CN111628319A - 一种mxm模块总线电路 - Google Patents

一种mxm模块总线电路 Download PDF

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CN111628319A
CN111628319A CN202010698652.2A CN202010698652A CN111628319A CN 111628319 A CN111628319 A CN 111628319A CN 202010698652 A CN202010698652 A CN 202010698652A CN 111628319 A CN111628319 A CN 111628319A
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bus
mxm
golden finger
finger connector
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龚苹频
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Shenzhen Industrial Computer System Co ltd
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Shenzhen Industrial Computer System Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure
    • G06F13/4063—Device-to-bus coupling
    • G06F13/4068—Electrical coupling
    • G06F13/4086—Bus impedance matching, e.g. termination
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure
    • G06F13/4063—Device-to-bus coupling
    • G06F13/409—Mechanical coupling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473—Impedance matching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

本发明提供一种MXM模块总线电路，包括连接核心PCB板和底板之间的金手指连接器；所述的金手指连接器中同类信号放一起，各类型的中间都以地脚隔开。本发明具有如下优势：1)方便扩展底板。2)同类信号之间的阻抗匹配、等长处理等更好控制。3)数、模、电源各自不干扰。4)各自类型的中间都以地脚隔开，相当隔离带一样，减少干扰传播。

Description

一种MXM模块总线电路
技术领域
本发明涉及总线电路领域，特别是一种MXM模块总线电路。
背景技术
MXM，即Mobile PCI Express Module，这是一套基于PCI-Express界面的、为图形处理器设计的设备接口。
金手指(connecting finger)是电脑硬件如:(内存条上与内存插槽之间、显卡与显卡插槽等)，所有的信号都是通过金手指进行传送的。金手指由众多金黄色的导电触片组成，因其表面镀金而且导电触片排列如手指状，所以称为"金手指"。
金手指实际上是在覆铜板上通过特殊工艺再覆上一层金，因为金的抗氧化性极强，而且传导性也很强。不过因为金昂贵的价格，且从上个世纪90年代开始黄铜材料就开始普及，故截至2015年，主板、内存和显卡等设备的"金手指"几乎都是采用黄铜材料来镀黄铜，只有部分高性能服务器/工作站的配件接触点才会继续采用镀金的做法，价格自然不菲。
目前，金手指常用于内存调和内存插槽之间、显卡与显卡插槽之间，传送的信号自然只有数字信号和电源信号。这样的金手指不适合目前MXM模块中，两块主板之间总线接口连接。
发明内容
本发明针对目前金手指不适合于MXM模块中，两块主板之间总线接口连接，提供一种MXM模块总线电路。
本发明实现其技术目的技术方案是：一种MXM模块总线电路，包括连接核心PCB板和底板之间的金手指连接器；所述的金手指连接器中同类信号放一起，各类型的中间都以地脚隔开。
进一步的，上述的MXM模块总线电路中：所述的金手指连接器的物料的型号是CONNFoxconn MXM 3.0A SMD-281Pin NPB。
进一步的，上述的MXM模块总线电路中：：所述金手指连接器中至少包括两组电源接口和五组总线接口，所述电源接口排母为两排、每排10针的排母，所述总线接口排母为两排、每排20针的排母。
进一步的，上述的MXM模块总线电路中：：所述的五组总线接口排母分别为：高保真音频/安全数字输入输出总线、硬盘光驱/低引脚并行总线、硬盘光驱/通用串行总线、通用串行总线/低压差分信号总线、串行数字视频输出/新一代PCI总线。
进一步的，上述的MXM模块总线电路中：所述的金手指连接器中包括：左右平行的两组信号针，各信号的分配如表1所示。
本发明具有如下优势：
1)方便扩展底板。
2)同类信号之间的阻抗匹配、等长处理等更好控制。
3)数、模、电源各自不干扰。
4)各自类型的中间都以地脚隔开，相当隔离带一样，减少干扰传播。
以下将结合附图和实施例，对本发明进行较为详细的说明。
附图说明
附图1为本发明核心模块主板与底板组合过程示意图。
附图2为本发明核心模块主板与底板组合示意图。
具体实施方式
本实施例是一种组合式平台，在底板1上安装核心模块主板2，比如将CPU、南北桥芯片等设置在核心主板2上，其它I/O模块设置在底板上，由于升级时一般是对CPU、南北桥芯片等进行升级，而I/O模块、通信模块、通道等一般不需要升级，因此，只需要更换核心主板，目前，在底板上设置有MSATA座子3，它与核心主板2上的金手指4配合，如图1和图2所示为将核心主板2装配到底板1上的装配过程示意图。实现总线连接，本实施例中，金手指连接器中同类信号放一起，自类型的中间都以地脚隔开。
本实施例中，核心主板2的总线接口板包括一印刷线路板，以及焊接在该印刷线路板边缘的金手指接口，金手指接口包括两组电源接口和五组总线接口，电源接口排母为两排、每排10针的排母，总线接口排母为两排、每排20针的排母。
五组总线接口排母分别为：高保真音频/安全数字输入输出总线(HAUDIO/SDIO)、硬盘光驱/低引脚并行总线(IDE/LPC)、硬盘光驱/通用串行总线(IDE/USB)、通用串行总线/低压差分信号总线(USB/LVDS)、串行数字视频输出/新一代PCI总线(SDVO/PCI_EXPRESS)。
物料的型号是CONN Foxconn MXM 3.0A SMD-281Pin NPB。具有281针，分成两组，具体定义如表1所示：五组总线接口排母占有200针，而电源接口占有40针，另外41针暂时悬空，可以由用户定义。
表1
Figure BDA0002592233380000031
Figure BDA0002592233380000041
Figure BDA0002592233380000051
Figure BDA0002592233380000061
Figure BDA0002592233380000071
Figure BDA0002592233380000081
Figure BDA0002592233380000091

Claims (5)

1.一种MXM模块总线电路，包括连接核心PCB板和底板之间的金手指连接器；其特征在于：所述的金手指连接器中同类信号放一起，各类型的中间都以地脚隔开。
2.根据权利要求1所述的MXM模块总线电路，其特征在于：所述金手指连接器中至少包括两组电源接口和五组总线接口，所述电源接口排母为两排、每排10针的排母，所述总线接口排母为两排、每排20针的排母。
3.根据权利要求3所述的MXM模块总线电路，其特征在于：所述的五组总线接口排母分别为：高保真音频/安全数字输入输出总线、硬盘光驱/低引脚并行总线、硬盘光驱/通用串行总线、通用串行总线/低压差分信号总线、串行数字视频输出/新一代PCI总线。
4.根据权利要求4所述的MXM模块总线电路，其特征在于：所述的金手指连接器中包括：左右平行的两组信号针，各信号的分配如表1所示。
5.根据权利要求1所述的MXM模块总线电路，其特征在于：
所述的金手指连接器的物料的型号是CONN Foxconn MXM 3.0 A SMD-281Pin NPB。
表1：
Figure FDA0002592233370000011
Figure FDA0002592233370000021
Figure FDA0002592233370000041
Figure FDA0002592233370000051
Figure FDA0002592233370000061
Figure FDA0002592233370000071
CN202010698652.2A 2020-07-20 2020-07-20 一种mxm模块总线电路 Pending CN111628319A (zh)

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