CN111599728A - Wafer carrying platform and semiconductor manufacturing equipment - Google Patents
Wafer carrying platform and semiconductor manufacturing equipment Download PDFInfo
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- CN111599728A CN111599728A CN202010486213.5A CN202010486213A CN111599728A CN 111599728 A CN111599728 A CN 111599728A CN 202010486213 A CN202010486213 A CN 202010486213A CN 111599728 A CN111599728 A CN 111599728A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 238000001514 detection method Methods 0.000 claims abstract description 51
- 239000013307 optical fiber Substances 0.000 claims description 66
- 230000003287 optical effect Effects 0.000 claims description 15
- 241000251468 Actinopterygii Species 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 12
- 238000001179 sorption measurement Methods 0.000 description 12
- 238000010521 absorption reaction Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application discloses wafer microscope carrier and semiconductor manufacturing equipment, the wafer microscope carrier is provided with the plummer, still includes at least one detection sensor, detection sensor is used for detecting at least whether the wafer has been placed on the plummer, and the reliable operation of detection sensor can accurately detect whether the wafer has been placed on the plummer to guarantee semiconductor manufacturing equipment's operational reliability, avoided because of the risk of the wafer fish tail that the false retrieval leads to and fracturing.
Description
Technical Field
The invention relates to the field of semiconductor manufacturing, in particular to a wafer carrying platform and semiconductor manufacturing equipment.
Background
In the semiconductor manufacturing industry, a large number of devices are provided with a wafer placing carrying platform, the wafer placing carrying platform needs to have a vacuum adsorption function, the conventional wafer placing carrying platform generally adopts a vacuum gauge arranged on a vacuum adsorption pipeline, whether a wafer is placed on the carrying platform or not is judged according to the numerical value of the vacuum gauge, and when the vacuum value reaches a set value, the device judges that the wafer is arranged on the carrying platform; when the vacuum value is lower than a set value, the equipment can judge that no wafer is on the carrying platform, and the arm can repeatedly place the wafer on the wafer placing carrying platform, so that the wafer is damaged.
Disclosure of Invention
In view of the above-mentioned drawbacks and deficiencies of the prior art, it is desirable to provide a wafer stage and a semiconductor manufacturing apparatus.
In a first aspect, the invention provides a wafer carrier, which is provided with a carrier table and further comprises at least one detection sensor, wherein the detection sensor is at least used for detecting whether a wafer is placed on the carrier table or not.
Specifically, whether the wafer is placed on the bearing table or not is detected by arranging the detection sensor, the detection sensor works reliably, whether the wafer is placed on the bearing table or not can be accurately detected, and quality accidents caused by repeated placement of the wafer on the bearing table due to misdetection of semiconductor manufacturing equipment are avoided; in addition, a plurality of detection sensors can be arranged for detection, so that the detection reliability of the detection sensors can be further improved.
Further, the detection sensor is an optical fiber sensor, and the optical fiber sensor is arranged on the bearing table.
Specifically, the detection sensor can be an optical fiber sensor, the optical fiber sensor is arranged on the bearing table, an optical signal is emitted upwards through the optical fiber sensor, and the optical signal is reflected back to be received by the optical fiber sensor; the optical fiber sensor can judge the distance between an object of a reflected light signal and the bearing table through the received light signal, when the distance is smaller than a preset threshold value, the bearing table is judged to be provided with a wafer, namely the highest height of the wafer which can be positioned when the wafer is placed on the bearing table is set as the threshold value, when the wafer is placed on the bearing table, the light signal is reflected back by the wafer, the distance calculated by the optical fiber sensor after receiving the reflected signal is smaller than or equal to the set threshold value, at the moment, the wafer is placed on the bearing table, and when the distance calculated by the optical fiber sensor exceeds the set threshold value or the reflected light signal is not received, the wafer is judged to be absent on the bearing table.
Further, optical fiber sensor is provided with a plurality ofly, and is a plurality of optical fiber sensor is liftable setting, and a plurality of liftable setting optical fiber sensor still is used for the jacking wafer.
Specifically, the optical fiber sensor can be set to be liftable, so that the optical fiber sensor can not only have the effect of jacking the wafer, but also have the effect of detecting the wafer; or the optical fiber sensor is lifted to prop against the wafer, and the inserting and taking arm is lowered, so that the wafer is separated from the inserting and taking arm; then the inserting and taking arm moves out of the bearing table, the wafer is prevented from being dragged by the inserting and taking arm when the inserting and taking arm leaves the bearing table, therefore, the phenomenon that the wafer is placed abnormally and the wafer cannot be detected by the detection sensor is avoided, the optical fiber sensor is set to be in a lifting structure, and no jacking rod is additionally arranged, so that the structure of the wafer bearing table is simplified, the manufacturing cost is saved, and the effect of jacking the wafer and the detection effect can be guaranteed by arranging a plurality of optical fiber sensors around the center of the bearing table.
Further, a plurality of the optical fiber sensors are uniformly arranged around the center of the bearing table. The optical fiber sensors are uniformly arranged around the center of the bearing table, so that the effect of jacking the wafer by the optical fiber sensors can be guaranteed.
Further, the optical fiber sensor is connected with an optical amplifier; amplifying the emission signal of the optical fiber sensor by arranging an optical amplifier; or the received reflected optical signal is amplified, so that the detection effect of the optical fiber sensor is ensured.
Further, the detection sensor is a correlation sensor, one of a receiving end and a transmitting end of the correlation sensor is arranged on the bearing platform, and the other is arranged above the bearing platform.
Specifically, the detection sensor may be a correlation sensor, the transmitting end of the correlation sensor is disposed on the carrier, the receiving end and the transmitting end are disposed above the carrier and opposite to each other, or the receiving end of the correlation sensor is disposed on the carrier, the transmitting end and the receiving end are disposed above the carrier and opposite to each other, when no wafer is disposed on the carrier, the signal transmitted by the transmitting end can be received by the receiving end, at this time, it is determined that no wafer is disposed on the carrier, when a wafer is disposed on the carrier, the wafer is located between the transmitting end and the receiving end of the correlation sensor, the signal transmitted by the transmitting end is shielded, at this time, the receiving end cannot receive the transmitting signal from the transmitting end, at this time, it is determined that a wafer is disposed on the carrier, and a plurality of correlation sensors may be disposed, the detection accuracy is further improved.
Furthermore, the vacuum table further comprises a plurality of adsorption parts arranged on the upper surface of the bearing table, the adsorption parts are collected in a vacuum tube, and the vacuum tube is connected with a vacuum meter.
Furthermore, the table top of the bearing table is provided with a plurality of adsorption parts which are communicated and gathered in the vacuum tube, the vacuum adsorption can not be adsorption holes, adsorption grooves and the like, and the wafer is adsorbed and fixed through the vacuum adsorption parts, so that the subsequent semiconductor manufacturing equipment can conveniently process the wafer.
Further, the adsorption part is an adsorption groove, and the adsorption grooves are coaxially arranged around the center of the bearing table.
Further, be provided with a plurality of ejector pins on the plummer, it is a plurality of the ejector pin centers on the center of plummer evenly sets up.
Specifically, by arranging the ejector rod, when the wafer is placed on the bearing table by the inserting arm, the wafer can be jacked by the ejector rod, so that the wafer is separated from the inserting arm; or the top rod is lifted to prop against the wafer, and the inserting and taking arm is lowered, so that the wafer is separated from the inserting and taking arm; then insert the arm and remove the plummer, avoided inserting and getting the arm and leaving drag the wafer when the plummer to avoided placing of wafer unusual and made the detection sensor can not detect the wafer and the false detection appears, in addition, can be provided with the ejector pin on the plummer promptly, also have the optical fiber sensor of liftable setting, wind optical fiber sensor and the ejector pin of liftable setting the center setting of plummer.
In a second aspect, the present application also discloses a semiconductor manufacturing apparatus comprising a wafer carrier as described in any of the above.
Has the advantages that:
the application discloses wafer microscope carrier and semiconductor manufacturing equipment, the wafer microscope carrier is provided with the plummer, still includes at least one detection sensor, detection sensor is used for detecting at least whether the wafer has been placed on the plummer, and the reliable operation of detection sensor can accurately detect whether the wafer has been placed to the plummer to guarantee semiconductor manufacturing equipment's operational reliability, avoided because of the risk of the wafer fish tail that the false retrieval leads to and fracturing.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
FIG. 1 is a schematic diagram of a wafer carrier according to the present invention;
FIG. 2 is a schematic structural diagram of a first embodiment of the present invention;
FIG. 3 is a top view of FIG. 2;
fig. 4 is a schematic structural diagram of another embodiment of the present invention.
Reference numerals: wafer stage 10, wafer 20, susceptor 100, suction vessel 200, lift pins 300, vacuum tubes 301, vacuum gauge 302, detection sensor 400, correlation sensor 410, control device 401, optical fiber sensor 420, and optical amplifier 421.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
Referring to fig. 1, in a first aspect, the present invention provides a wafer stage 10, which is provided with a carrier 100, and includes at least one detection sensor 400, where the detection sensor 400 is at least used for detecting whether a wafer is placed on the carrier 100.
Specifically, the detection sensor 400 is arranged to detect whether the wafer is placed on the bearing table 100, the detection sensor works reliably, whether the wafer is placed on the bearing table 100 can be accurately detected, and quality accidents caused by repeated placement of the wafer on the bearing table 100 due to false detection of semiconductor manufacturing equipment are avoided; further, by providing a plurality of detection sensors 400 for detection, the reliability of detection can be further increased.
Referring to fig. 2 and 3, further, the detection sensor 400 is an optical fiber sensor 420, and the optical fiber sensor 420 is disposed on the carrier 100.
Specifically, the detection sensor 400 may be an optical fiber sensor 420, and the optical fiber sensor 420 is disposed on the bearing table 100, specifically, the optical fiber sensor 420 is disposed in a fixing hole (not shown) formed in the bearing table 100, and a highest point of the optical fiber sensor 420 is flush with the upper surface of the bearing table 100; the optical fiber sensor 420 detects whether a wafer is placed on the susceptor 100, and an optical signal is emitted upwards through the optical fiber sensor 420 and reflected back to be received by the optical fiber sensor 420; the optical fiber sensor 420 may calculate a distance between an object of the reflected optical signal and the upper surface of the susceptor 100 by receiving the optical signal reflected, and when the distance is less than or equal to a predetermined threshold, it is determined that the wafer is disposed on the susceptor 100; namely, the highest height that a wafer can be located when the wafer is placed on the carrier 100 is set as a threshold, when the wafer is placed on the carrier 100, an optical signal is reflected back by the wafer, the distance calculated by the optical fiber sensor 420 after receiving the reflected signal is less than or equal to the set threshold, it is determined that the wafer is placed on the carrier 100 at this time, and it is determined that no wafer is on the carrier 420 when the distance calculated by the optical fiber sensor 420 exceeds the set threshold or the reflected optical signal is not received.
Referring to fig. 2 and 3, further, the optical fiber sensors 420 are provided in a plurality, the optical fiber sensors 420 are all arranged in a lifting manner, and the optical fiber sensors 420 are arranged around the center of the bearing table.
Specifically, the optical fiber sensor 420 can be set to be liftable, so that the optical fiber sensor 420 can have the effect of jacking the wafer and can also have the effect of detecting the wafer, and the optical fiber sensor 420 is set to be of a jacking structure, specifically, a liftable mechanism can be arranged below the bearing table 100, and as the optical fiber sensor 420 is of a long and thin cylinder, the optical fiber sensor can be connected with the liftable structure by penetrating the optical fiber sensor through the bearing table 100, and the optical fiber sensor 420 can be arranged in a liftable manner through the liftable mechanism; by arranging the optical fiber sensor 420 to be capable of ascending and descending, when the inserting and taking arm places the wafer on the bearing table 100, the optical fiber sensor 420 can lift the wafer, so that the wafer is separated from the inserting and taking arm; or the optical fiber sensor 420 is lifted to support the wafer, and the inserting and taking arm is lowered, so that the wafer is separated from the inserting and taking arm; then the inserting arm moves out of the bearing table 100, so that the wafer is prevented from being dragged by the inserting arm when the inserting arm leaves the bearing table 100, the phenomenon that the wafer is placed abnormally and the optical fiber sensor 420 cannot detect the wafer and detect the wafer in error is avoided, the appearance structure of the optical fiber sensor 420 is ingeniously utilized by setting the optical fiber sensor 420 to be a lifting structure, a jacking rod is not additionally arranged, the structure of the wafer bearing table 10 is simplified, and the manufacturing cost is saved; the plurality of optical fiber sensors 420 may be uniformly disposed around the center of the susceptor 100, so that the effect of lifting the wafer and the effect of detecting the wafer may be ensured.
Referring to fig. 2, further, the optical fiber sensing, 420 is connected with an optical amplifier 421; the optical amplifier 421 is arranged to amplify the transmission signal of the optical fiber sensor 420; or amplify the received reflected optical signal, thereby ensuring the detection effect of the optical fiber sensor 420.
Referring to fig. 4, further, the detection sensor 400 may be selected from a correlation sensor 410, one of a receiving end and a transmitting end of the correlation sensor 410 is disposed on the carrier 100, and the other is disposed above the carrier 100.
Specifically, the detection sensor 400 may be an opposite-type sensor 410, the emitting end of the opposite-type sensor 410 is disposed on the susceptor 100, the receiving end and the emitting end are disposed above the susceptor 100 and opposite to the emitting end, or the receiving end of the opposite-type sensor 410 is disposed on the susceptor 100, the emitting end and the receiving end are disposed above the susceptor 100 and opposite to the receiving end, when no wafer 20 is disposed on the susceptor 100, the signal emitted from the emitting end can be received by the receiving end, at this time, it is determined that no wafer 20 is disposed on the susceptor 100, when a wafer is disposed on the susceptor 100, the wafer is disposed between the emitting end and the receiving end of the opposite-type sensor 410, the signal emitted from the emitting end is shielded, at this time, the receiving end does not receive the emitting signal from the emitting end, at this time, it is determined that a wafer is disposed on the susceptor 100, the accuracy of detection can be further improved by providing a plurality of correlation sensors 410.
Referring to fig. 1 and 3, wafer stage 10 further includes a plurality of suction units 200 disposed on the upper surface of susceptor 100, wherein the plurality of suction units 200 are collected in vacuum tubes 301, and vacuum gauges 302 are connected to vacuum tubes 301.
Furthermore, a plurality of absorption parts 200 are arranged on the top surface of the carrier 100, the absorption parts 200 are communicated and collected in a vacuum pipe 301, the vacuum suction part 200 may be a suction hole, a suction groove, etc., and the wafer 20 is sucked and fixed by the vacuum suction part 200, so as to facilitate the subsequent semiconductor manufacturing equipment to process the wafer 20, and in addition, a vacuum gauge 302 is connected to the vacuum tube 301, when a wafer is placed on the susceptor 100, the wafer is sucked and fixed by the suction part 200, and the vacuum value in the vacuum tube 301 is high, when the wafer 20 is not placed on the susceptor 100, the suction portion 200 is connected to the outside, and the vacuum value in the vacuum tube 301 is small, whether a wafer is placed on the susceptor 100 can also be determined by the vacuum value of the vacuum gauge 302, the detection is carried out together with the detection sensor 400, so that the detection accuracy is further ensured.
Further, the absorption part 200 is an absorption groove, and the absorption groove 200 surrounds the center of the bearing table 100 and is coaxially arranged, and the effect of absorbing the wafer can be ensured by arranging the absorption grooves 200 and the bearing table 100 coaxially.
Referring to fig. 1 and 4, further, a plurality of lift pins are arranged on the bearing platform, and the plurality of lift pins are arranged around the center of the bearing platform.
Specifically, in actual work, when the detection sensor 400 is set as the correlation sensor 410, the detection sensor 400 has no jacking function, the jacking rod 300 can be arranged on the bearing table 100 to jack the wafer 20, and by arranging the jacking rod 300, when the wafer is placed on the bearing table 100 by the inserting and taking arm, the wafer can be jacked by the jacking rod 300, so that the wafer 20 is separated from the inserting and taking arm; or the top rod 300 is lifted to support the wafer, and the inserting and taking arm is lowered, so that the wafer 20 is separated from the inserting and taking arm; then the inserting arm moves out of the bearing table 100, so that the wafer 20 is prevented from being dragged by the inserting arm when the inserting arm leaves the bearing table 100, the wafer 20 is prevented from being placed abnormally, the wafer cannot be detected by the detection sensor 400, false detection is avoided, it can be understood that the bearing table 100 can be provided with the ejector rod 300 or the optical fiber sensor 420 with the jacking function, and the optical fiber sensor 420 and the ejector rod 300 which can be arranged in a lifting mode are arranged around the center of the bearing table 100.
Referring to fig. 1 and 3, further, the plurality of lift pins 300 are uniformly arranged around the center of the susceptor 100, and this design can ensure that the lift pins 300 lift the wafer stably, and ensure the placement position of the wafer.
In a second aspect, the present application also discloses a semiconductor manufacturing apparatus comprising a wafer carrier as described in any of the above.
Specifically, by arranging the wafer carrying table 10 in the semiconductor manufacturing equipment, the wafer can be accurately detected through the wafer carrying table 10, the risks of wafer scratching and fracturing caused by false detection are avoided, and the safety of the equipment is greatly improved.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (10)
1. The utility model provides a wafer microscope carrier is provided with the plummer, its characterized in that includes at least one detection sensor, detection sensor is used for detecting at least whether wafer has been placed on the plummer.
2. The wafer carrier as claimed in claim 1, wherein the detection sensor is an optical fiber sensor disposed on the susceptor.
3. The wafer carrier as claimed in claim 2, wherein the optical fiber sensors are provided in plural numbers, the optical fiber sensors are all arranged in a lifting manner, and the optical fiber sensors arranged in a lifting manner are also used for jacking up the wafer.
4. A wafer carrier as claimed in claim 2 wherein a plurality of the optical fibre sensors are arranged evenly around the centre of the susceptor.
5. A wafer carrier as claimed in any one of claims 2 to 4 wherein the optical fibre sensor is connected to an optical amplifier.
6. The wafer carrier as claimed in claim 1 wherein the detection sensor is a correlation sensor, one of a receiving end and a transmitting end of the correlation sensor being disposed on the carrier and the other being disposed above the carrier.
7. The wafer carrier as claimed in any of claims 1-4 and 6 further comprising a plurality of suction portions disposed on the top surface of the susceptor, the plurality of suction portions being collected in a vacuum tube, the vacuum tube being connected to a vacuum gauge.
8. The wafer carrier as claimed in claim 7, wherein the suction portion is a suction groove, and a plurality of the suction grooves are coaxially arranged around a center of the susceptor.
9. A wafer carrier as claimed in any one of claims 1 to 3 and 6 wherein the carrier is provided with a plurality of lift pins, the plurality of lift pins being arranged evenly around the centre of the carrier.
10. A semiconductor manufacturing apparatus, characterized in that the apparatus is provided with a wafer stage according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010486213.5A CN111599728A (en) | 2020-06-01 | 2020-06-01 | Wafer carrying platform and semiconductor manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010486213.5A CN111599728A (en) | 2020-06-01 | 2020-06-01 | Wafer carrying platform and semiconductor manufacturing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111599728A true CN111599728A (en) | 2020-08-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010486213.5A Pending CN111599728A (en) | 2020-06-01 | 2020-06-01 | Wafer carrying platform and semiconductor manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111599728A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112378354A (en) * | 2020-11-13 | 2021-02-19 | 广州粤芯半导体技术有限公司 | Position detection sensor, wafer box position detection device and method |
| CN113106386A (en) * | 2021-04-02 | 2021-07-13 | 宁波江丰电子材料股份有限公司 | Protection ring for preparing wafer and processing method thereof |
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| TWM376901U (en) * | 2009-08-27 | 2010-03-21 | Jing Jiang Technology Inc | Robot arm with wafer detection function |
| CN102194727A (en) * | 2010-03-11 | 2011-09-21 | 中芯国际集成电路制造(上海)有限公司 | Improved robot telescopic arm |
| CN105448795A (en) * | 2015-11-30 | 2016-03-30 | 北京中电科电子装备有限公司 | Wafer gripping system |
| CN109155268A (en) * | 2016-06-21 | 2019-01-04 | 应用材料公司 | substrate temperature monitoring |
| CN208954942U (en) * | 2018-09-04 | 2019-06-07 | 德淮半导体有限公司 | Wafer conveying device |
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2020
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| CN201054346Y (en) * | 2007-06-04 | 2008-04-30 | 大赢数控设备(深圳)有限公司 | A mechanical structure for taking solid crystal for solid crystal processing machine |
| JP2010047330A (en) * | 2008-08-19 | 2010-03-04 | Avanstrate Inc | Glass plate carrying device and contact member |
| TWM376901U (en) * | 2009-08-27 | 2010-03-21 | Jing Jiang Technology Inc | Robot arm with wafer detection function |
| CN102194727A (en) * | 2010-03-11 | 2011-09-21 | 中芯国际集成电路制造(上海)有限公司 | Improved robot telescopic arm |
| CN105448795A (en) * | 2015-11-30 | 2016-03-30 | 北京中电科电子装备有限公司 | Wafer gripping system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112378354A (en) * | 2020-11-13 | 2021-02-19 | 广州粤芯半导体技术有限公司 | Position detection sensor, wafer box position detection device and method |
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Application publication date: 20200828 |