CN111584667A - 一种新型N型晶硅TOPCon电池结构及其制备工艺 - Google Patents
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Abstract
本发明涉及N型晶硅TOPCon电池生产领域。一种新型N型晶硅TOPCon电池结构,背面膜层结构自下而上为SixNy/SiOx/SiOxNy,其中,中间SiOx为磷掺杂的膜层;其中,SiOxNy层的折射率为1.7‑2.0,厚度为3‑5nm,SiOx层折射率为1.5‑1.7,厚度为50‑100nm,SixNy层折射率为2.1‑2.3,厚度为70‑80nm。本发明还涉及该电池结构的制备工艺。本发明不仅与当前P型PERC电池制程工艺兼容性高,设备投入额小,而且解决了磷掺杂绕度的问题,制造过程产品良率高。
Description
技术领域
本发明涉及N型晶硅TOPCon电池生产领域。
背景技术
太阳能电池是将太阳能转化为电能的基础器件。随着太阳能电池工艺技术的不断进步与深入,高效降本已经成为当前太阳电池产业化发展的重要方向,高效结构设计和提高制造良率是实现这一目标的关键。目前,业界的主流产品为P型晶硅太阳能电池,该电池工艺简单,但是具有光致衰减效应,即电池的效率会随着时间的增加而逐渐衰减,而N型电池由于少子寿命高、无光致衰减等特性,逐渐发展成为下一代高效电池产品之一。
发明内容
本发明所要解决的技术问题是:如何解决现有P型PERC电池效率低、光衰大的问题。
本发明所采用的技术方案是:一种新型N型晶硅TOPCon电池结构,背面膜层结构自下而上为SixNy /SiOx/SiOxNy,其中,中间SiOx为磷掺杂的膜层;其中,SiOxNy层的折射率为1.7-2.0,厚度为3-5nm,SiOx层折射率为1.5-1.7,厚度为50-100nm,SixNy层折射率为2.1-2.3,厚度为70-80nm。
内膜层SiOxNy,充当隧穿氧化层,可对硅基体背表面进行化学钝化,有效降低表面的复合速率;中间层SiOx,在充当电子选择层的同时,有效降低背面接触电阻,提高填充因子;外层SixNy,主要用作减反射膜。
一种新型N型晶硅TOPCon电池结构的制备工艺,背面膜层结构按照如下的步骤进行制备
步骤一、背面SiOx/SiOxNy膜层的制备,使用PECVD设备,沉积SiOxNy时,压力为1500-2000mTorr,温度450-500℃,功率为10000-12000W,脉冲开关比为1:16,所通SiH4/NH3/N2O=1/0.5/5.2至1/0.8/5.8,时间为15-45s;沉积SiOx时,压力为1500-2000mTorr,温度450-500℃,功率为10000-12000W,脉冲开关比为1:16,所通SiH4/N2O=2/1至4/1,时间为400-800s;
步骤二、背面中间层SiOx磷掺杂的制备,采用磷扩散方式,通入300sccm的N2、500-1000sccm的N2-POCl3、400-900sccm的O2,反应温度780-820℃,时间为200-400s;
步骤三、背面清洗,清洗边缘与背面部分PSG,使用原液体积比浓度为49%的HF,与H2O配置成1%体积浓度的混合液,反应时间为0.5min;
步骤四、背面SixNy膜层的制备,采用PECVD的方式,沉积SixNy时压力为1000-2000mTorr,温度450-500℃,功率为11000-13000W,脉冲开关比为1:12,所通SiH4/NH3 =1/4至1/10,时间为800-1200s。
本发明中X和y用于反应分子式中的原子之间的比例关系,取正数。
本发明的有益效果是:本发明不仅与当前P型PERC电池制程工艺兼容性高,设备投入额小,而且解决了磷掺杂绕度的问题,制造过程产品良率高。
附图说明
图1是本发明结构的示意图。
具体实施方式
参照图1,一种新型N型晶硅TOPCon电池结构及其制备工艺,本发明的背面膜层结构自下而上为SixNy /SiOx/SiOxNy,其中,中间SiOx为具有一定磷掺杂浓度的膜层。其中内层SiOx/SiOxNy,使用PECVD设备沉积,制备所得SiOxNy的折射率为1.7-2.0,厚度为3-5nm;制备所得SiOx,在富SiH4的氛围下沉积,SiOx折射率为1.5-1.7,厚度为50-100nm;外层SixNy,使用PECVD设备沉积,制备所得SixNy的折射率为2.1-2.3,厚度为70-80nm。
具体的制备工艺实施过程如下:
1. 清洗制绒。制绒使用碱制绒,刻蚀量控制在0.4-0.6g,反射率7%-12%。
2. 硼扩散。扩散温度940-960℃,扩散方阻100-150Ω/sqr。
3. 背面刻蚀。使用碱刻蚀,刻蚀量控制在0.14-0.17g,反射率35%-45%。
4. 正面氧化铝制备。AlOx折射率1.6-1.65,膜厚3-5nm。
5. 正面氮化硅膜制备。在管式PECVD中制备氮化硅,折射率为2.03-2.10,膜厚为75-80nm。
6. 背面SiOx/SiOxNy膜层的制备。使用PECVD设备,沉积SiOxNy时,压力为1500-2000mTorr,温度450-500℃,功率为10000-12000W,脉冲开关比为1:16,所通SiH4/NH3/N2O=1/0.5/5.2至1/0.8/5.8,时间为15-45s;沉积SiOx时,压力为1500-2000mTorr,温度450-500℃,功率为10000-12000W,脉冲开关比为1:16,所通SiH4/N2O=2/1至4/1,时间为400-800s。
7. 背面中间层SiOx磷掺杂的制备。采用磷扩散方式,通入300sccm的N2、500-1000sccm的N2-POCl3、400-900sccm的O2,反应温度780-820℃,时间为200-400s。
8. 背面清洗。清洗边缘与背面部分PSG。使用原液浓度为49%HF,与H2O配置成1%体积浓度的混合液,反应时间为0.5min。
9. 背面SixNy膜层的制备。采用PECVD的方式,沉积SixNy时压力为1000-2000mTorr,温度450-500℃,功率为11000-13000W,脉冲开关比为1:12,所通SiH4/NH3 =1/4至1/10,时间为800-1200s。
10.丝网印刷及高温烧结。
Claims (2)
1.一种新型N型晶硅TOPCon电池结构,其特征在于:背面膜层结构自下而上为SixNy /SiOx/SiOxNy,其中,中间SiOx为磷掺杂的膜层;其中,SiOxNy层的折射率为1.7-2.0,厚度为3-5nm,SiOx层折射率为1.5-1.7,厚度为50-100nm,SixNy层折射率为2.1-2.3,厚度为70-80nm。
2.一种权利要求1所述新型N型晶硅TOPCon电池结构的制备工艺,其特征在于:背面膜层结构按照如下的步骤进行制备
步骤一、背面SiOx/SiOxNy膜层的制备,使用PECVD设备,沉积SiOxNy时,压力为1500-2000mTorr,温度450-500℃,功率为10000-12000W,脉冲开关比为1:16,所通SiH4/NH3/N2O=1/0.5/5.2至1/0.8/5.8,时间为15-45s;沉积SiOx时,压力为1500-2000mTorr,温度450-500℃,功率为10000-12000W,脉冲开关比为1:16,所通SiH4/N2O=2/1至4/1,时间为400-800s;
步骤二、背面中间层SiOx磷掺杂的制备,采用磷扩散方式,通入300sccm的N2、500-1000sccm的N2-POCl3、400-900sccm的O2,反应温度780-820℃,时间为200-400s;
步骤三、背面清洗,清洗边缘与背面部分PSG,使用原液体积比浓度为49%的HF,与H2O配置成1%体积浓度的混合液,反应时间为0.5min;
步骤四、背面SixNy膜层的制备,采用PECVD的方式,沉积SixNy时压力为1000-2000mTorr,温度450-500℃,功率为11000-13000W,脉冲开关比为1:12,所通SiH4/NH3 =1/4至1/10,时间为800-1200s。
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CN116190498A (zh) * | 2021-11-26 | 2023-05-30 | 通威太阳能(眉山)有限公司 | 制备隧穿氧化层和非晶硅薄膜的方法及TOPCon电池 |
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