CN111631857A

CN111631857A - Fitting pressure adjustable headgear type local low-temperature brain protection equipment

Info

Publication number: CN111631857A
Application number: CN202010477113.6A
Authority: CN
Inventors: 马磊; 牛雯; 吕建瑞; 田俊斌; 罗斌
Original assignee: Second Affiliated Hospital School of Medicine of Xian Jiaotong University
Current assignee: Second Affiliated Hospital School of Medicine of Xian Jiaotong University
Priority date: 2020-05-29
Filing date: 2020-05-29
Publication date: 2020-09-08
Anticipated expiration: 2040-05-29
Also published as: CN111631857B

Abstract

The invention particularly discloses a fitting pressure-adjustable headgear type local low-temperature brain protection device which comprises an air cushion, a breathable layer and a cap body, wherein the air cushion, the breathable layer and the cap body are sequentially connected from inside to outside, the cap body is composed of an outer frame and a refrigeration system, the refrigeration system comprises a hexagonal block body and a refrigeration assembly, the refrigeration assembly is arranged in a containing groove of the hexagonal block body, a fixing part is arranged on the outer side wall of the hexagonal block body, the lower part of the outer frame is a cap edge, the upper part of the outer frame comprises a hemispherical structure formed by splicing a plurality of hexagonal frames and a hindbrain fitting part positioned below the hemispherical structure, the hindbrain fitting part is positioned behind the hemispherical structure and is in a holding state, and the hexagonal block body is clamped in the hexagonal.

Description

Fitting pressure adjustable headgear type local low-temperature brain protection equipment

Technical Field

The invention relates to the technical field of low-temperature brain protection, in particular to headgear type local low-temperature brain protection equipment with adjustable fitting pressure.

Background

Patients with severe craniocerebral injury, severe cerebral hemorrhage, brain tumors and even other severe cerebrovascular diseases need to undergo craniocerebral operations, and the common craniocerebral operations in clinical practice are boneless decompression: left or right frontotemporal parietal lobe decompression, bilateral frontotemporal parietal lobe decompression, double frontotemporal parietal lobe decompression and the like. The skull forming repair operation needs to be carried out on a patient with large flap decompression in the past at a proper time, but when the patient does not have the skull repair condition, the brain of the patient is easy to be injured by external force striking, more importantly, the brain tissue is easy to shift due to lack of protection and support of the skull, and is seriously influenced by the atmospheric pressure, and even more, the brain tissue can swing left and right, so that the integrity of the cranial cavity structure and the stability of the cranial cavity pressure are seriously damaged, the brain function is damaged to a certain extent, and the recovery of the nerve function is influenced. The larger the area of skull defect, the more unstable the pressure in the cranial cavity, and the higher the probability of the occurrence of paradural effusion and hydrocephalus. Therefore, for craniocerebral injury patients, in addition to accurately maintaining the stability of the proper pressure of the cranial cavity, the physical cooling method is adopted, so that the metabolism of brain tissues is reduced, the oxygen consumption is reduced, the damage of brain cells is reduced, and the brain function is protected as far as possible, thereby having very important clinical implementation.

Disclosure of Invention

Aiming at the technical problems, the invention provides headgear type local low-temperature brain protection equipment with adjustable fitting pressure.

The technical scheme adopted by the invention is as follows:

a headgear type local low-temperature brain protection device with adjustable fitting pressure,

this protective equipment includes air cushion, ventilative layer and the cap body that from inside to outside connects gradually, the cap body comprises outer frame and refrigerating system, refrigerating system includes hexagon block and refrigeration assembly, refrigeration assembly sets up in the storage tank of hexagon block, be provided with the fixed part on the lateral wall of hexagon block, the outer frame lower part is the brim of a hat, and upper portion includes and forms hemispherical structure and the afterbrain laminating portion that is located the hemispherical structure below by the concatenation of a plurality of hexagon frame, afterbrain laminating portion is located hemispherical structure's rear and is the state of holding together, through the fixed part with hexagon block chucking in the hexagon frame.

Preferably, the refrigeration subassembly includes the control unit and refrigeration unit, wherein, refrigeration unit includes semiconductor refrigeration piece, cold junction and hot junction, the cold junction is located the internal surface of semiconductor refrigeration piece, the cold junction side is provided with a plurality of archs that are located same water flat line, the arch is located the elastic groove on the storage tank inner wall of hexagon block, the adaptation tank bottom of hexagon block is provided with a plurality of inlet port, the hot junction is located the surface of semiconductor refrigeration piece, the control unit installs the side at the semiconductor refrigeration piece, be provided with a plurality of open slots on the inner wall of the storage tank of hexagon block, be provided with the chucking part in every open slot for with the refrigeration subassembly chucking in the storage tank.

Preferably, the hot end adopts fin formula structure, the surface of fin has scribbled the graphite alkene heat-conducting layer.

Preferably, the control unit is composed of a microprocessor, a PWM module integrated with the microprocessor, a human body local temperature sensor and a power supply module, wherein the microprocessor is mainly responsible for adjusting the width of a voltage pulse signal according to temperature information fed back by the human body local temperature sensor by referring to a preset target temperature through the PWM module, sending the voltage pulse signal to the semiconductor refrigeration sheet and carrying out a new refrigeration process; the power supply module is used for supplying power to the semiconductor refrigeration piece, and a power interface of the semiconductor refrigeration unit is connected with the control unit.

Preferably, the human body local temperature sensor is attached to the inner side of the breathable layer.

Preferably, the clamping part is including being fixed in the horizon bar on the interior terminal surface of open slot, the outside cover of horizon bar is equipped with compression spring and sleeve, compression spring one end is fixed in on the sleeve, and on the other end was fixed in the interior terminal surface of open slot, the one end that the spring was kept away from to the sleeve is provided with the chucking piece, be provided with the elastic steel of mutual symmetry on the lateral wall of semiconductor refrigeration piece, the free end an organic whole of elastic steel is provided with circuitous portion, circuitous position in the adaptation inslot that telescopic upper and lower side set up respectively.

Preferably, an elastic fixing band is arranged below the brim, ear-shaped holes penetrating ears are formed in two sides of the elastic fixing band, air holes are formed in the elastic fixing band, and a magic tape is arranged at the bottom of the elastic fixing band.

Preferably, the air cushion is connected with a first inflation catheter and a second inflation catheter, the free end of the first inflation catheter is connected with a pressure measurement module for monitoring the pressure of the air cushion in real time, and the free end of the second inflation catheter is connected with an indication balloon.

Preferably, the pressure measurement module is embedded in the brim.

Preferably, the main body of the fixing part is any one of an elastic electric piece and a magic tape.

Compared with the prior art, the invention has the beneficial effects that: the outer frame of the headgear type local low-temperature brain protection device with adjustable fitting pressure is designed according to the shape of the brain of a human body, so that the protective cap is perfectly fitted with the postoperative physiological curve of the brain of a patient, the wearing is more comfortable, and the design and the material selection of the outer frame meet the standard requirements of medical instruments.

Secondly, the refrigeration system and the outer frame are spliced to form the cap body structure, the refrigeration structure is composed of a hexagonal block body and a refrigeration assembly, the hexagonal block body is clamped on the outer frame through a fixing portion on the side wall, the head is cooled locally through the refrigeration assembly, the purpose of sub-low temperature protection is achieved, and when the cap body structure is used, the refrigeration system can be placed at different proper positions of the wound part according to the actual condition of a patient, so that the wound part of the head of the patient can be cooled rapidly.

Secondly, according to the problems of the patient condition, the trauma degree, the whole body condition and the like, the pressure maintenance time is controlled, constant pressure can be provided within one end time after the pressure is set, the skull pressure of the patient with large-area skull injury after the bone flap is removed and the pressure is reduced is kept stable, the pressure in the air cushion is measured in real time by the pressure measurement module and displayed, and the brain protection of the patient is enhanced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural view of a headgear type local hypothermia brain protection apparatus with adjustable fitting pressure according to an embodiment of the present invention;

fig. 2 is a front view of a headgear type local hypothermia brain protection apparatus with adjustable fitting pressure according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of a refrigeration system provided in accordance with an embodiment of the present invention;

FIG. 4 is a side cross-sectional view of a refrigeration system provided in accordance with an embodiment of the present invention;

FIG. 5 is another side cross-sectional view of a refrigeration system provided in accordance with an embodiment of the present invention;

fig. 6 is an enlarged view of a portion a in fig. 5.

Wherein, 1-an outer frame; 101-a brim; 2-a breathable layer; 3-air cushion; 301-a first inflation conduit; 302-a second inflation catheter; 303-indicating balloon; 4-elastic fixing band; 401-air holes; 5-ear shaped holes; 6-a pressure measurement module; 7-a refrigeration system; 701-hexagonal block; 7011-air intake; 7012-open slot; 702-a refrigeration component; 7021-cold end; 7022-semiconductor refrigerating sheet; 7023-hot end; 7024-a control unit; 703-a fixation section; 8-a clamping part; 801-horizontal bar; 802-compression spring; 803-sleeve; 8031-an adaptation groove; 804-a clamping block; 805-elastic steel; 8051-a detour; 9-bulge; 10-elastic groove.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The invention particularly discloses a headgear type local low-temperature brain protection device with adjustable fitting pressure, which is shown in a figure 1 and a figure 2 and comprises an air cushion 3, a breathable layer 2 and a cap body which are sequentially connected from inside to outside.

Specifically, the cap body comprises outer frame 1 and refrigerating system 7, refrigerating system 7 includes hexagonal block 701 and refrigeration subassembly 702, refrigeration subassembly 702 sets up in hexagonal block 701's storage tank, be provided with fixed part 703 on hexagonal block 701's the lateral wall, the main part of fixed part 703 is arbitrary one kind of elasticity electric piece and magic subsides.

The lower part of the outer frame 1 is a brim 101, the upper part of the outer frame comprises a plurality of hexagonal frames which are spliced to form a hemispherical structure and a hindbrain attaching part located below the hemispherical structure, the hindbrain attaching part is located behind the hemispherical structure and is in a holding state, and a hexagonal block 701 is tightly clamped in the hexagonal frame through a fixing part.

The outer frame 1 is designed according to the shape of the brain of a human body and is manufactured by adopting a 3D printing technology, a material main body of the outer frame is made of medical mechanical standard materials, and the outer frame can be made of materials which are light in weight and have elasticity and rigidity meeting requirements.

In order to improve the usability of the protective device, the elastic fixing band 4 is adhered along the brim of the hat, the two sides of the elastic fixing band 4 are provided with ear-shaped holes 5 which penetrate through ears, when in use, the elastic fixing band 5 fixes the whole hat body on the head of a patient through the magic tape at the bottom, and in order to improve the wearing comfort level, the elastic fixing band 4 is provided with a plurality of air holes 401.

The air cushion 3 is arranged at the innermost side of the cap body, a first inflation conduit 301 and a second inflation conduit 302 are connected to the air cushion 3, the free end of the first inflation conduit 301 is connected with a pressure measurement module 6 used for monitoring the pressure of the air cushion 3 in real time, the pressure measurement module 6 is embedded in the brim of the cap, and the free end of the second inflation conduit 302 is connected with an indication balloon 303.

The air cushion 3 adopts a full-automatic high-speed plastic-sucking forming machine to process sheets with semicircular outlines, and the air cushion material is made of thermoplastic polyurethane material with the thickness of 0.3-0.5 mm.

The pressure measurement module 6 comprises a pressure sensor, a display screen, a power supply and a control circuit, wherein the pressure sensor adopts a high-precision piezoresistive gauge pressure sensor, and has high stability, high interactivity and low power consumption. The working principle of the pressure measuring module is conventional technology, and therefore, the detailed description is omitted here.

Referring to fig. 3-5, the refrigeration assembly 702 includes a control unit 7024 and a refrigeration unit, where the refrigeration unit includes a semiconductor refrigeration sheet 7022, a cold end 7021, and a hot end 7023, the cold end 7021 is located on an inner surface of the semiconductor refrigeration sheet 7022, a plurality of protrusions 9 located on the same horizontal line are disposed on a side surface of the cold end 7021, and the protrusions 9 are located in elastic grooves 10 on an inner wall of an accommodating groove of the hexagonal block 701, so as to achieve primary fixing of the refrigeration assembly. The bottom of the adapting groove of the hexagonal block 701 is provided with a plurality of air inlets 7011, the hot end 7023 is located on the outer surface of the semiconductor refrigerating sheet 7022, the control unit 7024 is installed on the side surface of the semiconductor refrigerating sheet 7022, a plurality of open grooves 7012 are arranged on the inner wall of the accommodating groove of the hexagonal block 701, and a clamping portion 8 is arranged in each open groove 7012 and used for clamping the refrigerating assembly 702 in the accommodating groove.

In order to enhance the passive heat exchange capacity and better dissipate heat, the hot end adopts a fin type structure, and the outer surface of each fin is coated with a graphene heat conduction layer, and the fins can be designed into saw-toothed shapes to increase the heat exchange area.

Cold end 7021 is located semiconductor refrigeration piece 7022's internal surface, and cold end 7021 can adopt solid aluminium piece, realizes cold end and semiconductor refrigeration piece 7022's internal surface contact through the silicone grease to the realization is to the rapid cooling of surrounding environment, and cold air enters into the scalp through the inlet port of holding tank bottom, reduces the temperature to skull damage part, realizes local low temperature protection purpose

Referring to fig. 4 and 5 again, the control unit 7024 is composed of a microprocessor and a PWM module, a human body local temperature sensor, and a power supply module integrated with the microprocessor, wherein the microprocessor is mainly responsible for adjusting the width of the voltage pulse signal according to the temperature information fed back by the human body local temperature sensor with reference to a preset target temperature, and sending the voltage pulse signal to the semiconductor chilling plate through the PWM module to perform a new round of chilling process; the power supply module is used for supplying power to the semiconductor refrigeration piece, the main body of the power supply module is a lithium battery, and a power supply interface of the semiconductor refrigeration unit is connected with the control unit. The human body local temperature sensor is attached to the inner side of the breathable layer, is far away from the air inlet and is close to the injured part of the skull.

The microprocessor adopts an STM32 microprocessor (which has an adjustable clock signal and receives a signal from a comprehensive temperature sensor, and a pulse current signal with a certain frequency is automatically generated by PMW through a natural algorithm to output a variable-power cold quantity to control the work of the semiconductor refrigerating piece.

Referring to fig. 4-6, the hexagonal block 701 fixes the refrigeration assembly 702 in the accommodating groove through the plurality of locking nuts 9 at the bottom, so as to avoid the situation that the refrigeration assembly falls down and breaks during use. Secondly, through the chucking part that sets up in the open slot on the storage tank inner wall to carry out the chucking to refrigeration assembly overall structure, improve its stability.

Wherein, chucking portion 8 including be fixed in the horizontal pole 801 on the interior terminal surface of open slot 7012, the outside cover of horizontal pole 801 is equipped with compression spring 802 and sleeve 803, compression spring 802 one end is fixed in on the sleeve 803, the other end is fixed in on the interior terminal surface of open slot 7012, the one end that the spring was kept away from to sleeve 803 is provided with chucking piece 804, chucking piece can adopt hard plastic material or elastic resin material. The side wall of the semiconductor refrigeration piece 7022 is provided with mutually symmetrical elastic steel 805, the elastic steel is fixed on the semiconductor refrigeration piece by using an adhesive, the free end of the elastic steel 805 is integrally provided with a circuitous part 8051, and the circuitous part is positioned in the adaptive grooves 8031 respectively arranged on the upper side surface and the lower side surface of the sleeve.

In the process of placing the refrigeration assembly 702, the sleeve 803 contracts towards the inside of the open slot 7012 along the horizontal rod 801, the clamping block 804 abuts against the side wall of the semiconductor refrigeration piece 7022, at the moment, the circuitous parts 8051 at the end parts of the two elastic steels 805 on the semiconductor refrigeration piece 7022 are clamped into the adaptation slots 8031 of the sleeve, and the clamping block 804 is clasped in the upper elastic steel 805 and the lower elastic steel 805, so that the stability of the whole refrigeration assembly in the hexagonal block 701 is improved.

The clinical operation process comprises the following steps:

the number of the refrigerating systems is set according to the specific position of the brain wound of the patient, the human body local temperature sensor is attached to the inner side of the breathable layer before the refrigerating systems are arranged, the refrigeration system is fixed in the corresponding hexagonal frame, and then the whole cap body is worn on the brain of the patient, the second inflation conduit is used for inflating the air cushion, and the numerical value displayed by the pressure measurement module is observed, thereby controlling the air inflation quantity of the air cushion, removing the air inflation device after the air inflation is finished, maintaining the pressure for a period of time, in the process, the human body local temperature sensor feeds back the measured temperature to the microprocessor, the microprocessor refers to a preset target temperature, the width of the voltage pulse signal is adjusted through the PWM module and sent to the semiconductor refrigerating sheet to carry out a new refrigerating process until the feedback temperature is within a preset target temperature range, wherein the target temperature is 31-35 degrees.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention in any way. Any simple modification, change and equivalent changes of the above embodiments according to the technical essence of the invention are still within the protection scope of the technical solution of the invention.

Claims

1. The utility model provides a local low temperature brain protection equipment of fitting pressure adjustable headgear formula, its characterized in that, this protection equipment include air cushion, ventilative layer and the cap body that from inside to outside connects gradually, the cap body comprises outer frame and refrigerating system, refrigerating system includes hexagon block and refrigeration assembly, refrigeration assembly sets up in the storage tank of hexagon block, be provided with the fixed part on the lateral wall of hexagon block, outer frame lower part is the brim of a hat, and upper portion includes and forms half spherical structure and the afterbrain laminating portion that is located the half spherical structure below by the concatenation of a plurality of hexagon frame, afterbrain laminating portion is located half spherical structure's rear and is and holds together the state, through the fixed part with hexagon block chucking in the hexagon frame.

2. The headgear type local hypothermia brain protection apparatus with adjustable fitting pressure according to claim 1, it is characterized in that the refrigeration component comprises a control unit and a refrigeration unit, wherein the refrigeration unit comprises a semiconductor refrigeration piece, a cold end and a hot end, the cold end is positioned on the inner surface of the semiconductor refrigerating sheet, the side surface of the cold end is provided with a plurality of bulges positioned on the same horizontal line, the bulge is positioned in the elastic groove on the inner wall of the containing groove of the hexagonal block body, the bottom of the adapting groove of the hexagonal block body is provided with a plurality of air inlets, the hot end is positioned on the outer surface of the semiconductor refrigeration piece, the control unit is arranged on the side surface of the semiconductor refrigeration piece, the inner wall of the containing groove of the hexagonal block body is provided with a plurality of open grooves, and a clamping part is arranged in each open groove and used for clamping the refrigeration assembly in the containing groove.

3. The headgear type local hypothermia brain protection apparatus with adjustable fitting pressure according to claim 2, wherein the hot end is of a fin type structure, and a graphene heat conduction layer is coated on an outer surface of the fin.

4. The headgear type local hypothermia brain protection device with adjustable attaching pressure according to claim 2, wherein the control unit is composed of a microprocessor, a PWM module integrated with the microprocessor, a human body local temperature sensor and a power supply module, wherein the microprocessor is mainly responsible for adjusting the width of a voltage pulse signal according to temperature information fed back by the human body local temperature sensor by the PWM module with reference to a preset target temperature, sending the voltage pulse signal to a semiconductor refrigeration piece and performing a new round of refrigeration process; the power supply module is used for supplying power to the semiconductor refrigeration piece, and a power interface of the semiconductor refrigeration unit is connected with the control unit.

5. The headgear type local hypothermia brain protection apparatus with adjustable fitting pressure according to claim 4, wherein the human body local temperature sensor is attached to an inner side of the breathable layer.

6. The fit pressure adjustable headgear type local hypothermia brain protection device according to claim 2, wherein the clamping portion comprises a horizontal rod fixed on an inner end face of the open slot, a compression spring and a sleeve are sleeved on an outer side of the horizontal rod, one end of the compression spring is fixed on the sleeve, the other end of the compression spring is fixed on the inner end face of the open slot, a clamping block is arranged at one end, away from the spring, of the sleeve, elastic steels which are symmetrical to each other are arranged on a side wall of the semiconductor refrigeration piece, a free end of each elastic steel is integrally provided with a circuitous portion, and the circuitous portions are located in adaptation grooves respectively formed in an upper side face and a lower side face of the sleeve.

7. The headgear type local hypothermia brain protection device with adjustable attaching pressure according to claim 1, wherein an elastic fixing band is arranged below the brim, ear-shaped holes penetrating through ears are arranged at two sides of the elastic fixing band, air holes are arranged on the elastic fixing band, and a magic tape is arranged at the bottom of the elastic fixing band.

8. The fit pressure-adjustable headgear type local low-temperature brain protection device is characterized in that a first inflation catheter and a second inflation catheter are connected to the air cushion, the free end of the first inflation catheter is connected with a pressure measurement module used for monitoring the pressure of the air cushion in real time, and the free end of the second inflation catheter is connected with an indication balloon.

9. The fitting pressure adjustable headgear type local hypothermia brain protection apparatus according to claim 8, wherein the pressure measuring module is embedded in the brim.

10. The headgear type local hypothermia brain protection apparatus with adjustable attaching pressure according to claim 1, wherein the main body of the fixing portion is any one of an elastic electric piece and a magic tape.