CN111640852B - Structural device for realizing temperature difference between emitter and receiver in thermoelectric cell - Google Patents
Structural device for realizing temperature difference between emitter and receiver in thermoelectric cell Download PDFInfo
- Publication number
- CN111640852B CN111640852B CN202010541656.XA CN202010541656A CN111640852B CN 111640852 B CN111640852 B CN 111640852B CN 202010541656 A CN202010541656 A CN 202010541656A CN 111640852 B CN111640852 B CN 111640852B
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- Prior art keywords
- emitter
- heat insulation
- welded
- radiator
- temperature difference
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- 238000009413 insulation Methods 0.000 claims abstract description 37
- 239000000919 ceramic Substances 0.000 claims abstract description 16
- 229910052792 caesium Inorganic materials 0.000 claims abstract description 10
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 238000001816 cooling Methods 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 8
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 5
- 239000008239 natural water Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims 1
- 238000003466 welding Methods 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000005219 brazing Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 2
- 235000017491 Bambusa tulda Nutrition 0.000 description 2
- 241001330002 Bambuseae Species 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 2
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 2
- 239000011425 bamboo Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 229910052702 rhenium Inorganic materials 0.000 description 2
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
- H02N11/002—Generators
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
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- Thermistors And Varistors (AREA)
Abstract
The invention discloses a structural device for realizing temperature difference between an emitter electrode and a receiving electrode in a thermoelectric cell, which comprises the emitter electrode and the receiving electrode, wherein a heat insulation cylinder is welded outside the emitter electrode, an upper flange is welded below the heat insulation cylinder, a ceramic ring is welded below the upper flange, a lower flange is welded below the ceramic ring, a heat insulation plate is welded inside the lower flange, the heat insulation plate is welded and fixed with the receiving electrode, a radiator is welded below the lower flange, and a cesium tube is welded on the inner wall of the radiator.
Description
Technical Field
The invention relates to the technical field of thermoelectric cells, in particular to a structural device for realizing temperature difference between an emitter electrode and a receiver electrode in a thermoelectric cell.
Background
The earliest thermoelectric cell was developed successfully by the soviet union in 1942, the power generation efficiency is only 1.5% -2%, and the development of the thermoelectric cell technology is greatly stimulated by the power supply requirements in some special fields. A series of thermoelectric cell technologies have been successfully applied to aerospace aircraft, military and ocean exploration beginning in the 60 s of the 20 th century.
And the radioisotope heat source with the size of one coin can provide continuous electric energy for more than twenty years by utilizing the thermoelectric cell technology, which is incomparable with any other heat energy source technology.
However, how to ensure the temperature difference between the emitter and the receiving electrode in the thermoelectric cell, how to ensure that only a few tens of gaps between the emitter and the receiving electrode ensure that the emitter and the receiving electrode are not in short circuit, and how to ensure that the temperature of the emitter and the receiving electrode is higher, and the contact surface of other parts is lower in temperature and easy to weld are all the problems which need to be solved currently.
Disclosure of Invention
The invention aims to solve the technical problems of realizing temperature difference between an emitter and a receiving electrode in a thermoelectric cell, preventing short circuit between the emitter and the receiving electrode and facilitating welding of parts.
The invention aims to solve the technical problems by adopting the following technical scheme:
the utility model provides a structure device of realization temperature difference of projecting pole and receiving pole in thermoelectric cell, includes projecting pole and receiving pole, the outside welding of projecting pole has a thermal-insulated section of thick bamboo, thermal-insulated section of thick bamboo below welding has an upper flange, upper flange below welding has the ceramic ring, ceramic ring below welding has a lower flange, the inside welding of lower flange has the heat insulating board, the heat insulating board with receiving pole looks welded fastening, lower flange below welding has the radiator, the welding has the cesium pipe on the radiator inner wall.
Further, the distance between the emitter lower surface and the receiver upper surface is 0.2 mm.
Further, the emitter and the receiver are made of metal molybdenum; the heat insulation cylinder is made of metal rhenium; the upper flange and the lower flange are made of metal niobium materials; the heat insulation board is made of aluminum silicate; the radiator is made of metal copper with high heat dissipation coefficient; the cesium tube material adopts metallic copper.
Further, the thickness of the heat insulation cylinder is 0.2-0.5 mm.
Further, water flow or natural wind at normal temperature is blown into the radiator, so that the radiator works in a natural water cooling state or natural air cooling state.
Compared with the prior art, the invention has the beneficial effects that:
the thermoelectric cell is provided with the heat insulation cylinder, the heat insulation plate and the radiator, so that the welding difficulty of each part is greatly reduced, the air leakage rate of the sealing part is reduced, the requirement on welding equipment is greatly reduced, and the welding between each part is facilitated.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
fig. 2 is a schematic cross-sectional structure of the present invention.
In the figure: 1-emitter; 2-a heat insulation cylinder; 3-a receiver; 4-an upper flange; a 5-ceramic ring; 6-a lower flange; 7-insulating boards; 8-a heat sink; 9-cesium tube.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
In the description of the present invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
It should be noted that the emitter temperature in the present invention is 1500 ℃.
The sealing strength of the invention is detected according to the SJ3226-199 standard.
The air leakage rate of the invention is detected according to the SJ20600-1996 standard.
Referring to fig. 1-2, a structural device for realizing temperature difference between an emitter electrode and a receiving electrode in a thermoelectric cell comprises the emitter electrode 1 and the receiving electrode 3, wherein a heat insulation cylinder 2 is welded outside the emitter electrode 1, an upper flange 4 is welded below the heat insulation cylinder 2, a ceramic ring 5 is welded below the upper flange 4, a lower flange 6 is welded below the ceramic ring 5, a heat insulation plate 7 is welded inside the lower flange 6, the heat insulation plate 7 is welded and fixed with the receiving electrode 3, a radiator 8 is welded below the lower flange 6, and a cesium tube 9 is welded on the inner wall of the radiator 8.
The distance between the lower surface of the emitter 1 and the upper surface of the receiving electrode 3 is 0.2 mm, and the emitter 1 and the receiving electrode 3 are insulated by ceramic between the upper flange 4 and the lower flange 6.
The emitter electrode 1 and the receiving electrode 3 are made of metal molybdenum; the heat insulation cylinder 2 is made of metal rhenium; the upper flange 4 and the lower flange 6 are made of metal niobium materials; the heat insulation plate 7 is made of aluminum silicate; the radiator 8 is made of metal copper with high heat dissipation coefficient; the cesium tube 9 is made of metallic copper.
The thickness of the heat insulation cylinder 2 is 0.2-0.5 mm, and the thickness can ensure that the emitter electrode 1 and the receiving electrode 3 are kept stable, so that the receiving electrode 3 and the emitter electrode 1 are not in short circuit, and heat transfer on the emitter electrode 1 can be blocked.
And water flow or natural wind at normal temperature is blown into the radiator 8, so that the radiator 8 works in a natural water cooling state or in a natural air cooling state, and the natural air cooling or the natural water cooling can be used for cooling, so that the part to be welded reaches the weldable temperature.
The use of the heat insulation plate 7 can solve the problem that the temperature of the receiving electrode is lower due to the use of the radiator 8, and ensure the temperature difference between the emitter electrode 1 and the receiving electrode 3.
The emitter 1 is connected with a heat insulation cylinder 2; the temperature of the emitter 1 reaches 1500 ℃, so that the contact position of the emitter 1 and the heat insulation cylinder 2 has higher temperature and has air tightness requirement, and the electron beam is adopted for welding treatment.
The heat insulation cylinder 2 is connected with the upper flange 4; because of the heat insulation and heat dissipation effects adopted by the structure, the temperature of the contact part of the heat insulation cylinder 2 and the upper flange 4 is only about 500 ℃, the air tightness is required, and the oxygen-free copper solder ring is adopted for brazing.
The upper flange 4 is connected with ceramic 5; because of the heat insulation and heat dissipation effects adopted by the structure, the temperature of the contact part of the upper flange 4 and the ceramic 5 is only about 450 ℃, the air tightness requirement is met, and palladium-silver copper solder sheets are adopted for brazing.
The ceramic 5 is connected with the lower flange 6; because of the heat insulation and heat dissipation effects adopted by the structure, the contact temperature of the ceramic 5 and the lower flange 6 is only about 400 ℃, the air tightness requirement is met, and palladium-silver copper solder sheets are adopted for brazing.
The lower flange 6 is connected with a radiator 8; because of the heat insulation and heat dissipation effects adopted by the structure, the temperature of the contact part of the lower flange 6 and the radiator 8 is only about 300 ℃, the air tightness is required, and the silver-copper solder sheet is adopted for brazing.
The radiator 8 is connected with the cesium tube 9; because of the heat insulation and heat dissipation effects adopted by the structure, the temperature of the contact part of the radiator 8 and the cesium tube 9 is only about 300 ℃, the air tightness is required, and palladium-silver copper solder rings are adopted for brazing.
The receiving electrode 3 is connected with the heat insulation plate 7; the temperature of the contact part is about 900 ℃, but the air tightness is not required, and the welding is carried out by adopting an oxygen-free copper solder piece.
The heat insulation plate 7 is connected with the lower flange 6; the temperature of the contact part is about 700 ℃, but the air tightness is not required, and the palladium-silver copper solder ring is adopted for welding.
In conclusion, the invention successfully realizes the temperature difference of 1500 ℃ of the emitter electrode 1 and 900 ℃ of the receiving electrode 3 through the heat insulation effect of the heat insulation cylinder 2 and the heat insulation plate 7, and realizes the aim of lower temperature at the contact part of the ceramic 5 with the upper flange 4 and the lower flange 6, thereby facilitating the welding of the ceramic and ensuring the integral air tightness requirement of all parts.
While the basic principles, principal features and advantages of the present invention have been shown and described, it will be understood by those skilled in the art that the present invention is not limited by the foregoing embodiments, which are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined by the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (3)
1. The utility model provides a structure device of emitter and receiving pole temperature difference in realization thermoelectric cell, includes emitter (1) and receiving pole (3), its characterized in that: the emitter (1) is externally welded with a heat insulation cylinder (2), an upper flange (4) is welded below the heat insulation cylinder (2), a ceramic ring (5) is welded below the upper flange (4), a lower flange (6) is welded below the ceramic ring (5), a heat insulation plate (7) is welded inside the lower flange (6), the heat insulation plate (7) is welded and fixed with the receiving electrode (3), a radiator (8) is welded below the lower flange (6), and a cesium tube (9) is welded on the inner wall of the radiator (8);
the contact part of the radiator (8) and the cesium tube (9) is brazed by adopting a palladium-silver copper solder ring;
and (3) blowing natural wind into the radiator (8) by water flow at normal temperature to enable the radiator (8) to work in a natural water cooling state or work in a natural air cooling state.
2. The structural device for realizing temperature difference between emitter and receiver electrodes in a thermoelectric cell according to claim 1, wherein: the distance interval between the lower surface of the emitter (1) and the upper surface of the receiving electrode (3) is 0.2 millimeter.
3. A structural device for realizing temperature difference between emitter and receiver in thermoelectric cell according to claim 1, wherein: the thickness of the heat insulation cylinder (2) is 0.2-0.5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010541656.XA CN111640852B (en) | 2020-06-15 | 2020-06-15 | Structural device for realizing temperature difference between emitter and receiver in thermoelectric cell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010541656.XA CN111640852B (en) | 2020-06-15 | 2020-06-15 | Structural device for realizing temperature difference between emitter and receiver in thermoelectric cell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111640852A CN111640852A (en) | 2020-09-08 |
| CN111640852B true CN111640852B (en) | 2023-09-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010541656.XA Active CN111640852B (en) | 2020-06-15 | 2020-06-15 | Structural device for realizing temperature difference between emitter and receiver in thermoelectric cell |
Country Status (1)
| Country | Link |
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Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1293011A (en) * | 1961-03-23 | 1962-05-11 | Csf | Improvements to thermionic converters comprising a system of coaxial cylindrical electrodes |
| US3259766A (en) * | 1964-02-25 | 1966-07-05 | Eric S Beckjord | Thermionic nuclear reactor |
| GB1151083A (en) * | 1965-07-26 | 1969-05-07 | Martin Marietta Corp | Thermoelectric Conversion Module. |
| GB1158915A (en) * | 1965-09-20 | 1969-07-23 | Euratom | Thermionic converter. |
| RU2096858C1 (en) * | 1996-02-29 | 1997-11-20 | Рафаил Яковлевич Кучеров | Method of operation of thermal emission converter with microgap |
| CN101217176A (en) * | 2007-12-27 | 2008-07-09 | 江门金谷电子工业有限公司 | Temperature difference power-generating device |
| JP2011089973A (en) * | 2009-10-26 | 2011-05-06 | Central Res Inst Of Electric Power Ind | Thermoelectric conversion module assembly for nuclear reactor |
| CN202217708U (en) * | 2011-07-21 | 2012-05-09 | 华南理工大学 | Semiconductor temperature-difference power generation assembly |
| CN103427709A (en) * | 2012-05-22 | 2013-12-04 | 张维国 | Novel high-efficiency thermionic power supply |
| CN203521364U (en) * | 2013-10-24 | 2014-04-02 | 苏州图卡节能科技有限公司 | Novel thermionic device |
| CN104753395A (en) * | 2013-12-26 | 2015-07-01 | 张维国 | Power generation unit of thermionic power supply |
| CN109037062A (en) * | 2018-06-28 | 2018-12-18 | 杭州电子科技大学 | A kind of III-V HEMT device with thermo-electric generation mechanism |
| DE102018120047B3 (en) * | 2018-08-17 | 2019-12-19 | Karlsruher Institut für Technologie | AMTEC energy converter and process for its manufacture |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070277866A1 (en) * | 2006-05-31 | 2007-12-06 | General Electric Company | Thermoelectric nanotube arrays |
-
2020
- 2020-06-15 CN CN202010541656.XA patent/CN111640852B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1293011A (en) * | 1961-03-23 | 1962-05-11 | Csf | Improvements to thermionic converters comprising a system of coaxial cylindrical electrodes |
| US3259766A (en) * | 1964-02-25 | 1966-07-05 | Eric S Beckjord | Thermionic nuclear reactor |
| GB1151083A (en) * | 1965-07-26 | 1969-05-07 | Martin Marietta Corp | Thermoelectric Conversion Module. |
| GB1158915A (en) * | 1965-09-20 | 1969-07-23 | Euratom | Thermionic converter. |
| RU2096858C1 (en) * | 1996-02-29 | 1997-11-20 | Рафаил Яковлевич Кучеров | Method of operation of thermal emission converter with microgap |
| CN101217176A (en) * | 2007-12-27 | 2008-07-09 | 江门金谷电子工业有限公司 | Temperature difference power-generating device |
| JP2011089973A (en) * | 2009-10-26 | 2011-05-06 | Central Res Inst Of Electric Power Ind | Thermoelectric conversion module assembly for nuclear reactor |
| CN202217708U (en) * | 2011-07-21 | 2012-05-09 | 华南理工大学 | Semiconductor temperature-difference power generation assembly |
| CN103427709A (en) * | 2012-05-22 | 2013-12-04 | 张维国 | Novel high-efficiency thermionic power supply |
| CN203521364U (en) * | 2013-10-24 | 2014-04-02 | 苏州图卡节能科技有限公司 | Novel thermionic device |
| CN104753395A (en) * | 2013-12-26 | 2015-07-01 | 张维国 | Power generation unit of thermionic power supply |
| CN109037062A (en) * | 2018-06-28 | 2018-12-18 | 杭州电子科技大学 | A kind of III-V HEMT device with thermo-electric generation mechanism |
| DE102018120047B3 (en) * | 2018-08-17 | 2019-12-19 | Karlsruher Institut für Technologie | AMTEC energy converter and process for its manufacture |
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| Publication number | Publication date |
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| CN111640852A (en) | 2020-09-08 |
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