CN111665112A - Auxiliary device for metallographic sample preparation of plastic packaged chip and sample preparation method - Google Patents
Auxiliary device for metallographic sample preparation of plastic packaged chip and sample preparation method Download PDFInfo
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- CN111665112A CN111665112A CN202010672287.8A CN202010672287A CN111665112A CN 111665112 A CN111665112 A CN 111665112A CN 202010672287 A CN202010672287 A CN 202010672287A CN 111665112 A CN111665112 A CN 111665112A
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- sample
- plastic package
- sample preparation
- chip
- package chip
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/36—Embedding or analogous mounting of samples
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
- G01N2001/2866—Grinding or homogeneising
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/36—Embedding or analogous mounting of samples
- G01N2001/364—Embedding or analogous mounting of samples using resins, epoxy
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/36—Embedding or analogous mounting of samples
- G01N2001/366—Moulds; Demoulding
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- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
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- Analytical Chemistry (AREA)
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Abstract
The invention discloses an auxiliary device for metallographic sample preparation of plastic package chips, which comprises a cylindrical sample preparation mold and a metal sheet, wherein the metal sheet is Z-shaped. The invention can prepare a plurality of samples at the same time, saves cost, grinds a plurality of samples at the same time, and improves efficiency.
Description
Technical Field
The invention relates to a method for preparing a chip sample, in particular to an auxiliary device for preparing a metallographic sample of a plastic package chip and a sample preparation method.
Background
At present, the failure analysis method of the plastic package chip mainly comprises nondestructive analysis and destructive analysis; the nondestructive analysis mainly comprises electrical property test, appearance inspection, X-Ray inspection, ultrasonic scanning and the like; the destructive analysis mainly includes surface grinding, cross-section grinding, decap analysis, and the like. Because the volume of the plastic package chip is small and is not easy to control, all methods for grinding the section of the plastic package chip generally form a cylindrical or cubic die which is convenient for grinding operation by solidifying a sample to be subjected to section analysis through cold mosaic resin.
The general resin sampling method is as follows: firstly, selecting a cylindrical or cubic cold-inlaid sample mold manufactured by a manufacturer and cold-inlaid resin (at present, metallographic resin powder and a curing agent or cold-inlaid resin 'liquid' and the curing agent are matched according to the suggested proportion of the manufacturer to form a metallographic cured resin mixed solution, pouring the metallographic cured resin mixed solution into the cold-inlaid sample mold for curing), then adopting a metallographic sample-making sample clamp 1 to erect and fix a plastic-sealed chip 2, then putting the plastic-sealed chip into a sample-making cold-inlaid mold 3 (shown in figure 3), pouring the cold-inlaid resin mixed solution, finally, demoulding, grinding, polishing and observing by a microscope after the resin is cured.
The conventional sample adopts LGA packaging, and when failure analysis is carried out, bump balls in a chip need to be ground out at the same time to observe whether bump connection is abnormal or not; the existing sample preparation clamp can only clamp one sample at a time, and sometimes, the cross sections of a plurality of samples need to be ground to the same bump connection position at the same time to determine whether bump connection is abnormal, so that the sample preparation clamp cannot meet the requirement.
Disclosure of Invention
The invention aims to solve the technical problem of providing an auxiliary device and a sample preparation method for metallographic sample preparation of a plastic package chip, which can simultaneously prepare a plurality of samples, save cost, complete grinding at one time, and improve efficiency.
The technical scheme adopted by the invention for solving the technical problem is as follows:
the utility model provides an auxiliary device of plastic envelope chip metallography system appearance, includes cylinder system appearance mould, still includes the foil, the foil is the Z type.
Preferably, the metal sheet is a stainless steel sheet, and the thickness of the metal sheet is 0.3-0.5 mm.
Preferably, the corners of the Z-shaped metal sheet adopt arc corners.
Preferably, the cylindrical sample preparation mold has a diameter of 30mm and a height of 35 mm.
A method for preparing a metallographic sample of a plastic package chip adopts a metal sheet, a plurality of plastic package chip samples are simultaneously pasted on the metal sheet through glue in the direction of grinding according to needs, the fixed samples are placed in a cylindrical sample preparation mold, and then the cylindrical sample preparation mold is placed in a cylindrical cold-embedding mold to carry out curing treatment on the plastic package chip samples, and the method comprises the following specific steps:
(1) confirming the section grinding direction and the number of samples of the plastic package chip sample;
(2) sticking a plastic package chip sample to be ground on a metal sheet through glue according to the grinding direction; ensuring that the plastic package chip sample is kept horizontal and vertical;
(3) vertically placing the adhered plastic package chip sample into a cylindrical cold embedding mold;
(4) mixing and stirring the cold embedding resin and the curing agent according to the proportion of the cold embedding resin, fully mixing the resins, and standing for 4-6 minutes to ensure that no obvious bubbles exist in the mixed resin;
(5) pouring the mixed cold embedding resin mixed liquid into a cylindrical cold embedding mold gently to ensure that the plastic packaged chip sample is kept horizontal and vertical;
(6) and after the cold embedding resin is cured, demolding, grinding, polishing and observing by a microscope.
Preferably, the cold-inlaid resin is prepared by mixing metallographic cold-inlaid king and cold-inlaid curing agent in a ratio of 2: 1.
The invention has the beneficial effects that the Z-shaped metal sheet is adopted, the surface area is large, a plurality of plastic package chips can be adhered at the same time, a plurality of samples are simultaneously sealed in one resin mould, one-time grinding and polishing are carried out, the sample preparation of the plurality of samples is finished at the same time, and the grinding analysis time and the cost are saved.
Drawings
Fig. 1 is a schematic structural diagram of embodiment 1 of the present invention.
FIG. 2 is a schematic view of a Z-shaped metal foil according to example 1 of the present invention.
Fig. 3 is a schematic structural diagram of the prior art.
The invention is further described below with reference to the accompanying drawings.
Detailed Description
Example 1: as shown in attached figures 1 and 2, the auxiliary device for metallographic sample preparation of the plastic package chip comprises a cylindrical sample preparation mold 6 and a Z-shaped stainless steel sheet 4, wherein the thickness of the Z-shaped stainless steel sheet is 0.5 mm. And the corners of the Z-shaped stainless steel sheets 3 adopt radian corners. The diameter of the cylinder sample preparation mould is 30mm, and the height of the cylinder sample preparation mould is 35 mm.
Example 2: the other auxiliary device for the metallographic sample preparation of the plastic package chip comprises a cylindrical sample preparation mold and a Z-shaped stainless steel sheet, wherein the thickness of the Z-shaped stainless steel sheet is 0.3 mm. The rest is the same as in example 1.
Example 3: the auxiliary device for plastic package chip metallographic sample preparation comprises a cylindrical sample preparation mold and a Z-shaped stainless steel sheet, wherein the thickness of the Z-shaped stainless steel sheet is 0.4 mm. The rest is the same as in example 1.
Example 4: a method for preparing a metallographic sample of a plastic package chip comprises the steps of adopting a Z-shaped stainless steel sheet 4, simultaneously pasting three plastic package chip samples 5 on the Z-shaped stainless steel sheet 4 in a direction needing to be ground through glue, placing fixed samples in a cylinder sample preparation mold 6, pouring mixed cold embedding resin mixed liquid into the cylinder sample preparation mold 6, and enabling the plastic package chip samples 5 to be cured in the cylinder cold embedding mold, wherein the method comprises the following specific steps:
(1) confirming the section grinding direction and the number of samples of the plastic package chip sample;
(2) adhering a plastic package chip sample to be ground on the Z-shaped metal sheet through glue according to the grinding direction to ensure that the plastic package chip sample is kept horizontal and vertical;
(3) vertically placing the adhered plastic package chip sample into a cylindrical cold embedding mold;
(4) mixing and stirring the cold embedding resin and the curing agent according to the proportion of the cold embedding resin, fully mixing the resins, and standing for 4-6 minutes to ensure that no obvious bubbles exist in the mixed resin;
(5) pouring the mixed cold embedding resin mixed liquid into a cylindrical cold embedding mold gently to ensure that the plastic packaged chip sample is kept horizontal and vertical;
(6) and after the cold embedding resin is cured, demolding, grinding, polishing and observing by a microscope.
Wherein, a resin mould is manufactured, 12g of metallographic cold inlay king resin and 6 g of cold inlay king curing agent are weighed by an electronic scale and mixed evenly and poured into the cold inlay mould.
Claims (6)
1. The utility model provides an auxiliary device of plastic envelope chip metallography system appearance, includes cylinder system appearance mould, its characterized in that: the metal sheet is Z-shaped.
2. The auxiliary device for metallographic phase sample preparation of the plastic package chip as claimed in claim 1, wherein: the metal sheet is a stainless steel sheet, and the thickness of the metal sheet is 0.3-0.5 mm.
3. The auxiliary device for metallographic phase sample preparation of the plastic package chip as claimed in claim 1, wherein: and the corners of the Z-shaped metal sheets adopt radian corners.
4. The auxiliary device for metallographic phase sample preparation of the plastic package chip as claimed in claim 1, wherein: the diameter of the cylinder sample preparation mould is 30mm, and the height of the cylinder sample preparation mould is 35 mm.
5. A method for preparing a metallographic sample of a plastic package chip is characterized by comprising the following steps: adopt the foil, paste a plurality of plastic envelope chip samples simultaneously on the foil through the direction that glue ground as required, put the sample that will fix in cylinder system appearance mould, pour into the cold mixed liquid of inlaying resin in cylinder system appearance mould, make the solidification of plastic envelope chip sample, concrete step is as follows:
(1) confirming the section grinding direction and the number of samples of the plastic package chip sample;
(2) sticking a plastic package chip sample to be ground on a metal sheet through glue according to the grinding direction; ensuring that the plastic package chip sample is kept horizontal and vertical;
(3) vertically placing the adhered plastic package chip sample into a cylindrical cold embedding mold;
(4) mixing and stirring the cold embedding resin and the curing agent according to the proportion of the cold embedding resin, fully mixing the resins, and standing for 4-6 minutes to ensure that no obvious bubbles exist in the mixed resin;
(5) pouring the mixed cold embedding resin mixed liquid into a cylindrical cold embedding mold gently to ensure that the plastic packaged chip sample is kept horizontal and vertical;
(6) and after the cold embedding resin is cured, demolding, grinding, polishing and observing by a microscope.
6. The method for preparing the metallographic sample of the plastic package chip as claimed in claim 5, wherein the method comprises the following steps: the cold embedding resin is prepared by mixing metallographic cold embedding king and a cold embedding curing agent in a ratio of 2: 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010672287.8A CN111665112A (en) | 2020-07-14 | 2020-07-14 | Auxiliary device for metallographic sample preparation of plastic packaged chip and sample preparation method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010672287.8A CN111665112A (en) | 2020-07-14 | 2020-07-14 | Auxiliary device for metallographic sample preparation of plastic packaged chip and sample preparation method |
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| Publication Number | Publication Date |
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| CN111665112A true CN111665112A (en) | 2020-09-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010672287.8A Pending CN111665112A (en) | 2020-07-14 | 2020-07-14 | Auxiliary device for metallographic sample preparation of plastic packaged chip and sample preparation method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112505081A (en) * | 2020-11-18 | 2021-03-16 | 中国科学院生态环境研究中心 | Sample preparation method for hollow fiber membrane ToF-SIMS test |
| CN116572087A (en) * | 2023-07-12 | 2023-08-11 | 日月新检测科技(苏州)有限公司 | Method for grinding semiconductor packaging product |
-
2020
- 2020-07-14 CN CN202010672287.8A patent/CN111665112A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112505081A (en) * | 2020-11-18 | 2021-03-16 | 中国科学院生态环境研究中心 | Sample preparation method for hollow fiber membrane ToF-SIMS test |
| CN116572087A (en) * | 2023-07-12 | 2023-08-11 | 日月新检测科技(苏州)有限公司 | Method for grinding semiconductor packaging product |
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Effective date of registration: 20210926 Address after: 314400 Building 1 (East), No.306 Gushui Road, Haichang street, Haining City, Jiaxing City, Zhejiang Province Applicant after: TIANTONG RUIHONG TECHNOLOGY Co.,Ltd. Address before: 314400 no.23-1, Shuangxue Road, Haining Economic Development Zone, Haining City, Jiaxing City, Zhejiang Province Applicant before: Tiantong Kaimei Microelectronics Co.,Ltd. |
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