CN111586222A - Piezoelectric ceramic assembly and electronic equipment - Google Patents
Piezoelectric ceramic assembly and electronic equipment Download PDFInfo
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- CN111586222A CN111586222A CN202010591402.9A CN202010591402A CN111586222A CN 111586222 A CN111586222 A CN 111586222A CN 202010591402 A CN202010591402 A CN 202010591402A CN 111586222 A CN111586222 A CN 111586222A
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- piezoceramic
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
- H04M1/035—Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
- H04M1/185—Improving the rigidity of the casing or resistance to shocks
Abstract
The embodiment of the invention discloses a piezoelectric ceramic component and electronic equipment. The middle layer substrate is arranged between the first piezoelectric ceramic piece and the second piezoelectric ceramic piece, and the first piezoelectric ceramic piece and the second piezoelectric ceramic piece are fixedly connected through the middle layer substrate, so that the piezoelectric ceramic component can bear larger stress when being subjected to vibration bending, the impact resistance of the piezoelectric ceramic component is improved, and the reliability of the piezoelectric ceramic component is improved.
Description
Technical Field
The invention relates to the field of electronic equipment, in particular to a piezoelectric ceramic component and electronic equipment.
Background
Based on the requirements of the full screen of the mobile phone and the nonporous screen of the mobile phone, the traditional sounding technology for forming holes on the mobile phone cannot meet the requirements of the full screen of the mobile phone and the nonporous screen. Therefore, screen sounding techniques have been developed. The principle is that a screen and a structure which are fixedly connected with an exciter are driven by the exciter, and the screen is used as a vibrating body to generate sound waves which are transmitted to human ears.
The exciter is divided into a piezoelectric ceramic unit exciter and a micro-vibration unit exciter. The micro-vibration exciter converts electric energy into mechanical energy through the electromagnetic induction principle of the magnet and the coil and drives the screen to vibrate and sound, and the micro-vibration exciter has high assembly difficulty and complex process; the piezoelectric ceramic exciter has the advantages of simple structure, thin thickness, small size and the like, but the ceramic chip structure in the traditional piezoelectric exciter is too simple, and the reliability risk is large.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a piezoelectric ceramic component and an electronic device, which are used to solve the problem of high reliability risk of the conventional piezoelectric ceramic plate.
In a first aspect, embodiments of the present invention provide a piezoelectric ceramic component, including
The piezoelectric ceramic plate comprises a first piezoelectric ceramic plate and a second piezoelectric ceramic plate; and
and the middle layer substrate is arranged between the first piezoelectric ceramic piece and the second piezoelectric ceramic piece and used for enhancing the strength of the piezoelectric ceramic component.
Preferably, also comprises
The flexible circuit board comprises a first flexible part and a second flexible part, the first flexible part is fixedly connected with the first piezoelectric ceramic piece, and the second flexible part is fixedly connected with the second piezoelectric ceramic piece;
a first adhesive layer; and
and the steel plate is fixedly connected with the second flexible part through the first bonding layer.
Preferably, the interlayer substrate includes:
the bearing part is attached to the first piezoelectric ceramic piece and the second piezoelectric ceramic piece; and
and the extension part extends out from the position between the first piezoelectric ceramic piece and the second piezoelectric ceramic piece, extends below the flexible circuit board and is used for supporting the flexible circuit board.
Preferably, silica gel is arranged between the extension part and the flexible circuit board.
Preferably, the outline of the middle layer substrate is the same as the outlines of the first piezoceramic sheet and the second piezoceramic sheet.
Preferably, the outline of the middle layer substrate is larger than the outlines of the first piezoceramic sheet and the second piezoceramic sheet.
Preferably, the middle layer substrate has a sealing area beyond edges of the first piezoelectric ceramic piece and the second piezoelectric ceramic piece, and the sealing area is filled with a sealing structure.
Preferably, a groove is provided on the intermediate layer substrate, and a flexible weight portion is provided in the groove; the flexible counterweight part is a flexible mass block or silica gel.
Preferably, the flexible mass is a mixture of metal powder and glue.
Preferably, the piezoelectric ceramic assembly further comprises a thin film blister package.
In a second aspect, an embodiment of the present invention provides an electronic device, including:
a piezoelectric ceramic component as described above;
a second adhesive layer; and
a screen;
the piezoelectric ceramic assembly is fixedly connected with the screen through a second bonding layer.
The piezoelectric ceramic component comprises a first piezoelectric ceramic piece, a second piezoelectric ceramic piece and an intermediate layer substrate. The middle layer substrate is arranged between the first piezoelectric ceramic piece and the second piezoelectric ceramic piece, and the first piezoelectric ceramic piece and the second piezoelectric ceramic piece are fixedly connected through the middle layer substrate, so that the piezoelectric ceramic component can bear larger stress when the piezoelectric ceramic component is subjected to bending vibration, the impact resistance of the piezoelectric ceramic component is improved, and the reliability of the piezoelectric ceramic component is improved.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:
FIG. 1 is a schematic view of a piezoelectric ceramic component according to a first embodiment of the present invention;
FIG. 2 is an exploded view of a piezoelectric ceramic component according to a first embodiment of the present invention;
FIG. 3 is a sectional view of a piezoelectric ceramic component according to a first embodiment of the present invention;
FIG. 4 is a schematic structural view of an electronic apparatus employing a piezoelectric ceramic element according to a first embodiment of the present invention;
FIG. 5 is a schematic structural view of a piezoelectric ceramic component according to a second embodiment of the present invention;
FIG. 6 is a sectional view of a piezoelectric ceramic component according to a second embodiment of the present invention;
FIG. 7 is a schematic structural view of an electronic device employing a piezoelectric ceramic element according to a second embodiment of the present invention;
FIG. 8 is an exploded view of a piezoelectric ceramic component according to a third embodiment of the present invention;
FIG. 9 is a top view of a third embodiment of an interlayer substrate of the present invention;
FIG. 10 is a sectional view of a piezoelectric ceramic component according to a third embodiment of the present invention;
FIG. 11 is a cut-away view of a third embodiment of a thin film blister package in accordance with the present invention;
FIG. 12 is a top view of a third embodiment of a thin film blister package of the present invention;
fig. 13 is a schematic view of an electronic device employing a piezoelectric ceramic element according to a third embodiment of the present invention;
FIG. 14 is a schematic view of a piezoelectric ceramic component according to a fourth embodiment of the present invention;
FIG. 15 is a schematic view of an interlayer substrate according to a fourth embodiment of the present invention;
FIG. 16 is a sectional view of a piezoelectric ceramic component according to a fourth embodiment of the present invention;
FIG. 17 is a cross-sectional view of a fourth embodiment of a thin film blister package in accordance with the present invention;
FIG. 18 is a top view of a fourth embodiment of a thin film blister package of the present invention;
fig. 19 is an exploded view of an electronic device using a piezoelectric ceramic element according to a fourth embodiment of the present invention.
Detailed Description
The present invention will be described below based on examples, but the present invention is not limited to only these examples. In the following detailed description of the present invention, certain specific details are set forth. It will be apparent to one skilled in the art that the present invention may be practiced without these specific details. Well-known methods, procedures, components and circuits have not been described in detail so as not to obscure the present invention.
Further, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.
Unless the context clearly requires otherwise, throughout the description, the words "comprise", "comprising", and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is, what is meant is "including, but not limited to".
In the description of the present invention, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
The first embodiment of the present invention is described below.
Fig. 1 is a schematic view of a piezoelectric ceramic component according to a first embodiment of the present invention. Fig. 2 is an exploded view of a piezoelectric ceramic component according to a first embodiment of the present invention.
As shown in fig. 1 and 2, the piezoelectric ceramic assembly of the present embodiment includes a first piezoelectric ceramic sheet 11, a second piezoelectric ceramic sheet 12, an intermediate substrate 13, a flexible circuit board 20, a first adhesive layer 30, and a steel plate 40.
The traditional piezoelectric ceramic plate is only a multilayer ceramic plate, and the ceramic plate is easy to break and has high reliability risk.
The piezoelectric ceramic assembly of the present embodiment adds the intermediate layer substrate 13 between the first piezoelectric ceramic plate 11 and the second piezoelectric ceramic plate 12. The first piezoelectric ceramic piece 11 is connected with the middle layer substrate 13 in a gluing mode; the second piezoceramic sheet 12 is connected to the interlayer substrate 13 by gluing. Therefore, when the first piezoelectric ceramic piece 11 and the second piezoelectric ceramic piece 12 are stressed and bent, the middle layer substrate 13 can bear large stress, so that the impact resistance of the piezoelectric ceramic component is improved, and the reliability of the piezoelectric ceramic component is improved.
The outer dimension of the intermediate substrate 13 (i.e., the outline of the intermediate substrate 13) may be the same as the outlines of the first piezoelectric ceramic piece 11 and the second piezoelectric ceramic piece 12; or may be larger than the contours of the first piezoceramic wafer 11 and the second piezoceramic wafer 12. Alternatively, the outer dimension of the intermediate substrate 13 (i.e., the outline of the intermediate substrate 13) of the present embodiment is the same as the outer dimensions of the first piezoceramic sheet 11 and the second piezoceramic sheet 12.
The intermediate layer substrate 13 is a plate material having a certain hardness in the horizontal direction. Preferably, the intermediate layer substrate of the embodiment adopts a complete glass fiber plate, a carbon fiber plate or a steel plate, etc.
Specifically, the flexible circuit board 20 includes two parts, namely a first flexible portion 21 and a second flexible portion 22, the second flexible portion 22 is connected to the first flexible portion 21, and the second flexible portion 22 forms a space a with the first flexible portion 21 in a bent manner. A ceramic sheet combination a1 formed by the first piezoelectric ceramic sheet 11, the intermediate substrate 13, and the second piezoelectric ceramic sheet 12 is disposed in the space a of the flexible circuit board 20. Wherein, the first piezoelectric ceramic piece 11 is provided with an electrode 110, and the first flexible portion 21 feeds power to the first piezoelectric ceramic piece 11 through the electrode 110 of the first piezoelectric ceramic piece 11; an electrode 120 is disposed on the second piezoceramic sheet 12, and the second flexible portion 22 feeds power to the second piezoceramic sheet 12 through the electrode 120 of the second piezoceramic sheet 12. The flexible printed circuit board 20 is enabled to feed the ceramic chip combination a1 by the electrode 110 and the electrode 120, and thus the piezoelectric ceramic combination a1 can contract according to the excitation of the feed signal.
In the drawings, B1 and B2 are used to illustrate two different states of the flexible circuit board 20, and B1 is a state in which the second flexible portion 22 forms a space a with the first flexible portion 21 in a bent form (the space a is used to accommodate the ceramic sheet combination a1 formed by the first piezoelectric ceramic sheet 11, the intermediate layer substrate 13, and the second piezoelectric ceramic sheet 12); b2 is the unfolded state of the flexible circuit board 20. Preferably, to reduce the overall size of the piezoelectric ceramic element, the operating state of the present embodiment is B1.
FIG. 3 is a sectional view of a piezoelectric ceramic component according to a first embodiment of the present invention.
As shown in fig. 3, the sectional view of the piezoelectric ceramic component according to the embodiment of the present invention sequentially includes, from top to bottom: the first flexible portion 21, the first piezoelectric ceramic sheet 11, the intermediate layer substrate 13, the second piezoelectric ceramic sheet 12, the second flexible portion 22, the first adhesive layer 30, and the steel plate 40. The above elements are fixedly connected in turn. Wherein the steel plate 40 is attached to the second flexible portion 22 by the first adhesive layer 30. The first adhesive layer 30 may be a double-sided tape or a glue or other adhesive material with a bonding or gluing function. In this embodiment, after the ceramic sheet combination formed by the first piezoelectric ceramic sheet 11, the intermediate layer substrate 13, and the second piezoelectric ceramic sheet 12 acquires the excitation signal of the flexible circuit board 20 through the electrodes, the ceramic sheet combination formed by the first piezoelectric ceramic sheet 11, the intermediate layer substrate 13, and the second piezoelectric ceramic sheet 12 contracts by the excitation signal. Because the ceramic plates formed by the first piezoelectric ceramic plate 11, the middle layer substrate 13 and the second piezoelectric ceramic plate 12 are combined in the space of the flexible circuit board 20, and the flexible circuit board 20 is fixedly connected with the steel plate through the first bonding layer, the contraction motion of the ceramic plate combination can drive the steel plate to perform vertical bending motion, so that the piezoelectric ceramic component integrally shows vertical bending motion (namely vibration).
It should be understood that in the present embodiment, the first piezoceramic sheet 11 and the second piezoceramic sheet 12 may also be fed in other ways. The flexible circuit board 20 may be replaced with a wire or other type of feed structure.
Fig. 4 is a schematic structural view of an electronic device using a piezoelectric ceramic component according to a first embodiment of the present invention.
As shown in fig. 4, the electronic device provided by the embodiment of the present invention includes a piezoelectric ceramic component 1, a second adhesive layer 2, and a screen 3. The second adhesive layer 2 may be a double-sided tape, and the screen 3 may be a screen of a mobile phone, a tablet computer, or the like.
The piezoelectric ceramic assembly 1 is attached to the screen 3 by the second adhesive layer 2. The piezoelectric ceramic component 1 can be driven by the electric signal of the flexible circuit board 20 to do up-and-down bending movement, namely vibration, and after the screen 3 is attached through the second bonding layer, the piezoelectric ceramic component 1 can drive the whole or local vibration of the screen 3, so that the screen can sound. The piezoelectric ceramic component 1 provided by the embodiment of the invention comprises a first piezoelectric ceramic piece 11, a second piezoelectric ceramic piece 12, an intermediate layer substrate 13, a flexible circuit board 20, a first bonding layer 30 and a steel plate 40.
The electronic equipment is fixedly connected with the screen through the piezoelectric ceramic component and the second bonding layer, so that vibration generated by driving of the piezoelectric ceramic component is transmitted to the screen, the piezoelectric ceramic component drives the screen to vibrate to generate sound waves, and when the sound waves reach ears of a user, the user can hear the sound emitted by the screen.
In the embodiment, the middle layer substrate is arranged between the first piezoelectric ceramic and the second piezoelectric ceramic, so that the impact resistance of the piezoelectric ceramic component is improved, the reliability of the piezoelectric ceramic component is improved, and the characteristic of low reliability of the traditional ceramic piece is changed. The flexible circuit board feeds power to the first piezoelectric ceramics, the second piezoelectric ceramics and the middle layer substrate, so that excitation signals are provided for the first piezoelectric ceramics, the second piezoelectric ceramics and the middle layer substrate, and the first piezoelectric ceramics, the second piezoelectric ceramics and the middle layer substrate are driven to shrink. Through setting up the steel sheet to laminate the steel sheet to the combination of flexible circuit board, first piezoceramics, second piezoceramics and intermediate level base plate on through first bond line, thereby convert the shrink motion of first piezoceramics, second piezoceramics and intermediate level base plate into the up-and-down motion of buckling of steel sheet, thereby make whole piezoceramics subassembly demonstrate the motion of buckling and also vibrate. Through the second bond line, laminate the screen with piezoceramics subassembly on to can drive the screen vibration during piezoceramics subassembly's vibration, and then produce the sound wave, realize the screen sound production from this.
The second embodiment of the present invention is described below.
Fig. 5 is a schematic structural view of a piezoelectric ceramic component according to a second embodiment of the present invention. FIG. 6 is a sectional view of a piezoelectric ceramic component according to a second embodiment of the present invention.
As shown in fig. 5 and 6, the piezoelectric ceramic assembly of the present embodiment includes a first piezoelectric ceramic sheet 11, a second piezoelectric ceramic sheet 12, an intermediate substrate 13, a flexible circuit board 20, a first adhesive layer 30, and a steel plate 40. The flexible circuit board 20 includes a first flexible portion 21 and a second flexible portion 22.
The intermediate layer substrate 13 of the present embodiment is different from the first embodiment, and the remaining elements (the first piezoelectric ceramic sheet 11, the second piezoelectric ceramic sheet 12, the flexible circuit board 20, the first adhesive layer 30, and the steel plate 40) are the same as those of the first embodiment, and a description thereof will not be repeated.
In order to increase the reliability of the piezoelectric ceramic assembly, the second embodiment of the present invention improves the intermediate substrate 13 on the basis of the first embodiment by adding the groove 130 and the flexible weight (not shown in the figure) on the intermediate substrate 13. The flexible counterweight part is a flexible mass block or silica gel.
In an alternative implementation, the flexible weight portion employs a flexible mass. The flexible mass of the present embodiment includes a stiffness isolator, a weight, and an adherent, for example, the flexible weight may be a mixture of metal powder and glue. The rigidity isolator can be made of foam, silica gel, K glue, damping glue or epoxy resin glue. Materials that may be used for the weight include metals or inorganic non-metals. The state that the balancing weight adopted can be powdered. The metal material of the counterweight block can be iron or copper. The inorganic non-metallic material of the balancing weight can adopt glass or silicon. The balancing weight and the rigidity isolating body form layered bonding or uniform mixing bonding through the adhesion body. Meanwhile, the adhesive body of the flexible counterweight part can also bond the middle layer substrate with the first piezoelectric ceramic piece and the second piezoelectric ceramic piece together.
In another alternative implementation, the flexible weight portion is made of silicone.
By providing the groove in the intermediate layer substrate, the second embodiment of the present invention can improve the acoustic performance of the piezoelectric ceramic component after excitation; by providing the flexible weight in the groove, the intermediate substrate according to the second embodiment of the present invention can adjust the product mode (i.e., vibration state) of the piezoelectric ceramic assembly, thereby optimizing the acoustic curve, greatly improving the hearing of the piezoelectric ceramic assembly, and reducing the acoustic wave distortion generated after the piezoelectric ceramic assembly is driven to vibrate.
Fig. 7 is a schematic structural view of an electronic device of the invention employing a piezoelectric ceramic element according to a second embodiment.
As shown in fig. 7, the present embodiment provides an electronic device including a piezoelectric ceramic component 1, a second adhesive layer 2, and a screen 3. The second adhesive layer 2 may be a double-sided tape, and the screen 3 may be a screen of a mobile phone, a tablet computer, or the like.
The piezoelectric ceramic element 1 is bonded to the screen 3 by the second adhesive layer 2 in the piezoelectric ceramic element 1. The piezoelectric ceramic component 1 can be driven by an electric signal to vibrate to drive the whole or local vibration of the screen, so that the screen can sound. The piezoelectric ceramic component 1 provided by the embodiment of the invention comprises a first piezoelectric ceramic piece 11, a second piezoelectric ceramic piece 12, an intermediate layer substrate 13, a flexible circuit board 20, a first bonding layer 30 and a steel plate 40. The flexible circuit board 20 includes a first flexible portion 21 and a second flexible portion 22. The intermediate layer substrate 13 includes a slot 130 and a flexible weight (not shown).
The electronic equipment is fixedly connected with the screen through the piezoelectric ceramic component and the second bonding layer, so that the vibration signal generated by driving the piezoelectric ceramic component is transmitted to the screen. When the piezoelectric ceramic component is stressed to vibrate, the piezoelectric ceramic component drives the screen to vibrate and generates sound waves, and when the sound waves reach the ears of a user, the user can hear the sound emitted by the screen. By providing the groove in the intermediate layer substrate and filling the groove with the flexible weight portion, the vibration state of the piezoelectric ceramic element can be improved. After the piezoelectric ceramic component is driven to generate a vibration signal and is transmitted to the screen, the sound generated by the screen vibration is not easy to distort.
A third embodiment of the present invention is described below.
Fig. 8 is an exploded view of a piezoelectric ceramic component according to a third embodiment of the present invention. Fig. 9 is a plan view of an interlayer substrate according to a third embodiment of the present invention. FIG. 10 is a sectional view of a piezoelectric ceramic component according to a third embodiment of the present invention.
As shown in fig. 8 to 10, the piezoelectric ceramic assembly of the present embodiment includes a first piezoelectric ceramic plate 11, a second piezoelectric ceramic plate 12, an intermediate substrate 13, a flexible circuit board 20, a first adhesive layer 30, a steel plate 40, and a sealing area 50. The flexible circuit board 20 includes a first flexible portion 21 and a second flexible portion 22. The interlayer substrate 13 includes a carrier portion 13A and an extension portion 13B.
The first piezoceramic sheet 11, the second piezoceramic sheet 12, the first flexible portion 21, the second flexible portion 22, the first adhesive layer 30 and the steel plate 40 are the same as those of the first embodiment, and description thereof is not repeated.
The difference between this embodiment and the first embodiment is that the outline of the intermediate substrate 13 is larger than the outlines of the first piezoelectric ceramic plate 11 and the second piezoelectric ceramic plate 12, the bearing portion 13A and the extension portion 13B are disposed on the intermediate substrate 13, the extension portion 13B is disposed with a sealing area 50, and the edges of the first piezoelectric ceramic plate 11 and the second piezoelectric ceramic plate 12 are wrapped by the sealing area 50.
Specifically, the interlayer substrate 13 of the present embodiment includes a bearing portion 13A and an extension portion 13B. The bearing part 13A is located between the first piezoelectric ceramic plate 11 and the second piezoelectric ceramic plate 12. The extension 13B is a portion of the intermediate substrate 13 that extends beyond the first piezoelectric ceramic plate 11 and the second piezoelectric ceramic plate. The bearing part 13A is bonded to the first piezoelectric ceramic sheet 11 and the second piezoelectric ceramic sheet 12 by gluing. The extension portion 13B is provided with a sealing area 50, and the sealing area 50 wraps the edges of the first piezoelectric ceramic plate 11 and the second piezoelectric ceramic plate 12.
In an alternative implementation, the extension 13B is 0.05 to 2mm (millimeters) extended on the contour of the bearing 13A. Preferably, the extension 13B is 0.1mm extended on the contour of the bearing 13A. Specifically, the extension portion 13B is provided with a sealing area 50, and the sealing area 50 can prevent the first piezoelectric ceramic piece 11 and the second piezoelectric ceramic piece 12 from being chipped due to vibration and can also prevent moisture from entering.
In the embodiment, the extension part is arranged on the middle layer substrate, the glue sealing area is arranged on the extension part, and the first piezoelectric ceramic piece and the second piezoelectric ceramic piece are wrapped by the glue sealing area, so that the edge breakage of the first piezoelectric ceramic piece and the second piezoelectric ceramic piece caused by the oscillation of the piezoelectric ceramic component can be prevented, and moisture can be prevented from entering between the first piezoelectric ceramic piece and the second piezoelectric ceramic piece. Therefore, the overall reliability of the piezoelectric ceramic component of the embodiment is improved.
In an optional implementation manner, in order to enhance the overall reliability of the piezoelectric ceramic assembly of the present embodiment, the piezoelectric ceramic assembly of the present embodiment further includes a thin film blister package.
Fig. 11 is a cross-sectional view of a film blister package according to a third embodiment of the present invention. Fig. 12 is a top view of a third embodiment of the thin film blister package of the present invention.
As shown in fig. 11 and 12, in the present embodiment, a thin film blister packaging region 60 is provided to package the first piezoelectric ceramic sheet 11, the second piezoelectric ceramic sheet 12, the intermediate substrate 13, the flexible circuit board 20 (including the first flexible portion 21 and the second flexible portion 22, where a part of the first flexible portion 21 is in the sealant region and a part of the first flexible portion is outside the sealant region), the first adhesive layer 30, the steel plate 40, and the sealant region 50.
Preferably, the film thickness of the film blister pack area 60 is 10 um.
In the embodiment, the film blister packaging area 60 is arranged on the first piezoelectric ceramic piece 11, the second piezoelectric ceramic piece 12, the middle layer substrate 13, the flexible circuit board 20, the first bonding layer 30, the steel plate 40 and the sealing glue area 50 in the piezoelectric ceramic component, so that the overall reliability of the piezoelectric ceramic component is improved.
Fig. 13 is a schematic view of an electronic device using a piezoelectric ceramic component according to a third embodiment of the present invention.
As shown in fig. 13, the electronic apparatus provided by the present embodiment includes a piezoelectric ceramic component 1, a second adhesive layer 2, and a screen 3. The second adhesive layer 2 may be a double-sided tape, and the screen 3 may be a screen of a mobile phone, a tablet computer, or the like.
The piezoelectric ceramic element 1 is bonded to the screen 3 by the second adhesive layer 2 in the piezoelectric ceramic element 1. The piezoelectric ceramic component 1 can be driven by an electric signal to vibrate to drive the whole or local vibration of the screen, so that the screen can sound. The piezoelectric ceramic component 1 according to the embodiment of the present invention includes a first piezoelectric ceramic sheet 11, a second piezoelectric ceramic sheet 12, an intermediate layer substrate 13, a flexible circuit board 20, a first adhesive layer 30, a steel plate 40, and a sealing area 50 (see fig. 10). The flexible circuit board 20 includes a first flexible portion 21 and a second flexible portion 22. The interlayer substrate 13 includes a carrier portion and an extension portion.
The electronic equipment is fixedly connected with the screen through the piezoelectric ceramic component and the second bonding layer, so that the vibration signal generated by driving the piezoelectric ceramic component is transmitted to the screen. When the piezoelectric ceramic component is stressed to vibrate, the piezoelectric ceramic component drives the screen to vibrate and generates sound waves, and when the sound waves reach the ears of a user, the user can transmit the sound generated by the screen to the ears of the user. The extension part is arranged on the middle layer substrate, and the glue sealing area is arranged on the extension part to wrap the first piezoelectric ceramic piece and the second piezoelectric ceramic piece, so that the edges of the first piezoelectric ceramic piece and the second piezoelectric ceramic piece, which are caused by the vibration of the piezoelectric ceramic component, can be prevented from being broken, and moisture can be prevented from entering between the first piezoelectric ceramic piece and the second piezoelectric ceramic piece. Therefore, when the electronic equipment of the embodiment is oscillated, the reliability of the electronic equipment is improved.
A fourth embodiment of the present invention is described below.
Fig. 14 is a schematic view of a piezoelectric ceramic component according to a fourth embodiment of the present invention. Fig. 15 is a schematic view of an interlayer substrate according to a fourth embodiment of the present invention. FIG. 16 is a sectional view of a piezoelectric ceramic component according to a fourth embodiment of the present invention.
Referring to fig. 14 to 16, in the modification of the third embodiment, the piezoelectric ceramic assembly of the present embodiment includes a first piezoelectric ceramic plate 11, a second piezoelectric ceramic plate 12, an intermediate substrate 13, a flexible circuit board 20, a first adhesive layer 30, a steel plate 40, a sealing area 50 (see fig. 10), and a silicone gel 70. The flexible circuit board 20 includes a first flexible portion 21 and a second flexible portion 22. The interlayer substrate 13 includes a bearing portion 13A (see fig. 15) and an extension portion 13B (see fig. 15), wherein the extension portion 13B includes at least one protrusion 13C (see fig. 15).
The first piezoceramic sheet 11, the second piezoceramic sheet 12, the first flexible portion 21, the second flexible portion 22, the first adhesive layer 30 and the steel plate 40 are the same as those of the third embodiment, and description thereof is not repeated.
The difference is that the extension portion 13B of this embodiment further includes at least one protrusion 13C, and the protrusion 13C of this embodiment supports the first flexible portion 21 through the silicone rubber 70. The protrusion 13C of the present embodiment is fixedly connected to the first flexible portion 21 through the silicone rubber 70, so that the extension portion 13B can better support the flexible circuit board 20.
The fourth embodiment of the present invention can enhance the reliability of the first flexible portion by improving the profile of the intermediate layer substrate, adding the protrusion on the extension portion, and fixedly connecting the protrusion and the first flexible portion through the silicone rubber. This improves the reliability of the entire piezoelectric ceramic element.
In an optional implementation manner, in order to enhance the overall reliability of the piezoelectric ceramic assembly of the present embodiment, the piezoelectric ceramic assembly of the present embodiment further includes a thin film blister packaging region.
Fig. 17 is a cross-sectional view of a film blister package according to a fourth embodiment of the present invention. Fig. 18 is a top view of a fourth embodiment of the thin film blister package of the present invention.
As shown in fig. 17 and 18, in the present embodiment, a thin film blister packaging area 60 is provided to package the first piezoelectric ceramic sheet 11, the second piezoelectric ceramic sheet 12, the intermediate substrate 13, the flexible circuit board 20, the first adhesive layer 30, the steel plate 40, the sealant area 50, and the silicone gel 70.
Preferably, the film thickness of the film blister pack area 60 is 10 um.
In the embodiment, the film blister packaging area 60 is arranged on the first piezoelectric ceramic piece 11, the second piezoelectric ceramic piece 12, the middle layer substrate 13, the flexible circuit board 20, the first bonding layer 30, the steel plate 40, the sealing glue area 50 and the silica gel 70 in the piezoelectric ceramic component, so that the overall reliability of the piezoelectric ceramic component is improved.
Fig. 19 is an exploded view of an electronic device using a piezoelectric ceramic combination according to a fourth embodiment of the present invention.
As shown in fig. 19, the present embodiment provides an electronic device including a piezoelectric ceramic component 1, a second adhesive layer 2, and a screen 3. The second adhesive layer 2 may be a double-sided tape, and the screen 3 may be a screen of a mobile phone, a tablet computer, or the like.
The piezoelectric ceramic element 1 is bonded to the screen 3 by the second adhesive layer 2 in the piezoelectric ceramic element 1. The piezoelectric ceramic component 1 can be driven by an electric signal to vibrate to drive the whole or local vibration of the screen, so that the screen can sound. The piezoelectric ceramic component 1 provided by the embodiment of the invention comprises a first piezoelectric ceramic piece 11, a second piezoelectric ceramic piece 12, an intermediate layer substrate 13, a flexible circuit board 20, a first bonding layer 30, a steel plate 40, a sealing glue area 50 (see fig. 17) and silica gel 70. The flexible circuit board 20 includes a first flexible portion 21 and a second flexible portion 22.
The electronic equipment is fixedly connected with the screen through the piezoelectric ceramic component and the second bonding layer, so that the vibration signal generated by driving the piezoelectric ceramic component is transmitted to the screen. When the piezoelectric ceramic component is stressed to vibrate, the piezoelectric ceramic component drives the screen to vibrate and generates sound waves, and when the sound waves reach the ears of a user, the user can transmit the sound generated by the screen to the ears of the user. The extension part is arranged on the middle layer substrate, the protrusion is arranged on the extension part and fixedly connected with the first flexible part through silica gel, and therefore reliability of the first flexible part is improved. Therefore, when the electronic equipment of the embodiment is oscillated, the overall reliability of the electronic equipment is improved.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A piezoelectric ceramic component, comprising
The piezoelectric ceramic plate comprises a first piezoelectric ceramic plate and a second piezoelectric ceramic plate; and
and the middle layer substrate is arranged between the first piezoelectric ceramic piece and the second piezoelectric ceramic piece and used for enhancing the strength of the piezoelectric ceramic component.
2. The piezoceramic assembly of claim 1, further comprising:
the flexible circuit board comprises a first flexible part and a second flexible part, the first flexible part is fixedly connected with the first piezoelectric ceramic piece, and the second flexible part is fixedly connected with the second piezoelectric ceramic piece;
a first adhesive layer; and
and the steel plate is fixedly connected with the second flexible part through the first bonding layer.
3. The piezoceramic assembly of claim 2, wherein the interlayer substrate comprises:
the bearing part is attached to the first piezoelectric ceramic piece and the second piezoelectric ceramic piece; and
and the extension part extends out from the position between the first piezoelectric ceramic piece and the second piezoelectric ceramic piece, extends below the flexible circuit board and is used for supporting the flexible circuit board.
4. The piezoceramic assembly of claim 3, wherein silicone is disposed between the extension and the flexible circuit board.
5. The piezoceramic assembly of claim 1, wherein the intermediate layer substrate has a contour that is the same as a contour of the first piezoceramic sheet and the second piezoceramic sheet.
6. The piezoceramic assembly of claim 1, wherein the intermediate layer substrate has a profile that is greater than a profile of the first piezoceramic wafer and the second piezoceramic wafer.
7. The piezoceramic assembly of claim 6, wherein the interlayer substrate has an encapsulated area beyond edges of the first piezoceramic wafer and the second piezoceramic wafer, the encapsulated area being filled with an encapsulating structure.
8. The piezoceramic assembly according to claim 1, wherein a slot is provided on the interlayer substrate, the slot having a flexible weight disposed therein;
the flexible counterweight part is a flexible mass block or silica gel;
preferably, the flexible mass is a mixture of metal powder and glue.
9. The piezoceramic assembly of claim 1, further comprising a thin film blister package.
10. An electronic device, comprising:
a piezoelectric ceramic component according to any one of claims 1 to 9;
a second adhesive layer; and
a screen;
the piezoelectric ceramic assembly is fixedly connected with the screen through a second bonding layer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010591402.9A CN111586222A (en) | 2020-06-24 | 2020-06-24 | Piezoelectric ceramic assembly and electronic equipment |
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| CN202010591402.9A CN111586222A (en) | 2020-06-24 | 2020-06-24 | Piezoelectric ceramic assembly and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115095509A (en) * | 2022-07-21 | 2022-09-23 | 米笛声学科技(江阴)有限公司 | Micro pump |
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2020
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115095509A (en) * | 2022-07-21 | 2022-09-23 | 米笛声学科技(江阴)有限公司 | Micro pump |
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