CN111683323A - Earphone set - Google Patents
Earphone set Download PDFInfo
- Publication number
- CN111683323A CN111683323A CN202010622579.0A CN202010622579A CN111683323A CN 111683323 A CN111683323 A CN 111683323A CN 202010622579 A CN202010622579 A CN 202010622579A CN 111683323 A CN111683323 A CN 111683323A
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- CN
- China
- Prior art keywords
- heat dissipation
- module
- battery
- heat
- upper cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1025—Accumulators or arrangements for charging
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1091—Details not provided for in groups H04R1/1008 - H04R1/1083
Abstract
The invention provides an earphone, which comprises a shell and an integrated device; the shell is provided with an accommodating space, and the integrated device is accommodated in the accommodating space; the integrated device comprises a battery module, a mainboard module and a loudspeaker module; the battery module comprises a battery and a heat dissipation support fixed on the shell, the heat dissipation support and the shell jointly enclose a first packaging space, and the battery is packaged in the first packaging space; the mainboard module is abutted against one side of the heat dissipation bracket far away from the battery and is electrically connected with the battery; the loudspeaker module is fixed on one side of the mainboard module, which is far away from the heat dissipation support, and the loudspeaker module is electrically connected with the mainboard module. Compared with the related art, the earphone has the advantages of good heat dissipation, high reliability and long service life.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of electroacoustic conversion devices, in particular to an earphone.
[ background of the invention ]
With the advent of the mobile internet age, the number of smart mobile devices is increasing. Among them, the TWS wireless headset is popular with consumers since its appearance, and the demand thereof is greatly increased year by year.
In the related art, the TWS wireless headset includes a housing having an accommodating space, and a battery module, a motherboard and a speaker module which are respectively accommodated in the accommodating space, wherein the battery module is electrically connected with the motherboard to supply power to the motherboard, the motherboard is electrically connected with the speaker module to drive the speaker module to vibrate and sound, the housing is provided with a via hole penetrating through the housing, and the accommodating space is communicated with the outside through the via hole to serve as a sound outlet structure of the speaker module.
However, in the earphones in the related art, when the earphones are used and charged for a long time, a large amount of heat is generated inside the earphones, and because the existing earphones do not have a heat dissipation mechanism, only one sound conduction hole is arranged to conduct heat with the outside, the heat dissipation performance of the earphones is poor, and the main board, the battery module and the like in the earphones are often damaged due to the fact that the temperature is too high, and the reliability of the earphones is low and the service life of the earphones is short.
Therefore, it is necessary to provide a new earphone to solve the above technical problems.
[ summary of the invention ]
The invention aims to provide an earphone which has good heat dissipation, high reliability and long service life.
In order to achieve the above object, the present invention provides an earphone comprising:
a housing having an accommodating space; and an integration device, which is accommodated in the accommodating space;
the integrated device includes:
the battery module comprises a battery and a heat dissipation support fixed on the shell, the heat dissipation support and the shell jointly enclose a first packaging space, and the battery is packaged in the first packaging space;
the mainboard module is abutted against one side of the heat dissipation bracket, which is far away from the battery, and is electrically connected with the battery; and the number of the first and second groups,
the loudspeaker module is fixed on one side, away from the heat dissipation support, of the main board module, and the loudspeaker module is electrically connected with the main board module.
Preferably, the casing include with the fixed region that the heat dissipation support is fixed, the embedded heat-conducting plate that is equipped with of fixed region, the thermal conductivity of heat-conducting plate is greater than the thermal conductivity of casing.
Preferably, the casing include with the backshell that the heat dissipation support is fixed and with backshell fixed connection's preceding shell, preceding shell with the backshell encloses to establish and forms accommodating space, preceding shell is equipped with the sound conduction hole that runs through on it, the speaker module has the sound outlet, the sound conduction hole will the sound outlet communicates with the external world.
Preferably, the mainboard module comprises a mainboard fixed on the heat dissipation support and a chip attached to one side of the heat dissipation support, wherein the chip is abutted to the heat dissipation support.
Preferably, the battery module further comprises a heat conduction layer attached to one side of the heat dissipation support close to the main board module, and the chip is connected with the heat dissipation support through the heat conduction layer.
Preferably, the surface of the heat dissipation support, which is close to the motherboard module, is recessed towards the direction away from the motherboard module to form an accommodating groove, the heat conduction layer is accommodated in the accommodating groove, and the chip extends into the accommodating groove and is abutted to the heat conduction layer.
Preferably, the heat dissipation support includes an upper cover fixed to the rear shell, the upper cover and the rear shell enclose to form the first encapsulation space, the heat dissipation support further includes a lower cover accommodated in the first encapsulation space and fixed to the rear shell, the lower cover and the upper cover together enclose to form a second encapsulation space, and the battery is fixedly accommodated in the second encapsulation space.
Preferably, the main board is fixed to a side of the upper cover close to the front case, and the receiving slot is formed in a side of the upper cover close to the main board.
Preferably, the heat dissipation support further comprises a buckle structure arranged between the upper cover and the lower cover, and the upper cover and the lower cover are fixed in a buckle mode through the buckle structure.
Preferably, the heat dissipation support further comprises a sealing ring, and the sealing ring is compressed and clamped between the upper cover and the lower cover so as to seal the upper cover and the lower cover.
Preferably, the heat conducting layer is made of heat conducting silicone grease.
Preferably, the heat dissipation bracket is made of heat-conducting plastic.
Compared with the prior art, in the earphone, the integrated device is accommodated in the accommodating space of the shell and comprises the battery module, the mainboard module and the loudspeaker module, wherein the battery module comprises a battery and a heat dissipation bracket fixed on the shell, the heat dissipation bracket and the shell jointly enclose a first packaging space, and the battery is packaged in the first packaging space; the mainboard module is abutted against one side of the heat dissipation bracket far away from the battery and is electrically connected with the battery; the loudspeaker module is fixed on one side of the mainboard module, which is far away from the heat dissipation bracket, and the loudspeaker module is electrically connected with the mainboard module; in the structure, the battery is packaged through the heat dissipation support, the heat generated by the battery during discharging or charging and the heat of the mainboard module are absorbed and dissipated outwards by the heat dissipation support, the heat dissipation performance of the earphone is effectively improved, the phenomenon that the mainboard module and the battery are overheated and damaged due to heat accumulation inside the earphone is avoided, the service life of the earphone is prolonged, and the use reliability is improved.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
fig. 1 is a schematic structural diagram of the earphone of the present invention;
fig. 2 is a schematic view of a part of the structure of the earphone of the present invention.
[ detailed description ] embodiments
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides an earphone 100, which includes a housing 1, an integrated device 20, and a microphone 5.
The integrated device 20 is accommodated in the accommodating space 10, and specifically includes a battery module 2, a motherboard module 3, and a speaker module 4.
The battery module 2 comprises a heat dissipation support 21 and a battery 22, the heat dissipation support 21 is fixed to the housing 1 and covers the battery 22, the heat dissipation support 21 is fixed to the housing 1 and encloses a first packaging space 110 together with the housing 1, and the battery 22 is packaged in the first packaging space 110.
The housing 1 may be an integral structure or a separate structure, for example, in the present embodiment, the housing 1 is a separate structure, and includes a rear shell 11 fixed to the heat dissipation bracket 21 and a front shell 12 fixedly connected to the rear shell 11, the front shell 12 and the rear shell 11 enclose to form the receiving space 10, and the heat dissipation bracket 21 and the rear shell 11 enclose to form the first sealing space 110.
The mainboard module 3 is abutted against one side of the heat dissipation support 21 far away from the battery 22, and the mainboard module 3 is electrically connected with the battery 22 and dissipates heat outwards through the heat dissipation support 21.
It should be noted that the heat dissipation bracket 21 is made of a heat conductive material, for example, in the present embodiment, the heat dissipation bracket 21 is made of a heat conductive plastic, which provides a condition for the motherboard module 3 to dissipate heat outwards through the heat dissipation bracket 21.
In the above structure, the heat dissipation bracket 21 abuts against the motherboard module 3, when the earphone 100 is used or charged for a long time, the heat dissipation bracket 21 can effectively and quickly absorb heat generated by the motherboard module 3 during operation or heat generated by the battery 22 during charging or discharging, and then the heat dissipation bracket 21 conducts the heat to the housing 1 to be dissipated to the outside through the housing 1, which effectively increases the overall heat dissipation area of the earphone 100, compared with the related art, the structure has higher heat dissipation efficiency through air convection, so that the heat dissipation performance of the earphone 100 is good, the problem that the motherboard module 3 and the battery module 2 inside are damaged due to overhigh temperature is avoided, the use reliability of the earphone 100 is improved, and the service life of the earphone 100 is prolonged.
Further, in order to improve the heat conduction efficiency between the motherboard module 3 and the heat dissipation support 21, a layer of material with a high heat conduction coefficient may be added between the motherboard module and the heat dissipation support 21, for example, in this embodiment, the battery module 2 further includes a heat conduction layer 23 attached to the heat dissipation support 21 near the motherboard module 3, specifically, the heat conduction layer 23 is fixedly attached to the heat dissipation support 21, and the chip 32 is connected to the heat dissipation support 21 through the heat conduction layer 23 and conducts heat to the heat dissipation support 21.
Preferably, the surface of the heat dissipation bracket 21 close to the motherboard module 3 is recessed in a direction away from the motherboard module 3 to form a receiving slot 210, the heat conduction layer 23 is attached to the heat dissipation bracket 21 and received in the receiving slot 210, and the chip 32 extends into the receiving slot 210 and abuts against the heat conduction layer 23; through the arrangement of the accommodating part 210, the space utilization rate of the heat dissipation bracket 21 is effectively improved, so that the overall size of the earphone 100 is reduced, and the miniaturization design of the earphone 100 is facilitated.
It should be noted that the material of the heat conducting layer 23 is not limited, and it can be selected according to the actual situation, for example, the heat conducting layer 23 can be made of heat conducting silicone grease; of course, in other embodiments, the thermally conductive layer may be made of a thermally conductive metal.
Furthermore, in order to improve the heat conduction efficiency between the heat dissipation bracket 21 and the rear case 11, a layer of material with high heat conduction coefficient may be added between the two, for example, in the present embodiment, the casing 1 includes a fixing region 1101 fixed with the heat dissipation bracket 21, a heat conduction plate 111 is embedded in the fixing region 1101, the heat conduction plate 111 has a thermal conductivity greater than that of the casing 1, and the heat dissipation bracket 21 conducts heat to the rear case 11 through the heat conduction plate 111 to dissipate heat; the heat conducting plate 111 is made of a material with a high heat conductivity coefficient, which can be selected according to actual conditions, and herein, the heat conducting plate 111 may preferably be a metal sheet structure such as copper, copper alloy, steel sheet, etc.
Preferably, in order to ensure that a sufficient contact area exists between the heat dissipation bracket 21 and the rear housing 11, the heat dissipation bracket 21 includes an upper cover 211 and a lower cover 212 respectively covering opposite sides of the battery 22, the upper cover 211 and the rear housing 11 enclose the first packaging space 110, the lower cover 212 is accommodated in the first packaging space 110 and fixed to the rear housing 11, the lower cover 212 and the upper cover 211 together enclose a second packaging space 210, the battery 22 is fixedly accommodated in the second packaging space 210, the main board 31 is fixed to one side of the upper cover 211 close to the front housing 12, the accommodating groove 210 is formed by a depression of one side of the upper cover 211 close to the main board 31, the heat conduction layer 23 is attached to the upper cover 211, and the chip 32 abuts against the heat conduction layer 23 on the upper cover 211.
The upper cover 211 and the lower cover 212 are both fixedly connected with the rear housing 11, and through the cooperation arrangement of the upper cover 211 and the lower cover, the contact area between the heat dissipation bracket 21 and the rear housing 11 is effectively increased, the heat conduction efficiency between the heat dissipation bracket 21 and the rear housing 11 is further improved, and therefore the overall heat dissipation performance of the earphone 100 is further improved.
In addition, the battery 22 is a button battery, the internal cell of the battery 22 is packaged once by an aluminum-plastic film before packaging, this arrangement better protects the internal cell of the battery 22 and ensures the reliability thereof, and by the common arrangement of the upper cover 211 and the lower cover 212, the battery 22 is accommodated in the second packaging space 210 to realize secondary packaging of the battery 22, thereby further protecting the battery 22; of course, in other embodiments, it is also feasible that the heat dissipation bracket includes only one upper cover, the upper cover is disposed on the battery and fixed to the rear case, and at this time, the battery is not secondarily packaged, the upper cover directly forms a first packaging space with the rear case, the battery is accommodated in the first packaging space and fixed to one side of the upper cover, which is far away from the motherboard module, and the motherboard is fixed to one side of the upper cover, which is near the front case, so that the battery can be isolated from the external environment, thereby achieving the purpose of protecting the battery.
More preferably, in order to facilitate the assembly, the heat dissipation bracket 21 includes a fastening structure 2101 disposed between the upper cover 211 and the lower cover 212, and the fastening between the upper cover 211 and the lower cover 212 is realized by the fastening structure 2101, and the above fastening arrangement omits a glue-dispensing process during the assembly, so that the packaging of the battery module 2 is more convenient, the assembly process is simple, the assembly efficiency is effectively improved, and the automatic production is more facilitated.
In order to ensure the sealing performance inside the heat dissipation bracket 21, a sealing ring 2102 may be additionally disposed on the heat dissipation bracket 21, and the sealing ring 2102 is compressed and clamped between the upper cover 211 and the lower cover 212 to seal the upper cover 211 and the lower cover 212, that is, the battery 22 is accommodated in a sealed cavity, so as to prevent external moisture or foreign matters from entering the second encapsulation space 210, thereby causing adverse effects on the battery 22 and improving the reliability of the battery 22.
The loudspeaker module 4 is used for vibrating and sounding, is fixed on one side of the mainboard module 3 away from the heat dissipation bracket 21, and is electrically connected with the mainboard module 3; the microphone 5 is mounted on the rear case 11 and is used for collecting external sound signals.
In this embodiment, the speaker module 4 is welded to the motherboard 31 and electrically connected to the motherboard 31, and the chip 32 transmits an electrical signal to the speaker module 4 through the motherboard 31 to control the speaker module 4 to vibrate and sound in the accommodating space 10; the front shell 12 is covered on the rear shell 11 and is close to one side of the loudspeaker module 4, the front shell 12 is provided with a sound guide hole 120 penetrating through the front shell, the loudspeaker module 4 is provided with a sound outlet hole 40, the sound guide hole 120 is communicated with the outside through the sound outlet hole 40 to serve as a sound outlet structure of the loudspeaker module 4, namely, the loudspeaker module 4 is communicated with the outside, and in addition, through the arrangement of the sound guide hole 120, the mainboard module 3 and the heat dissipation support 21 are enabled to dissipate heat through air convection between the sound guide hole 120 and the outside, so that the heat dissipation performance of the earphone 100 is optimized while sound production is achieved.
Compared with the prior art, the earphone accommodates the integrated device in the accommodating space, the integrated device comprises a battery module, a mainboard module and a loudspeaker module, the battery module comprises a battery and a heat dissipation support fixed on the shell, the heat dissipation support and the shell jointly enclose a first packaging space, and the battery is packaged in the first packaging space; the mainboard module is abutted against one side of the heat dissipation bracket far away from the battery and is electrically connected with the battery; the loudspeaker module is fixed on one side of the mainboard module, which is far away from the heat dissipation bracket, and the loudspeaker module is electrically connected with the mainboard module; in the structure, the battery is packaged through the heat dissipation support, the heat generated by the battery during discharging or charging and the heat of the mainboard module are absorbed and dissipated outwards by the heat dissipation support, the heat dissipation performance of the earphone is effectively improved, the phenomenon that the mainboard module and the battery are overheated and damaged due to heat accumulation inside the earphone is avoided, the service life of the earphone is prolonged, and the use reliability is improved.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (12)
1. An earphone, characterized in that it comprises:
a housing having an accommodating space; and an integration device, which is accommodated in the accommodating space;
the integrated device includes:
the battery module comprises a battery and a heat dissipation support fixed on the shell, the heat dissipation support and the shell jointly enclose a first packaging space, and the battery is packaged in the first packaging space;
the mainboard module is abutted against one side of the heat dissipation bracket, which is far away from the battery, and is electrically connected with the battery; and the number of the first and second groups,
the loudspeaker module is fixed on one side, away from the heat dissipation support, of the main board module, and the loudspeaker module is electrically connected with the main board module.
2. The earphone of claim 1, wherein the housing comprises a securing region secured to the heat sink support, a thermally conductive plate embedded in the securing region, the thermally conductive plate having a thermal conductivity greater than a thermal conductivity of the housing.
3. The earphone according to claim 1, wherein the housing comprises a rear housing fixed to the heat dissipation bracket and a front housing fixedly connected to the rear housing, the front housing and the rear housing enclose the receiving space, the front housing is provided with a sound guide hole penetrating therethrough, the speaker module has a sound outlet, and the sound guide hole communicates the sound outlet with the outside.
4. The earphone according to claim 1, wherein the main board module comprises a main board fixed on the heat dissipation bracket and a chip attached to one side of the main board close to the heat dissipation bracket, and the chip abuts against the heat dissipation bracket.
5. The earphone according to claim 4, wherein the battery module further comprises a heat conduction layer attached to one side of the heat dissipation bracket close to the main board module, and the chip is connected with the heat dissipation bracket through the heat conduction layer.
6. The earphone according to claim 5, wherein the surface of the heat sink bracket near the motherboard module is recessed away from the motherboard module to form a receiving slot, the heat conducting layer is received in the receiving slot, and the chip extends into the receiving slot and abuts against the heat conducting layer.
7. The earphone according to claim 6, wherein the heat dissipation bracket comprises an upper cover fixed to the rear housing, the upper cover and the rear housing enclosing the first packaging space, the heat dissipation bracket further comprises a lower cover received in the first packaging space and fixed to the rear housing, the lower cover and the upper cover together enclosing a second packaging space, and the battery is fixedly received in the second packaging space.
8. The earphone according to claim 7, wherein the main plate is fixed to a side of the upper cover adjacent to the front case, and the receiving groove is formed in a side of the upper cover adjacent to the main plate.
9. The earphone according to claim 8, wherein the heat dissipation bracket further comprises a snap structure disposed between the upper cover and the lower cover, and the upper cover and the lower cover are fixed by the snap structure.
10. The earphone of claim 9, wherein the heat sink support further comprises a sealing ring that is compressively sandwiched between the upper cover and the lower cover to seal between the upper cover and the lower cover.
11. The earphone of claim 5, wherein the heat conductive layer is made of thermally conductive silicone.
12. The headset of claim 1, wherein the heat-dissipating support is made of thermally conductive plastic.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010622579.0A CN111683323B (en) | 2020-06-30 | 2020-06-30 | Earphone set |
| PCT/CN2020/102777 WO2022000583A1 (en) | 2020-06-30 | 2020-07-17 | Earphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010622579.0A CN111683323B (en) | 2020-06-30 | 2020-06-30 | Earphone set |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111683323A true CN111683323A (en) | 2020-09-18 |
| CN111683323B CN111683323B (en) | 2022-04-15 |
Family
ID=72457060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010622579.0A Active CN111683323B (en) | 2020-06-30 | 2020-06-30 | Earphone set |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111683323B (en) |
| WO (1) | WO2022000583A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100072952A1 (en) * | 2006-11-22 | 2010-03-25 | Kyocera Corporation | Portable electronic apparatus |
| CN205726308U (en) * | 2016-06-21 | 2016-11-23 | 窦越 | A kind of portable headphone |
| CN209120416U (en) * | 2018-12-27 | 2019-07-16 | 东莞市龙拓鑫电子有限公司 | A kind of Headphone structure based on fast charge heat dissipation |
| CN210431794U (en) * | 2019-09-11 | 2020-04-28 | 东莞市云仕电子有限公司 | Bluetooth headset and Bluetooth headset assembly |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206212526U (en) * | 2016-10-06 | 2017-05-31 | 南昌与德通讯技术有限公司 | Housing and electronic equipment |
| EP3834432A4 (en) * | 2018-08-09 | 2022-05-04 | James J. Fallon | Sound production using speaker enclosure with reduced internal pressure |
| CN108882096A (en) * | 2018-09-20 | 2018-11-23 | 梁天真 | A kind of novel Bluetooth earphone |
-
2020
- 2020-06-30 CN CN202010622579.0A patent/CN111683323B/en active Active
- 2020-07-17 WO PCT/CN2020/102777 patent/WO2022000583A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100072952A1 (en) * | 2006-11-22 | 2010-03-25 | Kyocera Corporation | Portable electronic apparatus |
| CN205726308U (en) * | 2016-06-21 | 2016-11-23 | 窦越 | A kind of portable headphone |
| CN209120416U (en) * | 2018-12-27 | 2019-07-16 | 东莞市龙拓鑫电子有限公司 | A kind of Headphone structure based on fast charge heat dissipation |
| CN210431794U (en) * | 2019-09-11 | 2020-04-28 | 东莞市云仕电子有限公司 | Bluetooth headset and Bluetooth headset assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022000583A1 (en) | 2022-01-06 |
| CN111683323B (en) | 2022-04-15 |
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