CN111669904A - Processing method of multilayer circuit board with golden fingers - Google Patents
Processing method of multilayer circuit board with golden fingers Download PDFInfo
- Publication number
- CN111669904A CN111669904A CN202010355762.9A CN202010355762A CN111669904A CN 111669904 A CN111669904 A CN 111669904A CN 202010355762 A CN202010355762 A CN 202010355762A CN 111669904 A CN111669904 A CN 111669904A
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- hole
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- gold
- inner layer
- board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a processing method of a multilayer circuit board with a golden finger, which comprises the following steps: preparing materials, manufacturing an inner layer circuit, pressing, drilling once, manufacturing a golden finger circuit, plugging with resin once, drilling twice, manufacturing an outer layer circuit, plugging with resin twice and preventing welding. According to the processing method of the multilayer circuit board with the golden fingers, the lead wires of the golden fingers are guided and arranged on the inner layer board in a blind hole mode, and the wiring pattern of an outer layer circuit can be prevented from being influenced.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a processing method of a multilayer circuit board with golden fingers.
Background
Circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. The development of the circuit board has been over 100 years old, the design is mainly a layout design, and the circuit board has the main advantages of greatly reducing errors of wiring and assembly and improving the automation level and the production labor rate. The printed circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of layers of the circuit board.
In order to achieve the plugability of the circuit board, a plug terminal is usually required to be designed on the circuit board, and a golden finger, such as a memory stick, is printed on the surface of the plug terminal. However, the number of the gold fingers is usually large, and if the leads of the gold fingers are directly arranged on the outer side surface of the circuit board, the layout of other circuits on the surface of the circuit board is seriously affected.
Disclosure of Invention
Aiming at the problems, the invention provides a processing method of a multilayer circuit board with a golden finger, which leads the lead of the golden finger in a blind hole mode and arranges the lead on an inner layer board, and can avoid influencing the wiring pattern of an outer layer circuit.
In order to achieve the purpose, the invention is solved by the following technical scheme:
a processing method of a multilayer circuit board with golden fingers comprises the following steps:
s1, preparing materials: preparing a substrate, and cutting to obtain an inner layer plate, an upper layer plate and a lower layer plate;
s2 inner layer circuit manufacturing: after the inner layer plate is subjected to electroplating, film pasting, developing, exposure and film tearing, a first inner layer circuit and a second inner layer circuit are respectively manufactured on the upper end face and the lower end face of the inner layer plate;
s3, pressing: preparing a first prepreg, a second prepreg, a third prepreg and a fourth prepreg, sequentially laminating an upper layer plate, a second prepreg, an inner layer plate, a third prepreg and a lower layer plate, respectively clamping the first prepreg and the fourth prepreg on two sides of the inner layer plate, and pressing to obtain a multilayer plate;
s4 primary drilling: drilling a plurality of first blind holes and second blind holes corresponding to the positions of the golden fingers in the golden finger wiring areas on the upper end surface and the lower end surface of the multilayer board respectively;
s5 golden finger circuit manufacturing: after electroplating, film pasting, developing, exposing and film tearing are carried out on the golden finger wiring areas on the upper end face and the lower end face of the multilayer board, a first golden finger circuit and a second golden finger circuit are respectively manufactured, and a first gold pore and a second gold pore are respectively formed in the first blind hole and the second blind hole after electroplating;
s6 primary resin plugging: printing epoxy resin on the end faces of the first gold hole and the second gold hole, and filling the epoxy resin in the first gold hole and the second gold hole;
s7 secondary drilling: drilling a plurality of third blind holes and fourth blind holes in outer layer wiring areas of the upper end face and the lower end face of the multilayer board respectively, and drilling through holes which are communicated up and down on the multilayer circuit board;
s8 manufacturing an outer layer circuit: respectively manufacturing outer layer wiring areas on the upper end face and the lower end face of the multilayer board after electroplating, film pasting, developing, exposing and film tearing to obtain a first outer circuit and a second outer circuit, and respectively forming a third gold hole, a fourth gold hole and a fifth gold hole in the third blind hole, the fourth blind hole and the through hole after electroplating;
s9 secondary resin hole plugging: printing epoxy resin on the end faces of the third gold melting hole, the fourth gold melting hole and the fifth gold melting hole, and filling the epoxy resin in the third gold melting hole, the fourth gold melting hole and the fifth gold melting hole;
s10 solder mask: and printing a layer of solder mask ink on the end surfaces of the first outer circuit and the second outer circuit to finish the manufacture.
Specifically, in step S2, the surfaces of the first inner layer circuit and the second inner layer circuit need to be subjected to microetching treatment to roughen the surfaces of the first inner layer circuit and the second inner layer circuit.
Specifically, in step S3, after the pressing, the edges of the multi-layer board need to be ground with sandpaper.
Specifically, in both steps S6 and S9, after the epoxy resin is printed, the end faces of the holes need to be ground by using sandpaper.
Specifically, the first blind hole, the second blind hole, the third blind hole and the fourth blind hole all extend to the inner side of the inner-layer plate.
The invention has the beneficial effects that:
firstly, the processing method of the multilayer circuit board guides and arranges the lead of the golden finger on the inner layer board in a blind hole mode, and can avoid influencing the wiring pattern of the outer layer circuit;
and secondly, the electric conduction between the golden finger and the outer side circuit can be realized by utilizing the inner layer plate with a smaller area, the whole circuit board is not required, and the material cost is reduced.
Drawings
FIG. 1 is a schematic view of a substrate having a cut of an inner layer plate, an upper layer plate and a lower layer plate.
Fig. 2 is a schematic structural view of the inner layer board manufactured in step S2.
FIG. 3 is a schematic structural diagram of a multilayer circuit board with gold fingers prepared by the present invention.
FIG. 4 is a schematic structural diagram of steps S3-S6 according to the present invention.
FIG. 5 is a schematic structural diagram of steps S7-S9 according to the present invention.
The reference signs are: the printed circuit board comprises an inner board 1, an upper board 2, a first outer circuit 21, a lower board 3, a second outer circuit 31, a first inner circuit 11, a second inner circuit 12, a first blind hole 13, a second blind hole 14, a first golden finger circuit 15, a second golden finger circuit 16, a third blind hole 17, a fourth blind hole 18, a first semi-solidified board 4, a second semi-solidified board 5, a third semi-solidified board 6, a fourth semi-solidified board 7 and a through hole 8.
Detailed Description
The present invention will be described in further detail with reference to examples and drawings, but the embodiments of the present invention are not limited thereto.
Referring to FIGS. 1-5:
a processing method of a multilayer circuit board with golden fingers comprises the following steps:
s1, preparing materials: preparing a substrate, wherein cutting marks of an inner layer plate 1, an upper layer plate 2 and a lower layer plate 3 are designed in advance on the substrate, and the inner layer plate 1, the upper layer plate 2 and the lower layer plate 3 are obtained after cutting;
s2 inner layer circuit manufacturing: after the inner layer plate 1 is subjected to electroplating, film pasting, developing, exposure and film tearing, a first inner layer circuit 11 and a second inner layer circuit 12 are respectively manufactured on the upper end face and the lower end face of the inner layer plate 1;
s3, pressing: preparing a first prepreg 4, a second prepreg 5, a third prepreg 6 and a fourth prepreg 7, sequentially laminating an upper layer plate 2, the second prepreg 5, an inner layer plate 1, the third prepreg 6 and a lower layer plate 3, respectively clamping the first prepreg 4 and the fourth prepreg 7 on two sides of the inner layer plate 1, and pressing to obtain a multilayer plate, wherein in order to make the edge of the multilayer plate smoother, the edge of the multilayer plate needs to be ground by using sand paper to remove resin materials protruding after pressing;
s4 primary drilling: dividing two golden finger wiring areas on the upper end surface and the lower end surface of the multilayer board, respectively drilling a plurality of first blind holes 13 and second blind holes 14 corresponding to the positions of the golden fingers in the golden finger wiring areas on the upper end surface and the lower end surface of the multilayer board, wherein the first blind holes 13 and the second blind holes 14 can be arranged at the edge positions of the golden fingers in order to shorten the length of a lead;
s5 golden finger circuit manufacturing: after electroplating, film pasting, developing, exposing and film tearing are carried out on the golden finger wiring areas on the upper end face and the lower end face of the multilayer board, a first golden finger circuit 15 and a second golden finger circuit 16 are respectively manufactured, after electroplating, copper is coated on the inner walls of a first blind hole 13 and a second blind hole 14, and a first golden hole and a second golden hole are respectively formed, wherein the first golden hole is used for realizing bridge electric connection between the first golden finger circuit 15 and the first inner layer circuit 11, and the second golden hole is used for realizing bridge electric connection between the second golden finger circuit 16 and the second inner layer circuit 12;
s6 primary resin plugging: printing epoxy resin on the end faces of the first gold hole and the second gold hole, and filling the epoxy resin in the first gold hole and the second gold hole, wherein in order to enable the upper ends of the first gold hole and the second gold hole to be more smooth, the end faces of the holes need to be ground by using sand paper so as to remove the resin material protruding after plugging the holes;
s7 secondary drilling: drilling a plurality of third blind holes 17 and fourth blind holes 18 in outer layer wiring areas of the upper end face and the lower end face of the multilayer board respectively, and drilling through holes 8 which are communicated up and down on the multilayer circuit board;
s8 manufacturing an outer layer circuit: after electroplating, film pasting, developing, exposing and film tearing are carried out on outer layer wiring areas on the upper end face and the lower end face of the multilayer board, a first outer circuit 21 and a second outer circuit 31 are respectively manufactured, and after electroplating, copper is coated on the inner walls of a third blind hole 17, a fourth blind hole 18 and a through hole 8, so that a third gold hole, a fourth gold hole and a fifth gold hole are respectively formed;
s9 secondary resin hole plugging: printing epoxy resin on the end faces of the third gold hole, the fourth gold hole and the fifth gold hole, filling the epoxy resin in the third gold hole, the fourth gold hole and the fifth gold hole, and grinding the end faces of the third gold hole, the fourth gold hole and the fifth gold hole by using sand paper to remove resin materials protruding after plugging holes in order to enable the upper ends of the third gold hole, the fourth gold hole and the upper end and the lower end of the fifth gold hole to be more smooth;
s10 solder mask: and printing a layer of solder mask ink on the end surfaces of the first outer circuit 21 and the second outer circuit 31 to finish the manufacture.
Preferably, in step S2, in order to improve the adhesion between the laminated layers of the second prepreg 5, the inner layer board 1, and the third prepreg 6, the surfaces of the first inner layer circuit 11 and the second inner layer circuit 12 need to be microetched to roughen the surfaces of the first inner layer circuit 11 and the second inner layer circuit.
The above examples only show one embodiment of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (5)
1. A processing method of a multilayer circuit board with a golden finger is characterized by comprising the following steps:
s1, preparing materials: preparing a substrate, and cutting to obtain an inner layer plate (1), an upper layer plate (2) and a lower layer plate (3);
s2 inner layer circuit manufacturing: after the inner layer plate (1) is subjected to electroplating, film pasting, developing, exposure and film tearing, a first inner layer circuit (11) and a second inner layer circuit (12) are respectively manufactured on the upper end face and the lower end face of the inner layer plate (1);
s3, pressing: preparing a first prepreg (4), a second prepreg (5), a third prepreg (6) and a fourth prepreg (7), sequentially laminating an upper plate (2), the second prepreg (5), an inner plate (1), the third prepreg (6) and a lower plate (3), respectively clamping the first prepreg (4) and the fourth prepreg (7) on two sides of the inner plate (1), and pressing to obtain a multilayer plate;
s4 primary drilling: drilling a plurality of first blind holes (13) and second blind holes (14) corresponding to the positions of the golden fingers in the golden finger wiring areas on the upper end surface and the lower end surface of the multilayer board respectively;
s5 golden finger circuit manufacturing: after electroplating, film pasting, developing, exposing and film tearing are carried out on the golden finger wiring areas on the upper end face and the lower end face of the multilayer board, a first golden finger circuit (15) and a second golden finger circuit (16) are respectively manufactured, and a first golden hole and a second golden hole are respectively formed in the first blind hole (13) and the second blind hole (14) after electroplating;
s6 primary resin plugging: printing epoxy resin on the end faces of the first gold hole and the second gold hole, and filling the epoxy resin in the first gold hole and the second gold hole;
s7 secondary drilling: drilling a plurality of third blind holes (17) and fourth blind holes (18) in outer layer wiring areas of the upper end face and the lower end face of the multilayer board respectively, and drilling through holes (8) which are communicated up and down on the multilayer circuit board;
s8 manufacturing an outer layer circuit: after electroplating, film pasting, developing, exposing and film tearing are carried out on outer layer wiring areas on the upper end face and the lower end face of the multilayer board, a first outer circuit (21) and a second outer circuit (31) are respectively manufactured, and a third gold hole, a fourth gold hole and a fifth gold hole are respectively formed in a third blind hole (17), a fourth blind hole (18) and a through hole (8) after electroplating;
s9 secondary resin hole plugging: printing epoxy resin on the end faces of the third gold melting hole, the fourth gold melting hole and the fifth gold melting hole, and filling the epoxy resin in the third gold melting hole, the fourth gold melting hole and the fifth gold melting hole;
s10 solder mask: and printing a layer of solder mask ink on the end surfaces of the first outer circuit (21) and the second outer circuit (31) to finish the manufacture.
2. The method as claimed in claim 1, wherein in step S2, the surfaces of the first inner layer circuit (11) and the second inner layer circuit (12) are further microetched to roughen the surfaces of the first inner layer circuit (11) and the second inner layer circuit.
3. The method of claim 1, wherein in step S3, after the pressing, the edges of the multi-layer board are ground with sand paper.
4. The method of claim 1, wherein the ends of the holes are ground with sand paper after printing epoxy resin in steps S6 and S9.
5. The processing method of the multilayer circuit board with the golden finger as claimed in claim 1, wherein the first blind hole (13), the second blind hole (14), the third blind hole (17) and the fourth blind hole (18) all extend to the inner side of the inner layer board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010355762.9A CN111669904B (en) | 2020-04-29 | 2020-04-29 | Processing method of multilayer circuit board with golden fingers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010355762.9A CN111669904B (en) | 2020-04-29 | 2020-04-29 | Processing method of multilayer circuit board with golden fingers |
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| Publication Number | Publication Date |
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| CN111669904A true CN111669904A (en) | 2020-09-15 |
| CN111669904B CN111669904B (en) | 2023-02-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010355762.9A Active CN111669904B (en) | 2020-04-29 | 2020-04-29 | Processing method of multilayer circuit board with golden fingers |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101309556A (en) * | 2008-07-08 | 2008-11-19 | 深圳崇达多层线路板有限公司 | Production method of circuit board having long and short golden finger |
| CN104427783A (en) * | 2013-08-19 | 2015-03-18 | 宏启胜精密电子(秦皇岛)有限公司 | A flexible printed circuit board having golden fingers and manufacturing method thereof |
| US20160150653A1 (en) * | 2013-08-02 | 2016-05-26 | Peking University Founder Group Co., Ltd. | Manufacturing method for back drilling hole in pcb and pcb |
| CN105704946A (en) * | 2016-03-22 | 2016-06-22 | 深圳崇达多层线路板有限公司 | Fabrication method for printed circuit board with golden finger coated with gold on four surfaces |
| CN106535508A (en) * | 2016-11-14 | 2017-03-22 | 福建世卓电子科技有限公司 | Multi-layer board flexible circuit board built-in golden finger exposure process |
-
2020
- 2020-04-29 CN CN202010355762.9A patent/CN111669904B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101309556A (en) * | 2008-07-08 | 2008-11-19 | 深圳崇达多层线路板有限公司 | Production method of circuit board having long and short golden finger |
| US20160150653A1 (en) * | 2013-08-02 | 2016-05-26 | Peking University Founder Group Co., Ltd. | Manufacturing method for back drilling hole in pcb and pcb |
| CN104427783A (en) * | 2013-08-19 | 2015-03-18 | 宏启胜精密电子(秦皇岛)有限公司 | A flexible printed circuit board having golden fingers and manufacturing method thereof |
| CN105704946A (en) * | 2016-03-22 | 2016-06-22 | 深圳崇达多层线路板有限公司 | Fabrication method for printed circuit board with golden finger coated with gold on four surfaces |
| CN106535508A (en) * | 2016-11-14 | 2017-03-22 | 福建世卓电子科技有限公司 | Multi-layer board flexible circuit board built-in golden finger exposure process |
Non-Patent Citations (1)
| Title |
|---|
| 李小晓等: "埋盲孔板通盲孔同步电镀铜厚均匀性工艺技术研究", 《印制电路信息》 * |
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| CN111669904B (en) | 2023-02-24 |
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