CN111624464A

CN111624464A - Chip testing device and chip testing method

Info

Publication number: CN111624464A
Application number: CN202010418407.1A
Authority: CN
Inventors: 孙文檠
Original assignee: Ma'anshan Xinhai Technology Co ltd
Current assignee: Ma'anshan Xinhai Technology Co ltd
Priority date: 2020-05-18
Filing date: 2020-05-18
Publication date: 2020-09-04

Abstract

The invention discloses a chip testing device and a chip testing method, which comprise a testing equipment main body, a workbench and a testing frame, wherein a lifting plate is arranged at the upper end of the testing frame and is connected with the testing frame through a telescopic rod, a pressing plate is arranged below the lifting plate and is connected with the lifting plate through a connecting column, and a detection plate is arranged on the lower surface of the pressing plate. According to the chip testing device and the chip testing method, the situation that the fixed column is loosened when being combined with the fixed hole and the chip in the placing cavity is damaged by the pressing plate due to the fact that the limiting device is moved is avoided, the chip is practically prevented from being crushed by the pressing plate, the pulling rod is pulled to drive the connecting block to move, the chip is fixed under the action of the second expansion spring, the chips are prevented from deviating during detection, the air bag between the baffles is tightly pressed, the air bag is contacted with the contact gasket, buffering is further reduced, and the chip in the placing cavity or the fixed platform is prevented from being damaged.

Description

Chip testing device and chip testing method

Technical Field

The invention relates to the field of chip testing devices, in particular to a chip testing device and a chip testing method.

Background

Chip testing is a relatively big problem, and in the process of directly penetrating through the whole chip design and mass production, the single crystal growth is generally carried out according to the crystal orientation of 111, but due to various external factors, such as temperature, pulling speed and various randomness of quantum mechanics, dislocation can occur in the growth process, and the dislocation is called as a defect. The defect is also caused by ion implantation, and the irregular structure which cannot be corrected even if annealing occurs, and the problems existing in the semiconductor can cause the failure of the device, and further affect the whole chip, so that the chip needs to be tested to obtain a qualified chip product, and the chip needs to be tested by a chip testing device. But current testing arrangement has certain drawback, when at first installing the chip, all directly puts into the mounting groove with the chip, can not fix, and when the pick-up plate examined the chip in addition, it was bad with the chip pressure easily, caused the chip to be unable to use, and the speed was very fast when contacting between fly leaf and the fixed plate in addition, can produce the impact, influences the stability of equipment.

Disclosure of Invention

The invention mainly aims to provide a chip testing device and a chip testing method, which can effectively solve the problems in the background technology.

In order to achieve the purpose, the invention adopts the technical scheme that:

the utility model provides a chip testing device, includes test equipment main part, workstation and test jig, the upper end of test jig is provided with the lifter plate, the lifter plate is connected with the test jig through the telescopic link, the below of lifter plate is provided with the clamp plate, and the clamp plate is connected with the lifter plate through the spliced pole, the lower surface of clamp plate is provided with the pick-up plate, the lower extreme of test jig is provided with the fixed station, the centre of fixed station is provided with places the chamber, the inside of placing the chamber is provided with fixed knot and constructs, the fixed station is provided with stop device and buffer structure with the both sides that the face of contact of placing the chamber is located and places the chamber, and buffer structure is located between the stop device.

Preferably, the limiting device comprises a fixing column, a matching ball, a first fixing block, a matching block, a first fixing groove, a fixing hole, a rotating pin and a first telescopic spring, the fixing column and the matching ball are arranged on the pressing plate, the first fixing block is arranged inside the fixing table, the first fixing groove and the fixing hole are formed inside the first fixing block, the first telescopic spring is arranged at the bottom end of the first fixing groove, the rotating pin is arranged on the two sides, located on the first telescopic spring, of the first fixing groove, and the matching block is arranged on the rotating pin.

Preferably, the fixed orifices cooperatees with the fixed column, cooperation ball and cooperation piece looks block, the cooperation piece rotates round the rotating pin, first expanding spring contacts with the bottom of two cooperation pieces, and through the stop device who adds, can be through removing stop device for cooperation ball on the stop device combines together with the cooperation piece, avoids the fixed column to take place not hard up when combining with the fixed orifices, and carries on spacingly through fixed column and fixed orifices, avoids the clamp plate to place the chip in the chamber and crushes by pressure, and is more practical.

Preferably, the fixed knot constructs including pulling pole, second expanding spring, second fixed slot, connecting block, guide bar and compressing tightly the frame, the both sides that lie in placing the chamber on the fixed station are provided with the second fixed slot, the inside of second fixed slot is provided with the pulling pole, the inside that lies in the second fixed slot on the pulling pole is provided with second expanding spring, the bottom that the inside that lies in the pulling pole of second fixed slot is provided with the connecting block, be provided with between the connecting block and compress tightly the frame, the inside of second fixed slot is provided with the guide bar.

Preferably, the connecting block compresses the second expansion spring, the connecting block moves along the guide rod, the pressing frame is pressed tightly with the chip, the pulling rod is pulled to drive the connecting block to move, the pressing frame can be drawn out from the placing cavity at the moment, the chip is flatly placed in the placing cavity, the chip is fixed under the action of the second expansion spring, and the chip is prevented from deviating during detection.

Preferably, buffer structure includes contact pad, second fixed block, first removal post, second removal post, baffle, third fixed slot, oblique angle, gasbag and third expanding spring, the lower surface of clamp plate is provided with contact pad, the inside of fixed station is provided with the second fixed block, the third fixed slot has been seted up to the inside of second fixed block, the inside first removal post and the second removal post that is provided with in both sides of third fixed slot, first removal post and second removal post binding face are provided with the oblique angle, the one end that the second removed the post is provided with the baffle, the inside of second fixed block is located and is provided with the gasbag between the baffle, the below that is located the gasbag between the second removal post is provided with the third expanding spring.

Preferably, first removal post and second remove post mutually perpendicular, first removal post removes along vertical direction, second removal post and gasbag remove along the horizontal direction, the contact pad contacts with the gasbag, when the clamp plate descends, can contact with first removal post earlier, and then makes first removal post drive the second and remove post and promote the baffle, and the gasbag between the baffle is compressed tightly to the gasbag contacts and then reduces the buffering with the contact pad, avoids placing chip or the fixed station in the chamber and takes place to damage.

Preferably, the lifting plate moves along the direction of the telescopic rod, the detection plate at the bottom end of the pressing plate is aligned with the placing cavity on the fixing table, and the chip is arranged in the middle of the fixing structure in the placing cavity.

A testing method of a chip testing device comprises the following steps:

s1, preparing a chip and debugged equipment, placing the chip beside a testing device, and then debugging the testing device;

s2, placing the chip in the placing cavity, and pressing the chip tightly through the fixing structure to avoid the chip deviating;

s3, the chip is tested by the device, the lifting plate of the testing equipment is lowered to enable the detection plate to be in contact with the chip, and the chip can be in contact with the detection plate at the moment so as to be tested;

and S4, taking out the chip from the placing cavity after the test is finished, lifting the fixing structure to lift the pressing frame for pressing the chip, and taking out the chip.

Preferably, the S2 presses the chip into the pressing frame of the middle fixing structure, the chip is prevented from loosening by the second expansion spring, the limiting device and the buffer structure work simultaneously while the lifting plate descends in the S3, and the limiting device and the buffer structure are matched with the fixing table.

Compared with the prior art, the invention has the following beneficial effects: a chip testing device and a chip testing method are disclosed, wherein a matching ball on a limiting device can be combined with a matching block by moving the limiting device through the additionally arranged limiting device, so that looseness generated when a fixing column is combined with a fixing hole is avoided, and the chip in a placing cavity is prevented from being crushed by a pressing plate through the fixing column and the fixing hole for limiting, so that the chip testing device and the chip testing method are practical;

the fixing structure is arranged, the pulling rod is pulled to drive the connecting block to move, the pressing frame can be pulled out of the placing cavity at the moment, the chip is horizontally placed in the placing cavity, and the chip is fixed under the action of the second telescopic spring, so that the chip is prevented from deviating during detection;

through setting up buffer structure, when the clamp plate descends, can contact with first removal post earlier, and then make first removal post drive the second and remove post and promote the baffle, the gasbag between the baffle is compressed tightly to the gasbag contacts and then reduces the buffering with contact pad, avoids placing chip or the fixed station in the chamber and takes place to damage.

Drawings

FIG. 1 is a schematic diagram of an overall structure of a chip testing apparatus and a chip testing method according to the present invention;

FIG. 2 is a front view of a chip testing apparatus and a chip testing method according to the present invention;

fig. 3 is a schematic view of a fixing table of a chip testing apparatus and a chip testing method according to the present invention.

FIG. 4 is a schematic diagram of a limiting device of a chip testing device and a chip testing method according to the present invention;

FIG. 5 is a schematic diagram of a fixing structure of a chip testing apparatus and a chip testing method according to the present invention;

FIG. 6 is a schematic diagram of a buffering structure of a chip testing apparatus and a chip testing method according to the present invention;

in the figure: 1. a test device main body; 2. a work table; 3. a test jig; 4. a lifting plate; 5. pressing a plate; 6. a limiting device; 601. fixing a column; 602. matching the balls; 603. a first fixed block; 604. a matching block; 605. a first fixing groove; 606. a fixing hole; 607. a rotation pin; 608. a first extension spring; 7. a fixed table; 8. a fixed structure; 801. pulling a rod; 802. a second extension spring; 803. a second fixing groove; 804. connecting blocks; 805. a guide bar; 806. a pressing frame; 9. a buffer structure; 901. a contact pad; 902. a second fixed block; 903. a first moving column; 904. a second moving column; 905. a baffle plate; 906. a third fixing groove; 907. oblique angle; 908. an air bag; 909. a third extension spring; 10. detecting a plate; 11. connecting columns; 12. a telescopic rod; 13. a placement chamber.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-6, a chip testing device comprises a testing device main body 1, a workbench 2 and a testing jig 3, wherein a lifting plate 4 is arranged at the upper end of the testing jig 3, the lifting plate 4 is connected with the testing jig 3 through a telescopic rod 12, a pressing plate 5 is arranged below the lifting plate 4, the pressing plate 5 is connected with the lifting plate 4 through a connecting column 11, a detecting plate 10 is arranged on the lower surface of the pressing plate 5, a fixing table 7 is arranged at the lower end of the testing jig 3, a placing cavity 13 is arranged in the middle of the fixing table 7, a fixing structure 8 is arranged inside the placing cavity 13, a limiting device 6 and a buffer structure 9 are arranged on the two sides of the placing cavity 13, which are contact surfaces of the fixing table 7 and the placing cavity 13, and the buffer structure 9 is arranged between;

the limiting device 6 comprises a fixing column 601, a matching ball 602, a first fixing block 603, a matching block 604, a first fixing groove 605, a fixing hole 606, a rotating pin 607 and a first telescopic spring 608, the fixing column 601 and the matching ball 602 are arranged on the pressing plate 5, the first fixing block 603 is arranged inside the fixing table 7, the first fixing groove 605 and the fixing hole 606 are arranged inside the first fixing block 603, the first telescopic spring 608 is arranged at the bottom end inside the first fixing groove 605, the rotating pin 607 is arranged on two sides, located on the first telescopic spring 608, of the inside of the first fixing groove 605, and the matching block 604 is arranged on the rotating pin 607; the fixing hole 606 is matched with the fixing column 601, the matching ball 602 is clamped with the matching block 604, the matching block 604 rotates around the rotating pin 607, and the first expansion spring 608 is contacted with the bottom ends of the two matching blocks 604; the fixing structure 8 comprises a pulling rod 801, second telescopic springs 802, second fixing grooves 803, connecting blocks 804, a guide rod 805 and a pressing frame 806, the second fixing grooves 803 are formed in two sides of the placing cavity 13 on the fixing table 7, the pulling rod 801 is arranged inside the second fixing grooves 803, the second telescopic springs 802 are arranged inside the second fixing grooves 803 on the pulling rod 801, the connecting blocks 804 are arranged at the bottom ends of the pulling rod 801 inside the second fixing grooves 803, the pressing frame 806 is arranged between the connecting blocks 804, and the guide rod 805 is arranged inside the second fixing grooves 803; the connecting block 804 compresses the second expansion spring 802, the connecting block 804 moves along the guide rod 805, and the pressing frame 806 presses the chip; the buffer structure 9 comprises a contact pad 901, a second fixed block 902, a first moving column 903, a second moving column 904, a baffle 905, a third fixed groove 906, an oblique angle 907, an air bag 908 and a third telescopic spring 909, the lower surface of the pressure plate 5 is provided with the contact pad 901, the second fixed block 902 is arranged inside the fixed table 7, the third fixed groove 906 is arranged inside the second fixed block 902, the first moving column 903 and the second moving column 904 are arranged inside two sides of the third fixed groove 906, the oblique angle 907 is arranged on the joint surface of the first moving column 903 and the second moving column 904, one end of the second moving column 904 is provided with a baffle 905, the air bag 908 is arranged inside the second fixed block 902 between the baffles 905, and the third telescopic spring 909 is arranged below the air bag 908 between the second moving columns 904; the first moving column 903 and the second moving column 904 are perpendicular to each other, the first moving column 903 moves in the vertical direction, the second moving column 904 and the airbag 908 move in the horizontal direction, and the contact pad 901 is in contact with the airbag 908; the lifting plate 4 moves along the direction of the telescopic rod 12, the detection plate 10 at the bottom end of the pressing plate 5 is aligned with the placing cavity 13 on the fixed table 7, and a chip is installed in the middle of the fixed structure 8 in the placing cavity 13.

A testing method of a chip testing device comprises the following steps:

s2, placing the chip in the placing cavity 13, and pressing the chip tightly through the fixing structure 8 to avoid the chip deviating;

s3, the chip is tested by the device, the lifting plate 4 of the testing equipment is lowered, so that the detection plate 10 is in contact with the chip, and the chip can be in contact with the detection plate 10 at the moment so as to be tested;

s4, after the test is finished, taking the chip out of the placing cavity 13, lifting the fixing structure 8 to lift the pressing frame 806 for pressing the chip, and further taking the chip out;

s2 presses the chip in the pressing frame 806 of the middle fixing structure 8, and the chip is prevented from loosening by the second expansion spring 802, the stopper 6 and the buffer structure 9 work simultaneously while the lifting plate 4 descends in S3, and the stopper 6 and the buffer structure 9 are engaged with the fixing table 7.

Before detection, a produced chip is placed on a workbench 2 of a testing equipment main body 1, then a power supply of the equipment is plugged, relevant detection parameters can be adjusted through control keys and a display screen on a control panel, then the equipment can work, firstly, a fixed structure 8 in a placing cavity 13 is pulled, specifically, a pulling rod 801 is pulled to lift a connecting block 804 upwards, then the connecting block 804 moves along a guide rod 805, when a pressing frame 806 is exposed from the placing cavity 13, the chip can be placed into the pressing frame 806, then the pulling rod 801 is slowly put back, the chip is pressed through the pressing frame 806, the chip is pressed under the action of a second telescopic spring 802, the situation that the chip moves is avoided, then a function key and the display screen on the control panel are used for controlling the telescopic rod 12 to extend, so that the lifting plate 4 drives the pressing plate 5 to move downwards until the pressing plate 5 of the test rack 3 is moved to the fixed station 7, at this time, the speed is fast when moving, and impact is generated on the fixed station 7, at this time, the impact can be reduced through the buffer structure 9, specifically, when the pressing plate 5 is firstly contacted with the first moving column 903, because the first moving column 903 and the second moving column 904 in the third fixed slot 906 are both provided with the mutually matched oblique angles 907, at this time, the first moving column 903 can push the second moving column 904 to move along the horizontal direction, so that the air bag 908 between the baffles 905 is compressed, and at this time, the air bag 908 is expanded and then contacted with the contact gasket 901, so that the impact of the pressing plate 5 on the fixed station 7 is reduced, at this time, the fixed column 601 and the matching ball 602 on the pressing plate 5 enter the fixed hole 606, and when the matching ball 602 enters the first fixed slot 605, the matching block 604 can be contacted, at this time, the matching block 604 rotates around the rotating pin 607, so that the matching block 604 contacts with the matching ball 602, at this time, the pressing plate 5 reaches a limited position, looseness caused when the fixing column 601 is combined with the fixing hole 606 is avoided, further, the pressing plate 5 is prevented from crushing the chip in the placing cavity 13, at this time, the detecting plate 10 in the middle of the pressing plate 5 contacts with the chip in the placing cavity 13, and related data detection can be performed on the chip, so that the chip is stored on the device, after the detection is completed, the pressing plate 5 can be lifted upwards by retracting the telescopic rod 12, then the detecting plate 10 is separated from the chip in the placing cavity 13, and meanwhile, the limiting device 6 is separated from the buffer structure 9, specifically, when the limiting device 6 moves upwards, the matching block 604 is driven to rotate around the rotating pin 607, and the matching block 604 can be unfolded under the action of the first telescopic spring 608, so that the matching ball 602 falls off from the matching block, meanwhile, when the contact gasket 901 is separated from the air bag 908, the pressure of the air bag 908 is reduced to enable the volume of the air bag 908 to contract, the second movable column 904 is pushed towards two sides under the action of a third expansion spring 909, the second fixed block 902 is moved upwards to enable the buffer structure 9 to restore to the original position, relevant data are read from the control panel to determine whether the chip is intact, the connecting block 804 can be lifted upwards by pulling the pulling rod 801 at the moment, when the pressing frame 806 is exposed out of the placing cavity 13, the chip can be taken out, then the next chip is detected, after the detection is completed, the power supply of the equipment is turned off, and the power supply plug is pulled out.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A chip testing device comprises a testing equipment main body (1), a workbench (2) and a testing frame (3), wherein a lifting plate (4) is arranged at the upper end of the testing frame (3), the lifting plate (4) is connected with the testing frame (3) through a telescopic rod (12), a pressing plate (5) is arranged below the lifting plate (4), the pressing plate (5) is connected with the lifting plate (4) through a connecting column (11), a detection plate (10) is arranged on the lower surface of the pressing plate (5), a fixed table (7) is arranged at the lower end of the testing frame (3), a placing cavity (13) is arranged in the middle of the fixed table (7), a fixed structure (8) is arranged inside the placing cavity (13), a limiting device (6) and a buffer structure (9) are arranged on the two sides of the placing cavity (13) of the contact surfaces of the fixed table (7) and the placing cavity (13), and the buffer structure (9) is positioned between the limiting devices (6).

2. The chip testing device according to claim 1, wherein: the limiting device (6) comprises a fixing column (601), a matching ball (602), a first fixing block (603), a matching block (604), a first fixing groove (605), a fixing hole (606), a rotating pin (607) and a first telescopic spring (608), wherein the fixing column (601) and the matching ball (602) are arranged on the pressing plate (5), the first fixing block (603) is arranged inside the fixing table (7), the first fixing groove (605) and the fixing hole (606) are arranged inside the first fixing block (603), the first telescopic spring (608) is arranged at the bottom end of the first fixing groove (605), the rotating pin (607) is arranged on two sides, located on the first telescopic spring (608), of the first fixing groove (605), and the matching block (604) is arranged on the rotating pin (607).

3. The chip testing device according to claim 2, wherein: the fixing hole (606) is matched with the fixing column (601), the matching ball (602) is clamped with the matching block (604), the matching block (604) rotates around the rotating pin (607), and the first telescopic spring (608) is in contact with the bottom ends of the two matching blocks (604).

4. The chip testing device according to claim 1, wherein: fixed knot constructs (8) including pulling pole (801), second expanding spring (802), second fixed slot (803), connecting block (804), guide bar (805) and compress tightly frame (806), it is provided with second fixed slot (803) to lie in the both sides of placing chamber (13) on fixed station (7), the inside of second fixed slot (803) is provided with pulls pole (801), the inside that lies in second fixed slot (803) on pulling pole (801) is provided with second expanding spring (802), the inside that lies in pulling pole (801) of second fixed slot (803) is provided with connecting block (804), be provided with between connecting block (804) and compress tightly frame (806), the inside of second fixed slot (803) is provided with guide bar (805).

5. The chip testing device according to claim 4, wherein: the connecting block (804) compresses the second expansion spring (802), the connecting block (804) moves along the guide rod (805), and the pressing frame (806) is pressed with the chip.

6. The chip testing device according to claim 1, wherein: the buffer structure (9) comprises a contact gasket (901), a second fixed block (902), a first movable column (903), a second movable column (904), a baffle (905), a third fixed groove (906), an oblique angle (907), an air bag (908) and a third telescopic spring (909), the contact gasket (901) is arranged on the lower surface of the pressing plate (5), the second fixed block (902) is arranged inside the fixed table (7), the third fixed groove (906) is arranged inside the second fixed block (902), a first movable column (903) and a second movable column (904) are arranged inside two sides of the third fixed groove (906), the oblique angle (904) is arranged on the joint surface of the first movable column (903) and the second movable column (904), the baffle (905) is arranged at one end of the second movable column (904), and the air bag (908) is arranged between the baffles (905) inside the second fixed block (902), and a third expansion spring (909) is arranged between the second moving columns (904) and below the air bag (908).

7. The chip testing device according to claim 6, wherein: the first moving column (903) and the second moving column (904) are perpendicular to each other, the first moving column (903) moves in the vertical direction, the second moving column (904) and the air bag (908) move in the horizontal direction, and the contact pad (901) is in contact with the air bag (908).

8. The chip testing device according to claim 1, wherein: the lifting plate (4) moves along the direction of the telescopic rod (12), the detection plate (10) at the bottom end of the pressing plate (5) is aligned with the placing cavity (13) on the fixing table (7), and a chip is arranged in the middle of the fixing structure (8) in the placing cavity (13).

9. A testing method of a chip testing device is characterized in that: the method comprises the following steps:

s2, placing the chip in the placing cavity (13), and pressing the chip tightly through the fixing structure (8) to avoid the chip from deviating;

s3, the chip is tested through the device, the lifting plate (4) of the testing equipment is lowered, the detection plate (10) is made to be in contact with the chip, and the chip can be in contact with the detection plate (10) at the moment so as to be tested;

and S4, after the test is finished, taking the chip out of the placing cavity (13), lifting the fixing structure (8) to lift the pressing frame (806) pressing the chip, and further taking the chip out.

10. The method of claim 9, wherein the testing device comprises: the S2 enables the chip to be pressed in a pressing frame (806) of the middle fixing structure (8), the chip is prevented from loosening through a second expansion spring (802), the limiting device (6) and the buffer structure (9) work simultaneously when the lifting plate (4) descends in the S3, and the limiting device (6) and the buffer structure (9) are matched with the fixing table (7).