CN111624856A - Mask plate, motion table positioning error compensation device and compensation method - Google Patents

Mask plate, motion table positioning error compensation device and compensation method Download PDF

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Publication number
CN111624856A
CN111624856A CN201910152262.2A CN201910152262A CN111624856A CN 111624856 A CN111624856 A CN 111624856A CN 201910152262 A CN201910152262 A CN 201910152262A CN 111624856 A CN111624856 A CN 111624856A
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China
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mark
positioning
marks
center
imaging
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CN201910152262.2A
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CN111624856B (en
Inventor
吴丽丽
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Shanghai Micro Electronics Equipment Co Ltd
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Shanghai Micro Electronics Equipment Co Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The invention discloses a mask plate, a motion table positioning error compensation device and a compensation method. The reticle includes measurement marks; the measurement mark comprises at least one measurement unit, the measurement unit comprises two mark groups, the mark groups comprise an X-direction mark and a Y-direction mark, the X-direction mark comprises at least one X-direction grating and an X-direction positioning mark, and the Y-direction mark comprises at least one Y-direction grating and a Y-direction positioning mark; the two mark groups comprise a first mark group and a second mark group, the center of the first mark group is a first center, the center of the second mark group is a second center, and after the measuring mark rotates clockwise or anticlockwise by 90 degrees, the first center is coincided with the second center before the measuring mark does not rotate. The technical scheme provided by the embodiment of the invention realizes the correction of the high-order deformation of the motion platform and is suitable for on-line periodic calibration.

Description

Mask plate, motion table positioning error compensation device and compensation method
Technical Field
The embodiment of the invention relates to the technical field of photoetching, in particular to a mask and a motion table positioning error compensation device and a compensation method.
Background
Photolithography, or photolithography, has been widely used in integrated circuit fabrication processes. This technique transfers the designed mask pattern onto the photoresist by exposure through an optical projection device. Optical projection devices, which are important equipment in the fabrication of integrated circuits, ultimately determine the feature sizes of the integrated circuits, the accuracy requirements of which are of considerable importance to the lithographic process. In the exposure process, because the workpiece stage bearing the silicon wafer and the mask stage bearing the mask can generate stepping or scanning movement, the positioning precision of the moving stage can directly influence the quality of the pattern exposed on the silicon wafer.
The reflecting plane mirror is used for influencing the positioning accuracy in the motion platform measuring system controlled by the interferometer, and the plane grating is used for influencing the positioning accuracy in the motion platform measuring system controlled by the plane grating ruler. In any case, although the mirror plane or the grating scale plane is precisely machined and polished, the surface of the mirror or the grating scale inevitably has defects. Even defect spots of only a few nanometers in size cause considerable errors in the accuracy of the optical projection device. In order to reduce the above errors as much as possible, the optical plane surface must be measured before exposure to obtain the measurement data of the surface shape image, and then the surface defects must be corrected and compensated, so as to meet the high precision requirement of the system. However, the motion stage positioning error compensation device in the prior art can only realize low-order error compensation and cannot calibrate high-order deformation.
Disclosure of Invention
The invention provides a mask plate, a motion table positioning error compensation device and a compensation method, which are used for realizing high-order positioning error compensation of a mask plate table and a workpiece table.
In a first aspect, embodiments of the present invention provide a reticle, including a measurement mark;
the measurement mark comprises at least one measurement unit, the measurement unit comprises two mark groups, the mark groups comprise an X-direction mark and a Y-direction mark, the X-direction mark comprises at least one X-direction grating and an X-direction positioning mark, and the Y-direction mark comprises at least one Y-direction grating and a Y-direction positioning mark;
the two mark groups comprise a first mark group and a second mark group, the center of the first mark group is a first center, the center of the second mark group is a second center, and after the measuring mark rotates clockwise or anticlockwise by 90 degrees, the first center is coincided with the second center before the measuring mark does not rotate.
In a second aspect, an embodiment of the present invention further provides a device for compensating a positioning error of a motion stage, including:
the mask plate is provided with a measuring mark for measuring the positioning error of the moving table;
the mask table is used for bearing the mask plate;
the workpiece table is used for bearing the substrate after the glue coating;
a projection objective for imaging the measurement marks on the reticle onto the substrate;
an alignment device for measuring an imaged mark on the substrate after development of the measurement mark;
the measurement marks comprise two mark groups, each mark group comprises an X-direction mark and a Y-direction mark, the X-direction marks comprise at least one X-direction grating and at least one X-direction positioning mark, and the Y-direction marks comprise at least one Y-direction grating and at least one Y-direction positioning mark;
the two mark groups comprise a first mark group and a second mark group, the center of the first mark group is a first center, the center of the second mark group is a second center, and after the measuring mark rotates clockwise or anticlockwise by 90 degrees, the first center is coincided with the second center before the measuring mark does not rotate.
In a third aspect, an embodiment of the present invention further provides a method for compensating a positioning error of a motion stage, including:
s1, imaging measurement marks on the mask on a substrate, wherein the measurement marks comprise at least one measurement unit, the measurement unit comprises two mark groups, the mark groups comprise X-direction marks and Y-direction marks, the X-direction marks comprise at least one X-direction grating and at least one X-direction positioning mark, and the Y-direction marks comprise at least one Y-direction grating and at least one Y-direction positioning mark;
the two mark groups comprise a first mark group and a second mark group, the center of the first mark group is a first center, the center of the second mark group is a second center, and after the measuring mark is rotated by 90 degrees clockwise or anticlockwise, the first center is coincided with the second center before the measuring mark is not rotated;
s2, acquiring expected positions and actual positions of the imaging markers of the first marker set on the substrate;
s3, moving the substrate such that the imaged marks of the measurement marks after the moving are rotated 90 ° clockwise or counterclockwise relative to the imaged marks before the moving, acquiring the desired and actual positions of the imaged marks of the second set of marks on the substrate after the moving;
s4, calculating the high-order positioning errors of the workpiece stage and the mask stage according to the position information obtained in S2 and S3, and performing data processing to obtain a positioning error compensation table;
and S5, respectively compensating the workpiece stage position measuring system and the mask stage position measuring system by using the obtained positioning error compensation table.
The mask provided by the embodiment of the invention comprises a measurement mark; the measurement mark comprises at least one measurement unit, the measurement unit comprises two mark groups, the mark groups comprise an X-direction mark and a Y-direction mark, the X-direction mark comprises at least one X-direction grating and an X-direction positioning mark, and the Y-direction mark comprises at least one Y-direction grating and a Y-direction positioning mark; the two mark groups comprise a first mark group and a second mark group, the center of the first mark group is a first center, the center of the second mark group is a second center, and after the measuring mark rotates clockwise or anticlockwise by 90 degrees, the first center is coincided with the second center before the measuring mark does not rotate. After the measurement mark on the mask plate is imaged on the substrate, the high-order positioning errors of the workpiece table and the mask table can be calculated according to the expected position information and the actual position information of the imaging mark, a positioning error compensation table is formed after data processing, the positioning error compensation table is used for compensating the motion table, and the high-order deformation of the motion table is corrected. In addition, the measurement mark on the mask plate is small in size, so that an imaging mark of the measurement mark can be accommodated in the substrate scribing groove, and the method is suitable for on-line periodic calibration.
Drawings
In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, a brief description is given below of the drawings used in describing the embodiments. It should be clear that the described figures are only views of some of the embodiments of the invention to be described, not all, and that for a person skilled in the art, other figures can be derived from these figures without inventive effort.
FIG. 1 is a schematic structural diagram of a reticle provided by an embodiment of the invention;
FIG. 2 is a schematic structural view of yet another reticle provided by an embodiment of the invention;
fig. 3 is a schematic structural diagram of a motion stage positioning error compensation apparatus according to an embodiment of the present invention;
FIG. 4 is a flowchart illustrating a method for compensating for positioning errors of a motion stage according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of an imaging marker according to an embodiment of the present invention;
FIG. 6 is a schematic view of the imaging label of FIG. 5 rotated 90 clockwise;
fig. 7 is a schematic structural diagram of a substrate according to an embodiment of the invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the relevant aspects of the present invention are shown in the drawings. Before discussing exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although a flowchart may describe the operations (or steps) as a sequential process, many of the operations can be performed in parallel, concurrently or simultaneously. In addition, the order of the operations may be re-arranged. The process may be terminated when its operations are completed, but may have additional steps not included in the figure. The processes may correspond to methods, functions, procedures, subroutines, and the like.
FIG. 1 is a schematic structural diagram of a reticle according to an embodiment of the present invention. As shown in fig. 1, the reticle includes a measurement mark 100, the measurement mark 100 includes at least one measurement unit 110, the measurement unit 110 includes two mark groups, the mark groups include an X-direction mark 101 and a Y-direction mark 102, the X-direction mark 101 includes at least one X-direction grating 101/1 and an X-direction positioning mark 101/2, the Y-direction mark 102 includes at least one Y-direction grating 102/1 and a Y-direction positioning mark 102/2, the two mark groups include a first mark group 111 and a second mark group 112, a center where the first mark group 111 is positioned is a first center, a center where the second mark group 112 is positioned is a second center, and the first center coincides with the second center before non-rotation after the measurement mark 100 is rotated 90 ° clockwise or counterclockwise.
It should be noted that the dividing manner of the first mark group 111 and the second mark group 112 in the same measurement mark 100 is not limited to that shown in fig. 1, and in this embodiment, any X mark and any Y mark may be combined into the first mark group 111, and the remaining X marks and Y marks may be combined into the second mark group 112.
It should be further noted that fig. 1 merely provides an exemplary specific structure of a reticle, and is not limited thereto, in this embodiment, for the number of measurement units 110 in the measurement mark 100, the number of X-direction gratings 101/1 in the X-direction mark 101, the number of Y-direction gratings 102/1 in the Y-direction mark 102, the relative position relationship between the X-direction grating 101/1 and the X-direction positioning mark 101/2 in the X-direction mark 101, the relative position relationship between the Y-direction grating 102/1 and the Y-direction positioning mark 102/2 in the Y-direction mark 102, the shapes of the X-direction positioning mark 101/2 and the Y-direction positioning mark 102/2, the slit width of at least one X-direction grating 101/1 in the same X-direction mark 101, the slit width of at least one Y-direction grating 102/1 in the same Y-direction mark 102, and the position relationship between different X-direction gratings 101/1 in the same X-direction mark 101, and the positional relationship between different Y-direction rasters 102/1 in the same Y-direction mark 102 are not particularly limited.
Alternatively, a rectangular region having the smallest area and including all the X-directional gratings 101/1 and the Y-directional grating 102/1 in the same measurement unit 110 is defined as a first region, and all the X-directional positioning marks 101/2 and the Y-directional positioning marks 102/2 in the measurement unit 110 are disposed in the first region. Such an arrangement enables the overall size of the measurement unit 110 to be reduced, resulting in a more compact structure of the measurement unit 110.
The reticle provided by the embodiment comprises a measurement mark 100, the measurement mark 100 comprises at least one measurement unit 110, the measurement unit 110 comprises two mark groups, each mark group comprises an X-direction mark 101 and a Y-direction mark 102, the X-direction mark 101 comprises at least one X-direction grating 101/1 and an X-direction positioning mark 101/2, the Y-direction mark 102 comprises at least one Y-direction grating 102/1 and a Y-direction positioning mark 102/2, the two mark groups comprise a first mark group 111 and a second mark group 112, the center where the first mark group 111 is positioned is a first center, the center where the second mark group 112 is positioned is a second center, and after the measurement mark 100 is rotated by 90 degrees clockwise or counterclockwise, the first center is coincident with the second center before the measurement mark is not rotated. After the measurement mark 100 on the mask is imaged on the substrate, the high-order positioning errors of the workpiece stage and the mask stage can be calculated according to the expected position information and the actual position information of the imaging mark, a positioning error compensation table is formed after data processing, the positioning error compensation table is used for compensating the motion stage, and the high-order deformation correction of the motion stage is realized. In addition, the measurement mark 100 on the reticle is small in size, so that an imaging mark of the measurement mark 100 can be accommodated in a substrate scribing groove, and the measurement mark is suitable for on-line periodic calibration.
FIG. 2 is a schematic structural diagram of another reticle provided by an embodiment of the invention. As shown in fig. 2, when the number of the at least one X-direction grating 101/1 is greater than 1 and the number of the at least one Y-direction grating 102/1 is greater than 1, the plurality of X-direction gratings 101/1 in the X-direction mark 101 are arranged in the Y-direction and the plurality of Y-direction gratings 102/1 in the Y-direction mark 102 are arranged in the X-direction.
It should be noted that, this design makes the four sub-measurement marks 100 in the measurement unit 110 arranged more closely, which is beneficial to reduce the occupied space of the measurement unit 110.
Referring to fig. 2, the plurality of X-directional gratings 101/1 in the X-directional mark 101 have different slit widths, and the plurality of Y-directional gratings 102/1 in the Y-directional mark 102 have different slit widths.
It should be noted that, such a design increases the capture range of the sub-measurement mark 100, and reduces the probability of the problem that the alignment apparatus cannot recognize the sub-measurement mark 100 due to its too small capture range.
Alternatively, as shown in fig. 2, the X-direction mark 101 includes two X-direction gratings 101/1, and the Y-direction mark 102 includes two Y-direction gratings 102/1.
Further, with continued reference to FIG. 2, in the same X-direction marker 101, the X-direction alignment mark 101/2 is located between two X-direction gratings 101/1, and in the same Y-direction marker 102, the Y-direction alignment mark 102/2 is located between two Y-direction alignment marks 102/2.
It should be noted that such an arrangement can reduce the overall size of the measurement unit 110, so that the structure of the measurement unit 110 is more compact, and the problem of increasing the size of the measurement unit 110 due to the X-direction positioning mark 101/2 or the Y-direction positioning mark 102/2 is avoided.
It is to be noted that, in other embodiments of this embodiment, the number of the X-directional gratings 101/12 in the same X-directional mark 101 and the number of the Y-directional gratings 102/1 in the same Y-directional mark 102 may also be three or more, which is not specifically limited in this embodiment. It is understood that the larger the number of X-directional gratings 101/1 in the same X-directional mark 101, the larger the capture range of the X-directional mark 101, and the larger the number of X-directional gratings 101/1 in the same Y-directional mark 102, the larger the capture range of the Y-directional mark 102, the more beneficial the measurement of the alignment apparatus.
Illustratively, with continued reference to FIG. 2, X-directional locating marks 101/2 and Y-directional locating marks 102/2 may be cross-shaped.
It should be noted that the relative position relationship between the geometric center points of X-directional positioning mark 101/2 and Y-directional positioning mark 102/2 and measurement mark 100 is a known parameter, and during the subsequent measurement of the imaged mark, the positions of corresponding X-directional mark 101 and Y-directional mark 102 on the substrate, i.e. the desired positions, can be determined according to the above-mentioned position relationship and the positions of the corresponding imaged marks on the substrate.
In other embodiments of the present embodiment, the X-direction positioning mark 101/2 and the Y-direction positioning mark 102/2 may have other shapes, and the present embodiment is not particularly limited to this, as long as only one position point can be uniquely specified.
Fig. 3 is a schematic structural diagram of a motion stage positioning error compensation apparatus according to an embodiment of the present invention. As shown in fig. 3, the motion stage positioning error compensation apparatus includes a reticle 100, a measurement mark 100 for measuring a positioning error of the motion stage is provided on the reticle 100, a mask stage 300 for carrying the reticle 100, a work stage 600 for carrying a substrate 500 after being coated with glue, a projection objective 400 for imaging the measurement mark 100 on the reticle 100 on the substrate 500, and an alignment apparatus 200 for measuring an imaging mark of the measurement mark 100 on the substrate 500 after being developed, wherein the measurement mark 100 includes two mark groups, the mark group includes an X-direction mark 101 and a Y-direction mark 102, the X-direction mark 101 includes at least one X-direction grating 101/1 and an X-direction positioning mark 101/2, the Y-direction mark 102 includes at least one Y-direction grating 102/1 and a Y-direction positioning mark 102/2, the two mark groups include a first mark group 111 and a second mark group 112, the first mark set 111 is positioned with a center that is a first center and the second mark set 112 is positioned with a center that is a second center, and after the measurement mark 100 is rotated 90 ° clockwise or counterclockwise, the first center coincides with the second center before the rotation.
It is noted that the motion stage includes the mask stage 300 and the workpiece stage 600.
The motion table positioning error compensation device provided by the embodiment comprises a mask plate 100, a measurement mark 100 for measuring the positioning error of the motion table is arranged on the mask plate 100, a mask table 300 for bearing the mask plate 100, a workpiece table 600 for bearing a substrate 500 after being glued, a projection objective 400 for imaging the measurement mark 100 on the mask plate 100 on the substrate 500, and an alignment device 200 for measuring an imaging mark of the measurement mark 100 on the substrate 500 after being developed, wherein the measurement mark 100 comprises two mark groups, the mark group comprises an X-direction mark 101 and a Y-direction mark 102, the X-direction mark 101 comprises at least one X-direction grating 101/1 and an X-direction positioning mark 101/2, the Y-direction mark 102 comprises at least one Y-direction grating 102/1 and a Y-direction positioning mark 102/2, the two mark groups comprise a first mark group 111 and a second mark group 112, the first mark set 111 is positioned with a center that is a first center and the second mark set 112 is positioned with a center that is a second center, and after the measurement mark 100 is rotated 90 ° clockwise or counterclockwise, the first center coincides with the second center before the rotation. After the measurement mark 100 on the mask 100 is imaged on the substrate 500, the high-order positioning errors of the workpiece table 600 and the mask table 300 can be calculated according to the expected position information and the actual position information of the imaging mark, a positioning error compensation table is formed after data processing, and the positioning error compensation table is used for compensating the motion table, so that the high-order deformation correction of the motion table is realized. In addition, measurement marks 100 on reticle 100 are small in size, so that the imaged marks of measurement marks 100 can be accommodated in scribe lanes of substrate 500, suitable for on-line periodic calibration.
Optionally, referring to fig. 3, the motion stage positioning error compensation apparatus further comprises a mask stage position measurement system 700 coupled to the mask stage 300, and a workpiece stage position measurement system 800 coupled to the workpiece stage 600.
Illustratively, mask stage position measurement system 700 and workpiece stage position measurement system 800 employ an interferometer, a grating scale, or a planar grating scale.
Alternatively, the alignment device 200 may employ a CCD or a grating scale.
It should be noted that the related technologies of the mask stage position measurement system 700, the workpiece stage position measurement system 800, and the alignment apparatus 200 having the above structures are mature, which is beneficial to reducing the implementation difficulty of the motion stage positioning error compensation apparatus in this embodiment.
Fig. 4 is a schematic flow chart of a method for compensating a positioning error of a motion stage according to an embodiment of the present invention. The method for compensating the positioning error of the motion table is implemented by using the device for compensating the positioning error of the motion table of any embodiment of the present invention, as shown in fig. 4, the method for compensating the positioning error of the motion table specifically comprises the following steps:
s1, imaging a measurement mark on the mask plate on a substrate, wherein the measurement mark comprises at least one measurement unit, the measurement unit comprises two mark groups, the mark groups comprise an X-direction mark and a Y-direction mark, the X-direction mark comprises at least one X-direction grating and an X-direction positioning mark, and the Y-direction mark comprises at least one Y-direction grating and a Y-direction positioning mark; the two mark groups comprise a first mark group and a second mark group, the center of the first mark group is a first center, the center of the second mark group is a second center, and after the measuring mark is rotated by 90 degrees clockwise or anticlockwise, the first center is superposed with the second center before the measuring mark is not rotated.
Illustratively, the imaged marks on the substrate may be formed by a yellow light process.
S2, acquiring the expected and actual positions of the imaged marks of the first set of marks on the substrate.
S3, moving the substrate such that the imaged marks of the measurement marks after the moving are rotated 90 ° clockwise or counterclockwise relative to before the moving, acquiring the desired and actual positions of the imaged marks of the second set of marks on the substrate after the moving.
Illustratively, the expected positions of the imaging marks corresponding to the X-direction mark and the Y-direction mark are determined according to the positions of the X-direction positioning mark and the Y-direction positioning mark in the measuring mark and the preset positions of the imaging marks of the measuring mark on the substrate, the imaging marks of the X-direction grating and the Y-direction grating are measured by the alignment device, the actual positions of the imaging marks corresponding to the X-direction mark and the Y-direction mark are determined, the expected position and the actual position of the first mark group are determined according to the expected positions and the actual positions of the imaging marks of the X-direction mark and the Y-direction mark in the first mark group, and the expected position and the actual position of the second mark group are determined according to the expected positions and the actual positions of the imaging marks of the X-direction mark and the Y-direction mark in the second mark group.
Specifically, fig. 5 is a schematic structural diagram of an imaging marker according to an embodiment of the present invention. Illustratively, fig. 5 is a schematic view of the structure of the imaging marker obtained at S4 described above. The imaging mark of the measurement unit is a unit imaging mark, the imaging mark of the X-directional mark in the first mark group is a first X-directional imaging mark, the imaging mark of the Y-directional mark in the first mark group is a first Y-directional imaging mark, the imaging mark of the X-directional mark in the second mark group is a second X-directional imaging mark, and the imaging mark of the Y-directional mark in the second mark group is a second Y-directional imaging mark, as shown in fig. 5, the imaging mark includes a plurality of unit imaging marks, and the unit imaging marks include a first X-directional imaging mark 201/1, a first Y-directional imaging mark 202/1, a second X-directional imaging mark 201/2, and a second Y-directional imaging mark 202/2. In the above S2, the desired position and the actual position of the corresponding unit imaging mark may be determined based on the desired position and the actual position of the first X-direction imaging mark 201/1 and the first Y-direction imaging mark 202/1. Fig. 6 is a schematic view of the imaging mark of fig. 5 rotated 90 ° clockwise. Correspondingly, fig. 6 is a schematic structural view of the imaging marker obtained in S3 described above. In the above S3, the desired position and the actual position of the corresponding unit imaging mark may be determined based on the desired position and the actual position of the second X-direction imaging mark 201/2 and the second Y-direction imaging mark 202/2. It is noted that the above-mentioned S2 and S3 are measured using imaging markers of different marker groups among the unit imaging markers.
The desired position of the imaging mark of the recording unit is sexp,α(Mi,j.x,Mi,jY), the actual position of the unit imaging marker is salign,α(Mi,j.x,Mi,jY), wherein i ∈ [1, ∞]And i is a positive integer, j ∈ [1,4 ]]And j is a positive integer, i is the ordering of the imaged marks of each unit in the imaged marks, j is the ordering of the first X-direction imaged mark 201/1, the first Y-direction imaged mark 202/1, the second X-direction imaged mark 201/2, and the second Y-direction imaged mark 202/2 in the same unit imaged mark, α is the cut angle of the substrate, α is 0 ° in the above step S4, α is 90 ° when the substrate is rotated clockwise by 90 ° in step S5, and α is 270 ° when the substrate is rotated counterclockwise by 90 °.
Illustratively, with continued reference to FIG. 5, the imaging markers include a first unit imaging marker 210/1, a second unit imaging marker 210/2, a third unit imaging marker 210/3, and a fourth unit imaging marker 210/4, the four unit imaging markers 220 being sequentially ordered in the order of a first unit imaging marker 210/1, a second unit imaging marker 210/2, a third unit imaging marker 210/3, and a fourth unit imaging marker 210/4, and the first X-direction imaging marker 201/1, the first Y-direction imaging marker 202/1, the second X-direction imaging marker 201/2, and the second Y-direction imaging marker 202/2 of each unit imaging marker 220 being sequentially ordered. The positions of the first X-direction imaging mark 201/1 and the first Y-direction imaging mark 202/1 in the first unit imaging mark 210/1 are M, respectively1，1.xAnd M1，2.yThe positions of the first X-direction imaging mark 201/1 and the first Y-direction imaging mark 202/1 in the second unit imaging mark 210/2Are respectively M2，1.xAnd M2，2.yThe positions of the first X-direction imaging mark 201/1 and the first Y-direction imaging mark 202/1 in the third unit imaging mark 210/3 are M, respectively3，1.xAnd M3，2.yThe positions of the first X-direction imaging mark 201/1 and the first Y-direction imaging mark 202/1 in the fourth unit imaging mark 210/4 are M, respectively4，1.xAnd M4，2.yIn addition, since fig. 5 is a schematic view of the structure of the imaging mark obtained at S4 described above, α is 0 °, so that the desired position of the first-unit imaging mark 210/1 is Sexp,0(M1,1.x,M1, 2Y) actual position is salign,0(M1,1.x,M1,2Y), the desired position of the second unit imaging marker 210/2 is sexp,0(M2, 1.x,M2,2Y) actual position is salign,0(M2,1.x,M2,2Y), the desired position of the third unit imaging marker 210/3 is sexp,0(M3,1.x,M3,2Y) actual position is salign,0(M3,1.x,M3,2Y), the desired position of the fourth unit imaging marker 210/4 is sexp,0(M4,1.x,M4,2Y) actual position is salign,0(M4,1.x,M4,2.y)。
In fig. 6, the plurality of unit imaging markers among the imaging markers are sequentially ordered in the order of the third unit imaging marker 210/3, the first unit imaging marker 210/1, the fourth unit imaging marker 210/4, and the second unit imaging marker 210/2, and the first X-direction imaging marker 201/1, the first Y-direction imaging marker 202/1, the second X-direction imaging marker 201/2, and the second Y-direction imaging marker 202/2 among the unit imaging markers 220 are sequentially ordered. It should be noted that the unit imaging marks in fig. 6 and 5 located at the same position have the same serial number, for example, the first unit imaging mark 210/1 in fig. 5 and the third unit imaging mark 210/3 in fig. 6 are both located in the first row and the first column in the lower view, so that the serial numbers of the first unit imaging mark 210/1 in fig. 5 and the third unit imaging mark 210/3 in fig. 6 are both 1. The sequence numbers of the first X-direction imaging mark 201/1, the first Y-direction imaging mark 202/1, the second X-direction imaging mark 201/2 and the second Y-direction imaging mark 202/2 in each unit imaging mark remain unchanged, for example, the first X-direction imaging mark 201/1 is at different positions of the unit imaging mark 220 in fig. 5 and 6, but the sequence numbers are all 1.
Specifically, with continued reference to FIG. 6, the positions of the second X-direction imaging mark 201/2 and the second Y-direction imaging mark 202/2 in the third unit imaging mark 210/3 are M, respectively1，3.xAnd M1，4.yThe positions of the second X-direction imaging mark 201/2 and the second Y-direction imaging mark 202/2 in the first unit imaging mark 210/1 are M, respectively2，3.xAnd M2，4.yThe positions of the second X-direction imaging mark 201/22 and the second Y-direction imaging mark 202/2 in the fourth unit imaging mark 210/4 are M, respectively3，3.xAnd M3，4.yThe positions of the second X-direction imaging mark 201/2 and the second Y-direction imaging mark 202/22 in the second unit imaging mark 210/2 are M, respectively4，3.xAnd M4，4.yIn addition, fig. 6 is a schematic view of the structure of the imaging mark obtained at S3 described above, and therefore α is 90 °, so that the desired position of the third unit imaging mark 210/3 is Sexp,90(M1,3.x,M1,4Y) actual position is salign,90(M1,3.x,M1,4Y), the desired position of the first unit imaging marker 210/1 is sexp,90(M2,3.x,M2,4Y) actual position is salign,90(M2,3.x,M2,4Y), the desired position of the fourth unit imaging marker 210/4 is sexp,90(M3,3.x,M3,4Y) actual position is salign,90(M3,3.x,M3, 4Y), the desired position of the second unit imaging marker 210/2 is sexp,90(M4,3.x,M4,4Y) actual position is salign,90(M4,3.x,M4,4.y)。
It should be noted that the desired positions of the X-direction imaging mark and the Y-direction imaging mark are the positions on the substrate, and therefore, the desired positions can be obtained according to the positions of the imaging mark of the X-direction positioning mark and the imaging mark of the Y-direction positioning mark in the unit imaging mark and the positions of the corresponding unit imaging mark on the substrate, where the positions of the imaging mark of the X-direction positioning mark and the imaging mark of the Y-direction positioning mark in the unit imaging mark are known parameters, and the position of the corresponding unit imaging mark on the substrate is also a preset parameter.
It should be further noted that the positions in the present embodiment are coordinate positions in the same coordinate system, and for example, the origin of the coordinate system may be the geometric center of the substrate, the abscissa extends along the X direction, and the ordinate extends along the Y direction.
And S4, calculating the high-order positioning errors of the workpiece table and the mask table according to the position information obtained in S2 and S3, and performing data processing to obtain a positioning error compensation table.
Optionally, calculating the high-order positioning error of the workpiece stage and the mask stage according to the position information obtained in S2 and S3 includes: according to the position information obtained in S2 and S3, the upper piece deviation and the overall positioning error, the first order positioning coefficient and the second order positioning coefficient of the workpiece platform and the mask platform are obtained through calculation, the first order positioning error and the second order positioning error of the workpiece platform and the mask platform are obtained according to the first order positioning coefficient and the second order positioning coefficient, the first order positioning error and the second order positioning error in the overall positioning error of the mask platform are removed, the high order positioning error of the mask platform is obtained, the first order positioning error, the second order positioning error and the upper piece deviation in the overall positioning error of the workpiece platform are removed, and the high order positioning error of the workpiece platform is obtained.
For example, the deviation of the upper wafer and the first-order and second-order positioning coefficients of the workpiece stage and the mask stage can be obtained by using a least square method.
Specifically, according to the following formula I, the first-order positioning error coefficient sy of the mask stage is calculated by fitting with the least square methode、sxyeFirst order positioning error coefficient sy of workpiece stagerAnd sxyrSecond order positioning error coefficient stx of mask stageeAnd styeSecond order positioning error coefficient stx of the workpiece tabler、styrAnd a chip mounting deviation Cα、RαAnd Mα：
Figure BDA0001981885150000141
Figure DA00019818851530271
Wherein α represents 0 °, 90 ° or 270 °, α in the above measurement results in S2 is 0 °, α in S3 is 90 ° when the substrate is rotated 90 ° clockwise and then uploaded to the work table, and α in S3 is 270 ° when the substrate is rotated 90 ° counterclockwise and then uploaded to the work table;
Xαas a deviation of the actual position from the desired position,
Figure BDA0001981885150000152
Tαin order to be a matrix of rotations,
Figure BDA0001981885150000153
Figure BDA0001981885150000154
defining settings for exposure measurement marks based on positioning error coefficients
Figure BDA0001981885150000155
Wherein x or y is 0;
Figure BDA0001981885150000156
defining settings for desired positions when measuring marks based on positioning error coefficients
Figure BDA0001981885150000157
Wherein x or y is 0. Calculating the overall positioning error Δ M of the mask stage according to the following formula IIeAnd the integral positioning error Delta M of the workpiece tabler：
X is P.DELTA.M- - -formula two
Wherein X represents the error of the measurement result when α is 0 deg.,
Figure BDA0001981885150000158
p represents the influence coefficient of the positioning error on the measurement result, and is set as the position ssetAnd a desired position sexpA matrix of formations;
Δ M is the overall positioning error at the exposure position, including the overall positioning error Δ M of the mask stageeIntegral point position error delta M of workpiece tabler。
Calculating the high-order positioning error of the workpiece stage and the mask stage according to the following formula III:
Figure BDA0001981885150000159
wherein the content of the first and second substances,
Figure BDA00019818851500001510
for high order positioning errors with the mask table,
Figure BDA00019818851500001511
the high-order positioning error of the workpiece table.
And S5, respectively compensating the workpiece stage position measurement system and the mask stage position measurement system by using the obtained positioning error compensation table.
Illustratively, the compensation mode may be feed forward compensation.
According to the technical scheme provided by the embodiment, the measurement mark on the mask is imaged on the substrate, the high-order positioning errors of the workpiece table and the mask table are calculated according to the expected position information and the actual position information of the imaging mark, a positioning error compensation table is formed after data processing, the positioning error compensation table is used for compensating the motion table, and the high-order deformation correction of the motion table is realized. In addition, the measurement mark on the mask plate is small in size, so that an imaging mark of the measurement mark can be accommodated in the substrate scribing groove, and the method is suitable for on-line periodic calibration.
For example, fig. 7 is a schematic structural diagram of a substrate according to an embodiment of the present invention. As shown in fig. 7, an imaging mark 530 of the measurement mark may be located in the scribe line groove 520 of the substrate 500.
It should be noted that, as shown in fig. 7, the substrate 500 is divided into a plurality of chip units 510 in the subsequent process, and the area between adjacent chip units 510 is an inactive area, i.e., the area where the scribe line groove 520 is located. In this embodiment, since the measurement mark on the reticle has a small size, the corresponding imaging mark 530 can be disposed in the scribe line groove 520 of the substrate 500, so that the motion stage positioning error compensation apparatus provided in any embodiment of the present invention is suitable for both off-line integrated calibration and on-line periodic calibration.
It should be noted that in order to compensate for the high-order positioning errors on the entire substrate 500, the imaging marks 530 are generally distributed over the entire substrate 500, and in the case where the imaging marks 530 are disposed in the scribe line grooves 520 of the substrate 500, the imaging marks 530 are distributed over the entire scribe line grooves 520 in the substrate 500.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims (15)

1. A reticle, comprising a measurement mark;
the measurement mark comprises at least one measurement unit, the measurement unit comprises two mark groups, the mark groups comprise an X-direction mark and a Y-direction mark, the X-direction mark comprises at least one X-direction grating and an X-direction positioning mark, and the Y-direction mark comprises at least one Y-direction grating and a Y-direction positioning mark;
the two mark groups comprise a first mark group and a second mark group, the center of the first mark group is a first center, the center of the second mark group is a second center, and after the measuring mark rotates clockwise or anticlockwise by 90 degrees, the first center is coincided with the second center before the measuring mark does not rotate.
2. The reticle as claimed in claim 1 wherein a plurality of the X-directional gratings in the X-directional mark are arranged in a Y direction when the number of the at least one X-directional grating is greater than 1 and the number of the at least one Y-directional grating is greater than 1; a plurality of the Y-directional gratings in the Y-directional mark are arranged along the X direction.
3. The reticle of claim 2, wherein a plurality of the X-directional gratings in the X-directional marks have different slit widths and a plurality of the Y-directional gratings in the Y-directional marks have different slit widths.
4. The reticle of claim 3, wherein the X-direction mark comprises two X-direction gratings; the Y-direction mark comprises two Y-direction gratings.
5. The reticle as claimed in claim 4 wherein the X-direction positioning mark is located between two X-direction gratings in the same X-direction mark; in the same Y-direction mark, the Y-direction positioning mark is positioned between the two Y-direction positioning marks.
6. The reticle as claimed in claim 1 wherein the X-direction positioning marks and the Y-direction positioning marks may be cross-shaped.
7. A motion stage positioning error compensation apparatus, comprising:
the mask plate is provided with a measuring mark for measuring the positioning error of the moving table;
the mask table is used for bearing the mask plate;
the workpiece table is used for bearing the substrate after the glue coating;
a projection objective for imaging the measurement marks on the reticle onto the substrate;
an alignment device for measuring an imaged mark on the substrate after development of the measurement mark;
the measurement marks comprise two mark groups, each mark group comprises an X-direction mark and a Y-direction mark, the X-direction marks comprise at least one X-direction grating and at least one X-direction positioning mark, and the Y-direction marks comprise at least one Y-direction grating and at least one Y-direction positioning mark;
the two mark groups comprise a first mark group and a second mark group, the center of the first mark group is a first center, the center of the second mark group is a second center, and after the measuring mark rotates clockwise or anticlockwise by 90 degrees, the first center is coincided with the second center before the measuring mark does not rotate.
8. The motion stage positioning error compensation apparatus of claim 7, further comprising a mask stage position measurement system coupled to the mask stage and a workpiece stage position measurement system coupled to the workpiece stage.
9. The motion stage positioning error compensation apparatus of claim 8, wherein the mask stage position measurement system and the workpiece stage position measurement system employ an interferometer, a grating scale, or a planar grating scale.
10. The motion stage positioning error compensation device of claim 1, wherein the alignment device employs a CCD or a grating scale.
11. A method for compensating for positioning error of a motion stage, comprising:
s1, imaging measurement marks on the mask on a substrate, wherein the measurement marks comprise at least one measurement unit, the measurement unit comprises two mark groups, the mark groups comprise X-direction marks and Y-direction marks, the X-direction marks comprise at least one X-direction grating and at least one X-direction positioning mark, and the Y-direction marks comprise at least one Y-direction grating and at least one Y-direction positioning mark;
the two mark groups comprise a first mark group and a second mark group, the center of the first mark group is a first center, the center of the second mark group is a second center, and after the measuring mark is rotated by 90 degrees clockwise or anticlockwise, the first center is coincided with the second center before the measuring mark is not rotated;
s2, acquiring expected positions and actual positions of the imaging markers of the first marker set on the substrate;
s3, moving the substrate such that the imaged marks of the measurement marks after the moving are rotated 90 ° clockwise or counterclockwise relative to the imaged marks before the moving, acquiring the desired and actual positions of the imaged marks of the second set of marks on the substrate after the moving;
s4, calculating the high-order positioning errors of the workpiece stage and the mask stage according to the position information obtained in S2 and S3, and performing data processing to obtain a positioning error compensation table;
and S5, respectively compensating the workpiece stage position measuring system and the mask stage position measuring system by using the obtained positioning error compensation table.
12. The method of compensating for motion stage positioning error of claim 11,
determining an expected position of an imaging mark corresponding to the X-direction mark or the Y-direction mark according to the position of each positioning mark in the measuring mark and the preset position of the imaging mark of the measuring mark on the substrate;
measuring imaging marks of gratings in each X-direction mark or each Y-direction mark by using the alignment device, and determining the actual positions of the imaging marks corresponding to the X-direction marks or the Y-direction marks;
determining a desired position and an actual position of the first marker set according to the desired position and the actual position of the imaging marker of the X-marker or the Y-marker in the first marker set;
and determining the expected position and the actual position of the second mark group according to the expected position and the actual position of the imaging mark of the X-direction mark or the Y-direction mark in the second mark group.
13. The method of claim 11, wherein calculating the high order positioning errors of the workpiece stage and the mask stage according to the position information obtained in S2 and S3 comprises:
calculating to obtain a loading deviation, and an overall positioning error, a first-order positioning coefficient and a second-order positioning coefficient of the workpiece stage and the mask stage according to the position information obtained in S2 and S3;
obtaining a first-order positioning error and a second-order positioning error of the workpiece stage and the mask stage according to the first-order positioning coefficient and the second-order positioning coefficient;
removing the first order positioning error and the second order positioning error in the overall positioning error of the mask stage to obtain a high order positioning error of the mask stage; and removing the first-order positioning error, the second-order positioning error and the chip loading deviation in the overall positioning error of the workpiece table to obtain a high-order positioning error of the workpiece table.
14. The motion stage positioning error compensation method of claim 13, wherein the overlay error and the first order and second order positioning coefficients of the workpiece stage and the mask stage are obtained by a least squares calculation.
15. The method of claim 11, wherein the imaged mark of the measurement mark is located in a scribe line groove of the substrate.
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