CN111631857B - Fitting pressure adjustable headgear type local low-temperature brain protection equipment - Google Patents

Abstract

The invention specifically discloses a headgear-type local low-temperature brain protection device with adjustable fitting pressure. The protection device includes an air cushion, a breathable layer and a cap body which are sequentially connected from the inside to the outside, and the cap body is composed of an outer frame and a refrigeration system. , the refrigeration system includes a hexagonal block and a refrigeration assembly, the refrigeration assembly is arranged in the accommodating groove of the hexagonal block, the outer side wall of the hexagonal block is provided with a fixing part, the The lower part of the outer frame is the brim, the upper part includes a hemispherical structure formed by splicing several hexagonal frames, and a hindbrain fitting part located under the hemispherical structure, the hindbrain fitting part is located behind the hemispherical structure and is in a hugging state , the hexagonal block is clamped in the hexagonal frame by the fixing part.

Description

A headgear-type local hypothermic brain protection device with adjustable fitting pressure

technical field

The invention relates to the technical field of low temperature brain protection, in particular to a headgear type local low temperature brain protection device with adjustable fitting pressure.

Background technique

Patients with severe craniocerebral injury, severe cerebral hemorrhage, and brain tumors or even other severe cerebrovascular diseases require craniocerebral surgery. The common craniocerebral surgery in clinical practice is decompression craniectomy: left or right frontotemporal and parietal bone craniectomy Decompression, bilateral frontotemporal decompressive craniectomy, double frontal decompressive craniectomy, etc. Patients who have undergone decompressive craniectomy need to undergo cranioplasty repair at an appropriate time, but when the patient is not yet ready for cranioplasty, the patient's brain is not only vulnerable to external force to cause craniocerebral injury, but more importantly, the brain tissue Due to the lack of protection and support of the skull, the brain tissue is easily displaced, and is seriously affected by atmospheric pressure. What’s more, the brain tissue will swing left and right, which will seriously damage the integrity of the cranial cavity structure, the stability of the cranial cavity pressure, and a certain degree of damage. Brain function, affecting the rehabilitation of neurological function. The larger the area of the skull defect, the more unstable the pressure in the cranial cavity, and the higher the chance of developing contralateral subdural effusion and hydrocephalus. Therefore, for patients with craniocerebral injury, in addition to accurately maintaining the stability of the appropriate pressure in the cranial cavity, physical cooling methods are used to reduce brain tissue metabolism, reduce oxygen consumption, reduce brain cell damage, and protect brain function as much as possible. It is very important clinically. realistic meaning.

SUMMARY OF THE INVENTION

In view of the above existing technical problems, the present invention provides a headgear-type local hypothermic brain protection device with adjustable fitting pressure.

The technical scheme adopted in the present invention:

1. A headgear-type local cryo-brain protection device with adjustable fitting pressure, characterized in that, the protection device comprises an air cushion, a breathable layer and a cap body sequentially connected from the inside to the outside, and the cap body is composed of an outer frame and a refrigeration system. The refrigeration system includes a hexagonal block and a refrigeration assembly, the refrigeration assembly is arranged in the accommodating groove of the hexagonal block, and the outer side wall of the hexagonal block is provided with a fixing part, so The lower part of the outer frame is the brim, and the upper part includes a hemispherical structure formed by splicing several hexagonal frames and a hindbrain fitting part located below the hemispherical structure, and the hindbrain fitting part is located behind the hemispherical structure and is hugged. state, the hexagonal block is clamped in the hexagonal frame by the fixing part;

The refrigeration assembly includes a control unit and a refrigeration unit, wherein the refrigeration unit includes a semiconductor refrigeration sheet, a cold end and a hot end, the cold end is located on the inner surface of the semiconductor refrigeration sheet, and the side of the cold end is provided with a plurality of A protrusion on the same horizontal line, the protrusion is located in the elastic groove on the inner wall of the accommodating groove of the hexagonal block, and the bottom of the first matching groove of the hexagonal block is provided with several air intake holes , the hot end is located on the outer surface of the semiconductor refrigeration sheet, the control unit is installed on the side of the semiconductor refrigeration sheet, the inner wall of the accommodating groove of the hexagonal block is provided with a plurality of opening grooves, each open groove A clamping part is arranged inside, which is used to clamp the refrigeration component in the accommodating groove;

The clamping part includes a horizontal rod fixed on the inner end surface of the opening slot, a compression spring and a sleeve are sleeved on the outer side of the horizontal rod, one end of the compression spring is fixed on the sleeve, and the other end is fixed on the opening slot On the inner end face of the refrigerating plate, the end of the sleeve away from the spring is provided with a clamping block, the side wall of the semiconductor refrigeration chip is provided with mutually symmetrical elastic steel, and the free end of the elastic steel is integrally provided with a circuitous portion, so The circuitous portion is located in the second fitting grooves respectively provided on the upper and lower sides of the sleeve;

The air cushion is connected with a first inflation conduit and a second inflation conduit, the free end of the first inflation conduit is connected with a pressure measurement module for real-time monitoring of the air cushion pressure, and the free end of the second inflation conduit is connected with an indication balloon.

Preferably, the hot end adopts a warped sheet structure, and the outer surface of the warped sheet is coated with a graphene thermal conductive layer.

Preferably, the control unit is composed of a microprocessor and its integrated PWM module, a local body temperature sensor and a power supply module, wherein the microprocessor is mainly responsible for referring to the preset target temperature according to the temperature information fed back by the local body temperature sensor , adjust the width of the voltage pulse signal through the PWM module, and send it to the semiconductor refrigeration chip to perform a new round of cooling process; the power supply module is used to provide power to the semiconductor refrigeration chip, and the power interface of the semiconductor refrigeration unit is connected with the control unit .

Preferably, the local body temperature sensor is attached to the inner side of the breathable layer.

Preferably, an elastic fixing band is arranged under the brim, ear-shaped holes passing through the ears are arranged on both sides of the elastic fixing band, ventilation holes are arranged on the elastic fixing band, and the bottom of the elastic fixing band is Set with Velcro.

Preferably, the pressure measurement module is embedded on the brim.

Preferably, the main body of the fixing part is any one of elastic electric sheet and Velcro.

Compared with the prior art, the present invention has the beneficial effects as follows: the outer frame of the headgear-type local cryo-brain protection device with adjustable fitting pressure of the present invention is designed according to the shape of the human brain, so that the protective cap is compatible with the patient's postoperative The physiological curve of the brain fits perfectly and is more comfortable to wear. Its design and selection of materials meet the requirements of medical device standards.

Secondly, the present invention adopts the splicing of the refrigeration system and the outer frame to form a cap structure, wherein the refrigeration structure is composed of a hexagonal block and a refrigeration component, and the hexagonal block is clamped to the outside by the fixing part on the side wall. On the frame, the local cooling of the head is achieved through the refrigeration component to achieve the purpose of sub-low temperature protection. During use, the refrigeration system can be placed in a suitable position according to the actual situation of the patient, that is, the different trauma sites, so as to quickly treat the trauma site of the patient's head. Cool down.

Secondly, according to the patient's condition, trauma degree and general condition, the pressure maintenance time is controlled. After the pressure is set, a constant pressure can be provided within a period of time, so that patients with large-area skull injury after decompression craniectomy can maintain the intracranial pressure. It is stable, and the pressure measurement module is used to measure the pressure in the air cushion in real time and display it, which strengthens the protection of the patient's brain.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings used in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore do not It should be regarded as a limitation of the scope, and for those of ordinary skill in the art, other related drawings can also be obtained according to these drawings without any creative effort.

1 is a schematic structural diagram of a headgear-type local cryo-brain protection device with adjustable fitting pressure according to an embodiment of the present invention;

2 is a front view of a headgear-type local cryo-brain protection device with adjustable fitting pressure according to an embodiment of the present invention;

3 is a schematic diagram of a refrigeration system according to an embodiment of the present invention;

4 is a side cross-sectional view of a refrigeration system according to an embodiment of the present invention;

5 is a cross-sectional view of another side of a refrigeration system provided by an embodiment of the present invention;

FIG. 6 is an enlarged view of A in FIG. 5 .

Among them, 1-outer frame; 101-cap brim; 2-breathable layer; 3-air cushion; 301-first inflatable conduit; 302-second inflatable conduit; 303-indicating balloon; 4-elastic fixing belt; 401-breathable hole; 5-lug hole; 6-pressure measurement module; 7-refrigeration system; 701-hexagonal block; 7011-inlet hole; 7012-open slot; 702-refrigeration assembly; 7023-Hot end; 7024-Control unit; 703-Fixing part; 8-Clamping part; 801-Horizontal rod; 802-Compression spring; 803-Sleeve; 8031-Second adapter slot; 804- Clamping block; 805-elastic steel; 8051-circumferential part; 9-protrusion; 10-elastic groove.

Detailed ways

In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations.

Thus, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

The present invention specifically discloses a headgear type local cryogenic brain protection device with adjustable fitting pressure. Referring to FIG. 1 and FIG. 2 , the protection device includes an air cushion 3 , a breathable layer 2 and a cap body connected in sequence from the inside to the outside.

Specifically, the cap body is composed of an outer frame 1 and a refrigeration system 7 . The refrigeration system 7 includes a hexagonal block 701 and a refrigeration assembly 702 , and the refrigeration assembly 702 is arranged in the accommodation of the hexagonal block 701 . Inside the groove, a fixing portion 703 is provided on the outer side wall of the hexagonal block 701 , and the main body of the fixing portion 703 is any one of an elastic gasket and a Velcro.

The lower part of the outer frame 1 is the brim 101, and the upper part includes a hemispherical structure formed by splicing several hexagonal frames and a hindbrain fitting part located below the hemispherical structure, the hindbrain fitting part is located behind the hemispherical structure and In a hugging state, the hexagonal block 701 is clamped in the hexagonal frame by the fixing part.

Among them, the outer frame 1 is designed according to the shape of the human brain, and is made by 3D printing technology.

In order to improve the usability of the protective device of the present invention, an elastic fixing band 4 is pasted along the brim of the cap. Both sides of the elastic fixing band 4 are provided with ear-shaped holes 5 passing through the ears. When in use, the elastic fixing band 5 passes through the bottom The whole cap body is fixed on the patient's head by the Velcro. In order to improve the wearing comfort, several ventilation holes 401 are provided on the elastic fixing belt 4 .

The air cushion 3 is arranged on the innermost side of the cap body, and the air cushion 3 is connected with a first inflation conduit 301 and a second inflation conduit 302. A pressure measurement module 6 is connected, the pressure measurement module 6 is embedded on the brim, and an indicator balloon 303 is connected to the free end of the second inflation conduit 302 .

The air cushion 3 uses a fully automatic high-speed plastic forming machine to process a sheet with a semicircular outline, and the air cushion material is a thermoplastic polyurethane material with a thickness of 0.3-0.5 mm.

Wherein, the pressure measurement module 6 includes a pressure sensor, a display screen, a power supply and a control circuit, and the pressure sensor adopts a high-precision piezoresistive gauge pressure sensor, which has high stability, high interactivity and low power consumption. The working principle of the pressure measurement module is a conventional technology, so it is not repeated here.

3-5, the above-mentioned refrigeration assembly 702 includes a control unit 7024 and a refrigeration unit, wherein the refrigeration unit includes a semiconductor refrigeration sheet 7022, a cold end 7021 and a hot end 7023, and the cold end 7021 is located in the semiconductor On the inner surface of the cooling sheet 7022, the side of the cold end 7021 is provided with a plurality of protrusions 9 located on the same horizontal line, and the protrusions 9 are located in the elastic grooves 10 on the inner wall of the accommodating groove of the hexagonal block 701 , to achieve the initial fixation of the refrigeration components. The bottom of the first fitting groove of the hexagonal block 701 is provided with several air inlet holes 7011 , the hot end 7023 is located on the outer surface of the semiconductor refrigeration chip 7022 , and the control unit 7024 is installed on the semiconductor refrigeration chip 7022 . On the side, the inner wall of the accommodating groove of the hexagonal block 701 is provided with a plurality of open grooves 7012, and each open groove 7012 is provided with a clamping part 8 for clamping the refrigeration assembly 702 in the accommodating groove Inside.

In order to enhance the passive heat exchange ability and dissipate heat better, the hot end adopts a warped sheet structure, and a graphene thermal conductive layer is applied on the outer surface of the warped sheet. The warped sheet can be designed in a zigzag shape to increase the heat exchange area. .

The cold end 7021 is located on the inner surface of the semiconductor refrigeration sheet 7022. The cold end 7021 can be made of a solid aluminum block. The cold end is in contact with the inner surface of the semiconductor refrigeration sheet 7022 through silicone grease, so as to achieve rapid cooling of the surrounding environment, and the cold air passes through the container. The air inlet at the bottom of the slot enters the scalp to cool down the damaged part of the skull and achieve the purpose of local hypothermia protection

Referring to Figure 4 and Figure 5 again, the control unit 7024 is composed of a microprocessor and its integrated PWM module, a human body temperature sensor and a power supply module, wherein the microprocessor is mainly responsible for the temperature information fed back by the human body temperature sensor, With reference to the preset target temperature, the width of the voltage pulse signal is adjusted by the PWM module, and sent to the semiconductor refrigeration chip for a new round of cooling process; the power supply module is used to provide power to the semiconductor refrigeration chip, and the main body of the power supply module is used to provide power to the semiconductor refrigeration chip. It is a lithium battery, and the power interface of the semiconductor refrigeration unit is connected with the control unit. The human body local temperature sensor is attached to the inner side of the breathable layer and away from the air inlet, and is close to the damaged part of the skull.

Among them, the microprocessor adopts the STM32 microprocessor (with its own adjustable clock signal, and receives the signal from the integrated temperature sensor, and uses the inherent algorithm to automatically generate a pulse current signal of a certain frequency through PMW to output variable power cooling capacity control semiconductors Refrigerator works.

Referring to FIGS. 4-6 , the hexagonal block 701 fixes the refrigeration assembly 702 in the accommodating groove through a plurality of locking nuts 9 at the bottom, so as to avoid the situation that the refrigeration assembly slips and breaks during use. Secondly, the entire structure of the refrigeration assembly is clamped by the clamping part arranged in the opening groove on the inner wall of the accommodating groove to improve its stability.

The clamping portion 8 includes a horizontal rod 801 fixed on the inner end surface of the opening slot 7012, and a compression spring 802 and a sleeve 803 are sleeved on the outer side of the horizontal rod 801. One end of the compression spring 802 is fixed on the On the sleeve 803, the other end is fixed on the inner end surface of the opening groove 7012. The end of the sleeve 803 away from the spring is provided with a clamping block 804, and the clamping block can be made of hard plastic material or elastic resin material. The side walls of the semiconductor refrigeration sheet 7022 are provided with mutually symmetrical elastic steels 805. The elastic steels are fixed on the semiconductor refrigeration sheets with adhesives. The free end of the elastic steel 805 is integrally provided with a detour portion 8051. It is located in the second matching grooves 8031 respectively provided on the upper and lower sides of the sleeve.

During the process of placing the refrigeration assembly 702, the sleeve 803 shrinks along the horizontal rod 801 to the inside of the opening slot 7012, and the clamping block 804 is pressed against the side wall of the semiconductor refrigeration sheet 7022. At this time, the two elastic steels on the semiconductor refrigeration sheet 7022 The circuitous portion 8051 at the end of the 805 is clamped into the second adapter groove 8031 of the sleeve, and the clamping block 804 is hugged in the upper and lower elastic steels 805, thereby improving the entire refrigeration assembly within the hexagonal block 701. stability.

Clinical operation process:

The number of refrigeration systems is set according to the specific location of the patient's brain wound. Before that, the local body temperature sensor is attached to the inner side of the breathable layer, and the refrigeration system is fixed in the corresponding hexagonal frame, and then the entire cap body is worn In the patient's brain, inflate the inside of the air cushion through the second inflation tube, and observe the value displayed by the pressure measurement module, thereby controlling the inflation amount of the air cushion. After the inflation is completed, remove the inflatable device and maintain the pressure for a period of time. In a process, the local temperature sensor of the human body feeds back the measured temperature to the microprocessor. The microprocessor refers to the preset target temperature, adjusts the width of the voltage pulse signal through the PWM module, and sends it to the semiconductor refrigeration chip for a new round of The cooling process is performed until the feedback temperature is within the preset target temperature range, wherein the target temperature is 31-35°.

The above descriptions are only preferred embodiments of the present invention, and do not limit the present invention in any way. Any simple modifications, changes and equivalent changes made to the above embodiments according to the technical essence of the invention still fall within the protection scope of the technical solutions of the present invention.

Claims (7)

1. A headgear-type local cryo-brain protection device with adjustable fitting pressure, characterized in that, the protection device comprises an air cushion, a breathable layer and a cap body sequentially connected from the inside to the outside, and the cap body is composed of an outer frame and a refrigeration system. The refrigeration system includes a hexagonal block and a refrigeration assembly, the refrigeration assembly is arranged in the accommodating groove of the hexagonal block, and the outer side wall of the hexagonal block is provided with a fixing part, so The lower part of the outer frame is the brim, and the upper part includes a hemispherical structure formed by splicing several hexagonal frames and a hindbrain fitting part located below the hemispherical structure, and the hindbrain fitting part is located behind the hemispherical structure and is hugged. state, the hexagonal block is clamped in the hexagonal frame by the fixing part; The refrigeration assembly includes a control unit and a refrigeration unit, wherein the refrigeration unit includes a semiconductor refrigeration sheet, a cold end and a hot end, the cold end is located on the inner surface of the semiconductor refrigeration sheet, and the side of the cold end is provided with a plurality of A protrusion on the same horizontal line, the protrusion is located in the elastic groove on the inner wall of the accommodating groove of the hexagonal block, and the bottom of the first matching groove of the hexagonal block is provided with several air intake holes , the hot end is located on the outer surface of the semiconductor refrigeration sheet, the control unit is installed on the side of the semiconductor refrigeration sheet, the inner wall of the accommodating groove of the hexagonal block is provided with a plurality of opening grooves, each open groove A clamping part is arranged inside, which is used to clamp the refrigeration component in the accommodating groove; The clamping part includes a horizontal rod fixed on the inner end surface of the opening slot, a compression spring and a sleeve are sleeved on the outer side of the horizontal rod, one end of the compression spring is fixed on the sleeve, and the other end is fixed on the opening slot On the inner end surface of the refrigerating plate, the end of the sleeve away from the spring is provided with a clamping block, the side wall of the semiconductor refrigeration chip is provided with mutually symmetrical elastic steel, and the free end of the elastic steel is integrally provided with a circuitous portion, so The circuitous portion is located in the second fitting grooves respectively provided on the upper and lower sides of the sleeve; The air cushion is connected with a first inflation conduit and a second inflation conduit, the free end of the first inflation conduit is connected with a pressure measurement module for real-time monitoring of the air cushion pressure, and the free end of the second inflation conduit is connected with an indication balloon. 2. a kind of headgear type local cryogenic brain protection device with adjustable bonding pressure according to claim 1, is characterized in that, described hot end adopts warped sheet type structure, and the outer surface of described warped sheet is smeared with graphene Thermal layer. 3. a kind of headgear type local cryogenic brain protection equipment with adjustable fitting pressure according to claim 1, is characterized in that, described control unit is composed of microprocessor and its integrated PWM module, human body temperature sensor and power supply module The microprocessor is mainly responsible for adjusting the width of the voltage pulse signal through the PWM module according to the temperature information fed back by the local temperature sensor of the human body, referring to the preset target temperature, and sending it to the semiconductor refrigeration chip for a new round of refrigeration. Process; the power supply module is used to provide power to the semiconductor refrigeration chip, and the power interface of the semiconductor refrigeration unit is connected to the control unit. 4 . The headgear-type local cryogenic brain protection device with adjustable fitting pressure according to claim 3 , wherein the human body local temperature sensor is attached to the inner side of the breathable layer. 5 . 5 . The headgear-type local cryogenic brain protection device with adjustable fitting pressure according to claim 1 , wherein an elastic fixing band is arranged under the brim, and both sides of the elastic fixing band are arranged with 5 . 6 . Through the ear-shaped hole of the ear, the elastic fixing belt is provided with a ventilation hole, and the bottom of the elastic fixing belt is provided with a Velcro. 6 . The headgear-type local cryo-brain protection device with adjustable fitting pressure according to claim 1 , wherein the pressure measurement module is embedded on the brim of the cap. 7 . 7. The headgear-type local cryo-brain protection device with adjustable fitting pressure according to claim 1, wherein the main body of the fixing portion is any one of elastic gaskets and Velcro.

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