CN111681973B - Wafer spin coating waste liquid collection device - Google Patents
Wafer spin coating waste liquid collection device Download PDFInfo
- Publication number
- CN111681973B CN111681973B CN202010579751.9A CN202010579751A CN111681973B CN 111681973 B CN111681973 B CN 111681973B CN 202010579751 A CN202010579751 A CN 202010579751A CN 111681973 B CN111681973 B CN 111681973B
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- groove
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- clamping
- pressing
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- 239000002699 waste material Substances 0.000 title claims abstract description 31
- 239000007788 liquid Substances 0.000 title claims abstract description 29
- 238000004528 spin coating Methods 0.000 title claims abstract description 20
- 238000003825 pressing Methods 0.000 claims abstract description 40
- 238000003756 stirring Methods 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000005096 rolling process Methods 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 229920000915 polyvinyl chloride Polymers 0.000 description 6
- 239000004800 polyvinyl chloride Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 150000008280 chlorinated hydrocarbons Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000003578 releasing effect Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
The invention discloses a wafer spin coating waste liquid collecting device, which structurally comprises a top plate, a collecting box, an auxiliary pressing device, a placing seat, a placing groove and a wind channel, wherein the auxiliary pressing device is arranged at the left end and the right end of the top plate, a rotating disc can be driven to rotate by a knob, the front end of the rotating disc can slide in a clamping way through a clamping column and a transverse groove on a connecting plate, the rotary disc rear end is in clamping sliding with the arc-shaped groove on the pressing piece through the stirring piece, and the pressing piece is fixedly sliding through the limiting piece, so that the pressing piece can stretch and slide along the sliding groove on the mounting plate, the wafer can be adjusted and pressed fixedly, and the stability of waste liquid collecting operation is guaranteed. Meanwhile, the vertical groove penetrates through the middle part in the lower end of the pressing piece, the inner diameter surface of the vertical groove slides with the clamping position of the limiting piece, normal sliding is convenient to carry out, and the sliding stability is guaranteed.
Description
Technical Field
The invention relates to the technical field of wafer spin coating processes, in particular to a wafer spin coating waste liquid collecting device.
Background
The new technology and market are continuously improved in the productivity requirement of equipment, more process modules are required to be configured for realizing more productivity under the condition of the same occupied area, the integration level of the process modules is continuously improved, and a novel rotary coating module with a plurality of rotary coating units configured in one process cavity appears, so that a waste liquid collecting device is required to collect waste liquid during processing.
Under the circumstances that needs to use wafer spin coating waste liquid collection device, because current waste liquid collection device structure is comparatively simple, all is the embedding and places and carry out the waste liquid collection, appears spin coating easily and rocks the skew to the dynamics is overweight to compress tightly and causes the wafer to warp easily when fixed and damages, influences the homogeneity and the waste liquid collection effect of coating.
Disclosure of Invention
(One) solving the technical problems
In order to overcome the defects of the prior art, the invention provides a wafer spin coating waste liquid collecting device, which solves the problems that when the wafer spin coating waste liquid collecting device is required to be used, the structure of the existing waste liquid collecting device is simple, the waste liquid collecting device is embedded and placed, the spin coating shake deviation is easy to occur, the wafer is easy to deform and damage when the force is too heavy to compress and fix, and the uniformity of coating and the waste liquid collecting effect are affected.
(II) technical scheme
The invention is realized by the following technical scheme: the invention provides a wafer rotary coating waste liquid collecting device which comprises a top plate, a collecting box, an auxiliary pressing device and a placing seat, wherein the middle part of the bottom end of the top plate is tightly fixed with the collecting box, the auxiliary pressing device is arranged at the left end and the right end of the top plate, the auxiliary pressing device comprises a box body, a knob and a sliding mechanism, the knob is fixedly arranged at the middle part of the right side of the box body, the sliding mechanism is arranged at the middle part in the box body, and the box body is fixedly arranged at the left end and the right end of the top plate.
Further, the top plate top middle part fixed mounting has the seat of placing, the embedding of seat top middle part has the standing groove, the inboard bottom of standing groove runs through there is the wind channel.
Further, slide mechanism includes rolling disc, cross slot, connecting plate, stir piece, arc wall, compresses tightly piece, locating part, spout and mounting panel, the terminal surface outer fringe is passed through the draw-in column and is slided with the cross slot screens before the rolling disc, the cross slot wears to locate middle part in the connecting plate, rolling disc rear end middle part is fixed each other with stirring the piece, stir piece and arc wall internal diameter surface screens and slide, the arc wall runs through middle part in compressing tightly the piece to compressing tightly piece and connecting plate rear end face four corners locking are fixed, middle part and locating part screens are slided in the compressing tightly piece lower extreme, compressing tightly piece along spout sliding fit, the spout wears to locate middle part in the mounting panel, the rolling disc rear end middle part is connected with the knob through the connecting axle.
Further, a rubber sleeve is arranged outside the knob, and anti-skid patterns are arranged on the surface of the rubber sleeve.
Further, four screw holes are formed in the lower end of the outer side of the box body, and the diameter of each screw hole is 8MM.
Further, a clamping column is arranged on the outer edge of the front end face of the rotating disc, and the clamping column and the inner diameter surface of the transverse groove are clamped and slide.
Further, the middle part runs through in the lower extreme of compressing tightly piece has vertical groove to vertical groove internal diameter surface and locating part screens slip.
Further, the upper end of the inner side of the pressing piece is provided with a pressing rod which is in sliding fit along the inner diameter surface of the sliding groove.
Furthermore, the mounting plate is made of PVC plastic.
Furthermore, the stirring piece is made of stainless steel.
(III) beneficial effects
Compared with the prior art, the invention provides a wafer spin coating waste liquid collecting device, which has the following beneficial effects:
The advantages are as follows: through setting up supplementary closing device in roof top left and right sides both ends, alright drive the rolling disc through the knob rotates for the rolling disc front end carries out the screens slip through the cross slot on draw-in column and the connecting plate, and the rolling disc rear end carries out the screens slip through stirring the arc wall on piece and the piece that compresses tightly, and the piece that compresses tightly carries out fixed slip through the locating part, thereby carries out flexible slip along the spout on the mounting panel through the piece that compresses tightly, realizes adjusting compressing tightly fixedly to the wafer, prevents the pressure loss wafer, guarantees the stability of waste liquid collection operation.
The advantages are as follows: through running through the middle part in the compact part lower extreme has vertical groove to vertical groove internal diameter surface slides with locating part screens, is convenient for carry out normal slip, guarantees gliding stability.
Drawings
FIG. 1 is a schematic diagram of a wafer spin coating waste liquid collection device according to the present invention;
FIG. 2 is a schematic view of an auxiliary pressing device according to the present invention;
FIG. 3 is a schematic view of a sliding mechanism according to the present invention;
FIG. 4 is a schematic view of the structure of the toggle member according to the present invention;
fig. 5 is a schematic structural view of the rotating disc of the present invention.
In the figure: the device comprises a top plate-1, a collecting box-2, an auxiliary pressing device-3, a placing seat-4, a placing groove-5, an air duct-6, a box body-31, a knob-32, a sliding mechanism-33, a rotating disc-331, a transverse groove-332, a connecting plate-333, a stirring piece-334, an arc-shaped groove-335, a pressing piece-336, a limiting piece-337, a sliding groove-338 and a mounting plate-339.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Referring to fig. 1, the present invention provides a wafer spin coating waste liquid collecting device: comprises a top plate 1, a collecting box 2, an auxiliary pressing device 3, a placing seat 4, a placing groove 5 and an air duct 6. The roof 1 bottom middle part is closely fixed with collecting box 2, and roof 1 top middle part fixed mounting has place seat 4, and place seat 4 top middle part embedding has standing groove 5, is convenient for carry out auxiliary placement, and the inboard bottom of standing groove 5 runs through has wind channel 6, and auxiliary hold-down device 3 sets up both ends about roof 1 top.
The overall placing seat 4 is cylindrical, the side surface is a cylindrical side surface, and the upper part is divided into a multi-layer structure. This cylindrical side surface makes the auxiliary pressing device 3, when set, set on a diameter of the cylindrical circular section so as to prevent the wafer on the placement base 4 from coming out of the side surface during the pressing process.
Referring to fig. 2, one of the parts of the auxiliary hold-down device 3 is shown (the auxiliary hold-down device 3 comprises two parts that are substantially symmetrical). The auxiliary pressing device 3 comprises a box body 31, a knob 32 and a sliding mechanism 33, wherein the knob 32 is fixedly arranged in the middle of the right side of the box body 31, so that the auxiliary pressing device is convenient to rotate under the force, and corresponding pressing and releasing actions are realized by using the knob 32. The middle part is provided with slide mechanism 33 in box 31, and box 31 fixed mounting is at roof 1 top left and right sides both ends, and the combination is referenced in fig. 1.
Please refer to fig. 3, wherein the sliding mechanism 33 includes a rotating disc 331, a transverse slot 332, a connecting plate 333, a toggle member 334, an arc slot 335, a pressing member 336, a limiting member 337, a sliding slot 338 and a mounting plate 339, wherein the outer edge of the front end surface of the rotating disc 331 slides in a clamping manner with the transverse slot 332 through a clamping post, so as to facilitate clamping transmission.
With continued reference to fig. 3, the transverse slot 332 is disposed through the middle portion of the connecting plate 333, the middle portion of the rear end of the rotating disc 331 is fixed to the stirring member 334, the stirring member 334 slides in a clamping manner against the inner diameter surface of the arc slot 335, the arc slot 335 penetrates through the middle portion of the compressing member 336, and the compressing member 336 is locked and fixed to four corners of the rear end surface of the connecting plate 333.
With continued reference to fig. 3, the middle part in the lower end of the pressing member 336 slides in a clamping manner with the limiting member 337, so as to facilitate the fixed sliding, the pressing member 336 is slidably matched along the sliding groove 338, the sliding groove 338 penetrates through the middle part in the mounting plate 339, so as to facilitate the connection and fixation, and the middle part in the rear end of the rotating disc 331 is connected with the knob 32 through a connecting shaft.
Wherein, as shown in fig. 2, the knob 32 is externally provided with a rubber sleeve, and the surface of the rubber sleeve is provided with anti-skid patterns, so that the pressing operation of the placement seat 4 is better realized due to the fact that hands slide when the device is used.
Four screw holes (not shown) are formed in the lower end of the outer side of the box body 31, and the screw holes are 8MM in diameter, so that locking and fixing are facilitated.
Referring to fig. 4 and 5, a clamping column (not labeled, as shown in fig. 5, located at the left side in the transverse slot 332) is disposed at the outer edge of the front end surface of the rotating disc 331, and the clamping column slides in a clamping manner with the inner diameter surface of the transverse slot 332, so as to ensure normal clamping transmission.
With continued reference to fig. 3, 4 and 5, a vertical groove (not labeled, as shown in fig. 5, and the bottom-most groove body) is formed in the middle of the lower end of the pressing member 336, and the inner diameter surface of the vertical groove and the limiting member 337 slide in a clamping manner, so that normal sliding is facilitated.
With continued reference to fig. 3, 4 and 5, the pressing member 336 is provided with a pressing rod (not labeled, as a portion of fig. 3 extends into the sliding groove 338), and the pressing rod is slidably engaged along the inner diameter surface of the sliding groove 338, so as to facilitate the auxiliary fixing.
Wherein, stir piece 334 can adopt stainless steel material, and its corrosion resistance is strong, and is with low costs, sexual valence relative altitude.
In the invention, the mounting plate 339 is made of PVC plastic, and is firm, durable, high in cost performance, corrosion-resistant and good in quality. The PVC plastic chemical industry field refers to a compound polyvinyl chloride, PVC materials have nonflammability, high strength, weather resistance and excellent geometric stability, PVC has strong resistance to oxidizing agents, reducing agents and strong acids, but can be corroded by concentrated oxidizing acids such as concentrated sulfuric acid and concentrated nitric acid, and is also not suitable for occasions of contact with aromatic hydrocarbons and chlorinated hydrocarbons.
The working principle of the wafer spin coating waste liquid collecting device provided by the invention is as follows:
firstly, a wafer spin coating waste liquid collecting device is arranged at a proper position, a placing seat 4 is arranged in the middle of an auxiliary pressing device 3, and then an air duct 6 (shown in figure 1) is connected with an external air outlet;
Secondly, when the wafer is required to be subjected to the collection of the wafer spin coating waste liquid, then the wafer to be processed is placed in a placing groove 5 in a placing seat 4, and the wafer is subjected to the processing operation through external spin coating equipment;
Thirdly, when the processing waste liquid that produces after the spin coating is collected (current waste liquid collection device structure is comparatively simple, the embedding is placed and is collected the waste liquid, the skew is rocked in the spin coating appears easily, and the dynamics is overweight to compress tightly and cause the wafer to warp when fixed and damage easily, influence the homogeneity and the waste liquid collection effect of coating, through setting up supplementary closing device 3 in roof 1 top left and right sides both ends, then force application to knob 32 (like fig. 2), in order to carry out, for example, clockwise rotation, alright drive rolling disc 331 (fig. 3 to fig. 5) through knob 32, make rolling disc 331 front end carry out the screens slip through the cross slot 332 on draw-in post and connecting plate 333, and rolling disc 331 rear end carries out the screens slip through the arc groove 335 on stirring piece 334 and compressing tightly piece 336, then compressing tightly piece 336 and carrying out the fixed slip through limiting piece 337, thereby carry out the flexible slip through compressing tightly piece 336 along spout 338 on the mounting panel, compressing tightly piece 336 inboard upper end is provided with down the depression bar, and down depression bar along spout 338 internal diameter surface sliding fit, be convenient for carry out supplementary fixed, realization is to compress tightly the wafer moderately, and corresponding regulation is fixed, and the degree of compressing tightly can guarantee to rotate stability can be guaranteed to the stability of the coating of the wafer, can be guaranteed, then the stability is guaranteed to be rotated and can be stably to collect.
The basic principle and main characteristics of the invention and the advantages of the invention are shown and described above, standard parts used by the invention can be purchased from market, special-shaped parts can be customized according to the description of the specification and the drawings, the specific connection modes of the parts adopt conventional means such as mature bolt rivets and welding in the prior art, the machinery, the parts and the equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection modes in the prior art, so that the description is omitted.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (3)
1. The wafer spin coating waste liquid collecting device comprises a top plate (1), a collecting box (2), an auxiliary pressing device (3) and a placing seat (4), wherein the middle part of the bottom end of the top plate (1) is tightly fixed with the collecting box (2);
the method is characterized in that: the auxiliary pressing device (3) is arranged at the left end and the right end of the top plate (1), the auxiliary pressing device (3) comprises a box body (31), a knob (32) and a sliding mechanism (33), the knob (32) is fixedly arranged in the middle of the right side of the box body (31), the sliding mechanism (33) is arranged in the middle of the box body (31), and the box body (31) is fixedly arranged at the left end and the right end of the top plate (1);
A placing seat (4) is fixedly arranged in the middle of the top end of the top plate (1), a placing groove (5) is embedded in the middle of the top end of the placing seat (4), and an air duct (6) penetrates through the bottom of the inner side of the placing groove (5);
The sliding mechanism (33) comprises a rotating disc (331), a transverse groove (332), a connecting plate (333), a stirring piece (334), an arc-shaped groove (335), a pressing piece (336), a limiting piece (337), a sliding groove (338) and a mounting plate (339), wherein the outer edge of the front end surface of the rotating disc (331) slides in a clamping way with the transverse groove (332) through a clamping post, the transverse groove (332) is arranged in the middle part in the connecting plate (333) in a penetrating way, the middle part of the rear end of the rotating disc (331) is mutually fixed with the stirring piece (334), and the stirring piece (334) slides in a clamping way with the inner diameter surface of the arc-shaped groove (335);
the arc-shaped groove (335) penetrates through the inner middle part of the pressing piece (336), and four corners of the rear end surface of the pressing piece (336) and the rear end surface of the connecting plate (333) are locked and fixed;
The middle part in the lower end of the pressing piece (336) slides in a clamping way with the limiting piece (337), the pressing piece (336) is in sliding fit with the sliding groove (338), the sliding groove (338) penetrates through the middle part in the mounting plate (339), and the middle part in the rear end of the rotating disc (331) is connected with the knob (32) through a connecting shaft;
the outer edge of the front end surface of the rotating disc (331) is provided with a clamping column, and the clamping column and the inner diameter surface of the transverse groove (332) slide in a clamping way;
A vertical groove penetrates through the middle part in the lower end of the pressing piece (336), and the inner diameter surface of the vertical groove and the limiting piece (337) slide in a clamping way;
The upper end of the inner side of the pressing piece (336) is provided with a pressing rod which is in sliding fit along the inner diameter surface of the sliding groove (338).
2. The wafer spin-on waste collection device of claim 1, wherein: the knob (32) is externally provided with a rubber sleeve, and the surface of the rubber sleeve is provided with anti-skid patterns.
3. The wafer spin-on waste collection device of claim 1, wherein: four screw holes are formed in the lower end of the outer side of the box body (31), and the diameter of each screw hole is 8MM.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010579751.9A CN111681973B (en) | 2020-06-23 | 2020-06-23 | Wafer spin coating waste liquid collection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010579751.9A CN111681973B (en) | 2020-06-23 | 2020-06-23 | Wafer spin coating waste liquid collection device |
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| Publication Number | Publication Date |
|---|---|
| CN111681973A CN111681973A (en) | 2020-09-18 |
| CN111681973B true CN111681973B (en) | 2024-08-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010579751.9A Active CN111681973B (en) | 2020-06-23 | 2020-06-23 | Wafer spin coating waste liquid collection device |
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| CN112942168B (en) * | 2021-02-05 | 2022-02-08 | 宁波交通工程咨询监理有限公司 | Movable traffic safety board device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN212380394U (en) * | 2020-06-23 | 2021-01-19 | 芯米(厦门)半导体设备有限公司 | Wafer spin coating waste liquid collection device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2957383B2 (en) * | 1993-05-27 | 1999-10-04 | 大日本スクリーン製造株式会社 | Rotary coating device |
| TW504776B (en) * | 1999-09-09 | 2002-10-01 | Mimasu Semiconductor Ind Co | Wafer rotary holding apparatus and wafer surface treatment apparatus with waste liquid recovery mechanism |
| KR100563911B1 (en) * | 2004-04-23 | 2006-03-30 | 어플라이드랩(주) | Spin coater |
| CN204564470U (en) * | 2015-03-26 | 2015-08-19 | 安徽三安光电有限公司 | A kind of gluing machine |
| CN108080222A (en) * | 2016-11-23 | 2018-05-29 | 沈阳芯源微电子设备有限公司 | The air draft switching device and its method of a kind of waste collection cup |
| CN110560327A (en) * | 2018-06-05 | 2019-12-13 | 深圳市旭控科技有限公司 | Silicon wafer coating source device |
| CN209868400U (en) * | 2019-05-14 | 2019-12-31 | 江西相岩科技有限公司 | Electronic device clamping structure |
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2020
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN212380394U (en) * | 2020-06-23 | 2021-01-19 | 芯米(厦门)半导体设备有限公司 | Wafer spin coating waste liquid collection device |
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