CN111676458A - Wafer metal sputtering equipment for chip - Google Patents
Wafer metal sputtering equipment for chip Download PDFInfo
- Publication number
- CN111676458A CN111676458A CN202010568895.4A CN202010568895A CN111676458A CN 111676458 A CN111676458 A CN 111676458A CN 202010568895 A CN202010568895 A CN 202010568895A CN 111676458 A CN111676458 A CN 111676458A
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- frame
- fixedly installed
- limiting
- machine body
- sputtering
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- 238000004544 sputter deposition Methods 0.000 title claims abstract description 45
- 239000002184 metal Substances 0.000 title claims abstract description 20
- 238000003780 insertion Methods 0.000 claims description 10
- 230000037431 insertion Effects 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 230000009467 reduction Effects 0.000 claims description 4
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 210000003205 muscle Anatomy 0.000 claims 1
- 230000009471 action Effects 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 7
- 239000011148 porous material Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 6
- 239000011261 inert gas Substances 0.000 description 4
- 238000001755 magnetron sputter deposition Methods 0.000 description 4
- 239000013077 target material Substances 0.000 description 4
- 238000007142 ring opening reaction Methods 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000003116 impacting effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical group C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
- F16M11/00—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters
- F16M11/20—Undercarriages with or without wheels
- F16M11/24—Undercarriages with or without wheels changeable in height or length of legs, also for transport only, e.g. by means of tubes screwed into each other
- F16M11/26—Undercarriages with or without wheels changeable in height or length of legs, also for transport only, e.g. by means of tubes screwed into each other by telescoping, with or without folding
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
- F16M11/00—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters
- F16M11/42—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters with arrangement for propelling the support stands on wheels
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Abstract
The invention discloses wafer metal sputtering equipment for chips, which comprises a sputtering machine body, wherein a supporting cushion seat is fixedly installed at the bottom of the sputtering machine body, a cabin door is arranged on the front surface of the sputtering machine body, a handle frame is fixedly installed on the front surface of the cabin door, and a limiting sleeve is fixedly installed on the side surface of the sputtering machine body. Through to counterpoint stopper and counterpoint ring counterpoint grafting, make the inside of spacing bushing pipe cunning to the stop collar, through pressing the spiale, make the spiale slide in the intercommunicating pore and insert to the locular part inside, promote the slip piece frame and extrude the spring, thereby make the spiale piece insert inside the cover grafting frame, when making the spiale counterpoint with spacing through-hole, the spiale can pop out under the reset action of spring and insert spacing through-hole, thereby it is fixed with the cover frame to make the spiale piece, thereby reached the effect of being convenient for install and dismantle, realized being convenient for carry out the target of adaptability assembly auxiliary structure according to the removal demand, it is more convenient to use.
Description
Technical Field
The invention relates to the technical field of sputtering equipment, in particular to wafer metal sputtering equipment for a chip.
Background
Chips, i.e., integrated circuits or microcircuits, microchips, chips/chips (chips), are a way in electronics to miniaturize circuits, including primarily semiconductor devices, including passive components, and the like, and are often fabricated on semiconductor wafer surfaces; introducing appropriate inert gas as a medium in a vacuum environment, impacting a target material by the aid of the inert gas in an accelerating way, impacting atoms on the surface of the target material, forming a coating on the surface, sputtering, generally referred to as magnetron sputtering, and belonging to a high-speed low-temperature sputtering method, wherein the process requires that the vacuum degree is about 1 x 10 < -3 > Torr, namely inert gas argon (Ar) is filled in the vacuum state of 1.3 x 10 < -3 > Pa, high-voltage direct current is added between a plastic substrate (anode) and a metal target material (cathode), electrons generated by glow discharge (glowddischarge) excite the inert gas to generate plasma, and the plasma bombs out the atoms of the metal target material and deposits the atoms on the plastic substrate; magnetron sputtering equipment is an important equipment for chip processing.
Most of magnetron sputtering equipment in the market at present is lack of an assembled movable auxiliary structure, so that the whole equipment is required to depend on large-scale suspension equipment and traction equipment in the moving or transporting process, the movement is inconvenient, and the whole equipment is difficult to move quickly and flexibly.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides wafer metal sputtering equipment for a chip, which solves the problems that most magnetron sputtering equipment in the market at present lacks a movable auxiliary structure which can be assembled, so that the whole equipment needs to depend on large-scale suspension equipment and traction equipment in the moving or transporting process, is inconvenient to move and is difficult to move the whole equipment quickly and flexibly.
In order to achieve the purpose, the invention adopts the following technical scheme: a wafer metal sputtering device for chips comprises a sputtering machine body, wherein a supporting pad seat is fixedly installed at the bottom of the sputtering machine body, a cabin door is arranged on the front side of the sputtering machine body, a handle frame is fixedly installed on the front side of the cabin door, a limiting sleeve is fixedly installed on the side surface of the sputtering machine body, a positioning ring is fixedly installed at one end, away from the sputtering machine body, of the limiting sleeve, a limiting liner tube is inserted into the limiting sleeve, a positioning plug is fixedly installed at one end, located inside the limiting sleeve, of the limiting liner tube, a connecting box frame is fixedly installed at one end, located outside the limiting sleeve, of the limiting liner tube, an inserting block is fixedly installed at the middle part, close to one side surface of the limiting liner tube, of the connecting box frame is sleeved with a sleeving frame in a sliding mode, the end part of the sleeving frame is fixedly connected with the middle part of the side surface of the sputtering machine body, and a limiting, the surface of the insertion block is provided with a communicating hole, the inside of the communicating hole is provided with a concave chamber, the inside of the concave chamber is connected with a sliding sheet frame in a sliding mode, one surface of the sliding sheet frame is fixedly provided with a spring, one surface of the sliding sheet frame, far away from the spring, is fixedly provided with an insertion shaft, and the insertion shaft is movably inserted into the limiting through hole and the communicating hole.
Preferably, a speed reduction motor is fixedly mounted at the top of the connecting box frame, a first bearing is mounted in the middle of the box wall on the top surface of the connecting box frame in a penetrating manner, the box wall of the connecting box frame is rotatably connected with a threaded shaft through the first bearing, a limiting wafer is fixedly mounted at the bottom end of the threaded shaft, a sliding lining frame is slidably connected inside the connecting box frame, a supporting sheet is fixedly mounted on the inner wall of the sliding lining frame, an internal threaded pipe is fixedly mounted at the end part of the supporting sheet, the internal threaded pipe is in threaded connection with the surface of the threaded shaft, a supporting plate is fixedly mounted at the bottom end of the sliding lining frame, a supporting leg is fixedly mounted at the bottom surface of the supporting plate, a universal wheel is fixedly mounted at the bottom end part of the supporting leg, a supporting transverse rib is fixedly mounted on the surface of the supporting leg, a, and the supporting transverse shaft is rotatably connected with the threaded shaft through a second bearing.
Preferably, a handheld shaft bracket is fixedly mounted on the side surface of the connecting box frame, a handheld sleeve is sleeved on the surface of the handheld shaft bracket, and an anti-skid ring groove is formed in the surface of the handheld sleeve.
Preferably, the handheld shaft bracket is of a round shaft bent bracket structure, and the handheld sleeve is a silicone rubber sleeve.
Preferably, the alignment ring is of a circular hopper-shaped ring pipe structure, and a ring opening of one end, close to the limiting sleeve, of the alignment ring is smaller than a ring opening of the other end of the alignment ring.
Preferably, the alignment plug is of a conical structure, and one end, close to the limiting liner tube, of the alignment plug is larger than the other end of the alignment plug.
Preferably, the limiting through hole and the communicating hole are circular through holes, and the aperture of the limiting through hole is equal to that of the communicating hole.
Preferably, every four supporting legs and universal wheel are all distributed to the bottom surface of backup pad, and four supporting legs and universal wheel are located the four corners of backup pad bottom surface respectively.
Compared with the prior art, the invention has the beneficial effects that:
1. this wafer metal sputtering equipment for chip, through to counterpoint stopper and counterpoint ring counterpoint grafting, make the inside of spacing bushing pipe cunning to the stop collar, through pressing the spiale, make the spiale slide in the intercommunicating pore and insert to the locular part inside, promote the slip sheet frame and extrude the spring, thereby make the grafting piece insert set frame inside, when making the spiale counterpoint with spacing through-hole, the spiale can pop out under the reset action of spring and insert spacing through-hole, thereby make the spiale and cup joint the frame fixed, thereby reached the effect of being convenient for install and dismantling, realized being convenient for carry out the target of adaptability assembly auxiliary structure according to the removal demand, it is more convenient to use.
2. This wafer metal sputtering equipment for chip, it rotates to drive the screw shaft through gear motor, can drive the internal thread pipe and rise or descend the removal at the surface of screw shaft, make backing sheet and slip lining frame slide at the inside longitudinal lift of connecting the tank tower, thereby drive backup pad and supporting leg and universal wheel and rise or descend the removal, keep off the universal wheel and descend to supporting ground, and when having supported whole device, make the universal wheel roll and can drive whole equipment and remove through promoting whole device, thereby reached the effect of being convenient for swiftly remove, realized being convenient for adjust and accomodate the target of dismantling in order to move, it is more nimble to move.
Drawings
FIG. 1 is a front view of the structure of the present invention;
FIG. 2 is a front sectional view of the structure of the position limiting sleeve of the present invention;
FIG. 3 is a front cross-sectional view of the plug block structure of the present invention;
FIG. 4 is a front cross-sectional view of the connecting box frame structure of the present invention;
FIG. 5 is a top view of the hand-held pedestal structure of the present invention.
In the figure: 1 sputtering machine body, 2 supporting cushion seats, 3 doors, 4 handle frames, 5 limiting sleeves, 6 aligning rings, 7 limiting liner tubes, 8 aligning plugs, 9 connecting box frames, 10 splicing blocks, 11 splicing frames, 12 limiting through holes, 13 communicating holes, 14 concave chambers, 15 sliding sheet frames, 16 springs, 17 splicing shafts, 18 speed reducing motors, 19 first bearings, 20 threaded shafts, 21 limiting circular sheets, 22 sliding liner frames, 23 supporting sheets, 24 internal threaded tubes, 25 supporting plates, 26 supporting legs, 27 universal wheels, 28 supporting transverse ribs, 29 supporting transverse shafts, 30 second bearings, 31 handheld shaft frames, 32 handheld sleeves and 33 anti-slip ring grooves.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example (b): referring to fig. 1-5, a wafer metal sputtering device for chips comprises a sputtering machine body 1, a supporting pad seat 2 is fixedly installed at the bottom of the sputtering machine body 1, a cabin door 3 is arranged on the front surface of the sputtering machine body 1, a handle frame 4 is fixedly installed on the front surface of the cabin door 3, a limit sleeve 5 is fixedly installed on the side surface of the sputtering machine body 1, an alignment ring 6 is fixedly installed at one end of the limit sleeve 5 far away from the sputtering machine body 1, a limit liner tube 7 is inserted into the limit sleeve 5, an alignment plug 8 is fixedly installed at one end of the limit liner tube 7 positioned inside the limit sleeve 5, the alignment ring 6 is in a circular funnel-shaped ring structure, the ring opening of one end of the alignment ring 6 close to the limit sleeve 5 is smaller than that of the other end, the alignment plug 8 is in a conical structure, one end of the alignment plug 8 close to the limit liner tube 7 is larger than that of the other end, and a connecting box frame, an inserting block 10 is fixedly installed in the middle of one side face, close to the limiting liner tube 7, of the connecting box frame 9, an inserting block 10 is fixedly installed in the middle of the side face, close to the limiting liner tube 7, of the connecting box frame 9, a sleeving frame 11 is slidably sleeved on the surface of the inserting block 10, the end portion of the sleeving frame 11 is fixedly connected with the middle of the side face of the sputtering machine body 1, a limiting through hole 12 is formed in the frame wall of the sleeving frame 11 in a penetrating mode, a communicating hole 13 is formed in the surface of the inserting block 10, the limiting through hole 12 and the communicating hole 13 are both circular through holes, the aperture of the limiting through hole 12 is equal to that of the communicating hole 13, a concave chamber 14 is formed in the communicating hole 13, a sliding sheet frame 15 is slidably connected with the inside of the concave chamber 14, a spring 16 is fixedly installed on one side of the sliding sheet frame 15, an inserting shaft 17 is fixedly installed on one side, far away from, through pressing the spiale 17, make the spiale 17 slide in the intercommunicating pore 13 and insert to the alcove 14 inside, promote slip piece frame 15 and extrude spring 16, thereby make the spiale 10 insert inside the cover joint frame 11, when making spiale 17 counterpoint with spacing through-hole 12, spiale 17 can pop out under spring 16's reset action and insert spacing through-hole 12, thereby it is fixed with cover joint frame 11 to make the spiale 10, thereby reached the effect of being convenient for install and dismantling, realized being convenient for carry out the target of adaptability assembly auxiliary structure according to the removal demand, it is more convenient to use.
The top of the connecting box frame 9 is fixedly provided with a speed reducing motor 18, the middle part of the top box wall of the connecting box frame 9 is provided with a first bearing 19 in a penetrating way, the box wall of the connecting box frame 9 is rotatably connected with a threaded shaft 20 through the first bearing 19, the bottom end of the threaded shaft 20 is fixedly provided with a limiting wafer 21, the inside of the connecting box frame 9 is slidably connected with a sliding lining frame 22, the inner wall of the sliding lining frame 22 is fixedly provided with a supporting sheet 23, the end part of the supporting sheet 23 is fixedly provided with an internal threaded pipe 24, the internal threaded pipe 24 is in threaded connection with the surface of the threaded shaft 20, the bottom end of the sliding lining frame 22 is fixedly provided with a supporting plate 25, the bottom surface of the supporting plate 25 is fixedly provided with a supporting leg 26, the bottom end of the supporting leg 26 is fixedly provided with a universal wheel 27, the surface of the supporting leg 26 is, the supporting cross shaft 29 is rotatably connected with the threaded shaft 20 through a second bearing 30, a handheld shaft bracket 31 is fixedly installed on the side surface of the connecting box frame 9, a handheld sleeve 32 is sleeved on the surface of the handheld shaft bracket 31, an anti-slip ring groove 33 is formed in the surface of the handheld sleeve 32, the handheld shaft bracket 31 is of a round shaft bent frame structure, the handheld sleeve 32 is a silicone rubber sleeve, four supporting legs 26 and universal wheels 27 are distributed on the bottom surface of each supporting plate 25 respectively, the four supporting legs 26 and the universal wheels 27 are located at four corners of the bottom surface of the supporting plate 25 respectively, the threaded shaft 20 is driven to rotate through the speed reduction motor 18, the pipe 24 can be driven to ascend or descend on the surface of the threaded shaft 20, the supporting sheet 23 and the sliding lining frame 22 can longitudinally ascend and descend and slide in the connecting box frame 9, the supporting plate 25, the supporting legs 26 and the universal wheels 27 are driven to ascend or descend, the universal wheels 26 are stopped from descending to the supporting ground, and, make universal wheel 27 roll and can drive whole equipment and remove through promoting whole device to reach the effect that the swiftly removes of being convenient for, realized being convenient for adjust and accomodate in order to carry out the target of dismantling, it is more nimble to remove.
To sum up, in the wafer metal sputtering device for the chip, the alignment plug 8 is aligned and inserted with the alignment ring 6, so that the limiting liner tube 7 is inserted into the limiting sleeve 5 in a sliding manner, the insertion shaft 17 is inserted into the concave chamber 14 in the communicating hole 13 in a sliding manner by pressing the insertion shaft 17, the sliding sheet frame 15 is pushed to extrude the spring 16, so that the insertion block 10 is inserted into the sleeving frame 11, when the insertion shaft 17 is aligned with the limiting through hole 12, the insertion shaft 17 can be popped out and inserted into the limiting through hole 12 under the resetting action of the spring 16, so that the insertion block 10 and the sleeving frame 11 are fixed, the mounting and dismounting effects are achieved, the aim of adaptively assembling an auxiliary structure according to the moving requirements is achieved, the use is more convenient, the reduction motor 18 drives the threaded shaft 20 to rotate, and the internal threaded tube 24 can be driven to move up or down on the surface of the threaded shaft 20, the support sheet 23 and the sliding lining frame 22 are vertically lifted and slid in the connecting box frame 9, so as to drive the support plate 25, the support leg 26 and the universal wheel 27 to move upwards or downwards, the universal wheel 26 is stopped from descending to the support ground, and when the whole device is supported, the whole device can be driven to move by pushing the whole device to enable the universal wheel 27 to roll, so that the effect of conveniently and quickly moving is achieved, the aim of conveniently adjusting and accommodating to disassemble is achieved, the device is more flexible to move, the problem that most of magnetic control sputtering equipment in the current market is lack of a movable auxiliary structure which can be assembled is solved, the whole equipment needs to depend on large-scale suspension equipment and traction equipment in the moving or moving process, the movement is inconvenient, and the problem that the whole equipment is difficult to move quickly and flexibly is solved.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The wafer metal sputtering equipment for the chip comprises a sputtering machine body (1) and is characterized in that a supporting pad seat (2) is fixedly installed at the bottom of the sputtering machine body (1), a cabin door (3) is arranged on the front face of the sputtering machine body (1), a handle frame (4) is fixedly installed on the front face of the cabin door (3), a limiting sleeve (5) is fixedly installed on the side surface of the sputtering machine body (1), a contraposition ring (6) is fixedly installed at one end, far away from the sputtering machine body (1), of the limiting sleeve (5), a limiting liner tube (7) is inserted into the limiting sleeve (5), a contraposition plug (8) is fixedly installed at one end, located inside the limiting sleeve (5), of the limiting liner tube (7), a connecting box frame (9) is fixedly installed at one end, located outside the limiting sleeve (5), of the connecting box frame (9), and an insertion block (10) is fixedly installed at the middle portion, close to one side face of the limiting liner tube (7), the surface of the splicing block (10) is slidably sleeved with the splicing frame (11), the end of the splicing frame (11) is fixedly connected with the middle of the side surface of the sputtering machine body (1), a limiting through hole (12) is formed in the frame wall of the splicing frame (11) in a penetrating mode, a communication hole (13) is formed in the surface of the splicing block (10), a concave chamber (14) is formed in the communication hole (13), a sliding sheet frame (15) is connected to the inside of the concave chamber (14) in a sliding mode, a spring (16) is fixedly mounted on one side of the sliding sheet frame (15), one side, far away from the spring (16), of the sliding sheet frame (15) is fixedly provided with a splicing shaft (17), and the splicing shaft (17) is movably spliced in the limiting through hole (12) and the communication hole (13).
2. The wafer metal sputtering device for the chip according to claim 1, wherein a speed reduction motor (18) is fixedly installed at the top of the connecting box frame (9), a first bearing (19) is installed in the middle of the box wall on the top surface of the connecting box frame (9) in a penetrating manner, the box wall of the connecting box frame (9) is rotatably connected with a threaded shaft (20) through the first bearing (19), a limiting wafer (21) is fixedly installed at the bottom end of the threaded shaft (20), a sliding lining frame (22) is slidably connected inside the connecting box frame (9), a supporting plate (23) is fixedly installed on the inner wall of the sliding lining frame (22), an internal threaded pipe (24) is fixedly installed at the end of the supporting plate (23), the internal threaded pipe (24) is in threaded connection with the surface of the threaded shaft (20), a supporting plate (25) is fixedly installed at the bottom end of the sliding lining frame (22), the bottom surface fixed mounting of backup pad (25) has supporting leg (26), the bottom fixed mounting of supporting leg (26) has universal wheel (27), the fixed surface of supporting leg (26) installs and supports horizontal muscle (28), the inner wall fixed mounting of connecting box rack (9) has support cross axle (29), the tip fixed mounting who supports cross axle (29) has second bearing (30), and supports cross axle (29) and rotate with threaded shaft (20) through second bearing (30) and be connected.
3. The wafer metal sputtering device for the chip as claimed in claim 2, wherein a hand-held shaft bracket (31) is fixedly mounted on a side surface of the connecting box bracket (9), a hand-held sleeve (32) is sleeved on the surface of the hand-held shaft bracket (31), and an anti-slip ring groove (33) is formed on the surface of the hand-held sleeve (32).
4. The wafer metal sputtering device for the chip as recited in claim 3, wherein the handheld shaft bracket (31) is a round shaft bent bracket structure, and the handheld sleeve (32) is a silicone rubber sleeve.
5. The apparatus for sputtering metal onto a wafer according to claim 1, wherein the alignment ring (6) has a funnel-shaped collar structure, and the collar of the alignment ring (6) near one end of the position-limiting sleeve (5) is smaller than the collar of the other end thereof.
6. Wafer metal sputtering equipment for chips according to claim 1, characterized in that the alignment plug (8) has a cone-shaped structure, and one end of the alignment plug (8) close to the limiting liner tube (7) is larger than the other end thereof.
7. Wafer metal sputtering equipment for chips according to claim 1, characterized in that the limiting through hole (12) and the communication hole (13) are circular through holes, and the aperture of the limiting through hole (12) and the aperture of the communication hole (13) are equal.
8. Wafer metal sputtering equipment for chips according to claim 2, characterized in that the bottom surface of each support plate (25) is distributed with four support legs (26) and universal wheels (27), and the four support legs (26) and the universal wheels (27) are respectively positioned at four corners of the bottom surface of the support plate (25).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010568895.4A CN111676458B (en) | 2020-06-19 | 2020-06-19 | Wafer metal sputtering equipment for chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010568895.4A CN111676458B (en) | 2020-06-19 | 2020-06-19 | Wafer metal sputtering equipment for chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111676458A true CN111676458A (en) | 2020-09-18 |
| CN111676458B CN111676458B (en) | 2022-06-24 |
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| CN202010568895.4A Active CN111676458B (en) | 2020-06-19 | 2020-06-19 | Wafer metal sputtering equipment for chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115302707A (en) * | 2022-07-11 | 2022-11-08 | 江苏鑫瑞德模具科技有限公司 | Synchronous belt arc inner tooth forming die |
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| CN111676458B (en) | 2022-06-24 |
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