CN111627897A - Three-dimensional packaging structure and preparation method thereof - Google Patents
Three-dimensional packaging structure and preparation method thereof Download PDFInfo
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- CN111627897A CN111627897A CN202010472891.6A CN202010472891A CN111627897A CN 111627897 A CN111627897 A CN 111627897A CN 202010472891 A CN202010472891 A CN 202010472891A CN 111627897 A CN111627897 A CN 111627897A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Abstract
The invention provides a three-dimensional packaging structure and a preparation method thereof, and the three-dimensional packaging structure comprises a cover plate, a first hard plate and a plurality of second hard plates arranged on the side edge of the first hard plate, wherein the first hard plate is electrically connected with the second hard plates through flexible conductors, the first hard plate, the second hard plates, the flexible conductors and the cover plate form an accommodating inner cavity, one side of the first hard plate, facing the accommodating inner cavity, is provided with at least one first chip, the first chip is electrically connected with the first hard plate, the second hard plates are provided with at least one second chip, and the second chip is electrically connected with the second hard plates. The first chip and the second chip are respectively arranged on different hard boards, so that the requirement of a packaging mode on the size of the chip is reduced, and the flexibility is higher; in addition, the problem that the lamination quantity and the wiring difficulty of the first hard board are greatly increased due to the fact that the devices are arranged on the first hard board in the traditional two-dimensional chip packaging structure is also solved.
Description
Technical Field
The invention relates to the technical field of integrated circuit packaging, in particular to a three-dimensional packaging structure and a preparation method thereof.
Background
With the trend of miniaturization or portability of electronic systems, packaging technology for realizing high-density products is getting more and more attention from system manufacturers. Three-dimensional chip stacking technology is considered to be an effective method for achieving high-density packaging. The three-dimensional chip stacking technology is a three-dimensional stacking processing technology which aims at forming three-dimensional integration, signal communication, wafer level, chip level, silicon cap packaging and other packaging and reliability technologies in the Z-axis direction of chips or structures with different functions through a stacking technology or a micro-machining technology such as via hole interconnection.
However, in the three-dimensional chip stacking technology, the stacked chips need to be gradually increased in size or the same in size from top to bottom, and the requirement on the chips is high; when the chip does not meet the size requirement of the three-dimensional stacking technology, part of the chip needs to be tiled, and the chip is packaged by combining the traditional two-dimensional chip packaging technology, so that the size of the packaging structure is increased, and the difficulty of substrate wiring is increased.
Disclosure of Invention
Therefore, the technical problem to be solved by the present invention is to overcome the defect that the size requirement of the chip to be packaged is high in the three-dimensional chip stacking technology, thereby providing a three-dimensional packaging structure and a manufacturing method thereof.
The invention provides a three-dimensional packaging structure, which comprises a first hard board (1), a plurality of second hard boards (2) arranged on the side edges of the first hard board (1) and a cover board (4), wherein the first hard board (1) and the second hard boards (2) are electrically connected through flexible conductors (3), the first hard board (1), the second hard boards (2), the flexible conductors (3) and the cover board (4) form an accommodating inner cavity, one side of the first hard board (1) facing the accommodating inner cavity is provided with at least one first chip (5), the first chip (5) is electrically connected with the first hard board (1), the second hard board (2) is provided with at least one second chip (6), and the second chip (6) is electrically connected with the second hard board (2).
Further, the second chip (6) is arranged on one side, facing the accommodating inner cavity, of the second hard board (2); or the second chip (6) is arranged on one side of the second hard board (2) departing from the containing inner cavity.
Furthermore, at least one passive element (8) is arranged on one side of the first hard board (1) facing the accommodating inner cavity, and the passive element (8) is electrically connected with the first hard board (1); and/or at least one passive element (8) is arranged on one side of the second hard board (2) where the second chip (6) is arranged, and the passive element (8) is electrically connected with the second hard board (2).
Furthermore, the cover plate (4) is made of glass; or, apron (4) are setting up second hardboard (2) are kept away from the third hardboard of first hardboard (1) one side, just the third hardboard pass through flexible conductor (3) with second hardboard (2) electricity is connected, the third hardboard orientation one side of holding inner chamber is provided with a plurality of third chips (7) and/or passive component (8), just third chip (7) and/or passive component (8) with the third hardboard electricity is connected.
Furthermore, the containing inner cavity is filled with curing glue (9).
Furthermore, the flexible conductor (3) is a flexible circuit board, and the first hard board (1), the flexible circuit board and the second hard board (2) form a rigid-flex board.
Furthermore, a plurality of solder balls (10) are arranged on one side of the first hard board (1) departing from the accommodating cavity, and the solder balls (10) are electrically connected with the first hard board (1).
The invention also provides a preparation method of the three-dimensional packaging structure, which comprises the following steps:
arranging at least one first chip (5) on a first hard board (1), wherein the first chip (5) is electrically connected with the first hard board (1);
arranging at least one second chip (6) on the second hard board (2), wherein the second chip (6) is electrically connected with the second hard board (2);
the second hard board (2) is folded along the flexible conductor (3) in a winding mode, so that an accommodating inner cavity is formed by the first hard board (1), the flexible conductor (3) and the second hard board (2), and the first chip (5) faces the inside of the accommodating inner cavity;
and a cover plate (4) is connected at the cavity opening of the containing inner cavity so as to seal the containing inner cavity.
Further, before the step of arranging the cover plate (4) at the orifice of the accommodating inner cavity, the step of filling the curing glue (9) into the accommodating inner cavity is also included.
Furthermore, after the cover plate (4) is arranged at the cavity opening of the accommodating inner cavity, the ball planting is carried out on one side, away from the accommodating inner cavity, of the first hard plate (1).
The technical scheme of the invention has the following advantages:
1. the invention provides a three-dimensional packaging structure which comprises a cover plate, a first hard plate and a plurality of second hard plates arranged on the side edge of the first hard plate, wherein the first hard plate is electrically connected with the second hard plates through flexible conductors, the first hard plate, the second hard plates, the flexible conductors and the cover plate form an accommodating inner cavity, one side of the first hard plate, facing the accommodating inner cavity, is provided with at least one first chip, the first chip is electrically connected with the first hard plate, the second hard plate is provided with at least one second chip, and the second chip is electrically connected with the second hard plate.
The first hard board is electrically connected with the second hard board through a flexible conductor, so that a first chip arranged on the first hard board and a second chip arranged on the second hard board realize signal communication and integration, and meanwhile, the first chip and the second chip are respectively arranged on different hard boards, so that the requirement of a packaging mode on the size of the chip is reduced, and the flexible packaging structure has greater flexibility; in addition, because the first chip and the second chip are respectively arranged on different hardboards, the problems that the number of stacked layers of the first hardboard and the wiring difficulty are greatly increased due to the fact that devices are arranged on the first hardboard in the traditional two-dimensional chip packaging structure are solved.
2. According to the preparation method of the three-dimensional packaging structure, the first chip and the second chip are respectively arranged on the first hard board and the second hard board, the second hard board is wound and folded along the flexible conductor, the first hard board, the flexible conductor and the second hard board form the containing inner cavity, and then the containing inner cavity is sealed by the connecting cover plate, so that the three-dimensional packaging structure is obtained.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a cross-sectional view of a three-dimensional package structure provided in embodiment 1 of the present invention;
fig. 2 is a cross-sectional view of a three-dimensional package structure provided in embodiment 2 of the present invention;
fig. 3 is a cross-sectional view of a three-dimensional package structure provided in embodiment 3 of the present invention;
fig. 4 is a schematic structural view of a first hard board and a second hard board of the three-dimensional package structure shown in fig. 1;
fig. 5 is a schematic structural view of step (1) of the method for manufacturing the three-dimensional package structure shown in fig. 2;
fig. 6 is a schematic structural view of step (2) of the method for manufacturing the three-dimensional package structure shown in fig. 2;
fig. 7 is a schematic structural view of step (3) of the method for manufacturing the three-dimensional package structure shown in fig. 2;
fig. 8 is a schematic structural view of step (4) of the method for manufacturing the three-dimensional package structure shown in fig. 2;
fig. 9 is a schematic structural view of step (5) of the method for manufacturing the three-dimensional package structure shown in fig. 2;
fig. 10 is a schematic structural view of step (6) of the method for manufacturing the three-dimensional package structure shown in fig. 2;
fig. 11 is a schematic structural view of a first hard board and a second hard board of the three-dimensional package structure shown in fig. 3;
description of reference numerals:
1-a first rigid plate; 2-a second rigid board; 3-a flexible conductor; 4-cover plate; 5-a first chip; 6-a second chip; 7-a third chip; 8-passive elements; 9-curing glue; 10-solder ball.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example 1
As shown in fig. 1, the embodiment provides a three-dimensional package structure, including a first hard board 1, a plurality of second hard boards 2 disposed at a side of the first hard board 1, and a cover plate 4, where the first hard board 1 is electrically connected to the second hard boards 2 through flexible conductors 3, the first hard board 1, the second hard boards 2, the flexible conductors 3 and the cover plate 4 form an accommodating cavity, one side of the first hard board 1 facing the accommodating cavity is provided with at least one first chip 5, the first chip 5 is electrically connected to the first hard board 1, the second hard board 2 is provided with at least one second chip 6, and the second chip 6 is electrically connected to the second hard board 2.
In this embodiment, the first hard board 1 and the second hard board 2 are rigid PCB boards, an included angle between the first hard board 1 and the second hard board 2 is not limited too much, and may be a right angle or an acute angle, and as a modification, the first hard board 1 and the second hard board 2 are connected perpendicularly. The shapes and the number of the first hard board 1 and the second hard board 2 can be adjusted according to actual conditions. As shown in fig. 4, when the first hard board 1 is rectangular, four sides of the first hard board are connected with the rectangular second hard board 2, and the first hard board 1 and the second hard board 2 form a right angle, so that the three-dimensional package structure shown in fig. 1 is obtained.
The first hard board is electrically connected with the second hard board through the flexible conductor, so that the signal communication and integration of a first chip arranged on the first hard board and a second chip arranged on the second hard board are realized, and meanwhile, the requirements of a packaging mode on the size of the chip are reduced and the flexibility is higher as the first chip and the second chip are respectively arranged on different hard boards; in addition, because the first chip and the second chip are respectively arranged on different hardboards, the problems that the number of stacked layers of the first hardboard and the wiring difficulty are greatly increased due to the fact that devices are arranged on the first hardboard in the traditional two-dimensional chip packaging structure are solved. When the packaging structure is used, a plurality of chips with different functions can be arranged on different hardboards according to requirements, so that the requirement of the high-density packaging structure is met.
Specifically, the flexible conductor 3 is a flexible circuit board, the first hard board 1, the flexible circuit board and the second hard board 2 form a rigid-flex board, the rigid-flex board is electrically connected to the first hard board 1, the flexible circuit board and the second hard board 2, and the specific structure is shown in fig. 4. The rigid-flexible circuit board is a circuit board which is formed by the processes of pressing the flexible circuit board and the rigid circuit board and has the characteristics of the flexible circuit board and the rigid circuit board, so that the rigid-flexible circuit board has a certain flexible area and a certain rigid area, and is greatly helpful for saving the internal space of a product, reducing the volume of a finished product and improving the performance of the product, and is suitable for the three-dimensional packaging structure in the application. As a modification, the flexible conductor 3 may also be a wire to electrically connect the first hard board 1 with the second hard board 2.
Further, the second chip 6 is arranged on one side of the second hard board 2 facing the accommodating cavity; at least one passive element 8 is further arranged on one side of the first hard board 1 facing the containing cavity, and the passive element 8 is electrically connected with the first hard board 1; one side of the second hard board 2, on which the second chip 6 is disposed, is further provided with at least one passive element 8, the passive element 8 is electrically connected to the second hard board 2, and the passive element 8 itself may be one or more of a capacitor, a resistor, and an inductor. The conventional three-dimensional stacked chip packaging mode can only complete the packaging of a plurality of chips, but cannot complete the integration of passive elements such as resistors, capacitors and the like in the packaging structure.
Specifically, the cover plate 4 is glass, and the first chip and the second chip are flip chips. As a variant, the cover plate 4 may also be a ceramic substrate, other rigid materials also being suitable for the cover plate 4. Meanwhile, in order to achieve stable connection between the cover plate 4 and the second hard plate 2, glue or the like is provided between the cover plate 4 and the second hard plate.
Meanwhile, in order to complete the shaping of the three-dimensional packaging structure, the three-dimensional packaging structure is made to have a fixed shape, the containing inner cavity is filled with curing glue 9, the curing glue can be epoxy resin glue or silica gel, and other curable materials also belong to the protection range of the application. The curing glue is filled in the accommodating inner cavity, so that damage to the junction structure caused by thermal expansion of gas in the accommodating inner cavity in the use process can be avoided.
In addition, a plurality of solder balls 10 are arranged on one side of the first hard board (1) departing from the containing cavity, and the solder balls 10 are electrically connected with the first hard board 1 and are used for being electrically connected with a next-stage substrate.
Example 2
As shown in fig. 2, the present embodiment provides a three-dimensional package structure, which is different from the three-dimensional package structure provided in embodiment 1 only in that: the second chip 6 is arranged on one side of the second hard board 2 departing from the containing cavity, and at least one passive element 8 arranged on the second hard board 2 and the second chip 6 are arranged on the same side of the second hard board 2. This embodiment provides a three-dimensional packaging structure through with the second chip setting on the second hardboard in the built-in cavity outside, has reduced the radiating pressure of holding inner chamber, is favorable to packaging structure's heat dissipation.
Example 3
As shown in fig. 3, the present embodiment provides a three-dimensional package structure, which is different from the three-dimensional package structure provided in embodiment 1 only in that: the cover plate 4 is a third hard plate which is arranged on one side, far away from the first hard plate 1, of the second hard plate 2, the third hard plate is electrically connected with the second hard plate 2 through the flexible conductor 3, one side, facing the containing inner cavity, of the third hard plate is provided with a plurality of third chips 7 and/or passive elements 8, and the third chips 7 and/or the passive elements 8 are electrically connected with the third hard plate. Specifically, the first hard board 1, the second hard board 2, the third hard board, the flexible circuit board connecting the first hard board 1 and the second hard board 2, and the flexible circuit board connecting the third hard board and the second hard board 2 form a rigid-flex board, and the specific structure of the rigid-flex board is shown in fig. 11.
Through setting the apron to the third hardboard of being connected with the second hardboard electricity, realized the make full use of three-dimensional packaging structure space, reduced the wiring pressure of first hardboard and second hardboard, still improved whole three-dimensional packaging structure's chip and set up density, guaranteed high density packaging structure's demand.
Example 4
As shown in fig. 5 to fig. 10, this embodiment provides a method for manufacturing a three-dimensional package structure to obtain the three-dimensional package structure provided in embodiment 2, including the following steps:
step (1): at least one first chip is arranged on the first hard board, and the first chip is electrically connected with the first hard board; specifically, a solder ball is deposited on a first chip, then the first chip is turned over and is in contact with a first hard board, then the solder ball is heated, and after the solder ball is solidified, the first chip is electrically connected with the first hard board;
at least one passive element is arranged on one side of the first hard board facing the containing cavity and is electrically connected with the first hard board; specifically, firstly, the solder paste is leaked and printed on the pad of the first hard board, then the glue for fixing is dripped on the first hard board, the passive component is mounted, and then the solder paste is melted and reflowed, so that the passive component is electrically connected with the first hard board.
Step (2): at least one second chip is arranged on the second hard board, the second chip is electrically connected with the second hard board, and the second chip and the first chip are arranged on opposite surfaces of the rigid-flex board; specifically, a solder ball is deposited on the second chip, then the second chip is turned over and is in contact with the second hard board, then the solder ball is heated, and after the solder ball is solidified, the second chip is electrically connected with the second hard board;
at least one passive element is arranged on one side of the second hard board, which is provided with the first chip, and the passive element is electrically connected with the second hard board; specifically, firstly, the solder paste is leaked and printed on the pad of the second hard board, then the glue for fixing is dripped on the second hard board, the passive component is mounted, and then the solder paste is melted and reflowed, so that the passive component and the second hard board are electrically connected.
And (3): the second hard board is wound and folded along the flexible conductor, so that the first hard board, the flexible conductor and the second hard board form an accommodating inner cavity, and the first chip is arranged towards the inside of the accommodating inner cavity; specifically, the winding position can be coated with adhesive glue to finish the primary shaping of the three-dimensional packaging structure after curing.
And (4): and filling curing glue into the accommodating cavity so as to fill the cavity.
And (5): connecting a cover plate at the cavity opening of the accommodating inner cavity to seal the accommodating inner cavity; specifically, firstly, coating adhesive glue on the edge of the cavity opening of the accommodating inner cavity, and then buckling the cover plate on the cavity opening to finish sealing the accommodating inner cavity; and then curing the curing glue to finish the shaping of the three-dimensional packaging structure.
And (6): and planting balls on one side of the first hard board, which is far away from the containing inner cavity. Because the three-dimensional packaging structure is also required to be electrically connected with an external circuit, a ball planting process of the solder balls is required to be completed on the lower surface of the first hard board, and the solder balls are conveniently adopted to be connected with the external circuit.
The preparation method of the three-dimensional packaging structure has the advantage of simple preparation process, and the prepared three-dimensional packaging structure is suitable for packaging a plurality of chips with different types and sizes, and simultaneously reduces the wiring difficulty of the first hard board and the production cost.
Example 5
This embodiment provides a method for manufacturing a three-dimensional package structure, so as to obtain the three-dimensional package structure provided in embodiment 1, which is different from the method for manufacturing the three-dimensional package structure provided in embodiment 4 only in that: in the step (2), the second chip 6, the at least one passive element disposed on the second hard board 2, and the first chip are disposed on the same side of the rigid-flex board, which is not described herein again.
Example 6
This embodiment provides a method for manufacturing a three-dimensional package structure, so as to obtain the three-dimensional package structure provided in embodiment 3, which is different from the method for manufacturing the three-dimensional package structure provided in embodiment 5 only in that:
in the step (2), at least one third chip and/or passive element is arranged on the third hard board, the second chip and/or passive element is electrically connected with the third hard board, and the third chip and/or passive element and the first chip are arranged on the same side of the soft-hard bonding board;
and (3) winding and folding the third hard board along the flexible conductor, filling curing glue into the accommodating cavity, gluing the edge of the third hard board and connecting the edge of the third hard board with the edge of the second hard board.
The third chip is arranged in the same manner as the first chip or the second chip, and the passive component has the same arrangement manner, which is not described herein again.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (10)
1. The utility model provides a three-dimensional packaging structure, its characterized in that, including first hardboard (1), set up in a plurality of second hardboards (2) and apron (4) of first hardboard (1) side, first hardboard (1) with second hardboard (2) are connected through flexible conductor (3) electricity, first hardboard (1), second hardboard (2), flexible conductor (3) and apron (4) form the holding inner chamber, first hardboard (1) orientation one side of holding inner chamber is provided with at least one first chip (5), just first chip (5) with first hardboard (1) electricity is connected, second hardboard (2) are provided with at least one second chip (6), just second chip (6) with second hardboard (2) electricity is connected.
2. The three-dimensional packaging structure according to claim 1, wherein the second chip (6) is disposed on a side of the second rigid board (2) facing the accommodating cavity; or the like, or, alternatively,
the second chip (6) is arranged on one side, deviating from the containing inner cavity, of the second hard board (2).
3. The three-dimensional encapsulation structure according to claim 2,
at least one passive element (8) is further arranged on one side of the first hard board (1) facing the containing cavity, and the passive element (8) is electrically connected with the first hard board (1); and/or the presence of a gas in the gas,
one side, provided with the second chip (6), of the second hard board (2) is also provided with at least one passive element (8), and the passive element (8) is electrically connected with the second hard board (2).
4. The three-dimensional encapsulation structure according to any one of claims 1 to 3,
the cover plate (4) is made of glass; or the like, or, alternatively,
the cover plate (4) is arranged on the second hard plate (2) far away from the third hard plate on one side of the first hard plate (1), the third hard plate is electrically connected with the second hard plate (2) through a flexible conductor (3), the third hard plate faces towards one side of the containing inner cavity and is provided with a plurality of third chips (7) and/or passive elements (8), and the third chips (7) and/or the passive elements (8) are electrically connected with the third hard plate.
5. The three-dimensional packaging structure according to any one of claims 1 to 4, wherein the accommodating cavity is filled with a curing glue (9).
6. The three-dimensional packaging structure according to any one of claims 1 to 5, wherein the flexible conductor (3) is a flexible circuit board, and the first hard board (1), the flexible circuit board and the second hard board (2) form a rigid-flex board.
7. The solid package structure according to any one of claims 1 to 6, wherein a plurality of solder balls (10) are disposed on a side of the first rigid board (1) facing away from the receiving cavity, and the solder balls (10) are electrically connected to the first rigid board (1).
8. The preparation method of the three-dimensional packaging structure is characterized by comprising the following steps:
arranging at least one first chip (5) on a first hard board (1), wherein the first chip (5) is electrically connected with the first hard board (1);
arranging at least one second chip (6) on the second hard board (2), wherein the second chip (6) is electrically connected with the second hard board (2);
the second hard board (2) is folded along the flexible conductor (3) in a winding mode, so that an accommodating inner cavity is formed by the first hard board (1), the flexible conductor (3) and the second hard board (2), and the first chip (5) faces the inside of the accommodating inner cavity;
and a cover plate (4) is connected at the cavity opening of the containing inner cavity so as to seal the containing inner cavity.
9. The method for preparing a three-dimensional package structure according to claim 8, further comprising a step of filling the accommodating cavity with a curing glue (9) before the step of providing the cover plate (4) at the opening of the accommodating cavity.
10. The method for manufacturing the three-dimensional packaging structure according to claim 8 or 9, further comprising performing ball-planting on a side of the first hard board (1) facing away from the receiving cavity after the step of providing the cover board (4) at the opening of the receiving cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010472891.6A CN111627897A (en) | 2020-05-28 | 2020-05-28 | Three-dimensional packaging structure and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010472891.6A CN111627897A (en) | 2020-05-28 | 2020-05-28 | Three-dimensional packaging structure and preparation method thereof |
Publications (1)
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