CN111662451A - Transparent polyimide film with low phase retardation effect and preparation method and application thereof - Google Patents
Transparent polyimide film with low phase retardation effect and preparation method and application thereof Download PDFInfo
- Publication number
- CN111662451A CN111662451A CN202010573806.5A CN202010573806A CN111662451A CN 111662451 A CN111662451 A CN 111662451A CN 202010573806 A CN202010573806 A CN 202010573806A CN 111662451 A CN111662451 A CN 111662451A
- Authority
- CN
- China
- Prior art keywords
- dianhydride
- polyimide film
- transparent polyimide
- phase retardation
- low phase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
The invention belongs to the technical field of transparent polyimide films, and particularly relates to a transparent polyimide film with a low phase retardation effect. The transparent polyimide film with the low phase retardation effect is prepared by condensation polymerization of diamine compounds and dianhydride compounds. The obtained film is an aromatic polymer and has excellent performances of low phase retardation value, high transparency, high heat resistance, high dimensional stability and the like.
Description
Technical Field
The invention belongs to the technical field of transparent polyimide films, and particularly relates to a transparent polyimide film with a low phase retardation effect, and a preparation method and application thereof.
Background
The transparent polyimide is a novel high-performance special high polymer material, and is widely concerned and applied and developed in the fields of flexible lighting, flexible display, flexible photovoltaic, flexible circuit and the like, and the core technology for preparing the transparent polyimide lies in the design and synthesis of special monomers, including diamine compound monomers, dianhydride compound monomers and end capping agents. The diamine compound monomer developed and applied at the earliest is 2, 2-trifluoromethyl-4, 4-diaminobiphenyl (TFDB), and the diamine monomer has a strong electron group and a large space position group trifluoromethyl, so that the space conformation of a polyimide molecular chain is distorted, the formation of Charge Transfer Complexes (CTC) among and in the polyimide molecular chains can be effectively reduced, and the transparency of the polyimide is improved. However, since the diamine monomer TFDB contains trifluoromethyl, the production cost is high, the synthetic route is expensive, which limits the industrial application of the diamine monomer TFDB, and in addition, the halogen may also affect the application of the diamine monomer TFDB in some fields requiring halogen-free materials.
The other diamine monomer researched and applied in the transparent polyimide is 4, 4-diaminodiphenyl sulfone or 3, 3-diaminodiphenyl sulfone, and the diamine has a rigid group sulfone group with strong electron pulling property, so that the CTC effect can be effectively inhibited in a polyimide molecular chain, and meanwhile, higher molecular chain rigidity is kept. However, since the sulfone group has too high electron-withdrawing ability, the diamine compound has low reactivity and is difficult to synthesize polyimide with high molecular weight.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a new development idea for the preparation of the transparent polyimide film, overcomes the technical problem that the cost of a diamine monomer of a transparent polyimide film material is too high or the activity of the diamine monomer is too low in the prior art, innovatively proposes that a sulfoxide structure is introduced into the structure of a diamine compound, the strength of electron pulling capacity is adjusted, side chain engineering on a benzene ring is combined, steric hindrance is designed, molecular orientation is changed, a chemical structure is designed, and a low-cost synthesis route is adopted. The synthetic method has the advantages of simple and easily obtained raw materials, mild reaction conditions, strong operability, convenience, high efficiency and low cost.
The technical scheme provided by the invention is as follows:
a process for preparing the transparent polyimide film with low phase delay function includes such steps as polycondensation of diamine compound and dianhydride compound.
Specifically, the method comprises the following steps:
1) completely dissolving diamine compounds in an organic solvent in a polymerization bottle, adding dianhydride compounds into the polymerization bottle, stirring and reacting for 6-30 hours, and controlling the reaction temperature to be 20-80 ℃ to obtain transparent and viscous polyamic acid solution;
2) vacuumizing the polyamic acid solution obtained in the step 1) to eliminate bubbles, casting a film on glass or a steel plate, gradually heating from room temperature to 300-350 ℃ within 1-5 hours at the heating rate of 1-10 ℃/min, naturally cooling to 25-80 ℃, and then demoulding to obtain the polyimide film.
Specifically, the diamine compound comprises 2-100% of essential diamine compound and 0-98% of optional diamine compound, wherein the essential diamine compound is selected from any one or multiple combinations of 2,2 ' -substituent-4, 4' -diaminodiphenyl sulfoxide or 4,4' -diaminodiphenyl sulfoxide, and the substituent is selected from alkane substituent with 1-5 carbon atoms, alkane substituent with 1-5 carbon atoms and 1-6 halogen atoms, and monohalogen atom substituent.
Further, the substituent is trifluoromethyl.
Specifically, the optional diamine compound is selected from any one or more of the following combinations: p-phenylenediamine, m-phenylenediamine, 1, 4-diaminobenzotrifluoride, 3, 5-diaminobenzotrifluoride, fluorinated p-phenylenediamine, 2, 5-difluorop-phenylenediamine, 4' -diaminodiphenyl ether, 3 ' -diaminodiphenyl ether, 4' -diaminodiphenyl sulfide, 9-bis (4-aminophenyl) fluorene, 9-bis (3-substituent-4-aminophenyl) fluorene, 9-bis (3, 5-disubstituted-4-aminophenyl) fluorene, diaminodiphenylsulfone, 4' -diaminobiphenyl, m ' -diaminobiphenyl, 4' -diamino-3, 3 ' -dimethylbiphenyl, 4' -diamino-3, 3 ' -bis (trifluoromethyl) biphenyl, m, 4,4 '-diamino-2, 2' -bis (trifluoromethyl) biphenyl, 2 '-difluorobiphenyldiamine, 2' -dichlorobiphenyldiamine, 2 '-dibromobiphenyldiamine, octafluorobiphenyldiamine, 3,5, 3', 5 '-tetramethyldiphenyldiamine, 2,6, 2', 6 ' -tetramethyldiphenylenediamine, 2 ' -bistrifluoromethyl-4, 4' -diphenyletherdiamine, 2 ' -bistrifluoromethyl-4, 4' -diphenylthioetherdiamine, 2 ' -bistrifluoromethyl-4, 4' -diphenylsulfonediamine, 4' -diaminodiphenylmethane, 3, 4' -diaminodiphenylmethane or 3,3 ' -dimethyl-4, 4' -diaminodiphenylmethane.
Specifically, the dianhydride-based compound comprises biphenyl type tetracarboxylic dianhydride, fluorine-containing aromatic type tetracarboxylic dianhydride or alicyclic tetracarboxylic dianhydride, wherein:
the fluorine-containing aromatic tetracarboxylic dianhydride accounts for 1-80 mol% of the total amount of the dianhydride compound;
the biphenyl tetracarboxylic dianhydride accounts for 20-99 mol% of the total amount of the dianhydride compound;
specifically, the feeding mode of the dianhydride compound is as follows: and (4) blending and feeding.
Specifically, the biphenyl tetracarboxylic dianhydride comprises symmetrical bridging type dianhydride and asymmetrical bridging type dianhydride, wherein the symmetrical bridging type is 3, 3-position bridging and 4, 4-position bridging, and the asymmetrical bridging type is 3, 4-position bridging;
the fluorine-containing aromatic tetracarboxylic dianhydride contains 1-8 fluorine atoms and 1-4 benzene rings;
the fluorine-containing aromatic tetracarboxylic dianhydride accounts for 20-40 mol% of the total amount of the dianhydride compound;
the biphenyl tetracarboxylic dianhydride accounts for 10-80 mol% of the total amount of the dianhydride compound;
specifically, the molar ratio of the diamine compound to the dianhydride compound is 1:0.98-1: 1.02.
Specifically, the organic solvent is selected from any one or a mixed solvent of N, N-dimethylformamide, N-dimethylacetamide, dimethyl sulfoxide and N-methylpyrrolidone;
specifically, the first step: completely dissolving diamine compounds in an organic solvent in a polymerization bottle, adding dianhydride compounds into the polymerization bottle, stirring and reacting for 6-30 hours, and controlling the reaction temperature to be 20-80 ℃ to obtain transparent and viscous polyamic acid solution;
the method for controlling the feeding mode of the dianhydride compound in the process of adding the dianhydride compound comprises the following steps: blending and feeding;
the second step is that: vacuumizing the obtained polyamic acid solution for 1-48 hours to eliminate bubbles, casting a film on glass or a steel plate, and gradually heating from room temperature to 300-350 ℃ within 1-5 hours at the heating rate of 1-10 ℃/minute; naturally cooling to 25-80 ℃ and then demoulding to obtain the polyimide film.
The invention also provides a transparent polyimide film prepared by the preparation method of the transparent polyimide film with the low phase retardation effect.
The film provided by the invention is an aromatic polymer, and the low phase retardation value is 20-100 nm; high transparency, ultraviolet cut-off wavelength of 320-; high heat resistance, glass transition temperature above 330 deg.C, high size stability, and thermal expansion coefficient below 30ppm/k at 50-250 deg.C.
The film provided by the invention is a high molecular material prepared by condensation polymerization of diamine compounds and dianhydride compounds, and the weight average molecular weight range is 2,000-2,000,000; the film is not added with any ultraviolet absorbent or inorganic filler, and the effect of blocking ultraviolet rays is achieved by absorbing the ultraviolet rays through the film body material.
The invention also provides application of the transparent polyimide film as a flexible touch substrate material or a flexible folding cover plate material.
Drawings
FIG. 1 shows an infrared absorption spectrum of the polyimide film obtained in example 1
FIG. 2 shows an infrared absorption spectrum of the polyimide film obtained in example 2.
FIG. 3 shows an infrared absorption spectrum of the polyimide film obtained in example 3.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
The invention is further described with reference to the following drawings and specific examples, which are not intended to be limiting.
Example 1
The first step is as follows: completely dissolving diamine compounds in an organic solvent in a polymerization bottle, adding dianhydride compounds into the polymerization bottle, stirring and reacting for 10 hours at the reaction temperature of 48 ℃ to obtain transparent and viscous polyamic acid solution;
the second step is that: vacuumizing the obtained polyamic acid solution for 1 hour to eliminate bubbles, casting a coating on glass or a steel plate, and gradually heating from 50 ℃ to 350 ℃ in 1 hour at the heating rate of 5 ℃/min; naturally cooling to 25 ℃, and demoulding to obtain the polyimide film.
The diamine compound comprises 4,4' -diaminodiphenyl sulfoxide and 2,2 ' -bis-trifluoromethyl-4, 4' -diaminobiphenyl, and the dosage is 1mol and 1mol in sequence.
The dianhydride compound comprises 4,4 '-biphenyl tetracarboxylic dianhydride and 3, 4' -biphenyl tetracarboxylic dianhydride, and the using amounts are 1.5mol and 0.5mol respectively
The solvent was N, N-dimethylformamide in an amount of 3.35 kg.
The obtained polyimide film was sampled and subjected to infrared absorption spectroscopic analysis, and as can be seen from spectrum 1, the polyimide film had a characteristic absorption peak of 1715cm in which the polyimide ring bond was present-1,1778cm-1Thus, it was confirmed that polyimide was obtained.
And (3) testing the refractive index of the obtained polyimide film by using an ellipsometer, and calculating to obtain the out-of-plane birefringence value so as to obtain the phase retardation value in the direction perpendicular to the film thickness.
The obtained polyimide film is sampled and subjected to ultraviolet visible transmittance spectral analysis, so that the ultraviolet cut-off wavelength, the transmittance at 380nm and the transmittance at 550nm can be measured, and the yellowness index can be calculated through spectral data.
The obtained polyimide film was sampled and subjected to dynamic mechanical thermal analysis (TMA), and the glass transition temperature and the thermal expansion coefficient (50 to 250 ℃) of the obtained film were measured.
Example 2
The first step is as follows: completely dissolving diamine compounds in an organic solvent in a polymerization bottle, adding dianhydride compounds into the polymerization bottle, stirring and reacting for 8 hours at the reaction temperature of 42 ℃ to obtain transparent and viscous polyamic acid solution;
the second step is that: vacuumizing the obtained polyamic acid solution for 1 hour to eliminate bubbles, casting a coating on glass or a steel plate, and gradually heating from 50 ℃ to 350 ℃ in 1 hour at the heating rate of 5 ℃/min; naturally cooling to 30 ℃ and then demoulding to obtain the polyimide film.
The diamine compound comprises 4,4' -diaminodiphenyl sulfoxide and 2,2 ' -bis-trifluoromethyl-4, 4' -diaminobiphenyl, and the dosage is 1mol and 1mol in sequence.
The dianhydride compound comprises 4,4'- (hexafluoroisopropylidene) diphthalic anhydride, and the usage amount of 3, 3' -biphenyl tetracarboxylic dianhydride is 1mol and 1mol in sequence.
The solvent was N, N-dimethylacetamide and the amount was 3.8 kg.
The structural, optical and thermal properties were also tested as in example 1.
Example 3
The first step is as follows: completely dissolving diamine compounds in an organic solvent in a polymerization bottle, adding dianhydride compounds into the polymerization bottle, stirring and reacting for 10 hours at the reaction temperature of 55 ℃ to obtain transparent and viscous polyamic acid solution;
the second step is that: vacuumizing the obtained polyamic acid solution for 1 hour to eliminate bubbles, casting a film on glass or a steel plate, and gradually heating from room temperature to 350 ℃ in 2 hours at the heating rate of 5 ℃/min; naturally cooling to 30 ℃ and then demoulding to obtain the polyimide film.
The diamine compound comprises 2,2 '-bis (trifluoromethyl) -4, 4' -diaminodiphenyl sulfoxide and 2,2 '-bis (trifluoromethyl) -4, 4' -diaminobiphenyl, and the dosage is 0.5mol and 1.5mol in sequence.
The dianhydride compound comprises 4,4 '-biphenyl tetracarboxylic dianhydride and 3, 4' -biphenyl tetracarboxylic dianhydride, and the using amount is 1mol and 1mol in sequence.
The solvent is N, N-dimethylacetamide, and the dosage is 3.3 Kg.
The structural, optical and thermal properties were also tested as in example 1.
Example 4
The first step is as follows: completely dissolving diamine compounds in an organic solvent in a polymerization bottle, adding dianhydride compounds into the polymerization bottle, stirring and reacting for 12 hours at the reaction temperature of 46 ℃ to obtain transparent and viscous polyamic acid solution;
the second step is that: vacuumizing the obtained polyamic acid solution for 1 hour to eliminate bubbles, casting a film on glass or a steel plate, and gradually heating from room temperature to 350 ℃ in 2 hours at the heating rate of 5 ℃/min; naturally cooling to 30 ℃ and then demoulding to obtain the polyimide film.
The diamine compound comprises 2,2 '-bis (trifluoromethyl) -4, 4' -diaminodiphenyl sulfoxide and 2,2 '-bis (trifluoromethyl) -4, 4' -diaminodiphenyl ether, and the dosage is 0.5mol and 1.5mol in sequence.
The dianhydride compound comprises 4,4 '-biphenyl tetracarboxylic dianhydride and 3, 4' -biphenyl tetracarboxylic dianhydride, and the using amounts are 1.5mol and 0.5mol in sequence.
The solvent is N, N-dimethylacetamide, and the dosage is 3.3 Kg.
The optical properties and thermal properties were measured in the same manner as in example 1.
Example 5
The first step is as follows: completely dissolving diamine compounds in an organic solvent in a polymerization bottle, adding dianhydride compounds into the polymerization bottle, stirring and reacting for 10 hours at the reaction temperature of 58 ℃ to obtain transparent and viscous polyamic acid solution;
the second step is that: vacuumizing the obtained polyamic acid solution for 1 hour to eliminate bubbles, casting a film on glass or a steel plate, and gradually heating from room temperature to 350 ℃ in 2 hours at the heating rate of 5 ℃/min; naturally cooling to 30 ℃ and then demoulding to obtain the polyimide film.
The diamine compound comprises 2,2 '-dimethyl-4, 4' -diaminodiphenyl sulfoxide and 2,2 '-bis-trifluoromethyl-4, 4' -diaminobiphenyl, and the dosage is 0.5mol and 1.5mol in sequence.
The dianhydride compound comprises 4,4 '-biphenyl tetracarboxylic dianhydride and 3, 3' -biphenyl tetracarboxylic dianhydride, and the using amounts are 1.5mol and 0.5mol in sequence.
The solvent is N, N-dimethylacetamide, and the dosage is 3.3 Kg.
The optical properties and thermal properties were measured in the same manner as in example 1.
Example 6
The first step is as follows: completely dissolving diamine compounds in an organic solvent in a polymerization bottle, adding dianhydride compounds into the polymerization bottle, stirring and reacting for 10 hours at the reaction temperature of 34 ℃ to obtain transparent and viscous polyamic acid solution;
the second step is that: vacuumizing the obtained polyamic acid solution for 1 hour to eliminate bubbles, casting a film on glass or a steel plate, and gradually heating from room temperature to 350 ℃ in 2 hours at the heating rate of 5 ℃/min; naturally cooling to 30 ℃ and then demoulding to obtain the polyimide film.
The diamine compound comprises 2,2 '-dimethyl-4, 4' -diaminodiphenyl sulfoxide and 2,2 '-bis-trifluoromethyl-4, 4' -diaminodiphenyl ether, and the dosage is 0.5mol and 1.5mol in sequence.
The dianhydride compound comprises 4,4 '-biphenyl tetracarboxylic dianhydride and 3, 4' -biphenyl tetracarboxylic dianhydride, and the using amount is 1mol and 1mol in sequence.
The solvent is N, N-dimethylformamide, and the dosage is 3.3 Kg.
The optical properties and thermal properties were measured in the same manner as in example 1.
Example 7
The first step is as follows: completely dissolving diamine compounds in an organic solvent in a polymerization bottle, adding dianhydride compounds into the polymerization bottle, stirring and reacting for 10 hours at the reaction temperature of 38 ℃ to obtain transparent and viscous polyamic acid solution;
the second step is that: vacuumizing the obtained polyamic acid solution for 1 hour to eliminate bubbles, casting a film on glass or a steel plate, and gradually heating from room temperature to 350 ℃ in 2 hours at the heating rate of 5 ℃/min; naturally cooling to 30 ℃ and then demoulding to obtain the polyimide film.
The diamine compound comprises 2,2 '-diethyl-4, 4' -diaminodiphenyl sulfoxide and 2,2 '-bis-trifluoromethyl-4, 4' -diaminobiphenyl, and the dosage is 0.5mol and 1.5mol in sequence.
The dianhydride compound comprises 4,4 '-biphenyl tetracarboxylic dianhydride and 3, 4' -biphenyl tetracarboxylic dianhydride, and the using amount is 1mol and 1mol in sequence.
The solvent is N, N-dimethylacetamide, and the dosage is 3.3 Kg.
The optical properties and thermal properties were measured in the same manner as in example 1.
Example 8
The first step is as follows: completely dissolving diamine compounds in an organic solvent in a polymerization bottle, adding dianhydride compounds into the polymerization bottle, stirring and reacting for 10 hours at the reaction temperature of 52 ℃ to obtain transparent and viscous polyamic acid solution;
the second step is that: vacuumizing the obtained polyamic acid solution for 1 hour to eliminate bubbles, casting a film on glass or a steel plate, and gradually heating from room temperature to 350 ℃ in 2 hours at the heating rate of 5 ℃/min; naturally cooling to 30 ℃ and then demoulding to obtain the polyimide film.
The diamine compound comprises 2,2 ' -bis (trifluoromethyl) -4, 4' -diaminodiphenyl sulfoxide and 3,3 ' -diaminodiphenyl ether, and the dosage is 0.5mol and 1.5mol in sequence.
The dianhydride compound comprises 4,4 '-biphenyl tetracarboxylic dianhydride and 3, 4' -biphenyl tetracarboxylic dianhydride, and the using amounts are 1.5mol and 0.5mol in sequence.
The solvent is N, N-dimethylacetamide, and the dosage is 3.3 Kg.
The optical properties and thermal properties were measured in the same manner as in example 1.
Example 9
The first step is as follows: completely dissolving diamine compounds in an organic solvent in a polymerization bottle, adding dianhydride compounds into the polymerization bottle, stirring and reacting for 10 hours at the reaction temperature of 50 ℃ to obtain transparent and viscous polyamic acid solution;
the second step is that: vacuumizing the obtained polyamic acid solution for 1 hour to eliminate bubbles, casting a film on glass or a steel plate, and gradually heating from room temperature to 350 ℃ in 2 hours at the heating rate of 5 ℃/min; naturally cooling to 30 ℃ and then demoulding to obtain the polyimide film.
The diamine compound comprises 2,2 ' -bis (trifluoromethyl) -4, 4' -diaminodiphenyl sulfoxide and 4,4' -diaminodiphenyl ether, and the dosage is 0.5mol and 1.5mol in sequence.
The dianhydride compound comprises 4,4 '-biphenyl tetracarboxylic dianhydride and 3, 3' -biphenyl tetracarboxylic dianhydride, and the using amount is 1mol and 1mol in sequence.
The solvent is N, N-dimethylacetamide, and the dosage is 3.3 Kg.
The optical properties and thermal properties were measured in the same manner as in example 1.
Example 10
The first step is as follows: completely dissolving diamine compounds in an organic solvent in a polymerization bottle, adding dianhydride compounds into the polymerization bottle, stirring and reacting for 10 hours at the reaction temperature of 51 ℃ to obtain transparent and viscous polyamic acid solution;
the second step is that: vacuumizing the obtained polyamic acid solution for 1 hour to eliminate bubbles, casting a film on glass or a steel plate, and gradually heating from room temperature to 350 ℃ in 2 hours at the heating rate of 5 ℃/min; naturally cooling to 30 ℃ and then demoulding to obtain the polyimide film.
The diamine compound comprises 4,4 '-diaminodiphenyl sulfoxide and 3, 3' -diaminodiphenyl ether, and the dosage is 1mol and 1mol in sequence.
The dianhydride compound comprises 4,4'- (hexafluoroisopropylidene) diphthalic anhydride and 3, 4' -biphenyl tetracarboxylic dianhydride, and the dosage is 1mol and 1mol in sequence.
The solvent is N, N-dimethylacetamide, and the dosage is 3.3 Kg.
The optical properties and thermal properties were measured in the same manner as in example 1.
Example 11
The first step is as follows: completely dissolving diamine compounds in an organic solvent in a polymerization bottle, adding dianhydride compounds into the polymerization bottle, stirring and reacting for 10 hours at the reaction temperature of 57 ℃ to obtain transparent and viscous polyamic acid solution;
the second step is that: vacuumizing the obtained polyamic acid solution for 1 hour to eliminate bubbles, casting a film on glass or a steel plate, and gradually heating from room temperature to 350 ℃ in 2 hours at the heating rate of 5 ℃/min; naturally cooling to 30 ℃ and then demoulding to obtain the polyimide film.
The diamine compound comprises 2,2 ' -bis (trifluoromethyl) -4, 4' -diaminodiphenyl sulfoxide and 4,4' -diaminodiphenyl ether, and the dosage is 0.5mol and 1.5mol in sequence.
The dianhydride compound comprises 4,4'- (hexafluoroisopropylidene) diphthalic anhydride and 3, 4' -biphenyl tetracarboxylic dianhydride, and the dosage is 1mol and 1mol in sequence.
The solvent is N, N-dimethylacetamide, and the dosage is 3.3 Kg.
The optical properties and thermal properties were measured in the same manner as in example 1.
Example 12
The first step is as follows: completely dissolving diamine compounds in an organic solvent in a polymerization bottle, adding dianhydride compounds into the polymerization bottle, stirring and reacting for 10 hours at the reaction temperature of 60 ℃ to obtain transparent and viscous polyamic acid solution;
the second step is that: vacuumizing the obtained polyamic acid solution for 1 hour to eliminate bubbles, casting a film on glass or a steel plate, and gradually heating from room temperature to 350 ℃ in 2 hours at the heating rate of 5 ℃/min; naturally cooling to 30 ℃ and then demoulding to obtain the polyimide film.
The diamine compound comprises 2,2 ' -bis (trifluoromethyl) -4, 4' -diaminodiphenyl sulfoxide and 4,4' -diaminobiphenyl, and the dosage is 0.5mol and 1.5mol in sequence.
The dianhydride compound comprises 4,4 '-biphenyl tetracarboxylic dianhydride and 3, 4' -biphenyl tetracarboxylic dianhydride, and the using amount is 1mol and 1mol in sequence.
The solvent is N, N-dimethylacetamide, and the dosage is 3.3 Kg.
The optical properties and thermal properties were measured in the same manner as in example 1.
Comparative example 1
The first step is as follows: completely dissolving diamine compounds in an organic solvent in a polymerization bottle, adding dianhydride compounds into the polymerization bottle, stirring and reacting for 10 hours at the reaction temperature of 20 ℃ to obtain transparent and viscous polyamic acid solution;
the second step is that: vacuumizing the obtained polyamic acid solution for 1 hour to eliminate bubbles, casting a film on glass or a steel plate, and gradually heating from room temperature to 350 ℃ in 2 hours at the heating rate of 5 ℃/min; naturally cooling to 30 ℃ and then demoulding to obtain the polyimide film.
The diamine compound comprises 2,2 '-bis (trifluoromethyl) -4, 4' -diaminobiphenyl with the dosage of 2mol in sequence.
The dianhydride compound comprises 4,4 '-biphenyl tetracarboxylic dianhydride and 3, 4' -biphenyl tetracarboxylic dianhydride, and the use amount is 1mol and 1mol in sequence.
The solvent is N, N-dimethylacetamide, and the dosage is 3.3 Kg.
The optical properties and thermal properties were measured in the same manner as in example 1.
Comparative example 2
The first step is as follows: completely dissolving diamine compounds in an organic solvent in a polymerization bottle, adding dianhydride compounds into the polymerization bottle, stirring and reacting for 10 hours at the reaction temperature of 22 ℃ to obtain transparent and viscous polyamic acid solution;
the second step is that: vacuumizing the obtained polyamic acid solution for 1 hour to eliminate bubbles, casting a film on glass or a steel plate, and gradually heating from room temperature to 350 ℃ in 2 hours at the heating rate of 5 ℃/min; naturally cooling to 30 ℃ and then demoulding to obtain the polyimide film.
The diamine compound comprises 2mol of 2,2 '-bis (trifluoromethyl) -4, 4' -diaminobiphenyl.
The dianhydride compound comprises 4,4' - (hexafluoroisopropylidene) diphthalic anhydride, and the dosage is 2 mol.
The solvent is N, N-dimethylacetamide, and the dosage is 3.3 Kg.
The optical properties and thermal properties were measured in the same manner as in example 1.
The polyimide films obtained in the examples were subjected to the performance test, and the results are shown in the following table:
TABLE 1
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (10)
1. A preparation method of a transparent polyimide film with low phase retardation effect is characterized by comprising the following steps: prepared by condensation polymerization of diamine compounds and dianhydride compounds.
2. The method for preparing a transparent polyimide film having a low phase retardation as claimed in claim 1, comprising the steps of:
1) completely dissolving diamine compounds in an organic solvent, adding dianhydride compounds, stirring and reacting for 6-30 hours, and controlling the reaction temperature to be 20-80 ℃ to obtain transparent and viscous polyamic acid solution;
2) vacuumizing the polyamic acid solution obtained in the step 1) to eliminate bubbles, casting a film on a substrate, gradually heating from room temperature to 300-350 ℃ within 1-5 hours at the heating rate of 1-10 ℃/min, naturally cooling to 25-80 ℃, and then demoulding to obtain the polyimide film.
3. The method for preparing a transparent polyimide film having a low phase retardation as claimed in claim 1 or 2, wherein: the diamine compound comprises 2-100% of essential diamine compound and 0-98% of optional diamine compound, wherein the essential diamine compound is selected from any one or more of 2,2 ' -substituent-4, 4' -diaminodiphenyl sulfoxide or 4,4' -diaminodiphenyl sulfoxide, and the substituent is selected from an alkane substituent with 1-5 carbon atoms, an alkane substituent with 1-5 carbon atoms and 1-6 halogen atoms or a single halogen atom substituent.
4. The method for preparing a transparent polyimide film having a low phase retardation as claimed in claim 3, wherein:
the substituent is trifluoromethyl;
the optional diamine compound is selected from any one or more of the following combinations: p-phenylenediamine, m-phenylenediamine, 1, 4-diaminobenzotrifluoride, 3, 5-diaminobenzotrifluoride, fluorinated p-phenylenediamine, 2, 5-difluorop-phenylenediamine, 4' -diaminodiphenyl ether, 3 ' -diaminodiphenyl ether, 4' -diaminodiphenyl sulfide, 9-bis (4-aminophenyl) fluorene, 9-bis (3-substituent-4-aminophenyl) fluorene, 9-bis (3, 5-disubstituted-4-aminophenyl) fluorene, diaminodiphenylsulfone, 4' -diaminobiphenyl, m ' -diaminobiphenyl, 4' -diamino-3, 3 ' -dimethylbiphenyl, 4' -diamino-3, 3 ' -bis (trifluoromethyl) biphenyl, m, 4,4 '-diamino-2, 2' -bis (trifluoromethyl) biphenyl, 2 '-difluorobiphenyldiamine, 2' -dichlorobiphenyldiamine, 2 '-dibromobiphenyldiamine, octafluorobiphenyldiamine, 3,5, 3', 5 '-tetramethyldiphenyldiamine, 2,6, 2', 6 ' -tetramethyldiphenylenediamine, 2 ' -bistrifluoromethyl-4, 4' -diphenyletherdiamine, 2 ' -bistrifluoromethyl-4, 4' -diphenylthioetherdiamine, 2 ' -bistrifluoromethyl-4, 4' -diphenylsulfonediamine, 4' -diaminodiphenylmethane, 3, 4' -diaminodiphenylmethane or 3,3 ' -dimethyl-4, 4' -diaminodiphenylmethane.
5. The method for preparing a transparent polyimide film having a low phase retardation as claimed in claim 1 or 2, wherein: the dianhydride compound comprises biphenyl tetracarboxylic dianhydride and fluorine-containing aromatic tetracarboxylic dianhydride, wherein:
the fluorine-containing aromatic tetracarboxylic dianhydride accounts for 1-80 mol% of the total amount of the dianhydride compound;
the biphenyl tetracarboxylic dianhydride accounts for 20-99 mol% of the total amount of the dianhydride compound;
the dianhydride compound is added in a mode of mixing and feeding together.
6. The method for producing a transparent polyimide film having a low phase retardation as claimed in claim 5, wherein:
the biphenyl tetracarboxylic dianhydride comprises symmetrical bridging type dianhydride and asymmetrical bridging type dianhydride, wherein the symmetrical bridging type is 3, 3-position bridging and 4, 4-position bridging, and the asymmetrical bridging type is 3, 4-position bridging;
the fluorine-containing aromatic tetracarboxylic dianhydride contains 1-8 fluorine atoms and 1-4 benzene rings;
the fluorine-containing aromatic tetracarboxylic dianhydride accounts for 20-40 mol% of the total amount of the dianhydride compound;
the biphenyl tetracarboxylic dianhydride accounts for 10-80 mol% of the total amount of the dianhydride compound.
7. The method for preparing a transparent polyimide film having a low phase retardation as claimed in claim 1 or 2, wherein: in the step 1), the molar ratio of the diamine compound to the dianhydride compound is 1:0.98-1: 1.02.
8. The method for preparing a transparent polyimide film having a low phase retardation as claimed in claim 1 or 2, wherein: in the step 1), the organic solvent is selected from any one or a mixed solvent of N, N-dimethylformamide, N-dimethylacetamide, dimethyl sulfoxide or N-methylpyrrolidone.
9. A transparent polyimide film produced by the method for producing a transparent polyimide film having a low phase retardation according to any one of claims 1 to 8.
10. Use of the transparent polyimide film according to claim 9, wherein: as a flexible touch-sensitive substrate material or a flexible folding cover material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010573806.5A CN111662451B (en) | 2020-06-22 | 2020-06-22 | Transparent polyimide film with low phase retardation effect and preparation method and application thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010573806.5A CN111662451B (en) | 2020-06-22 | 2020-06-22 | Transparent polyimide film with low phase retardation effect and preparation method and application thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111662451A true CN111662451A (en) | 2020-09-15 |
CN111662451B CN111662451B (en) | 2023-04-18 |
Family
ID=72389356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010573806.5A Active CN111662451B (en) | 2020-06-22 | 2020-06-22 | Transparent polyimide film with low phase retardation effect and preparation method and application thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111662451B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022176919A1 (en) * | 2021-02-17 | 2022-08-25 | 株式会社カネカ | Polyimide film and production method therefor, hardcoat film, and image display device |
WO2023155030A1 (en) * | 2022-02-21 | 2023-08-24 | 汕头超声显示器技术有限公司 | Polyimide membrane, preparation method therefor and use thereof |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101885967A (en) * | 2009-05-15 | 2010-11-17 | 达兴材料股份有限公司 | Liquid crystal alignment liquid |
CN107112448A (en) * | 2015-01-06 | 2017-08-29 | 凸版印刷株式会社 | Electrical storage device encapsulating material |
CN110408024A (en) * | 2018-04-27 | 2019-11-05 | 东京应化工业株式会社 | Polyimide precursor composition, polyamic acid, polyimide resin, polyimide film and Optical devices |
WO2020040057A1 (en) * | 2018-08-24 | 2020-02-27 | 三菱瓦斯化学株式会社 | Polyimide resin, polyimide varnish, and polyimide film |
KR20200021411A (en) * | 2018-08-20 | 2020-02-28 | 주식회사 엘지화학 | A composition for preparing polyimide, and polyimide film and flexible device prepared by using same |
-
2020
- 2020-06-22 CN CN202010573806.5A patent/CN111662451B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101885967A (en) * | 2009-05-15 | 2010-11-17 | 达兴材料股份有限公司 | Liquid crystal alignment liquid |
CN107112448A (en) * | 2015-01-06 | 2017-08-29 | 凸版印刷株式会社 | Electrical storage device encapsulating material |
CN110408024A (en) * | 2018-04-27 | 2019-11-05 | 东京应化工业株式会社 | Polyimide precursor composition, polyamic acid, polyimide resin, polyimide film and Optical devices |
KR20200021411A (en) * | 2018-08-20 | 2020-02-28 | 주식회사 엘지화학 | A composition for preparing polyimide, and polyimide film and flexible device prepared by using same |
WO2020040057A1 (en) * | 2018-08-24 | 2020-02-27 | 三菱瓦斯化学株式会社 | Polyimide resin, polyimide varnish, and polyimide film |
Non-Patent Citations (2)
Title |
---|
R.A.DINE-HART ET AL: "Effect of structural variations on the thermo-oxidative stability of aromatic polyimides", 《DIE MAKROMOLEKULARE CHIMIE》 * |
何天白 等: "《功能高分子与新技术》", 31 January 2001, 化学工业出版社 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022176919A1 (en) * | 2021-02-17 | 2022-08-25 | 株式会社カネカ | Polyimide film and production method therefor, hardcoat film, and image display device |
WO2023155030A1 (en) * | 2022-02-21 | 2023-08-24 | 汕头超声显示器技术有限公司 | Polyimide membrane, preparation method therefor and use thereof |
Also Published As
Publication number | Publication date |
---|---|
CN111662451B (en) | 2023-04-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Liu et al. | Synthetic strategies for highly transparent and colorless polyimide film | |
Wu et al. | Optically Transparent and Thermal‐Stable Polyimide Films Derived from a Semi‐Aliphatic Diamine: Synthesis and Properties | |
CN111662451B (en) | Transparent polyimide film with low phase retardation effect and preparation method and application thereof | |
CN109642968B (en) | Optical compensation film with reverse wavelength dispersion | |
CN101597428B (en) | Full aromatic fluorine containing transparent polyimide film and preparation method thereof | |
KR20160059097A (en) | Polyamic acid solution, polyimde film, and method for manufacturing the same | |
KR20140118386A (en) | Polyimide resin and film thereof | |
JP2006206825A (en) | Aromatic polyimide resin precursor and aromatic polyimide resin | |
Jiang et al. | The influences of sulfoxide electron traps in transparent polyimides with low retardation, yellow index, and CTE | |
Liu et al. | Synthesis of organosoluble and light‐colored cardo polyimides via aromatic nucleophilic substitution polymerization | |
Xu et al. | Colorless polyimides from 2, 2′, 3, 3′-biphenyltetracarboxylic dianhydride and fluorinated diamines | |
Li et al. | Synthesis and properties of novel colorless and thermostable polyimides containing cross‐linkable bulky tetrafluorostyrol pendant group and organosoluble triphenylmethane backbone structure | |
Bao et al. | Colorless polyimides derived from rigid trifluoromethyl-substituted triphenylenediamines | |
CN101225169B (en) | Sulfur fluoro self-crosslinkable polyimide material and preparation method thereof | |
Wei et al. | Preparation, characterization, and properties of poly (thioether ether ketone imide) s from isomeric bis (chlorophthalimide) s | |
CN112708130A (en) | Colorless transparent polyimide film and preparation method thereof | |
CN113429785B (en) | Low-birefringence polyimide film and preparation method thereof | |
EP3348599A1 (en) | Polyimide-based block copolymer and polyimide-based film comprising same | |
CN114891212A (en) | Preparation method of high-temperature-resistant polyimide film | |
Wang et al. | Novel rigid semi-alicyclic dianhydride with large side groups for high performance colorless polyimides (CPIs) | |
Liu et al. | Synthesis of crosslinkable fluorinated linear‐hyperbranched copolyimides for optical waveguide devices | |
JP7054064B2 (en) | Composition for forming a flexible device substrate | |
JP5015070B2 (en) | Novel coating type optical compensation film and method for producing the same | |
Yu et al. | Transparent semi-aliphatic polyimide films with excellent thermal stabilities for applications in the display technology | |
CN110272544B (en) | Oligomer, composition, article, method for preparing article, and display device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |