is an anodic oxidation process, the oxidation layer and the anti-fingerprint film layer are formed in the same process space, and the forming process of the anti-fingerprint film layer is a dipping process.
8. The electronic device of claim 7, wherein the material of the protrusion is a fluoropolyether-based material.
9. The electronic device of claim 7, further comprising: the anti-fingerprint film layer is arranged on the surface of the substrate and is provided with an oxidation layer, a dyeing layer and a sealing layer, wherein the dyeing layer is arranged between the oxidation layer and the anti-fingerprint film layer, and the sealing layer is arranged between the dyeing layer and the anti-fingerprint film layer.
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