CN111586994A - Uncovering method of multilayer circuit board for 5G communication - Google Patents
Uncovering method of multilayer circuit board for 5G communication Download PDFInfo
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- CN111586994A CN111586994A CN202010341412.7A CN202010341412A CN111586994A CN 111586994 A CN111586994 A CN 111586994A CN 202010341412 A CN202010341412 A CN 202010341412A CN 111586994 A CN111586994 A CN 111586994A
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- copper
- circuit board
- layer
- multilayer circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
Abstract
The invention discloses a cover opening method of a multilayer circuit board for 5G communication, which comprises the following steps of S1, respectively carrying out preset circuit manufacturing on each board, and etching a copper-free area for cutting off a cover opening area on a copper layer of a board with a partial area positioned in the cover opening area; s2, stacking the plates in sequence, wherein the reserved copper layer at the bottommost layer of the cover opening area is in contact with the copper layer of the plate at the layer below the reserved copper layer; s3, bonding the boards to form a multilayer circuit board, wherein the bottom of the reserved copper layer is not bonded with the board positioned at the next layer of the reserved copper layer; s4, cutting the multilayer circuit board along the copper-free area by using laser; and S5, removing the reserved copper layer and the uncapping area to obtain the uncapped multilayer circuit board. The cover opening method of the multilayer circuit board for 5G communication provided by the invention reduces the processing cost and the processing time efficiency of the isolation material, improves the production efficiency of the multilayer circuit board for 5G communication and is beneficial to the mass production of the multilayer circuit board for 5G communication.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a cover opening method of a multilayer circuit board for 5G communication.
Background
Under the trend of 5G and the quick development of thing networking, the antenna industry is to the demand greatly increased of 5G communication multilayer circuit board, multilayer circuit board usually need form the Airgap region through uncapping and in order to improve the work bandwidth of antenna, current multilayer circuit board generally blocks the upper and lower layer bonding back of circuit board through built-in isolation material and uses uv radium-shine to cut multilayer circuit board, in order to get rid of the partial circuit board in upper strata and accomplish uncapping, and current isolation material is with higher costs and the texture is softer not workable, common isolation material can't tolerate the high temperature of more than 300 degrees centigrade, the requirement to the technology is higher when making multilayer circuit board and laser cutting.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: a low-cost method for opening a cover of a multilayer circuit board for 5G communication is provided.
In order to solve the technical problems, the invention adopts the technical scheme that: a cover opening method of a multilayer circuit board for 5G communication comprises the following steps,
s1, respectively carrying out preset circuit manufacturing on each plate, and etching a copper-free area for cutting off the cover opening area on the copper layer of the plate with a partial area located in the cover opening area;
s2, stacking the plates in sequence, wherein the reserved copper layer at the bottommost layer of the cover opening area is in contact with the copper layer of the plate at the layer below the reserved copper layer;
s3, bonding the boards to form a multilayer circuit board, wherein the bottom of the reserved copper layer is not bonded with the board positioned at the next layer of the reserved copper layer;
s4, cutting the multilayer circuit board along the copper-free area by using laser;
and S5, removing the reserved copper layer and the cover opening area to obtain the multi-layer circuit board after the cover is opened.
The invention has the beneficial effects that: the uncovering method of the multilayer circuit board for 5G communication provided by the invention has the advantages that the processing cost and the processing time of the isolation material are reduced, the production efficiency of the multilayer circuit board for 5G communication is improved, and the large-scale production of the multilayer circuit board for 5G communication is facilitated.
Drawings
Fig. 1 is a schematic structural view of the uppermost-layer board corresponding to step S1 in the method for opening a cover of a multilayer circuit board for 5G communication according to the first embodiment of the present invention;
fig. 2 is a schematic structural diagram of any one layer of plate material between the plate material of the second layer corresponding to step S1 and the plate material of the layer on the reserved copper layer in the method for opening a cover of a multilayer circuit board for 5G communication according to the first embodiment of the present invention;
fig. 3 is a schematic structural diagram of a board having a reserved copper layer corresponding to step S1 in the method for opening a cover of a multilayer circuit board for 5G communication according to the first embodiment of the present invention;
fig. 4 is a schematic structural diagram of any one layer of plate material located below the reserved copper layer in the step S1 in the method for opening a cover of a multilayer circuit board for 5G communication according to the first embodiment of the present invention;
fig. 5 is a schematic structural view of the multilayer circuit board corresponding to steps S2 and S3 in the method for opening a cover of a multilayer circuit board for 5G communication according to the first embodiment of the present invention;
fig. 6 is a schematic structural view of the multilayer circuit board corresponding to step S4 in the method for opening a cover of a multilayer circuit board for 5G communication according to the first embodiment of the present invention;
fig. 7 is a schematic structural diagram of the multilayer circuit board corresponding to step S5 in the method for opening a cover of a multilayer circuit board for 5G communication according to the first embodiment of the present invention.
Description of reference numerals:
1. a copper layer; 2. a cover opening area; 3. a copper-free region; 31. a first copper-free region; 32. a second copper-free region; 4. reserving a copper layer; 5. an LCP layer.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
The most key concept of the invention is as follows: and etching a copper-free area for cutting off the cover opening area in advance on each layer of plate material of the multilayer circuit board, wherein the bottom of the reserved copper layer positioned at the bottom of the cover opening area is not bonded with the next layer of plate material.
Referring to fig. 1 to 4, a method for opening a cover of a multilayer circuit board for 5G communication includes the following steps,
s1, respectively carrying out preset circuit manufacturing on each plate, and etching a copper-free area 3 for cutting off the cover opening area 2 on the copper layer 1 of the plate with a partial area located in the cover opening area 2;
s2, stacking the plates in sequence, wherein the reserved copper layer 4 at the bottommost layer of the open cover area 2 is in contact with the copper layer 1 of the plate positioned at the next layer of the reserved copper layer 4;
s3, bonding the boards to form a multilayer circuit board, wherein the bottom of the reserved copper layer 4 is not bonded with the board positioned at the next layer of the reserved copper layer 4;
s4, cutting the multilayer circuit board along the copper-free area 3 by using laser;
and S5, removing the reserved copper layer 4 and the cover opening area 2 to obtain the multi-layer circuit board after the cover is opened.
The working principle of the invention is briefly described as follows: the copper-free area 3 is etched in advance on each layer of plate material of the multilayer circuit board, the copper-free area 3 forms a channel for laser to pass through after each layer of plate material is bonded into the multilayer circuit board, the bottom of the reserved copper layer 4 at the bottom of the cover opening area 2 is not bonded with the next layer of plate material, and the laser can take down the whole cover opening area 2 to complete the cover opening of the multilayer circuit board after cutting off the cover opening area 2 and the bonding layers on two sides of the reserved copper layer 4 along the copper-free area 3.
From the above description, the beneficial effects of the present invention are: the processing cost and the processing aging of the isolation material are reduced, the production efficiency of the multilayer circuit board for 5G communication is improved, and the large-scale production of the multilayer circuit board for 5G communication is facilitated.
Further, in step S1, the copper-free area 3 on the plate is a frame-shaped area surrounding the open-cover area 2.
As can be seen from the above description, the shape of the copper-free area 3 is determined by the position of the open cover area 2 on the plate, the copper-free area 3 is a frame-shaped area when the open cover area 2 is located in the middle of the plate, and the copper-free area 3 is correspondingly shaped when the open cover area 2 is located at the edge or corner of the plate.
Further, in step S2, the copper-free area 3 is etched on all the plates above the reserved copper layer 4, wherein the first copper-free area 31 is disposed on the first layer of plate, and the second copper-free area 32 is disposed on the plate from the second layer to the layer above the reserved copper layer 4.
Further, the difference between the width of the second copper free area 32 and the width of the first copper free area 31 is larger than the lamination tolerance.
As can be seen from the above description, the width of the second copper-free region 32 is greater than the width of the first copper-free region 31, so as to prevent other plates from being damaged due to the deviation during laser cutting, or prevent the laser from being blocked by other plates and being unable to continue to cut downwards.
Further, the difference between the width of the first copper-free region 31 and the horizontal distance from the edge of the reserved copper layer to the outer edge of the first copper-free region 31 is larger than the lamination tolerance.
As can be seen from the above description, the width of the first copper-free region 31 is greater than the horizontal distance from the edge of the reserved copper layer 4 to the outer edge of the first copper-free region 31, so that when the laser cuts to the bottom of the uncapped region 2, a part of the laser is located on the reserved copper layer 4, and another part of the laser is located in the copper-free region 3, which facilitates separation of the uncapped region 2 from the multilayer circuit board.
Further, step S2 is followed by step S21 of adjusting the relative position between two adjacent plates to make the position of the copper-free area 3 correspond.
As can be seen from the above description, when stacking plates, the positions of the copper-free areas 3 on each plate in the vertical direction need to be correspondingly placed, so as to ensure that the laser cutting can smoothly reach the bottom of the cap opening area 2.
Further, the plate material includes the LCP layer 5, and in step S3, the LCP layer 5 is melted by heating to bond the two adjacent plate materials.
As can be seen from the above description, bonding between the respective plates is reliable by melting the LCP layers 5 provided on the plates to bond the adjacent two plates, while avoiding the use of adhesives, simplifying the manufacturing process.
Further, in step S4, the multilayer wiring board is diced using a CO2 laser.
As can be seen from the above description, the CO2 laser cannot break down the copper layer 1 that is not specially processed, so that it is not necessary to precisely control the energy of the CO2 laser when using the CO2 laser to cut, when the CO2 laser cuts the reserved copper layer 4 and the copper layer 1 of the board located below the reserved copper layer 4, the CO2 laser cannot continue to cut downwards, at this time, the uncapping area 2 can be removed from the multilayer circuit board, and at the same time, the copper layers 1 of other boards are not damaged, so that the finished product quality of the multilayer circuit board for 5G communication is improved.
Example one
Referring to fig. 1 to 4, a first embodiment of the present invention is: a cover opening method of a multilayer circuit board for 5G communication comprises the following steps,
s1, respectively carrying out preset circuit manufacturing on each plate, and etching a copper-free area 3 for cutting off the cover opening area 2 on the copper layer 1 of the plate with a partial area located in the cover opening area 2;
s2, stacking the plates in sequence, wherein the reserved copper layer 4 at the bottommost layer of the open cover area 2 is in contact with the copper layer 1 of the plate positioned at the next layer of the reserved copper layer 4;
s3, bonding the boards to form a multilayer circuit board, wherein the bottom of the reserved copper layer 4 is not bonded with the board positioned at the next layer of the reserved copper layer 4;
s4, cutting the multilayer circuit board along the copper-free area 3 by using laser;
and S5, removing the reserved copper layer 4 and the cover opening area 2 to obtain the multi-layer circuit board after the cover is opened.
As shown in fig. 1, in step S1, the shape of the copper-free area 3 is determined by the position of the uncapped area 2 on the plate, in this case, the uncapped area 2 is located in the middle of the plate, and the copper-free area 3 is a frame-shaped area, and in other embodiments, the copper-free area 3 is correspondingly shaped when the uncapped area 2 is located at the edge or corner of the plate.
As shown in fig. 2, in the multilayer circuit board obtained in steps S2 and S3, the copper-free regions 3 are etched on all boards located above the reserved copper layer 4, and the copper-free regions 3 are not etched on the copper layers 1 of all boards located below the reserved copper layer 4. Step S21 is further included after step S2, the relative position between two adjacent plates is adjusted, so that the position of the copper-free area 3 corresponds to that of the copper-free area, and the laser can smoothly reach the bottom of the cap opening area 2 during laser cutting. Preferably, the plate comprises the LCP layer 5, and the LCP layer 5 is melted by heating the plate to bond the two adjacent plates together to obtain the multilayer circuit board, so that the use of an adhesive is avoided, and the production process is simplified. The board with the reserved copper layer 4 is in contact with the copper layer 1 of the board positioned next to the reserved copper layer 4, so that the LCP layer 5 of the board with the reserved copper layer 4 is bonded to the copper layer 1 of the next board, and there is no LCP layer 5 or other bonding agent between the reserved copper layer 4 and the copper layer 1 of the next board, so that the reserved copper layer 4 is not bonded to the next board.
Further, set up reserve copper layer 4 and replace the barrier material among the prior art, compare in flexible barrier material, the texture is harder reserve copper layer 4 processing is more convenient, can tolerate higher processing temperature, has reduced the technology degree of difficulty, and non-deformable when piling up or clamp plate formation multilayer circuit board has improved 5G is with the machining precision of multilayer circuit board, has reserve copper layer 4's panel can be obtained by current panel further processing, has practiced thrift manufacturing cost.
As shown in fig. 3, in step S4, a first copper-free area 31 is formed on the first layer of board material of the multilayer circuit board from top to bottom, and a second copper-free area 32 is formed on the second layer of board material to the layer of board material above the reserved copper layer 4. The difference between the width of the second copper-free area 32 and the width of the first copper-free area 31 is larger than the tolerance of the lamination, so that the damage of other plates of the multilayer circuit board caused by the deviation generated during the cutting of the laser is avoided, or the laser is blocked by other plates and cannot be continuously cut downwards; the difference between the width of the first copper-free area 31 and the horizontal distance from the edge of the reserved copper layer 4 to the outer edge of the first copper-free area 31 is larger than the tolerance of lamination, so that when the laser cuts to the bottom of the uncapping area 2, one part of laser is positioned on the reserved copper layer 4, and the other part of laser is positioned on the copper-free area 3, and the uncapping area 2 is conveniently separated from the multilayer circuit board. It should be noted that the lamination tolerance is the maximum distance that the individual sheets are allowed to deflect when stacked.
Preferably, the laser used in step S4 is a CO2 laser, and since the CO2 laser cannot break through the copper layer 1 that is not specially processed, it is not necessary to precisely control the energy of the CO2 laser when cutting with the CO2 laser, and when the CO2 laser cuts through the reserved copper layer 4 and the copper layer 1 of the board located at the layer below the reserved copper layer 4, the CO2 laser cannot continue to cut downward, and at this time, the cap opening region 2 can be removed from the multilayer circuit board without damaging other boards, so that the finished product quality of the multilayer circuit board for 5G communication is improved, and the difficulty of the laser cutting operation is reduced.
As shown in fig. 4, in step S5, the bottom of the reserved copper layer 4 is not bonded to the copper layer 1 of the board material located at the layer below the reserved copper layer 4, so that the reserved copper layer 4 and the open lid region 2 can be easily removed from the multilayer circuit board after the LCP layers 5 on both sides of the reserved copper layer 4 are removed by laser cutting.
In conclusion, the uncovering method of the multilayer circuit board for 5G communication provided by the invention reduces the processing cost and the processing time efficiency of the isolation material, improves the processing efficiency of the multilayer circuit board for 5G communication, has high product quality and low requirement on laser cutting operation, and is beneficial to the mass production of the multilayer circuit board for 5G communication.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (8)
1. A cover opening method of a multilayer circuit board for 5G communication is characterized in that: comprises the following steps of (a) carrying out,
s1, respectively carrying out preset circuit manufacturing on each plate, and etching a copper-free area for cutting off the cover opening area on the copper layer of the plate in which a partial area is positioned in the cover opening area;
s2, stacking the plates in sequence, wherein the reserved copper layer at the bottommost layer of the cover opening area is in contact with the copper layer of the plate at the layer below the reserved copper layer;
s3, bonding the boards to form a multilayer circuit board, wherein the bottom of the reserved copper layer is not bonded with the board positioned at the next layer of the reserved copper layer;
s4, cutting the multilayer circuit board along the copper-free area by using laser;
and S5, removing the reserved copper layer and the cover opening area to obtain the multi-layer circuit board after the cover is opened.
2. The method for opening a cover of a multilayer circuit board for 5G communication according to claim 1, wherein: in step S1, the copper-free area on the plate is a frame-shaped area surrounding the open-cover area.
3. The method for opening a cover of a multilayer circuit board for 5G communication according to claim 1, wherein: in step S2, the copper-free areas are etched on all the plates above the reserved copper layer, wherein a first copper-free area is disposed on the first layer of plate, and a second copper-free area is disposed on the plate from the second layer to the layer above the reserved copper layer.
4. A cover opening method for a multilayer circuit board for 5G communication according to claim 3, wherein: the difference between the width of the second copper free region and the width of the first copper free region is greater than the lamination tolerance.
5. A cover opening method for a multilayer circuit board for 5G communication according to claim 3, wherein: the difference between the width of the first copper-free region and the horizontal distance from the edge of the reserved copper layer to the outer edge of the first copper-free region is greater than the lamination tolerance.
6. The method for opening a cover of a multilayer circuit board for 5G communication according to claim 1, wherein: step S21 is further included after step S2, the relative position between two adjacent boards is adjusted to make the copper-free areas correspond to each other.
7. The method for opening a cover of a multilayer circuit board for 5G communication according to claim 1, wherein: the sheets include LCP layers, and in step S3, adjacent two sheets are bonded by heating to melt the LCP layers.
8. The method for opening a cover of a multilayer circuit board for 5G communication according to claim 1, wherein: in step S4, the multilayer wiring board is diced using a CO2 laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010341412.7A CN111586994B (en) | 2020-04-27 | 2020-04-27 | Uncovering method of multilayer circuit board for 5G communication |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010341412.7A CN111586994B (en) | 2020-04-27 | 2020-04-27 | Uncovering method of multilayer circuit board for 5G communication |
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| CN111586994A true CN111586994A (en) | 2020-08-25 |
| CN111586994B CN111586994B (en) | 2021-12-21 |
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| US20060101638A1 (en) * | 2004-11-18 | 2006-05-18 | International Business Machines Corporation | Method and structure for creating printed circuit boards with stepped thickness |
| CN103124472A (en) * | 2011-11-18 | 2013-05-29 | 北大方正集团有限公司 | Flex-rigid printed circuit board manufacturing method and flex-rigid printed circuit board |
| CN103517582A (en) * | 2012-06-18 | 2014-01-15 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
| CN104394665A (en) * | 2014-10-15 | 2015-03-04 | 上海美维电子有限公司 | Manufacturing method of ultrathin printed circuit board, and ultrathin printed circuit board |
| CN105101684A (en) * | 2015-08-11 | 2015-11-25 | 河源西普电子有限公司 | Rigid-flex board making and laser uncapping method |
| CN108882570A (en) * | 2018-09-28 | 2018-11-23 | 广州兴森快捷电路科技有限公司 | Rigid-flex circuit board and preparation method thereof |
-
2020
- 2020-04-27 CN CN202010341412.7A patent/CN111586994B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060101638A1 (en) * | 2004-11-18 | 2006-05-18 | International Business Machines Corporation | Method and structure for creating printed circuit boards with stepped thickness |
| CN103124472A (en) * | 2011-11-18 | 2013-05-29 | 北大方正集团有限公司 | Flex-rigid printed circuit board manufacturing method and flex-rigid printed circuit board |
| CN103517582A (en) * | 2012-06-18 | 2014-01-15 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and manufacturing method thereof |
| CN104394665A (en) * | 2014-10-15 | 2015-03-04 | 上海美维电子有限公司 | Manufacturing method of ultrathin printed circuit board, and ultrathin printed circuit board |
| CN105101684A (en) * | 2015-08-11 | 2015-11-25 | 河源西普电子有限公司 | Rigid-flex board making and laser uncapping method |
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