CN111649168A - Gas micro flow controller and supply device - Google Patents
Gas micro flow controller and supply device Download PDFInfo
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- CN111649168A CN111649168A CN202010550550.6A CN202010550550A CN111649168A CN 111649168 A CN111649168 A CN 111649168A CN 202010550550 A CN202010550550 A CN 202010550550A CN 111649168 A CN111649168 A CN 111649168A
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- gas
- flow
- memory alloy
- flow controller
- rear end
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K31/00—Actuating devices; Operating means; Releasing devices
- F16K31/002—Actuating devices; Operating means; Releasing devices actuated by temperature variation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
- F16K1/32—Details
- F16K1/34—Cutting-off parts, e.g. valve members, seats
- F16K1/36—Valve members
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17D—PIPE-LINE SYSTEMS; PIPE-LINES
- F17D3/00—Arrangements for supervising or controlling working operations
- F17D3/01—Arrangements for supervising or controlling working operations for controlling, signalling, or supervising the conveyance of a product
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Flow Control (AREA)
- Temperature-Responsive Valves (AREA)
Abstract
The invention relates to a gas micro flow controller and a supply device, wherein the flow controller (6) comprises a shell (61) with the front end for gas inlet and the rear end for gas outlet, a heating device, a memory alloy spring (66) and a sealing gasket which are arranged in the shell (61) and are sequentially connected from front to back, and the rear end of the sealing gasket is connected with a gas outlet interface which is protruded inwards on the inner wall of the shell (61). The flow controller has simple structure and low cost, effectively utilizes the characteristic that the structure of the memory alloy changes along with the temperature change, adjusts the compression degree between the sealing gasket and the air outlet interface, changes the opening degree of the sealing cavity in the flow controller so as to realize the micro adjustment of the gas micro-flow, has high controllability, and can meet the requirements of downstream on the gas micro-flow and high precision. The flow supply device using the flow controller also has the advantages that the pressure stabilizing flow reducer adopts the combination of the small-diameter air duct and the heating wire wound on the outer wall, the structure is simple, and the cost is low.
Description
Technical Field
The invention relates to the technical field of gas supply, in particular to a gas micro-flow controller and a supply device.
Background
The gas supply device is widely applied to the industrial field and is mainly used for supplying gas media. In the fields of aviation and aerospace, a gas supply device is often required to provide micro-flow gas, particularly, a space electric propulsion system must provide micro-flow gas according to corresponding requirements due to limited carrying gas volume and expensive xenon serving as a common electric propulsion gas, the drift diameter reaches the micron level, and an industrially mature common gas supply device has large flow, low gas flow precision and poor flow stability. Therefore, it is necessary to provide a gas micro flow rate supply device.
The conventional gas micro-flow supply device mainly comprises the following two types:
one is to control the tiny flow by controlling the opening and closing of a special electromagnetic valve, although the scheme has high precision, the electromagnetic valve playing a key role in the flow control part is not a common electromagnetic valve, and the structure is complex, the cost is high, and the cost is high.
The other is to control the flow by making the gas pass through the permeable material (such as powder metallurgy material), but once the porosity of the powder metallurgy material is processed to be a certain value, the flow is a specific value, the variable flow control can not be realized, and the controllability is low.
Disclosure of Invention
The invention aims to provide a gas micro flow controller which is simple in structure, low in cost and high in controllability. Based on the controller, the invention also provides a gas micro-flow supply device on the whole.
In order to solve the problems, the invention provides a gas micro flow controller which comprises a shell with front end gas inlet and rear end gas outlet, a heating device, a memory alloy spring and a sealing gasket, wherein the heating device, the memory alloy spring and the sealing gasket are arranged in the shell and are sequentially connected from front to back; when the device works, the heating device controls the temperature of the memory alloy spring to extend or shorten the memory alloy spring, so that the micro adjustment of the compression degree between the sealing gasket and the air outlet interface is realized.
Preferably, heating device includes the heating plate, encloses to establish the heating plate with first heat insulating part between the shells inner wall, establish the heat-conducting plate of heating plate rear end and establishing temperature sensor on the heat-conducting plate, the rear end of heat-conducting plate with the front end of memory alloy spring links to each other.
Preferably, the integral structure of the heating device spans two sides of an air inlet interface on the inner wall of the shell, and an air flow channel is arranged at the air inlet interface.
Preferably, the first heat insulation member is a ceramic member.
Preferably, the sealing gasket comprises a hard seat and a sealing cushion embedded at the rear end of the hard seat, the front end of the hard seat is connected with the rear end of the memory alloy spring, the outer wall of the hard seat is not in contact with the inner wall of the shell, and the rear end of the sealing cushion is connected with an air outlet interface on the inner wall of the shell.
Preferably, a second heat insulation piece is further arranged between the front end of the hard seat and the rear end of the memory alloy spring.
Preferably, the second heat insulation member is a ceramic member.
The invention also provides a gas micro-flow supply device, which comprises a high-pressure gas cylinder, an on-off valve, a pressure reducing valve, a pressure stabilizing flow reducer, a flow controller and a flowmeter which are sequentially connected along a gas path, wherein the flow controller is the gas micro-flow controller.
In the supply device, preferably, the pressure-stabilizing flow reducer comprises a small-diameter air guide tube and a heating wire wound on the outer wall of the small-diameter air guide tube.
Compared with the prior art, the invention has the following advantages:
the flow controller comprises a shell, and a heating device, a memory alloy spring and a sealing gasket which are arranged in the shell, has simple structure and low cost, effectively utilizes the characteristic that the structure of the memory alloy changes along with the temperature change, adjusts the compression degree between the sealing gasket and the air outlet interface, changes the opening degree of a sealing cavity in the flow controller so as to realize the micro adjustment of gas micro-flow, has high controllability, and can meet the requirements of downstream on gas micro-flow, high precision and high stability.
The flow rate supply device adopts the flow rate controller of the invention as the flow rate controller which plays a key role in the flow rate control part, so that the supply device has simple integral structure, low cost and high controllability, and can meet the requirements of downstream on micro-flow rate, high precision and high stability of gas. Furthermore, the pressure stabilizing flow reducer adopts the combination of a small-diameter air duct and a heating wire wound on the outer wall, and has simple structure and low cost.
Drawings
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a gas micro flow controller according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a gas micro flow supply device according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a voltage stabilizing and current reducing device according to an embodiment of the present invention.
In the figure: 1-a high-pressure gas cylinder, 2-an on-off valve, 3-a pressure reducing valve, 4-a small-diameter gas guide tube, 5-a heating wire, 6-a flow controller and 7-a flow meter; 61-housing, 62-first thermal insulation, 63-heating plate, 64-heat conducting plate, 65-temperature sensor, 66-memory alloy spring, 67-second thermal insulation, 68-sealing soft pad, 69-hard seat.
Detailed Description
EXAMPLE 1 gas micro flow controller
Referring to fig. 1, an embodiment of the present invention provides a gas micro flow controller, where the flow controller 6 mainly includes a housing 61 with a front end for gas inlet and a rear end for gas outlet in an axial direction, and a heating device, a memory alloy spring 66 and a sealing gasket which are arranged inside the housing 61 and sequentially connected from front to rear, and a rear end of the sealing gasket is connected to a gas outlet port protruding inwards on an inner wall of the housing 61. When the air outlet connector works, the temperature of the memory alloy spring 66 is controlled by the heating device to extend or shorten, so that the opening and closing degree between the sealing gasket and the air outlet connector is slightly adjusted.
The memory alloy material has shape memory effect, when the heating device heats the memory alloy spring 66, the length of the spring is extended immediately, and when the temperature of the spring is reduced, the spring is restored immediately. According to the invention, by utilizing the characteristic that the structure of the memory alloy changes along with the temperature change, the memory alloy spring 66 is stretched in a controllable range through the heating device, the spring force of the memory alloy spring 66 is controlled to adjust the compression degree of the sealing gasket, the porosity of the sealing gasket is adjusted, the gas permeation quantity meets the downstream flow requirement, and the micro-flow control of the gas is realized. In practical applications, the housing 61 may be made of metal such as stainless steel, and the memory alloy spring 66 may be made of titanium-nickel alloy.
When the flow controller 6 works, the memory alloy spring 66 is heated by the heating device, so that the memory alloy spring 66 extends, the pressing force on the sealing gasket is increased, the flow channel between the sealing gasket and the air outlet interface on the inner wall of the shell 61 is reduced, the permeation quantity of gas passing through the sealing gasket is reduced, and the purpose of reducing the gas flow is achieved.
The cavity inside the flow controller 6 is used as a gas pressure buffer cavity, the low-flow gas flowing in the front is stabilized, the gas is slowly supplied to a downstream device through the opening degree of the sealing gasket, and the gas with the flow rate of 10 sccm-200 sccm is stably supplied to the downstream device.
In the present invention, the heating device specifically comprises a heating plate 63, a first heat insulation member 62 enclosed between the heating plate 63 and the inner wall of the casing 61, a heat conduction plate 64 disposed at the rear end of the heating plate 63, and a temperature sensor 65 disposed on the heat conduction plate 64, wherein the rear end of the heat conduction plate 64 is connected to the front end of a memory alloy spring 66; the temperature sensor 65 is used to detect the temperature of the heating device, which is usually 50-80 ℃, and the heat conducting plate 64 is used to effectively transfer the heat of the heating plate 63 to the memory alloy spring 66. In practice, the first thermal shield 62 may be made of ceramic, the thermally conductive plate 64 may be made of ceramic sealing alloy 4J33, and the temperature sensor 65 may employ pt100 platinum resistor.
Further, the overall structure of the heating device spans two sides of an air inlet interface on the inner wall of the shell 61 as shown in fig. 1, and an air flow channel is formed at the air inlet interface; set up like this on the one hand heating area big can effectively heat memory alloy spring 66, on the other hand guarantees the overall stability of structure at memory alloy spring 66 deformation in-process. The shapes of the first heat insulation piece 62, the heating sheet 63 and the heat conduction plate 64 are mutually adaptive and wedged, the first heat insulation piece 62 is tightly abutted against the inner wall of the shell 61, and the three integrally form a ring shape, so that the structure is compact and the occupied space is small. For the electric wires (heating voltage 8.8-9V, not shown in the drawings) for supplying power to the heating chip 63, a passage is formed in the housing 61 (attention is paid to ensure the overall sealing property of the inside of the housing 61).
In the invention, the sealing gasket comprises a hard seat 69 and a sealing soft cushion 68 embedded at the rear end of the hard seat 69, the front end of the hard seat 69 is connected with the rear end of the memory alloy spring 66, the outer wall of the hard seat is not contacted with the inner wall of the shell 61 (the circulation of air flow is ensured), and the rear end of the sealing soft cushion 68 is connected with an air outlet port on the inner wall of the shell 61. The hard seat 69 ensures the overall stability of the structure in the deformation process of the memory alloy spring 66 on one hand, and provides a stable and solid rear seat for the sealing soft cushion 68 on the other hand, so that the sealing soft cushion 68 is ensured not to generate redundant phase change except the contact position with the air outlet interface, and the control of flow precision is facilitated. The sealing cushion 68 is arranged to be big in front and small in back, and has good stability. In practical application, the sealing cushion 68 can be made of silicone rubber pad, the hard seat 69 is made of hard metal, and the two are vulcanized into a whole, so that the structural stability is good.
Further, a second heat insulation piece 67 is arranged between the front end of the hard seat 69 and the rear end of the memory alloy spring 66, and a ceramic piece can be adopted in practical application. It will be appreciated that the second insulating element 67, like the rigid socket 69, has an outer wall which does not contact the inner wall of the casing 61.
Example 2 gas micro flow supply device
Referring to fig. 2 to 3, the gas micro flow supply device of the present invention includes a high pressure gas cylinder 1, an on-off valve 2, a pressure reducing valve 3, a pressure stabilizing and flow reducing device 4, a flow controller 6 and a flow meter 7, which are connected in sequence along a gas path, and the two are connected through a gas pipe, wherein the flow controller 6 is any one of the gas micro flow controllers disclosed in embodiment 1.
Wherein, the high-pressure gas cylinder 1 is used for storing high-pressure gas; the on-off valve 2 is used for realizing on/off of high-pressure gas and a downstream device, and an electromagnetic valve can be adopted in practical application; the pressure reducing valve 3 is used for reducing the pressure of the high-pressure gas to (0.2 +/-0.02) Mpa; the voltage-stabilizing current reducer is used for stabilizing voltage and reducing current; the flow of the flow controller 6 can reach 10 sccm-200 sccm; the flow meter 7 is used to measure the gas output flow of the flow controller 6.
When the device works, the supply device can meet the requirements of downstream on micro-flow and high precision of gas through the change of the opening degree of the sealing cavity in the flow controller 6, and the micro-flow supply and control of the gas are realized. It will be appreciated that the correspondence between the heating temperature of the heating means in the flow controller 6 and the gas output flow rate of the flow controller 6 is previously tested and clarified before the flow controller 6/entire supply device is put into actual use.
Referring to fig. 3, in the present invention, the pressure-stabilizing flow-reducing device includes a small-diameter air-guiding tube 4 and a heating wire 5 wound on the outer wall of the small-diameter air-guiding tube 4. Wherein, the 'small diameter' in the small diameter air duct 4 is compared with the air duct on the main trunk line, the two can be the same in material, but on the pipe inner diameter, the air duct on the main trunk line usually has a larger inner diameter, such as 2mm, while the small diameter air duct 4 in the pressure stabilizing and flow reducing device of the invention has an inner diameter phi of 0.5-0.6 mm.
The heating wire 5 can be a common sheathed heating wire, for example, the heating material is Ni80Cr20, the insulating layer is magnesia ceramic, and the protective tube is N6 pure nickel. The heating temperature of the heating wire 5 is determined according to the flow rate of the flow controller 6 and the supply device, and is usually 60 ℃ to 100 ℃.
When the heating wire 5 is used for heating, the temperature in the small-diameter air guide pipe 4 rises, the distance between gas molecules becomes large, the gas expands, the local pressure is improved, the pressure difference between the gas inlet and the air guide pipe is reduced, the gas flow speed is reduced, the gas flow is reduced, and the pressure stabilization and the flow reduction are further realized.
The technical solution provided by the present invention is described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the structure and the core concepts of the present invention. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (9)
1. A gas micro flow controller is characterized in that the flow controller (6) comprises a shell (61) with the front end for gas inlet and the rear end for gas outlet, a heating device, a memory alloy spring (66) and a sealing gasket, wherein the heating device, the memory alloy spring and the sealing gasket are arranged in the shell (61) and are sequentially connected from front to back, and the rear end of the sealing gasket is connected with a gas outlet interface which is protruded inwards on the inner wall of the shell (61); when the device works, the temperature of the memory alloy spring (66) is controlled by the heating device to extend or shorten the memory alloy spring, so that the micro adjustment of the compression degree between the sealing gasket and the air outlet interface is realized.
2. The controller according to claim 1, wherein the heating means comprises a heating plate (63), a first heat insulating member (62) enclosed between the heating plate (63) and an inner wall of the housing (61), a heat conductive plate (64) provided at a rear end of the heating plate (63), and a temperature sensor (65) provided on the heat conductive plate (64), the rear end of the heat conductive plate (64) being connected to a front end of the memory alloy spring (66).
3. A control as claimed in claim 1 or 2, characterised in that the heating means is of unitary construction spanning both sides of an air inlet port in the inner wall of the housing (61) and defining an air flow passage at the air inlet port.
4. A control as claimed in claim 2, characterised in that the first insulating element (62) is embodied as a ceramic element.
5. The controller according to claim 1, characterized in that the sealing gasket comprises a hard seat (69) and a sealing cushion (68) embedded in the rear end of the hard seat (69), the front end of the hard seat (69) is connected with the rear end of the memory alloy spring (66) and the outer wall of the hard seat is not contacted with the inner wall of the shell (61), and the rear end of the sealing cushion (68) is connected with an air outlet port on the inner wall of the shell (61).
6. A control as claimed in claim 5, characterised in that a second thermal insulator (67) is provided between the front end of the rigid seat (69) and the rear end of the memory alloy spring (66).
7. A control as claimed in claim 6, characterised in that the second insulating element (67) is embodied as a ceramic element.
8. A gas micro flow supply device is characterized by comprising a high-pressure gas cylinder (1), an on-off valve (2), a pressure reducing valve (3), a pressure stabilizing and flow reducing device, a flow controller (6) and a flow meter (7) which are sequentially connected along a gas path, wherein the flow controller (6) is the gas micro flow controller according to claim 1.
9. The supply device according to claim 8, characterized in that the pressure-stabilizing flow reducer comprises a small-diameter air duct (4) and a heating wire (5) wound on the outer wall of the small-diameter air duct (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010550550.6A CN111649168B (en) | 2020-06-16 | 2020-06-16 | Gas micro flow controller and supply device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010550550.6A CN111649168B (en) | 2020-06-16 | 2020-06-16 | Gas micro flow controller and supply device |
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| Publication Number | Publication Date |
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| CN111649168A true CN111649168A (en) | 2020-09-11 |
| CN111649168B CN111649168B (en) | 2022-05-06 |
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| CN202010550550.6A Active CN111649168B (en) | 2020-06-16 | 2020-06-16 | Gas micro flow controller and supply device |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101776176A (en) * | 2009-01-13 | 2010-07-14 | 浙江三花汽车控制系统有限公司 | Thermal power expansion valve |
| CN101818828A (en) * | 2010-04-15 | 2010-09-01 | 上海应用技术学院 | Thermodynamic regulating valve with remote control function |
| CN104948793A (en) * | 2014-03-31 | 2015-09-30 | 杭州三花研究院有限公司 | Throttling device |
| CN206539711U (en) * | 2017-03-16 | 2017-10-03 | 赵德渊 | Furnace temp auto-controller |
| US20190003608A1 (en) * | 2017-06-28 | 2019-01-03 | GM Global Technology Operations LLC | Passively actuated resettable valve |
| CN208495808U (en) * | 2018-06-27 | 2019-02-15 | 绵阳西磁科技有限公司 | A kind of high pressure gas heating device |
-
2020
- 2020-06-16 CN CN202010550550.6A patent/CN111649168B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101776176A (en) * | 2009-01-13 | 2010-07-14 | 浙江三花汽车控制系统有限公司 | Thermal power expansion valve |
| CN101818828A (en) * | 2010-04-15 | 2010-09-01 | 上海应用技术学院 | Thermodynamic regulating valve with remote control function |
| CN104948793A (en) * | 2014-03-31 | 2015-09-30 | 杭州三花研究院有限公司 | Throttling device |
| CN206539711U (en) * | 2017-03-16 | 2017-10-03 | 赵德渊 | Furnace temp auto-controller |
| US20190003608A1 (en) * | 2017-06-28 | 2019-01-03 | GM Global Technology Operations LLC | Passively actuated resettable valve |
| CN208495808U (en) * | 2018-06-27 | 2019-02-15 | 绵阳西磁科技有限公司 | A kind of high pressure gas heating device |
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| Publication number | Publication date |
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| CN111649168B (en) | 2022-05-06 |
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