CN111637428A - Integrated high-power LED thermoelectric separation support - Google Patents
Integrated high-power LED thermoelectric separation support Download PDFInfo
- Publication number
- CN111637428A CN111637428A CN202010315138.6A CN202010315138A CN111637428A CN 111637428 A CN111637428 A CN 111637428A CN 202010315138 A CN202010315138 A CN 202010315138A CN 111637428 A CN111637428 A CN 111637428A
- Authority
- CN
- China
- Prior art keywords
- ceramic substrate
- heat
- water tank
- cooling water
- power led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/645—Heat extraction or cooling elements the elements being electrically controlled, e.g. Peltier elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The invention discloses an integrated high-power LED thermoelectric separation support which comprises a ceramic substrate, heat conducting fins, a heat insulating plate and a circulating cooling water tank, wherein a packaging seat is embedded in the top of the ceramic substrate, an LED chip is packaged in the packaging seat, a plurality of heat conducting fins are arranged at the bottom of the ceramic substrate, the heat insulating plate is arranged in the middle of the heat conducting fins and at the bottom end of the ceramic substrate, and the circulating cooling water tank is arranged at the bottom of the heat insulating plate; the circulating cooling water tank and the heat insulation plate and the ceramic substrate are connected through screws, and first clamping blocks are symmetrically arranged on two sides of the ceramic substrate. Has the advantages that: structural design is reasonable, and the radiating effect is good for the light efficiency of LED chip is higher, has improved the life of product simultaneously, has practiced thrift the cost, through the modular design, conveniently changes the LED chip of damage, and it is convenient to maintain.
Description
Technical Field
The invention relates to the technical field of LEDs (light-emitting diodes), in particular to an integrated high-power LED thermoelectric separation bracket.
Background
The LED is called as a fourth generation illumination light source or a green light source, has the characteristics of energy conservation, environmental protection, long service life, small volume and the like, and is widely applied to the fields of various indications, display, decoration, backlight sources, common illumination, urban night scenes and the like. According to different use functions, the system can be divided into five categories of information display, signal lamps, vehicle lamps, liquid crystal display backlight sources and general illumination.
Because the LED has the characteristics of high brightness, rich color types, low power consumption and long service life, the LED is widely applied to the field of automobile illumination. The LED car light is more and more popular, only 20-30% of electric energy of the current LED chip is converted into light energy, the rest electric energy is converted into heat energy, the temperature of the chip is high, the light efficiency is reduced, the service life of the chip is shortened, the performances such as color rendering property and the like are changed, in addition, the general power of the car LED car light is large, the lighting time is long, especially when the car LED car light runs on a highway at night, the high-power LED car light distributes a large amount of heat energy after long-time work, the heat radiation effect is poor or the heat radiation is not timely, the lighting effect of the LED car light is not good, the potential safety hazard is caused, in addition, the traditional LED car light, the LED chip and a lamp group integrated structure are adopted, the whole body needs to be.
An effective solution to the problems in the related art has not been proposed yet.
Disclosure of Invention
The invention provides an integrated high-power LED thermoelectric separation bracket aiming at the problems in the related art, and aims to overcome the technical problems in the prior related art.
Therefore, the invention adopts the following specific technical scheme:
an integrated high-power LED thermoelectric separation bracket comprises a ceramic substrate, heat conducting fins, a heat insulating plate and a circulating cooling water tank, wherein a packaging seat is embedded in the top of the ceramic substrate, an LED chip is packaged in the packaging seat, the bottom of the ceramic substrate is provided with a plurality of heat conducting fins, the heat insulating plate is arranged in the middle of the heat conducting fins and at the bottom end of the ceramic substrate, and the circulating cooling water tank is arranged at the bottom of the heat insulating plate; the circulating cooling water tank and the heat insulation plate and the ceramic substrate are connected through screws, first clamping blocks are symmetrically arranged on two sides of the ceramic substrate, and a plurality of second clamping blocks are symmetrically arranged on the side surface of the ceramic substrate, which is perpendicular to the side surface where the first clamping blocks are located; one side of the bottom end of the circulating cooling water tank is provided with a water inlet, and the other side of the bottom end of the circulating cooling water tank is provided with a water outlet.
Further, in order to enable the ceramic substrate and the circulating cooling water tank to be matched with the threaded holes through screws, the ceramic substrate and the circulating cooling water tank are installed on the heat insulation plate and then are convenient to detach and maintain, the heat insulation plate comprises a transverse plate, end plates are symmetrically arranged at two ends of the transverse plate, and a plurality of threaded holes are formed in the top end and the bottom end of each end plate.
Furthermore, in order to enable the heat-conducting fins to penetrate through the rectangular through holes, the heat-conducting fins are installed on the heat insulation plate and used for absorbing heat emitted by the LED chip during working, the cooling and radiating effects are achieved, thermoelectric separation of the high-power LED is achieved, the lighting effect of the LED is improved, the plurality of rectangular through holes are evenly formed in the top end of the transverse plate, and transition fit is achieved between the rectangular through holes and the heat-conducting fins.
Furthermore, in order to improve the heat dissipation efficiency, the heat conducting sheet comprises a shell, end plates are welded to the top end and the bottom end of the shell in a sealing mode, a suction nozzle is arranged on one side of the bottom of the shell, liquid suction cores are arranged on the inner surface of the end plates and the top and the bottom of the side wall of the shell, a plurality of capillary grooves are formed in the side wall of the shell and located between the two liquid suction cores, each liquid suction core comprises a dot-shaped pit arranged on the inner surface of the end plate and the side wall of the shell, a metal net is arranged on the surface of each dot-shaped pit, the pressure of an inner cavity of the heat conducting sheet is 1.3 x 10 < -1 >.
Furthermore, in order to match the heat conducting fins with the first clamping grooves, the plurality of heat conducting fins can be inserted into the first clamping grooves, the contact area between the heat conducting fins and the radiating fins is increased, the heat exchange efficiency is further improved, a plurality of counter bores are formed in the top end of the ceramic substrate, internal threads are formed in the side walls of the counter bores, a plurality of radiating fins are arranged at the bottom end of the ceramic substrate, the first clamping grooves are formed between every two radiating fins, and first screw holes are formed in the top end of the ceramic substrate and the two sides, located in the counter.
Furthermore, in order to enable the external threads to be matched with the internal threads, the packaging seat is convenient to mount and dismount and maintain, the contact area between the LED chip and the ceramic substrate is increased, heat dissipation is facilitated, the packaging seat is of a barrel-shaped structure, a copper ring is arranged inside the packaging seat and electrically connected with the LED chip, and the external threads are arranged at the bottom of the outer side of the circumference of the packaging seat.
Further, in order to effectively take away heat generated by long-time working of the automobile lamp bank for a long time and ensure long-time stable working of the automobile lamp bank, a plurality of heat absorbing sheets are arranged on the top end of the circulating cooling water tank, a second clamping groove is formed between every two heat absorbing sheets, and a second screw hole is formed in the top end of the circulating cooling water tank and two sides of each heat absorbing sheet.
The invention has the beneficial effects that:
(1) the LED lamp is reasonable in structural design and good in heat dissipation effect, so that the lighting effect of the LED chip is higher, the service life of the product is prolonged, the cost is saved, the damaged LED chip is convenient to replace through the modular design, and the maintenance is convenient.
(2) And through setting up the conducting strip and cooperating with draw-in groove one, make a plurality of conducting strips can insert on draw-in groove one to increase the area of contact of conducting strip and fin, and then improve the efficiency of heat exchange.
(3) Through setting up recirculated cooling water tank to make recirculated cooling water tank refute and connect on the water tank of car, thereby can be long-time effectual take away the produced heat of the long-time work of car banks, in order to guarantee the work that car banks can be stable for a long time.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an integrated high-power LED thermoelectric separation bracket according to an embodiment of the invention;
FIG. 2 is a top view of an integrated high power LED thermoelectric separation mount according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a heat insulation board integrated with a high-power LED thermoelectric separation bracket according to an embodiment of the invention;
FIG. 4 is a schematic structural diagram of a heat conducting sheet of an integrated high-power LED thermoelectric separation bracket according to an embodiment of the invention;
FIG. 5 is a cross-sectional view of a thermally conductive sheet of an integrated high power LED thermoelectric separation mount according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a ceramic substrate integrated with a high-power LED thermoelectric separation support according to an embodiment of the present invention;
FIG. 7 is a schematic structural diagram of a package base integrated with a high-power LED thermoelectric separation support according to an embodiment of the invention;
fig. 8 is a schematic structural diagram of a circulating cooling water tank integrated with a high-power LED thermoelectric separation bracket according to an embodiment of the invention.
In the figure:
1. a ceramic substrate; 101. a counter bore; 102. an internal thread; 103. a heat sink; 104. a first clamping groove; 105. a first screw hole; 2. a heat conductive sheet; 201. a housing; 202. an end plate; 203. a suction nozzle; 204. a wick; 205. a capillary groove; 206. a dot-shaped pit; 207. a metal mesh; 3. a heat insulation plate; 301. a transverse plate; 302. an end plate; 303. a threaded hole; 304. a rectangular through hole; 4. a circulating cooling water tank; 401. a heat absorbing sheet; 402. a second clamping groove; 403. a second screw hole; 5. a package base; 501. a copper ring; 502. an external thread; 6. an LED chip; 7. a first clamping block; 8. a second fixture block; 9. a water inlet; 10. and (7) a water outlet.
Detailed Description
For further explanation of the various embodiments, the drawings which form a part of the disclosure and which are incorporated in and constitute a part of this specification, illustrate embodiments and, together with the description, serve to explain the principles of operation of the embodiments, and to enable others of ordinary skill in the art to understand the various embodiments and advantages of the invention, and, by reference to these figures, reference is made to the accompanying drawings, which are not to scale and wherein like reference numerals generally refer to like elements.
According to an embodiment of the invention, an integrated high-power LED thermoelectric separation support is provided.
The invention will be further described with reference to the accompanying drawings and specific embodiments, as shown in fig. 1-8, an integrated high-power LED thermoelectric separation support according to an embodiment of the invention includes a ceramic substrate 1, heat conducting fins 2, a heat insulating plate 3 and a circulating cooling water tank 4, wherein a package base 5 is embedded in the top of the ceramic substrate 1, an LED chip 6 is packaged in the package base 5, the bottom of the ceramic substrate 1 is provided with a plurality of heat conducting fins 2, the heat insulating plate 3 is arranged at the middle positions of the heat conducting fins 2 and at the bottom end of the ceramic substrate 1, and the circulating cooling water tank 4 is arranged at the bottom of the heat insulating plate 3; the circulating cooling water tank 4 is connected with the heat insulation plate 3 through screws, the heat insulation plate 3 is connected with the ceramic substrate 1 through screws, first fixture blocks 7 are symmetrically arranged on two sides of the ceramic substrate 1, and a plurality of second fixture blocks 8 are symmetrically arranged on the side surface of the ceramic substrate 1, which is perpendicular to the side surface of the first fixture blocks 7; a water inlet 9 is arranged on one side of the bottom end of the circulating cooling water tank 4, and a water outlet 10 is arranged on the other side of the bottom end of the circulating cooling water tank 4.
By means of the above scheme to make structural design reasonable, the radiating effect is good, makes the light efficiency of LED chip higher, has improved the life of product simultaneously, has practiced thrift the cost, through the modularized design, conveniently changes the LED chip of damage, and it is convenient to maintain.
In one embodiment, the heat insulation plate 3 comprises a horizontal plate 301, end plates 302 are symmetrically arranged at two ends of the horizontal plate 301, and a plurality of threaded holes 303 are formed in the top end and the bottom end of each end plate 302, so that the ceramic substrate 1 and the circulating cooling water tank 4 can be matched with the threaded holes 303 through screws and installed on the heat insulation plate 3, and further the disassembly and the maintenance are convenient.
In an embodiment, the top end of the horizontal plate 301 is uniformly provided with a plurality of rectangular through holes 304, and the rectangular through holes 304 and the heat conducting fins 2 are in transition fit, so that the heat conducting fins 2 can penetrate through the rectangular through holes 304 and be installed on the heat insulating plate 3 to absorb heat emitted by the LED chip 6 during operation, thereby playing a role in cooling and heat dissipation, further realizing thermoelectric separation of a high-power LED, and improving the lighting effect of the LED.
In one embodiment, heat conducting sheet 2 includes a casing 201, end plates 202 are hermetically welded to the top and bottom ends of casing 201, a suction nozzle 203 is disposed on one side of the bottom of casing 201, wicks 204 are disposed on the inner surface of end plates 202 and the top and bottom of the side walls of casing 201, a plurality of capillary grooves 205 are disposed on the side walls of casing 201 and between wicks 204, wicks 204 include point-like recesses 206 disposed on the inner surface of end plates 202 and the side walls of casing 201, metal mesh 207 is disposed on the surfaces of point-like recesses 206, and the pressure of the inner cavity of heat conducting sheet 2 is 1.3 × 10-1～1.3×10-4pa, and fill working fluid into in the inner chamber of conducting strip 2, thereby under negative pressure environment, the one end of conducting strip 2 is the evaporation zone and absorbs the heat that is dispersed and through ceramic substrate 1 transmission by LED chip 6, the other end is the condensation segment, working fluid evaporation in imbibition core 204 when the one end of conducting strip 2 is heated, steam flows to the other end under little pressure differential and emits heat and condenses into liquid, liquid flows back to the evaporation zone along capillary groove 205 by the effect of capillary force again, so circulation, with the heat by the one end of conducting strip 2 to the other end, take away the heat by a plurality of heat absorbing sheet 401 again, and then radiating efficiency has been improved.
In one embodiment, a plurality of counter bores 101 are formed in the top end of the ceramic substrate 1, internal threads 102 are formed in the side walls of the counter bores 101, a plurality of radiating fins 103 are arranged at the bottom end of the ceramic substrate 1, a first clamping groove 104 is formed between every two radiating fins 103, and first screw holes 105 are formed in the top end of the ceramic substrate 1 and located on two sides of the counter bores 101, so that the heat conducting fins 2 are matched with the first clamping groove 104, the plurality of heat conducting fins 2 can be inserted into the first clamping groove 104, the contact area between the heat conducting fins 2 and the radiating fins 103 is increased, and the heat exchange efficiency.
In one embodiment, the package base 5 is a barrel-shaped structure, the copper ring 501 is disposed inside the package base 5, the copper ring 501 is electrically connected to the LED chip 6, and the outer side of the circumference of the package base 5 is provided with the external thread 502, so that the external thread 502 is matched with the internal thread 102, which facilitates the installation and disassembly of the package base 5, facilitates the maintenance, increases the contact area between the LED chip 6 and the ceramic substrate 1, and facilitates the heat dissipation.
In one embodiment, the top end of the circulating cooling water tank 4 is provided with a plurality of heat absorbing sheets 401, a second clamping groove 402 is formed between every two heat absorbing sheets 401, two screw holes 403 are formed in the top end of the circulating cooling water tank 4 and located on two sides of each heat absorbing sheet 401, and the circulating cooling water tank 4 can be connected to a water tank of an automobile, so that heat generated by long-time work of an automobile lamp bank can be effectively taken away for a long time, and the long-time stable work of the automobile lamp bank can be guaranteed.
For the convenience of understanding the technical solutions of the present invention, the following detailed description will be made on the working principle or the operation mode of the present invention in the practical process.
In practical application, firstly, a plurality of cavities inside the heat conducting sheet 2 are drawn to be 1.3 × 10-1～1.3×10-4pa, then injecting working fluid, installing the heat conducting strip 2 in the first clamping groove 104 at the bottom of the ceramic substrate 1, installing the heat insulating plate 3 on the heat conducting strip 2 after people enter, at the moment, the heat conducting strip 2 penetrates through the rectangular through hole 304, the end plate 302 contacts with the bottom end of the ceramic substrate 1, matching with the first screw hole 105 and the screw hole 303 through screws to fix the heat insulating plate 3 with the ceramic substrate 1, then installing the circulating cooling water tank 4 at the bottom end of the heat insulating plate 3, at the moment, the bottom of the heat conducting strip 2 is positioned in the second clamping groove 402, the bottom end of the end plate 302 contacts with the top end of the circulating cooling water tank 4, matching with the second screw hole 403 and the screw hole 303 through screws to fix the heat insulating plate 3 with the circulating cooling water tank 4, then installing the packaged packaging seat 5 in matching with the internal screw thread 102 through the external thread 502 in the counterbore 101, and electrically connecting the electrode, copper ring 501 is electrically connected with an electrode of an automobile lamp bank, and then the thermoelectric separation support is installed on the automobile lamp bank through first fixture block 7 or second fixture block 8, and circulating cooling water tank 4 is connected to a water tank of an automobile through water inlet 9 and water outlet 10, when the automobile lamp bank works, heat emitted by LED chip 6 is transmitted to heat conducting strip 2 through ceramic substrate 1, and when one end of heat conducting strip 2 is heated, heat is absorbedWorking fluid in the liquid core 204 evaporates and vaporizes, steam flows to the other end under a tiny pressure difference to release heat and condenses into liquid, the liquid flows back to the evaporation section along the capillary groove 205 under the action of capillary force, the circulation is carried out in such a way that the heat is transferred to the other end from one end of the heat conducting sheet 2, and then the heat is taken away by the heat absorbing sheets 401, so that the heat dissipation efficiency is improved.
In summary, according to the above technical solution of the present invention, the heat-conducting fins 2 are matched with the first clamping grooves 104, so that the heat-conducting fins 2 can be inserted into the first clamping grooves 104, thereby increasing the contact area between the heat-conducting fins 2 and the heat sink 103, and further improving the heat exchange efficiency. Through setting up circulative cooling water tank 4 to make circulative cooling water tank 4 overlap and connect on the water tank of car, thereby can be long-time effectual take away the produced heat of the long-time work of car banks, in order to guarantee the work that car banks can be stable for a long time. Thereby make structural design reasonable, the radiating effect is good for the light efficiency of LED chip is higher, has improved the life of product simultaneously, has practiced thrift the cost, through the modularized design, conveniently changes the LED chip of damage, and it is convenient to maintain.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "disposed," "connected," "secured," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. The integrated high-power LED thermoelectric separation support is characterized by comprising a ceramic substrate (1), heat conducting fins (2), a heat insulating plate (3) and a circulating cooling water tank (4), wherein a packaging seat (5) is embedded in the top of the ceramic substrate (1), an LED chip (6) is packaged in the packaging seat (5), a plurality of heat conducting fins (2) are arranged at the bottom of the ceramic substrate (1), the heat insulating plate (3) is arranged at the middle position of each heat conducting fin (2) and at the bottom end of the ceramic substrate (1), and the circulating cooling water tank (4) is arranged at the bottom of the heat insulating plate (3);
the circulating cooling water tank (4) is connected with the heat insulation plate (3) and the heat insulation plate (3) is connected with the ceramic substrate (1) through screws, first clamping blocks (7) are symmetrically arranged on two sides of the ceramic substrate (1), and a plurality of second clamping blocks (8) are symmetrically arranged on the side surface of the ceramic substrate (1) perpendicular to the side surface side where the first clamping blocks (7) are arranged;
and a water inlet (9) is formed in one side of the bottom end of the circulating cooling water tank (4), and a water outlet (10) is formed in the other side of the bottom end of the circulating cooling water tank (4).
2. The integrated high-power LED thermoelectric separation bracket according to claim 1, wherein the heat insulation board (3) comprises a horizontal board (301), end boards (302) are symmetrically arranged at two ends of the horizontal board (301), and a plurality of threaded holes (303) are respectively formed in the top end and the bottom end of each end board (302).
3. The integrated high-power LED thermoelectric separation bracket as claimed in claim 2, wherein a plurality of rectangular through holes (304) are uniformly formed at the top end of the transverse plate (301), and the rectangular through holes (304) are in transition fit with the heat conducting fins (2).
4. The integrated high-power LED thermoelectric separation bracket as claimed in claim 1, wherein the heat conducting fin (2) comprises a shell (201), end plates (202) are hermetically welded on the top end and the bottom end of the shell (201), and a suction nozzle (203) is arranged on one side of the bottom of the shell (201).
5. The integrated high-power LED thermoelectric separation bracket according to claim 4, characterized in that the inner surfaces of the end plates (202) and the top and bottom of the side walls of the housing (201) are provided with wicks (204), and a plurality of capillary grooves (205) are formed in the side walls of the housing (201) and between the wicks (204).
6. The integrated high-power LED thermal-electrical separation bracket according to claim 5, wherein the wick (204) comprises point-shaped concave pits (206) arranged on the inner surface of the end plate (202) and the side wall of the shell (201), and the surface of the point-shaped concave pits (206) is provided with a metal mesh (207).
7. The integrated high-power LED thermoelectric separation bracket according to claim 1 or 4, wherein the pressure of the inner cavity of the heat conducting fin (2) is 1.3 × 10-1～1.3×10-4pa, and working fluid is filled in the inner cavity of the heat conducting fin (2).
8. The integrated high-power LED thermoelectric separation bracket according to claim 1, wherein a plurality of counter bores (101) are formed in the top end of the ceramic substrate (1), internal threads (102) are formed in the side walls of the counter bores (101), a plurality of cooling fins (103) are arranged at the bottom end of the ceramic substrate (1), a first clamping groove (104) is formed between every two cooling fins (103), and first screw holes (105) are formed in the top end of the ceramic substrate (1) and located on two sides of the counter bores (101).
9. The integrated high-power LED thermoelectric separation bracket according to claim 1, wherein the package base (5) is a barrel-shaped structure, a copper ring (501) is arranged inside the package base (5), the copper ring (501) is electrically connected with the LED chip (6), and an external thread (502) is arranged at the bottom of the outer circumference of the package base (5).
10. The integrated high-power LED thermoelectric separation bracket as claimed in claim 1, wherein a plurality of heat absorbing sheets (401) are arranged at the top end of the circulating cooling water tank (4), two clamping grooves (402) are formed between every two heat absorbing sheets (401), and two screw holes (403) are formed at the top end of the circulating cooling water tank (4) and located at two sides of the heat absorbing sheets (401).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010315138.6A CN111637428B (en) | 2020-04-21 | 2020-04-21 | Integrated high-power LED thermoelectric separation support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010315138.6A CN111637428B (en) | 2020-04-21 | 2020-04-21 | Integrated high-power LED thermoelectric separation support |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111637428A true CN111637428A (en) | 2020-09-08 |
| CN111637428B CN111637428B (en) | 2021-10-15 |
Family
ID=72327656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010315138.6A Active CN111637428B (en) | 2020-04-21 | 2020-04-21 | Integrated high-power LED thermoelectric separation support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111637428B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101872826A (en) * | 2010-05-28 | 2010-10-27 | 符建 | Liquid metal heat radiation based high-power LED light source of threaded connection structure |
| CN204141542U (en) * | 2014-09-15 | 2015-02-04 | 杭州超视科技有限公司 | For the radiator structure of monitoring equipment auxiliary lighting apparatus |
| CN204592934U (en) * | 2015-03-31 | 2015-08-26 | 佛山市南海区华恒照明电器厂 | A kind of high-voltage LED light sources |
| CN204927339U (en) * | 2015-09-18 | 2015-12-30 | 常州机电职业技术学院 | Integrated high -power LED thermoelectric separation support |
| CN205842588U (en) * | 2016-08-03 | 2016-12-28 | 孙利娟 | Led lamp device |
| CN206478607U (en) * | 2017-02-08 | 2017-09-08 | 徐州鹰格电子技术有限公司 | A kind of LED lamp cooling stand |
| WO2018026860A1 (en) * | 2016-08-01 | 2018-02-08 | Hayward Industries, Inc. | Accent lights with junction box controller |
| CN108461616A (en) * | 2018-05-21 | 2018-08-28 | 杭州电子科技大学 | A kind of great power LED detaches the packaging method of radiator structure with thermoelectricity |
-
2020
- 2020-04-21 CN CN202010315138.6A patent/CN111637428B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101872826A (en) * | 2010-05-28 | 2010-10-27 | 符建 | Liquid metal heat radiation based high-power LED light source of threaded connection structure |
| CN204141542U (en) * | 2014-09-15 | 2015-02-04 | 杭州超视科技有限公司 | For the radiator structure of monitoring equipment auxiliary lighting apparatus |
| CN204592934U (en) * | 2015-03-31 | 2015-08-26 | 佛山市南海区华恒照明电器厂 | A kind of high-voltage LED light sources |
| CN204927339U (en) * | 2015-09-18 | 2015-12-30 | 常州机电职业技术学院 | Integrated high -power LED thermoelectric separation support |
| WO2018026860A1 (en) * | 2016-08-01 | 2018-02-08 | Hayward Industries, Inc. | Accent lights with junction box controller |
| CN205842588U (en) * | 2016-08-03 | 2016-12-28 | 孙利娟 | Led lamp device |
| CN206478607U (en) * | 2017-02-08 | 2017-09-08 | 徐州鹰格电子技术有限公司 | A kind of LED lamp cooling stand |
| CN108461616A (en) * | 2018-05-21 | 2018-08-28 | 杭州电子科技大学 | A kind of great power LED detaches the packaging method of radiator structure with thermoelectricity |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111637428B (en) | 2021-10-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101619842B (en) | Light-emitting diode lamp and light engine thereof | |
| CN101769524B (en) | Light emitting diode lamp and light engine thereof | |
| CN101865370B (en) | Light-emitting diode lamp | |
| CN101749570A (en) | LED light fitting and light engine thereof | |
| WO2010099733A1 (en) | Hollow liquid cooling led lamp | |
| CN103196116A (en) | Improved gravity assisted heat pipe radiator used for high-power LED | |
| CN101487584A (en) | Heat radiating module for high-power LED lamp | |
| CN101749657B (en) | Light emitting diode lamp | |
| CN201779503U (en) | Light-emitting diode lamp with better radiating effect | |
| CN102518971A (en) | Ultraviolet light emitting diode light source | |
| CN101463956B (en) | Wind power combined water-refrigeration LED road lamp | |
| CN201293238Y (en) | Outdoor lighting equipment with active heat radiating device and outdoor lighting system thereof | |
| CN201425207Y (en) | Luminescent diode lighting device | |
| CN201764356U (en) | LED (Light-Emitting Diode) spot lamp and illuminating system | |
| CN202501224U (en) | Ultraviolet light emitting diode (UV LED) light source | |
| CN201106831Y (en) | LED lamp radiator | |
| CN202561604U (en) | Water-flow heat conduction type high-power light-emitting diode (LED) plant growth lighting device | |
| CN111637428B (en) | Integrated high-power LED thermoelectric separation support | |
| CN201954309U (en) | LED (light-emitting diode) bulb structure and LED lighting device | |
| CN107366889B (en) | LED light source driving heat dissipation module | |
| CN101900313A (en) | Annular steam cavity radiating module for high-power LED | |
| CN201145243Y (en) | LED cup lamp | |
| CN202040784U (en) | Replaceable LED (light-emitting diode) heat-radiating device | |
| CN201992605U (en) | Heat sink for high-power LED (light-emitting diode) lamps | |
| CN102705795A (en) | Water flow heat conduction method and high-power light emitting diode (LED) plant growth illumination device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |