CN111618540B - Preparation method of welded metal column for column grid array - Google Patents
Preparation method of welded metal column for column grid array Download PDFInfo
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- CN111618540B CN111618540B CN202010542476.3A CN202010542476A CN111618540B CN 111618540 B CN111618540 B CN 111618540B CN 202010542476 A CN202010542476 A CN 202010542476A CN 111618540 B CN111618540 B CN 111618540B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
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Abstract
The invention provides a preparation method of a welding metal column for a column grid array, which comprises the following steps: selecting a plurality of straightened metal wires; loading a plurality of said wires into a curing mold such that a plurality of said wires are juxtaposed; adding curing liquid into the curing mould, wherein the curing liquid and the metal wire form a hard columnar body after being cured; transversely cutting the cylindrical body to obtain a plurality of sheets with the thickness larger than the length of the required finished metal column; polishing two end faces of the sheet until the difference between the thickness of the sheet and the length of the required finished metal column is within a normal tolerance range; placing the polished slice into a mould and melting the solidified liquid to separate the metal column; and electroplating brazing filler metal on the surface of the metal column after surface treatment to obtain a finished product. The invention can manufacture the welded metal column with higher efficiency, and the manufactured welded metal column has higher regularity.
Description
Technical Field
The invention relates to the technical field of welding, in particular to a preparation method of a welding metal column for a column grid array.
Background
The CCGA is the development and improvement of CBGA, and the ball grid is replaced by the column grid, so that the problem of thermal fatigue caused by mismatching of thermal expansion coefficients between an alumina ceramic chip carrier and an epoxy resin glass cloth printed circuit board is greatly relieved, and the assembly reliability of the CCGA is improved. The CCGA can realize a plurality of logic and microprocessor functions, the packaging form of the CCGA determines the characteristics of high temperature resistance, high pressure resistance and high reliability of the CCGA, and the CCGA is suitable for the conditions of larger size and more I/O, so the CCGA plays an important role in the manufacturing fields of military, aviation and aerospace electronic products. The pillar grid requires the use of a large number of solder metal pillars, including electrically connected metal pillars of non-solder material inside and solder on the metal surface. The forming of the electrically connected metal cylindrical body made of the non-welding material is a core step for preparing the welded metal column, the regularity of the electrically connected metal cylindrical body affects the regularity of a column grid, and the conventional metal cylindrical body adopts a one-by-one manufacturing method to ensure the regularity and has very low efficiency.
Disclosure of Invention
In view of the above, there is a need for a method for manufacturing a solder metal pillar for a pillar grid array, which can manufacture the solder metal pillar more efficiently and with higher regularity.
The invention provides a preparation method of a welding metal column for a column grid array, which comprises the following steps:
selecting a plurality of straightened metal wires;
loading a plurality of said wires into a curing mold such that a plurality of said wires are juxtaposed;
adding curing liquid into the curing mould, wherein the curing liquid and the metal wire form a hard columnar body after being cured;
transversely cutting the cylindrical body to obtain a plurality of sheets with the thickness larger than the length of the required finished metal column;
polishing two end faces of the sheet until the difference between the thickness of the sheet and the length of the required finished metal column is within a normal tolerance range;
placing the polished slice into a mould and melting the solidified liquid to separate the metal column;
and electroplating brazing filler metal on the surface of the metal column after surface treatment to obtain a finished product.
Further, the step of adding a curing liquid into the curing mold, wherein the curing liquid and the metal wire form a rigid columnar body after curing includes:
and adding low-melting-point metal liquid into the curing mould, and combining the cooled solid metal of the low-melting-point metal liquid and the metal wire to form a hard columnar body.
Further, the curing mold is firstly placed in an environment with a first cooling temperature for cooling, and then the curing mold is placed in an environment with a second cooling temperature for continuing cooling, wherein the second cooling temperature is lower than the first cooling temperature, and the first cooling temperature is lower than the metal melting point.
Further, the "adding a low-melting-point metal liquid into the solidification mold, and combining the cooled solid metal of the low-melting-point metal liquid and the metal wire to form a hard columnar body" includes:
placing a solid low melting point metal in the curing mold;
putting the curing mold into an environment atmosphere with the temperature higher than the melting point of the metal, so that molten metal obtained by melting solid metal permeates into gaps among the metal wires;
the molten metal cools to re-form solid metal and combines with the wire to form a rigid column.
Further, the ambient atmosphere is a liquid.
Further, the "placing the polished wafer into a mold and melting the solidified liquid" includes:
putting the polished slice into a mold with a leak hole;
placing the mold into a liquid having a temperature above the melting point of the metal;
the solid metal combined with the wire melts and flows out of the die.
Further, the environmental atmosphere is water.
Further, the melting point of the metal is 60-95 ℃.
Further, the curing liquid is a high-molecular curing agent.
Further, a dissolving agent is added into the mould to dissolve the solidified liquid after solidification.
Compared with the prior art, the method has the advantages that the hard columnar body is formed by the solidification of the solidification liquid and the plurality of metal wires, then the columnar body is transversely cut by the cutting device to obtain the sheet, the two ends of the sheet are polished, the solidified solidification liquid is melted to separate the metal posts, the metal posts with the same number as the metal wires are obtained at one time, the lengths of the metal posts are basically the same, the welding metal posts are manufactured more efficiently, and the regularity of the manufactured welding metal posts is higher.
Drawings
FIG. 1 is a flow chart of an embodiment of the present invention.
Fig. 2 is a schematic structural view of a columnar body.
Fig. 3 is a schematic view of the structure of the sheet.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without any inventive step, are within the scope of the present invention.
The invention provides a preparation method of a welding metal column for a column grid array, which comprises the following steps as shown in figure 1.
S110: and selecting a plurality of straightened metal wires.
The metal wire is made of a non-welding material and can be electrically conducted, and for example, a copper wire or an alloy wire can be selected. The coiled metal wire can be straightened by a straightening machine or manually, the manual straightening efficiency is lower, and the straightening machine is preferably adopted for straightening.
The length and diameter of the wire are preferably the same, which ensures that the welded metal studs produced at one time are of substantially the same diameter and facilitate subsequent cutting into thin sheets.
S120: loading a plurality of said wires into a curing mold such that a plurality of said wires are juxtaposed.
10000 metal wires of 1000-.
S130: and adding a curing liquid into the curing mould, wherein the curing liquid and the metal wire form a hard columnar body after being cured.
The curing liquid penetrates into the spaces between the wires and cures over time, and the columnar structure can be as shown in fig. 2. It should be understood that the term curing does not merely represent a specific term in a polymeric material (i.e., the process of converting from a low molecule to a high molecule), and is herein understood to mean a transition from a fluid state (or liquid state) to a non-fluid state (or solid state).
In a first embodiment, a low-melting-point metal liquid is added to the solidification mold, and the cooled solid metal of the low-melting-point metal liquid is combined with the metal wire to form a hard columnar body.
In combination with the technical solution provided by the present invention, as is well known to those skilled in the art, the low melting point metal is a metal having a very low melting point compared to the metal wire, and the difference is preferably 300 ℃ or more, more preferably 500 ℃ or more, and more preferably 1000 ℃ or more. In the present embodiment, the melting point of the metal is preferably 60 to 95 ℃, for example 60 ℃, 65 ℃, 70 ℃, 75 ℃, 80 ℃, 85 ℃, 90 ℃ or 95 ℃.
In the first embodiment, the method more specifically comprises the following steps:
placing a solid low melting point metal in the curing mold.
And putting the curing mould into an environment atmosphere with the temperature higher than the melting point of the metal, so that molten metal obtained by melting the solid metal permeates into gaps among the metal wires.
The molten metal cools to re-form solid metal and combines with the wire to form a rigid column.
Putting solid metal into the curing mold, then putting the curing mold into a constant-temperature environment atmosphere for heating, conducting external heat into the curing mold through the curing mold, enabling the environment in the curing mold to be in a constant-temperature state, melting the solid metal to form molten metal, continuously keeping the metal in a liquid state and continuously penetrating into gaps among the metal wires in the constant-temperature environment, taking out the environment atmosphere in the curing mold after a certain time, cooling, and obtaining a hard columnar body by the metal wires after cooling.
The melting point of the metal is preferably 60-95 ℃, the environmental atmosphere is preferably liquid, and more preferably, the environmental atmosphere is water, and is water with a temperature higher than the melting point of the metal, such as constant-temperature water (e.g., constant-temperature water at 100 ℃).
In order to make the solidified column harder, the solidification mold is firstly placed in an environment with a first cooling temperature for cooling, and then the solidification mold is placed in an environment with a second cooling temperature for continuing cooling, wherein the second cooling temperature is lower than the first cooling temperature, and the first cooling temperature is lower than the melting point of the metal. Cooling in a higher temperature environment, wherein in the process of initial slow solidification of the molten metal, the molten metal is shrunk, part of the incompletely solidified molten metal is continuously filled in gaps generated by shrinkage, so that the gaps among the metal wires can be completely filled to improve the bonding strength of the metal and the metal wires, and then cooling in a lower temperature environment to completely solidify the molten metal to obtain a hard columnar body.
In a second embodiment, a polymeric curing agent is added to the curing mold, and the polymeric curing agent penetrates into the gaps between the metal wires and is cured to form rigid columns in combination with the metal wires.
The polymer curing agent comprises resin glue and a curing agent or can be rosin or paraffin, and the resin glue and the curing agent can be obtained after being uniformly stirred.
The inventor finds, through repeated experiments, that the mode of the first embodiment is generally better than the second embodiment for the specific reason that: the solidification speed of the low-melting-point metal liquid into the solid metal is relatively slow, the fluidity is strong, the permeability is good, the solidification speed of the high-molecular curing agent is relatively fast, the viscosity of the high-molecular curing agent is large, the fluidity is poor, and the permeability is relatively weak, but because the metal wire adopted by the invention is applied to a column grid array, the diameter of the metal wire is small and is only 0.2mm-0.4mm, the gaps among the metal wires are very small, the gaps among the metal wires can not be filled up easily due to the high-molecular curing agent, and the solidification time of the high-molecular curing agent is relatively short, the filling effect is generally inferior to that of the low-melting-point metal liquid, the columnar body obtained by adopting the high-molecular curing agent has a plurality of empty holes, the hardness is smaller than that of the columnar body obtained by adopting the low-melting-point metal liquid, in addition, the binding force between the metal and the metal is generally higher than the binding force between the metal and the high-molecular material, therefore, the hardness of the columnar body formed by bonding the solidified low-melting-point molten metal to the wire is higher than the hardness of the columnar body formed by bonding the solidified low-melting-point molten metal to the wire.
S140: and transversely cutting the cylindrical body to obtain a plurality of sheets with the thickness larger than the length of the required finished metal column.
The cylinder may be cut into sheets by a cutting device, and the sheet structure may be as shown in fig. 3. It should be noted that, at present, a single metal wire is made by cutting, and the diameter of the single metal wire is only 0.2mm-0.4mm, when a short metal column is cut (the length of the metal column is generally 2-2.5mm), the metal column is easy to bend at the cutting position, so that a metal column initial material with a length longer than that of a normal specification needs to be cut, and then the bent part of the end part of the metal column initial material is ground to obtain a finished metal column, which undoubtedly wastes materials, causes resource waste, and has high cost.
In the invention, the columnar body comprises a plurality of metal wires which are combined together, the metal wires are solidified and combined through the curing liquid to form the columnar body with a larger diameter, and the columnar body is not easy to bend in the process of transversely cutting the columnar body, namely, each metal column forming the sheet is not easy to bend, so that the thickness of the cut sheet can be closer to the length of a finished metal column with a normal specification, thereby reducing the subsequent polishing thickness.
S150: and polishing the two end faces of the sheet until the difference between the thickness of the sheet and the length of the required finished metal column is within a normal tolerance range.
S160: and placing the polished sheet into a mould and melting the solidified liquid to separate the metal column.
Also, it should be understood that the term ablation, including dissolving, melting, etc., means that the solidified material can be separated from the metal pillar, thereby allowing the metal pillar to come off. The obtained metal columns have consistent length, smooth end surfaces and high regularity, and welded metal columns prepared by subsequently electroplating the brazing filler metal have basically consistent appearance.
With reference to the first embodiment of step S130, this step may specifically include:
and putting the polished thin slice into a die with a leak hole.
And putting the mould into a liquid with the temperature higher than the melting point of the metal.
The solid metal combined with the wire melts and flows out of the die.
In a liquid environment at a certain temperature, the solid metal will be melted again, and then flow out of the mold to separate the metal column.
With reference to the second embodiment of step S130, this step may specifically include adding a dissolving agent into the mold to dissolve the solidified liquid after solidification, so as to separate the metal pillar.
S170: and electroplating brazing filler metal on the surface of the metal column after surface treatment to obtain a finished product.
The surface treatment can be carried out by carrying out surface micro-etching, then carrying out polishing treatment, and then electroplating a nickel layer with the thickness of 1-5 microns.
The electroplated solder can comprise tin, lead, silver, copper alloy or gold, specifically comprises tin 100, tin 99.3 copper 0.7, tin 96.5 silver 3 copper 0.5, tin 63 lead 37, tin 60 lead 40, tin 20 lead 80, tin 10 lead 90 and gold 100, wherein the thickness is 0.08-0.16 micrometer if the plating layer is gold, and the thickness is 0.08-10 micrometer if the plating layer is tin-based alloy.
And finally, placing the electroplated finished product into 120-180 PPM PVP solution to be soaked for 5-10 minutes, taking out and draining for 5-10 minutes, then baking for 10-30 minutes at 120 ℃, bottling, and filling inert gas for storage.
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and the above embodiments are only used for explaining the claims. The scope of the invention is not limited by the description. Any changes or substitutions that can be easily made by those skilled in the art within the technical scope of the present disclosure are included in the scope of the present invention.
Claims (5)
1. A method of making a solder metal stud for a stud grid array, the method comprising the steps of:
selecting a plurality of straightened metal wires;
loading a plurality of said wires into a curing mold such that a plurality of said wires are juxtaposed;
adding low-melting-point metal liquid into the curing mould, and combining the cooled solid metal of the low-melting-point metal liquid with the metal wire to form a hard columnar body;
transversely cutting the cylindrical body to obtain a plurality of sheets with the thickness larger than the length of the required finished metal column;
polishing two end faces of the sheet until the difference between the thickness of the sheet and the length of the required finished metal column is within a normal tolerance range;
placing the polished slice into a mold, and melting the solidified low-melting-point metal liquid in an environmental atmosphere to separate the metal column; wherein the environmental atmosphere is water;
and electroplating brazing filler metal on the surface of the metal column after surface treatment to obtain a finished product.
2. The method of claim 1, wherein the solidifying mold is placed in an environment of a first cooling temperature to cool, and then placed in an environment of a second cooling temperature to continue cooling, wherein the second cooling temperature is lower than the first cooling temperature, and wherein the first cooling temperature is lower than the melting point of the solid metal.
3. The method as claimed in claim 1, wherein the step of adding a low melting point metal liquid into the solidification mold, and the cooled solid metal of the low melting point metal liquid is combined with the metal wire to form a hard cylinder includes:
placing a solid low melting point metal in the curing mold;
putting the curing mold into an environment atmosphere with the temperature higher than the melting point of the solid metal, so that low-melting-point metal liquid obtained by melting the solid metal permeates into gaps among the metal wires;
the low melting point metal liquid is cooled to form solid metal again and is combined with the metal wire to form a hard columnar body.
4. The method for preparing a solder metal post for a post-grid array as claimed in claim 1, wherein said "placing said ground sheet in a mold and melting said solidified liquid after solidification" comprises:
putting the polished slice into a mold with a leak hole;
placing the mold into a liquid having a temperature above the melting point of the solid metal;
the solid metal combined with the wire melts and flows out of the die.
5. The method of claim 1, wherein the metal has a melting point of 60-95 ℃.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010542476.3A CN111618540B (en) | 2020-06-15 | 2020-06-15 | Preparation method of welded metal column for column grid array |
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| CN202010542476.3A CN111618540B (en) | 2020-06-15 | 2020-06-15 | Preparation method of welded metal column for column grid array |
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| CN111618540B true CN111618540B (en) | 2022-03-04 |
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| CN113421830B (en) * | 2021-06-15 | 2023-06-23 | 珠海天成先进半导体科技有限公司 | CCGA device welding column nondestructive grinding method and device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60150917A (en) * | 1984-01-17 | 1985-08-08 | Mitsubishi Heavy Ind Ltd | Preparation of pins |
| CN102350600A (en) * | 2011-09-30 | 2012-02-15 | 中国电子科技集团公司第十三研究所 | Method for manufacturing array case welding flux post of ceramic welding post |
| CN103908740A (en) * | 2014-03-05 | 2014-07-09 | 中山大学 | Metal microneedle array manufacturing method |
| CN105297086A (en) * | 2015-10-22 | 2016-02-03 | 重庆群崴电子材料有限公司 | Preparation method for tin-plated copper columns used for copper column grid array |
| CN109103095A (en) * | 2018-08-03 | 2018-12-28 | 清华大学 | A kind of diode and preparation method thereof |
-
2020
- 2020-06-15 CN CN202010542476.3A patent/CN111618540B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60150917A (en) * | 1984-01-17 | 1985-08-08 | Mitsubishi Heavy Ind Ltd | Preparation of pins |
| CN102350600A (en) * | 2011-09-30 | 2012-02-15 | 中国电子科技集团公司第十三研究所 | Method for manufacturing array case welding flux post of ceramic welding post |
| CN103908740A (en) * | 2014-03-05 | 2014-07-09 | 中山大学 | Metal microneedle array manufacturing method |
| CN105297086A (en) * | 2015-10-22 | 2016-02-03 | 重庆群崴电子材料有限公司 | Preparation method for tin-plated copper columns used for copper column grid array |
| CN109103095A (en) * | 2018-08-03 | 2018-12-28 | 清华大学 | A kind of diode and preparation method thereof |
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