CN111682395A - Solid laser medium cooling structure and semiconductor pumping solid laser - Google Patents

Solid laser medium cooling structure and semiconductor pumping solid laser Download PDF

Info

Publication number
CN111682395A
CN111682395A CN202010373093.8A CN202010373093A CN111682395A CN 111682395 A CN111682395 A CN 111682395A CN 202010373093 A CN202010373093 A CN 202010373093A CN 111682395 A CN111682395 A CN 111682395A
Authority
CN
China
Prior art keywords
laser medium
solid laser
cooling structure
water outlet
length
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010373093.8A
Other languages
Chinese (zh)
Inventor
阮双琛
吕启涛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Han s Laser Technology Industry Group Co Ltd
Shenzhen Technology University
Original Assignee
Han s Laser Technology Industry Group Co Ltd
Shenzhen Technology University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Han s Laser Technology Industry Group Co Ltd, Shenzhen Technology University filed Critical Han s Laser Technology Industry Group Co Ltd
Priority to CN202010373093.8A priority Critical patent/CN111682395A/en
Publication of CN111682395A publication Critical patent/CN111682395A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/0407—Liquid cooling, e.g. by water
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/042—Arrangements for thermal management for solid state lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
    • H01S3/16—Solid materials
    • H01S3/163—Solid materials characterised by a crystal matrix

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Lasers (AREA)

Abstract

The invention provides a solid laser medium cooling structure and a semiconductor pumping solid laser, comprising: one end of the outer cooling pipe is provided with a groove for mounting a medium to be cooled; the internal cooling pipe, nested in the outer cooling tube, and with the inner wall interval of outer cooling tube sets up, the internal cooling pipe is close to the one end of recess is the cecum, the cecum is provided with a plurality of apopores, the apopore is the loudspeaker form that the diameter expands outward along the rivers direction. The blind end of the inner cooling pipe is provided with the water outlet holes, so that the solid laser medium is subjected to uniform cooling water impact force, and the water outlet holes are horn-shaped, so that the water outlet apertures are gradually expanded, the impact of water pressure on the solid laser medium is reduced, the dead zone of water impact is avoided, and the purpose of uniform cooling is achieved.

Description

Solid laser medium cooling structure and semiconductor pumping solid laser
Technical Field
The invention belongs to the technical field of laser equipment, and particularly relates to a solid laser medium cooling structure and a semiconductor pumping solid laser.
Background
In laser equipment, the temperature of a solid laser medium is increased after the solid laser medium absorbs pumping energy, and the rapid and effective cooling of the laser medium is important for the output characteristics of a laser. For example, the existing cooling method is to cool the high power disc laser by impact cooling (impact cooling). However, the disadvantages of this method are: uneven cooling, resulting in local transverse temperature gradients, causing thermal distortion of the thermal lens effect, and local pressure at the water outlet impacting the laser medium, resulting in irregular deformation, affecting beam quality, destroying the stability of the optical resonator.
Content of application
The invention aims to solve the technical problems of uneven cooling and overlarge impact force on a laser medium in the conventional impact cooling method.
In order to solve the technical problem, the invention is realized as follows: a solid laser medium cooling structure, comprising:
one end of the outer cooling pipe is provided with a groove for mounting a medium to be cooled;
the internal cooling pipe, nested in the outer cooling tube, and with the inner wall interval of outer cooling tube sets up, the internal cooling pipe is close to the one end of recess is the cecum, the cecum is provided with a plurality of apopores, the apopore is the loudspeaker form that the diameter expands outward along the rivers direction.
Further, the water outlet hole comprises in the water flow direction:
a straight hole;
and the longitudinal section of the trapezoidal trapezoid hole is connected with the straight hole.
Furthermore, the length of the lower bottom of the trapezoid is 1.2-3 times that of the upper bottom.
Further, the length of the upper bottom of the trapezoid is 0.3-1.5mm
Further, the length of the water outlet hole is 1.2-4 times of the length of the straight hole.
Furthermore, the length of the water outlet hole is 0.3-5 mm.
Further, the groove includes:
a support surface perpendicular to the outer cooling tube axis;
and the limiting wall is connected with the supporting surface and is positioned on one side far away from the axis of the outer cooling pipe.
Further, a sealing ring groove is formed in the supporting surface, and a sealing ring is arranged in the sealing ring groove.
A semiconductor pumped solid state laser comprising a solid state laser medium cooling structure as described above.
Compared with the prior art, the invention has the beneficial effects that: the blind end of the inner cooling pipe is provided with the plurality of water outlet holes, so that the solid laser medium is subjected to uniform cooling water impact force, and the water outlet holes are horn-shaped, so that the water outlet caliber is gradually expanded outwards, the impact of water pressure on the solid laser medium is reduced, dead zones (part of zones cannot be flushed by water) of water impact are avoided, and the purpose of uniform cooling is achieved.
Drawings
Fig. 1 is a cooling structure diagram of a solid laser medium according to an embodiment of the present invention.
Fig. 2 is a top view of the blind end of the inner cooling tube according to the embodiment of the present invention.
Fig. 3 is a longitudinal sectional view of a water outlet hole provided in an embodiment of the present invention.
Fig. 4 is a structural diagram of a semiconductor pumped solid-state laser according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The solid laser medium cooling structure provided by the embodiment of the invention comprises an outer cooling pipe 1 and an inner cooling pipe 2, wherein one end of the outer cooling pipe 1 is provided with a groove 11 for mounting a solid laser medium 3, as shown in fig. 1-2. Interior cooling tube 2 nested in outer cooling tube 1, and with the inner wall interval of outer cooling tube 1 sets up, interior cooling tube 2 is close to the one end of recess 11 is cecum 21, cecum 21 is provided with a plurality of apopores 22, apopore 22 is the loudspeaker form that the diameter expands outward along the rivers direction.
The working principle of the solid laser medium cooling structure is as follows: the cooling water flows in from the inner cooling pipe 2, and is sprayed on the lower surface of the solid laser medium 3 from the water outlet hole 22 on the blind end 21 to cool the solid laser medium 3, and the returned cooling water flows out from the gap between the inner wall of the outer cooling pipe 1 and the outer wall of the inner cooling pipe 2, and the water flow direction is shown by an arrow in the figure. According to the invention, the blind end 21 of the inner cooling pipe 2 is provided with the plurality of water outlet holes, so that the solid laser medium 3 is subjected to uniform cooling water impact force, and the water outlet holes 22 are horn-shaped, so that the water outlet aperture is gradually expanded, the impact of water pressure on the solid laser medium 3 is reduced, dead zones (part of zones cannot be flushed by water) of water impact are avoided, and the purpose of uniform cooling is achieved.
Further, the trumpet-shaped structure of the water outlet 22 may be as shown in fig. 3, and the water outlet 22 includes a straight hole 221 and a trapezoid hole 222 connected to the straight hole 221 and having a trapezoid longitudinal section along the water flow direction. The length D2 of the lower base of the trapezoid can be 1.2-3 times, preferably 1.5-2.0 times, the length D1 of the upper base. Wherein D1 may be set at 0.3-1.5mm, preferably at 0.5-1.0 mm. The length T2 of the water outlet hole 22 may be 1.2-4 times, preferably 1.2-2.5 times, the length T1 of the straight hole 221. The length of the water outlet 22 is set to 0.3-5mm, preferably 0.3-3.0 mm.
Further, referring to fig. 1, in order to adapt to the installation and fixation of the solid laser medium 3 in the shape shown in the figure, the structure of the groove 11 may include a supporting surface 111 and a limiting wall 112, wherein the supporting surface 111 is perpendicular to the axis of the outer cooling tube 1; and a limiting wall 112 connected to the supporting surface 111 and located on a side away from the axis of the outer cooling pipe 1. In order to enhance the sealing and waterproof performance of the structure, a seal ring groove 1111 may be provided in the support surface 111, and a seal ring 4 may be provided in the seal ring groove 1111.
The invention also provides a semiconductor pump solid laserFig. 1 shows a solid laser medium cooling structure as described above and a solid laser medium 3 mounted in the recess 11. The solid laser medium 3 is a doped laser crystal, such as Nd: YAG, Nd: YVO4YAG, LuAG or other laser media, wherein the surface of the solid laser medium 3 facing the water outlet 22 can be coated with a total reflection film with laser wavelength and pumping wavelength, and the surface far away from the water outlet 22 can be coated with an antireflection film with laser wavelength and pumping wavelength, so that the laser efficiency is improved.
The invention also provides another semiconductor pump solid laser, referring to fig. 4, a heat dissipation block 5 is arranged in a groove 11, and a solid laser medium 3 is fixed on the surface of the heat dissipation block 5 by welding, bonding, optical bonding or indium film. The heat dissipation block 5 is made of materials with good heat conduction performance, such as diamond, red copper or aluminum, and a waterproof protection layer can be plated on one surface of the heat dissipation block 5 facing the water outlet 22. The solid laser medium 3 is cooled through the radiating block 5, so that the cooling is more uniform, and the solid laser medium 3 can be prevented from being directly impacted by cooling water.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims (9)

1. A solid laser medium cooling structure, comprising:
one end of the outer cooling pipe is provided with a groove for mounting a medium to be cooled;
the internal cooling pipe, nested in the outer cooling tube, and with the inner wall interval of outer cooling tube sets up, the internal cooling pipe is close to the one end of recess is the cecum, the cecum is provided with a plurality of apopores, the apopore is the loudspeaker form that the diameter expands outward along the rivers direction.
2. The solid laser medium cooling structure of claim 1, wherein the water outlet hole comprises, in a water flow direction:
a straight hole;
and the longitudinal section of the trapezoidal trapezoid hole is connected with the straight hole.
3. The solid laser medium cooling structure as claimed in claim 2, wherein the length of the lower base of the trapezoid is 1.2 to 3 times the length of the upper base.
4. The solid laser medium cooling structure as claimed in claim 3, wherein the length of the upper base of the trapezoid is 0.3 to 1.5 mm.
5. The solid laser medium cooling structure of claim 2, wherein the length of the water outlet hole is 1.2 to 4 times the length of the straight hole.
6. The solid laser medium cooling structure of claim 5, wherein the length of the water outlet hole is 0.3-5 mm.
7. The solid state laser medium cooling structure of claim 1, wherein the groove comprises:
a support surface perpendicular to the outer cooling tube axis;
and the limiting wall is connected with the supporting surface and is positioned on one side far away from the axis of the outer cooling pipe.
8. The solid state laser medium cooling structure of claim 7 wherein the bearing surface has a seal groove with a seal disposed therein.
9. A semiconductor-pumped solid state laser comprising a solid state lasing medium cooling structure as claimed in any of claims 1 to 8.
CN202010373093.8A 2020-05-06 2020-05-06 Solid laser medium cooling structure and semiconductor pumping solid laser Pending CN111682395A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010373093.8A CN111682395A (en) 2020-05-06 2020-05-06 Solid laser medium cooling structure and semiconductor pumping solid laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010373093.8A CN111682395A (en) 2020-05-06 2020-05-06 Solid laser medium cooling structure and semiconductor pumping solid laser

Publications (1)

Publication Number Publication Date
CN111682395A true CN111682395A (en) 2020-09-18

Family

ID=72433478

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010373093.8A Pending CN111682395A (en) 2020-05-06 2020-05-06 Solid laser medium cooling structure and semiconductor pumping solid laser

Country Status (1)

Country Link
CN (1) CN111682395A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090252277A1 (en) * 2008-04-07 2009-10-08 Korea Atomic Engergy Research Institute Upper Plenum Structure of Cooled Pressure Vessel for Prismatic Very High Temperature Reactor
CN106571579A (en) * 2015-10-13 2017-04-19 中国科学院大连化学物理研究所 Piston type adjustable disc laser crystal cooling finger
CN108616028A (en) * 2016-12-10 2018-10-02 中国科学院大连化学物理研究所 A kind of cooling device and cooling means of high heat flux density
CN109075520A (en) * 2016-04-05 2018-12-21 通快激光有限责任公司 Impinging cooling equipment and corresponding laser disk module for laser disk
CN210098381U (en) * 2019-10-18 2020-02-21 湖北正达机械制造有限公司 Bar spraying ring

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090252277A1 (en) * 2008-04-07 2009-10-08 Korea Atomic Engergy Research Institute Upper Plenum Structure of Cooled Pressure Vessel for Prismatic Very High Temperature Reactor
CN106571579A (en) * 2015-10-13 2017-04-19 中国科学院大连化学物理研究所 Piston type adjustable disc laser crystal cooling finger
CN109075520A (en) * 2016-04-05 2018-12-21 通快激光有限责任公司 Impinging cooling equipment and corresponding laser disk module for laser disk
CN108616028A (en) * 2016-12-10 2018-10-02 中国科学院大连化学物理研究所 A kind of cooling device and cooling means of high heat flux density
CN210098381U (en) * 2019-10-18 2020-02-21 湖北正达机械制造有限公司 Bar spraying ring

Similar Documents

Publication Publication Date Title
CN111293579B (en) Double-sided water cooling device for lath laser crystal
IL156895A (en) Multi-jet impingement cooled slab laser pumphead and method
CN105305206A (en) Heat sink suitable for disc laser jet flow impingement cooling system
CN111682395A (en) Solid laser medium cooling structure and semiconductor pumping solid laser
CN109411997B (en) Laminated repetition frequency sheet amplifier for xenon lamp pumping liquid cooling
US7359413B2 (en) Diamond-cooled solid-state laser
CN205178255U (en) It is heat sink suitable for video disc laser instrument efflux impingement cooling system
CN112670805A (en) Laser crystal direct-impact cooling type micro-channel radiator
JP3237525B2 (en) Solid-state laser excitation module
CN106816804B (en) Micro-channel metal foam disc-shaped laser crystal cooling device
CN115663571B (en) Low-power-consumption heat dissipation cooling device and cooling method for laser
CN201008074Y (en) Solid-state thin disk laser
CN110970789B (en) Fiber laser cooling device
CN111211466B (en) Transparent light guide and low-stress packaged solid laser module device and welding method thereof
CN216214774U (en) Pumping source
CN210273005U (en) Multi-pumping gain flat Raman fiber amplifier based on different fiber phase cascades
CN211786459U (en) Faraday optical rotator with self-heat-removal effect
CN209881086U (en) Semiconductor laser pumping microchip laser with good heat dissipation performance
CN111952823A (en) Double-suspension liquid-cooling impact-resistant carbon dioxide laser
CN220873570U (en) Radiator
CN220190118U (en) Micro laser and portable laser cleaning equipment
CN216121189U (en) Carbon dioxide laser tube reflector heat abstractor
CN220934066U (en) High-power consumption module cooling plate structure
CN112928584B (en) Novel jet type disc laser crystal cooling device
CN215896955U (en) Cooling device and solid laser with same

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20200918