CN111682395A - Solid laser medium cooling structure and semiconductor pumping solid laser - Google Patents
Solid laser medium cooling structure and semiconductor pumping solid laser Download PDFInfo
- Publication number
- CN111682395A CN111682395A CN202010373093.8A CN202010373093A CN111682395A CN 111682395 A CN111682395 A CN 111682395A CN 202010373093 A CN202010373093 A CN 202010373093A CN 111682395 A CN111682395 A CN 111682395A
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- China
- Prior art keywords
- laser medium
- solid laser
- cooling structure
- water outlet
- length
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 65
- 239000007787 solid Substances 0.000 title claims abstract description 45
- 239000004065 semiconductor Substances 0.000 title abstract description 8
- 238000005086 pumping Methods 0.000 title abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 37
- 210000004534 cecum Anatomy 0.000 claims abstract description 8
- 239000000498 cooling water Substances 0.000 abstract description 6
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910009372 YVO4 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0407—Liquid cooling, e.g. by water
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/042—Arrangements for thermal management for solid state lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
- H01S3/16—Solid materials
- H01S3/163—Solid materials characterised by a crystal matrix
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Lasers (AREA)
Abstract
The invention provides a solid laser medium cooling structure and a semiconductor pumping solid laser, comprising: one end of the outer cooling pipe is provided with a groove for mounting a medium to be cooled; the internal cooling pipe, nested in the outer cooling tube, and with the inner wall interval of outer cooling tube sets up, the internal cooling pipe is close to the one end of recess is the cecum, the cecum is provided with a plurality of apopores, the apopore is the loudspeaker form that the diameter expands outward along the rivers direction. The blind end of the inner cooling pipe is provided with the water outlet holes, so that the solid laser medium is subjected to uniform cooling water impact force, and the water outlet holes are horn-shaped, so that the water outlet apertures are gradually expanded, the impact of water pressure on the solid laser medium is reduced, the dead zone of water impact is avoided, and the purpose of uniform cooling is achieved.
Description
Technical Field
The invention belongs to the technical field of laser equipment, and particularly relates to a solid laser medium cooling structure and a semiconductor pumping solid laser.
Background
In laser equipment, the temperature of a solid laser medium is increased after the solid laser medium absorbs pumping energy, and the rapid and effective cooling of the laser medium is important for the output characteristics of a laser. For example, the existing cooling method is to cool the high power disc laser by impact cooling (impact cooling). However, the disadvantages of this method are: uneven cooling, resulting in local transverse temperature gradients, causing thermal distortion of the thermal lens effect, and local pressure at the water outlet impacting the laser medium, resulting in irregular deformation, affecting beam quality, destroying the stability of the optical resonator.
Content of application
The invention aims to solve the technical problems of uneven cooling and overlarge impact force on a laser medium in the conventional impact cooling method.
In order to solve the technical problem, the invention is realized as follows: a solid laser medium cooling structure, comprising:
one end of the outer cooling pipe is provided with a groove for mounting a medium to be cooled;
the internal cooling pipe, nested in the outer cooling tube, and with the inner wall interval of outer cooling tube sets up, the internal cooling pipe is close to the one end of recess is the cecum, the cecum is provided with a plurality of apopores, the apopore is the loudspeaker form that the diameter expands outward along the rivers direction.
Further, the water outlet hole comprises in the water flow direction:
a straight hole;
and the longitudinal section of the trapezoidal trapezoid hole is connected with the straight hole.
Furthermore, the length of the lower bottom of the trapezoid is 1.2-3 times that of the upper bottom.
Further, the length of the upper bottom of the trapezoid is 0.3-1.5mm
Further, the length of the water outlet hole is 1.2-4 times of the length of the straight hole.
Furthermore, the length of the water outlet hole is 0.3-5 mm.
Further, the groove includes:
a support surface perpendicular to the outer cooling tube axis;
and the limiting wall is connected with the supporting surface and is positioned on one side far away from the axis of the outer cooling pipe.
Further, a sealing ring groove is formed in the supporting surface, and a sealing ring is arranged in the sealing ring groove.
A semiconductor pumped solid state laser comprising a solid state laser medium cooling structure as described above.
Compared with the prior art, the invention has the beneficial effects that: the blind end of the inner cooling pipe is provided with the plurality of water outlet holes, so that the solid laser medium is subjected to uniform cooling water impact force, and the water outlet holes are horn-shaped, so that the water outlet caliber is gradually expanded outwards, the impact of water pressure on the solid laser medium is reduced, dead zones (part of zones cannot be flushed by water) of water impact are avoided, and the purpose of uniform cooling is achieved.
Drawings
Fig. 1 is a cooling structure diagram of a solid laser medium according to an embodiment of the present invention.
Fig. 2 is a top view of the blind end of the inner cooling tube according to the embodiment of the present invention.
Fig. 3 is a longitudinal sectional view of a water outlet hole provided in an embodiment of the present invention.
Fig. 4 is a structural diagram of a semiconductor pumped solid-state laser according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The solid laser medium cooling structure provided by the embodiment of the invention comprises an outer cooling pipe 1 and an inner cooling pipe 2, wherein one end of the outer cooling pipe 1 is provided with a groove 11 for mounting a solid laser medium 3, as shown in fig. 1-2. Interior cooling tube 2 nested in outer cooling tube 1, and with the inner wall interval of outer cooling tube 1 sets up, interior cooling tube 2 is close to the one end of recess 11 is cecum 21, cecum 21 is provided with a plurality of apopores 22, apopore 22 is the loudspeaker form that the diameter expands outward along the rivers direction.
The working principle of the solid laser medium cooling structure is as follows: the cooling water flows in from the inner cooling pipe 2, and is sprayed on the lower surface of the solid laser medium 3 from the water outlet hole 22 on the blind end 21 to cool the solid laser medium 3, and the returned cooling water flows out from the gap between the inner wall of the outer cooling pipe 1 and the outer wall of the inner cooling pipe 2, and the water flow direction is shown by an arrow in the figure. According to the invention, the blind end 21 of the inner cooling pipe 2 is provided with the plurality of water outlet holes, so that the solid laser medium 3 is subjected to uniform cooling water impact force, and the water outlet holes 22 are horn-shaped, so that the water outlet aperture is gradually expanded, the impact of water pressure on the solid laser medium 3 is reduced, dead zones (part of zones cannot be flushed by water) of water impact are avoided, and the purpose of uniform cooling is achieved.
Further, the trumpet-shaped structure of the water outlet 22 may be as shown in fig. 3, and the water outlet 22 includes a straight hole 221 and a trapezoid hole 222 connected to the straight hole 221 and having a trapezoid longitudinal section along the water flow direction. The length D2 of the lower base of the trapezoid can be 1.2-3 times, preferably 1.5-2.0 times, the length D1 of the upper base. Wherein D1 may be set at 0.3-1.5mm, preferably at 0.5-1.0 mm. The length T2 of the water outlet hole 22 may be 1.2-4 times, preferably 1.2-2.5 times, the length T1 of the straight hole 221. The length of the water outlet 22 is set to 0.3-5mm, preferably 0.3-3.0 mm.
Further, referring to fig. 1, in order to adapt to the installation and fixation of the solid laser medium 3 in the shape shown in the figure, the structure of the groove 11 may include a supporting surface 111 and a limiting wall 112, wherein the supporting surface 111 is perpendicular to the axis of the outer cooling tube 1; and a limiting wall 112 connected to the supporting surface 111 and located on a side away from the axis of the outer cooling pipe 1. In order to enhance the sealing and waterproof performance of the structure, a seal ring groove 1111 may be provided in the support surface 111, and a seal ring 4 may be provided in the seal ring groove 1111.
The invention also provides a semiconductor pump solid laserFig. 1 shows a solid laser medium cooling structure as described above and a solid laser medium 3 mounted in the recess 11. The solid laser medium 3 is a doped laser crystal, such as Nd: YAG, Nd: YVO4YAG, LuAG or other laser media, wherein the surface of the solid laser medium 3 facing the water outlet 22 can be coated with a total reflection film with laser wavelength and pumping wavelength, and the surface far away from the water outlet 22 can be coated with an antireflection film with laser wavelength and pumping wavelength, so that the laser efficiency is improved.
The invention also provides another semiconductor pump solid laser, referring to fig. 4, a heat dissipation block 5 is arranged in a groove 11, and a solid laser medium 3 is fixed on the surface of the heat dissipation block 5 by welding, bonding, optical bonding or indium film. The heat dissipation block 5 is made of materials with good heat conduction performance, such as diamond, red copper or aluminum, and a waterproof protection layer can be plated on one surface of the heat dissipation block 5 facing the water outlet 22. The solid laser medium 3 is cooled through the radiating block 5, so that the cooling is more uniform, and the solid laser medium 3 can be prevented from being directly impacted by cooling water.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (9)
1. A solid laser medium cooling structure, comprising:
one end of the outer cooling pipe is provided with a groove for mounting a medium to be cooled;
the internal cooling pipe, nested in the outer cooling tube, and with the inner wall interval of outer cooling tube sets up, the internal cooling pipe is close to the one end of recess is the cecum, the cecum is provided with a plurality of apopores, the apopore is the loudspeaker form that the diameter expands outward along the rivers direction.
2. The solid laser medium cooling structure of claim 1, wherein the water outlet hole comprises, in a water flow direction:
a straight hole;
and the longitudinal section of the trapezoidal trapezoid hole is connected with the straight hole.
3. The solid laser medium cooling structure as claimed in claim 2, wherein the length of the lower base of the trapezoid is 1.2 to 3 times the length of the upper base.
4. The solid laser medium cooling structure as claimed in claim 3, wherein the length of the upper base of the trapezoid is 0.3 to 1.5 mm.
5. The solid laser medium cooling structure of claim 2, wherein the length of the water outlet hole is 1.2 to 4 times the length of the straight hole.
6. The solid laser medium cooling structure of claim 5, wherein the length of the water outlet hole is 0.3-5 mm.
7. The solid state laser medium cooling structure of claim 1, wherein the groove comprises:
a support surface perpendicular to the outer cooling tube axis;
and the limiting wall is connected with the supporting surface and is positioned on one side far away from the axis of the outer cooling pipe.
8. The solid state laser medium cooling structure of claim 7 wherein the bearing surface has a seal groove with a seal disposed therein.
9. A semiconductor-pumped solid state laser comprising a solid state lasing medium cooling structure as claimed in any of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010373093.8A CN111682395A (en) | 2020-05-06 | 2020-05-06 | Solid laser medium cooling structure and semiconductor pumping solid laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010373093.8A CN111682395A (en) | 2020-05-06 | 2020-05-06 | Solid laser medium cooling structure and semiconductor pumping solid laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111682395A true CN111682395A (en) | 2020-09-18 |
Family
ID=72433478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010373093.8A Pending CN111682395A (en) | 2020-05-06 | 2020-05-06 | Solid laser medium cooling structure and semiconductor pumping solid laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111682395A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090252277A1 (en) * | 2008-04-07 | 2009-10-08 | Korea Atomic Engergy Research Institute | Upper Plenum Structure of Cooled Pressure Vessel for Prismatic Very High Temperature Reactor |
| CN106571579A (en) * | 2015-10-13 | 2017-04-19 | 中国科学院大连化学物理研究所 | Piston type adjustable disc laser crystal cooling finger |
| CN108616028A (en) * | 2016-12-10 | 2018-10-02 | 中国科学院大连化学物理研究所 | A kind of cooling device and cooling means of high heat flux density |
| CN109075520A (en) * | 2016-04-05 | 2018-12-21 | 通快激光有限责任公司 | Impinging cooling equipment and corresponding laser disk module for laser disk |
| CN210098381U (en) * | 2019-10-18 | 2020-02-21 | 湖北正达机械制造有限公司 | Bar spraying ring |
-
2020
- 2020-05-06 CN CN202010373093.8A patent/CN111682395A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090252277A1 (en) * | 2008-04-07 | 2009-10-08 | Korea Atomic Engergy Research Institute | Upper Plenum Structure of Cooled Pressure Vessel for Prismatic Very High Temperature Reactor |
| CN106571579A (en) * | 2015-10-13 | 2017-04-19 | 中国科学院大连化学物理研究所 | Piston type adjustable disc laser crystal cooling finger |
| CN109075520A (en) * | 2016-04-05 | 2018-12-21 | 通快激光有限责任公司 | Impinging cooling equipment and corresponding laser disk module for laser disk |
| CN108616028A (en) * | 2016-12-10 | 2018-10-02 | 中国科学院大连化学物理研究所 | A kind of cooling device and cooling means of high heat flux density |
| CN210098381U (en) * | 2019-10-18 | 2020-02-21 | 湖北正达机械制造有限公司 | Bar spraying ring |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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Application publication date: 20200918 |